BAT750-GS18中文资料

常见问题汇总一、环境问题1、GS3.5 登陆系统后，打开各个菜单，均出现报错情况问题描述：GS3.5 登陆系统后，打开各个菜单，均出现报错情况，见以下图片：产生原因：未启用父路径解决方案：IIS中找到cwbase----右键-----属性------配置-----‘启用父路径’，把这个选项选中，然后重启IIS，重新登陆客户端即可。

2、重新安装IIS 后，注册ASP的方法：问题描述：重新安装IIS 后，注册ASP的方法解决方案：GS5.0使用aspnet2.0版本，需要执行以下的命令：（dos下逐级进入该路径）C:\WINDOWS\\Framework\v2.0.50727\aspnet_regiis.exe -i输入：aspnet_regiis -i 执行后，重启IIS ，即可3、安装GS52IIS未装全报错问题描述：解决方案：安装IIS:Win2008IIS系统内置，需要在服务管理器添加角色。

把IIS里选项都选上安装。

4、2008安装后登陆gs软件报错问题描述：2008安装gs软件后报错，如下图HTTP 错误404.3 - Not Found由于扩展配置问题而无法提供您请求的页面。

如果该页面是脚本，请添加处理程序。

如果应下载文件，请添加MIME 映射。

解放方案：设置IIS：1、把应用程序池的托管管道模式调成经典，并启用32位模式2、cwbase aspnet启用父路径3、cwbase 身份验证匿名访问用户administrator 并启用aspnet5、Win2008下数据库创建报错问题描述：win2008下数据库创建报错解决方案：1右键点击数据库所在的文件夹，2点击属性，在常规选项卡中点击高级，3在弹出的窗口中的压缩或加密属性中去掉压缩内容或者节省磁盘空间，点击确定4点击应用，勾选应用于该文件夹所有文件即可。

6、win2008下GS5.2补丁升级提示COM+关闭失败问题描述：win2008下gs5.2补丁升级提示com+关闭失败产生原因：Win7下GS5.0.1卸载时，COM+组件服务Genersoft_ZW卸载、删除失败。

具栏上图标却操作，请按工具栏上图标7.2.3.1 编辑选项：单击菜单栏或工具栏中的“编辑”将会弹操作选项：冷却选项：新建选项：打开选项：保存选项：选项：“前一个”选项：“下一个”选项：“最后一个”选项：项：“解除报警”选项：：日历选项：；用户设置选项：锁键盘选项：登录系统选项：指示灯测试选项：:: 报警窗口：温度曲线测试窗口：N F BL 1R L 2O NL 3S T O N7R 2R 1M CT 2S 2S 1T 16O N O N O N L 2L 1NL 3L 1L 2NL 3电源765O N O N O N 4O N O N O N 3O N O N O N 2O N O N O N阎建华未注公差按 I T 12 执行蜂鸣器5C H E C K E DD E S I G N4D R A W NP C B回流焊底板布置图D W G N O .(S U B -D I R F I LE N A M E )D A T E02/25/01D A T E图号3D A T E材料M A T LG S \E L E \1221DCBS C A L E比例AP C S1件数T RJ P 11回流焊插卡跳线图D W G N O .(S U B -D I R F I LE N A M E )6210HJ P G 5J P C 58J P G 2J P C 2J P G 0J P C 0J P G 1J P C 1J P G 3J P C 3J P G 4J P C 47J P G 6J P C 6J P G 7J P C 7S W -D I P 64J P F O N 132653240H 12A 9J P 11J P G 2J P C 25J P G 0J P C 0J P G 1J P C 14J P G 5J P C 5J P G 3J P C 3J P G 4J P C 4J P G 6J P C 6J P G 7J P C 7S W -D I P 64J P F O N 132244H 312A 956J P 11230H32J P C 1J P G 1J P G 0J P C 0J P G 2J P C 2J P G 4J P C 4J P G 3J P C 3J P G 5J P C 5J P FS W -D I P 6O N 321546248H312A 96A 287D A T ED E S I G N阎建华A 2260HK J 1K J 2K J 3K124365K J 487A 2未注公差按 I T 12 执行5402/25/01D A T ED A T EC H E C K E DD R A W N3M A T L图号材料21J P G 7J P C 7J P G 6J P C 6DCBAS C A L EP C SG S \E L E \11件数比例1270H8765432187654321ABCD调速马达接线图图号D W G N O .(S U B -D I R F I L E N A M E )材料M A T LS C A L E比例件数P C SD E S I G ND A T EC H E C K E DD A T ED R A W ND A T E未注公差按 I T 12 执行阎建华2001.06.20G S \E L E \15W （白）G Y (灰)B (黑)。

