AS05008MR-4-R, 规格书,Datasheet 资料

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERFeatures• Low Forward Voltage Drop• Guard Ring Construction for Transient Protection • High Conductance• Lead Free By Design/RoHS Compliant (Note 3) • "Green" Device (Note 4)Mechanical Data• Case: SOD-323• Case Material: Molded Plastic, "Green" Molding Compound.UL Flammability Rating Classification 94V-0• Moisture Sensitivity: Level 1 per J-STD-020D• Polarity: Cathode Band• Terminals: Finish - Matte Tin Annealed Over Alloy 42leadframe. Solderable per MIL-STD-202, Method 208 • Marking Information: See Page 2• Ordering Information: See Page 2• Weight: 0.004 grams (approximate)Top ViewMaximum Ratings@T A = 25°C unless otherwise specifiedSingle phase, half wave, 60Hz, resistive or inductive load.For capacitance load, derate current by 20%.Characteristic Symbol Value UnitPeak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRMV RWMV R40 VRMS Reverse Voltage V R(RMS)28 V Average Rectified Output Current I O0.5 ANon-Repetitive Peak Forward Surge Current8.3ms single half sine-wave superimposed on rated load I FSM3 A Thermal CharacteristicsCharacteristic Symbol Value Unit Power Dissipation (Note 1) P D235 mW Typical Thermal Resistance Junction to Ambient (Note 1) RθJA426 °C/W Operating and Storage Temperature Range T J, T STG-40 to +125 °CElectrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test Condition Reverse Breakdown Voltage (Note 2) V(BR)R40 ⎯⎯V I R = 1mAForward Voltage V F⎯285480300550mVI F = 10mAI F = 500mAReverse Current (Note 2) I R ⎯⎯1.02.035μAμAV R = 10VV R = 30VTotal Capacitance C T ⎯⎯12520⎯⎯pFpFV R = 0V, f = 1.0MHzV R = 10V, f = 1.0MHzNotes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at /datasheets/ap02001.pdf.2. Short duration pulse test used to minimize self-heating effect.3. No purposefully added Lead.4. Diodes Inc.'s "Green" policy can be found on our website at /products/lead_free/index.php.Please click here to visit our online spice models database.10100V, INSTANTANEOUS REVERSE VOLTAGE (V)Fig. 2 Typical Reverse CharacteristicsRI,INSTANTANEOUSFORWARDCURRENT(mA)FV, INSTANTANEOUS FORWARD VOLTAGE (V)Fig. 1 Typical Forward CharacteristicsF100C,TOTALCAPACITANCE(pF)TV, DC REVERSE VOLTAGE (V)Fig. 3 Total Capacitance vs. Reverse VoltageR0.250.50050100I,AVE150RAGEFORWARDCURRENT(A)F(AV)T, TERMINAL TEMPERATURE (C)Fig. 4 Forward Current Derating CurveT°0.751.02575125Ordering Information(Note 5)Part Number Case PackagingB0540WS-7 SOD-323 3000/Tape & ReelNotes: 5. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationSF SF = Product Type Marking CodePackage Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.SOD-323 Dim Min Max A 0.25 0.35 B 1.20 1.40 C 2.30 2.70 H 1.60 1.80 J 0.00 0.10 K 1.0 1.1 L0.20 0.40 M 0.10 0.15α0° 8°All Dimensions in mmDimensions Value (in mm)Z 3.75 G 1.05 X 0.65 Y 1.35 C 2.40分销商库存信息: DIODESB0540WS-7。

XN5008T版本 1.1 ( October 2018 )本版本适用于QSAN XCubeNAS XN5008T NAS储存设备。

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法规声明CE StatementThis device has been shown to be in compliance with and was tested in accordancewith the measurement procedures specified in the Standards and Specificationslisted below.Technical Standard: EMC DIRECTIVE 2014/30/EU Class B(EN55032 / EN55024)FCC StatementThis equipment has been tested and found to comply with the limits for a Class Bdigital device, pursuant to Part 15 of the FCC Rules. These limits are designed toprovide reasonable protection against harmful interference when the equipment isoperated in a residential installation and used in accordance with the instruction! imanual may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:•Reorient or relocate the receiving antenna.•Increase the separation between the equipment and receiver.•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.•Consult the dealer or an experienced radio TV technician for help.Notice: The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equivalent.VCCI Statementこの装置は、クラスB情報技術装置です。

SPECIFICATIONSFX Form FactorSST-SX550550W Switching Power SupplyWith Active PFC 80Plus Gold01This is the specification of Model SX550; AC-line powered switching power supply with active PFC (Power Factor Correction) circuit, meet EN61000-3-2 and with Full Range Input features.The specification below is intended to describe as detailedly as possible the functions and performance of the subject power supply. Any comment or additional requirements to this specification from our customers will be highly appreciated and treated as a new target for us to approach.The subject power supply will meet the EMI requirements and obtain main safety approvalsas following:- FCC Part 15 Subpart J, Class ‘B’ 115 Vac operation.- CISPR 22 Class ‘B’ 230 Vac operation.2.1 EMI REGULATORY1. GENERAL DESCRIPTION AND SCOPE2. REFERENCE DOCUMENTS3. PHYSICAL REQUIREMENTS3.1 MECHANICAL SPECIFICATIONSThe mechanical drawing of the subject power supply, which indicate the form factor, location of the mounting holes, location, the length of the connectors, and other physical specifications of the subject power supply. Please refer to the attachment drawing.4. ELECTRICAL REQUIREMENTS4.1 OUTPUT ELECTRICAL REQUIREMENTSThe subject power supply will meet all electrical specifications below, over the full operation temperature range and dynamic load regulation.4.1.1. OUTPUT RATING(1)The +3.3V and +5V total output shall not exceed 120W(2) total output for this subject power supply is 550 watts.(3) Ripple and noise measurements shall be made under all specified load conditions through a singlepole low pass filter with 20MHz cutoff frequency. Outputs shall bypassed at the connector witha 0.1uF ceramic disk capacitor and a 10uF electrolytic capacitor to simulate system loading.02115V / 60Hz : 15 mSec. Minimum.230V / 50Hz : 15 mSec. Minimum.4.1.5.OVER VOLTAGE PROTECTION03The cross regulation defined as follows, the voltage regulation limits DC include DC Output ripple & noise.115V / 60Hz : 15 mSec. Minimum.230V / 50Hz : 15 mSec. Minimum.(10% TO 90% OF FINAL OUTPUT VALUE, @FULL LOAD)115V-rms or 230V-rms + 5Vdc : 20ms Maximum4.1.3. HOLD-UP TIME (@80 % LOAD)4.1.4.OUTPUT RISE TIME4.1.2. LOAD CAPACITY SPECIFICATIONS04P.G. SENSE Output short circuit is defined to be a short circuit load of less than 0.1 ohm.In the event of an output short circuit condition on +3.3V, +5V or +12V output, the power supply will shutdown and latch off without damage to the power supply. The power supply shall return to normal operation after the short circuit has been removed and the power switch has been turned off for no more than 2 seconds.In the event of an output short circuit condition on -12V output, the power supply will not be damaged. The power supply shall return to normal operation as soon as the short circuit has been removed. and the power switch has been turned off for no more than 2 seconds.The power good signal is a TTL compatible signal for the purpose of initiating an orderly star-up procedure under normal input operating conditions. This signal is asserted (low) until +5Vdc has reached 4.75 volts during power up. Characteristics:TTL signal asserted (low state) : less than 0.5V while sinking 10mA.TTL signal asserted (high state) : greater than 4.75V while sourcing 500uA. High state output impedance : less or equal to 1Kohm from output to common.4.1.6.SHORT CIRCUIT PROTECTION4.1.7.OVER CURRENT PROTECTION4.1.8.POWER GOOD SIGNALPOWER GOOD @ 115/230V,FULL LOAD POWER FAIL @115/230V, FULL LOAD100 – 500mSec.1 mSec. minimum05IAIB4.2. OUTPUT TRANSIENT LOAD RESPONSEV+5V and +12V must be within specification for a step change in current as specified below. The outputs will be tested one section at a time with all other sections at maximum load. The testtransition will be from IA to IB and IB to IA. The step current will have a nominal transition time of 0.5 amp per microsecond for +5V and 0.1 amp per microsecond for +12V.+5Vdc:IA: 16.0 amps IB: 11.2 ampsVolts variation: 400 mV max (p-p) Setting time: 10 ms max+12V:IA: 45.0 amps IB: 31.5 ampsVolts variation: 550 mV max (p-p) Setting time: 10 ms max +3.3Vdc:IA: 16.0 amps IB: 11.2 ampsVolts variation: 400 mV max (p-p) Setting time: 10 ms max4.2.1 Transient Load Requirement4.3. INPUT ELECTRICAL SPECIFICATIONS4.3.1. VOLTAGE RANGEPARAMETER UNITSV-in Range 90 - 264 V-rms4.3.2. INPUT FREQUENCYINPUT FREQUENCY 47–63Hz4.3.3. INRUSH CURRENT(Cold start – 25 deg. C)115V 60A230V 120A4.3.4. INPUT LINE CURRENT115V 8.0 Amps – rms maximum230V 4.0 Amps – rms maximum4.4. EFFICIENCYFull load (100%) Typical load (50%) Light load (20%) 115VAC 87% 90% 87%(loading shown in Amps)064.5. Standby Power Consumption (5Vsb):Input Power < 0.5W @ 5Vsb/45mA & 230Vac inputPS_ON input signal @ High State4.6. PS_ ON#PS_ON# is an active-low, TTL-compatible signal that allows a motherboard to remotely controlthe power supply in conjunction with features such as soft on/off, Wake on LAN+, or wake-on-modem.When PS_ON# is pulled to TTL low, the power supply should turn on the five main DC outputrails: +12VDC,+5VDC,+3.3VDC,and –12VDC. When PS_ON# is pulled to TTL highor open-circuited, the DC output rails should not deliver current and should be held at zeropotential with respect to ground. PS_ON# has no effect on the +5VSB output, which is always enabled whenever the AC power is present. Table 15 lists PS_ON# signal characteristics.The power supply shall provide an internal pull-up to TTL high. The power supply shall also provide debounce circuitry on PS_ON# to prevent it from oscillating on/off at startup when activated by a mechanical switch. The DC output enable circuitry must be SELV-compliant.Table 15. PS_ON# Signal Characteristics5. ENVIRONMENTAL REQUIREMENTSThe power supply will be compliant with each item in this specification for the following Environmental conditions.5.1. TEMPERATURE RANGEOperating 550W 0 to 50Storage -20 to 805.2. HUMIDITYOperating 5 –85% RH, Non-condensing Storage 5 –95% RH, Non-condensing075.3. VIBRATIONThe subject power supply will withstand the following imposed conditions without experiencingnon-recoverable failure or deviation from specified output characteristics.Vibration Operation, 0.01g²/Hz at 5 Hz sloping to 0.02g²/Hz at 20 Hz, and maintaining 0.02g²/Hz from20 Hz to 500 Hz. The area under the PSD curve is 3.13gRMS. The duration shall be 20 minutes per axisfor all three axes on all samples.Plane of vibration to be along three mutually perpendicular axes.5.4. SHOCKThe subject power supply will withstand the following imposed conditions without experiencingnon-recoverable failure or deviation from specified output characteristics.Storage 40G, 9 mSec. half-sine wave pulse in both directions on three mutually Perpendicular axes.Operating 10G, 11mSec. half-sine wave pulse in both directions on three mutually Perpendicular axes.6. SAFETYLEAKAGE CURRENTThe leakage current from AC to safety ground will not exceed 3.5 mA-rms at 264Vac, 50 Hz.7. ELECTORMAGNETIC COMPATIBILITY7.1. RADIATED EMIThe subject power suppy will meet FCC and CISPR 22 requirements under normal load conditions.0810.1 Physical Dimension09125 mm (W) × 63.5 mm (H) × 100mm (D)10. MECHANICAL REQUIREMENTS9.1. MTBF8.1. MODEL NUMBER LABEL8.2. DC OUTPUT IDENTIFICATIONCThe power supply have a minimum predicted MTBF(MIL-HDBK-217) of 100,000 hours ofcontinuous operation at 25 , maximum-output load, and nominal AC input voltage.Label marking will be permanent, legible and complied with all agency requirements.Labels will be affixed to the sides of the power supply showing the following:Each output connector will be labeled.- Manufacturer’s name and logo.- Model no., serial no., revision level, location of manufacturer.- The total power output and the maximum load for each output.- AC input rating.8. LABELLING9. RELIABILITY。

