Performance of large area Micro Pixel Chamber

5 µmCu Ag O CaSi Microstructure of copper-silver alloy revealed with ChemiSEM technology. Silicate contamination is immediately recognized when inspecting samples with live compositional imaging via ChemiSEM.2 µmApreo 2 SEMUnmatched versatility powered by ChemiSEM TechnologyDatasheetResolve gray areas with the Thermo Scientific Apreo 2 SEM, a high-performance field emission gun (FEG) SEM with unique, live elemental imaging and an advanced, automated optics system that enables you to focus on your research rather than microscope performance.Key featuresAll-round nanometer or sub-nanometer resolution performance on materials ranging from nanoparticles,powders, catalysts, and nanodevices to bulk magnetic samples, even at long (10 mm) working distancesExtreme flexibility for handling a wide range of sampletypes, including insulators, sensitive materials, or magnetic samples, and for collecting the data that matters most to your applicationLess time spent on maintenance with an optics system that tiling, and stitchingChemiPhase image showing different phases present in a complex inclusion in steel.P3P2P4The result is an easy-to-use system that allows you to focus on discovery rather than manipulating multiple software packages.The Apreo SEM’s unique Trinity in-column detection systemis present, but now with improved performance. TheApreo 2 SEM remains the platform of choice for research on nanoparticles, catalysts, powders, and nanodevices, thanksto its innovative final lens design that does not compromise on magnetic sample imaging performance. The electrostatic final lens (available on Apreo 2 C and Apreo 2 S SEMs) enables simultaneous in-column detection at high resolution, whilethe Apreo 2 S SEM combines the electrostatic final lens with magnetic immersion into a compound lens. The compound final lens further boosts resolution performance, providinga resolution of 0.9 nm at 1 kV without additional beam deceleration, while offering unique options for signal filtering.For the most challenging applications, the Apreo 2 SEM’s charge mitigation routines can include optional low vacuum (up to 500 Pa) to mitigate charge on any sample while providing excellent resolution and large analytical currents with field-proven through-the-lens differential pumping and dedicated LoVac detectors.All these capabilities are complemented by easy sample handling and an easy-to-use microscope user interface, saving time for novice and expert users alike. A customizable user interface provides many options for user guidance, automation, and remote operation. With unique technologies like SmartAlign, FLASH, and ChemiSEM Technology addedto an already advanced microscope, the Apreo 2 SEM adds additional flexibility to any lab while providing advanced imaging capability for all users.Electron optics• High-resolution field emission SEM column with:–High-stability Schottky field emission gun to provide stable high-resolution analytical currents–Compound final lens: a combined electrostatic, field-free magnetic and immersion magnetic objective lens(optional)–60° objective lens geometry: allows tilting larger samples –Automated heated apertures to ensure cleanliness and touch-free aperture changes• SmartAlign Technology: user-alignment-free technology • Through-the-lens differential pumping for low vacuum (optional) reduces beam skirting for the most accurateanalysis and highest resolution• Beam deceleration with stage bias from -4,000 V to +600 V • Continuous beam current control and optimized aperture angle • Double stage scanning deflection• Easy gun installation andmaintenance: auto bake-out, autostart, no mechanical alignments• PivotBeam Mode for selected areaelectron channeling, also known as“rocking beam” mode (Apreo 2 Smodel only)• Guaranteed minimum source lifetime: 24 monthsElectron beam resolutionElectron beam parameter space• Beam current range: 1 pA to 50 nA(400 nA configuration also available)• Accelerating voltage range: 200 V – 30 kV• Landing energy range: 20 eV – 30 keV• Max. horizontal field width: 3 mm at 10 mm WD (corresponds to 29x minimum magnification)Chamber• Inner width: 340 mm• Analytical working distance: 10 mm• Ports: 12• EDS take-off angle: 35°• Three simultaneous EDS detectors possible, two at 180°•Coplanar EDS/EBSD orthogonal to the tilt axis of the stageApreo 2 C Apreo 2 S15 kV (30 Pa) 1.2 nm 1.2 nmBD: beam deceleration mode. WD: working distance. Resolutions are at optimum working distance unless specified otherwise. By default, upon final installation,the resolution is proven in the systems acceptance test at 1 kV and 30 kV in highvacuum and with immersion switched on if applicable.DetectorsThe Apreo 2 SEM detects up to four signals simultaneously from any combination of the available detectors or detector segments (optional):• Trinity Detection System (in-lens and in-column)–T1 segmented lower in-lens detector–T2 upper in-lens detector–T3 in-column detector (optional)• ETD—Everhart-Thornley SE detector• DBS—Retractable segmented under-the-lens BSED (optional)• Low-vacuum SE detector (optional)• DBS-GAD—Lens-mounted gaseous analytical BSED (optional)• STEM 3+—Retractable segmented detector(BF, DF, HADF, HAADF) (optional)• IR-CCD• Thermo Scientific Nav-Cam™ Camera (chamber-mounted)ChemiSEM Technology (optional)• EDS detector size: 10, 30, or 60 mm²• Light element sensitivity down to beryllium• 127 eV or 129 eV spectral resolution• Optional motorized slide availableVacuum system• Complete oil-free vacuum system• 1 × 240 l/s TMP• 1 × PVP-scroll• 2 × IGP• Chamber vacuum (high vacuum) <6.3 × 10-6 mbar (after 12 hours pumping)• Evacuation time: ≤3.5 minute• Optional low-vacuum mode• 10–500 Pa chamber pressure• Automatic Pressure Limiting Aperture (PLA) LoaderSample holders• Standard multi-purpose holder uniquely mounts directly onto the stage, hosts up to 18 standard stubs (ø12 mm),three pre-tilted stubs, cross-section samples, and two pre-tilted row-bar holders (optional) (38° and 90°). Tools are not required to mount a sample.• Each optional row-bar accommodates 6 STEM grids• Wafer and custom holders (optional)System control• 64-bit GUI with Windows 10, keyboard, optical mouse • 24-inch LCD display, WUXGA 1920×1200(second monitor optional)• Customizable graphical user interface,with up to 4 simultaneously active views• FLASH automated image tuning for focus,lens align, and stigmator• Image registration• Navigation montage• Image analysis software• Undo / Redo functionality• User guidance for basic operations / applications• Optional joystick• Optional manual user interface (knob board)Image processor• Dwell time range from 25 ns to 25 ms/pixel• Up to 6144×4096 pixels• File type: TIFF (8-, 16-, 24-bit), JPEG or BMP• Single-frame or 4-view image display• SmartScan Mode (256-frame average or integration, line integration and averaging, interlaced scanning)• DCFI (drift compensated frame integration) Mode• Digital image improvement and noise reduction filter Type Eucentric goniometer stage,5 axes motorizedXY110x110 mmRepeatability <3.0 μm (@ 0° tilt)Motorized Z65 mmRotation n × 360°Tilt -15° / +90°Max. sample height Clearance 85 mm to eucentric point Max. sample weight 500 g in any stage positionUp to 5 kg at 0° tiltMax. sample size122 mm diameter with fullX, Y, rotation (larger samplespossible with limited stagetravel or rotation)For research use only. Not for use in diagnostic procedures. For current certifications, visit /certifications© 2023 Thermo Fisher Scientific Inc. All rights reserved. All trademarks are the property of Thermo Fisher Scientific and its subsidiaries unless otherwise specified. DS0345-EN-07-2023Accessories (optional)• Sample / chamber cleaning: CryoCleaner,Integrated Plasma Cleaner• Analysis: EDS, EBSD, WDS, CL, Raman• Thermo Scientific QuickLoader ™Load Lock for fastsample transfer• Navigation: correlative navigation, Thermo Scientific Maps ™Software tiling and stitching• Gas injection: up to 2 units (other accessories may limitnumber of GIS available) for beam-induced deposition of:–Platinum –Tungsten –Carbon • Manipulators • Cryo-stage• Electrical probing / multi-probing stations • Electrostatic beam blanker• CleanConnect Sample Transfer DeviceSoftware options• Maps Software for automatic large area acquisition usingtiling and stitching; correlative work• Thermo Scientific AutoScript ™ 4 Software—Python-basedapplication programming interface• TopoMaps for image colorization, image analysis,and 3D surface reconstruction• Advanced image analysis software • Remote control softwareDocumentation• Online user guidance• Operating instructions handbook • Online help• Prepared for RAPID (remote diagnostic support)• Free access to online resources for ownersWarranty and Training• 1 year warranty• Choice of service maintenance contracts• Choice of operation / application training contractsInstallation requirement(Refer to preinstall guide for detailed data)• Power:–Voltage 100–240 V AC (-6%, +10%) –Frequency 50 or 60 Hz (±1%)–Consumption: <3.0 kVA for basic microscope • Earth resistance <0.1 Ω• Environment:–Temperature (20 ± 3)°C –Relative humidity below 80%–Stray AC magnetic fields <40 nT asynchronous, <100nT synchronous for line times, 20 ms (50 Hz mains) or 17 ms (60 Hz mains)• Minimum door size: 0.9 m wide × 1.9 m high • Weight: column console 980 kg • Dry nitrogen recommended for venting • Compressed air 4–6 bar, clean, dry and oil-free • System chiller• Acoustics: site survey required,as acoustic spectrum relevant• Floor vibrations: site survey required,as floor spectrum relevant• Optional active vibration isolation tableConsumables (partial list)• Replacement Schottky electron source moduleL earn more at /apreo。