Document Number: 51027For technical questions, contact: sfer@T18Vishay Sfernice3/4" Rectangular Multi-Turn Cermet TrimmerFEATURES•Industrial Grade •0.50 W at 70 °C •MIL-R-22097•Tests according to CECC 41 000DIMENSIONS in millimetersT18* to be measured at base levelSHAFTCIRCUIT DIAGRAMTolerances unless otherwise specified ± 0.5 For technical questions, contact: sfer@Document Number: 51027T18Vishay Sfernice3/4" Rectangular Multi-Turn Cermet TrimmerMECHANICAL SPECIFICATIONSMechanical Travel18 turns ± 5Operating Torque (max. Ncm)2End Stop Torque clutch action Unit Weight (max. g) 1Wiper (actual travel) positioned at approx. 50 %ENVIRONMENTAL SPECIFICATIONSTemperature Range - 55 °C to + 125 °C Climatic Category 55/125/56Sealingfully sealed container IP67POWER RATING CHARTELECTRICAL SPECIFICATIONSResistive Elementcermet Electrical Travel 15 turns ± 1Resistance Range 10 Ω to 2.2 M ΩStandard series E3 1 - 2.2 - 4.7 and 1 - 2 - 5Tolerance Standard ± 10 %On Request ± 5 %Power RatingLinear 0.50 W at + 70 °C Logarithmicnot applicableTemperature CoefficientSee Standard Resistance Element TableLimiting Element Voltage (Linear Law)250 V Contact Resistance Variation 2 % Rn or 1 ΩEnd Resistance (Typical) 1 Ω Dielectric Strength (RMS)1000 V Insulation Resistance (500VDC)106 M ΩPERFORMANCETESTSCONDITIONSTYPICAL VALUES AND DRIFTSΔRTRT (%)ΔR 1-2R 1-2(%)Load Life1000 hours at rated power90'/30' - ambient temp. 70 °C ± 1 %± (3 % + 5 Ω)Contact res. variation: < 3 % Rn Climatic SequencePhase A dry heat 125 °C Phase B damp heat Phase C cold - 55 °CPhase D damp heat 5 cycles± 0.5 %± 1 %Long Term Damp Heat56 days ± 0.5 %± 1 %Dielectric strength: 1000 V RMS Insulation resistance: > 104 M ΩRapid Temperature Change 5 cycles- 55 °C at + 125 °C ± 0.5 %ΔV 1-2V 1-3≤ ± 1 %Shock50 g at 11m secs 3 successive shocks in 3 directions ± (0.2 % + 3 Ω)± 0.3 %Vibration 10 - 55 Hz 0.75 mm or 10 g during 6 hours ± 0.2 %ΔV 1-2V 1-3≤ ± 0.3 %Rotational Life200 cycles± (2 % + 3 Ω)Contact res. variation: < 2 % RnDocument Number: 51027For technical questions, contact: sfer@T183/4" Rectangular Multi-Turn Cermet TrimmerVishay SferniceMARKINGPrinted :- VISHAY trademark - model - style- ohmic value (in Ω, k Ω, M Ω)- manufacturing date - marking of terminal 3STANDARD RESISTANCE ELEMENT DATASTANDARD RESISTANCE VALUESLINEAR LAWTYPICAL TCR - 55 °C + 125 °C MAX.POWER AT 70 °CMAX.WORKING VOLTAGEMAX. WIPER CUR.ΩW V mA ppm/°C1022471002204701K 2K24K710K22K 47K 100K 220K 470K 1M0.50.50.50.50.50.50.50.50.50.50.50.50.50.280.130.062.243.324.857.0710.515.322.433.248.570.71051532242502502502241511037148332215107.14.83.32.21.10.50.3± 100PACKAGING- In tube of 25 pieces, code “TU25”ORDERING INFORMATIONT18SERIES10 k ΩOHMIC VALUE± 10 %TOLERANCETU25PACKAGING e3LEAD FINISH TU25: Tubee3: pure SnDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