ADNS-5000 Optical Mouse Sensor Data SheetDescriptionThe ADNS-5000 is a one-chip USB optical mouse sensor for implementing a non-mechanical tracking engine for computer mice.It is based on optical navigation technology that measures changes in position by optically acquiring sequential surface images (frames) and mathemati-cally determining the direction and magnitude of move-ment.The sensor is in a 18-pin optical package that is designed to be used with the ADNS-5100 Round Lens or ADNS-5100-001 Trim Lens, the ADNS-5200 Clip, and the HLMP-ED80-XX000 LED. These parts provide a complete and compact mouse sensor. There are no moving parts, and precision optical alignment is not required, facilitating high volume assembly.The output format is USB. This device meets USB revision1.1 specifications and is compatible with USB Revision2.0 specification.Default resolution is specified as 500 counts per inch, with rates of motion up to 16 inches per second and 2g acceleration. Resolution can also be programmed to 1000 cpi. Frame rate is varied internally by the sensor to achieve tracking and speed performance, eliminating the need for the use of many registers.A complete mouse can be built with the addition of a PC board, switches, mechanical Z-wheel, plastic case and cable. A 1% pull up resistor is needed for the USB port to signify a low speed HID device.Featuresx Optical navigation technologyx No mechanical moving partsx High reliabilityx Complete 2-D motion sensorx High speed motion detectionx Accurate navigation over a wide variety of surfaces x No precision optical alignment neededx Wave Solderablex IEC 60825-1 eye safe under single fault conditionsx Single 5.0 volt power supplyx Meets USB Revision 1.1 Specification and compatible with USB Revision 2.0 specificationx Meets HID Revision 1.1x On Chip LED Drive with regulated current Applicationsx Mice for desktop PC’s, Workstations, and portable PC’sx TrackballsxIntegrated input devicesFigure 1. Package outline drawing (top view)Theory of OperationThe ADNS-5000 is based on Optical Navigation Technol-ogy. It contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP) and USB stream output.The IAS acquires microscopic surface images via the lens and illumination system provided by the ADNS-5100 Round Lens or ADNS-5100-001 Trim Lens, ADNS-5200, and HLMP-ED80-XX000. These images are processed by the DSP to determine the direction and distance of mo-tion. The DSP generates the 'x and 'y relative displace-ment values which are converted to USB motion data.PinoutPin PinDescription1 D +USB D+ line2 D -USB D- line3ZA Scroll wheel quadrature input 4ZB Scroll wheel quadrature input 5LGND LED ground 6XYLED XYLED Input7VDD5 5 Volt Power (USB VBUS)8GND System ground 9REG0 3 Volt Power 10VDD3 3 Volt Power11OPT 0Descriptor Select 1 or B412OPT 1Descriptor Select 2 or B513GND System ground 14OSC_IN Ceramic resonator input 15OSC_OUT Ceramic resonator output 16B3Button 3 input (switch to ground)17B2Button 2 input (switch to ground)18B1Button 1 input (switch to ground)11 OPT 0 (B4)12 OPT 1 (B5)15 OSC_OUT14 OSC_IN13 GND18 B117 B216 B310 VDD3GND 8VDD5 7ZB 4LGND 5XYLED 6D+ 1D- 2ZA 3REG0 9Figure 2. Package outline drawingCAUTION: It is advised that normal static precautions be taken in handling and assemblyof this component to prevent damage and/or degradation which may be induced by ESD.scribing the base plate molding features for lens and PCB alignment.Figure 4. 2D assembly drawing of ADNS-5000Figure 3. Recommended PCB mechanical cutouts and spacing (Top view)The components interlock as they are mounted onto defined features on the base plate.The ADNS-5000 sensor is designed for mounting on a through hole PCB, looking down. The aperture stop and features on the package align it to the lens (See figure 3).The ADNS-5100 Round lens provides optics for the imag-ing of the surface as well as illumination of the surface at the optimum angle. Lens features align it to the sensor, base plate, and clip with the LED. The lens also has a largeFigure 5. Exploded view drawinground flange to provide a long creepage path for any ESD events that occur at the opening of the base plate (See figure 4).The ADNS-5200 clip holds the LED in relation to the lens. The LED must be inserted into the clip and the LED’s leads formed prior to loading on the PCB.The HLMP-ED80-XX000 LED is recommended for illumi-nation. If used with the bin table, sufficient illumination can be guaranteed.Block DiagramFigure 6. Block DiagramZBZAZ WHEELOSCILLATORLED OSC_OUTVOLTAGE REFERENCE D -USB PORT5 VOLT POWERBUTTONSB4B3B2B1B5PCB Assembly Considerations1. Insert the sensor and all other electrical components into PCB.2. Bend the LED leads 90 degrees and then insert the Led into the assembly clip until the snap feature locks the Led base.3. Insert the LED/clip assembly into PCB.4. Wave solder the entire assembly in a no-wash solder process utilizing solder fixture. The solder fixture is needed to protect the sensor during the solder process. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact.5. Place the lens onto the base plate.6. Remove the protective Kapton tape from optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. Recom-mend not placing the PCB facing up during the entire mouse assembly process. Recommend to hold the PCB first vertically for the Kapton removal process.7. Insert PCB assembly over the lens onto base plate aligning post to retain PCB assembly. The sensor ap-erture ring should self-align to the lens.8. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment.9. Install mouse top case.Figure 7. Typical ApplicationDesign considerations for improving ESD PerformanceThe table below shows typical values assuming base plate construction per the Avago Technologies supplied IGES file and ADNS-5100 Round lens.Typical distanceA5100A5100-001Creepage 40.5mm 17.9mm Clearance32.6mm9.2mmTypical ApplicationRegulatory Requirementsx Passes F CC B and worldwide analogous emission limits when assembled into a mouse with unshielded cable and following Avago Technologies recommen-dations.x Passes EN61000-4-4/IEC801-4 EFT tests when assem-bled into a mouse with shielded cable and following Avago Technologies recommendations.x UL flammability level UL94 V-0.x Provides sufficient ESD creepage/clearance distance to avoid discharge up to 15kV when assembled into a mouse according to usage instructions above.Notes on bypass capacitors:x All caps (except C4) MUST be as close to the sensor pins as possible.x Caps should be ceramic.x Caps should have less than 5 nH of self inductance x Caps connected to VDD3 MUST have less than 0.2: ESRx 1.5k : resistor should be ± 1% tolerance.x Z-wheel connections are detailed in Figure 20x Buttons B1-B5 can be used as button or VID/PID straps (see strap table on page 14). For VID/PID connections, parts must be connected to Vdd3 on ‘high’ connec-tion, preferably near pin 10Surface mount parts are recommendedFigure 8. Application Schematic for 3 buttons and 5 buttonsAbsolute Maximum RatingsRecommended Operating ConditionsFigure 9. Distance from lens reference plane to object surfaceParameterSymbolMinimumMaximumUnitsNotesStorage Temperature T S -4085 q C Operating Temperature T A-1555 q C Lead Solder Temp 260 q C For 10 seconds, 1.6mm below seating plane.Supply Voltage V DD-0.55.5 V ESD 2 kV All pins, human body model MIL 883 Method 3015Input Voltage V IN -0.5V DD +0.5 V All I/O pins except OSC_IN and OSC_OUT, D+, D- Input Voltage V IN -1.0 4.6 V D+, D-, AC waveform, see USB specification (7.1.1)Input VoltageV IN -0.5 3.6 V OSC_IN and OSC_OUTInput Short Circuit VoltageV SCV DDVD+, D-, see USB specification (7.1.1)ParameterSymbolMinimumTypicalMaximumUnitsNotesOperating Temperature T A 040 q C Power supply voltage V DD 4.0 5.0 5.25Volts For accurate navigation and proper USB operationPower supply voltage V dd 3.8 5.05.25Volts Maintains communication to USB host and internal register contents.Power supply rise time V RT 0.1100ms Supply noise V N 100mV Peak to peak within 0-100 MHz bandwidthVelocity Vel 16ips Acceleration Acc 2 GClock Frequency f clk 23.642424.36MHz Due to USB timing constraints Resonator Impedance X RES 55 :Distance from lens refer-ence plane to surface Z 2.3 2.42.5mm See Figure 9 Light Level onto ICIRR INC8010025,00030,000mW/m 2=639nm =875nmElectrical Characteristics over recommended operating conditions. Typical values at 25 °C, V DD =5.0 V, 24MHz USB Electrical SpecificationsElectrical Characteristics over recommended operating conditions. ParameterSymbolMin.Typ.Max.UnitsNotesPower up delay T PUP 50ms Debounce delay on button inputs T DBB5917ms“Maximum” specified at 8ms polling rate. Mechanical Z-Wheel Internally pulled down with 20k resistors and debouncedTransient Supply CurrentI DDT60mAMax. supply current during a VDD ramp from 0 to 5.0 V with > 500 s rise time. Does not include charging currents for bypass capacitors.Input Capacitance(OSC Pins)C OSC_IN50pFOCS_IN, OSC_OUT to GNDParameterSymbolMin.Max.UnitsNotesOutput Signal Crossover Voltage V CRS 1.3 2.0V C L = 200 to 600 pF (see Figure 10)Input Signal Crossover Voltage V ICRS 1.2 2.1V C L = 200 to 600 pF (see Figure 10)Output High V OH 2.8 3.6V with 15 kohm to Ground and 7.5 k to Vbus on D- (see Figure 11)Output Low V OL 0.00.3V with 15 kohm to Ground and 7.5 k to Vbus on D- (see Figure 11)Single Ended Output V SE00.8V Input High (Driven)VI H 2.0V Input High (Floating)V IHZ 2.7 3.6V Input LowV IL 0.8V 7.5k to Vdd5Differential Input Sensitivity V DI 0.2V |(D+)-(D-)| See Figure 12Differential Input Common Mode RangeV CM 0.8 2.5V Includes V DI , See Figure 12Single Ended Receiver Threshold V SE 0.82.0V Transceiver Input CapacitanceC IN12pFD+ to V BUS , D- to V BUSTiming Specifications over recommended operating conditions.Parameter Symbol Min.Max.Units NotesD+/D- Transition rise time T LR75ns C L = 200 pF (10% to 90%), see Figure 10D+/D- Transition rise time T LR300ns C L = 600 pF (10% to 90%), see Figure 10D+/D- Transition fall time T LF75ns C L = 200 pF (90% to 10%), see Figure 10D+/D- Transition fall time T LF300ns C L = 600 pF (90% to 10%), see Figure 10Rise and Fall time matching T LRFM80125%T R/T F; C L = 200 pF; Excluding the first transitionfrom the Idle StateWakeup delay from USB suspend mode due to buttons push T WUPB17ms Delay from button push to USB operationOnly required if remote wakeup enabledWakeup delay from USB suspend mode due to buttons push until accurate navigation T WUPN50ms Delay from button push to navigation operationOnly required if remote wakeup enabledUSB reset time T reset18.7sData Rate t LDRATE 1.4775 1.5225Mb/s Average bit rate, 1.5 Mb/s +/- 1.5% Receiver Jitter Tolerance t DJR1-7575ns To next transition, see Figure 13 Receiver Jitter Tolerance t DJR2-4545ns For paired transitions, see Figure 13 Differential to EOP TransitionSkewt LDEOP-40100ns See Figure 14EOP Width at Receiver t LEOPR670ns Accepts EOP, see Figure 14Source EOP Width t LEOPT 1.25 1.50sWidth of SE0 interval duringDifferential Transitiont LST210ns See Figure 11.Differential Output Jitter t UDJ1-9595ns To next transition, see Figure 15Differential Output Jitter t UDJ2-150150ns For paired transitions, see Figure 15Figure 10. Data Signal Rise and Fall TimesFigure 11. Data Signal Voltage LevelsFigure 12. Differential Receiver Input Sensitivity vs. Common Mode Input RangeV CRSRise TimeFall TimeV OLV OH V OH (min)V OL (max)GNDV IH (min)V IL (max)t LSTInput Voltage Range (volts)Figure 13. Receiver Jitter ToleranceFigure 14. Differential to EOP Transition Skew and EOP WidthFigure 15. Differential Output JitterT PERIODPERIOD DJR2Data T PERIODDifferential Data LinesT PERIODDifferential Data LinesDC Electrical SpecificationsElectrical Characteristics over recommended operating conditions. Typical values at 25 °C, V DD =5.0 V, 24MHz ParameterSymbolMinimum TypicalMaximum UnitsNotesSupply current (Sensor only), mouse moving I DDS 7.2mA No load on B1-B3, Z-LED, XYLED ZA, ZB, D+, D-Supply current (Sensor only), mouse not moving I DDSN 6.2mANo load on B1-B3, Z-LED, XYLED ZA, ZB, D+, D-Supply current, USB suspend mode I DDSS 250 P A No load on B1-B3, Z-LED, XYLED ZA, ZB, D+, D-XYLED current I LED 30mA XYLED Output Low Voltage V OL 1.1V Refer to Figure 16Input Low VoltageV IL0.5VPins: ZA, ZB, B1, B2, B3, V IL max of 0.5V DC is at V DD min of 4V DC , with a typical of 0.8V DC at V DD of 5V DC Input High Voltage V IH 0.6*V DDV Pins: ZA, ZB, B1, B2, B3 Input Hysteresis V HYST 285mV Pins: ZA, B1, B2, Input Hysteresis V HYST 200mV Pins: ZB Button Pull Up CurrentB IOUT125275500APins: B1, B2, B3Typical Performance CharacteristicsPerformance Characteristics over recommended operating conditions. Typical values at 25 °C, V DD =5.0 V, 24MHz Parameter Symbol Minimum TypicalMaximum UnitsNotesPath Error (Deviation)P Error0.5%Average path error as percent of total2.5” travel on various standard surfacesTypical Performance CharacteristicsPerformance Characteristics over recommended op-erating conditions. Typical values at 25 °C, V DD =5.0 V, 24MHzFigure 16. Typical Resolution vs. Z [2,3]Figure 17. Wavelength responsivity.[1] (Comparative Surfaces)The following graphs are the typical performance of the ADNS-5000 sensor, assembled as shown in the 2D assem-bly drawing with the ADNS-5100 Round Lens/Prism, the ADNS-5200 clip, and the HLMP-ED80-XX000 LED.00.10.20.30.40.50.60.70.80.914005006007008009001000Wavelength in nmN o r m a l i s e d r e s p o n s eNotes:1. The ADNS-5000 is designed for optimal performance when used with the HLMP-ED80-XX000 (Red LED 639nm).2. Z = distance from Lens Reference Plane to Surface.3. DOF = Depth of Field11-0.8-0.6-0.4-0.20.20.40.60.81Z-H eight(mm)R e s o l u t i o n (D P I )Configuration after Power up (Data Values)Signal Function State from Figure 9-1 of USB spec:Powered or Default Address or ConfiguredState from Figure 9-1 of USB spec:Suspended from any other stateB1Hi-Z if tied to VDD3 else pullup active Hi-Z if tied to VDD3 else pullup activeB2Hi-Z if tied to VDD3 else pullup active Hi-Z if tied to VDD3 else pullup activeB3Hi-Z if tied to VDD3 else pullup active Hi-Z if tied to VDD3 else pullup activeB4Hi-Z if tied to VDD3 else pullup active Hi-Z if tied to VDD3 else pullup activeB5Hi-Z if tied to VDD3 else pullup active Hi-Z if tied to VDD3 else pullup activeD-USB I/O Hi-Z inputD+USB I/O Hi-Z inputOSC_IN24MHz pulled lowOSC_OUT24MHzXYLED low (on) or pulsing Pulled high (off)ZB/Z_LED Hi-Z input Hi-Z inputZA Hi-Z if ZA tied to GND Hi-Z inputStrap (Jumper) TableThe PID/string strap matrix is the following:Mouse type VID PID Manuf str. Product string B1B2 B3 OPT 0OPT 1ZA ZB3-button mse 0x192F0x0116“““USB OpticalMouse”sw1 sw2 sw3Vdd3 Vdd3mechZ-wheelmechZ-wheel5-button mse 0x192F 0x0216“““USB OpticalMouse”sw1 sw2 sw3sw4 sw5mechZ-wheelmechZ-wheelXY LEDx The peak current values are 30 mA if R1 59ohm and the part meets the IEC 825-1 eye safety regulations.ButtonsThe minimum time between button presses is T DBB . But-tons B1 through B3 are connected to a Schmidt trigger input with 100 uA current sources pulling up to +5 volts during normal, sleep and USB suspend modes.Notes:For mechanical Z-wheels the following must be imple-mented:x Use a rotary switch equivalent to the Panasonic part EVQVX at /www-data/pdf/ATC0000/ATC0000CE20.pdf (The key point is stable “A” switch state in all detent positions).x Solder the rotary switch into the PCB such that the common pin is closest to the cable end of the mouse. (Metal plate faces to left)x Connect the “A” terminal of the rotary switch to “ZA” and the “B” terminal to “ZB”. ZA MUST be connected to “Signal A” in Figure 19 where the z-wheel detents are mechanically stable.Figure 19. Z-Wheel A and B connectionsZ-WheelThe mechanical Z-Wheel connections (A,B) are deter-mined below.X & Y Directions(Looking through an ADNS-5100 Lens)The positive and negative X and Y directions with respect to the mouse case are shown in the diagram below.Top Xray View of MousePOSITIVE XP O S T E YI I V Figure 18. Directions are for a complete mouse, with the ADNS-5100 lensUSB CommandsMnemonic Command NotesUSB_RESET D+/D- low > 18.6 us Device Resets; Address=0USB_SUSPEND Idle state > 3mS Device enters USB low-power modeUSB_RESUME Non-idle state Device exits USB low-power modeGet_Status_Device80 00 00 00 00 00 02 00Normally returns 00 00, Self powered 00 00,Remote wakeup 02 00Get_Status_Interface81 00 00 00 00 00 02 00Normally returns 00 00Get_Status_Endpt082 00 00 00 xx 00 02 00OUT: xx=00, IN: xx=80Normally returns 00 00Get_Status_Endpt182 00 00 00 81 00 02 00Normally returns 00 00, Halt 00 01Get_Configuration80 08 00 00 00 00 01 00Return: 00=not config., 01=configuredGet_Interface81 0A 00 00 00 00 01 00Normally returns 00Get_Protocol A1 03 00 00 00 00 01 00Normally returns 01, Boot protocol 00Get_Desc_Device80 06 00 01 00 00 nn 00See USB command detailsGet_Desc_Config80 06 00 02 00 00 nn 00See USB command detailsGet_Desc_String80 06 xx 03 00 00 nn 00See USB command detailsGet_Desc_HID81 06 00 21 00 00 09 00See USB command detailsGet_Desc_HID_Report81 06 00 22 00 00 nn 00See USB command detailsGet_HID_Input A1 01 00 01 00 00 nn 00Return depends on motion & configGet_Idle A1 02 00 00 00 00 01 00Returns rate in multiples of 4msGet_Vendor_Test C0 01 00 00 xx 00 01 00Read register xxSet_Address00 05 xx 00 00 00 00 00xx = addressSet_Configuration00 09 xx 00 00 00 00 00Not configured: xx=00Configured: xx=01Set_Interface01 0B 00 00 00 00 00 00Only one interface supportedSet_Protocol21 0B xx 00 00 00 00 00Boot: xx=00, Report: xx=01Set_Feature_Device00 03 01 00 00 00 00 00Enable remote wakeupSet_Feature_Endpt002 03 00 00 xx 00 00 00Halt. OUT: xx=00, IN: xx=80Set_Feature_Endpt102 03 00 00 81 00 00 00HaltClear_Feature_Device00 01 01 00 00 00 00 00Disable Remote wakeupClear_Feature_Endpt002 01 00 00 xx 00 00 00Clear Halt; OUT: xx=00, IN: xx=80Clear_Feature_Endpt102 01 00 00 81 00 00 00Clear HaltSet_Idle21 0A 00 rr 00 00 00 00rr = report rate in multiples of 4msSet_Vendor_Test40 01 00 00 xx yy 00 00Write yy to address xxPoll_Endpt1Read buttons, motion, & Z-wheelNote:The last two bytes in a command shown as “nn 00” specify the 16-bit data size in the order of “LowByte HighByte.” For example a two-byte data size would be specifed as “02 00.” ADNS-5000 will not provide more bytes than the number requested in the command, but it will only supply up to a maximum of 8 bytes at a time. The ADNS-5000 will re-send the last packet if the transfer is not acknowledged properly.USB COMMAND DETAILS___________________________________________________________________________________________USB_RESET D+/D- low for an extended periodUSB Spec: A device may reset after seeing an SE0 for more than 18.6 uS, and definitely after 10mS. Notes: After power up and prior to Reset, the device will not respond to any USB commands. After the device has been given a USB Reset, the device’s address will be reset to zero and the device will be in the Default state. The chip will default to Report protocol and any pending output will be flushed.___________________________________________________________________________________________USB_SUSPEND Idle state for an extended period USB Spec: A device may suspend after seeing an idle for more than 3mS, and definitely after 10mS. Notes: The chip will take a minimum of 5mS to start Suspend, though will definitely start after 6mS. The chip may finish the current frame if necessary before stopping the clock. Thus, an additional frame time may be used to reach Suspend mode.___________________________________________________________________________________________USB_RESUME Non-idle state USB Spec: Remote Resume signalling from a device must be between 1mS and 15mS. The host is required to send Resume signaling for 20mS plus 10mS of resume recovery time in which it does not access any devices. This allows devices enough time to wake back up. Notes: The chip can cause a Resume if Remote Wakeup is enabled and a button has been pressed.Remote resume signalling from the chip will last 11.45mS to 12.45mS.___________________________________________________________________________________________Get_Status_Device 80 00 00 00 00 00 02 00 Returns: xx yy xx[0] = Self Powered xx[1] = Remote Wakeup xx[7:2] = 0 yy = 00 (Reserved) Default: Accept (undefined in USB Spec) Addressed: Accept Configured: Accept Notes: Use Set_Feature_Device/Clear_Feature_Device to set/clear remote wakeup.___________________________________________________________________________________________Get_Status_Interface 81 00 00 00 00 00 02 00 Returns: 00 00 Default: Stall (undefined in USB Spec) Addressed: Stall Configured: Accept Notes: Both return bytes are reserved and currently 00.___________________________________________________________________________________________Get_Status_Endpt0 82 00 00 00 xx 00 02 00 82 00 00 00 00 00 02 00 82 00 00 00 80 00 02 00 xx = 00 = Endpt0 OUT xx = 80 = Endpt0 IN Returns: xx yy xx[0] = H alt xx[7:1] = 0 yy = 00 (Reserved) Default: Accept (undefined in USB Spec) Addressed: Accept Configured: Accept Notes: Use Set_Feature_Endpt0/Clear_Feature_Endpt0 to (try to) set/clear Halt bit. According to USB, “It is neither required or recommended that the Halt feature be implemented for the Default Control Pipe.” Since a new SETUP command will clear any Endpt0 halt bit, it is____________________________________________________________________________________________Get_Status_Endpt1 82 00 00 00 81 00 02 00 Returns: xx yy xx[0] = Halt xx[7:1] = 0 yy = 00 (Reserved) Default: Stall (undefined in USB Spec) Addressed: Stall Configured: Accept Notes: Use Set_Feature_Endpt1/Clear_Feature_Endpt1 to set/clear Halt bit.___________________________________________________________________________________________Get_Configuration 80 08 00 00 00 00 01 00 Returns: xx xx = config valueDefault: Accept (undefined in USB Spec) — returns 00Addressed: Accept — returns 00 Configured: Accept — returns 01 Notes: Use Set_Configuration to change.___________________________________________________________________________________________Get_Interface 81 0A 00 00 00 00 01 00 Returns: 00 Default: Undefined in USB Spec Addressed: Stall Configured: Accept — returns 00 Notes: Command has no alternate interfaces, so only valid value is 00___________________________________________________________________________________________Get_Protocol A1 03 00 00 00 00 01 00 Returns: xx xx = 00 = Boot protocol xx = 01 = Report protocolDefault: AcceptAddressed: Accept Configured: Accept Notes: Defaults to Report protocol after USB Reset. Use Set_Protocol to change.___________________________________________________________________________________________Get_Desc_Device 80 06 00 01 00 00 nn0080 06 00 01 00 00 12 00 Returns: 12 01 00 02 00 00 00 08 vv vv pp pp dd dd mm PP ss 01 vv vv = vendor id pp pp = product id (vendor specified) dd dd = device id (vendor specified) (bcd rev_id byte) mm = iManufacturer PP = iProduct ss = iSerialNumber (00 - no string)Default: Accept Addressed: Accept Configured: Accept___________________________________________________________________________________________Get_Desc_Config80 06 00 02 00 00 nn 00 80 06 00 02 00 00 22 00Returns: 09 02 22 00 01 01 00 A0 32 09 04 00 00 01 03 01 02 00 09 21 10 01 00 01 22 rr 00 07 05 81 03 04 00 0A rr = HID Report descriptor lengthThese values are determined by jumper configuration see strap table.Without Z-Wheel: 09 02 22 00 01 01 00 A0 32 09 04 00 00 01 03 01 02 00 09 21 10 01 00 0122 32 00 07 05 81 03 0400 0A// Config Descriptor | 09 // bLength | 02 // bDescriptorType | 22 // wTotalLength (34 decimal) | 00 // high byte of WTotalLength | 01 // bNumInterfaces | 01 // bConfigurationValue | 00 // iConfiguration | A0 // bmAttributes (bus powered/remote wakeup) | 32 // MaxPower (in 100mA in 2mA units) // Interface Descriptor | 09 // bLength | 04 // bDescriptorType | 00 // bInterfaceNumber | 00 // bAlternateSetting | 01 // bNumEndpoints | 03 // bInterfaceClass (HID Class) | 01 // bInterfaceSubClass | 02 // bInterfaceProtocol | 00 // iInterface // H ID Descriptor | 09 // bLength | 21 // bDescriptorType | 11 // bcdHID ( HID Release ##.##; HID 1.1 compliant ) | 01 // | 00 // bCountry | 01 // bAvailable | 22 // bType | 32 // wLength (Length of HID Report below) | 00 // // Endpoint Descriptor | 07 // bLength | 05 // bDescriptorType | 81 // bEndpointAddress (IN & #=1) | 03 // bmAttributes (Interrupt) | 04 // wMaxPacketSize | 00 // | 0A // bInterval (10mS)With Z-Wheel:09 02 22 00 01 01 00 A0 32 09 04 00 00 01 03 01 02 00 09 21 10 01 00 01 22 34 00 07 05 81 03 04 00 0A// Config Descriptor | 09 // bLength | 02 // bDescriptorType | 22 // wTotalLength (34 decimal)| 00 // high byte of WTotalLength | 01 // bNumInterfaces | 01 // bConfigurationValue | 00 // iConfiguration | A0 // bmAttributes (bus powered/remote wakeup) | 32 // MaxPower (in 100mA in 2mA units) // Interface Descriptor | 09 // bLength | 04 // bDescriptorType | 00 // bInterfaceNumber | 00 // bAlternateSetting | 01 // bNumEndpoints | 03 // bInterfaceClass (HID Class) | 01 // bInterfaceSubClass | 02 // bInterfaceProtocol | 00 // iInterface // H ID Descriptor | 09 // bLength | 21 // bDescriptorType | 11 // bcdHID ( HID Release ##.##; HID 1.1 compliant ) | 01 // | 00 // bCountry | 01 // bAvailable | 22 // bType | 34 // wLength (Length of HID Report below) | 00 // // Endpoint Descriptor | 07 // bLength | 05 // bDescriptorType | 81 // bEndpointAddress (IN & #=1) | 03 // bmAttributes (Interrupt) | 04 // wMaxPacketSize | 00 // | 0A // bInterval (10mS) Default: Accept Addressed: Accept Configured: Accept Notes: This is the concatenation of 4 descriptors: Configuration Interface HIDEndpt__________________________________________________________________________________________Get_Desc_String 80 06 xx 03 00 00 nn 00 xx= 00 Language String 02 Product String Returns: ss 03 “unicode string”ss = String descriptor lengthThese values are determined by jumper configuration on page 14:For xx=00:04 03 09 04// Language IDFor xx=02: 20 00 55 00 53 00 42 00 // “ USB”20 00 4f 00 70 00 74 00 // “Opt” 69 00 63 00 61 00 6c 00 // “ical” 20 00 4d 00 6f 00 75 00 // “Mou”73 00 65 00 // “se___________________________________________________________________________________________Get_Desc_H ID 81 06 00 21 00 00 09 00Returns:09 21 10 01 00 01 22 rr 00rr = HID Report descriptor lengthThese values are determined by jumper configuration see table on page 14:Without Z-wheel:09 21 10 01 00 01 22 32 00// H ID Descriptor | 09 // bLength | 21 // bDescriptorType | 10 // bcdHID ( HID Release ##.##; HID 1.1 compliant ) | 01 // | 00 // bCountry | 01 // bAvailable | 22 // bType | 32 // wLength (Length of HID Report below) | 00 // With Z-wheel:09 21 10 01 00 01 22 34 00// HID Descriptor | 09 // bLength | 21 // bDescriptorType | 10 // bcdHID ( HID Release ##.##; HID 1.1 compliant ) | 01 // | 00 // bCountry | 01 // bAvailable | 22 // bType | 34 // wLength (Length of HID Report below) | 00 //Default: AcceptAddressed: Accept Configured: Accept___________________________________________________________________________________。