UG0643User Guide Image De-Noising FilterMicrosemi HeadquartersOne Enterprise, Aliso Viejo,CA 92656 USAWithin the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996Email: *************************** ©2020 Microsemi, a wholly owned subsidiary of Microchip Technology Inc. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice.About MicrosemiMicrosemi, a wholly owned subsidiary of Microchip T echnology Inc. (Nasdaq: MCHP), offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs andmidspans; as well as custom design capabilities and services. Learn more at .Contents1Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.1Revision 3.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.2Revision2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3Revision 1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 3Image De-Noising Filter Hardware Implementation . . . . . . . . . . . . . . . . . . . . . . . . . .33.1Inputs and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.2Configuration Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43.3Testbench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.4Simulation Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93.5Resource Utilization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10FiguresFigure 1Median-Based Denoising Filter Effect on a Noisy Image . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 2Image De-Noising Filter Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 3Create SmartDesign Testbench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 4Create New SmartDesign Testbench Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 5Image De-Noise Filter Core in Libero SoC Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 6Image De-Noise Filter Core on SmartDesign Testbench Canvas . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 7Promote to Top Level Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 8Image De-Noise Filter Core Ports Promoted to Top Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 9Generate Component Icon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 10Import Files Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 11Input Image File Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 12Input Image File in Simulation Directory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 13Open Interactively Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 14ModelSim Tool with Image De-Noising Filter Testbench File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 15Image De-Noising Filter Effect on a Noisy Image 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 16Image De-Noising Filter Effect on a Noisy Image 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10TablesTable 1Image De-Noising Filter Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 2Design Configuration Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 3Testbench Configuration Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 4Resource Utilization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Revision History1Revision HistoryThe revision history describes the changes that were implemented in the document. The changes arelisted by revision, starting with the most current publication.1.1Revision 3.0The following is a summary of the changes in revision 3.0 of this document.•Input Data_In_i is replaced with R_I, G_I and B_I to support RGB color format.•Output Data_Out_o is replaced with R_O, G_O and B_O.•Median Filter design logic is redesigned to support for (n x n) resolution with pipelined logics whereas previous design is implemented with Sequential FSM.1.2Revision2.0The following is a summary of the changes in revision 2.0 of this document.•In Image De-Noising Filter Hardware Implementation, page3:•YCbCr in signal names was replaced with Data.•The following text was deleted: The median filtering is only applied on the Y channel. The C B and C R signals are passed through the required pipe-lining registers to synchronize with Ychannel. For the Y channel, three pixels from each of the three video lines are read into threeshift-registers.•Details about the Image De-noising Filter testbench were added. For more information, see Testbench, page5.•The Timing Diagrams section and the appendix were deleted.•The number of buffers in the hardware was updated from four to five. For more information, see Image De-Noising Filter Hardware Implementation, page3.•Information about port widths was added. For more information, see Inputs and Outputs, page4.•Resource utilization data was updated. For more information, see Resource Utilization, page10.1.3Revision 1.0The first publication of this document.Introduction2IntroductionImages captured from image sensors are affected by noise. Impulse noise is the most common type ofnoise, also called salt-and-pepper noise. It is caused by malfunctioning pixels in camera sensors, faultymemory locations in the hardware, or errors in data transmission.Image denoising plays a vital role in digital image processing. Many schemes are available for removingnoise from images. A good denoising scheme retrieves a clearer image even if the image is highlyaffected by noise.Image denoising may either be linear or non-linear. A mean filter is an example of linear filtering, and amedian filter is an example of non-linear filtering. While the linear model has traditionally been preferredfor image denoising because of its speed, the limitation of this model is that it does not preserve theedges of the image. The non-linear model preserves the edges well compared to the linear model, but itis relatively slow.Despite the slowness, non-linear filtering is a good alternative to linear filtering because it effectivelysuppresses impulse noise while preserving the edge information. The median filter ensures that eachpixel in the image fits in with the pixels around it. It filters out samples that are not representative of theirsurroundings—the impulses. Therefore, it is very useful in filtering out missing or damaged pixels.For 2D images, standard median operation is implemented by sliding a window over the image. The 3 ×3 window size, considered to be effective for the most commonly used images, is implemented in the IP.At each position of the window, the nine pixel values inside the window are copied and sorted. The valueof the central pixel is replaced with the median value of the nine pixels in the window. The window slidesright by one column after every clock cycle until the end of the line. The following illustration shows theeffect of a median-based denoising filter on a noisy image.Figure 1 • Median-Based Denoising Filter Effect on a Noisy Image3Image De-Noising Filter HardwareImplementationMicrosemi Image De-noising Filter IP core—a part of Microsemi’s imaging and video solutions IP suite—supports 3 × 3 2D median filtering and effectively removes impulse noise from images.The Image De-noising Filter hardware contains three one-line buffers storing one horizontal video lineeach. The incoming data stream fills these three buffers, one by one. In the design illustrated in thisdocument, the median filter is implemented on 3 × 3 matrix, so three lines of video form the 3 × 3 windowfor the median. When the third buffer contains three pixel values, the read process is initiated.Three shift registers form the 3 × 3 2D array for median calculation. These shift registers are applied asinput to the median finder, which contains 8-bit comparators that sort the nine input values in increasingorder of magnitude and produce the median value, which is then updated into the output register. Thenew pixel column is shifted into the shift register, with the oldest data being shifted out. The 3 × 3 windowmoves from the left to right and from top to bottom for each frame.The following illustration shows the block diagram of the Image De-noising Filter hardware with defaultRGB888 input.Figure 2 • Image De-Noising Filter Hardware3.1Inputs and OutputsThe following table lists the input and output ports of the Image De-noising Filter.3.2Configuration ParametersThe following table lists the configuration parameters for the Image De-noising Filter design.Note:These are generic parameters that vary based on the application requirements.Table 1 • Image De-Noising Filter PortsPort Name Direction WidthDescriptionRESETN_I Input Active-low asynchronous reset signal to design SYS_CLK_I Input System clockR_I Input [(g_DATAWIDTH–1):0]Data input – Red Pixel G_I Input [(g_DATAWIDTH–1):0]Data input – Green Pixel B_IInput [(g_DATAWIDTH–1):0]Data input – Blue Pixel DATA_VALID_I Input Input data valid signal R_O Output [(g_DATAWIDTH-1):0]Data output - Red Pixel G_O Output [(g_DATAWIDTH-1):0]Data output - Green Pixel B_OOutput [(g_DATAWIDTH-1):0]Data output - Blue Pixel DATA_VALID_OOutputOutput data valid signalTable 2 • Design Configuration ParametersNameDescription Default G_DATA_WIDTH Data bit width 8G_RAM_SIZEBuffer size of RAM2048 (for horizontal resolution of 1920)3.3TestbenchT o demonstrate the functionality of the Image De-Noise Filter core, a sample testbench file (image-denoise_test ) is available in the Stimulus Hierarchy (View > Windows > Stimulus Hierarchy), and a sample testbench input image file (RGB_input.txt ) is available in the Libero ® SoC Files window (View > Windows > Files).The following table lists the testbench parameters that can be configured according to the application, if necessary.The following steps describe how to simulate the core using the testbench.1.In the Libero SoC Design Flow window, expand Create Design , and double-click Create SmartDesign Testbench, as shown in the following figure.Figure 3 •Create SmartDesign Testbench2.Enter a name for the SmartDesign testbench and click OK .Figure 4 •Create New SmartDesign Testbench Dialog BoxA SmartDesign testbench is created, and a canvas appears to the right of the Design Flow pane.3.In the Libero SoC Catalog (View > Windows > Catalog), expand Solutions-Video, and drag the Image De-Noise Filter IP core onto the SmartDesign testbench canvas.Table 3 • Testbench Configuration ParametersName Description CLKPERIOD Clock period HEIGHT Height of the image WIDTH Width of the image g_DATAWIDTH Data bit widthWAITNumber of clock cycles of delay between the transmission of one line of the input image and the next IMAGE_FILE_NAMEInput image nameFigure 5 • Image De-Noise Filter Core in Libero SoC CatalogThe core appears on the canvas, as shown in the following figure.Figure 6 • Image De-Noise Filter Core on SmartDesign Testbench Canvas4.Select all the ports of the core, right-click, and click Promote to Top Level, as shown in the followingfigure.Figure 7 • Promote to Top Level OptionThe ports are promoted to the top level, as shown in the following figure.Figure 8 • Image De-Noise Filter Core Ports Promoted to Top Level5.T o generate the Image De-noising Filter SmartDesign component, click Generate Component iconon the SmartDesign Toolbar, as shown in the following figure.Figure 9 • Generate Component IconA sample testbench input image file is created at:…\Project_name\component\Microsemi\SolutionCore\Image_Denoising_Fil-ter\1.2.0\Stimulus6.In the Libero SoC Files window, right-click the simulation directory, and click Import Files..., asshown in the following figure.Figure 10 • Import Files Option7.Do one of the following:•To import the sample testbench input image, browse to the sample testbench input image file, and click Open, as shown in the following figure.•To import a different image, browse to the desired image file, and click Open.Figure 11 • Input Image File SelectionThe input image file appears in the simulation directory, as shown in the following figure.Figure 12 • Input Image File in Simulation Directory8.In the Stimulus Hierarchy, expand Work, and right-click the Image De-noising Filter testbench file(image_denoise_test.v).9.Click Simulate Pre-Synth Design, and then click Open Interactively.Figure 13 • Open Interactively OptionThe ModelSim tool appears with the testbench file loaded on to it, as shown in the following figure. Figure 14 • ModelSim Tool with Image De-Noising Filter Testbench File10.If the simulation is interrupted because of the runtime limit in the DO file, use the run -all command tocomplete the simulation.After the simulation is completed, the testbench output image file (.txt) appears in the simulationfolder.3.4Simulation ResultsThe following illustration shows the effect of the Image De-noising Filter on a noisy image.Figure 15 • Image De-Noising Filter Effect on a Noisy Image 1Figure 16 • Image De-Noising Filter Effect on a Noisy Image 23.5Resource UtilizationIn this design, the Image De-noising Filter is implemented on an MPF300TS-1FCG1152I PolarFireSystem-on-Chip (SoC) FPGA. The following table provides resource utilization data for a 24-bit datawidth design after synthesis.Note:Image De-noising Filter supports for SmartFusion2 and PolarFire FPGAs.Table 4 • Resource UtilizationResource UtilizationDFFs19614_input LUTs2417MACC0RAM1Kx1815RAM64x180。

高分辨率相机对安装底板微振动幅值的要求分析刘涌;王巧霞;孙欣;高征【摘要】相机安装底板作为卫星和相机的接口,其微振动量级对卫星、相机都很重要.总体设计经常把相机视为刚体,忽略了相机弹性和扰振频谱的耦合,使得计算出现误差.文章将相机视为弹性体,利用有限元软件和CODEV建立了结构、光学模型,分析了安装底板1μm平动位移以及0.1″转动位移对相机像移的全谱段影响,并反推得到了相机对安装底板微振动的频域要求.结果显示,以像移不超过0.35个像元(像元大小7μm)为指标,某分辨率1m的相机的安装底板在敏感频率处的平动位移幅值不应超过0.01μm,角位移幅值不应超过0.003″,该分析可以为总体设计初期提供参考.%As the interface between satellite and camera, the micro-vibration amplitude of mounting flange is very important. At present, the micro-vibration requirement is put forward with the camera regarded as a rigid body, which ignores the coupling of inherent characteristic mode and micro-vibration spectrum, and then leads to the calculation error. In the article, the camera is regarded as an elastic body and the structural-optical model has been created by the finite element software and CODEVsoft ware. The influence on imaging quality of 1μm translation displacement and 0.1″ rotational displacement on mounting flange in whole frequency do-main is analyzed, and the frequency requirement of micro-vibration on mounting flange is acquired. The result shows that the pixel displacement indicator is no more than 0.35 pixel(size of 7μm), so for a 1m camera the amplitude of the translational displacement on mounting flange should be no more than 0.01μm and the rota-tional displacementshould be no more than 0.003″ at the sensitivity frequency. The analysis can provides ref-erence for overall preliminary design.【期刊名称】《航天返回与遥感》【年(卷),期】2017(038)002【总页数】7页(P27-33)【关键词】微振动;安装底板;位移要求;空间相机【作者】刘涌;王巧霞;孙欣;高征【作者单位】北京空间机电研究所,北京 100094;北京空间机电研究所,北京100094;北京空间机电研究所,北京 100094;北京空间机电研究所,北京 100094【正文语种】中文【中图分类】V19星上活动部件在正常工作时会产生微小的扰振力和扰振力矩，并经由安装底板传递到相机，最终影响成像品质[1-2]。

