rayence leafiet 2014 韩国平板资料
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LAMP1383-2SURD/S530-A3Features• Choice of various viewing angles• Available on tape and reel.• Reliable and robust• Pb free• The product itself will remain within RoHS compliant version.• Compliance with EU REACH• Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm)Description•The series is specially designed for applications requiring higher brightness •The led lamps are available with different colors, intensities.. Applications• TV set• Monitor• Telephone• ComputerDevice Selection GuideAbsolute Maximum Ratings (Ta=25℃)Electro-Optical Characteristics (Ta=25℃)Note:*Measurement Uncertainty of Forward Voltage: ±0.1V*Measurement Uncertainty of Luminous Intensity: ±10%*Measurement Uncertainty of Dominant Wavelength ±1.0nmTypical Electro-Optical Characteristics CurvesPackage DimensionNote: Note:1. All dimensions are in millimeters2. The height of flange must be less than 1.5mm(0.059").3. Without special declared, the tolerance is ±0.25mm.Moisture Resistant Packing MaterialsLabel ExplanationCPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: RanksHUE: Dominant Wavelength REF: Reference LOT No: Lot Number■ Packing Quantity1.MIN200-500 PCS/1 Bag, 5 Bags/1 Inner Carton2. 10 Inner Cartons/1 Outside CartonNotes1. Lead Forming⏹ During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.⏹ Lead forming should be done before soldering.⏹ Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.⏹ Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs. ⏹When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.2. Storage ⏹ The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limitsare 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. ⏹Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.3. Soldering ⏹ Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,and soldering beyond the base of the tie bar is recommended. ⏹Recommended soldering conditions:⏹⏹ Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. ⏹ Dip and hand soldering should not be done more than one time⏹ After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.⏹A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.⏹Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowestpossible temperature is desirable for the LEDs.⏹Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solderwave.4. Cleaning⏹When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more thanone minute. Dry at room temperature before use.⏹Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDsdepends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED5. Heat Management⏹Heat management of LEDs must be taken into consideration during the design stage of LED application. The currentshould be de-rated appropriately by referring to the de-rating curve found in each product specification.⏹The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-ratingcurve.6. ESD (Electrostatic Discharge)⏹The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.When handling the products, the following measures against electrostatic discharge are stronglyrecommended:Eliminating the chargeGrounded wrist strap, ESD footwear, clothes, and floorsGrounded workstation equipment and toolsESD table/shelf mat made of conductive materials⏹Proper grounding is required for all devices, equipment, and machinery used in product assembly.Surge protection should be considered when designing of commercial products.⏹If tools or equipment contain insulating materials such as glass or plastic,the following measures against electrostatic discharge are strongly recommended:Dissipating static charge with conductive materialsPreventing charge generation with moistureNeutralizing the charge with ionizers7. Directions for use⏹The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjectedto forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it may cause migration resulting in LED damage.8. Other⏹Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for abovespecification.⏹When using this product, please observe the absolute maximum ratings and the instructions for using outlined in thesespecification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not complywith the absolute maximum ratings and the instructions included in these specification sheets.⏹These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’treproduce or cause anyone to reproduce them without EVERLIGHT’s consent.DISCLAIMER1. EVERLIGHT reserves the right(s) on the adjustment of product material mix for the specification.2. The product meets EVERLIGHT published specification for a period of twelve (12) months from date ofshipment.3. The graphs shown in this datasheet are representing typical data only and do not show guaranteed values.4. When using this product, please observe the absolute maximum ratings and the instructions for using outlinedin these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from the use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.5. These specification sheets include materials protected under copyright of EVERLIGHT. Reproduction in anyform is prohibited without obtaining EVERLIGHT’s prior consent.6. This product is not intended to be used for military, aircraft, automotive, medical, life sustaining or life savingapplications or any other application which can result in human injury or death. Please contact authorized Everlight sales agent for special application request.。
Technical Data SheetChip LED with Right Angle Lens12-21SYGC/S530-XX/TR8Features˙Package in 8mm tape on 7〞diameter reel.˙Compatible with automatic placement equipment. ˙Compatible with infrared and vapor phase reflowsolder process. ˙Mono-color type.Descriptions˙The 12-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.˙Besides, lightweight makes them ideal for miniature applications. etc.Applications˙Automotive: backlighting in dashboard and switch. ˙Telecommunication: indicator and backlighting in telephone and fax.˙Flat backlight for LCD, switch and symbol. ˙General use.Device Selection GuideChipMaterial Emitted Color Lens ColorAlGaInPSuper Yellow GreenWater Clear12-21SYGC/S530-XX/TR8Notes: Tolerances Unless Dimension ±0.1mm , Angle±0.5°,Unit = mmAbsolute Maximum Ratings (Ta=25℃)Parameter SymbolRatingUnitReverse Voltage V R 5 VForward Current I F 25 mAOperating Temperature Topr -40 ~ +85 ℃Storage Temperature Tstg -40~ +90 ℃Soldering Temperature Tsol 260 (for 5 second)℃Electrostatic Discharge ESD 2000 VPower Dissipation Pd 60 mWPeak Forward Current(Duty 1/10 @1KHz)I F 160 mA12-21SYGC/S530-XX/TR8Electro-Optical Characteristics (Ta=25℃)ParameterSymbol*Chip RankMin. Typ. Max. UnitConditionE1 13 19 -----E2 19 26 -----E3 26 35 ----- Luminous IntensityIv E4 35 41 -----mcd I F =20 mAViewing Angle 2θ1/2 ----- ----- 120 ----- deg I F=20mA Peak Wavelengthλp ----- ----- 575 -----nm I F=20mA Dominant Wavelengthλd----- ----- 573 ----- nm I F =20mA Spectrum RadiationBandwidth △λ ----- ----- 20 -----nm I F =20mA Forward VoltageV F----- ----- 2.0 2.4 VI F =20mA Reverse CurrentI R ----- ----- ----- 10μA V R =5V*12-21SYGC/S530-XX/TR8Chip RankReel & Carrier Tape Dimensions Loaded quantity per reel 2000 PCS/reel12-21SYGC/S530-XX/TR8 Typical Electro-Optical Characteristics Curves12-21SYGC/S530-XX/TR8Reliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below. Confidence level : 90 % LTPD : 10 %No. Items Test Condition Test Hours/Cycles SampleSizeAc/Rc1 Reflow Temp. : 240℃±5℃Min. 5 sec. 6 min. 22 Pcs. 0/12 Temperature Cycle H : +85℃ 30min.∫ 5 min.L : -55℃ 30min. 50 Cycles 22 Pcs. 0/1 3 Thermal Shock H : +100℃ 5min.∫ 10 sec.L : -10℃ 5min.50 Cycles 22 Pcs. 0/1 4High TemperatureStorage Temp. : 100℃ 1000 Hrs. 22 Pcs. 0/1 5Low TemperatureStorage Temp. : -55℃ 1000 Hrs. 22 Pcs. 0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 Pcs. 0/1 7 High Temperature/ High Humidity85℃/R.H85%1000 Hrs.22 Pcs.0/112-21SYGC/S530-XX/TR8Precautions For Use1. Over-current-proofCustomer must apply resistors for protection , otherwise slight voltage shiftwill cause big current change ( Burn out will happen ).2. Storage time2.1 The operation of Temperature and RH are : 5℃~35℃, RH60%.2.2 Once the package is opened, the products should be used within a week.Otherwise, they should be kept in a damp proof box with descanting agent.Considering the tape life , we suggest our customers to use our productswithin a year(from production date).2.3 If opened more than one week in an atmosphere 5℃~35℃, RH 60%,they should be treated at 60℃±5℃for 15hrs.2.4 When you discover that the desiccant in the package has a pink color(Normal = blue) , you should treat them in the same conditions as 2.3.Soldering heat Reflow Temp / TimeSoldering IronBasic spec is ≦5 sec when 260℃.If temperature is higher, time should be shorter (+10℃→-1sec). Power dissipation of Iron should be smaller than 15 W , and temperature should becontrollable. Surface temperature of the device should be under 230 ℃.12-21SYGC/S530-XX/TR8 Rework1. Customer must finish rework within 5 sec under 245℃.2. The head of iron can not touch copper foil.。