LAN SURGE PROTECTION 1 PAIR OF RJ-45 IN/OUT CONNECTORSCOAXIAL SURGE PROTECTIONSRACK EARS NOT INCLUDED, SOLD SEPARATELYSpecifications subject to change due to product upgrades and improvements.*Go to for detailed noise filtering information.Español - Para la versión en español de este documento, vaya a /products Français - Pour la version espagnole de ce document, allez à /productsDIN-00011 - REV. BNote to CATV Installers:This reminder is provided to call attention to Article 820-40 of the NEC. That article provides specific guidelines for proper grounding.It specifies that the cable ground shall be connected to the grounding system of the building and as close to the point of entry as practical.©2012 Panamax LLC, Panamax Logo is a US registered trademark of PanamaxModel MR4000 Reference GuideAC PROTECTIONProtect or Disconnect Circuitry______________________________________Yes Patented Power Management Circuit__________________________________Yes Overvoltage Shutoff__________________________________________140V ±4Undervoltage Shutoff_________________________________________95V ±3V Thermal Fusing_________________________________________________Yes Line Voltage_________________________________________120VAC, 50/60HZ Initial Clamping Level_______________________________200V Peak, 141VRMS Voltage Protection Rating (UL 1449 3rd Edition, 3,000A)__________________400V Protection Modes________________________________________ L-N, L-G, N-G Maximum Current Rating____________________________________15A (1800W)EMI/RFI Noise Filtration________________________Panamax Level 2 Noise Filtration*Response Time________________________________________________< 1ns Single Pulse Energy Dissipation________________________________1350 Joules Peak Impulse Current_________________________________________52,000 A LAN PROTECTIONClamping Level__________________________________________________50V Compatibility_______________________________________________10/100bT Wires Protected_______________________________________________8-Wires Connectors__________________________________________________RJ-45UNIVERSAL COAX PROTECTIONHD 1080 i/p Ready_______________________________________________Yes Bidirectional_____________________________________________Yes Shielded_________________________________________________Yes Clamping Level_________________________________________________75V Frequency Range________________________________________OMHz - 2.2 GHz Insertion Loss______________________________________________<0.5 dB Connections_____________________________________Female “F”, Gold PlatedFOR ALL OUTLETS Right Angle(Blue lights can be illuminated when power is off)SAFE POWER AND UNSAFE VOLTAGE INDICATOR normally OFF; when lit, indicates that incoming voltage is unsfe However, if it is LIT call a licensed electrician for proper and safe wiring for your wall outlet.FRONT PANELCONVENIENCE OUTLETKey FeaturesExclusive Automatic Voltage Monitoring (AVM) Panamax’s patent pending power monitoring circuitry constantly monitors the AC line voltage for unsafe voltage conditions such as momentary spikes, prolonged over-voltages and undervoltag-es (brownouts). These unsafe conditions pose a very dangerous threat to all electronic equipment within the home. If the MR4000 senses an unsafe power condition, it will automatically disconnect power from your equipment from the to protect equipment from damage. The front panel indica-tor will also alert users to the power condition. Once the voltage returns to a safe level, the MR4000 will automatically reconnect the power to the outlets.Protect or Disconnect™ TechnologiesIn the event of a catastrophic surge such as light-ning, it completely disconnects AC power to con-nected equipment.Front Panel OutletMR4000 features a protected and noise filtered convenience outlet located on the front panel. Perfect for temporary gaming systems, por-table electronics (such as music players or smart phones), or other personal electronics.Front Panel LightsBlue decorative lights add an attractive look at feel to your equipment rack or TV cabinet.Antenna, Cable, Sat and LAN Signal protection Coaxial protection circuits prevent damaging surges from entering through signal paths and have the smallest signal loss on the market - less than 0.5 db of attenuation from 0Hz to 2.2GHz. Our coaxial protection has been specifically designed to virtually eliminate signal loss. The clamping level of 75V will meet and exceed the demands of both cable and satellite voltages while minimizing exposure to damaging spikes and surges. LAN protection allows for 10/100 base-T Ethernet equipment to integrate into an audio/video system without the risk of upstream surge damage from a gateway, switch, router or other network device.Eight Protected and Filtered Power Outlets (see specifications)Eight Foot Power Cable with Low Profile Plug This 45° angle low profile plug allows yourequipment to be as close as it can get to the wall outlet while not blocking an adjacent outlets. The 8’ power cord means your installation loca-tion isn’t restricted by wall outlet location. Don’t let your electronics control your lifestyle.TO GET STARTED1. Turn OFF the power to all equipment that will be plugged into the MR4000.2. Plug the MR4000 into the wall outlet then turn it ON.3. Verify that the LINE FAULT INDICATOR LED is NOT lit, indicating that the wall outlet is properly wired and grounded. (If it is LIT call a licensed electrician to inspect and implement proper and safe wiring).4. Plug the equipment to be proteced into the MR4000 AC outlets and leave everything off until after the TELEPHONE and COAX Lines are connected and then proceed to turn on your connected equipment.IMPORTANT SAFETY POINTSPanamax surge protectors and the connected equipment must be indoors, in a dry location and in the same building. Although your Panamax protector is very durable, its internal components are not isolated from theenvironment. Do not install any Panamax product near heat emitting appliances such as a radiator or heat register. Do not install this product where excessive moisture is present; for example near a bath tub, sink, pool basement floor, fish tank, etc. It is not uncommon for a building to be improperly grounded. In order to protect your equipment, Panamax products must be plugged into a properly wired and grounded 3-wire outlet. Additionally, building wiring and grounding must conform to applicable NEC (USA) or CEC (Canada) codes for the Panamax protection policy to be valid. Do not use 2-blade adapters or any other “power strips” with this product. Use only Panamax extension cord, or a UL / CSA recognized power cord.CAUTION!All Panamax Warranties and Connected Equipment Policies are valid only in the United States and Canada.CAUTION!Audio/Video, computer and/or telephone system installations can be very complex systems, consisting of many interconnected components.Due to the nature of electricity and surges, a single protector may not be able to completely protect complex installations. In those cases, a systematic approach using multiple protectors must be employed. Systematic protection requires professional design. AC power, satellite cables, CATV cables, telephone/network lines, signal lines or any other electrical conductors, entering the system that do not pass through this surge protector may invalidate the Panamax Connected Equipment Protection Policy. For additional information on how to protect your system, please contact Panamax before connecting your equipment to the surge protector.CAUTION!WARRANTY LIMITATION FOR INTERNET PURCHASERSPanamax products purchased through the Internet do not carry a valid Product Warranty or Connected Equipment Protection Policy unless purchased from an Authorized Panamax Internet Dealer and the original factory serial numbers are intact (they must not have been removed, defaced or replaced in any way). Purchasing from an Authorized Panamax Internet Dealer insures that the product was intended for consumer use, has passed all quality inspections and is safe. Buying through auction sites or unauthorized dealers may result in the purchase of salvaged, failed and/or products not intended for use in the US. In addition, Authorized Panamax Internet dealers have demonstrated sufficient expertise to insure warranty compliant installations. For a list of Authorized Panamax Internet Dealers go to . If you have any questions regarding these requirements, please contact Panamax Customer Relations.Product Upgrade Program If your Panamax power conditioner sacrifices it-self while protecting your connected equipment, you have an option to upgrade to the latest tech-nology. Please go to our web site www.panamax. com or contact Panamax Customer Relations at 800-472-5555 for details.Panamax PowerConditioner LimitedProduct WarrantyPanamax warrants to the purchaser of this Pan-amax audio/video component style power con-ditioner, for a period of three (3) years from the date of purchase, that the unit shall be free of defects in design, material or workmanship, and Panamax will repair or replace any defective unit. For product replacement see “NOTIFICATION” section (3).Panamax Power Conditioner Limited Connected Equipment Protection PolicyI t is the policy of Panamax that it will, at its elec-tion, either replace, pay to replace at fair market value, or pay to repair, up to the dollar amount specified below, equipment that is damaged by an AC power, cable, telephone, or lightning surge while connected to a properly installed Panamax power conditioner. To be eligible for compensa-tion, repair and or replacement, the power con-ditioner must shows signs of surge damage or that it is operating outside of design specifica-tions, relative to its surge protection capability, and under all of the circumstances failed to pro-tect your connected equipment.MR4000: $5,000,000THE CONNECTED EQUIPMENT POLICY IS SUBJECT TO THE FOLLOWING CONDITIONSAND LIMITATIONS1. ORIGINAL OWNERSHIP REQUIREMENT: Panamax’s connected equipment policy extends to the original purchaser of the Panamax product only and is non-transferable. Original purchase receipts must accompany any product return or claim for connected equipment damage.2. PROPER INSTALLATION: Panamax AC protec-tors must be directly plugged into a properlygrounded 3-wire AC outlet. Extension cords*,non-grounded two prong adapters, or othernon-Panamax surge products must not be used.Building wiring and other connections to protect-ed equipment must conform to applicable codes(NEC or CEC). No other ground wires or groundconnections may be used. All wires (including,e.g., AC power lines, telephone lines, signal/datalines, coaxial cable, antenna lead-ins) leadinginto the protected equipment must first passthrough a single Panamax protector designed forthe particular application. The protector and theequipment to be protected must be indoors in adry location, and in the same building. Panamaxinstallation instructions and diagrams must befollowed3. NOTIFICATION:You must notify Panamaxwithin ten days of any event precipitating requestfor product replacement or payment for con-nected equipment damage. A return authoriza-tion (RA) number must first be obtained fromthe Panamax Customer Relations Departmentat ** before returning theprotector Panamax. At this time, you must no-tify Panamax if you believe you have a claim fordamaged connected equipment. Once you obtainan RA number, please mark the number on thebottom of the unit and pack it in a shipping car-ton/box with enough packing material to protectit during transit. The RA number must also beclearly marked on the outside of the carton. Shipthe unit Panamax. Please note that you are re-sponsible for any and all charges related to ship-ping the unit to Panamax. If connected equip-ment damage was indicated on your RA request,Panamax will mail you claim kit to be completedand returned within 30 days. A connection dia-gram of your system will be required as part ofthe claim kit. Be sure to note its configurationbefore disconnecting your equipment.4. DETERMINATION OF FAILURE:Panamax willevaluate the protector for surge damage. ThePanamax protector must show signs of surgedamage or must be performing outside (>10%)of design specifications relative to its surgeprotection capability. Opening the enclosure,tampering with, or modifying the unit in any wayshall be grounds for an automatic denial yourrequest for payment. Panamax, after evaluatingall information provided, will determine whetheror not your request is eligible for payment. If thesurge protector shows no signs of AC power orsignal line surge damage and is working withindesign specifications, Panamax will return theunit to you with a letter explaining the test resultsExceptions: If a dealer or installer replacesfor a Canadian customer, the protector willfor any and all charges related to shippingPanamax until the claim is finalized.5. REQUEST PAYMENTS:lence of replacement equipment.6. OTHER INSURANCE/WARRANTIES:7. EXCLUSIONS: THE PANAMAXPLY TO:8. DISPUTE RESOLUTION: Any controversyclaim arising out of or relating toConnected Equipment Protection Policy, orAssociation under its CommercialRules. You may file for arbitration at anyparty special, exemplary, consequential,。