Surface Perfection ZEISS Smartproof 5Your Widefield Confocal Microscope for Routine and Automated Surface Analysis in Quality Control and Research /smartproofZEISS Smartproof 5 is an integrated widefield confocal microscope, combining fast confocal technology for roughness and topography measurements with light microscopy imaging and documentation functions.Dedicated optics enable unrivaled speed and accuracy for 3D data acquisition, providing raw data without pre-processing for results you can trust. Integration of motorization, LED based illumination and optics enable automated operation that yield reliable, certified and user-independet results in any environment. Based on the software suite ZEISS ZEN core, you can choose between free-form and guided workflows, store and share results, and use advanced image analysis and reporting functions. In addition, the capability to correlate light, confocal and electron microscopy enables you to gain maximum information from your part or insights into your sample.Dedicated Design. Guided Workflow. Trusted Output.Raw data of a 3.0 µm roughness standard measured using a 20x objectiveMeasurement length 6 mm created by stiching of individual images, no data processing/filtering applied.› In Brief › The Advantages › The Applications › The System› Technology and Details › ServiceSimpler. More Intelligent. More Integrated.Trusted Results @SpeedAs a widefield confocal microscope, Smartproof 5 is based on the Aperture Correlation technology which combines the benefits of classical confocal systems: high resolution, with the benefits of spinning disc systems: high acquisition speeds. Dedicated optics designed for the 405 nm LED illumination reveal accurate surface details even at low magnifications. Additional RGB LED illumina-tion enables color imaging and documentation.Workflow-based and ConnectedRun by ZEN core, Smartproof 5 combines allknown benefits of a fully integrated solution intoyour connected laboratory environment. Free-form or guided workflows for data acquisitionand analysis enable the system to be operated byuntrained users or to simply speed up your investi-gation. As ZEN core is the ZEISS imaging softwarefor light, confocal, and electron microscopy, train-ing efforts will be minimal, and data correlationacross different modalities will provide maximuminformation. By using the powerful ConfoMapsoftware for data analysis, you can measure geo-metrical parameters and carry out roughnessanalyses in 2D (line profile) and 2.5D (area), basedon ISO standards.Integrated & Robust DesignSmartproof 5 gives you the benefit of a fullyintegrated system design: motorization, optics,electronics and camera are all enclosed in themicroscope to provide a self-contained clutter freesystem. The entire system is built in a compactmanner and its sturdy construction withstandsvibration so effectively that there is no need forextra anti-vibration equipment. The robust designoffers you the choice of installing and runningSmartproof 5 in many different working environ-ments – not only in labs but also on the shopfloor.› In Brief› The Advantages› The Applications› The System› Technology and Details › ServiceFaster Confocal Technology For Trusted Results @SpeedThe main feature of a confocal microscope is its aperture (usually called a pinhole) which is arranged in sucha way that out-of-focus information will be blocked and only in-focus information can be detected. In-focusinformation appears bright while out-of-focus information is dark. The sample is scanned vertically in pre-defined steps obtaining a stack of images, during which every point on the surface passes through the focuslevel. The height of the surface at each pixel location is determined from the intensity variation of each pixelwithin the z stack, which allows the reconstruction of the topography of the scanned surface represented bya color-coded height map.In traditional spinning discs systems using conven-tional multi-pinhole discs or spinning disc, a high acquisition speed can be achieved, however at the cost of crosstalk – out-of-focus information from adjacent or neighboring pinholes – that decrease the z-resolution dramatically. While point scan-ners, like classical laser scanning microscopes, have no crosstalk and thus the highest resolution, they lack speed in comparison.Smartproof 5 is based on the Aperture Correlation technology which combines the benefits of a point (one pinhole) scanner – its resolution, with the benefits of spinning disc systems – there high acquisition speeds. Using a spinning disc that con-sist of various segments with different structures, Smartproof 5 can acquire both the spinning disc data and a widefield image (crosstalk informa-tion). By combining both, the system obtains point-scanner-like resolution at high speed.Image stack acquired along the Z axis; in-focus informationappears bright while out-of-focus information is dark Acquisition speed versus resolution: Smartproof 5 combines high resolution – like a point scanner – with high acquisition speeds – like a spinning disc system.› In Brief› The Advantages› The Applications› The System› Technology and Details › ServiceHigh-Resolution Imaging Thanks to Dedicated ZEISS OpticsDedicated optics with high numerical apertures and optimized for the violet (405 nm) LED light source – the wavelength used for widefield confocal imaging – provide the basis for high-resolution imaging and data quality, even at low magnifications (see also technical specification of the objectives at the end). They also perform excellent with the integrated RGB LEDs, in order to provide true color images. Overlaying texture and 3D topography information result in a realistic surface reconstruction.Surface of an additively manufactured metal part; 3D view with true color texture overlaySurface of an additively manufactured metal part; 3D view with color-coded height map› In Brief› The Advantages › The Applications › The System› Technology and Details › ServiceIntegrated & Robust Design for Highest PerformanceBased on its robust design, integrated motoriza-tion and LED-based illumination, Smartproof 5 offers you the choice of installing and running the system in many different environments: on your lab bench, in your office or on the shop floor—even without additional anti-vibration equipment. The scanning stage has a surface area of 300 mm × 240 mm with threaded holes, enabling you to mount holders or fixtures for a variety of different parts to be measured or investigated. The travel range of 150 mm × 150 mm allows you to analyze different regions on a large part or multiple samples in one pass, in an automated fashion.Smartproof 5 monitors the status of its own me-chanical components to ensure optimal perfor-mance and preventive detection of potential service issues.› In Brief› The Advantages › The Applications › The System› Technology and Details › ServiceAdvanced Data Correlation for Maximum InsightsCorrelation between light, confocal, and electron microscopy tools becomes easy, since any region of interest that was identified with Smartproof 5 can be marked using the Shuttle & Find functionality within ZEN core, and at a simple click of a button, the same region can be retrieved in e.g. an electron microscope for further analysis. This eliminates the seemingly endless attempts to relocate the same region of interest at high magnification and at total different contrasts and thus speeds up your analysis.Data correlation example showing corrosion on a metal sealing surface, acqired with confocal, light, and electron microscopes (images show 500 µm x 300 µm field of view):True color image aquired with Smartproof 5 using co-axial il-lumination High-resolution imaging aquired with ZEISS EVO scanning elec-tron microscope (Secondary Electron, SE) for morphology con-trast Height map created based on surface information aquired with Smartproof 5Light microscopy image aquired with ZEISS Smartzoom 5 digital microscope using ringlight illuminationHigh-resolution imaging aquired with ZEISS EVO scanning elec-tron microscope (Back-scattered Electron, BSE) for composition-al contrastElemental information aquired with ZEISS EVO scanning electron microscope (Energy-dispersive X-ray spectroscopy, EDX)› In Brief› The Advantages › The Applications › The System› Technology and Details › ServiceWorkflow-based Software for Automated Data Acquisition and ImagingSmartproof 5 is run by ZEN core, the ZEISS soft-ware suite for microscopy imaging, analysis, andworkflow connectivity, thus provides all knownbenefits of a fully integrated solution into yourconnected laboratory environment: user manage-ment, images and results database, as well asintegrated reporting.The operating concept also provides the choicebetween two working modes: free and job mode,whereas the latter is a guided workflow, whichcan be freely designed to your routine measure-ment and imaging tasks. The workflow consistsof all necessary steps to have a reproducibleimage acquisition, whereas – once set-up – theoperators have only to press “next” in order toexecute the necessary pre-defines steps, one afterthe other. This speeds up routine task and enablesthe use of the system for untrained users, whilenot compromising data integrity or system safety.ZEN core also provides all functions for 2D micros-copy image acquisition, measurement and docu-mentation. In addition, all advanced imageanalysis and measurement software packages are available, including Machine Learning for image segmentation (ZEN Intellesis) and simple to use yet sophisticated 2D metrology (NEO pixel). ZEN core user interface: free-form modeAnalysis AutomationIn order to guide and automate your analysis or research, stitched overview images can be acquired to have a full representation of the sample or part under investigation. Then the regions for surface analysis are defined within the context of this overview image. The measurement can then be set-up to run automatically in user-defined regions. This is essential to create statistically relevant data, acquire information from dis-tinctly different regions of your part or to simply speed up your process.› In Brief› The Advantages› The Applications› The System› Technology and Details › ServiceConnected Workflow Solutions• ZEN core is the ZEISS connected laboratory software solution. It includes modules that provide image analysis, data reporting and archiving solutions for images and data acquired with Smartproof 5 and other ZEISS industrial microscopy solutions.• Shuttle & Find enables seamless relocation of identified regions of interest: from Smartproof 5 to any other light microscope for basic to advanced optical inspection and documen-tation; from Smartproof 5 to ZEISS scanning electron microscopes for high-resolution surface imaging or elemental composition analysis using energy-dispersive X-ray spectroscopy (EDX).• ZEN Connect, a module for ZEN core, enables the visualization and reporting of data from multiple modalities, different laboratories, or even different locations, in a single correlative microscopy workspace.• ZEN Data Storage provides a solution for image data management—for laboratories, across laboratories or even across locations.Smartproof 5 in a laboratory environment connected by ZEISS ZEN core: 1) Shuttle & Find between Smartproof 5 and other light microscopes2) Shuttle & Find between Smartproof 5 and ZEISS EVO scanning electron microscope 3) Central data management enabled by ZEN Data Storage4) ZEN Connect: image processing, analysis, and reporting on separate office workstations5) Exchange of images and analysis data, instrument presets, workflow templates, and reporting data between laboratories and locations› In Brief› The Advantages › The Applications › The System› Technology and Details › ServiceTailored Precisely to Your Applications› The Advantages› The Applications› The System› Technology and Details› ServiceZEISS Smartproof 5 at WorkMachined metal surface: (left) 3D view with true color-texture overlay and height map created using a 20×/0.7 objective and four stitched images; (right) roughness profile taken vertical to machining direction shows surface profile.Dental screw: (left) 3D view with color-coded height map; (right) profile taken along indicated direction – see left image – with contour measurements of angles and height difference.› In Brief › The Advantages › The Applications › The System› Technology and Details › ServiceZEISS Smartproof 5 at WorkElectronic device: (left) 3D view with true color-texture overlay and (center) height map created using a 10×/0.4 objective; (right) 2D height plot for measuring areal roughness or texture e.g. for quality control purposes or for determining counterfeit electronic devicesSilver finger on solar cell surface, 3D view of color coded height map with texture overlay, C Epiplan-Apochromat 50×/0.95Laser-structured surface, 3D view of color coded height map with texture overlay, C Epiplan-Apochromat 50×/0.958 nm step height standard, height map, C Epiplan-Apochromat 50×/0.95› In Brief › The Advantages › The Applications › The System› Technology and Details › Service1231 MicroscopeSmartproof 5 consisting of:• Scan head with fine Z-drive and 4-megapixel camera • Stand with coarse Z-drive2 Objectives• EC Epiplan-Neofluar 2.5x/0.06 (always included)• C Epiplan-Apochromat 5×/0.2 • C Epiplan-Apochromat 10×/0.4• C Epiplan-Apochromat 20×/0.7• C Epiplan-Apochromat 50×/0.95Your Flexible Choice of Components• LD C Epiplan-Apochromat 50×/0.6 (long working distance)• LD C Epiplan-Neofluar 100×/0.75 (long working distance) 3 Computer System• PC system with Smartproof ZEN software • Monitor• 3D mouse for control of XYZ axes4 Software• ZEN core for data acquisition and imaging • ConfoMap for data analysis• ZEN Shuttle & Find for correlative microscopy • ZEN Data Storage for centralized data management• ZEN Intellesis for advanced image segmentation• ZEN Connect for data visualization and analysis of different imaging modalities• NEO pixel for automated 2D measurements› In Brief › The Advantages › The Applications › The System› Technology and Details › ServiceSystem Overview› The Advantages› The Applications› The System› Technology and Details› ServiceTechnical Specifications› The Advantages› The Applications› The System› Technology and Details› ServiceBenefit from the optimized performance of your microscope system with services from ZEISS – now and for years to come.Count on Service in the True Sense of the Word>> /microserviceBy choosing Smartproof 5 from ZEISS, you’ve put reliability and availability among your top priorities for quality assurance and quality control.Your Performance. Our Support.Your Smartproof 5 is designed for a long, productive life. However, should you ever have a question about the technology or how to use it, a dedicated team of experts will be available by phone, e-mail or remote access.Because Your Standards Are Uncompromising: Service Agreements with Connected AssistanceIf you rely on a high level of availability, you are well served by our ZEISS Protect Service Agreements. You can be sure of priority service and shorter response times as well as rapid repairs – and with Protect premium, all of that comes for a flat fee.› In Brief › The Advantages › The Applications › The System› Technology and Details › ServiceN o t f o r t h e r a p e u t i c u s e , t r e a t m e n t o r m e d i c a l d i a g n o s t i c e v i d e n c e . N o t a l l p r o d u c t s a r e a v a i l a b l e i n e v e r y c o u n t r y . C o n t a c t y o u r l o c a l Z E I S S r e p r e s e n t a t i v e f o r m o r e i n f o r m a t i o n . E N _42_011_145 | V e r s i o n 2.0 | C Z 08-2019 | D e s i g n , s c o p e o f d e l i v e r y , a n d t e c h n i c a l p r o g r e s s s u b j e c t t o c h a n g e w i t h o u t n o t i c e . | © C a r l Z e i s s M i c r o s c o p y G m b HCarl Zeiss Microscopy GmbH 07745 Jena, Germany ******************** /smartproof。