0.50.40.30.20.1Then and NowA Brief History ofSingle Board ComputersBy Cliff Ortmeyer, Global Head of Solutions Development, Premier FarnellThe term SBC or single board computer has been around for many years and has meant different things to different people.Newark element14 carries the most popular open-source and proprietary single board computers. We also manufacture and sell accessories for a variety of major platforms, including BeagleBone Black, Raspberry Pi, RIoTboard and more.December 06CONTENTS SBC Featured Article BeagleBone Black Bundles BeagleBone Black Projects The Best from Arduino, Embest and Freescale The element14 Design Center Reduced Prices on Dev Kits The Latest Test &Measurement Technology Lab Supplies for your Bench A Wireless Update from Atmel Freescale and STEM EducationDyna-MicroOLDCOMPUTER / MMD-2.HTMLRIoTBOARD/ RIOTBOARDBeagleBoard/ BEAGLEBONEAtmel Xplained/ SAMA5D3Raspberry Pi/ RASPBERRYPI19762013Then and Now: A Brief History of Single Board ComputersI n its truest sense, an SBC has referred to a single PCboard with the processor, memory and some type of I/O that allowed it to function as a computer – an example of the mid-70s “dyna-micro” was one of the first true single board computers. This differs from a traditional mass produced motherboard in that the early mass market motherboards had expansion slots for many of the key additional peripherals like audio, video and network cards. Today, most consumer motherboards would be considered SBCs as most of the necessary functionality exists on a single motherboard, with the added bonus of being able to upgrade the existing functionality through the use of add-on cards. This is an abbreviated version of the rise of the modern PC.As stated previously, the term SBC generally refers toa microprocessor based board. But, just as in previous years, semiconductor manufacturers have often supplemented the launch of new products, especially microcontrollers, with development kits or demo boards that engineers could use to test out their newest silicon. These kits were generally used by professional engineers to test out the silicon for their next design. Once the necessary functionality of the microcontroller was confirmed, the designer went into laying out their own board to test out their proof of concept design. Many of today’s SBCs have become so powerful that they are beginning to have the capability of modern day PCs and tablets.In order to understand the rise of today’s SBCs, we need only look back 10 years ago in Ivrea Italy where a team of designers were looking to develop a lost cost, easy to use microcontroller based development kit that allowed people of all skill levels to make use of modern microcontrollers in their projects. This marked the beginning of the Arduino™ platform. The rapid market acceptance of this prototyping platform paved the way for a new breed of designers entering into the electronics market. Today they are called DIYers, hobbyists and makers among other titles. As the microcontroller based Arduino™ market continued to grow, the cost of microprocessors and SOCs continued to drop dramatically thanks to the success of commercial processor platforms that integrated increasingly more functionality in a single package. One of the next major developments in the rise of the modern SBC was on July 28, 2008 with the birth of the non-profit . was formed to bring modern microprocessors development into the hands of engineers and designers through a low cost, open source community supported development platform known as the BeagleBoard.With the Arduino™ and BeagleBone platforms in place and continuing to evolve in the hands of designers, developers and hobbyists, the world was about to experience one of the largest disruptions in both the consumer and industrial computing space – the introduction of the Raspberry Pi. In 2006, a group based in the University of Cambridge’s Computer Laboratory, decided to address the need fora low cost computing platform that would allow kids to learn how to program without the need for a full-fledged home computer. The result was a $35 single board computer named Raspberry Pi. While initially designed as a tool for students to learn programming, the Raspberry Pi was adopted by makers, designers, students and even professional engineers and helped to launch the current boom in interest in SBCs.Present Day SBCsToday, SBCs can be grouped into two main categories – proprietary and open source. Proprietary SBCs are generally designed for use in end applications or as a reference to be evaluated. They are often industrialized designs that have gone through the same type of testing that an end product requires and are often integrated into end product designs or installed in a rack mount configuration. Open source SBCs on the other hand offer users access to both the hardware design and layout as well as access to the source code used on the board. This is ideal for all users as they can easily understand how the software and hardware operates and adopt the design to meet their end designs requirements or simply learn how a piece of hardware or software works.Current SBCs come with a wide variety of processor types, most with GPUs on-board. These processors range from X86 based processors from the traditional PC space (AMD and Intel) to ARM processors which have traditionally been used in the industrial and more recently mobile spaces. The most prevalent form of software used on SBCs is Linux with numerous derivations including Android, Ubuntu, Fedora, Debian and Arch Linux as well as FreeBSD and Windows CE.Then and Now: A Brief History of Single Board ComputersThe programming/debugging tools are also often free and open source, such as those based on the Eclipse IDE. Other tools that are tailored to a specific processor that are often used by professionals include ARMs DS-5 or vendor specific tools such as Freescale’s CodeWarrior or Texas Instruments’ Code Composer Studio.Types of SBCsWhile SBCs can be used for most any purpose, many have originally been designed for a specific purpose or application. A perfect example of this is the RaspberryPi which was developed as an educational tool to help encourage and strengthen students programming skills. The BeagleBoard and BeagleBone were also developed to help educate and promote the benefits and usage of open source hardware and software in embedded computing. Numerous other SBCs have been developed in the past few years including Atmel’s SAMA5D3 Xplained, which was designed for rapid prototyping development, and the RIoTboard which focuses on Android development to enable the development of the Internet of Things. Other well-known boards include the PandaBoard, OlinuXino, as well as a whole host of Allwinner ARM SoC based SBCs. The long term success of an SBC, like most other products, relies heavily on the performance/price ratio. But what also weighs in just as heavily is the amountof available support for a particular board or range of boards. While some SBCs rely on a dedicated supplieror secondary support entity, most of the open source SBCs are supported through a community of developers. These communities strengthen the boards propositionby providing software updates from individuals as well as projects that showcase the boards features as well as the many accessories that are often available to expand the boards functionality.The Future of SBCsMany of today’s SBCs have become so powerful that they are beginning to have the capability of modern day PCs and tablets. This trend will continue as more powerful processors make their way into the embedded computing market as ever-increasing performance/price ratios rise, as well as additional manufacturers enter into this “Wild West” frontier of supporting open source hardware and software for both DIYers and professionals alike. An additional trend we will continue to see is the availability of more accessories or add-on boards to be added to current SBC platforms, allowing users more options to control and have access to the outside world. This will benefit both DIYers and professionals alike. DIYers that come from a programming background will have increased access to the analog electronics that are required to interface with the outside world. Professional engineers on the other hand can take these accessories and quickly add additional needed functionality to their SBCs to develop working prototypes for projects currently on-hand. Lastly, another trend that will most likely continue is the adoption of these SBCs into lower volume end products. Many of today’s SBCs are as close to fully vetted designs as those developed specifically for end product usage. This is due to the fact that open source designs are equivalent to having a continual global design review with multitudes of designers and programmers updating and giving feedback on the boards and their software. Additionally, as the design and testing of these boards is done through high quality design and manufacturing firms like AVID or Embest Technologies, the boards go through the same quality control as any other end product and often come with CE or FCC certifications. And, as the cost of these boards is often well below what an individual or company could produce the board for, entrepreneurs and small companies alike, see these boards as an ideal way to quickly bring designs to market without the overhead needed to develop new hardware, but instead focus on the software innovation that is often a key differentiator in todays end product designs.Browse our super selection today! /SINGLE-BOARD-OVERVIEW④THE ELEMENT14 BEAGLEBONE BLACK (REVISION C) ④RASPBERRY PI MODEL B+ ④I.MX6SOLO, IOT, HDMI, MULTIMEDIA, RIOT BOARD ④SAMA5D3 XPLAINED ④BeagleBone Black AccessoriesBBW FAMILY ④A portable 4.3” or 7” LCD solution with touch-screencapability for BeagleBone & BeagleBone Black.WIFI DONGLE ④A high performance & cost effective WLAN USB modulethat connects your development platform to a wirelesslocal area network.Make it easy on yourself!Check out these BeagleBone Blackbundles to help get you started.BBB STARTER KIT ④Includes an element14 BeagleBone Blackand anadafruit Industries 699 Enclosure $65.00BBB INTERMEDIATE KIT ④Includes an element14 BeagleBone Black,BUD Enclosure, TRIAD Magnetics Power Supply,element14 4.3” BB View Display and anelement14 WiFi USB Dongle $150.00Try our “virtual” bundles, too.They’re an easy & convenient wayto drop BeagleBone Black boards& accessories right into yourShopping Cart!BBB ‘CAPE’ABILITY EXPANSION KIT ④BeagleBone Black, Case, Power Supply, USB Dongle, mikroBUSCape, Bluetooth Board and a Temperature & Humidity Sensor BoardBEAGLESTACH ④BeagleBone Black, Power Supply, 4.3” LCD Touch-screenUSB Cable and a 4-Port USB HubBBB+LCD 4.3” ④BeagleBone Black, Power Supply and a 4.3” LCD Touch-screen.BBB+LCD 7” ④BeagleBone Black, Power Supply and a 7” LCD Touch-screen.BBB EXPANSION BUNDLE ④Includes a Case, Power Supply, USB Dongle and a 7-Port USB Hub.MIKROBUS+CLICK BUNDLE ④Includes a mikroBUS Cape, Bluetooth Board, Data Acquisition Boardand a Temperature & Humidity Sensor Board.