倒装焊工艺(bumping)

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BUMPING INTRODUCTION

BUMPING INTRODUCTION

Bumping process introduction Domestic Bumping industry

Reflow machine

Wafer bumping: planting ball on wafer pad

Application: advanced package (BGA &WLP&CSP…..)

Wafer bumps

-gold bums

-solder bumps

-plating bumps

-stencil printing bumps

-solder ball attach

Methods of wafer bumping for flip chip

Gold bumping (plated)

Solder bumping (plated)

Gold ball (stud) bumps (gold wire micro weld) Solder ball bumps placement

Stencil Printed solder bumping

Solder bumping process is accomplished in a foundry-like processing setting. The bumps are generally made of lead, tin, or a combination of both.

Solder Bumping process flow

•gold ball bumping is truly an extension of the

wire bonding process.

Wire bonding.Gold (stud) bumps Bumping process introduction

Bumping process introduction Stencil printed solder bumping

Solder ball bumps placement and reflow

Costs of gold ball bumping vs. plating

Domestic Bumping industry 苏州颀中Chipmore

上海宏茂Chipmos

上海安靠Amkor

星科金朋SCC

江阴长电JCAP

苏州晶方WLCSP

中芯国际SMIC

上海宏茂Chipmos & 苏州欣中Chipmore -TCP&COG&COF for LCD Driver IC -Gold bumps

上海安靠Amkor

-put into production

-gold &solder bumping

星科金朋SCC

-Bumping service from TSMC

-Gold +Ni bumping & solder bumping

•JCAP Bumping Services

苏州Shellcase

-Shellcase WLCSP process & Wafer bumping process & TSV WLCSP process

氮气回流焊炉(for WAFER BUMP FORMING) -YAMATO WORKS (120000 USD)

深圳敏科))

系列回流焊炉炉(深圳敏科HELLER 1800EXL系列回流焊

岗)大型全热风无铅回流焊炉-SNR

州圣岗

SNR--845P(苏州圣

大型全热风无铅回流焊炉

SEMIgear GENVEA STP200/300