• Lens: AF DX Fisheye-Nikkor 10.5mm f/2.8G ED • Exposure: [M] mode, 1/1000 second, f/2.8 • White balance: Cloudy • Sensitivity: ISO 1600 • Picture Control: VividPhotographers, take your passion further Now is the time for new creativity, and to rethink what a digital SLR camera can achieve.It's time for the D90, a camera with everything you would expect fromNikon's next-generation D-SLRs, and some unexpected surprises, as well.The stunning image quality is inherited from the D300, Nikon's DX-format flagship.The D90 also has Nikon's unmatched ergonomics and high performance, and now takes high-quality movies with beautifully cinematic results.The world of photography has changed, and with the D90 in your hands,it's time to make your own rules.• Incredible image quality using 12.3 effective megapixels, Nikon's DX-format CMOS image sensor andexclusive EXPEED image processing• Remarkable low-noise performance from ISO 200 to 3200• D-Movie, an innovative movie shooting feature for digital SLR cameras• Scene Recognition System integrated with Face Detection System• Live View capability with 3-in., approx. 920k-dot high-resolution LCD and dedicated Live View button• Compatible with the Picture Control System and offering new Portrait and Landscape modes formore vibrant, customized colors• Bright pentaprism viewfinder featuring frame coverage of approx. 96%• Active D-Lighting for high-contrast lighting situations• In-camera retouch, including newly added features: Fisheye, Distortion Control and StraightenPure, natural color: new Landscape Picture ControlCapture the most importantelement clearly: Face priority AF in Live ViewTake a bold approach to low-light scenes: low-noise from ISO 200 to 3200• Lens: AF-S NIKKOR 14-24mm f/2.8G ED• Exposure: [M] mode, 1/30 second, f/2.8 • White balance: Auto • Sensitivity: ISO 3200 • Picture Control: Landscape• Lens: AF-S DX NIKKOR 18-105mm f/3.5-5.6G ED VR • Exposure: [A] mode, 1/250second, f/5 • White balance: Cloudy • Sensitivity: ISO 200 • Picture Control: Standard• Lens: AF-S DX NIKKOR 16-85mm f/3.5-5.6G ED VR • Exposure: [M] mode, 1.3 second, f/25 • White balance: Cloudy • Sensitivity: ISO 200 • Picture Control: LandscapeRich color and low noise from ISO 200 to 3200The D90 gives you the freedom to shoot in a remarkably wide variety of lighting conditions, including dimly lit scenes, without worrying about image-degrading noise. ISO can be raised as high as Hi 1 (ISO 6400 equivalent) or lowered to Lo 1 (ISO 100 equivalent).Customize the visual style of your images: Picture ControlNikon's Picture Control System allows you to customize the look and mood of your images. Choose from six settings: Standard, Vivid, Neutral, Monochrome and the newly added Portrait and Landscape. Try using the Quick Adjust* function to easily make further adjustments according to your needs and preferences, then save the settings as Custom Picture Controls.*Quick Adjust is not available with Neutral and Monochrome settings.More sophisticated Active D-Lighting for high-contrast lighting situationsDetails in the shadows and highlighted areas of your photos are often lost when strong lighting increases the contrast between the bright and dark areas of your image. Nikon's unique Active D-Lighting technology accurately restores these important details by localizing tone control while you shoot. Choose from four levels, including the new Extra High. Active D-Lighting can be used manually or set to Auto mode. It is also possible to bracket your pictures to get one with Active D-Lighting and one without.*Matrix metering is recommended when using Active D-Lighting.Picture Control [Portrait]• Lens: AF Nikkor 85mm f/1.4D IF • Exposure: [M] mode, 1/800 second, f/5 • White balance: Cloudy • Sensitivity: ISO 200Active D-Lighting [High]Active D-Lighting [off]ISO 200 ISO 400 ISO 800 ISO 1600ISO 320067Challenge your perception of image qualityThe newly developed Nikon DX-format CMOS image sensor with 12.3 effective megapixels and Integrated Dust Reduction SystemThe D90 incorporates a newly developed DX-format CMOS image sensor with technology directly inherited from the D300, Nikon's DX-format flagship. With its 12.3 effective megapixels andextraordinarily high signal-to-noiseratio, the D90 delivers low-noise images with detail and tonal gradation beyond your expectations, while Nikon's Integrated Dust Reduction System works to free image-degrading dust particles from the sensor's optical low-pass filter.EXPEED for smooth tones, rich colors and fine detailsNikon's comprehensive EXPEED technology is engineered to make the most of the sensor's rich, 12.3-megapixel data. The result — color, detail and high-speed processing inspired by the groundbreaking D300. The D90's image-processing engineproduces high-resolution pictures at remarkable speeds, better enabling high-speed continuous shooting. EXPEED also contributes to the outstanding performance of other powerful features, including Live View and the new FaceDetection System.Picture Control [Vivid]Picture Control [Monochrome]DX-format CMOS image sensorRich color and low noise at high ISO sensitivity• Lens: AF-S NIKKOR 24-70mm f/2.8G ED • Exposure: [M] mode, 1/320 second, f/2.8 • White balance: Direct sunlight • Sensitivity: ISO 3200• Picture Control: Standardl Incredibly accurate auto white balanceAuto white balance combines with Nikon's Scene Recognition System to analyze each scene's light sources, cross-referencing this information with 5,000 actual picture data examples from over 20,000 images in its onboard white balance database. Even under mixed lighting or difficult light sources like mercury vapor lights, the D90 calculates an ideal white balance for remarkably faithful colors.l Playback zoomUtilizing information from the new Face Detection System, the D90 detects up to ten human faces during playback. Select one face and the D90 zooms in for faster focus confirmation.Versatile, practical 11-point AF systemThanks to Multi-CAM 1000autofocus module, the D90's11-point AF system has fastand precise autofocus coverageacross the frame with the mostsensitive AF sensor operatingfrom the center. In addition,the D90 has versatile AF-areamodes to handle most shooting situations: Single-point AFis recommended for stationary subjects, dynamic-area AF for moving subjects, auto-area AF for spontaneous shooting and 3D-tracking (11 points) AF for changing composition afterfocusing on your subject.89Auto white balance for faithful colorsScene Recognition Systemwith the Face Detection SystemFirst introduced on the D3 and D300 flagship cameras,Nikon's breakthrough Scene Recognition System is alsofeatured in the D90. This unique technology utilizes a420-pixel RGB sensor to analyze immense amounts ofscene and color information in order to understand what thecamera is about to shoot. Milliseconds before the shutter isreleased, the camera optimizes the autofocus, auto exposure,i-TTL control and white balance. The D90 also uses Nikon'snew Face Detection System to render human faces with anewfound sharpness and accuracy.l Improved autofocus performanceThe D90 demonstrates amazing autofocus accuracy by utilizingcolor and brightness information from its 420-pixel RGBsensor. When shooting in Auto-area AF mode, the cameraquickly focuses on the main subject by detecting foreground,background and subject position. When using 3D-tracking(11 points) mode, the camera uses your subject's color andbrightness information to keep it in sharp focus as you changethe composition.l Sophisticated auto exposureNikon's 3D Color Matrix Metering II became one of the mosthighly acclaimed metering systems by delivering consistentlywell-balanced exposures — even in lighting conditions thatconfuse other systems. Further extending its exposurecapability, Nikon's Scene Recognition System evaluateseach scene's highlights, delivering even more light meteringprecision. Moreover, the D90 detects faces when usingface priority AF, giving you ideal exposures of your humansubjects.Treat every scene withastounding accuracy3D Color Matrix Metering II delivers consistently well-balanced exposures.3D-tracking (11 points) maintains sharp focus when changing composition.420-pixel RGB sensor Image sensorLarge, bright viewfinder features 96% frame coverageThe D90 has a precise eye-levelpentaprism viewfinder with approx. 96% (centered) frame coverage and an easy-to-view 19.5mm eyepoint (at -1.0 m -1), so photographers can concentrate oncapturing the moment. The built-in16-frame grid display can be activated to align the horizontal and vertical lines in your image or assist in more pleasing compositions.Built-in, pop-up flash commands Advanced Wireless LightingThe D90 is equipped with Nikon's i-TTL flash control, renowned for consistently accurate and balanced flash exposures. The built-in flash has an 18mm lens coverage and works as a wireless commander, controlling up to two independent groups of an unlimited number of remote Speedlights and providing incredible creative lighting control — on location or in the studio.Ergonomic superiority in a light, compact bodyAt a remarkably light 1 lb. 6 oz./620 g, the D90 is designed to meld with a photographer's hands. Its compact body offers a stable grip and an intuitive layout of controls that make operation and creative flow natural and effortless.New Advanced Scene ModesWhen you're not sure which camera settings are appropriate, simply rely on the Advanced Scene Modes. Just turn the mode dial to the appropriate icon: Portrait, Landscape, Close-up, Sports or Night Portrait. Unlike traditional scene modes, the D90 will automatically optimize the exposure, image processing, Active D-Lighting, and Picture Control to get the most out of your subject matter. What's more, the D90 has exceptional low-noise performance and accurately adjusts the camera settings whether VR (Vibration Reduction) is activated or not, so you can expect beautiful, crisp images, even in many low-light scenes.1011PortraitClose-up Advanced Wireless LightingSB-600 controlled by the D90’s built-in flash working as a commander.Night PortraitLandscape• Lens: AF-S DX NIKKOR 18-105mm f/3.5-5.6G ED VR • Exposure: [A] mode, 1/60 second, f/5.6• White balance: Direct sunlight • Sensitivity: ISO 800 • Picture Control: StandardPentaprismLive View with 3-in., 920k-dot, high-density color LCDStriking images often require uncommon perspectives. With the D90's Live View function, you can shoot effectively without looking through the viewfinder. Simply press Live View's dedicated button forinstant access and the 3-in., approx. 920k-dot LCD with its 170-degree viewingangle supports your Live View shooting. There are three contrast-detect AF modes which let you focus on any point in the frame: Face priority AF automatically detects up to five faces and focuses on the one calculated to be the closest. Wide area AF offers a large AF area suitable for handheld shooting and normal area AF provides focus with pinpoint accuracy when using a tripod.Quick responses and shooting at 4.5 frames a secondThe D90 captures crucial moments thanks to its impressive 0.15-second start-up time, 65-millisecond shutter release time lag (CIPA standard) and ability to shoot at 4.5 frames a second for up to 100 shots*.*Normal-Large image setting, using a Panasonic Pro HIGH SPEED 2 GB SD memory card.Innovative D-SLR movie function: D-MovieA new idea for D-SLRs, the D90 offers a movie function, allowing you to shoot movies in three different motion JPEG formats: 320 x 216 pixels, 640 x 424 pixels and HD720p (1,280 x 720 pixels). Now you can capture life's moving moments with added drama by using many of Nikon's NIKKOR lenses, including the AF DX Fisheye 10.5mm f/2.8G ED and the Micro-NIKKOR lenses. The shallow depth of field can give your movies a more creative and emotional impact. An additional benefit is the D90 image sensor, which is much larger than a typical camcorder for higher image quality and exceptional high ISO performance during low-light shooting.*Autofocus is not available when recording movies. Matrix metering is used regardless of the metering method selected.Freeze the moment,capture the movement —the tools are all hereD-Movie can be played on the camera's LCD monitor, as well as on a computer,TV or HDTV screen.Live View button forinstant access Face priority AFWide area AFNormal area AFExtensive in-camera Retouch MenusThe D90's wide variety of image editing functions makes it possible for you to enhance your pictures without the need for a computer, making creative exploration easier than ever.An exciting way to enjoy images:HDMI compatibilityYou can enjoy both still images and movies shot with theD90 via HDMI (High-Definition Multimedia Interface) with the global-standard digital A/V signal transfer. Type C connector (mini size) is employed.Original slideshow: PictmotionTry Nikon's easy-to-use Pictmotion function to create innovative slideshows combining five choices of both background music and image effects. You can watch the slideshow on your 3-in. LCD, a TV screen via video output or an HDTV set via HDMI output.Store your images online: Nikon's my Picturetown Transfer your memories instantly to my Picturetown, Nikon's simple online storage and sharing site for photos and video. Nikon's my Picturetown platform supports the following file formats: NEF (RAW), JPEG, MOV and AVI.• Straighten (manual control in +/–5 degree)• Distortion Control (automatic compensation using lens information andmanual compensation selectable)• Fisheye (optical effects similar to a fisheye lens, select from 10 levels)The editing menus• Straighten1213• D-Lighting• Red-eye Correction• Trim• Monochrome• Filter Effects• Color Balance• Small Picture• Image Overlay• NEF (RAW) Processing• Quick RetouchOriginal mProven endurance: Resilient shutter unitsReliability is not a luxury —it's a necessity. That's whyNikon subjected numerousD90 shutter mechanismsto grueling 100,000-cycleshutter-release tests with theunit fully assembled in thecamera.Intelligent power managementBecause of the D90's highly efficient energy-saving design,approx. 850 pictures can be taken on a single charge of theRechargeable Li-ion Battery EN-EL3e. (CIPA standard, withAF-S DX NIKKOR 18-105mm f/3.5-5.6G ED VR, with 50% ofpictures taken with flash)More playback optionsThe D90 gives you ample options for viewing and selectingthe right shot. Thumbnail display can show up to 72 framesat a time on the LCD, while Calendar playback arrangesimages in chronological order. You can also check thehistograms of a magnified portion of an image. Whenselecting shots for deleting, hiding, printing and Pictmotion,you can also choose an image by specifying date of capture.Maintain the excitementin-camera and online72-frame playback Histogram of a magnified portionof an imageShutter unitSB-900SB-800The MB-D80 gives you the choice of using one or two placed shutter-release button also allows for more。

System OverviewExperience the superior clarity of Dahua's Ultra 4K HDCVI cameras for vast coverage and superior image details. As the world's first 4K over coax cameras, the Dahua Ultra 4K HDCVI series leverages existing coax infrastructures to deliver forensic-level images seamlessly and more cost effectively. The outstanding performance, easy installation and rugged design make the camera an ideal choice for mid- to large-size businesses and for applications in large, open spaces (city centers, parks, campuses) where highly reliable surveillance and construction flexibility are valued.FunctionsMicro Four Thirds SystemThis Dahua camera takes advantage of the The Micro Four Thirds System, an interchangeable-lens photography system that offers superior picture quality from a smaller lens. This system offers nine times the surface area and pixel size of the standard 1/3-in. sensor commonly used in video surveillance applications. The larger surface area and pixel size increases the light gathering capability of the sensor to deliver color images in ultra-low light conditions in the 8MP camera class when other cameras have switched to monochrome.4K Resolution4K resolution is a revolutionary breakthrough in image processing technology. 4K delivers four times the resolution of standard HDTV 1080p devices and offers superior picture quality and image details. 4K resolution improves the clarity of a magnified scene to view or record crisp forensic video from large areas.Starlight+ TechnologyFor challenging low-light applications, Dahua’s Starlight Ultra-low Light Technology offers best-in-class light sensitivity, capturing color details in low light down to 0.001 lux. The camera uses a large pixel sensor, smart imaging algorithms and a set of optical features to balance light throughout the scene, resulting in clear images in dark environments.Ultra Series | A83AA9M43 Lens InterfaceThe lens is a key component of any security camera and one that directly effects the quality of the image. The Dahua 4K HDCVI box camera features the M43 lens interface, typically found on most SLR cameras. This camera is compatible with all types of M43 lenses, including fixed and vari-focal lenses.Four Signals over One Coaxial CableHDCVI technology simultaneously transmits video, power, data, and audio over a single coaxial cable. Dual-way data transmission allows the HDCVI camera to communicate with an HCVR to send control signals or to trigger alarms. HDCVI along with PoC technology delivers power 1 to devices at the edge, simplifying installation.Long Distance TransmissionHDCVI technology guarantees real-time transmission over long distances without loss of video quality. HDCVI cameras provide the same resolution as most IP network camera systems using existing RG-59, RG-6, or CAT 6 UTP cabling.SimplicityHDCVI technology seamlessly integrates traditional analog surveillance systems with upgraded, high-quality HD video, making it the best choice to protect security investments. The plug and play approach enables full HD video surveillance without the hassles of configuring a network. Multiple OutputsThe camera supports HDCVI and CVBS signal outputs simultaneously with one HDMI connector and one BNC connector. These output signals allow the camera to integrate with various devices, including analog matrix systems and monitors.1. Requires PoC Transceivers for each channel and an external power supply for each transceiver.•Micro Four Thirds 8 MP Progressive-scan CMOS Sensor •M43 Lens Interface•3840 x 2160 at 30 fps (HDMI) and 3840 x 2160 at 15 fps (BNC) •Simultaneous HDMI and HDCVI/CVBS Video Output •Starlight+ Technology for Ultra-low Light Sensitivity•Ultra Wide Dynamic Range (140 dB) and 2D and 3D Noise Reduction •Built-in Microphone •Software Upgrade via USB •Five-year Warranty**Warranty applies to products sold through an authorized Dahua Dealer.2. 4K at 15 fps resolution achievable with the following Dahua HDCVI DVRs: C52A1N/C52A2N/C52A3N(Channel 1) and X58A3S (Channels 1 and 9).3. Transmission distance results verified by real-scene testing in Dahua's test laboratory. Actual transmissiondistances may vary due to external influences, cable quality, and wiring structures.Rev 001.010© 2018 Dahua. All rights reserved. Design and specifications are subject to change without notice.PFB110WWall/Ceiling MountBracketPFB121WWall Mount Bracket PFM800-EPassive HDCVI Balun PFM810POC Transceiver DH-PFM320D-015Power Adapter DH-PFM321D-US Power AdapterDH-PFL085-J12M 12 MP Fixed LensDH-PFL2070-J12M 12 MP Vari-focalLens。

第 38 卷第 7 期2023 年 7 月Vol.38 No.7Jul. 2023液晶与显示Chinese Journal of Liquid Crystals and Displays超微型Micro-LED投影显示光学引擎设计黎垚1，江昊男1，周自平1，董金沛1，陈恩果1，2*，叶芸1，2，徐胜1，2，孙捷1，2，严群1，2，郭太良1，2（1.福州大学物理与信息工程学院平板显示技术国家地方联合工程实验室，福建福州 350108；2.中国福建光电信息科学与技术创新实验室（闽都创新实验室），福建福州 350108）摘要：随着微米级像素尺寸的微型自发光二极管（Micro-LED，μLED）的出现和发展，采用μLED作为光源和像源的超微型投影光学引擎成为了可能，其极大简化了传统投影显示光学引擎的结构。