④NEW! Live chat on product pages! Search by part number and keyword.CY3280-MBR CAPSENSE ® EXPRESS ™ WITHSMARTSENSETM AUTO-TUNING KIT GUIDE ④This Dev Kit is designed to showcase the abilities ofconfigurable capacitive sensing controller CY8CMBR2044. This controller is equipped with SmartSense, which allows engineers to go from prototyping to mass production without re-tuning for manufacturing variations in PCB and/or overlay material properties. $22.93TPS5420EVM-175 REGULATOR EVALUATION MODULE ④The TPS5420 dc/dc converter is designed to provide up to a 2-A continuous, 3-A peak output from an input voltage source of 5.5 V to 36 V. $9.55EVAL-CN0313-SDPZ DEVELOPMENT BOARD, RS-485 INTERFACE DESIGN ④Includes three ADM3485E devices, one for each protectionscheme: IEC 61000-4-2 electrostatic discharge (ESD), IEC 61000-4-4 electrical fast transients (EFT) & IEC 61000-4-5 surge immunity. Each protection scheme provides ESD and EFT protection and increasing levels of surge protection. $78.22the ArduinoTM R3 pin layout, providing a broad range of expansion board options.Interfaces include an RGB LED, a3-axis digital accelerometer, and a capacitive touch slider. $8.99ATSAMA5D3-XPLD ④A fully featured evaluationplatform for Atmel SAMA5D3 series microcontrollers. It allows users to extensively evaluate, prototype andcreate application-specific designs.$58.19HAP-TOUCHBOOSTERPACK ④Integrates capacitive touch functionality with haptics technology in a single TI BoosterPack. Developapplications using two of the hottest technologies available on the today!$25.00Stock your lab or bench with a complete line-up of supplies!/lab-supplies④SOLDERING STATIONS ④We offer a wide selection ofsoldering stations and accessories from leading manufacturers like Weller, Metcal and Tenma. You can also find desoldering &rework stations , fume extraction systems, soldering irons , solder tips & nozzles, wire , paste and desoldering braid.JUMPER WIRES ④Find the jumper wires you’re looking for along with a wide range of cable accessories including cable clips , cable ties , sleeving , wire markers and more from trusted manufacturers like MCM, 3M and Twin Industries.GROUNDING MATS ④Find a variety of Grounding Mats from brands like 3M and Multicomp for quality static control and site safety. These, along with all of the products you need to help minimize the impact of ESD and static electricity can be found here at Newark element14.CONNECTOR KITS ④Newark element14 is your source for connectors and connector kits from leading manufacturers like Weidmuller, Pomona, TE Connectivity, Molex, ITT Cannon, Amphenol and more. We carry most of our connectors in stock everyday, so you canalways find the right connector for your application. Our Connector Kits offer an easy way to keep the products you need on hand, so you can get the job done.manufacturers entering into this “Wild West” frontier to sup¬port open source hardware and software for DIYers and professionals.Given SBC’s exceptional growth, their use in wireless and IoT (Internet of Things) applications will certainly continue. Read the following article from Atmel Corporation for their perspective on this dynamic market.According to an updated market forecast from ABI Research, the installed base of active wireless connected devices will exceed 16 billion in 2014, an increase of nearly 20% from 2013. The number of devices will more than double from the current level, with 40.9 billion projected for 2020.“The driving force behind the surge in connections is that usual buzzword suspect, the Internet of Things (IoT). If we look at this year’s installed base, smartphones, PCs and other ‘hub’ devices represent still 44% of the active total, but by end-2020 their share is set to drop to 32%. In other words, 75% of the growth between today and the end of the decade will come from non-hub devices: sensor nodes and accessories,” revealed Aapo Markkanen, Principal Analyst.From a tech supplier’s strategic point of view, the critical question that lies ahead is how the plethora IoT devices will ultimately be connected. Until recently, the choices that product OEMs have faced have been fairly NFC,” added ABI Research Practice Director Dan Shey. Another prime example of this convergence is the newly unveiled Open Interconnect Consortium (OIC), formedby tech leaders Atmel, Broadcom, Dell, Intel, Samsung and Wind River. The aim of this new project is to establish a common communication framework based on industry standard technologies to wirelessly connect and intelligently manage the flow of information among devices, regardless of form factor, operating system or service provider. The OIC also intends to deliver open source implementations for a variety of IoT market opportunities and vertical segments from smart home solutions to automotive and more, utilizing both existing and emerging standards like Wi-Fi, Bluetooth, Wi-Fi Direct, Zigbee, Zwave and Ant+.The new Atmel | SMART product line includes the SmartConnect wireless IC family, which combines ultra-low power Atmel MCUs with wireless solutions and complementary software. The SmartConnect wireless portfolio is a family of self-contained, low-power, and certified modules bringing wireless Internet connectivity to any embedded design, without compromising on cost and power consumption. Adding to the already broad family are recently acquired NMI’s 802.11n Wi-Fi and Bluetooth certified products. These innovative, highly integrated solutions will accelerate seamless communication and connectivity for the IoT.Freescale and STEM EducationEducating Engineers for Careers in BusinessA Premier Farnell Company©2014 Newark, a trademark of Premier Farnell Corp. All other trademarks, registered or unregistered, are the property of their respective holders.。
Freescale Semiconductor Application Note AN2731Rev. 1.2, 11/20041Introduction Good antenna design is the most critical factor in obtaining good range and stable throughput in a wireless application. This is especially true in low power and compact designs, where antenna space is less than optimal. However, several compact, cost efficient, and very effective options exist for implementing integrated antennas.To obtain the desired performance, it is required thatusers have at least a basic knowledge about howantennas function, and the design parameters involved.These parameters include selecting the correct antenna,antenna tuning, matching, gain/loss, and knowing therequired radiation pattern.This note will help users understand antenna basics, andaid in selecting the right antenna solution for theirapplication.Compact Integrated Antennas Designs and Applications for the MC13191/92/93Contents1Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 12Antenna Terms . . . . . . . . . . . . . . . . . . . . . . . . 23Basic Antenna Theory . . . . . . . . . . . . . . . . . . 24Impedance Matching . . . . . . . . . . . . . . . . . . . 65Miniaturization Trade-offs . . . . . . . . . . . . . . 136Potential Issues . . . . . . . . . . . . . . . . . . . . . . 147Recommended Antenna Designs . . . . . . . . 148Design Examples . . . . . . . . . . . . . . . . . . . . . 16Antenna Terms2Antenna TermsAntenna Gain A measure of how well the antenna radiates the RF power in a given direction, compared to a reference antenna, such as a dipole or an isotropic radiator. The gainis usually measured in dB’s. A negative number means that the antenna in questionradiates less than the reference antenna, a positive number means that the antennaradiates more.Decibel (dB) A logarithmic scale used to represent power gain or loss in an RF circuit. 3 dB isa doubling of the power, -3 dB is half the power. -6 dB represents half the voltageor current, and quarter the power.Radiation Resistance The part of antenna’s impedance which produces radiated power. The measured impedance of an antenna is comprised of radiation resistance and loss.3Basic Antenna TheoryEvery structure carrying RF current generates an electromagnetic field and can radiate RF power to some extent and likewise an external RF field can introduce currents in the structure. This means that theoretically any metallic structure can be used as an antenna. However, some structures are more efficient in radiating and receiving RF power than others. The following set of examples explains this concept. Transmission lines (striplines, coaxial lines etc.) are designed to transport RF power with as little radiation loss as possible because these structures are designed to contain the electromagnetic fields. To obtain any appreciable radiation from such a structure, requires excessively high RF currents which causes low efficiency due to high losses. Likewise, the ability to introduce RF currents into the structure is of importance, described by the feed point impedance. If the feed point impedance is very high, low, and/or highly complex, it is difficult to introduce RF current with good efficiency.The antenna structure should be of reasonable size compared to the wavelength of the RF field. A natural size is half a wavelength, which corresponds to approximately 6 cm at the 2.4 GHz ISM band. This size is effective because when fed with RF power at the center point, the structure is resonant at the half wave frequency. Reducing the size below 6cm tends to make the antenna less visible to the RF field and not resonant which causes low efficiency. Not all structures make an efficient antenna.Numerous structures have been devised that provide good efficiency and impedance match, but most of these are derived from a few basic structures. A short description of these basic antennas, and some good advice on how to implement these with success is provided later in this note.This note does not include complicated formulas concerning antenna theory because it is beyond the scope of this note. The intention of this note is to provide basic information about how antennas work, which should allow users to achieve reasonable performance with a minimum number of attempts.If users are interested in performing complex calculations and antenna simulations, they should consult the abundant and widely available literature concerning antenna theory and design. Note that simply copying an existing design does not necessarily ensure reasonable performance. A lot of external factors affect antenna tuning, gain, radiation patterns, etc. An antenna tuned for one set of environmental factors may not perform at all if put into a new environment, and may require a lot of tuning to achieve