Eaton 120654Eaton Moeller series xPole - mRB4/6 RCBO - residual-current circuit breaker with overcurrent protection. RCD/MCB, 16A, 100mA, B-LS-Char, 3N pole, FI-Char: AGeneral specificationsEaton Moeller series xPole - mRB4/6 RCBO - residual-current circuit breaker with overcurrent protection120654401508118484280 mm 75.5 mm 70 mm 0.446 kg CE Marked RoHS conformCE mRB6-16/3N/B/01-AProduct NameCatalog Number EANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications Model CodeSwitchgear for residential and commercial applicationsmRB6Combined RCD/MCB devicesSwitchgear for industrial and advanced commercial applications Three-pole + N44BB16 A6 - 25 Ampere0.1 AType A, pulse-current sensitiveRCBO AC400 V230 V / 400 V400 V500 V4 kV30, 100, 300 MilliAmpere Partly surge-proof, 250 A 50 HzA6 kA6 kA6 kA0.5 x I∆n6 kA6 kA6 kAApplicationProduct rangeBasic functionProduct applicationNumber of polesNumber of poles (protected) Number of poles (total) Tripping characteristic Release characteristicRated currentRated current of product range Fault current rating Sensitivity typeType Voltage typeVoltage ratingVoltage rating at ACRated operational voltage (Ue) - maxRated insulation voltage (Ui)Rated impulse withstand voltage (Uimp)Rated fault currents of product rangeImpulse withstand currentFrequency ratingLeakage current typeRated switching capacityRated switching capacity (IEC/EN 60947-2)Rated switching capacity (IEC/EN 61009)Rated non-tripping currentRated short-circuit breaking capacity (EN 60947-2) Rated short-circuit breaking capacity (EN 61009) Rated short-circuit breaking capacity (EN 61009-1) Rated short-circuit breaking capacity (IEC 60947-2)0 kA 0.25 kAUndelayed Non-delayed 100 Ampere gL 3III245 mm480 mm70 mmTri-stable slide catch - enables removal from existing busbar combinationIP20IP40Twin-purpose1 - 25 Square MillimeterBusbar tag shroud to VBG41 mm²25 mm²1 mm²25 mm²2 mmIEC 68-2: 25 °C - 55 °C at 90 % - 95 % humiditySurge current capacityDisconnection characteristic TrippingBack-up fuseSelectivity class Overvoltage category Pollution degree FrameWidth in number of modular spacingsDevice heightBuilt-in depthMounting styleDegree of protectionDegree of protection (built in)Terminals (top and bottom)Solid terminal capacitiesTerminal protectionConnectable conductor cross section (solid-core) - min Connectable conductor cross section (solid-core) - max Connectable conductor cross section (multi-wired) - min Connectable conductor cross section (multi-wired) - max Material thicknessClimatic proofing16 A0 W 11.6 W 0 W0 W-25 °C 40 °C Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Rated operational current for specified heat dissipation (In) Heat dissipation per pole, current-dependentEquipment heat dissipation, current-dependentStatic heat dissipation, non-current-dependentHeat dissipation capacityAmbient operating temperature - minAmbient operating temperature - max 10.2.2 Corrosion resistance10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies10.4 Clearances and creepage distances10.5 Protection against electric shock10.6 Incorporation of switching devices and components10.7 Internal electrical circuits and connections10.8 Connections for external conductors10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Is the panel builder's responsibility.The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.3Concurrently switching N-neutralIEC/EN 61009eaton-xpole-mrb4-rcbo-catalog-ca019058en-en-us.pdfeaton-xpole-mrb6-rcbo-catalog-ca019057en-en-us.pdfDA-DC-03_mRB-3N03_mRB-3p_20041603_mRB-3N_281118eaton-mcb-xpole-mrb4-6-characteristic-curve.epseaton-xeffect-frbm6/m-characteristic-curve-002.jpgDimensions xPole mRB4/mRB6 3Neaton-xeffect-frbm6/m-dimensions-004.jpgeaton-mcb-xpole-mrb4-6-dimensions.eps3D Drawing xPole mRB4/mRB6 3Neaton-xpole-combined-mcb-rcd-device-rcbo-packaging-manual-multilingual.pdfIL019140ZUDA-CS-faz_3pn_4pDA-CD-faz_3pn_4pCharacteristics xPole mRB4/mRB6 3Neaton-mcb-xpole-mrb4-6-wiring-diagram.epsContact Sequence xPole mRB4/mRB6 3N10.9.3 Impulse withstand voltage10.9.4 Testing of enclosures made of insulating material 10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility10.13 Mechanical function Current limiting class FeaturesStandards Catalogues Certification reports Characteristic curve DrawingsInstallation instructions mCAD modelTime/current curves Wiring diagramsEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All rights reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaeaton-xeffect-frbm6/m-wiring-diagram-002.jpg。