本文提出了一种基于μLED的超微型投影光学引擎，基于现有3.302 mm（0.13 in）的μLED显示芯片设计了高像质的微型投影镜头。

针对μLED的光分布特性，优化μLED发散角度与微投影镜头的光瞳匹配，有效提升了μLED微投影光学系统的光能利用率。

结果表明，所设计的μLED微投影显示光学引擎体积仅有18.35 mm3，投影镜头中心视场的MTF值在截止频率处超过0.57。

该μLED微投影显示光学引擎较好地实现了系统体积与成像像质的均衡，未来在AR/VR等近眼显示设备上具有广泛的应用前景。

关键词：Micro-LED；近眼显示；微投影显示；光学设计；系统效率中图分类号：TN27；TN761 文献标识码：A doi：10.37188/CJLCD.2022-0216Optical design of super miniature Micro-LED projectionLI Yao1，JIANG Hao-nan1，ZHOU Zi-ping1，DONG Jin-pei1，CHEN En-guo1，2*，YE Yun1，2，XU Sheng1，2，SUN Jie1，2，YAN Qun1，2，GUO Tai-liang1，2（1.National & Local United Engineering Laboratory of Flat Panel Display Technology， College of Physics and Information Engineering， Fuzhou University， Fuzhou 350108， China；2.Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China（Mindu Innovation Laboratory）， Fuzhou 350108， China）Abstract：With the emergence and development of self-luminous micron-pixel-sized Micro-LED （Micro light-emitting diode， μLED）， using μLED as the light and image source have become possible for ultra-compact projection optical engines. It greatly simplifies the structure of traditional projection display optical engines. In 文章编号：1007-2780（2023）07-0910-09收稿日期：2022-11-07；修订日期：2022-12-27.基金项目：国家重点研发计划（No.2022YFB3603503）；国家自然科学基金（No.62175032）；漳州市科技重大项目（No.202110051）；闽都创新实验室自主部署项目（No.2020ZZ111）Supported by National Key Research and Development Program of China（No.2022YFB3603503）； NationalNatural Science Foundation of China （No.62175032）；Zhangzhou Key Science and Technology project（No.202110051）；Fujian Science & Technology Innovation Laboratory for Optoelectronic Information ofChina （No.2020ZZ111）*通信联系人，E-mail：ceg@第 7 期黎垚，等：超微型Micro-LED投影显示光学引擎设计this paper， a μLED-based super miniature projection optical engine is proposed， and a high image quality pico-projection lens is designed based on 3.302 mm（0.13 in） μLED display chip. The divergence angle of μLED display chip matched with the pupil of pico-projection lens is optimized according to the light distribution characteristics of μLED chip，which effectively improves the light efficiency of μLED based pico-projection optical system. The results show that the volume of the system is only 18.35 mm3， and the MTF value of the center field of view of the projection lens exceeds 0.57 at the cut-off frequency. The μLED based pico-projection display optical engine achieves a good trade-off between system volume and image quality， and has a wide application prospect in near-eye display devices such as AR/VR in the future.Key words： Micro-LED； near-eye display； pico-projection display； optical design； system efficiency1 引言投影显示技术是最早的电子信息显示技术之一［1］。

小像元间距、晶圆级封装、asi1.小像元间距是数字图像处理中的重要参数。

The pixel pitch is an important parameter in digital image processing.2.晶圆级封装可以提高集成电路的稳定性。

Wafer-level packaging can improve the stability of integrated circuits.3. asi技术在半导体制造中有着广泛的应用。

Advanced Silicon Integration (ASI) technology has a wide range of applications in semiconductor manufacturing.4.微探测器的小像元间距决定了其空间分辨率。

The small pixel pitch of micro detectors determines their spatial resolution.5.晶圆级封装可以有效减少集成电路的尺寸。

Wafer-level packaging can effectively reduce the size of integrated circuits.6. asi技术可以提高半导体器件的性能和可靠性。

ASI technology can improve the performance andreliability of semiconductor devices.7.晶圆级封装可以降低集成电路的成本。

Wafer-level packaging can reduce the cost of integrated circuits.8.小像元间距越小，图像的清晰度就越高。

The smaller the pixel pitch, the higher the image resolution.9. asi技术的发展推动了半导体产业的进步。

大幅面焦面帘幕式快门(ICOME2011)周九飞，冷雪，刘明，李大伟，付金宝1，何勇，陈浠惠(中国科学院长春光学精密机械与物理研究所，吉林长春 1300331 中国科学院研究生院，中国，北京，100039)摘要：随着科学技术的发展，CCD制造技术日益成熟，面阵CCD不仅像元尺寸越来越小，而且像元数也越来越多，CCD成像靶面越来越大。

正是由于大面阵CCD的出现，给航空相机的发展带来了新的空间，同时也出现了一些技术难题，其中如何保证CCD合理曝光是关键问题之一。

本文介绍一种焦面帘幕式快门，重点分析快门的工作原理，并对快门的曝光调节范围及控制电路进行分析，同时通过试验对快门曝光均匀性进行验证。

试验表明，该焦面帘幕式快门效率高达90%；帘缝调节宽度2毫米~100毫米，对应的曝光时间调节范围1/30秒~1/1500秒；曝光均匀性优于10%；基于这些特点，该快门可广泛用于大幅面光学系统进行自动曝光控制。

关键词： CCD；相机；帘幕；快门；曝光时间；曝光均匀性；光学系统中图分类号 TP394.1；TH691.9 文献标识码： ALarge format and focal plane curtain shutter Zhou Jiu-fei,Leng Xue,Liu Ming,Li Da-wei,Fu Jing-bao1,He Yong,Chen Xi-hui（Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of SciencesChangchun, Jilin 130033，China1 Graduate University of Chinese Academy of Sciences, Beijing 100039，China）AbstractWith the development of science and technology, CCD manufacturing technique becomes more sophisticated. Not only the pixel size of area array CCD is smaller, but also the size of CCD imaging target surface and the number of pixels increases more and more. The appearing of large area array CCD, which leads to the new development space of aerial camera, brings about some technical problems in which how to ensure the CCD reasonable exposure is one of the key problems. This paper presents a focal plane curtain shutter, focuses on the analysis of the work-principle、the adjusting scope and exposure control circuit of the shutter, while the exposure uniformity of the shutter was validated through the experiment. Experiment result shows that the efficiency of the focal plane curtain shutter is up to 90%, the adjustable width of curtain gap is from 2mm～100mm, the corresponding adjustable range of exposure time is from 1/30 second to 1/1500 second and exposure uniformity is better than 10%. Based on these characteristics, the shutter can be used in large-format optical systems for automatic exposure control.Key words: ccd；camera; curtain；shutter；exposure time；exposure uniformity；optical systems 收稿日期：2011年月日；收到修改稿日期：年-月-日基金项目：中国科学院知识创新工程领域前沿项目资助(No:O70Y32R070).作者简介：周九飞（1975--），男，硕士研究生，副研究员。

JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。

专利名称：Inexpensive fabrication of large-area pixelarrays for displays and sensors发明人：William S. Wong,Robert A. Street,Stephen D.White,Robert Matusiak申请号：US10334595申请日：20021230公开号：US07033516B2公开日：20060425专利内容由知识产权出版社提供专利附图：摘要：A method and system for fabricating an array of electronic devices, typically a display or sensor is described. In the method, a droplet source ejects droplets of amasking material for deposit on a thin film or substrate surface to mask an element of the array of electronic devices. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.申请人：William S. Wong,Robert A. Street,Stephen D. White,Robert Matusiak地址：San Carlos CA US,Palo Alto CA US,Santa Carla CA US,Sunnyvale CA US国籍：US,US,US,US代理人：Kent Chen更多信息请下载全文后查看。

RM5PHARMACEUTICALSPOLYMERS NANO-MATERIALSCHEMICALS BIOSCIENCES MOLECULAR SPECTROSCOPY SINCE 1971 CIRCLE Photoluminescence CIRCLE Raman CIRCLE UV-Vis CIRCLE Transient AbsorptionEDINBURGH INSTRUMENTSEdinburgh Instruments has been providing high performance instrumentation in the Molecular Spectroscopy market for almost 50 years. Our commitment to offering the highest quality, highest sensitivity instruments for our customers has now expanded to include the best Raman microscopes for all research and analytical requirements.As always, Edinburgh Instruments provides world-class customer support and service throughout the lifetime of our instruments.1PRECISIONRAMANSEMICONDUCTORS GEOLOGYFORENSICS ART & MUSEUM COSMETICSRM5 RAMAN MICROSCOPEThe RM5 is a compact and fully automated Raman microscope for analytical and research purposes. The truly confocal design of the RM5 is unique to the market and offers uncompromised spectral resolution, spatial resolution, and sensitivity.The RM5 builds on the expertise of robust and proven building blocks, combined with modern optical design considerations; and a focus on function, precision and speed. The result is a modern Raman microscope that stands alone in both specifications and ease of use.Truly Confocal – with variable slit and multiple position adjustablepinhole for higher image definition, better fluorescence rejection and application optimisation Integrated Narrowband Raman Lasers – up to 3 computer-controlled lasers for ease of use, enhanced stability and reduced footprint 5-Position Grating Turret – for unrivalled spectral resolutionof 1.4 cm -1 (FWHM) and optimisation over the full spectral range 50 cm -1 - 4000 cm -1 Integrated Detectors – up to 2, including high efficiency CCD,EMCCD and InGaAs arrays for low noise, increased speed, high sensitivity and wide spectral range Internal Standards and Auto-Calibration – to ensure thehighest quality data at all times 4-Position Raman Filter Turret – fully automated notch and edgefilters to match the Raman range to excitation laser wavelength Ramacle ® Software – one powerful software package forcomplete system control, data acquisition, analysis and ease of upgrade High Performance Microscope – compatible with all thelatest accessories2D E S I G N F E A T U R E SRM5DESIGN FEATURESLaser excitation, from one of three possible lasers (1), is directed to the microscope and sample stage via a series of motorised mirrors with laser power at the sample controlled through an adjustable attenuator. The beam is focussed onto the sample that sits on an XYZ-movable stage (3) through a microscope objective, and can be viewed live on screen thanks to an integrated CMOS camera (4). The scattered light produced is then collected by the same objective before being passed through a filter to remove unwanted laser light. The Raman scattered light passes through an adjustable confocal pinhole (5) before entering the spectrograph. One of five possible diffraction gratings splits the light into its constituent wavelengths (6) which are then focussed onto the detector(s) (7) and displayed to the user as a spectrum.1Multiple LasersUp to 3 integrated and computer-controlled lasers with choice of wavelengths, combined with a computer-controlled continuous laser beam attenuator to allow control over laser power at the sample position.3High Performance MicroscopeThe latest generation research-grade upright microscope (Olympus BX53series), allows the RM5 to benefit from all modern sample visualisation and contrast enhancement techniques availableincluding brightfield, darkfield, polarised light, Nomarski differential interference contrast (DIC) and fluorescence. A manual or computer-controlled XYZ stage provides movement to locate and map areas of interest on the sample.2Automated CalibrationFor recalibration and validation, the RM5 comes with integrated Raman reference materials. Internal standards are included for spectrograph calibration and for laser wavelength calibration and adjustment. All calibration and validation routines are part of the instrument’s operating software, Ramacle ®, and allow for complete ease-of-use and user-friendliness.3535Automated Optical RoutingThis compartment contains a 4-position turret of dichroic laser rejection filters, computer-controlled beam splitter and an adjustable confocal pinhole. Auto-alignment of the instrument is achieved by two embedded piezo-controlled mirrors. An optional polariser and analyser accessory is available for advanced analysis of polarised Raman scattering.microscope for higher resolution and image stitching of Raman mapping.7Multiple Detector PortsThermo-electrically cooled spectroscopic CCD cameras are used for low noise and fast image detection. A second CCD camera port is available for a camera with complementary spectral coverage,increased speed, higher spectral sampling or sensitivity, pushing the flexibility of the RM5.6High Resolution SpectrographA high resolution 225 mm focal lengthspectrograph of asymmetric Czerny-Turner design is integrated. This includes acontinuously adjustable precision slit and a grating turret with up to 5 pre-aligned gratings for wide spectral coverage. The spectrograph undergoes comprehensive calibration and validation procedures at the factory.2Triptycene triplet, excited by 785 nm laser, 600 g/mm grating (blue) and 1800 g/mm grating (red), arbitrary scaled1 μm Polystyrene bead scanned over a distance 12 μm, excited with 532 nm laserSilicon, excited with 785 nm laserL-Histidine,excited with 785 nm laserThe software provides control, visualisation, data acquisition, analysis and presentation of the RM5 whether it is used for generating Raman spectra or with advanced upgrades suchas Raman mapping.Ramacle enables sample visualisation, live signal monitoringand parameter optimisation before every measurement. The instrument status and signal are displayed and constantly updated during measurements.Data generated by Ramacle have a proprietary file format. This contains all measurement and instrumental properties, allowing the user to retrieve important information whenever neededand ensures data traceability. Simple input and output functions provide the required compatibility with third party data analysis or presentation packages.KnowItAll TM Raman Identification Pro spectral library is availablefor material identification and advanced analysis. Data acquisition methods such as single measurements, multiple and accumulated scans, kinetic scans and generation of maps (accessory dependent)Cyclohexane, excited with 785 nm laser. Parallel polarised intensity (orange), perpendicular polarised intensity (blue). Inset: Depolarisation ratio. Raman spectrum of 1,2(4-pyridyl)ethylene 40 nm Au, recorded over time, showing the significant enhancement of the signal intensity of this SERS sample.Benzonitrile, excited with 532 nm laser. Multiple spectra joined together. The resulting spectrum contains 6700 data points with 3500 cm-1 spectral coverage and a resolution of 0.54 cm-1 per pixel.Paracetamol / Caffeine / Phenylephrine Hydrochloride tablet, excited with 638 nm laser (blue) and 785 nm laser (red).Raman spectra of the constituents of a commercial pharmaceutical tablet, excited with 785 nm laser.White light image of the tablet under investigation.Using a 10x objective, the image has been composed of 1,650 (55 x 30) individual white light images automatically acquired and stitched together into one large image by Ramacle. The blue grid scale shows the frame size of the individual images.Raman map superimposed on the white light image.Using the same 10x objective, 785 nm laser excitation, and a 50 μm pinhole, spectra were collected at 100 μm steps along the X and Y axes. This results in over 18,000 individual Raman acquisitions.The matrix of spectra was then analysed and superimposed onto the white light image using Ramacle software. The colours in the resulting map represent Aspirin (red), Caffeine (blue) and Paracetamol (green) demonstrated by their Raman spectra above. The red grid scale shows the area that was scanned for Raman with 1 mm graduation.8U P G R A D E O P T I O N SLASERSThe RM5 is built with flexibility in mind. A choice of excitation lasers and associated laser rejection filters (both edge and notch) are available depending on application requirements.GRATINGSGratings are chosen for optimum resolution for each laser excitation, with up to a maximum of five gratings per system.DETECTORSA choice of CCD, EMCCD and InGaAs detectors are also available dependent on requirements, with a maximum of two detectors being integrated per system.ACCESSORIES AND LASER SAFETYOther accessories such as a polarisation kit and a Class Ilaser safety enclosure are also available to further expand the capabilities, flexibility and safety of your RM5 system.MICROSCOPEThe RM5 uses one of the most modern microscopes on the market for first class Raman microscopy. You can use the microscope beyond pure Raman microscopy; the RM5 has been designed to maintain the full capability of the microscope allowing all the necessary tools to be added for exceptional visualisation and contrast of your samples. Brightfield, darkfield, polarised light, differential interference contrast (DIC) and fluorescence are all available. Alongside a choice of high quality microscope objectives, a highperformance camera can be added to the microscope to ensure pictures of your samples (and associated Raman maps) are captured with excellent quality and resolution.SAMPLE STAGESA choice of microscope stages, including manual and an XYZ motorised stage which allows ease of navigation around your samples and stage area. Automated Raman maps can be obtained and generated through Ramacle.Heating/cooling of stages is also available.SPECIFICATIONS – RM5LASERS Up to 3 narrow-band lasers including: 532 nm, 638 nm, 785 nmOther wavelengths available on requestLaser selection is fully computer-controlledLASER REJECTION FILTERS Up to 3 laser rejection filters includedFilter exchange is fully computer-controlledLASER ATTENUATION 4 orders of magnitude, continuousFully computer-controlledSPECTRAL RESOLUTION From 1.4 cm-1 *SPECTRAL RANGE50 cm-1 - 4000 cm-1 *SPECTROGRAPH T ype Asymmetric Czerny-TurnerFocal Length225 mmGratings5-position grating turret, fully computer-controlledSlits Continuously adjustable, fully computer-controlledCONFOCAL IMAGING Adjustable confocal pinhole, fully computer-controlledDETECTORS Standard Detector High sensitivity ultra low noise CCD1650 x 200 pixels, TE-cooled -60o C (standard) OR2000 x 256 pixels, TE-cooled -60o C (enhanced sensitivity and spectral range)Optional Second Detector EMCCD detector, InGaAs and others available on requestSelection of detectors, fully computer-controlledRAMAN POLARISATION Optional Polarisation kit available, fully computer-controlledINTERNAL CALIBRATION Wavelength calibration standard (Neon)Raman shift standard (Silicon)Sensitivity validation standard (Silicon)Automated laser alignmentMICROSCOPE SYSTEM Functionality Full upright microscope with brightfield and darkfield illuminatorOptional Polarisation, Differential Interference Contrast (DIC) capability and fluorescence imagingObjective(s)10x and 100x objective included as standard; up to 5 can be includedSample Viewing Trinocular eyepiece, embedded CMOS video camera, second video camera optionalSample Stage XY manual stageOptional XYZ motorised stage (75 mm x 50 mm XY), confocal Raman mappingT emperature-controlled sample stages availableSOFTWARE Ramacle®Comprehensive all-in-one, intuitive software packageOperating System Windows®Functionality Data acquisition, spectrograph control, graphical display, data processingOptional Chemometric, spectral library packages - KnowItAll TMLASER SAFETY Without Laser Enclosure Class 3BWith Laser Enclosure Class 1DIMENSIONS W x D x H †600 mm x 800 mm x 600 mmWeight †63 kg*depending on grating, laser and CCD selection† without laser enclosure9EDINBURGHINSTRUMENTS2 Bain Square,Kirkton Campus,Livingston, EH54 7DQUnited KingdomTel: +44 (0)1506 425 300Fax: +44 (0)1506 425 320****************U.S. OFFICECONTACT:Tel: +1 800 323 6115******************Registered in England and Wales No: 962331 VAT No:GB 271 7379 37 ©Edinburgh Instruments Ltd 2019F / 06.2019MANUFACTURED WITH PRIDE IN THEUNITED KINGDOMCustomer support isavailable worldwideP h o to lu m ine s c e n c e CIRCLE R a m a n CIRCLE U V -V i s CIRCLET ransie nt Abso rp tionEXPERTS IN MOLECULAR SPECTROSCOPY S I N C E 1971。