even reasonable performance.Basic Antenna Theory 3.1Basic Antenna Variations3.1.1 3.1.1 Dipole AntennaThe dipole is one of the most basic antennas. The dipole is a straight piece of wire cut in the center and fed with a balanced generator or transmission line. As previously stated, this structure is resonant, ornon-reactive, at the frequency where the conductor length is 1/2 wavelength. For the ISM band, this length is approximately 6 cm or about 2 ½ inches. At this length, the dipole shows resonance, the feed impedance is resistive, and is close to 73 Ohms. This also holds true for a very thin wire in free space.Figure1. Basic DipoleA practical dipole of some thickness, loaded with different dielectric materials (PCB etc.), and perhaps relatively close to ground, shows resonance at a slightly shorter length than calculated, and the radiation resistance drops somewhat. For dipoles not too close to ground, the shorting factor is typically in the range of 5-20%, the shorter being more heavily dielectric loaded, and radiation resistance is in the range of 35-65 Ohms.This dipole setup exhibits a relatively good match to a 50 Ohm generator, but the feed is differential. A small ceramic balun can be used for single-ended feed. The bandwidth is typically 2-5%, depending on the return loss required. The radiation pattern in free space is doughnut-shaped, with pronounced dips along the direction of the wires.To fill out these dips, the outer ends of the antenna can be bent at a 45 degree angle. Several configurations are possible, including the “broken arrow” shape. Any materials close to the antenna can distort the radiation pattern.Basic Antenna TheoryFigureTo reduce the size of the dipole, several options exist: •Replacing some of the wire length with loading coils •Bending the dipole ends back on the dipole•Folding the dipole into a meander pattern•Hairpin or coil loading of the center•Capacitive loading of the dipole endsBasic Antenna TheoryFigure3. Dipole Loading ExamplesIn general, the smaller the antenna, the lower the radiation resistance and the lower the efficiency. The antenna should also be removed somewhat from the ground plane, preferably at least ¼ wavelength (3 cm) but not less than 1 cm. Sometimes a loading technique is employed where the dipole ends are bent close to the ground plane, or even loaded with small capacitors to ground. This technique shorts the dipole considerably but causes heavy RF currents to flow in the ground plane, resulting in low efficiency. Often some of the other loading techniques result in better performance.Impedance Matching4Impedance MatchingFor heavily loaded antennas and antennas close to ground, the radiation resistance may deviate considerably from 50 Ohms which causes a poor match. An Inductive/Capacitive (LC) matching network may be employed, but better efficiency is possible by raising the feed impedance.These techniques may also be employed if an impedance higher than 50 Ohm is required.The current and voltage distribution on a dipole is such that the impedance is low in the center and raises towards the ends. By tapering the dipole at some distance from the center, an appropriate match can be found. The tapering may take the form of Gamma, Delta or Capacitive tapping as shown in Figure 4. This allows for matching impedances from 2 up to 300 Ohms. Some loading may be required to take out the reactance introduced by the tapering, or the antenna could be slightly offset tuned to compensate for the added reactive component.Another approach is using the folded dipole. This is where two parallel wires are placed closely together. Due to the tight coupling, the current distribution is approximately proportional to the surface area of each wire. This means that in two equal wires, the current in the feeding wire is approximately half the value of the wires together. Half the current at the same power means twice the voltage, or four times the impedance of 73 Ohms (292 Ohms). In practice, the impedance is somewhat lower, as in the normal dipole case. however, by changing the relative wire diameter, or even introducing several wires, it is possible to tune the impedance from less than 100 Ohms to several hundred Ohms.Impedance MatchingFigure5. The Folded DipoleAll the different dipole types, loading techniques, and feeding networks total up to an enormous amount of possible combinations, each with its own advantages and disadvantages. Selection of the correct design for your application is best found using case-by-case assessment.4.1Monopole AntennasIf one part of a dipole antenna is removed and replaced by an infinite ground plane, the remaining half of the dipole “mirrors” itself in the ground plane, much in the same way that one sees their own reflection in water.For all practical purposes, the monopole behaves as a “half” dipole. That is, it has the same doughnut shaped radiation pattern, the radiation resistance is half that of the dipole (37 Ohm), it can be bend and be folded like the dipole, and the same loading and feeding techniques can be applied.However, one very important difference remains in that the antenna feed point is not balanced, but single ended. Because of this and because most RF circuits are of the unbalanced type, this antenna type has been immensely popular and a lot of variations of the monopole theme exist, most designed to match 50 Ohms.FigureIt is important to note that the “whip” is only half the antenna and that the remainder is made up of the ground plane, or counter weight, as it is sometimes called. In a practical application, the ground plane is often made up of the remainder of the PCB (ground and supply planes, traces, and components).Impedance MatchingThe ground plane should be a reasonably sized area compared to the antenna, and should be reasonably continuous. If a monopole is used on a very small PCB, perhaps even with only a small area of copper, efficiency suffers, and the antenna is difficult to tune. Components and tracks introduce additional losses and affect the feed point impedance.As for the dipole, resonance is obtained at a length slightly shorter than one quarter wavelength, typically 5-15% shorter. Typical lengths are slightly more than an inch or two or 3 to 5 cm. The radiation resistance is caused by bending the antenna, and like the dipole, the marked dip in the radiation pattern can be eliminated. By bending the antenna closer to ground, the radiation resistance and efficiency drops, so the antenna should not be placed too close to ground. Like the dipole, the monopole can also be folded and bent around corners, if board space requires this, or it can be loaded with series coils.Of the many variations that exist, the following sections highlight the most common.4.1.1PCB Whip, Quarter Wave Monopole, or Quarter WaveIf board space allows, a full-size quarter wave antenna is quite efficient and often provides a reasonable match to a 50 Ohm system. Slight folding or bending of the ends has negligible impact on performance.4.1.2Open Stub, Tilted WhipIf the monopole is bent and traced along the ground plane, it will be more compact and the null in the radiation pattern is partly eliminated. The antenna should not bee too close to ground, preferably not closer than 1/10 wavelength (1 cm), or efficiency suffers too much. At this close spacing, the radiation resistance is so low (in the order of 10 Ohms) that a matching network is usually needed. If the monopole is very close to ground, it resembles a transmission line, with little or no radiation at all.4.1.3The F-AntennaThe F-antenna can be thought of as a tilted whip, where impedance matching is done by tapping the antenna at the appropriate impedance point. Because this antenna is reasonably compact, has an omnidirectional radiation pattern, good efficiency, and is very simple, it is used extensively in applications, including the mobile communications business. It should be noted that the currents in the ground leg are high, and that a good sized ground plane is necessary to provide good efficiency.Impedance Matching 4.1.4The HelixIf a quarter wavelength is coiled up, a very compact antenna can be made which still has reasonable efficiency. Some experimentation may be required to find resonance, because the length of the wire is not exactly related to a quarter wavelength. This type of antenna is very popular at lower frequencies.4.1.5The SpiralA spiral antenna, with the windings in one plane like a pancake, is well suited to be implemented on a PCB. Performance is similar to the helix.4.1.6The Meander AntennaThe meander antenna or meander pattern, is an antenna with the wire folded back and forth where resonance is found in a much more compact structure than can otherwise be obtained.The meander, spiral, and helix antennas are similar in that resonance is obtained in a compact space by compressing the wire in different ways. In all three cases, the radiation resistance, bandwidth, and efficiency drops off as size is decreased, and tuning becomes increasingly critical. Impedance matching can be implemented by tapping, as in the F-antenna. The meander and helix antenna, or a combination of these two, are easily implemented in a PCB, and many chip antennas are based on these types of antenna.Figure8. Meander Pattern (Tapped for Impedance Match)Impedance Matching4.2Loop AntennasLoop antennas can be divided in two groups:1.Half-wave antennas2.Full-wave antennasThe term wave refers to the approximate circumference of the loop.4.2.1Half-wave LoopThe half wave loop consists of a loop approximately half a wavelength in circumference, with a gap cut in the ring. It is very similar to a half-wave dipole that has been folded into a ring and much of the statements about the dipole apply to the half-wave loop. Because the ends are very close together, there exists some capacitive loading, and resonance is obtained at a somewhat smaller circumference than expected. The feedpoint impedance is also somewhat lower than the usual dipole, but all the usual feeding techniques can be applied to the half-wave loop. By increasing the capacitive loading across the gap, the loop can be made much smaller than a half wavelength. At heavy loading, the loop closely