HUAWEI AR550 Series IoTGateway DatasheetJan, 2017Copyright © Huawei Technologies Co., Ltd. 2018. All rights reserved.Trademark NoticeGeneral Disclaimer, HUAWEI, and are trademarks or registered trademarks of Huawei Technologies Co., Ltd.Other trademarks, product, service and company names mentioned are the property of their respective owners.The information in this document may contain predictive statementsincluding, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictivestatements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.HUAWEI TECHNOLOGIES CO.,LTD.Huawei Industrial BaseBantian LonggangShenzhen 518129,P.R.ChinaTel: +86 755 28780808Product OverviewAR550 series industrial IoT gateway are specially designed for network communication in challenging environments such as extreme temperature, high humidity, and electromagnetic interference. The AR550 series integrates routing, switching, IPSec VPN, and other functions, provides powerful application scalability, and widely applies to various industrial automation fields, such as electric power automation and transportation automation.The AR550 series is available in four models: AR550C-4GE, AR550C-2C6GE, AR550-8FE-D-H and AR550-24FE-D-H.AR550-24FE-D-HAR550-8FE-D-HKey Features and ValuesIndustrial Design, Premium Quality• Adopts a fan-free design and works in a wide temperature range of –40o C to +70o C.• Works properly in environments with strong electromagnetic interference and complies with IEEE1613 standards.• Complies with environment standards of substations: IEC61850-3/IEEE1613.• Supports a Mean Time Between Failures (MTBF) of more than 50 years. • Supports dual-input DC power supply, DO (Digit Output) alarm relays.Flexible Networking, Secure and Reliable Services• Provides 28 interfaces to connect a variety of terminals.• Provides RS485 to connect multiple serial terminals• Supports various networking modes, such as closed ring, open ring, multi-ring, and dual-ring.• Supports Smart Ethernet Protection (SEP), which can implement fast protection switching.• Uses multiple technologies to guarantee data security, such as IPSec VPN data encryption, 802.1x, and port locking.Easy Deployment, Convenient O&M• Web-based visualized configuration and user-friendly UI• Remote topology management and batch configuration or upgrade • USB-based deployment and plug-and-play• One-click configuration backup and simplified device replacement • High-Density industrial Power over Ethernet(POE) simplify field wiring• Fixed interfaces: 4 x GE combo, 8 x FE RJ45, 1 x USB2.0, and 1 x digital output (DO)• Working temperature: –40o C to +70o C• Dimensions (W x D x H): 97 mm x 133 mm x 150 mm • Redundant power supplies: 9.6 V to 60 V DC• Fixed interfaces: 2 x 2.5G SFP(compatible with GE), 2 x GE combo, 6 x GE RJ45, 1 x RS485, 1 x USB2.0, 1 x DI, 1 x DO • Working temperature: –40o C to +70o C• Dimensions (W x D x H): 44 mm x 133 mm x 150 mm • Redundant power supplies: 9.6V to 60V DC• Fixed interfaces: 2 x 2.5G SFP(compatible with GE), 4 x GE RJ45, 1 x USB2.0, 1 x DI, 1 x DO • Working temperature: –40o C to +70o C• Dimensions (W x D x H): 44 mm x 133 mm x 150 mm • Redundant power supplies: 9.6V to 60V DC• Fixed interfaces: 4 x GE combo, 24 x FE RJ45, 1 x USB2.0, and 1 x DO • Working temperature: –40o C to +70o C• Dimensions (W x D x H): 133 mm x 133 mm x 150 mm • Redundant power supplies: 9.6 V to 60 V DCAR550C-2C6GEAR550C-4GEA R 550 S e r i e s I n d u s t r i a l I o T G a t e w a yA R 550 S e r i e s I n d u s t r i a l I o T G a t e w a y34Typical ApplicationElectric PowerThe AR550 supports the SEP protocol to ensure highly reliable network communication by implementing fast protection switching. With 28 Ethernet interfaces, the AR550 provides access to a large number of densely deployed electric terminals. It complies with IEEE1613 and IEC61850-3 substation environment standards and can be used in power distribution automation and automatic substation access scenarios, boosting digital and smart development of the electric power industry.TransportationTraffic control and surveillance centerAR550AR550SEPIn addition to offering reliable, instant, and secure communication, the AR550 meets anti-vibration requirements defined by EN50155 standards of the transportation industry. The AR550 therefore can be used to construct the smart transportation system for traffic and vehicle control, such as express way monitoring, vehicle-mounted Passenger Information System (PIS), and vehicle-ground communication. After the AR550 is installed, services can be deployed using the USB drive, which is suitable for scenarios where there are many sparsely distributed stations.Master stationMSTP/IPSubstationPower stationPower stationAR550AR550RTURTURTURTUSubstationSubstationVideo BackhaulIP cameraIP camera EthernetAnalog camera DVRVideo surveillance centerAR550Video surveillance is popular in various industries. Different access conditions pose higher requirements on the installationspace and mode, operating temperature and humidity of video backhaul devices. The AR550 uses a compact design and has a small size. It can be installed on guide rails and supports a wide operating temperature, meeting outdoor video backhauling requirements in harsh environments.Ethernet Access in Other Industries or Harsh EnvironmentsThe industrial Ethernet is one major component of the industrial control field. Huawei AR550 adopts an industrial design and integrates abundant features, such as routing and IPSec VPN. It can be widely used for industrial Ethernet access in harsh environments, such as high temperature, low temperature, and strong electromagnetic interference. Additional, it provides end-to-end security guarantee for production data transmission.Product SpecificationsThe following table describes major specifications of the AR550.This content is applicable only to regions outside mainland China. Huawei reserves the right to interpret this content.Specification Power AdapterPower parametersPower input (high-voltage AC/DC)• 88 V to 300 V DC (terminal block)• 90 V to 264 V AC (terminal block)Power output:• 12 V DC (terminal block)Weight0.9 kgDimensions (W x D x H)40 x133 x 150 mmStorage temperature–40o C to +85o CInstallation mode Installation on a DIN railOperating temperature–40o C to +70o COperating humidity5% to 95% (non-condensing)Specification PoE Power AdapterPower parametersOne Power input• 77 V to 300 V DC (terminal block)• 90 V to 290 V AC (terminal block)Four Power outputs:• 56 V DC (terminal block)Weight 1.47KgDimensions (W x D x H)65 x133 x 150 mmStorage temperature–40o C to +85o CInstallation mode Installation on a DIN railOperating temperature–40o C to +70o COperating humidity5% to 95% (non-condensing) Power Supply ModulesAC power adapter240W PoE Power SupplyThe PAC-60WB is used as AC power adapter for AR550.The PAC240S53-CN is used as AC PoE power adapter for AR550C-2C6GE.IEC61000-4-8 (Power Frequency Magnetic Field Immunity) :30A/m (Long time) , 300A/m( short time)IEC61000-4-11 (AC DIP)IEC61000-4-10 (Damped Oscillatory Magnetic Field Immunity) :30A/mIEC61000-4-18 (Damped Oscillatory Wave) :2.5kV(CM)/1kV(DM)IEC6100-4-16 (Immunity to conducted, common mode) Safety UL60950-1, IEC60950-1, CEShock and Vibration test IEC60870-2-2 Cm IEC61373 Class BCertification/Standards compliance CEUSA FCC(47CFR Part 15) China CCC, GB 9254 CB ( IEC 60950) NRTL (UL60950-1)SNMP Support No ConfigurationBefore selecting the AR550, determine the device model, software configuration, and accessories.Device modelSelect the device model according to the interface type and service requirements.SoftwareAR550 software is classified into basic software and the advanced routing value-added service package. The basic software contains basic features, including Layer 2 switching, device management, and static routes. The value-added service package contains Layer 3 dynamic routing, VPN, and other advanced features.AccessoriesConfigure the types and quantity of the industrial 60 W power adapters, optical modules, and cables according to site environments.For more information, visit /en or contact your local Huawei sales office.Ordering InformationOrdering InformationDevice modelAR550C-4GE (2 x 2.5G SFP(Compatible with GE), 4 x GE, 1 x USB2.0, 1 x DI and 1 x DO)AR550C-2C6GE (2 x 2.5G SFP(Compatible with GE), 2 x GE combo(POE+), 2 x GE RJ45(POE++), 4 x GE(POE+), 1 x USB2.0, 1 x RS485, 1 x DI and 1 x DO)AR550-8FE-D-H (8 x 100M RJ45, 4 x GE combo, 1 x DO, DC power supply)AR550-24FE-D-H (24 x 100M RJ45, 4 x GE combo, 1 x DO, DC power supply)Accessories-power supply, cables and CabinetIndustrial 60 W power supply, 12 V AC/DC to DC, DIN rail, 88 V to 300 V DC, and 90 V to 264 V AC Industrial 240 W PoE power supply, 56 V AC/DC to DC, DIN rail, 77 V to 300 V DC, and 90 V to 290 V ACPOE midspan, 8 x GE MIDSPAN PORT,8 x GE input ,1 x FE mgmt ,1 x CONSOLE,1 x AC 100-240V INPUT,1 x DC12V 2.1A OUTPUTPower Distribution Cabinet,F01A109,220V,1PH,50Hz,2AAccessories-storage deviceUSB flash drive (USB Flash Disk,72mmX21.9mmX13mm,16GB,USB2.0,Alcor Micro MCU)Accessories-industrial optical moduleeSFP optical module (FE, single-mode, 1310 nm, 15 km, LC)eSFP optical module (GE, single-mode, 1310 nm, 10 km, LC)eSFP optical module (GE, single-mode, 1310 nm, 40 km, LC)eSFP optical module (GE, multimode, 850 nm, 0.55 km, LC)A R 550 S e r i e s I n d u s t r i a l I o T G a t e w a y9。

Ra-01S规格书版本V1.1版权©2020免责申明和版权公告本文中的信息，包括供参考的URL地址，如有变更，恕不另行通知。

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本文档在此未以禁止反言或其他方式授予任何知识产权使用许可，不管是明示许可还是暗示许可。

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文件制定/修订/废止履历表版本日期制定/修订内容制定核准V1.02020.8.12首版徐V1.12020.8.19更新部分参数徐目录一、产品概述 (5)二、电气参数 (6)三、外观尺寸 (8)四、管脚定义 (10)五、原理图 (11)六、设计指导 (12)七、回流焊曲线图 (14)八、包装信息 (15)九、联系我们 (15)一、产品概述安信可LoRa系列模块（Ra-01S）由安信可科技设计开发。