Ultra-Focus and digital aPO Correctioninformation about the lens and exact capture conditions is fedultra-fine-tuning of the auto-focus mechanism, taking into account the design specifications of the lens and the optical specifications of the sensor. in this way the full HC lens program is enhanced to perform at a new level ofaberration and distortion is also added. “digital aPO Correction” (daC), is an aPO-chromatic cor-a combination of the various paramaters concerning each specific lens for each specific shot, ensuring that each image represents the best that your equip-We are confident that the image quality you achieve as a result of the daC functionality will make you – andwe are now expanding our lensdesigned 28mm lens that has been developed for the H3d. the design has been optimized for the actual 36x48mm area of the sensor to make it more compact and work in conjunction with daC as anfect the images from this extraordinary lens. the achievement is clear; daC increases the resolution ofa perfect pixel definition, the basis for the image rendering is optimized.the advantages of the central lens shutters of HC/HCd lenses adds flexibility by allowing flash to be employedspeeds up to 1/800s. thanks to the large format, the depth of field range is considerably shallower making it much easier to create a perfect interplay between sharpness and blur.H System cameras and lenses are designed and built for dura-bility and high quality performance, both for rough location work and for the demands of a studio photographer, something you notice the moment you hold the camera.H3d Camera bodyany shutter with X syncRollei electronic shutter with lenscontrolany view camera with Hasselblad H adapterFlash sync input cableH3dsensor unit (included)HVM viewfinderHV 90x viewfinderinstant film back HMi100Film back HM 16•32HCd 4/28 mm HC 3.5/35 mm HC 2.2/100 mm HC 4/210 mm HC 3.5/50 mm HC Macro 4/120 mm HC 4.5/300 mm HC 2.8/80 mm HC 3.2/150 mm HC 3.5-4.5/50-110 mm HC 1.7X converter。

ZEISS Axiocam 512 colorYour 12 Megapixel Microscope Camera for Imagingof Large Sample Areas – Fast, in True Color, and High ResolutionProduct Information Version 1.1Technical Specifications› ServiceTechnical Specifications› ServiceTechnical Specifications› ServiceTechnical Specifications› Technology and Details› ServiceTechnical SpecificationsWave Length (nm)Blue Green Red› Technology and Details › ServiceBecause the ZEISS microscope system is one of your most important tools, we make sure it is always ready to perform. What’s more, we’ll see to it that you are employing all the options that get the best from your microscope. You can choose from a range of service products, each delivered by highly qualified ZEISS specialists who will support you long beyond the purchase of your system. Our aim is to enable you to experience those special moments that inspire your work.Repair. Maintain. Optimize.Attain maximum uptime with your microscope. A ZEISS Protect Service Agreement lets you budget for operating costs, all the while reducing costly downtime and achieving the best results through the improved performance of your system. Choose from service agreements designed to give you a range of options and control levels. We’ll work with you to select the service program that addresses your system needs and usage requirements, in line with your organization’s standard practices.Our service on-demand also brings you distinct advantages. ZEISS service staff will analyze issues at hand and resolve them – whether using remote maintenance software or working on site. Enhance Your Microscope System.Your ZEISS microscope system is designed for a variety of updates: open interfaces allow you to maintain a high technological level at all times. As a result you’ll work more efficiently now, while extending the productive lifetime of your microscope as new update possibilities come on stream.Profit from the optimized performance of your microscope system with services from ZEISS – now and for years to come.Count on Service in the True Sense of the Word>> /microservice› Technology and Details › ServiceN o t f o r t h e r a p e u t i c , t r e a t m e n t o r m e d i c a l d i a g n o s t i c e v i d e n c e . N o t a l l p r o d u c t s a r e a v a i l a b l e i n e v e r y c o u n t r y . C o n t a c t y o u r l o c a l Z E I S S r e p r e s e n t a t i v e f o r m o r e i n f o r m a t i o n .E N _40_011_104 | C Z 09-2016 | D e s i g n , s c o p e o f d e l i v e r y a n d t e c h n i c a l p r o g r e s s s u b j e c t t o c h a n g e w i t h o u t n o t i c e . | © C a r l Z e i s s M i c r o s c o p y G m b HCarl Zeiss Microscopy GmbH 07745 Jena, Germany ********************/axiocam。

成都理工大学学生毕业设计（论文）外文译文极，（b）光电子是后来ηNph，（c）这些∝ηNph电子在第一倍增极和到达（d）倍增极的k（k = 1，2…）放大后为δk 并且我们假设δ1=δ2=δ3=δk=δ的，并且δ/δ1≈1的。

我们可以得出：R2=Rlid2=5.56δ/[∝ηNph（δ-1）] ≈5.56/Nel （3）Nel表示第一次到达光电倍增管的数目。

在试验中，δ1≈10＞δ2=δ3=δk，因此，在实际情况下，我们可以通过（3）看出R2的值比实际测得大。

请注意，对于一个半导体二极管（不倍增极结构）（3）也适用。

那么Nel就是是在二极管产生电子空穴对的数目。

在物质不均匀，光收集不完整，不相称和偏差的影响从光电子生产过程中的二项式分布及电子收集在第一倍增极不理想的情况下，例如由于阴极不均匀性和不完善的重点，我们有：R2=Rsci2+Rlid2≈5.56[(νN-1/Nel)+1/Nel] (4)νN光子的产生包括所有非理想情况下的收集和1/Nel的理想情况。

为了说明，我们在图上显示，如图1所示。

ΔE/E的作为伽玛射线能量E的函数，为碘化钠：铊闪烁耦合到光电倍增管图。

1。

对ΔE/E的示意图（全曲线）作为伽玛射线能量E功能的碘化钠：铊晶体耦合到光电倍增管。

虚线/虚线代表了主要贡献。

例如见[9,10]。

对于Rsci除了1/（Nel）1/2的组成部分，我们看到有两个组成部分，代表在0-4％的不均匀性，不完整的光收集水平线，等等，并与在0-400代表非相称keV的最大曲线。