resembles a single winding LC tuned circuit. The actual shape of the loop is not critical. It can be shown that the efficiency is determined by the area enclosed by the loop. The half-wave loop is popular at lower frequencies. However, at higher frequencies, the tuning capacitance across the gap becomes very small and critical.4.2.2Full-wave LoopAs the name implies, the full wave loop is approximately one wavelength in circumference. Resonance is obtained when the loop is slightly longer than one wavelength, typically 10-15% longer. The full wave loop can be thought of as two end-connected dipoles. As is with the half-wave loop, the shape of the full wave loop is not critical, but efficiency is determined mainly by the enclosed area. The feed impedance is somewhat higher than the half-wave loop, typically around 120 Ohms.Loading can be done by inserting small coils or hairpins in the loop, thereby reducing the size. As is with the dipole and half-wave loop, there exists numerous ways for impedance matching, including gamma match and tapering across a loading coil or hairpin. The main advantage of the full-wave loop is that it does not have the air gap in the loop, which is very sensitive to load and PCB capacitance spread.Impedance Matching4.2.3Slot AntennasSlot antennas are used extensively in aircraft and radar applications. The basic slot antenna is a half wave slot cut in a conducting sheet of metal. The feed point is across the center of the slot and balanced. The feed impedance is high, typically several hundred Ohms. Because the slot antenna is the opposite of a dipole, that is, a non-conducting slot in a sheet of metal, as opposed to a conducting rod in free air, the slot antenna shows similarities to a dipole but also exhibits interesting differences as well.•The feed point is across the center, instead of in series, so the feed point impedance is high instead of low• E and H fields are switched, so that the polarity is opposite• A horizontal slot is equivalent to a vertical dipole•The slot antenna may be of interest, if the RF unit has to be placed in a metal enclosure, where the slot antenna could be made in the enclosure itself•If the slot antenna is cut in the center, a quarter wave slot antenna is created, which is equivalent to the monopole•Impedance matching can be done by tapping across the slot close to the shorted endThe slot antenna could be used if a metal enclosure is required, or if considerable board area is available. If the slot antennas are implemented in FR4 PCB, considerable dielectric loading occurs which causes the physical length to be shorter than expected.Impedance MatchingFigure10. Half-wave and Quarter-wave Slot Antennas4.2.4Patch AntennasPatch antennas are a group of antennas with a very low profile and are capable of working very close to a ground plane. However, they require a fair amount of board space. The radiation pattern may be omnidirectional or unidirectional. A few examples are shown, but design and tuning is not straightforward and is best left to an experienced antenna engineer. Some types of chip antennas that show unidirectional characteristics are of this design.4.2.5Chip AntennasMany different chip antennas are available commercially. To many, these antennas seem to work for no apparent reason, but careful investigation reveals that most of these antennas are based on a helix, meander, or patch design. To ensure proper operation it is very important to follow the manufacturer’s recommendations regarding footprint, ground areas, and mounting of the chip antenna. The “keep out” area around the antenna is especially important. Even following the recommendations does not always guarantee good performance due to de-tuning by nearby objects. It is to be expected that fine tuning of the antenna and/or a matching network is required to ensure satisfactory performance. Because chip antennas normally, but not always, use a ceramic material with higher dielectric constant and lower loss than the usual FR4, it is possible to make smaller antennas with reasonable efficiency.The efficiency is not exceptionally high, typically in the range of 10-50%, which corresponds to 3-10 dB loss (-3 to –10 dBi). The lower number being inferior products with high inherent losses. As already stated, buying a chip antenna does not guarantee good performance. However, they do provide the smallest antenna solution possible but the size reduction comes at a cost both in performance and pricing.If a slightly larger PCB area is available than is required by the chip antenna, and the “keep out” area can be allocated to a PCB antenna, it is possible to implement a PCB antenna with the same or better performance than a chip antenna but at a much reduced cost.4.2.6BalunsMany of the above antennas mentioned are single-ended and designed to have a feed point impedance close to 50 Ohms. To interface these antennas to a balanced output/input, a device called a balun is required. The balun converts a single ended input to a balanced output together with an optional impedance transformation. The output is differential. That is, the output voltage on each pin is of equal magnitude, but off opposite phase. The output impedance is normally stated differential. That is, measured betweenMiniaturization Trade-offs the two output pins. Because the balun is a discrete device, it is bidirectional. The balanced port can be both input or output.Several discrete circuits are available that perform as baluns. Most of them are sensitive to input and output loading and PCB layout which requires cumbersome fine tuning. And all of these require at least two chip inductors. In the 2.4 GHz band, small ceramic baluns exist which are easy to use and are less sensitive to the PCB layout. Standard output impedances are 50, 100 and 200 Ohms.The cost of a discrete balun is comparable to, or higher than, the ceramic balun, and the ceramic balun requires less board space. Therefore, the ceramic balun is recommended for most designs.To interface with the MC13192/92/93, the standard component 50–200 Ohm balun is recommended. A 50–400 Ohm device provides slightly better performance, but it is not an off-the-shelf device.5Miniaturization Trade-offsAs previously stated, reducing antenna size results in reduced performance. Some of the parameters that suffer are:•Reduced efficiency (or gain)•Shorter range•Smaller useful bandwidth•More critical tuning•Increased sensitivity to component and PCB spread•Increased sensitivity to external factorsAs stated, several performance factors deteriorate with miniaturization, but some antenna types tolerate miniaturization better than others. How much a given antenna can be reduced in size depends on the actual requirements for range, bandwidth, and repeatability. In general, an antenna can be reduced to half its natural size without much impact on performance. However, after a one half reduction, performance gets progressively worse as the radiation resistance drops off rapidly. As a rule, one half the antenna size equals one quarter the radiation resistance. As loading and antenna losses often increase with reduced size, it is clear that efficiency drops off quite rapidly.The amount of loss that can be tolerated depends on the range requirements. Bandwidth also decreases, which causes additional mismatch losses at the band ends. The bandwidth can be increased by resistive loading, but this often introduces even more loss than the mismatch loss. The low bandwidth combined with heavy loading requires a spread analysis to ensure adequate performance with variations in component values and PCB parameters. As shown by these facts, it is often better not to reduce antenna size too much, if board space allows. Even if range requirements do not require optimum antenna performance, production problems and spread are minimized. It is also best to keep some clearance between the antenna and nearby objects. Although the antenna may be retuned to compensate for the loading introduced by the surroundings, tuning becomes more critical, and the radiation pattern can be heavily distorted.Potential Issues6Potential IssuesNumerous things can go wrong with an antenna design. The following list provides a few do’s and don’t’s which may server as a good checklist in a final design. Many of these items seem obvious to the experienced antenna designer, but many of these issues are routinely encountered in practice. This is obviously not a complete list.•Never place ground plane or tracks underneath the antenna•Never place the antenna very close to metallic objects•Be careful about the wiring in the finalized product, not too close to the antenna• A monopole antenna should have a reasonable ground plane to be efficient•Do the final tuning in the end product, not in free air•Never install a chip antenna in a vastly different layout than the reference design, and expect it to work without tuning•Do not use a metallic enclosure or metallized plastic for the antenna•Test the plastic casing for high RF losses, preferably before production•Never do a cut and paste antenna design and expect it to work without testing•Never use low-Q loading components, or change manufacturer without retesting•Do not use very thin PCB tracks, the tracks should be fairly wide7Recommended Antenna DesignsTwo antenna designs are employed for the MC13192/93 hardware.1.Dipole (lowest cost implementation)2.F-antennaHowever, most antenna designs are intended to interface with the usual 50 Ohm industrial standard. This is certainly true for all chip antennas. For interfacing the MC13191/92/93 to a single-ended 50 Ohm antenna, it has been shown that the smallest and most cost-effective solution are two ceramic baluns and an RX/TX switch.The MC13192-EVB, which is included in the MC13193EVK-A00, provides an example of this setup. Users can omit the RX/TX switch and add two chip antennas, but in most cases the switch is less costly than another antenna. Any other 50 Ohm, single ended antenna design can be added if required. This includes among others the F-antenna, monopole, helical, and the usual commercially available chip antennas. The single-port, 50 Ohm solution has the added advantage that by adding a ceramic bandpass filter for improved performance is easy. For a very low cost, low bill of materials (BOM) count solution, users should consider interfacing the antenna(s) directly to MC13191/92/93, and integrate both antennas and matching components into the PCB.This setup does have some unique requirements, due to the input/output requirements of theMC13191/92/93. To achieve a good match to the MC13192/92/93, the antenna should include the following properties:•Balanced designRecommended Antenna Designs•Feedpoint impedance of 2-300 Ohm•Easily loaded to smaller size, with PCB or lumped loading•Provide a DC feed to the TX port•Easy to implement in FR-4 PCBOf the different antenna types, the following are especially suited to interface with the MC13191/MC13192:•Dipoles with gamma match, or folded dipoles•Half or quarter wave loops•The slot antenna may also prove useful in some casesBecause the MC13192/92/93 has separate RX and TX ports, two antennas will eliminate RX/TX switching. The two antennas should ideally be placed at least ¼ wavelength apart to reduce coupling, but due to the low power requirements, closer spacing can be allowed. The following list shows the results from testing with dipole antennas and shows the typical isolation. The values are empirical, and depend somewhat on the surrounding layout etc., but they should provide a reasonable indication of the isolation obtainable.