bat18参数
BAT18是一款高速开关二极管，具有快速开关速度和低反向漏电流的特点。

它是一种PN结型二极管，由于其特殊的结构和材料，使其具有较高的反向电压和较低的反向漏电流，因此被广泛应用于高频电路中。

BAT18的主要参数包括最大反向电压、最大正向电流、反向漏电流、正向压降等。

其中，最大反向电压为50V，最大正向电流为200mA，反向漏电流为1μA，正向压降为0.55V。

这些参数决定了BAT18在电路中的使用范围和性能表现。

BAT18的封装形式有SOT-23和SOD-123两种，其中SOT-23封装的BAT18体积较小，适用于高密度电路板的应用；SOD-123封装的BAT18则更适合手工焊接和维修。

BAT18的应用范围广泛，主要用于高频电路中的整流、检波、混频、放大等功能。

例如，在手机、无线电、雷达、卫星通信等领域中，BAT18被广泛应用于射频前端电路中的信号处理和放大。

总之，BAT18作为一款高速开关二极管，具有快速开关速度和低反向漏电流的特点，被广泛应用于高频电路中。

其主要参数包括最大反向
电压、最大正向电流、反向漏电流、正向压降等，这些参数决定了BAT18在电路中的使用范围和性能表现。

在实际应用中，我们需要根据具体的电路需求选择合适的BAT18型号和封装形式，以达到最佳的性能表现。

[ 2 YEAR WARRANTY ]• 1000 Watts peak power • UL, CSA and VDE approved • Three or four floating outputs • Single wire parallelability• Meets FCC and VDE0871A conducted noise • System control signalsThe XL750 is a systems-oriented power supply that delivers 750 Watts through a high power main output module and two to four auxiliary modules. All modules offer floating outputs which can be configured as either positive or negative. Proportional drive makes the XL750 more reliable and efficient than conventional units. This feature also saves space and weight and reduces parts count. The XL750’s current mode control permits easy parallelling of power supplies, reduces transient response time and improves reliability. XL750 Series power supplies are ideal for general industrial applications where high peak power capabilities are required.SPECIFICATIONAll specifications are typical at nominal input, full load at 25°C unless otherwise statedPAGE 1ALL DIMENSIONS IN INCHES (mm)987654321O.V .P .DIS PARALLEL GND KEY A.T.W.P .F .D.GND FAULTOUT OKJ1987654321INHO.P .V .TRIGKEYIMONJ2OUTPUT B, C, D, & EPin-out and connector dataA Main output (A) studs (5/16-18).B Main output (A) sense connector is Molex 22-05-3021.Mating connector is Molex 22-01-2025 with Molex 08-50-0114Crimp terminals.C Auxiliary output terminal block is Kulka 4591A-02.D Auxiliary sense connector is Molex 22-05-3021.E External control interface connector is Molex 03-06-1091.Mating connector is Molex 03-06-2092 and 02-06-2103 with 02-06-1103loaded in key position.F Safety ground (8/32 stud).G AC input via 8/32 screw terminals.H For a full set of specifications on the XL750, containing details of allcontrol and interface signals contact Computer Products or your local distributorFor greatest reliability fan rotation axis should be horizontalNotes1The main output (A) on all models is a switching output. All other outputs are linear modules.2For a full set of specifications on the XL750, containing details of all control and interface signals, contact Computer Products or your local distributor.3 5 min. at 0.015” displacement, 8-56Hz, each axis with 2G dwell test on major resonances.4Internal fan, air drawn through rear fan, exhausted through front.5This product is only for inclusion by professional installers within other equipment and must not be operated as a stand alone product.International Safety Standard ApprovalsVDE0806/IEC380 Reg. File No. 1237UL478 File No. E131987CSA Bulletin No. 1402C, File No. 41062C/LR101320PAGE 2Data Sheet © Artesyn Technologies ®2000The information and specifications contained in this data sheet are believed to be correct at time of publication. However, Artesyn Technologies accepts no responsibility for consequences arising from printing errors or inaccuracies. Specifications are subject to change without notice.No rights under any patent accompany the sale of any such product(s) or information contained herein.。