该模组用于超长距离扩频通信，其射频芯片SX1268主要采用LoRa™远程调制解调器，用于超长距离扩频通信，抗干扰性强，能够最大限度降低电流消耗。

借助SEMTECH的LoRa™专利调制技术，SX1268具有超过-148dBm的高灵敏度，+22dBm的功率输出，传输距离远，可靠性高。

同时，相对传统调制技术，LoRa™调制技术在抗阻塞和选择方面也具有明显优势，解决了传统设计方案无法同时兼顾距离、抗干扰和功耗的问题。

MRF101BN MRF101ANMRF101AN MRF101BN1RF Power LDMOS TransistorsHigh Ruggedness N--ChannelEnhancement--Mode Lateral MOSFETsThese devices are designed for use in VHF/UHF communications,VHF TV broadcast and aerospaceapplications as well as industrial,scientific and medical applications.The devices are exceptionally rugged and exhibit high performance up to 250MHz.Typical Performance:V DD =50VdcFrequency (MHz)Signal TypeP out (W)G ps (dB)ηD (%)13.56CW 130CW 27.179.627CW 130CW 24.081.540.68(1)CW 120CW 23.881.550CW 115CW 23.079.581.36CW 130CW 23.280.887.5–108CW 110CW 21.377.1136–174(2,3)CW104CW 21.276.5230(4)Pulse(100μsec,20%Duty Cycle)115Peak21.176.7Load Mismatch/RuggednessFrequency (MHz)Signal TypeVSWR P in (W)Test Voltage Result 40.68CW>65:1at all Phase Angles 0.64Peak (3dB Overdrive)50No Device Degradation 230Pulse(100μsec,20%Duty Cycle)>65:1at all Phase Angles1.8Peak (3dB Overdrive)50No Device Degradation1.Measured in 40.68MHz reference circuit (page 5).2.Measured in 136–174MHz VHF broadband reference circuit (page3.The values shown are the center band performance numbers across the indicated frequency range.4.Measured in 230MHz fixture (page 13).Features ∙Mirror pinout versions (A and B)to simplify use in a push--pull,two--up configuration∙Characterized from 30to 50V ∙Suitable for linear application∙Integrated ESD protection with greater negative gate--source voltage range for improved Class C operation∙Included in NXP product longevity program with assured supply for a minimum of 15years after launchTypical Applications∙Industrial,scientific,medical (ISM)–Laser generation –Plasma etching –Particle accelerators–MRI and other medical applications–Industrial heating,welding and drying systems∙Radio and VHF TV broadcast ∙HF and VHF communications ∙Switch mode power supplies Document Number:MRF101ANRev.0,11/2018Technical Data1.8–250MHz,100W CW,50VWIDEBANDRF POWER LDMOS TRANSISTORSMRF101AN MRF101BNTO--220--3LMRF101BNTO--220--3LMRF101ANGSDDS GNote:Exposed backside of the packageand tab also serves as a source terminal for the transistor.BacksideSS2RF Device Data NXP SemiconductorsMRF101AN MRF101BN Table 1.Maximum RatingsRatingSymbol Value Unit Drain--Source Voltage V DSS –0.5,+133Vdc Gate--Source Voltage V GS –6.0,+10Vdc Operating VoltageV DD 50Vdc Storage Temperature Range T stg –65to +150︒C Case Operating Temperature Range T C –40to +150︒C Operating Junction Temperature Range (1,2)T J –40to +175︒C Total Device Dissipation @T C =25︒C Derate above 25︒CP D1820.91W W/︒CTable 2.Thermal CharacteristicsCharacteristicSymbol Value (2,3)Unit Thermal Resistance,Junction to CaseCW:Case Temperature 77︒C,150W CW,50Vdc,I DQ =100mA,40.68MHz R θJC 1.1︒C/W Thermal Impedance,Junction to CasePulse:Case Temperature 73︒C,113W Peak,100μsec Pulse Width,20%Duty Cycle,50Vdc,I DQ =100mA,230MHzZ θJC0.37︒C/WTable 3.ESD Protection CharacteristicsTest MethodologyClass Human Body Model (per JS--001--2017)1B,passes 1000V Charge Device Model (per JS--002--2014)C3,passes 1200VTable 4.Electrical Characteristics (T A =25︒C unless otherwise noted)CharacteristicSymbolMinTypMaxUnitOff CharacteristicsGate--Source Leakage Current (V GS =5Vdc,V DS =0Vdc)I GSS ——1μAdc Drain--Source Breakdown Voltage (V GS =0Vdc,I D =50mAdc)V (BR)DSS 133——Vdc Zero Gate Voltage Drain Leakage Current (V DS =100Vdc,V GS =0Vdc)I DSS——10μAdcOn CharacteristicsGate Threshold Voltage(V DS =10Vdc,I D =290μAdc)V GS(th) 1.7 2.2 2.7Vdc Gate Quiescent Voltage(V DS =50Vdc,I D =100mAdc)V GS(Q)— 2.5—Vdc Drain--Source On--Voltage (V GS =10Vdc,I D =1Adc)V DS(on)—0.45—Vdc Forward Transconductance (V DS =10Vdc,I D =8.8Adc)g fs—7.1—S1.Continuous use at maximum temperature will affect MTTF.2.MTTF calculator available at /RF/calculators .3.Refer to AN1955,Thermal Measurement Methodology of RF Power Amplifiers.Go to /RF and search for AN1955.(continued)MRF101AN MRF101BN3RF Device DataNXP SemiconductorsTable 4.Electrical Characteristics (T A =25︒C unless otherwise noted)(continued)CharacteristicSymbolMinTypMaxUnitDynamic CharacteristicsReverse Transfer Capacitance(V DS =50Vdc ±30mV(rms)ac @1MHz,V GS =0Vdc)C rss —0.96—pF Output Capacitance(V DS =50Vdc ±30mV(rms)ac @1MHz,V GS =0Vdc)C oss —43.4—pF Input Capacitance(V DS =50Vdc,V GS =0Vdc ±30mV(rms)ac @1MHz)C iss—149—pFTypical Performance —230MHz (In NXP 230MHz Fixture,50ohm system)V DD =50Vdc,I DQ =100mA,P in =0.9W,f =230MHz,100μsec Pulse Width,20%Duty Cycle Common--Source Amplifier Output Power P out —115—W Power Gain G ps —21.1—dB Drain EfficiencyηD—76.7—%Table 5.Load Mismatch/Ruggedness (In NXP 230MHz Fixture,50ohm system)I DQ =100mAFrequency (MHz)Signal TypeVSWR P in (W)Test Voltage,V DDResult230Pulse(100μsec,20%Duty Cycle)>65:1at all Phase Angles1.8Peak (3dB Overdrive)50No Device DegradationTable 6.Ordering InformationDeviceShipping InformationPackageMRF101AN MPQ =250devices (50devices per tube,5tubes per box)TO--220--3L (Pin 1:Gate,Pin 2:Source,Pin 3:Drain)MRF101BNTO--220--3L (Pin 1:Drain,Pin 2:Source,Pin 3:Gate)4RF Device Data NXP SemiconductorsMRF101AN MRF101BNTYPICAL CHARACTERISTICS1100V DS,DRAIN--SOURCE VOLTAGE(VOLTS)Figure1.Capacitance versus Drain--Source Voltage C,CAPACITANCE(pF)1010000.1MRF101AN MRF101BN5RF Device DataNXP Semiconductors40.68MHz COMPACT REFERENCE CIRCUIT (MRF101AN)—0.7"⨯2.0"(1.8cm ⨯5.0cm)Table 7.40.68MHz Performance (In NXP Reference Circuit,50ohm system)V DD =50Vdc,I DQ =100mA,P in =0.50W,CWFrequency (MHz)P out (W)G ps (dB)ηD (%)40.6812023.881.56RF Device Data NXP SemiconductorsMRF101AN MRF101BN 40.68MHz COMPACT REFERENCE CIRCUIT (MRF101AN)—0.7"⨯2.0"(1.8cm ⨯5.0cm)Figure 2.MRF101AN Compact Reference Circuit Component Layout and Assembly Example —40.68MHzFigure 3.MRF101AN Compact Reference CircuitBoardaaa--032274Table 8.MRF101AN Compact Reference Circuit Component Designations and Values —40.68MHzPartDescriptionPart NumberManufacturer B1Short RF Bead 2743019447Fair-Rite C1,C582pF Chip Capacitor GQM2195C2E820GB12D Murata C2,C4200pF Chip Capacitor GQM2195C2A201GB12D Murata C333pF Chip Capacitor GQM2195C2E330GB12D Murata C6,C7,C8,C9,C101000pF Chip Capacitor GRM2165C2A102JA01D Murata C111μF Chip Capacitor GJ821BR71H105KA12L Murata C12,C1310nF Chip Capacitor GRM21BR72A103KA01B Murata C141μF Chip Capacitor C3216X7R2A105K160AA TDK L1150nH Chip Inductor 0805WL151JT ATC L217.5nH,4Turn Inductor GA3095-ACL Coilcraft L3160nH Square Air Core Inductor 2222SQ-161JEC Coilcraft L4110nH Square Air Core Inductor 2222SQ-111JEB Coilcraft Q1RF Power LDMOS Transistor MRF101ANNXP R175Ω,1/4W Chip Resistor SG73P2ATTD75R0F KOA Speer PCBFR40.09",εr =4.8,2oz.CopperD113958MTLMRF101AN MRF101BN7RF Device DataNXP SemiconductorsTYPICAL CHARACTERISTICS —40.68MHz COMPACT REFERENCE CIRCUIT (MRF101AN)V GS ,GATE--SOURCE VOLTAGE (VOLTS)8060P o u t ,O U T P U T P O W E R (W A T T S )40 3.52.51.51100120014020Figure 4.CW Output Power versus Gate--SourceVoltage at a Constant Input PowerP in ,INPUT POWER (WATTS)8060P o u t ,O U T P U T P O W E R (W A T T S )40010012001402040.68101121f (MHz)P1dB (W)P3dB (W)Figure 5.CW Output Power versus Input PowerP out ,OUTPUT POWER (WATTS)Figure 6.Power Gain and Drain Efficiencyversus CW Output PowerG p s ,P O W E R G A I N (d B )ηD ,D R A I N E F F I C I E N C Y (%)25242802090705030302223262729806040201004060801001201400.5230.10.20.30.40.50.60.721201008RF Device Data NXP SemiconductorsMRF101AN MRF101BN40.68MHz COMPACT REFERENCE CIRCUIT(MRF101AN)fMHzZ sourceΩZ loadΩ40.6824.0+j12.614.2–j2.5Z source=Testcircuit impedance as measured fromgate to ground.Z load=Test circuit impedance as measuredfromdrain toground.Figure7.Series Equivalent Source and Load Impedance—40.68MHzZ source Z load50Ω50ΩMRF101AN MRF101BN9RF Device DataNXP Semiconductors136–174MHz COMPACT VHF BROADBAND REFERENCE CIRCUIT (MRF101AN)—0.7"⨯2.0"(1.8cm ⨯5.0cm)Table 9.136–174MHz VHF Broadband Performance (In NXP Reference Circuit,50ohm system)V DD =50Vdc,I DQ =100mA,P in =0.79W,CWFrequency (MHz)P out (W)G ps (dB)ηD (%)13511721.780.015510421.276.517510721.375.4136–174MHz COMPACT VHF BROADBAND REFERENCE CIRCUIT(MRF101AN)—0.7"⨯2.0"(1.8cm⨯5.0cm)Figure8.MRF101AN Compact Reference Circuit Component Layout and Assembly Example—136–174MHzFigure9.MRF101AN Compact Reference Circuit BoardTable10.MRF101AN Compact VHF Broadband Reference Circuit Component Designations and Values—136–174MHz Part Description Part Number ManufacturerB1Short RF Bead2743019447Fair-RiteC139pF Chip Capacitor GQM2195C2E390GB12D MurataC2,C5,C6,C7,C8,C12510pF Chip Capacitor GRM2165C2A511JA01D MurataC368pF Chip Capacitor GQM2195C2E680GB12D MurataC427pF Chip Capacitor GQM2195C2E270GB12D MurataC910pF Chip Capacitor GQM2195C2E100FB12D MurataC111μF Chip Capacitor GJ821BR71H105KA12L MurataC1310nF Chip Capacitor GRM21BR72A103KA01B MurataC141μF Chip Capacitor C3216X7R2A105K160AA TDKL122nH Chip Inductor0805WL220JT ATCL212nH Chip Inductor0805WL120JT ATCL3,L4,L668nH Air Core Inductor1812SMS-68NJLC CoilcraftL512nH,3Turn Inductor GA3094-ALC CoilcraftQ1RF Power LDMOS Transistor MRF101AN NXPR175Ω,1/4W Chip Resistor SG73P2ATTD75R0F KOA SpeerPCB FR40.09",εr=4.8,2oz.Copper D113958MTLTYPICAL CHARACTERISTICS —136–174MHzCOMPACT VHF BROADBAND REFERENCE CIRCUIT (MRF101AN)20150f,FREQUENCY (MHz)26259085807565130120ηD ,D R A I N E F F I C I E N C Y (%)G p s ,P O W E R G A I N (d B )242322211715516016517070110P o u t ,O U T P U T P O W E R (W A T T S )14514017513519100180P in,INPUT POWER (WATTS)0P o u t ,O U T P U T P O W E R (W A T T S )806040200.40.61201000.20.8140 1.027202422807570G p s ,P O W E R G A I N (d B )20406026858025232110012014065605550ηD ,D R A I N E F F I C I E N C Y (%)Figure 10.Power Gain,Drain Efficiency and CW Output Power versus Frequency at a Constant Input PowerFigure 11.CW Output Power versus Input Power and FrequencyP out ,OUTPUT POWER (WATTS)Figure 12.Power Gain and Drain Efficiency versusCW Output Power and Frequency191817454035136–174MHz COMPACT VHF BROADBAND REFERENCE CIRCUIT(MRF101AN)f MHz Z sourceΩZ loadΩ135 6.8+j10.29.5+j5.2145 6.2+j10.29.9+j5.9155 5.3+j10.810.2+j6.2165 4.4+j11.910.0+j5.9175 3.9+j13.48.8+j5.0Z source=Test circuit impedance as measured fromgate to ground.Z load=Test circuit impedance as measured fromdrain to ground.Figure13.Series Equivalent Source and Load Impedance—136–174MHzZ source Z load50Ω50Ω230MHz FIXTURE(MRF101AN)—4.0"⨯5.0"(10.2cm⨯12.7cm)aaa--031939Figure14.MRF101AN Fixture Component Layout—230MHzTable11.MRF101AN Fixture Component Designations and Values—230MHzPart Description Part Number Manufacturer B1Long Ferrite Bead2743021447Fair-RiteC1,C2,C1018pF Chip Capacitor ATC100B180JT500XT ATCC343pF Chip Capacitor ATC100B430JT500XT ATCC4,C131000pF Chip Capacitor ATC800B102JT50XT ATCC50.1μF Chip Capacitor GRM319R72A104KA01D MurataC610nF Chip Capacitor C1210C103J5GACTU KemetC7 2.2μF Chip Capacitor C3225X7R1H225K TDKC847μF,16V Tantalum Capacitor T491D476K016AT KemetC951pF Chip Capacitor ATC100B510JT500XT ATCC1116pF Chip Capacitor ATC100B160JT500XT ATCC12470pF Chip Capacitor ATC800B471JW50XT ATCC140.1μF Chip Capacitor C1812104K1RACTU KemetC15 2.2μF Chip Capacitor C3225X7R2A225K TDKC16 2.2μF Chip Capacitor HMK432B7225KM-T Taiyo YudenC17220μF,100V Electrolytic Capacitor MCGPR100V227M16X26MulticompL139nH Chip Inductor1812SMS-39NJLC CoilcraftL246nH Chip Inductor1010VS-46NME CoilcraftL317.5nH,4Turn Inductor GA3095-ALC CoilcraftR1470Ω,1/4W Chip Resistor CRCW1206470RFKEA VishayPCB Rogers AD255C,0.030",εr=2.55,2oz.Copper D113651MTLTYPICAL CHARACTERISTICS —230MHz FIXTURE,T C =25_C (MRF101AN)0V GS ,GATE--SOURCE VOLTAGE (VOLTS)Figure 15.Output Power versus Gate--SourceVoltage at a Constant Input PowerP o u t ,O U T P U T P O W E R (W A T T S )P E A K755025 1.52 2.531251000.51P in ,INPUT POWER (dBm)PEAK 514943P o u t ,O U T P U T P O W E R (d B m )P E A K4733302127245318230110128f (MHz)P1dB (W)P3dB (W)Figure 16.Output Power versus Input PowerP out ,OUTPUT POWER(WATTS)PEAKFigure 17.Power Gain and Drain Efficiency versus Output Power and Quiescent CurrentG p s ,P O W E R G A I N (d B )ηD ,D R A I N E F F I C I E N C Y (%)3300806040203301080706050403020P out ,OUTPUT POWER (WATTS)PEAKFigure 18.Power Gain and Drain Efficiencyversus Output PowerG p s ,P O W E R G A I N (d B )ηD ,D R A I N E F F I C I E N C Y (%)0P out ,OUTPUT POWER (WATTS)PEAKFigure 19.Power Gain versus Output Powerand Drain--Source Voltage20G p s ,P O W E R G A I N (d B )16145075100182522150451001251503003002441393715230MHz FIXTURE (MRF101AN)f MHz Z sourceΩZ load Ω2302.1+j5.95.5+j3.2Z source =Test circuitimpedance as measured fromgate to ground.Z load=Test circuit impedance asmeasured from drain toground.Figure 20.Series Equivalent Source and Load Impedance —230MHzZ source Z load50Ω50ΩPACKAGE DIMENSIONSPRODUCT DOCUMENTATION,SOFTWARE AND TOOLS Refer to the following resources to aid your design process.Application Notes∙AN1955:Thermal Measurement Methodology of RF Power AmplifiersEngineering Bulletins∙EB212:Using Data Sheet Impedances for RF LDMOS DevicesSoftware∙Electromigration MTTF Calculator∙RF High Power Model∙.s2p FileDevelopment Tools∙Printed Circuit BoardsTo Download Resources Specific to a Given Part Number:1.Go to /RF2.Search by part number3.Click part number link4.Choose the desired resource from the drop down menuREVISION HISTORYThe following table summarizes revisions to this document.Revision Date Description 0Nov.2018∙Initial release of data sheetRF Device DataNXP Semiconductors How to Reach Us:Home Page: Web Support:/support Information in this document is provided solely to enable system and software implementers to use NXP products.There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document.NXP reserves the right to make changes without further notice to any products herein.NXP makes no warranty,representation,or guarantee regarding the suitability of its products for any particular purpose,nor does NXP assume any liability arising out of the application or use of any product or circuit,and specifically disclaims any and all liability,including without limitation consequential or incidental damages.“Typical”parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications,and actual performance may vary over time.All operating parameters,including “typicals,”must be validated for each customer application by customer’s technical experts.NXP does not convey any license under its patent rights nor the rights of others.NXP sells products pursuant to standard terms and conditions of sale,which can be found at the following address:/SalesTermsandConditions .NXP and the NXP logo are trademarks of NXP B.V.All other product or service names are the property of their respective owners.E 2018NXP B.V.MRF101BN MRF101AN。

information on the applications如产品需要用在有特殊质量要求及可靠性要求的地LEDs without having consentinform Refond in writinganalysis.在取得瑞丰的同意前，客户不应该对产品进行拆解分析，如发现失效产品，请直RF-W2S118TS-A41Features 特征Extremely wide viewing angle.发光角度大Suitable for all SMT assembly and solder process.适用于所有的SMT组装和焊接工艺 Moisture sensitivity level:Level3.防潮等级Level3Package:3000pcs/reel.包装每卷3000pcsRoHS compliant.满足RoHS要求Description描述The Colour LED which was fabricated using blue,green and red chip该产品为三色光LED，是由蓝光、绿光和红光晶片封装形Applications应用Optical indicator.光学指示Switch and Symbol,Display.开关和标识、显示器等General use.其他应用Package Dimension外观尺寸NOTES:1.All dimensions units are millimeters.(所有尺寸标注单位为毫米)2.All dimensions tolerances are 0.2mm unless otherwise noted.(除特别标注外，所有尺寸公差为±0.2毫米)--------Note备注Vr=5V For test conditions.Vr=5v为测试分选条件。

Absolute Maximum Ratings at Ts=25°C 绝对最大值1.2.3.4.5.6.Typical optical characteristics curves 典型光学特性曲线R e l a t i v e I n t e n s i t yR e l a t i v e I n t e n s i t yPackaging Specifications⏹Carrier Tape Dimensions载带尺寸Note:Thetolerances unless mentioned±0.1mm.Unit:mm注：未注公差为±0.1毫米，尺寸单位：毫米。

DATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorApplicationsDSSS 5 GHz WLAN (IEEE802.11a) DSSS 5 GHz WLAN (IEEE802.11n) Access Points, PCMCIA, PC cardsFeaturesHigh output power amplifier- 26dBm at 5VExternal Analog Reference Voltage (V REF ) for maximum flexibilityBuffered, temperature compensated power detector3% EVM, @26dBm, 64 QAM, 54 Mbps 32 dB GainLead Free, RoHS compliant, halogen free MSL3 package20 pin 4 mm x 4 mm x 0.9 mm QFNOrdering InformationPart Number Package Remark SE5004L 20 Pin QFN Samples SE5004L-R 20 Pin QFN Tape and Reel SE5004L-EK1Evaluation KitStandardProduct DescriptionThe SE5004L is a 5GHz power amplifier offering high linear power for wireless LAN applications. The SE5004L incorporates a power detector for closed loop monitoring and control of the output power.The SE5004L offers high integration for a simplified design, providing quicker time to market and higher application board production yield. The device integrates the input match, the inter-stage match, the output match, the power detectorwith 15dB of dynamic range and a 3.8GHz notch filter. Only 6 external decoupling capacitors are required to complete the design.For wireless LAN applications, the device meets the requirements of IEEE802.11a & 802.11n, and delivers approximately 26dBm of linear output power at 5V.The SE5004L integrates temperature compensated bias voltage generators. A 2.85V reference voltage on VREF is all that is required to enable or disable the power amplifier.Functional Block DiagramRFIN and RFOUT include DC shunt to Ground. External blocking capacitors are recommended.Figure 1: Functional Block DiagramDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorFigure 2: SE5004L Pin Out (Top View Through Package) Pin Out DescriptionPin No. Name Description1 NU Pin is not used, and is open circuit in the package2 GND Ground3 RFin Power Amplifier RF input, DC block required4 GND Ground5 V REF Reference Voltage6 SP1 Port for optional capacitor to improve dynamic EVM7 SP2 Port for optional capacitor to improve dynamic EVM8 VCC2 Second Stage Supply Voltage9 VCC3 Third Stage Supply Voltage10 DET Analog Power Detector Output11,12 GND Ground13 RF OUT Power Amplifier RF Output14-17 GND Ground18 VCC3 Third Stage Supply Voltage19 VCC2 Second Stage Supply Voltage20 VCC1 First Stage Supply VoltageDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorAbsolute Maximum RatingsThese are stress ratings only. Exposure to stresses beyond these maximum ratings for a long period of time may cause permanent damage to, or affect the reliability of the device. Avoid operating the device outside the recommended operating conditions defined below. This device is ESD sensitive. Handling and assembly of this device should be at ESD protected workstations.Symbol Definition Min. Max. UnitV CC Supply Voltage on pins VCC3 -0.3 +6V Supply Voltage on pins VCC1, VCC2 -0.3 VCC3V REF Power Amplifier Enable and Reference Voltage -0.3 3.6 V RF IN RF Input Power, RFout into 50Ω match, T CASE_MAX = 85C - 6 dBm T STG Storage Temperature Range -40 160 °C T j Maximum Junction Temperature - 160 °C ESD HBM JEDEC JESD22-A114 all pins - 500 VRecommended Operating ConditionsSymbol Parameter Min. Max. UnitV CC Supply Voltage VCC3 3.0 5.5V Supply Voltage VCC1, VCC2 3.0 VCC3T CASE_MAX Maximum Case Temperature -40 85 °C V REF Reference Voltage 2.8 2.9 VDC Electrical CharacteristicsConditions: V CC= 5.0V, V REF = 2.85 V, T A = 25 °C, as measured on Skyworks Solutions’ SE5004L-EK1 evaluation board, unless otherwise noted.Symbol Parameter Conditions Min. Typ. Max. Unit I CC-802.11a Supply Current P OUT = 26 dBm, 54 Mbps, 64 QAM - 600 800 mAI QC Quiescent Current No RF - 300 - mAI OFF Supply Current V REF = 0 V, No RF - 0.5 10 µAIEN Bias ControlCurrentV REF = V REF HInternal 2KΩ pull down resistor- 10 - mAV REF H Reference VoltageEnabled- 2.80 2.85 2.9 VV REF L Reference VoltageDisabled- 0 - 0.5 VDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorAC Electrical Characteristics802.11a AC Electrical CharacteristicsConditions: V CC = 5.0 V, V REF = 2.85 V, f = 5.4 GHz, T A = 25 °C, as measured on Skyworks Solutions’ SE5004L-EK1 evaluation board, unless otherwise notedSymbol Parameter Conditions Min. Typ. Max. Unitf L-U Frequency Range - 5.15 - 5.85 GHzP OUT Output Power 802.11a, 54Mbps, 64 QAM, 3% EVM 25.5 26 -dBm 802.11a, 54Mbps, 64 QAM, 2.5% EVM 24.5 25802.11n, MCS0, Mask Compliant - 29 -P1dB Output 1dBcompression pointNo modulation 30 34 - dBmS21Small Signal Gain P IN = -25 dBm 30 32 - dB∆S21Gain Variation Within each UNII Band - 3 - dB∆S21 3.8Gain at 3.8GHz P IN = -25 dBm - - 0 dB 2fHarmonic P OUT = 26 dBm, 5V - - -45 dBm/MHz 3ft r, t f Rise and Fall Time - - 0.15 0.3 usSTAB Stability P OUT = 26 dBm, VCC = 5V, 54 Mbps,64 QAM, VSWR = 6:1, all phasesAll non-harmonically related outputsless than -50 dBc/100 kHzRugged Tolerance toconstant inputpower into amismatch loadP IN = -10dBm, CW,VSWR = 6:1, all phasesNo damageDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorPower DetectorConditions: V CC= 5.0 V, V REF=2.85V, f = 5.4 GHz, T A = 25 °C, as measured on Skyworks Solutions’ SE5004L-EK1Figure 3: SE5004L Power Detector Characteristic over FrequencyDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power Detector Package DiagramFigure 4: SE5004L Package InformationDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power Detector Recommended Land and Solder PatternFigure 5: SE5004L Recommended Land PatternPackage Handling InformationBecause of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE5004L is capable of withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques, precautions, and handling procedures recommended, please refer to:“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044 Caution! Class 1B ESD sensitive deviceDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power DetectorBranding InformationFigure 6: SE5004L Branding InformationTape and Reel InformationParameterValue Devices Per Reel 3000 Reel Diameter 13 inches Tape Width12 millimetersFigure 7: SE5004L-R Tape and Reel InformationDATA SHEETSE5004L: 5 GHz, 26dBm Power Amplifier with Power Detector Document Change HistoryRevision Date Notes1.0 Aug 18, 2009 Created1.1 Jan 14, 2010 Updated Pinout1.2 May 4, 2010 Updated harmonic specification1.3 May 7, 2010 Update T RISE and T FALL time Added MSL rating1.4 May 20, 2010 Update Recommended Land and Solder Pattern Update detector plot.1.5 Jul 20, 2010 Extended operating temperature range to -40C to +85C Updated absolute maximum ratings for VCC1 and VCC2 Updated EN pull down resistor value1.6 Nov 20, 2010 Update Maximum Junction Temperature Updated ESD rating1.7 Feb 25, 2011 Added Mask complianceAdded Vref min/max limits to recommended operating conditions1.8 Apr 02, 2012 Updated with Skyworks logo and disclaimer statement1.9 Apr 12, 2012 Added min/max limits to Gain, P1dB, EVM, ICCCopyright © 2012 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.分销商库存信息:SKYWORKS-SOLUTIONSSE5004L-R SE5004L-EK1。

1 General DescriptionThe AS5045 is a contactless magnetic rotary encoder for accurate angular measurement over a full turn of 360°. It is a system-on-chip, combining integrated Hall elements, analog front end and digital signal processing in a single device.To measure the angle, only a simple two-pole magnet, rotating over the center of the chip, is required. The magnet may be placed above or below the IC.The absolute angle measurement provides instant indication of the magnet’s angular position with a resolution of 0.0879° = 4096 positions per revolution. This digital data is available as a serial bit stream and as a PWM signal.An internal voltage regulator allows the AS5045 to operate at either 3.3 V or 5 V supplies.2 BenefitsComplete system-on-chipFlexible system solution provides absolute andPWM outputs simultaneously Ideal for applications in harsh environments due tocontactless position sensing No calibration required3 Key FeaturesContactless high resolution rotational positionencoding over a full turn of 360 degrees Two digital 12bit absolute outputs:- Serial interface and- Pulse width modulated (PWM) output User programmable zero positionFailure detection mode for magnet placementmonitoring and loss of power supply “red-yellow-green” indicators display placement ofmagnet in Z-axis Serial read-out of multiple interconnected AS5045devices using Daisy Chain mode Tolerant to magnet misalignment and airgapvariations Wide temperature range: - 40°C to + 125°CSmall Pb-free package: SSOP 16 (5.3mm x 6.2mm)4 ApplicationsIndustrial applications:- Contactless rotary position sensing - Robotics Automotive applications:- Steering wheel position sensing - Transmission gearbox encoder - Headlight position control - Torque sensing- Valve position sensing Replacement of high end potentiometersFigure 1. Typical Arrangement of AS5045 and MagnetAS504512 Bit Programmable Magnetic Rotary Encoder Data SheetTable of Contents1General Description (1)2Benefits (1)3Key Features (1)4Applications (1)5Pinout (4)5.1Pin Configuration (4)5.2Pin Description (4)6Electrical Characteristics (5)6.1AS5045 Differences to AS5040 (5)6.2Absolute Maximum Ratings (non operating) (6)6.3Operating Conditions (6)6.4DC Characteristics for Digital Inputs and Outputs (7)6.4.1CMOS Schmitt-Trigger Inputs: CLK, CSn. (CSn = internal Pull-up) (7)6.4.2CMOS / Program Input: Prog (7)6.4.3CMOS Output Open Drain: MagINCn, MagDECn (7)6.4.4CMOS Output: PWM (7)6.4.5Tristate CMOS Output: DO (8)6.5Magnetic Input Specification (8)6.6Electrical System Specifications (9)6.7Timing Characteristics (10)6.7.1Synchronous Serial Interface (SSI) (10)6.7.2Pulse Width Modulation Output (11)6.8Programming Conditions (11)7Functional Description (12)8Mode Input Pin (13)8.1Synchronous Serial Interface (SSI) (13)8.1.1Data Content (14)8.1.2Z-axis Range Indication (Push Button Feature, Red/Yellow/Green Indicator) (14)8.2Daisy Chain Mode (15)9Pulse Width Modulation (PWM) Output (16)9.1Changing the PWM Frequency (17)10Analog Output (17)11Programming the AS5045 (18)11.1Zero Position Programming (18)11.2Repeated OTP Programming (18)11.3Non-permanent Programming (19)11.4Analog Readback Mode (20)12Alignment Mode (21)13 3.3V / 5V Operation (22)14Choosing the Proper Magnet (23)14.1Physical Placement of the Magnet (24)15Simulation Modeling (25)16Failure Diagnostics (26)16.1Magnetic Field Strength Diagnosis (26)16.2Power Supply Failure Detection (26)17Angular Output Tolerances (26)17.1Accuracy (26)17.2Transition Noise (28)17.3High Speed Operation (28)17.3.1Sampling Rate (28)17.4Propagation Delays (29)17.4.1Angular Error Caused by Propagation Delay (29)17.5Internal Timing Tolerance (29)17.6Temperature (30)17.6.1Magnetic Temperature Coefficient (30)17.7Accuracy over Temperature (30)17.7.1Timing Tolerance over Temperature (30)18Package Drawings and Markings (31)19Ordering Information (31)20Recommended PCB Footprint (32)5 Pinout5.1 Pin ConfigurationFigure 2. Pin Configuration SSOP165.2 Pin DescriptionTable 1 shows the description of each pin of the standard SSOP16 package (Shrink Small Outline Package, 16 leads, body size: 5.3mm x 6.2mmm; see Figure 2).Pins 7, 15 and 16 supply pins, pins 3, 4, 5, 6, 13 and 14 are for internal use and must not be connected.Pins 1 and 2 MagINCn and MagDECn are the magnetic field change indicators (magnetic field strength increase or decrease through variation of the distance between the magnet and the device). These outputs can be used to detect the valid magnetic field range. Furthermore those indicators can also be used for contact-less push-button functionality.Pin 6 Mode allows switching between filtered (slow) and unfiltered (fast mode). This pin must be tied to VSS or VDD5V, and must not be switched after power up. See chapter 8 Mode Input Pin.Pin 8 Prog is used to program the zero-position into the OTP (see chapter 11.1 Zero Position Programming).This pin is also used as digital input to shift serial data through the device in Daisy Chain configuration, (see chapter 8.2 Daisy Chain Mode).Pin 11 Chip Select (CSn; active low) selects a device within a network of AS5045 encoders and initiates serial data transfer. A logic high at CSn puts the data output pin (DO) to tri-state and terminates serial data transfer. This pin is also used for alignment mode (Figure 14) and programming mode (Figure 10).Pin 12 PWM allows a single wire output of the 10-bit absolute position value. The value is encoded into a pulse width modulated signal with 1µs pulse width per step (1µs to 4096µs over a full turn). By using an external low pass filter, the digital PWM signal is converted into an analog voltage, making a direct replacement of potentiometers possible.Table 1. Pin DescriptionPin Symbol Type Description1MagINCn DO_OD Magnet Field Mag nitude INC rease; active low, indicates a distance reduction between the magnet and the device surface. See Table 52MagDECn DO_OD Magnet Field Mag nitude DEC rease; active low, indicates a distance increase between the device and the magnet. See Table 53 NC - Must be left unconnected4 NC - Must be left unconnectedPin Symbol Type Description 5 NC - Must be left unconnected6Mode - Select between slow (low, VSS) and fast (high, VDD5V) mode. Internal pull-down resistor.7 VSS S Negative Supply Voltage (GND)8Prog_DI DI_PD OTP Prog ramming Input and Data Input for Daisy Chain mode. Internal pull-down resistor (~74kΩ). Connect to VSS if not used9 DO DO_TD ata O utput of Synchronous Serial Interface10 CLK DI,ST Cl oc k Input of Synchronous Serial Interface; Schmitt-Trigger input11 CSn DI_PU,STC hip S elect, active low; Schmitt-Trigger input, internal pull-up resistor (~50kΩ)12 PWM DO P ulse W idth M odulation of approx. 244Hz; 1µs/step (opt. 122Hz; 2µs/step)13 NC - Must be left unconnected14 NC - Must be left unconnected15VDD3V3 S 3V-Regulator Output, internally regulated from VDD5V. Connect to VDD5V for 3V supply voltage. Do not load externally.16 VDD5V S Positive Supply Voltage, 3.0 to 5.5 VDO_OD digital output open drain S supply pinDO digital output DI digital inputDI_PD digital input pull-down DO_T digital output /tri-stateDI_PU digital input pull-up ST Schmitt-Trigger input6 Electrical Characteristics6.1 AS5045 Differences to AS5040All parameters are according to AS5040 datasheet except for the parameters shown below: Building Block AS5045 AS5040Resolution 12bits, 0.088°/step. 10bit, 0.35°/stepData length Read: 18bits(12bits data + 6 bits status)OTP write: 18 bits(12bits zero position + 6 bits mode selection) Read: 16bits(10bits data + 6 bits status)OTP write: 16 bits(10bits zero position + 6 bits mode selection)Incremental encoder Not usedPin 3: not usedPin 4:not usedQuadrature, step/direction and BLDC motorcommutation modesPin 3:incremental output A_LSB_UPin 4:incremental output B_DIR_VPins 1 and 2 MagINCn, MagDECn: same feature asAS5040, additional OTP option for red-yellow-green magnetic range MagINCn, MagDECn indicate in-range or out-of-range magnetic field plus movement of magnet in z-axisPin 6 MODE pin, switch between fast and slowmodePin 6:Index outputPin 12 PWM output: frequency selectable by OTP:1µs / step, 4096 steps per revolution,f=244Hz 2µs/ step, 4096 steps perrevolution, f=122Hz PWM output:1µs / step, 1024 steps per revolution, 976Hz PWM frequencySampling frequency Selectable by MODE input pin:2.5kHz, 10kHzFixed at 10kHz @10bit resolutionBuilding Block AS5045AS5040 Propagation delay 384µs (slow mode) 96µs (fast mode)48µs Transition noise (rms; 1sigma) 0.03 degrees max. (slow mode) 0.06 degrees max. (fast mode)0.12 degreesOTP programming options Zero position, rotational direction, PWMdisable, 2 Magnetic Field indicator modes, 2 PWM frequenciesZero position, rotational direction, incremental modes, index bit width6.2 Absolute Maximum Ratings (non operating)Stresses beyond those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ParameterSymbol Min Max Unit Note DC supply voltage at pin VDD5V VDD5V -0.3 7 V DC supply voltage at pin VDD3V3 VDD3V35VInput pin voltageV in -0.3VDD5V+0.3 V Except VDD3V3 Input current (latchup immunity) I scr -100 100 mA Norm: JEDEC 78Electrostatic discharge ESD ± 2 kV Norm: MIL 883 E method 3015 Storage temperature T strg-55125°CMin – 67°F ; Max +257°FBody temperature (Lead-free package)T Body 260°C t=20 to 40s,Norm: IPC/JEDEC J-Std-020 Lead finish 100% Sn “matte tin” Humidity non-condensing H585%6.3 Operating ConditionsParameterSymbol Min Typ Max UnitNoteAmbient temperature T amb -40125 °C -40°F…+257°FSupply currentI supp 1621 mA Supply voltage at pin VDD5V Voltage regulator output voltage at pin VDD3V3VDD5V VDD3V3 4.53.0 5.03.3 5.5 3.6 V 5V operationSupply voltage at pin VDD5V Supply voltage at pin VDD3V3 VDD5V VDD3V33.03.03.33.33.6 3.6V3.3V operation(pin VDD5V and VDD3V3 connected)6.4 DC Characteristics for Digital Inputs and Outputs6.4.1 CMOS Schmitt-Trigger Inputs: CLK, CSn. (CSn = internal Pull-up)(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation) unless otherwise noted) ParameterSymbol Min Max Unit NoteHigh level input voltage V IH 0.7 * VDD5VV Normal operation Low level input voltage V IL0.3 * VDD5VVSchmitt Trigger hysteresis V Ion- V Ioff 1V-1 1 CLK only Input leakage current Pull-up low level input current I LEAK I iL-30 -100µA µA CSn only, VDD5V: 5.0V6.4.2 CMOS / Program Input: Prog(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation)unless otherwise noted) ParameterSymbol Min Max Unit Note High level input voltage VIH 0.7 * VDD5VVDD5VVHigh level input voltage VPROG See Programming ConditionsV During programming Low level input voltage VIL 0.3 * VDD5VVHigh level input current IiL30100µAVDD5V: 5.5V6.4.3 CMOS Output Open Drain: MagINCn, MagDECn(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation)unless otherwise noted) ParameterSymbolMinMax UnitNote Low level output voltage V OL VSS+0.4 V Output currentI O4 2mAVDD5V: 4.5V VDD5V: 3VOpen drain leakage current I OZ 1 µA6.4.4 CMOS Output: PWM(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation)unless otherwise noted) ParameterSymbolMinMax UnitNoteHigh level output voltage V OH VDD5V-0.5 V Low level output voltage V OL VSS+0.4 V Output current I O4 2mA mAVDD5V: 4.5V VDD5V: 3V6.4.5 Tristate CMOS Output: DO(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation) unless otherwise noted) ParameterSymbolMinMax UnitNoteHigh level output voltage V OH VDD5V –0.5VLow level output voltage V OL VSS+0.4 VOutput currentI O4 2mAmAVDD5V: 4.5V VDD5V: 3VTri-state leakage current I OZ 1 µA6.5 Magnetic Input Specification(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0-3.6V (3V operation) VDD5V = 4.5-5.5V (5V operation)unless otherwise noted)Two-pole cylindrical diametrically magnetised source: ParameterSymbolMinTypMaxUnitNoteDiameter d mag 4 6 mm Thickness t mag 2.5 mm Recommended magnet: Ø 6mm x 2.5mm forcylindrical magnets Magnetic input fieldamplitude B pk 4575 mTRequired vertical component of the magnetic field strength on the die’s surface, measured along a concentric circle with a radius of 1.1mm Magnetic offset B off ± 10mT Constant magnetic stray field Field non-linearity5 %Including offset gradient2.44146 rpm @ 4096 positions/rev.; fast modeInput frequency (rotational speed of magnet)f mag_abs0.61Hz36.6rpm @ 4096 positions/rev.; slow mode Displacement radiusDisp0.25mmMax. offset between defined device center and magnet axis (see Figure 18) Eccentricity Ecc 100µm Eccentricity of magnet center to rotational axis-0.12NdFeB (Neodymium Iron Boron) Recommended magnetmaterial andtemperature drift -0.035%/KSmCo (Samarium Cobalt)6.6 Electrical System Specifications(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0~3.6V (3V operation) VDD5V = 4.5~5.5V (5V operation) unless otherwise noted) ParameterSymbolMinTypMaxUnitNoteResolution RES 12 bit 0.088 deg Integral non-linearity (optimum)INL opt± 0.5 deg Maximum error with respect to the best line fit. Centered magnet without calibration, T amb =25 °C. Integral non-linearity (optimum)INL temp± 0.9 degMaximum error with respect to the best line fit. Centered magnetwithout calibration, T amb = -40 to +125°CIntegral non-linearity INL ± 1.4 degBest line fit =(Err max – Err min ) / 2Over displacement tolerance with 6mm diameter magnet, without calibration,T amb = -40 to +125°C Differential non-linearity DNL ±0.044 deg 12bit, no missing codes 0.06 1 sigma, fast mode (MODE = 1)Transition noiseTN0.03deg RMS1 sigma, slow mode (MODE=0 or open)Power-on reset thresholds On voltage; 300mV typ. hysteresisOff voltage; 300mV typ. hysteresisV on V off 1.37 1.08 2.2 1.9 2.9 2.6VDC supply voltage 3.3V (VDD3V3)DC supply voltage 3.3V (VDD3V3)20Fast mode (Mode = 1); until status bit OCF = 1Power-up timet PwrUp80msSlow mode (Mode = 0 or open); until OCF = 196Fast mode (MODE=1)System propagation delay absolute output : delay of ADC, DSP and absolute interfacet delay384µsSlow mode (MODE=0 or open) 2.48 2.61 2.74T amb = 25°C, slow mode (MODE=0 or open)Internal sampling rate for absolute output:f S2.35 2.61 2.87 kHzT amb = -40 to +125°C, slow mode (MODE=0 or open) 9.90 10.42 10.94T amb = 25°C, fast mode (MODE = 1)Internal sampling rate forabsolute outputf S9.38 10.42 11.46kHz T amb = -40 to +125°C, : fast mode (MODE = 1)Read-out frequency CLK1MHz Max. clock frequency to read out serial dataFigure 3. Integral and Differential Non-linearity (example)Integral Non-Linearity (INL) is the maximum deviation between actual position and indicated position. Differential Non-Linearity (DNL) is the maximum deviation of the step length from one position to the next. Transition Noise (TN) is the repeatability of an indicated position6.7 Timing Characteristics6.7.1Synchronous Serial Interface (SSI)(operating conditions: T amb = -40 to +125°C, VDD5V = 3.0~3.6V (3V operation) VDD5V = 4.5~5.5V (5V operation) unless otherwise noted) ParameterSymbol MinTypMaxUnitNoteData output activated (logic high)t DO active 100 nsTime between falling edge of CSn and dataoutput activated First data shifted to output registert CLK FE500 nsTime between falling edge of CSn and firstfalling edge of CLKStart of data output T CLK / 2 500nsRising edge of CLK shifts out one bit at a timeData output valid t DO valid357 375 394 nsTime between rising edge of CLK and dataoutput validData output tristate t DO tristate100 nsAfter the last bit DO changes back to“tristate”Pulse width of CSn t CSn 500ns CSn = high; To initiate read-out of next angular position Read-out frequencyf CLK>01MHzClock frequency to read out serial data分销商库存信息:AMSAS5045-ASST AS5045-ASSU AS5045 PB AS5045 DB V2AS5045 AB。