•On each side of a PCB, on top of each other: – 3 to – 4 dB•Very close, on the same side of the PCB: – 6 dB•15 mm apart: – 10 dB•25 mm apart: – 13 dBFor the MC13192/92/93 to show optimum performance, at least 6 dB of TX to RX isolation is required or the ESD protection diodes in the RX input cause some TX power loss and perhaps also increased 3rd harmonic output. However, placing the RX and TX dipoles on top of each other, with only 3 dB of isolation results in the smallest design possible, and only reduces TX power a few dB, which is entirely acceptable in most cases. The RX side works well with any isolation available. When the antennas are very close, the coupling results in some interaction in the tuning of the two antennas. With just a few attempts, users should be able to optimize performance.。
Wide-field fluorescence sectioning with hybrid speckle and uniform-illumination microscopyDaryl Lim,Kengyeh K.Chu,and Jerome Mertz *Department of Biomedical Engineering,Boston University,44Cummington Street,Boston,Massachusetts 02215,USA*Corresponding author:jmertz@ Received May 22,2008;accepted June 13,2008;posted July 14,2008(Doc.ID 96541);published August 6,2008We describe a method of obtaining optical sectioning with a standard wide-field fluorescence microscope.The method involves acquiring two images,one with nonuniform illumination (in our case,speckle)and another with uniform illumination (in our case,randomized speckle).An evaluation of thelocal contrast in the speckle-illumination image provides an optically sectioned image with low resolution.This is complemented with high-resolution information obtained from the uniform-illumination image.A fusion of both images leads to a full resolution image that is optically sectioned across all spatial frequencies.This hybrid illumi-nation method is fast,robust,and generalizable to a variety of illumination and imaging configurations.©2008Optical Society of AmericaOCIS codes:180.1790,180.2520,180.6900.It is well known that standard wide-field fluorescence microscopy does not provide optical sectioning for lat-erally uniform objects (i.e.,dc spatial frequencies)[1].Several strategies have been devised to circumvent this problem,such as scanning confocal or structured illumination microscopies (see [2]and references therein).More recently,a strategy was demonstrated based on dynamic speckle illumination (DSI)[3–5],in which a series of images is acquired of a fluorescent object illuminated with random speckle patterns.Op-tical sectioning is then obtained by simply calculat-ing the contrast of the image fluctuations in time.However,DSI microscopy is slow,since it generally requires several tens of images to produce a final sec-tioned image of reasonable quality.A possible strat-egy to speed up DSI microscopy is to use only a single speckle-illumination image and to calculate image contrast over space rather than time (i.e.,over local resolution areas).However,such a single-shot tech-nique,while fast,exhibits poor resolution.In this Letter,we demonstrate a solution to these problems based on a hybrid double-shot technique that combines a single speckle-illumination (i.e.,non-uniform)image I n with a standard uniform-illumination image I u .In this technique,I n provides low-resolution information that exhibits optical sec-tioning at low spatial frequencies below a user-specified cutoff frequency c ,while I u provides high-resolution information that exhibits optical sectioning above the cutoff frequency c (or crossover frequency).By properly selecting c and fusing low-and high-resolution information,we recover a final full resolution wide-field image that exhibits optical sectioning across the entire imaging bandwidth,in-cluding dc.The setup of our hybrid technique is illustrated in Fig.1and is identical to that used in DSI microscopy.The phase front of a laser beam is randomized on transmission through a diffuser plate,and a result-ant speckle pattern is projected into a sample via a microscope objective.Two fluorescence images are then acquired:one with the diffuser plate fixed ͑I n ͒and another with the diffuser plate in motion ͑I u ͒.In the latter case,the speckle pattern is randomized so rapidly compared with the camera exposure time that I u is equivalent to an image acquired with uni-form illumination.The principle of our hybrid tech-nique is to process both I n and I u to obtain a final op-tically sectioned high-resolution image.As a guide to our discussion,we will refer to Fig.2,which illus-trates the steps along the way.As a first step,we consider I n ͑ជ͒(Fig.2(a)),where ជare the image coordinates.Our goal in processing I n ͑ជ͒will be to derive a low-resolution image that is optically sectioned even for dc frequencies.To thisend we evaluate the local spatial contrast of I n ͑ជ͒,de-fined to beC N ͑ជ͒=͗n ͑ជ͒͘A ͗I n ͑ជ͒͘A ,͑1͒where ͗n ͑ជ͒͘A and ͗I n ͑ជ͒͘A correspond,respectively,to the standard deviation and mean of I n ͑ជ͒as calcu-lated over a mosaic of local resolution areas A (each area assumed to be large enough to encompass sev-eral imaged speckle grains).To gain an intuitive un-Fig.1.(Color online)Microscope layout.A laser beam is sent through a diffuser plate,which is imaged onto the back aperture of the objective.The resultant sample fluo-rescence is imaged onto a CCD camera.Two images are ac-quired:with the diffuser plate stationary (speckle illumina-tion,middle panel),and in rapid motion (uniform illumination,right panel).August 15,2008/Vol.33,No.16/OPTICS LETTERS 18190146-9592/08/161819-3/$15.00©2008Optical Society of Americaderstanding of C N ͑ជ͒,let us first consider a thin uni-form object.In this case,C N ͑ជ͒Ϸ1when the object is in focus (assuming that the illumination speckle pat-tern is fully developed [6],and the imaging resolution is high enough to easily resolve in-focus specklegrains);C N ͑ជ͒→0when the object goes out of focus.If we consider now a thick uniform object,then C N ͑ជ͒thus corresponds to the relative proportion of I n ͑ជ͒that can be interpreted as being in focus.Finally,making use of the uniform-illumination image I u ͑ជ͒,the product C N ͑ជ͒I u ͑ជ͒can be interpreted as extract-ing only the in-focus contribution of I u ͑ជ͒while reject-ing out-of-focus contributions,at least on the coarse spatial scale defined by A .However,an object is nonuniform in general,meaning that in fact two sources contribute to themeasured contrast of I n ͑ជ͒,namely,speckle illumina-tion and variations in the object itself.For our inter-pretation of contrast to be as object-independent as possible,we are interested only in the speckle-induced contrast.That is,we must correct Eq.(1)for any object-induced contrast contributions.To do this,let us examine the variations in I n and I u encom-passed by an arbitrary resolution area A .Defining O ͑ជ͒to be the image intensity obtained from the ac-tual object with a hypothetical uniform unit illumina-tion,and S ͑ជ͒to be the image intensity obtained from a hypothetical uniform unit object with the actual speckle illumination,we may then make the follow-ing approximations:I n ͑ជ͒Ϸ͓͗O ͘A +␦O ͑ជ͔͓͒͗S ͘A +␦S ͑ជ͔͒,͑2͒I u ͑ជ͒Ϸ͓͗O ͘A +␦O ͑ជ͔͒͗S ͘A .͑3͒In Eqs.(2)and (3)͗O ͘A and ͗S ͘A arise from both in-and out-of-focus contributions of the object and illu-mination,whereas ␦O ͑ជ͒and ␦S ͑ជ͒must arise domi-nantly from in-focus contributions,since only these are well resolved [1](the smaller the choice of A ,the more tightly these latter contributions must be in fo-cus).We then obtain the approximationC N 2ϷC O 2+C S 2+C O 2C S 2,͑4͒where C O and C S are,respectively,the contrasts as-sociated with O ͑ជ͒and S ͑ជ͒,as calculated over the resolution area A .Our goal,again,is to derive C S .This is readily accomplished by using Eqs.