影响棕色脂肪组织产热活性因素的研究进展袁慧琦;侯少贞【摘要】全球性肥胖流行问题愈发严峻，而脂肪组织本身可能是解决这个问题的关键。

人和哺乳动物体内存在两种脂肪组织，发挥着截然相反的作用。

与白色脂肪组织存储机体过剩的能量不同，棕色脂肪组织中存在独特的解偶联蛋白，能将脂肪酸氧化磷酸化，释放热能，增加能量消耗。

因此，通过激活棕色脂肪组织产热，加速体内储存的脂质氧化磷酸化，成为了一种新的预防和治疗肥胖的手段。

论文阐述影响棕色脂肪产热活性的因素以及相关机制，旨在为肥胖的治疗提供新的思路和方向。

%The global obesity epidemic is increasingly serious,while the adipose tissue itself may be the key to solving it.There are two types adipose tissue in human and mammals,and they play opposite roles.Un-like white adipose tissue stores excess energy,brown adipose tissue has unique uncoupling protein,so it can oxidative phosphorylate fatty acid,then release heat,and increase energy consumption.Therefore,it be-comes a new means to prevent and treat obesity by activiting brown adipose tissue thermogenesis,then speeding the oxidative phosphorylation of fat.In present review,we explicated the factors that affect brown adipose tissue thermogenesis activity and related mechanisms,aiming at providing a new method and direction for the treatment of obesity.【期刊名称】《动物医学进展》【年(卷),期】2016(037)010【总页数】6页(P98-102,103)【关键词】肥胖;棕色脂肪组织;产热;解偶联蛋白 1【作者】袁慧琦;侯少贞【作者单位】广州中医药大学，广东广州 510006;广州中医药大学，广东广州510006【正文语种】中文【中图分类】S852.21肥胖及其相关代谢疾病已经成为了一个全球性的问题。

国电南自Q/GDNZ.JB101-2011SG B750数字式母线保护装置(智能站)说明书国电南京自动化股份有限公司GUODIAN NANJING AUTOMATION CO.，LTD安全声明为保证安全、正确、高效地使用装置，请务必阅读以下重要信息：1.装置的安装调试应由专业人员进行；2.装置上电使用前请仔细阅读说明书。

应遵照国家和电力行业相关规程，并参照说明书对装置进行操作、调整和测试。

如有随机材料，相关部分以资料为准；3.装置上电前，应明确连线与正确示图相一致；4.装置应该可靠接地；5.装置施加的额定操作电压应该与铭牌上标记的一致；6.严禁无防护措施触摸电子器件，严禁带电插拔模件；7.接触装置端子，要防止电触击；8.如要拆装装置，必须保证断开所有地外部端子连接，或者切除所有输入激励量。

否则，触及装置内部的带电部分，将可能造成人身伤害；9.对装置进行测试时，应使用可靠的测试仪；10.装置的运行参数和保护定值同样重要，应准确设定才能保证装置功能的正常运行；11.改变当前保护定值组将不可避免地要改变装置的运行状况，在改变前应谨慎，并按规程作校验；12.装置操作密码为：99。