表1给出了E=662Kev时的数值（137Cs）在传统的闪烁体资料可见。

从图一我们可以清楚的看到在低能量E＜100Kev，如果Nel，也就是Nph增大的话，是可以提高能量分辨率的。

这是很难达到的，因为光额产量已经很高了（见表1）在能量E＞300Kev时，Rsci主要由能量支配其能量分辨率，这是没办法减小Rsci 的。

然而，在下一节我们将会讲到，可以用闪烁体在高能量一样有高的分辨率。

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Able to withstand a temperature range of -10 °C to 50 °C (14 °F to 122 °F) at full duty cycle, Vanta analyzers ensure you achieve 100% uptime without wasting time waiting for your analyzer to cool, even in hot environments.** The detector shutter on C and M series models helps prevent punctures so you can analyze rough surfaces with confidence. RevolutionaryEvery circuit, contour, and interface of Vanta handhelds is engineered to be the best of its kind. Vanta analyzers incorporate Olympus’ new Axon TM technology, a breakthrough in XRF signal processing that delivers accurate and repeatable test results. Axon technology uses ultra-low-noise electronics enabling higher X-ray counts per second and faster results. Coupled with a new quad-core processor, Axon technology makes Vanta analyzers remarkably responsive, pushing the limits of performance so you get the best results in the least amount of time. Axon technology provides both test-to-test and instrument-to-instrument repeatability. Whether it’s your first test on your first analyzer or your thousandth test with your hundredth analyzer, the Vanta handheld XRF gives you a consistent result.ProductiveVanta analyzers maximize user throughput and make data archiving easy. Application-specific software features improve user productivity for fast ROI.• A new, intuitive interface (UI) enables the user to quickly navigate the device’s settings and software functions.• The UI can be configured based on a customer’s specific needs. Users can customize which software features and functions are displayed on the main screen.• Data are easily exported via a USB flash drive, Wi-Fi, or Bluetooth. Vanta analyzers are designed to enable powerful cloud applications.• Vanta analyzers feature a clear, bright LCD touch screen that is readable in any light.• Ergonomic buttons and an industrial-grade, push-button joystick enable users to easily navigate the system with gloved hands.• Olympus’ Vanta handheld XRF offers embedded GPS so users can pair results with precise GPS coordinates to document and map the location of elements. The optional 5-megapixel panoramic camera combines images of XRF data with GPS coordinates for inclusive archiving and streamlined reporting which provides unmatched data traceability to the field.Scrap SortingVanta analyzers for scrap sorting feature a SmartSort function that intuitively lengthens or shortens test times based on material to save time while providing the best possible match. The software automatically compares results to a library of alloy compositions to quickly match unknown materials to known alloys. The Grade Match Messaging feature enables users to program messages for each grade to display warnings or instructions. These messages make it easy for operators to use the analyzer with little training, putting the knowledge of your most experienced person to work for everyone.Positive Material Identification (PMI) and Manufacturing Quality Control/Assurance Vanta analyzers help ensure that refineries, petrochemical plants, and other processing facilities are safe by verifying that correct alloys are installed in critical locations by following American Petroleum Institute Recommended Practice 578 (API-RP-578). Manufacturers and installers of expensive or mission-critical components and machinery can rest easy knowing that they are manufactured withthe correct alloy grades, regardless of the material source. The Vanta series’ integrated GPS, optional panoramic camera, user-defined input fields, connectivity features, and extensive data reporting capabilities maximize inspector confidence and traceability to the field.Regulatory and Safety ScreeningThe Vanta series screens for Pb, Cd, As, Hg, Cr, and other toxic metals in consumer products such as toys, apparel and footwear, and electronics to comply with RoHS regulations. With an optional camera, Vanta handhelds automatically archive sample images and results, making it the ideal tool for a reasonable testing program. Excellent sensitivity enables it to achieve low detection limits for pass/ fail results of regulated elements.Vanta TM analyzers provide fast results in a diverse range of applications from alloy identification (ID) to archaeological site evaluation. Olympus’ range of application-specific software features enable operators to get the most out of their analyzers with simplified report creation and traceable results.Geochemistry and Mining ExplorationThe Vanta TM handheld analyzer is the preferred tool for mining exploration including surface mapping and core analysis. It provides accurate and reproducible results in any environment. Vanta analyzers work all day even in the high temperatures found in desert or jungle environments; remote areas where instrument downtime cannot be afforded. Geo-referenced XRF data transfer wirelessly, via Bluetooth or Wi-Fi, for real-time geochemical mapping on a GIS-equipped tablet or laptop. Map, visualize, assess, and follow-up on targets in the field for faster in-field geological exploration and decision-making.Jewelry/Precious Metals IDVanta analyzers can provide on-the-spot characterization of a range of jewelry and precious metals including Au, Ag, Pt, and Pd. The analyzer accurately classifies the purity of gold alloys (0–24 karat) and can also detect plating. With the high price of precious metals, return-on-investment is rapid.Research and EducationVanta instruments provide quantitative, semi-quantitative, and qualitative elemental information to guide research and identification of unknown or complex materials. Fast results keep students engaged with relevant data in applicable science-based projects.Environmental AssessmentsThe Vanta analyzer readily screens soil and other materials for pollutant metals. Paired with GPS data, the results can be wirelessly transferred to a GIS to create pollutant metal maps. Get fast, decisive results for site characterizations, assessments, property evaluations, and contamination tracking.E 0440034EN48 Woerd Avenue, Waltham, MA 02453, USA, Tel.: (1) 781-419-3900 110 Magellan Circle, Webster TX, 77598, USA, Tel.: (1) 281-922-9300is certified to ISO 9001, ISO 14001, and OHSAS 18001.*M Series analyzers are IP 64 rated** With optional fan. The fan assembly is IP 54 rated. Operates continuously at 33 °C without the fan. All specifications are subject to change without notice.Vanta and Axon are trademarks of Olympus Corporation.All brands are trademarks or registered trademarks of their respective owners and third party entities. The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Olympus Corporation is under license.Copyright © 2017 by Olympus.No matter the model, the rugged, fast, and reliable Vanta TM analyzer features Olympus’ Axon TM technology, and is rated to pass a 4 foot drop test, and is rated to IP65.*The Vanta SeriesM SeriesOur most powerful Vanta analyzers feature exceptional performance to handle the most demanding applications and lowest limits of detection (LODs). Each VMR model comes equipped with a sensitive large area silicon drift detector and a 50 kV X-ray tube with a rhodium (Rh) anode.C SeriesThe C Series Vanta analyzers combine value with superior speed, limits of detection (LODs), and elemental range. Each VCR model is equipped with a silicon drift detector, a 40 kV X-ray tube, and an Rh anode.L SeriesGet the ruggedness, ease of use, and data management features of Vanta analyzers in a cost-effective PIN instrument. The L Series is designed for maximum uptime and a lower cost of ownership for reliability in the field.OlympusOlympus is a leader in XRF technology with a reputation for quality and accuracy. The Olympus International Mining Group (IMG) is an internal group of natural resource specialists wholly focused on geochemical applications of XRF and XRD. The IMG has unparalleled expertise in utilizing portable XRF technology for a range of in-field geological scenarios. Olympus’ global network of support staff provide a level of ongoing service to the customer that includes support for testing methods, specific calibrations, and user training.。

3D X-ray Microscopy SolutionsSKYSCAN 1273www.atecorp.Ad P r o vided b vided by y : com (800)40404-A -ATE TEC CAdvanced vanced T Test estE quipment Rentals®23D volume rendered 200 mm long carbonate drill core, at13 µm isotropic resolution.3D volume rendered additive manufactured part, at 34 µm isotropic resolution.3D volume rendered epipen, at 50 μm isotropic resolution.ManufacturingDefect detection and porosity analysis in casting, machining & additivemanufacturing, even for closed internal compartmentsQuality control of recycled metal powder in additive manufacturingPackagingInspection of advanced medical tools Inspection of pharmaceutical packagingInspection of complexelectromechanical assembliesGeology, Oil & GasAnalysis of large geological drill cores Measure pore size and permeability, grain size, and shapeCalculate distribution of mineral phasesAnalyze dynamic processesLife SciencesArtefact-free imaging of osteo-integration of biomaterials and high density implantsImaging and analysis of various samples for forensics and palaeontologyClassification and structural analysis in zoologic and botanic researchSheep bone 60 mm in size with 2 titanium implants, 5 mm in diameter.SKYSCAN 1273 – High-Capacity3D X-ray MicroscopyThe SKYSCAN 1273 is the next-generation benchtop 3D X-ray microscope based on microcomputed tomography (Micro-CT),a non-destructive imagingtechnology pioneered by Bruker.The SKYSCAN 1273 sets a new standard for non-destructive testing (NDT) with benchtop instruments, providing a performance previously only achieved by floor standing systems. Samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg can be inspected. The combination of a h igher-energy X-ray source running at higher power and a large format flat-panel detector with ultimate sensitivity and readout speed provides excellent image quality in just a few seconds. SKYSCAN 1273 – Plug’n Analyze™the internal structure of your sample343D X-ray Microscopy –Non-destructive Imaging of the Internal StructureSeeing is believing. That’s why microscopy is commonly used for materialscharacterization. Conventional microscopy uses light or an electron beam to directly image a sample by refocusing the radiation passing through the sample. Alternative microscopy techniques, such as Atomic Force Microscopy (AFM), use othersensors to probe the sample surface. They all provide detailed and local 2D images of surface or near-surface structures or properties.DetectorSam pleX-ray tubeBut wouldn’t it be great if you could also …… image the 3D internal structure?… measure your whole sample at once?… start right away?All without the need for extensive sample preparation that may alter or destroy your sample?With X-rays you can!3D X-ray Microscopy (3D XRM)When X-rays pass through an object the intensity is reduced by absorption proportional to the average atomic number along the trajectory.In traditional radiography the resulting projection image visualizes the intensity reduction inside a 3D object as a 2D projection.By taking projection images at many different rotation angles the full 3D information can be slice-wise retrieved through a mathematical process called backprojection. Computed tomography thus enables the reconstruction of the complete 3D volume.5❼❼❼Reconstructthe 3D object volumeScan2D projection images at different rotation steptsAnalyzethe 3D structure3D X-ray Microscopy – a guided workflow in 4 simple stepsSKYSCAN 1273 – Plug’n Analyze™Our SKYSCAN 1273 is a real space sensation. Its benchtop cabinet fits X L-size samples up to 500 mm in height and 300 mm in diameter. Such large samples would typically require a floor standing system. Clever sample mounts enable precise sample positioning, regardless of their size.Best-in-class components turn the SKYSCAN 1273 into a real power pack. The higher-energy X-ray source running at higher power (130 kV, 39 W) provides abundant X-ray intensity for fast scanning even on large or dense samples. The high sensitivity flat-panel detector achieves very high contrast in the accumulated images thanks to the large dynamic range. That combined with the detector’s large 6 megapixel format and fast readout speed provides excellent image quality in a stunningly short cycle time of less than 15 seconds, ideal for time-resolved 3D X-ray microscopy. Even on large samples the cycle time will typically be only minutes. This top performance comes withlow cost of ownership. In contrast to floor standing systems the benchtop SKYSCAN 1273 does not demand alot of expensive lab space. A simple domestic power plug is all you need to start running the instrument, no water chiller or additional compressor. There are no further hidden costs as the industry-grade sealed X-ray source is maintenance-free.Typical floor standing system SKYSCAN 1273scanning volume67Embedded touch screen and lead glass door enable easy operation while observing the objectLarge chamber for mounting big samples and optional sample stagesNon-ambient (up to +85°C, down to 40°C below ambient) andmechanical stages (up to 4400 N) for time-resolved 3D microscopySeveral factors affect the true 3D spatial resolution: the focal spot size of the X-ray source, the acquisition geometry, the overall system stability, the mechanical accuracy of the rotation axis, as well as the reconstruction algorithms. The 3D spatial resolution isdetermined with special phantom structures after reconstruction. The SKYSCAN 1273 easily resolvesbetter than 5 µm in both directions.Single-phase PowerSmall FootprintPlug‘n AnalyzeNo Water Supply8SKYSCAN 1273 – Data Quality andEfficiency through IntelligenceLeft: standard round scanning strategy with Feldkamp reconstruction results in streak artifacts for planar structures perpendicular to the rotation axis (indicated by the red arrows).Right: helical scanning strategy with exact reconstruction results in artifact-free imagesPlanar structuresThe cone-beam geometry used in most X-ray imaging systems causes artifacts for planar structures perpendicular to the rotation axis. These appear as streaks after reconstruction. The SKYSCAN 1273 prevents such artifacts through helical scanning combined with exact reconstruction algorithms. In helical scanning the sample follows a spiral trajectory during the dataacquisition. Only special algorithms as those licensed by Bruker ensure exact, artifact-free reconstruction of the whole object volume.Some sample types are challenging for efficient scanning or for getting high image quality due to their particular geometry.Not with the SKYSCAN 1273!XL sizeThe SKYSCAN 1273’s large sample chamber accepts samples larger than what can be scanned with a singledetector field-of-view. By offset scanning in sections and putting the largeformat flat-panel detector in two offset positions, the SKYSCAN 1273 scans large objects up to 250 mm in diameter and 250 mm in length. 3D.SUITEautomatically and seamlessly stitches the oversized images together.❼❼❼❼9High aspect ratioConventional scanning strategies fall short on samples with high aspect ratio. A fixed angular step is either optimized for the short or for the long sample side. This results in very long scan times or in loss of resolution and consequent decrease in image quality.High Aspect Ratio Tomography PLUS (HART PLUS) ensures optimum scan conditions at every rotation angle using a scanning strategy with continuously variable angular steps. As a result, planar objects are scanned 4 times faster than with a standard scan strategy at thesame resolution. 3D.SUITE automatically selects the optimized reconstruction algorithms.SKYSCAN 1273 – the Jack of allTrades(c) HART PLUS results in an artifact-free image as in (b),but 3 to 4 times faster.The pictures above show reconstructed cross sections through a ceramic capacitor with different scan strategies.RSKYSCAN 1273 with 3D.SUITE –the Complete 3D XRM SolutionIntuitive, simple, yet powerful – the3D.SUITE software that comes withevery SKYSCAN 1273 is designed toinspire finding out what’s inside. Withthe help of Genius Mode, even a noviceuser can intuitively start scanningright away. It helps optimize the scanconditions by choosing the appropriatefilter and X-ray energy to achieve optimalimage contrast, and by selecting theoptimum exposure time and rotationstep for efficient scanning.Our NRECON reconstruction softwarereadily transforms the 2D projectionimages into 3D volumes thanks tothe included GPU acceleration. Withthe optional InstaRecon® booster3D reconstruction is even up to100 times faster than conventionalreconstruction engines operating on asingle PC.3D.SUITE also includes all advancedsoftware capabilities needed for3D inspection, visualization, and analysis.So you are perfectly set up for startingwith 3D X-ray microscopy.10113D Inspection with DATAVIEWER Display reconstructed results as slice-by-slice movies or three orthogonal projectionsSmoothing, linear and non-linear grey scale transformations, color coding Differential image analysis between samples3D Visualization with CTVOX and CTVOLVolume rendering to displayreconstructed results as a realistic 3D objectCreate animated movies flying around or through the object Produce cut-away viewsAdjust coloring and transparency Export surface rendered models in STL format to 3D printers, or to 3D CAD softwareModelling using mobile devices3D Image analysis with CTAN Handles large data sets with ease Density analysisOpen/closed porosity 3D distances and angles Thickness and separationExtensive tool set for region-of-interest selectionVarious thresholding methods,morphological operations, and filtering algorithmsColor coding of local orientation, thickness and separationAutomated batch analysis3 orthogonal projections through a concrete sample3D rendered volume of a small stepper motorPorosity analysis of a tree sliceB r u k e r i s c o n t i n u a l l y i m p r o v i n g i t s p r o d u c t s a n d r e s e r v e s t h e r i g h t t o c h a n g e s p e c i f i c a t i o n s w i t h o u t n o t i c e . O r d e r N o . D OC -B 76-E X S 014 © 2019 B r u k e r A X S .Online information/skyscan1273Worldwide offices/mct-officesBruker microCT********************400 kg。