(1)and(4),and also C O ͑ជ͒=͗u ͑ជ͒͘A /͗I u ͑ជ͒͘A .By performing such a derivation over all resolution areas,we finallyobtain C S ͑ជ͒,which is a coarse-grained,object-independent measure of the relative proportion of I u ͑ជ͒that is in focus.That is,the product I su ͑ជ͒=C S ͑ជ͒͗I u ͑ជ͒͘A provides a low-resolution version of I u ͑ជ͒that is optically sectioned even for dc frequen-cies.To summarize this first step of our algorithm,wehave taken our speckle-illumination image I n ͑ជ͒,and from this we have extracted a speckle-induced con-trast that provides a coarse-grained,optically sec-tioned version of I u ͑ជ͒.It should be noted that the ex-traction of speckle-induced contrast can be further improved with the use of wavelet prefiltering,as de-scribed in detail in [5],which has the effect of en-hancing the rejection of out-of-focus background.Such wavelet prefiltering was applied in practice.We now turn to the second step of our algorithm,which involves recovering higher-resolution informa-tion directly from the uniform-illumination image I u ͑ជ͒.To describe this step,it is more convenient to consider the Fourier transform of I u ͑ជ͒,denoted I u ͑ជ͒,where ជis spatial frequency.We recall that I u ͑ជ͒does not exhibit optical sectioning for =0(i.e.,dc),but does for 0ϽϽmax ,where max is the imag-ing bandwidth defined by the microscope aperture [1].Thus,we specifically extract high-resolution (andtherefore optically sectioned)information from I u ͑ជ͒by applying a high-pass-filter,HP ͑ជ͒,to I u ͑ជ͒with cutoff frequency ជc defined such that HP ͑ជc ͒=1/2.We denote this high-pass-filtered version of I u ͑ជ͒as I hp ͑ជ͒=HP ͑ជ͒I u ͑ជ͒.In practice,we use a Gaussian HP ͑ជ͒.The final step is to perform a fusion of the high-resolution information from I hp ͑ជ͒[where I hp ͑ជ͒is the inverse Fourier transform of I hp ͑ជ͒]with the low-resolution information from I su ͑ជ͒.We begin by con-ditioning I su ͑ជ͒such that its frequency content isex-Fig.2.Hybrid imaging technique applied to a pair of fluo-rescent pollen grains (Carolina Biological Supply)locatedat slightly different depths.a,Speckle-illumination image ͑I n ͒.b,Uniform illumination image ͑I u ͒.c,Intermediate low-pass image ͑I lp ͒.d,Intermediate high-pass image ͑I hp ͒(note:negative values in this panel have been set to zero for ease of presentation).e,Composite full resolution opti-cally sectioned image ͑I ͒.f,Extended focus image obtained from a maximum intensity projection of 80slices separated by 0.5m steps.The illumination source was a 488nm ar-gon laser (ϳ3mW at sample).All images in this paper were acquired with an Olympus 60ϫ0.9NA water-immersion objective and an exposure time of 200ms per image.Panel c was obtained by using sliding resolution areas of size A =7ϫ7pixels,corresponding to ϳ0.5m 2in the sample.1820OPTICS LETTERS /Vol.33,No.16/August 15,2008actly complementary to that of I hp ͑ជ͒.That is,we apply to I su ͑ជ͒the low-pass filter,LP ͑ជ͒,that is complementary to HP ͑ជ͒[i.e.,LP ͑ជ͒=1−HP ͑ជ͒],ob-taining I lp ͑ជ͒=LP ͑ជ͒I su ͑ជ͒,where I su ͑ជ͒is the Fou-rier transform of I su ͑ជ͒.The intermediate images I lp ͑ជ͒and I hp ͑ជ͒are illustrated in Figs.2(c)and 2(d).To combine low-pass and high-pass information such that the transition across c is seamless,wenote that LP ͑ជc ͒=HP ͑ជc ͒=1/2and introduce the scaling factor =͉I hp ͑ជc ͉͒/͉I lp ͑ជc ͉͒,averaged over all angles of ជc .Finally,we define I ͑ជ͒=I lp ͑ជ͒+I hp ͑ជ͒,or,equivalently,I ͑ជ͒=I lp ͑ជ͒+I hp ͑ជ͒.͑5͒I ͑ជ͒is our desired final image,illustrated in Fig.2(e).This image combines both low-and high-frequency information (appropriately scaled)and also exhibits optical sectioning across the entire im-aging bandwidth,including dc.The choice of en-sures that the optical transfer function,OTF ͑ជ,z ͒,as-sociated with our hybrid imaging system varies smoothly across the cutoff frequency when z =0(where z is defocus).To further ensure that there is no abrupt change in the OTF sectioning strength be-tween low and high frequencies,the cutoff frequencywas chosen such that the FWHM of OTF ͑0ជ,z ͒and OTF ͑ជc ,z ͒are about the same.In practice,this means that the cutoff frequency was chosen to bevery roughly ͉ជc ͉Ϸ0.2max .We note that since C S de-pends linearly on fluorophore concentration [3],sodoes I su ͑ជ͒.Moreover,since all further operations on I su ͑ជ͒and I u ͑ជ͒in the construction of I ͑ជ͒are linear,I ͑ជ͒also depends linearly on fluorophore concentra-tion.We emphasize that only two shots,I n ͑ជ͒and I u ͑ជ͒,were required for generating I ͑ជ͒,which in principle can be acquired quite rapidly (in our case,200ms per shot).To demonstrate that our hybrid technique in-deed provides optical sectioning at dc,we imaged a thin,uniform fluorescent plane.Figure 3(a)illus-trates the integrated intensity in I ͑ជ͒as a function of the plane defocus z .The FWHM of the optical sec-tioning trace is 1.6m.The expected scaling law for the optical sectioning trace can be derived following a similar calculation as provided in [5],though this time evaluating speckle contrast in space rather than in time.Based on the Stokseth approximation forOTF ͑ជ,z ͒[7],we obtain a sectioning strength given by ͉z ͉−3/2,which is close to the ͉z ͉−2sectioning strength exhibited by an ideal confocal microscope.To further demonstrate that our hybrid technique in-deed provides high-resolution imaging similar to con-ventional wide-field microscopy,we imaged 1m fluorescent beads on a glass slide.Figures 3(b)and 3(c)exhibit essentially identical resolution (the left-most bead exhibits the same FWHM in both images),the latter outperforming the former owing to a rejec-tion of background fluorescence haze.In summary,we have described a two-shot hybrid imaging technique that combines the advantages of speckle and uniform illumination.Speckle illumina-tion provides low-resolution image structure that ex-hibits optical sectioning even at dc.Uniform illumi-nation provides a complementary high-resolution image structure that also exhibits optical sectioning with a commensurate scaling law as a function of de-focus.The combination of both images thus provides optical sectioning across the full imaging bandwidth,since,in effect,the speckle-illumination image has served to fill in the missing cone present in the fre-quency support of the uniform-illumination image.The advantage of our hybrid technique over DSI mi-croscopy is that it is significantly faster,requiring only two shots rather than several tens of shots,mak-ing it easily amenable to video rate imaging.The ad-vantage over confocal microscopy is its simplicity,ro-bustness,ease of implementation in any wide-field microscope setup,and versatility.For example,the il-lumination can be delivered directly to the sample in-dependently of the imaging optics.As a final note,we point out that our technique of generating a low-resolution optically sectioned image is not restricted to the use of speckle illumination and can be gener-alized to any type of patterned illumination,random (such as speckle)or nonrandom (such as a periodic grid or checkerboard pattern).The crux of our tech-nique is the accurate combination of this low-resolution image with a complementary high-resolution image obtained from uniform illumination.This work was partially supported by the National Institutes of Health (NIH;R21EB007338).References1.N.Streibl,Optik (Stuttgart)66,341(1984).2.J. B.Pawley,Handbook of Biological Confocal Microscopy (Plenum,2006).3.C.Ventalon and J.Mertz,Opt.Lett.30,3350(2005).4.C.Ventalon and J.Mertz,Opt.Express 14,7198(2006).5.C.Ventalon,R.Heintzmann,and J.Mertz,Opt.Lett.32,1417(2007).6.J.W.Goodman,Speckle Phenomena:Theory and Applications (Roberts &Company,2006).7.P .A.Stokseth,J.Opt.Soc.Am.59,1314(1969).Fig.3.a,Integrated signal from a thin fluorescent plane as a function of defocus z .b,Uniform-illumination image of 1m beads (Molecular Probes TetraSpeck Slide B).c,Pro-cessed hybrid image from speckle and uniform illumination.August 15,2008/Vol.33,No.16/OPTICS LETTERS 1821。
TrusignalMicroelectronicsTS2123A/TS2124A TS2223A/TS2224ATS2424A3.3MHz, Rail-to-Rail I/O CMOS Operational AmplifierFeatures• Low Offset Voltage: 1.2mV (typ) • High Gain: 105dB (typ)• High Gain Bandwidth Product: 3.3MHz • Rail-to-rail Input/Output • Low I B : 10pA (typ)• Low supply voltage: +2.7 V to +5.5 V • Low Power Consumption: 260μA at 5 V (per amplifier)•Extended Temperature : -40°C to +125°CApplications• Signal Conditioning• Current Sensor Amplifier• Battery-Powered Applications • Portable Devices • Active Filtering• Weight Scale Sensor•Medical/Industrial Instrumentation •Power Converter/InverterProduct DescriptionThe TS2123A/TS2124A families of products are low noise, low voltage and low power operational amplifiers with a gain-bandwidth product of 3.3MHz and slew rate of 2V/μs . The maximum input offset voltage is only 5mV and the input common mode range extends beyond the supply rails.TS2123A/TS2124A families of operational amplifiers are specified at the full temperature range of −40︒C to +125︒C under single or dual power supplies of 2.7V to 5.5V, however these products will operate under an extended supply range from 2.7V to 5.5V at a reduced temperatures range.The TS2123A and TS2223A have a power-down feature that reduces the supply current to 1μA.SOT23-5TS2124AOUT V-+IN V+-INSOT23-6V-+IN V+-IND +IND V-+INC -INC OUTCV+V+OUT NCNCNCV-Enable SO-8V-V+-INB +INBV- TS2223AV-+INBMicroelectronicsTS2424ADatasheet July 2018 ORDERING INFORMATIONABSOLUTE MAXIMUM RATINGSESD CAUTIONESD (electrostatic discharge) sensitive deviceCharged devices and circuit boards candischarge without detection. Although thisproduct features patented or proprietaryprotection circuitry, damage may occur ondevices subjects to high energy ESD. Therefore,proper ESD precautions should be taken toavoid performance degradation or loss offunctionality.ELECTRICAL CHARACTERISTICS: V S = +2.7V to +5.5V Boldface limits apply over the specified temperature range, T A = −40︒C to +125︒C.At T A = +25︒C, R L = 10kΩ connected to V S/2, and V OUT = V S/2, unless otherwise noted.ELECTRICAL CHARACTERISTICS: V S = +2.7V to +5.5V Boldface limits apply over the specified temperature range, T A= −40︒C to +125︒C.At T A = +25︒C, RL = 10kΩ connected to V S/2, and V OUT = V S/2, unless otherwise noted.TYPICAL CHARACTERISTICSAt T A = +25︒C, R L = 10k Ω connected to V S /2, and V OUT = V S /2, unless otherwise noted.TYPICAL CHARACTERISTICSAt T A = +25︒C, R L = 10k Ω connected to V S /2, and V OUT = V S /2, unless otherwise noted.202530354045505560-50-25255075100125150S h o r t -C i r c u i t C u r r e n t (m A )Temperature (℃)SHORT-CIRCUIT CURRENT vsTEMPERATURE I SC -I SC +0.010.020.030.040.050.060.02.02.53.03.54.04.55.05.5S h o r t -C i r c u i t C u r r e n t (m A )Power-Supply Voltage (V)CONTINUOUS SHORT-CIRCUIT CURRENTvs POWER-SUPPLY VOLTAGEI SC -I SC +20022024026028030022.533.544.555.5Q u i e s c e n t C u r r e n t ( μA )Supply Voltage (V )QUIESCENT CURRENT vs SUPPLY VOLTAGE300400500600700800900-5050100150Q u i e s c e n t C u r r e n t (μA )Temperature (℃)QUIESCENT CURRENT vs EMPERATUREV CC = 5VV CC = 2.5V50m V /d i v400ns/divLARGE-SIGNAL STEP RESPONSEC L =100pF50m V /d i vSMALL-SIGNAL STEP RESPONSE1μs/divC L =200pF-3-2-10123010203040506070O u t p u t V o l t a g e (V )Output Current(mA)OUTPUT VOLTAGE SWING VS OUTPUT CURRENT150℃25℃-55℃0.5u V /d i v0.1 Hz TO 10 Hz NOISE1s/divTYPICAL CHARACTERISTICSAt T A = +25︒C, R L = 10k Ω connected to V S /2, and V OUT = V S /2, unless otherwise noted.