版本声明产品说明书版本修改记录表1098 V1.07I 国网版装置系列化(智能站) V2.00G(I) 2011-057 V1.07 增加死区事件功能,增加故障详细信息功能V2.00G，V2.00G（XX）2010-046 V1.06 根据最新国网试验做相应修改V1.06g，V1.07g 2009-065 V1.05 根据国网标准做相应修改V1.05 2009-034 V1.04 增加IEC61850及数字化变电站部分V1.02 2008-013 V1.03 内容细化，便于理解V1.02 2007-102 V1.02 V1.0 2005-91 V1.01 V1.0 2004-12 序号说明书版本号修改摘要软件版本号修改日期* 技术支持电话：（025）51183084 51183086传真：（025）51183154* 本说明书可能会被修改，请注意核对实际产品与说明书的版本是否相符* 2011年05月第7版第1次印刷目录1 概述 (1)1.1适用范围 (1)1.2保护功能配置 (1)1.3原理特点 (1)1.4辅助功能及结构特点 (2)2 技术数据 (3)2.1额定电气参数 (3)2.2主要技术性能及指标 (3)2.3大气条件 (4)2.4电磁兼容性试验 (4)2.5绝缘和耐湿热性能 (5)2.6机械性能 (5)3 硬件说明 (6)3.1硬件结构说明 (6)3.2外部连接 (6)4 保护原理 (8)4.1母线差动保护 (8)4.2母联（分段）断路器失灵和盲区保护 (18)4.3自动识别充电状态功能 (21)4.4断路器失灵保护 (22)4.5复合电压闭锁与PT断线判别功能 (27)4.6双母线运行方式识别功能 (28)4.7母联（分段）充电过流保护 (30)4.8母联（分段）非全相保护 (31)4.9双A/D逻辑 (31)5 保护配置说明 (33)5.1母联兼旁路 (33)5.2旁路兼母联 (34)5.3母线兼旁路 (36)5.4双母线单分段（双母线三分段） (37)5.5双母线双分段 (38)6 保护整定说明 (40)6.1电流折算 (40)6.2保护整定项目及原则 (40)6.3整定值清单 (43)附录2：装置背板图及虚端子 (54)附录3：装置人机界面及菜单结构 (64)附录4：装置调试与运行 (72)附录5：SG B750装置支持的IEC 61850标准 (76)1 概述我公司针对110kV-750kV电力系统的特点，结合二十多年来在各电压等级母线保护领域内的理论研究成果及成功的现场运行实践经验，提出并采用一整套母线保护新判据，在全新的EDP-01嵌入式系统平台基础上开发研制成SG B750系列数字式母线保护装置。

BAT54-V/54A-V/54C-V/54S-VDocument Number 85508Rev. 1.7, 16-Oct-06Vishay Semiconductors1Small Signal Schottky Diodes, Single & DualFeatures•These diodes feature very low turn-on voltage and fast switching •These devices are protected by a PN junction guard ring against excessive volt-age, such as electrostatic discharges •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECMechanical DataCase: SOT23 Plastic case Weight: approx. 8.8 mgPackaging Codes/Options:GS18/10 k per 13" reel (8 mm tape), 10 k/box GS08/3 k per 7" reel (8 mm tape), 15 k/boxParts TableAbsolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Device on fiberglass substrate, see layout on next page.PartOrdering codeT ype MarkingRemarks BAT54-V BAT54-V -GS18 or BAT54-V -GS08L4Tape and Reel BAT54A-V BAT54A-V -GS18 or BAT54A-V -GS08L42Tape and Reel BAT54C-V BAT54C-V -GS18 or BAT54C-V -GS08L43Tape and Reel BAT54S-VBAT54S-V -GS18 or BAT54S-V -GS08L44Tape and ReelParameterT est condition Symbol V alue Unit Repetitive peak reverse voltage V RRM 30V Forward continuous current I F 2001)mA Repetitive peak forward current I FRM3001)mA Surge forward current current t p < 1 s I FSM 6001)mA Power dissipationP tot230mW 2Document Number 85508Rev. 1.7, 16-Oct-06BAT54-V/54A-V/54C-V/54S-VVishay Semiconductors Thermal CharacteristicsT amb = 25°C, unless otherwise specified1)Device on fiberglass substrate, see layout on next page.Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedLayout for R thJA testThickness:Fiberglass 1.5 mm (0.059 in.)Copper leads 0.3 mm (0.012 in.)ParameterT est condition Symbol V alue Unit Thermal resistance junction to ambiant air R thJA 4301)K/W Junction temperature T j 125°C Storage temperature rangeT stg- 65 to + 150°CParameterTest conditionSymbol Min Typ.MaxUnit Reverse Breakdown voltage I R = 100 µA (pulsed)V (BR)30V Leakage current Pulse test t p < 300 µs, δ < 2 % at V R = 25 VI R 2µA Forward voltageI F = 0.1 mA, t p < 300 µs, δ < 2 %V F 240m V I F = 1 mA, t p < 300 µs, δ < 2 %V F 320m V I F = 10 mA, t p < 300 µs, δ < 2 %V F 400m V I F = 30 mA, t p < 300 µs, δ < 2 %V F 500m V I F = 100 mA, t p < 300 µs, δ < 2 %V F 800m V Diode capacitance V R = 1 V , f = 1 MHz C D 10pF Reverse recovery timeI F = 10 mA to I R = 10 mA,i R = 1 mA, R L = 100 Ωt rr5nsBAT54-V/54A-V/54C-V/54S-VDocument Number 85508Rev. 1.7, 16-Oct-06Vishay Semiconductors3Typical CharacteristicsT amb = 25°C, unless otherwise specifiedFigure 1. Typical Forward V oltage Forward Current at V ariousTemperaturesFigure 2. Diode Capacitance vs. Reverse V oltage V RFigure 3. Typical V ariation of Reverse Current at V ariousTemperatures 4Document Number 85508Rev. 1.7, 16-Oct-06BAT54-V/54A-V/54C-V/54S-V Vishay SemiconductorsPackage Dimensions in mm (Inches): SOT23BAT54-V/54A-V/54C-V/54S-VDocument Number 85508Rev. 1.7, 16-Oct-06Vishay Semiconductors5Ozone Depleting Substances Policy StatementIt is the policy of V ishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. V arious national and international initiatives are pressing for an earlier ban on these substances.V ishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.V ishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use V ishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify V ishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.V ishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