Interfacial Interactions in PP/MMT/SEBSNanocompositesABSTRACT: The intercalation capability of poly(styrene-b-ethylene butylene-b-styrene) (SEBS) in nanocomposites of isotactic polypropylene (PP) with 5 wt % of organically modified montmorillonite (C20A), prepared by melt blending, has been investigated. X-ray diffraction (XRD) and transmission electron microscopy (TEM) studies have shown the presence of intercalated structures in the nanocomposite. In a previous research, we studied the intercalation capability of a commercial compatibilizer. Those results, with the study we present in this work, allow us a better understanding of the mechanism of compatibilizationand a deeper characterization of the structure and morphology of the nanocomposite. Scanning transmission X-ray microscopy (STXM) has been used. Because of the excellent chemical sensitivity and the high spatial resolution (∼40 nm) of this technique, we have proved that C20A is not in direct contact with the PP phase because the clay is always located inside the elastomer domains. The elastomer is surrounding the nanoclay, hindering the clay exfoliation and preventing its dispersion in the PP matrix. On the other hand, we have observed that the presence of the clay caused the SEBS particles to become elongated in shape and retarded the coalescence of the elastomer particles.IntroductionPhenomena and processes at the nanometric scale have opened revolutionary possibilities in the development of new nanostructured materials. In polymer systems, the addition of layered silicates leads to a great improvement in the properties of the matrix such as thermal stability and mechanical performancewith very low filler contents. This is because the high surface area of these particles with nanometric dimensions increases the interfacial interactions between matrix and clay. Therefore, the key factor for the enhancement in performance of the polymer/clay nanocomposites is the dispersion of the filler in the matrix since the final properties depend on the structure and morphology generated during the processing. Consequently, a significant research effort is dedicated to characterize the nanostructure in polymer nanocomposites.In this study, we have prepared isotactic polypropylene/ montmorillonite/poly(styrene-b-ethylenebutylene-b-styrene) elastomercomposites from the melt considering that this processing method is the most attractive for industrial application. The addition of SEBS as a third component in the composite is intended to provide a better dispersion and intercalation of the silicate and also to provide a toughness improvement. Montmorillonite is the most commonly used layered silicate for the preparation of nanocomposites because of its high aspect ratio, large surface area, and surface reactivity. Its structure consists on the stacking of aluminosilicate layers∼1 nmthick,with a regular spacing between them of∼1.5 nm. Its high cation exchange capacity offers a way of modifying the interlayer spacing to make it larger and more compatible with polymers. However, unlike polymers with polar groups like polyamides,in nonpolar polymers like polypropylene (PP) the organic modification of the clay is not enough to achieve a good level of dispersion and hardly leads to mixed structures. Therefore, compatibilizers like polypropylene graft- maleic anhydride (PP-g-MA) are commonly used to improve interactions between the organic polymer and the inorganic filler.In this work, we have studied the intercalation capability ofa styrene-ethylene butylene-styrene triblock copolymer, SEBS, as an alternative to the use of common compatibilizers, such as the PP-g-MA mentioned above, in PP/montmorillonite nanocomposites. In PP nanocomposites, an elastomer phase is normally used to compensate for the reduction of toughness caused by adding inorganic fillers. In principle, SEBS can aid the polypropylene chains to get into the nanoclay layers. Therefore, it can be expected that SEBS favors the intercalation and/or exfoliation. On the other hand, it has been reported that in these kinds of blends of immiscible polymers, e.g., PS/PP or PBT/PE, the nanoclay acts modifying the interphase properties and so improving the compatibility between the different polymeric phases. SEBS presents a phase-separated morphology, and consequently, its interactions with the montmorillonite and its intercalation capability will be very different from the ones of common compatibilizers. The aim of this work is to investigate the structure, morphology, and interfaces of isotactic polypropylene- clay-elastomer nanocomposites prepared by melt mixing. X-ray diffraction (XRD) and transmission electron microscopy (TEM) are used to characterize the intercalationcapability of the polymers. TEM microscopy alone cannot provide conclusive information about the compatibilization role of SEBS in the PP-clay system, since although the lack of chemical contrast between the SEBS and PP polymeric phases could be overcome by OsO4 staining, the different TEM magnificationsneeded to observe the rubber phase (in the range of micrometers) and the clays (in the range of nanometers) would make difficult to observe the three components simultaneously. Besides, no compositional chemical information is provided by this technique.Experimental SectionMaterials. The polypropylene (PP) used as matrix was an isotactic homopolymer, with a polydispersity of 4.77, provided by REPSOL. It is characterized by an isotacticity of 95%, determined by solution NMR,and a viscosity average molecular weight of 179 000 g/mol, obtained by intrinsic viscosity measurements. The organically modified montmorillonite (MMT) clay used in this study was Cloisite 20A (C20A) obtained from Southern Clay Products. The individual platelets are typically 1 nm in thickness, with an aspect ratio larger than 50. The interlayer spacing, determined by XRD, is d001 = 2.52 nm. The elastomer used was a triblock copolymer SEBS (Calprene H-6110) provided by DYNASOL, with 30 wt % of styrene content, a molecular weight value of Mw = 85 000 g/mol, and Mw/Mn=1.45, as determined by gel permeation chromatography(GPC).Preparation of PP-MMT Composites.Polymer blends and composites were prepared by melt blending in a Haake Rheomix 600 internal mixer attached to a Haake Rheocord 90 corotating twin-screw mixing chamber. A temperature of 190 _C, mixing time of 5 min, and a rotor speed of 100 rpm were determined to be the optimum processing conditions. In the composite, PP/C20A/SEBS (80/5/15), clay loading was 5 wt % as it is demonstrated to be the optimum content for mechanical performance. In order to compare the compatibilizer activity of SEBS with commercial compatibilizers, the elastomer content was 15 wt % because as seen in the literature weight ratios of clay/commercial compatibilizers of 1/3 give better results of clay dispersion. Binary composites PP/C20A(95/5) and binary PP/SEBS blends (90/10) and (80/20), with10 and 20 wt % elastomer content, respectively, were used for comparison. Films of the nanocomposite material were compression- molded at 100 Mbar by heating the pellets at 190 _C for 5 min withsubsequent quenching of the formed film between water-cooled metal plates.Characterization.XRD. X-ray diffraction (XRD) was used to measure the interlayer spacing of the clay.XRD patterns were obtained at room temperature using a Philips PW 1050/70 diffractometer, at 1_/min in a 2θ range between 2_ and 35_ usingNi-filtered Cu KR radiation.TEM. The dispersion of the nanoclays and composite morphology on a microscopic scale were examined by transmission electron microscopy (TEM). Images were obtained with a Philips Tecnai 20 microscope. Ultrathin sections, 50-100 nm in thickness, were cryogenically microtomed with a diamond knife at∼-60 _C. Sections were collected on copper TEM grids.STXM. To identify the chemical composition of the composites and to observe simultaneously all the components in the nanostructure, scanning transmission X-ray microscopy (STXM) measurements were conducted using the STXM at BL5.3.2 of the Advanced Light Source at Lawrence Berkeley National Laboratory. STXM allows a detailed chemical and compositional analysis with excellent chemical sensitivity and a high spatial resolution. The BL 5.3.2 STXM can provide images with ∼30 nm spatial resolution for X-ray photons of 250-600 eV, with an energy resolution of about 0.1 eV. The energy range includes the most important absorption edges in polymer chemistry: C(1s) at 280 eV,N(1s) at 400 eV, and O(1s) at 520 eV.We have used NEXAFS microscopy to obtain images with nanometric resolution and absorption contrast between the two polymer components, making use of the different X-ray absorption of the different components. The spectra shown are normalized to the maximum height for comparison purposes. Image sequences, used to provide detailed chemical mapping,were converted to chemical component maps using pixel-by-pixel curve fitting with suitable XANES spectra from reference components. Details about this instrument and experiment can be found elsewhere. To obtain the map shown below, a complete sequence of images at photon energies encompassing the C(1s) region was recorded corresponding to a typical XANES energy scan. In this way, each pixel, representing a morphological and spatial dimension, contains a full XANES spectrum.ConclusionsAn investigation of the structure and morphology of PP/C20A/SEBS nanocomposite prepared by melt processing has been carried out with special emphasis on the structure of the interface. STXM has been used to provide images and spatially resolved compositional information simultaneously of the threecomponents and has allowed determining the role of SEBS in the nanocomposite structure.From the XRD experiments, an intercalated structure was determined for the nanocomposite. TEM observations showed a mixed morphology in which stacks coexisted with intercalated regions and some individual exfoliated layers. However, the nanoclay was not well dispersed in the matrix, and it was not possible to distinguish which polymer was interacting with it. The stacks did not appear lined up but bent and twisted, and the clay exfoliation seemed to be hindered.The NEXAFS microscopy experiments clearly showed that the elastomer is surrounding the nanoclay, and although inside the rubbery phase there is intercalation, SEBS does not act as a compatibilizer agent since C20A is not in contact with PP. The dispersion of the montmorillonite in the PP matrix is dominated by the compatibility between the polymeric components and thenanoclay.On the other hand, the presence of the nanoclay causes a decrease in the coalescence of the rubbery phase. There is a reduction of the size of SEBS domains in comparison with binary PP/SEBS systems, and these domains are better distributed in the PP matrix.PP / MMT / SEBS纳米复合材料的界面相互作用摘要：插层能力的聚（苯乙烯 - 嵌段 - 乙烯 - 丁烯 - 嵌段 - 苯乙烯）（SEBS）的纳米复合材料由等规聚丙烯（PP）与5 ％（重量）的有机改性的蒙脱土（C20A ）通过熔融共混制备，已经被研究。

毕业设计单片机控制LED点阵显示器Controlled LED dot matrix display摘要随着社会日益快速的发展，目前人们的生活节奏也越来越快。

汉字LED电子显示屏越来越受到人们的重视。

显示是电子领域中不可缺少的一部分。

LED电子显示屏是新型信息显示媒体，集电子技术、光电子技术、计算机技术、信息处理技术于一体，以其色彩鲜艳，使用范围广，亮度高，寿命长，工作稳定可靠等优点，广泛应用于商业广告、体育场馆、港口机场、客运站、高速公路、新闻发布、证券交易等方面。

led显示屏利用发光二极管构成的点阵模块或像素单元组成大面积显示屏幕，以环境适应能力强、性能价格比高、使用成本低等特点，在短短的十来年中，迅速成为平板显示领域的主流产品，也是目前国际上比较先进的显示媒体之一。

本文叙述了单片机AT89S52在32×16点阵智能汉字显示屏的应用（主要的功能、硬件的组成和软件的设计）。

该系统的功能是通过对单片机的编程控制其P1口和P3口进行串行输出，然后通过正向驱动器将输出的信号进行放大，再利用二极管的单向导电性使其导通（亮）或者是截止（灭）。

整个系统结构紧凑、简单可靠、操作灵活、可扩展性强、功能强、性能价格比高，较好地满足了现代生活，生产和科研的需要。

关键词:LED显示屏；单片机AT89S52；驱动器74ALS245ABSRACTWith the fast development of the society ,the live rhythm of people is more and more quick at present ，LED character electronics screen is ardently loved by people. Display shows the electronic indispensable part of the file. Serial output LED electronic display is a new information display media, set electronic technology, photonics technology, computer technology, information processing technology, and its colorful, using a wide range of high brightness, long life, stable and reliable, widely used in commercial advertising, stadiums, ports or airports, bus terminal, highway, press releases, securities trading and so on. Led display using light emitting diode dot matrix modules consisting of a large area or pixel display modules, adaptable to the environment, high cost performance, using low cost, in just 10 coming in, quickly becoming the area of flat panel display mainstream products, is currently the intemational media, one of the more advanced display.This thesis described the intelligence Chinese characters for machine AT89S52 constituting of applied single slice to show to hold the constituting of main function, hardware with the software's design. The function of that system passes to plait machine of single slice the procedure as to it's the p1, p3 proceeds to serial output, then pass move the octal bus transceiver to proceeds the output's signal to enlarge, and make use of the diode again single to close or to electrical conductivity. It is strong that it is reliable, operates flexibility, function that the whole systematic structure is compact, simple and the ratio of performance to price is high, which have satisfied modern agricultural production and need of scientific research better.Key Words: LED character electronics screen；one-chip computer AT89S52；octal bus transceiver 74ALS245目录1引言 (1)2单片机简介 (2)2.1单片机的发展历史及其分类 (2)2.2单片机的结构特点 (4)2.3MCS-52单片机芯片内部逻辑结构 (4)3硬件系统设计 (5)3.1将要实现的功能要求 (5)3.2方案论证 (6)3.3系统硬件电路的设计 (7)3.4主要芯片介绍 (8)3.4.1 正向驱动器74LS245及其应用 (8)3.4.2 4-16线译码器 (10)3.4.3 32×16LED点阵显示屏 (11)3.4.4 系统核心单片机部分—AT89S52 (12)4软件设计 (19)4.1刷新频率的计算及驱动程序流程图 (19)4.2系统主程序流程图 (20)5调试及性能分析 (21)结论 (23)参考文献 (24)附录1：原理图 (25)附录2：程序源代码 (26)附录3：单片机控制板PCB图 (35)附录4：英文资料及中文翻译 (36)致谢 (45)。