-5-4-3-2-1012345Offset Voltage (mV)OFFSET VOLTAGEPRODUCTION DISTRIBUTIONP o p u l a t i o n123456789OFFSET VOLTAGE DRIFT MAGNITUDEPRODUCTION DISTRIBUTIONOffset Voltage Drift (uV/℃)P o p u l a t i o nAPPLICATION NOTESThe TS2123A and TS2124A families of op amps are suitable for a wide range of general-purpose applications. They provide Rail-to-rail input and output. Excellent ac performance makes them well-suited for audio and sensor applications. The input common-mode voltage range includes both rails, allowing the TS2123A and TS2124A families op amps to be used in bipolar and unipolar application. Rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications.Power-supply pins should be bypassed with 0.1 F ceramic capacitors.POWER SUPPLYThe TS2123A and TS2124A families operate from a single +2.5V to +5.5V supply or dual ±1.25V to ±2.75V supplies. For single supply operation, bypass the power supply +VS with a 0.1μF capacitor which should be placed close to the +VS pin. For dual-supply operation, both the +VS and the -VS supplies should be bypassed to ground with separate 0.1μF ceramic capacitors. 2.2μF tantalum capacitor can be added for better performance.The TS2123A and TS2124A families are ideal for battery-powered instrumentation and handheld devices because it can operate at the end of discharge voltage of most popular batteries.Figure1. Amplifier with Bypass Capacitors DRIVING CAPACITIVE LOADSThe TS2123A and TS2124A families can directly drive 1000pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this result in ringing or even oscillation. Applications that require greater capacitive driving capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure2. The isolation resistor R ISO and the load capacitor CL form a zero to increase stability.The bigger the R ISO resistor value, the more stable V OUT will be. Note that this method results in a loss of gain accuracy because R ISO forms a voltage divider with the R LOAD.Figure 2. Indirectly Driving Heavy Capacitive LoadAn improved circuit is shown in Figure 3. It provides DC accuracy as well as AC stability. Rf provides the DC accuracy by connecting the inverting signal with the output. Cf and R ISO serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier’s inverting input, thereby preserving phase margin inthe overall feedback loop.Figure 3. Indirectly Driving Heavy Capacitive Load withDC AccuracyFor non-buffer configuration, there are two other ways to increase the phase margin: (a) by increasing the amplifier’s gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node.TYPICAL APPLICATIONDifference AmplifierFigure 4. Differential AmplifierThe circuit shown in Figure 4 performs the difference function. If the resistor ratios are equal (R4/R3 = R2/R1) then Vout= (Vin2 –Vin1) × R2/R1 + Vref.Low Pass Active FilterFigure 5. Low Pass Active FilterThe low pass filter shown in Figure 5 has a DC gain of (-R2 / R1) and the –3dB corner frequency is 1/2πR2C. Make sure the filter within the bandwidth of the amplifier. The Large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistors value as low as possible and consistent with output loading consideration.Instrumentation AmplifierFigure 6. Instrumentation AmplifierThe circuit in Figure 6 performs the same function as that in Figure 4 but with the high input impedance.REV KY.1.0.1A MECHANICAL DIMENSIONSSOT23-5 PACKAGE MECHANICAL DRAWINGSOT23-5 PACKAGE MECHANICAL DATASOT23-6 PACKAGE MECHANICAL DRAWINGSOT23-6 PACKAGE MECHANICAL DATAMSOP-10 PACKAGE MECHANICAL DRAWINGMSOP-10 PACKAGE MECHANICAL DATATSSOP-14 PACKAGE MECHANICAL DRAWINGTSSOP-14 PACKAGE MECHANICAL DATASO-8 PACKAGE MECHANICAL DRAWINGSO-8 PACKAGE MECHANICAL DATASO-14 PACKAGE MECHANICAL DRAWINGSO-14 PACKAGE MECHANICAL DATADFN-10 PACKAGE MECHANICAL DRAWINGDFN-10 PACKAGE MECHANICAL DATACONTACT INFORMATIONTrusignal MicroelectronicsPhone: +86 512-65923982Fax: +86 512-65923995Email: *********************; *******************。
SECONDARY 5 中五學生只需購買所讀科目的書籍,並且注意書籍的中、英文版本。
Students are required to buy only the books of the subjects they take. ENGLISH LANGUAGE:Start From Term 1 1. HKDSE Exam Skills- Papers 1Reading Volume 1 (Set A) (2012)Cole, Grant,Kent, Neale, Poon,Steward & VowlesOxford INUSE2. HKDSE Exam Skills Paper 2 WritingSet A (2012)So-Shan Au,Christine Bruce,Rachel GrantOxfordINUSE3. Teach & Practise 5 for the HKDSEPaper 3 Listening and Integrated Skills(2013 2nd Edition) (with student CD &data file book)Grace Chan Pilot 167.00 □4. HKDSE Exam Skills Paper 4Speaking Set ACastle, Ng, Pol &SnowOxfordINUSE5. Developing Skills Grammar & UsageSet AC. Harris Aristo INUSE6. Developing Skills for HKDSE- SBA V. Mak, K.S. Yuen Aristo INUSE7.Oxford Essential HKDSE Practicepapers (2013)(Student’s Edition)Cevik, Doig, Grant,Hayhoe, Kishor,Leung, Pilgrim,Poon, Snow,Steward & WooOxford 284.00 □Electives: (For classes 5A & 5C)8. Pilot’s English Series Social Issues Made Easy (with student portfolio) Grace Chan,Diana EsserPilotINUSE9. Longman Activate NSS LearningEnglish through Short Stories(with Learner’s Journal) (2009)Amber King Pearson 150.00 □10. Longman Activate NSS LearningEnglish through WorkplaceCommunication(with Learner’s Journal) (2010) PetuniaKingsleyPearson 150.00□(For 5B only)11. Pilot’s English Series Social IssuesMade Easy (with student portfolio) Grace Chan,Diana EsserPilotINUSE12. Longman Activate NSS LearningEnglish through Poems and Songs(with Learner’s Journal) (2009)Gary Harfitt Pearson 150.00 □ (For 5D only)13. Pilot’s English Series Social IssuesMade Easy Grace Chan,Diana EsserPilotINUSE14. Longman Activate NSS LearningEnglish through Debating(with Learner’s Journal) (2009)John Potter Pearson 150.00 □ 中國語文:上學期用書15. 啟思新高中中國語文第三冊(2014年第二版)布裕民、李孝聰、黃璟瑜等啟思215.00 □16. 新高中中國語文新編選修單元一名著及改編影視作品(2012年第二版)鄺銳強、文英玲、李潔明、阮穎茵香港教育圖書87.00 □下學期用書17.啟思新高中中國語文第四冊(2014年第二版)布裕民、李孝聰、黃璟瑜等啟思215.00 □- 1 -18. 新高中中國語文選修4文化專題探討(2):節慶與倫理(2013年版) 鄺銳強、梁柏鍵培生教育93.00 □中國歷史:上學期用書19. 高中中國歷史五上(2014 第二版)呂振基、王穎芝、姚世外現代173.50 □下學期用書20. 高中中國歷史五下(2014 第二版)呂振基、王穎芝、姚世外現代173.50 □經濟:上學期用書21. 新視野經濟學五上(附溫習必備手冊(加強版)及學生溫習光碟)陳志文、郭偉強、陳繼庭香港教育圖書206.00 □下學期用書22. 新視野經濟學五下(附溫習必備手冊(加強版)及學生溫習光碟)陳志文、郭偉強香港教育圖書206.00 □地理:上學期起用書23. 香港中學文憑新互動地理 C6消失中的綠色樹冠-誰應為大規模砍伐雨林而付出代價? (2014)周玉蓮、麥家斌、蕭偉樂、謝萃輝雅集118.00 □24. 香港中學文憑新互動地理 C7全球增溫-是事實還是虛構? (2014)周玉蓮、麥家斌、蕭偉樂、謝萃輝雅集118.00 □25. 高中活學地理第四冊動態的地球 (2014第二版)葉劍威、林智中、施明輝、黃錦輝、楊錦泉、徐秀銀牛津136.00 □26. 香港中學文憑新互動地理 E2天氣與氣侯 (2014)周玉蓮、麥家斌、蕭偉樂、謝萃輝雅集118.00 □27.高中地理指南葉劍威、林智中、施明輝、黃錦輝、楊錦泉牛津舊生已備MATHEMATICS: Compulsory Part 必修部份Start From Term 1 29. NSS Mathematics in Action(Compulsory Part) Book 5A(With Learning CD-Rom 5A,Revision Handbook 5A, BridgeProgramme S4 to S5, SupplementaryExercise 5A (Enhanced version))P.F. Man,C.M. Yeung,K.Y. Tsui,K.H. YeungLongman 207.00□Start From Term 2 30. NSS Mathematics in Action(Compulsory Part) Book 5B(With Learning CD-Rom 5B,Revision Handbook 5B,Supplementary Exercise 5B(Enhanced version))P.F. Man,C.M. Yeung,K.Y. Tsui,K.H. YeungLongman 207.00□.Extended PartModule 1 – Calculus and StatisticsStart From Term 1 31. NSS Mathematics in Action M1(Calculus and Statistics) Volume 2(with Learning CD-ROM Module 1Vol. 2 and Supplementary ExerciseModule 1 Vol. 2)P.F. Man,C.M. Yeung,W.H. Wong,H.Y. CheungLongman 219.00□生物:- 2 -上學期用書32. *新高中基礎生物學 3(2014年第二版) (生物科適用)容顯懷、何金滿、何沃光、談國軒、湯靈磐牛津279.00 □下學期用書33. 新高中基礎生物學 4(生物科適用)容顯懷、何金滿、何沃光、談國軒、湯靈磐牛津160.00 □*舊版亦可使用CHEMISTRY:Start From Term 1 34. HKDSE Chemistry A Modern ViewBook 3B (2014 2nd Ed.)E. Cheng, J. Chow,Y.F. Chow, A. Kai,S.L. Lee,W.H. WongAristo 184.00□35. HKDSE Chemistry A Modern ViewBook 4A (2014 2nd Ed.)E. Cheng, J. Chow,Y.F. Chow, A. Kai,S.L. Lee,W.H. WongAristo 111.00□Start From Term 2 36. HKDSE Chemistry A Modern ViewBook 4B(2014 2nd Ed.)E. Cheng, J. Chow,Y.F. Chow, A. Kai,S.L. Lee,W.H. WongAristo 164.00□PHYSICS:Start From Term 1 37. NSS Physics in Life 1: Heat and Gases(with Bridging Programme (BIL),Student's CD 1, Last Minute e-Notes1 & Study Guide 1(2nd Ed.))S.S. Tong,H.K. Won,P.K. Kwong,Y.L. WongL.C. LeeLongman 184.00□38. NSS Physics in Life 4A: Electricityand Magnetism (with How to Use aCRO, Student's DVD 4,Last Minutee-Notes 4A, Study Guide 4A (2E) &Supplement 4A: Electrostatics (refinedversion )S.S. Tong,H.K. Won,P.K. Kwong,Y.L. WongL.C. LeeLongman 158.00□Start From Term 2 39. NSS Physics in Life 4B: Electricityand Magnetism (with Last Minutee-Notes 4B, Study Guide 4B (2E) &Supplement 4B: Electromagnetism(refined version)S.S. Tong,H.K. Won,P.K. Kwong,Y.L. WongL.C. LeeLongman 158.00□40. NSS Physics in Life 5: Radioactivityand Nuclear Energy (with Student'sCD 5, Last Minute e-Notes 5 & StudyGuide 5 (2E))S.S. Tong,H.K. Won,P.K. Kwong,Y.L. WongL.C. LeeLongman 106.00□企業、會計與財務概論:上學期用書41. 新高中企業、會計與財務概論(第二版): 基礎個人理財(必修部份)鄭子云朗文135.00 □下學期用書42. 新高中企業、會計與財務概論(第二版): Frank Wood 財務會計 2 (選修部份)(待2015年1月出版後學校集體訂購)盧志聰、Frank Wood朗文待定資訊及通訊科技:上學期用書43. 新高中資訊及通訊科技選修部分A1 (數據庫) [附學習光碟 1 及校本評核解讀 1 (修訂版)] (2010)黃少強、湯錦明、鄭志成朗文181.00 □下學期用書44. 新高中資訊及通訊科技選修部分A2 (數據庫) [附學習光碟 2 及校本評核解讀 2 (修訂版)] (2010)黃少強、湯錦明、鄭志成朗文181.00 □- 3 -旅遊與款待:45.容後公佈參考用書家長暫時無需購買,待開學後通知ENGLISH LANGUAGE:46. Longman Dictionary of ContemporaryEnglish (English-Chinese) (4th Ed.)(Pocket Size) (With DVD-Rom) LongmanINUSE中國語文:47.朗文中文新詞典(標準版)(第三版) (隨書附送全文光碟) 朗文舊生已備通識教育:48.雅集新高中通識教育系列單元五公共衛生 (2014年第二版) 【內含學生網上應試錦囊啟動密碼】陳詩鈴雅集208.00□地理:49.袖珍世界地圖集 (2009年版) 齡記舊生已備視覺藝術:50.高中視覺藝術評賞—視覺形式表達主題李桂芳精工157.50□- 4 -。
新西兰Evergreen常青树醒脑素新西兰evergreen常青树醒脑素成分表松树皮精华简介松树皮精华就是松树皮提取物,最强大的纯天然抗衰老物质。
其中所含近40多种成分,包含生物类黄酮、有机酸及其他存有生物活性的成分,其中前花青素约占到80%,黄杉素、儿茶酚和表中儿茶酚约占到10%,有机酸约占到8%,其余2%左右的成份为葡萄糖和上述酚酸的葡萄糖酯。
它所含高效率的有机抗氧化剂,比如,很大的前花青素分子(生物类黄酮)和较小的,例如儿茶酚、表中儿茶素和有机酸这样的小分子。
这些分子的大小差异使这些抗氧化剂既能够渗透到至细胞内部,又能随其血流循环维护细胞的外部,在自由基还没能已经开始反击人体非政府之前将它们歼灭。
松树皮精华中所不含的众多抗氧化性复合物的分子大小各不相同,可以在相同的时间段有效地促进作用于人体的相同部位。
很大的前花青素在血流中非常有效率,而较小的类黄酮分子和有机酸可以随时步入人体细胞的内部。
产品特点evergreen常青树醒脑素中不仅所含松树皮精华,还重新加入了深海鱼油,深海鱼油中多样的dha(又称“脑黄金”)能转化成大脑神经体质,提升大脑的反应速度,另外深海鱼油还能够供给大脑充裕的氧气,有利于提升自学效率。
evergreen常青树醒脑苏适用人群:自学压力小,用脑过度的学生;工作压力小,用脑量小的上班族;记忆力消退,易怒的老年人;松树皮药理作用(1)抗氧化性、去除自由基、防治老年痴呆原花青素低聚体在生理环境下具有高效抗氧化性,,它在低浓度的时候就能保护机体,使之免遭受自由基的损害。
松树皮提取的原花青素低聚物抗氧化活性是维生素e的50倍,是维生素c的20倍。
原花青素低聚体不仅能够清楚自由基,而且帮助保存和再生维生素c、维生素e同时,能通过制造弹性蛋白和胶原纤维加固毛细血管壁,从而进一步防御自由基的侵蚀。
原花青素低聚间有较好的抗辐射生物活性,其机理可能将与遏制脂质过氧化和去除电磁辐射产生的内源性自由基有关。