Manual infrared viewers RoHs Infrared viewers ABRIS M seriesABRM-1300-x ABRM-1700-x ABRM-2000-xPOLYTEC GmbHPolytec-Platz 1 - 7 D -76337 Waldbronn GERMANY Tel: +49 (72 43) 604-1540Fax:+49(7243)69944E-Mail:****************.polytec .deinfrared viewers ContentContent (3)Safety requirements (4)About (4)Applications (5)How does it work? (5)Operation (6)IR viewer in comparison with a CCD camera (8)Visualization of infrared laser beam in “mid-air” (9)The Maintenance instruction (9)Black spots on screen (9)Spectral sensitivity (10)Power density (11)Photosensitivity (12)Technical information (13)Warranty (15)Safety requirements•The customer is responsible for light source safety while using a viewer as a standalone device or integrated into system.•The customer must consider protective measures if necessary.•While assembling or operating viewer, do not stare at the direct laser (or other source) light even with safety goggles.•This device will not protect you from direct or high light radiation. Use viewer with caution and appropriate attenuation•Electrical safety requirements must be complied while operating this device.AboutHigh performance image conversion viewers ABRIS-M, based on high- grade image converter, are designed to observe indirect radiation of infrared laser, light emitting diodes (LED), dye and other IR-sources in 350 - 2000 nm spectral region. The lightweight, compact device can be used hand-held, post mounted with the 1/4-20 internal thread or face-mask mounted for hands free operation.ABRIS-M viewer has better resolution, infrared sensitivity and factor of intensification. Also, it can be used with a CCD camera adapter for PC and video registration of the image.This device allows viewing continuous lasers radiation as well as pulsed lasers radiation with pulse duration from ps to µs without synchronization.Applications•Laser alignment and safety.IR viewers are ideal for alignment of infrared laser beam and optical components in near infrared systems.•Semiconductors wafer inspection.With a microscope adapter IR viewer can be used to view through the surface of silicon and gallium arsenide wafers.•Forensics and art restoration•Photo processing•Thermal imaging•Food sorting•Vein and blood vessel observation under the skin•Fluid inspection How does it work?IR viewer is based on a first-generation high-grade image converter that has an electro-static focusing system, photocathode S-1+ with increasedconcentration of oxygen and screen of type P-20 with maximum of luminescence at 550nm.Infrared viewer focusemitted or re flected light from a chosen subject into the image tube where electron image is generated. When powered (with battery or power supply) the 16-18 kV voltage is generated required to accelerate the electron image into the output phosphor screen. The fluorescent green light output (550 nm) is observed via an adjustable eyepiece lens.Electrostatic lens Visible phosphor screen Photo-cathode surface Imaging optics +HVOperationCAUTION! Do not use the device for direct beam viewing. Long-term over-exposure may cause satiation of screen and decrease of resolution or irreversible reduction of photocathode response.1.Unscrew the lid (1) of the battery compartment and install one AAAsize battery into battery compartment, observing the polarity.2.Screw the handle (7) into the tripod thread ¼ inches (10) in body.3.Take of the lens cover. To switch the unit on, press button (2).NOTE: after switching off, the device continues to work some minutes due to the accumulated power.4.Rotate the ring (3) to focus the lens 1Х (F1.4/25mm). Rotate ring (13) tofocus the lens 2Х(F1.8/50mm). For adjustment of diaphragm (11), release the screw, adjust the diaphragm (11) and tighten the screw. Turn the ring (5) for eyepiece focus adjustment.5.When viewing in near-infrared range, use cut-off filter (4). Whileviewing a reflected radiation, use metallic surface as a reflector. A nypaper surface absorbs the radiation greatly.6.For "goggle" operation, place the IR viewer onto "dovetail” (9) of face-mask and clamp it with screw. Adjust the position with fixing screws for the most convenient operation.Figure 1. ABRIS M 1X viewe r12 21 6 9 7 101.Lid of battery2.Button ON/OFF3.Focusing ring ofF1.4/25mm lens4.IR Filter5.Eyepiece6.Socket 3V7.Handle8.LED9.Dovetail (for face-mask clamping)10.Tripod thread11.Diaphragm12.C-mount ring13.Focusing ring ofF1.8/50mm lensFigure 2. Lenses F1.8/50mm (left) and F1.4/25mm (right)IR viewer in comparison with a CCD cameraCertain models of CCD cameras can be used to observe near-infrared radiation at wavelengths up to 1100 nm. However, because these cameras are designed for optimum performance in the visible wavelength range, as a result, they exhibit mediocre performance in the near-infrared range; image bleeding, blooming, low sensitivity and low contrast are some of the observed characteristics. Image conversion viewers are design to observemuch wider spectrum.Visualization of infrared laser beam in “mid-air”It is a misconception that an IR viewer can be used to view infrared laser beams in “mid-air” (1100 – 2000 nm). However, if dust particles are in the beam path, the beam will become partly visible. Basically, IR viewers can be used to see the projection of the infrared beam spot on a flat diffusing surface such as a white card or metallic surface.The Maintenance instruction1.During IR viewer operation there is no danger of electric shock.2.When brought into a warm room from the cold outside the optical elements may become wet.3.Keep away viewer from mechanical damage and moisture.4.Protect the lenses from dirt. If necessary, clean them with clean soft cloth; remove oiled spots or deposit with cotton wool slightly wetted in rectified alcohol or with alcohol-ether mixture.5.If necessary, unscrew the lens and clean the photocathode window, because dust can be seen through eyepiece.Black spots on screenBlack spots on the screen are cosmetic blemishes in the image converter which do not affect the performance or reliability of an infrared viewers. Some spots are inherent in the manufacturing processes.Spectral sensitivityFigure 3. Spectral sensitivity (Abris M series IR viewers)infrared viewers Power densityApproximate minimum of power densities required to view an infrared laser beam from a one meter distance:Figure 4. Power density (Abris M series IR viewers)PhotosensitivityThe minimum detectable signal for a near-infrared viewer depends on: •Power density;•Wavelength of incident radiation;•Effective aperture of the objective lens;•Distance between observed target and the viewer;•Time duration of the signal (pulsed or continuous);•Reflectivity of the diffusing surface;•Sensitivity of human eye or device used in viewing the output of the IR viewer.Approximate minimum of power densities required for observing an infrared laser source from a distance of one meter:•20 µW/cm2 for a 1060 nm; 500 µW/cm2 for a 1300 nm.The IR viewer with sensitivity 350-2000 nm has the photocathode S-1+ type which contain the increased concentration of oxygen. It increases sensitivity of the photocathode. IR viewer can be used to view 2.0 µm laser beam at minimum power density 2 W/cm2. When operated in the 1500-2000 nm range, IR viewer has a low spectral response, therefore observations can be performed when the following requirements are met:e an IR cut-off filter or interference filter and darken the room toreduce external background;e a metallic surface for observation reflected radiation, as any othermaterial might absorb infrared radiation.Lenses 1X (F1.4/25mm) and 2X (F1.8/50mm) are exchangeable.infrared viewersStandard kit for version 1X includes: • IR viewer; • lens 1X; • C-mount ring; • IR filter; • handle;• battery and case.Standard kit for version 2X includes: • IR viewer; • lens 2X; • macro ring; • IR filter; • handle;• battery and case.Accessories available upon request:• Neutral density filter for lens 1X(3-5% @ 1064nm) • Neutral density filter for lens 2X(3-5% @ 1064nm) • Microscope adapter• Face-mask for hands free operation • IR illuminator (940nm, 850nm)• 1:1 Optical relay lens adapter for c-mount camera • Video adapter VA-1 to Abris • Lens 2X (F1.8/50mm) • Lens 1X(F1.4/25mm) • Macro ring• C-mount ring for any C-mount type lenses • Tripodinfrared viewers WarrantyInfrared viewing device ABRIS M meets specifications of the manufacturer and declared operation.The warranty period of the device is 24 months from the date it was sold to the consumer.Claims not accepted, and warranty repair are not made, because of the improper use or incorrect service and maintenance of product instructions. The company shall not accept warranty claim:-non-authorized alteration,-disassembling of device,-mechanical or any external damages,-if 2 years warranty term has expired.Serial No.Version No.Spectral rangeDate of Invoiceinfrared viewersirviPOLYTEC GmbH Polytec-Platz 1 - 7 D -76337 Waldbronn GERMANY Tel: +49 (72 43) 604-1540Fax:+49(7243)69944E-Mail:****************.polytec.de。