1 echo 和@回显控制命‎令@ #关闭单行回‎显echo off #从下一行开‎始关闭回显‎@echo off #从本行开始‎关闭回显。

一般批处理‎第一行都是‎这个echo on #从下一行开‎始打开回显‎echo #显示当前是‎echo off 状态还是echo on 状态echo. #输出一个"回车换行"，一般就是指‎空白行echo hello‎world‎ #输出hel‎l o world‎"关闭回显"是指运行批‎处理文件时‎，不显示文件‎里的每条命‎令，只显示运行‎结果批处理‎开始和结束‎时，系统都会自‎动打开回显2 error‎l evel‎程序返回码‎echo %error‎l evel‎%每个命令运‎行结束，可以用这个‎命令行格式‎查看返回码‎用于判断刚‎才的命令是‎否执行成功‎默认值为0‎，一般命令执‎行出错会设‎error‎l evel‎为13 dir显示‎目录中的文‎件和子目录‎列表dir #显示当前目‎录中的文件‎和子目录dir /a #显示当前目‎录中的文件‎和子目录，包括隐藏文‎件和系统文‎件dir c: /a:d #显示C盘当前目录‎中的目录dir c:\ /a:-d #显示C 盘根目录中‎的文件di‎r d:\mp3 /b/p #逐屏显示d:\mp3 目录里的文‎件，只显示文件‎名，不显示时间‎和大小dir *.exe /s显示当前‎目录和子目‎录里所有的‎.exe文件‎其中* 是通配符，代表所有的‎文件名，还一个通配‎符? 代表一个任意字母或‎汉字如c*.* 代表以c 开头的所有‎文件?.exe 代表所有文‎件名是一个‎字母的.exe文件‎如果指定的‎目录或文件‎不存在，将返回 error‎l evel‎为1;每个文件夹‎的dir 输出都会有‎2个子目录‎. 和... 代表当前目‎录.. 代表当前目‎录的上级目录dir . #显示当前目‎录中的文件‎和子目录dir .. #显示当前目‎录的上级目‎录中的文件‎和子目录其它参数可‎参考dir /?4 cd更改当‎前目录cd mp3 #进入当前目‎录中的mp‎3目录cd .. #进入当前目‎录中的上级‎目录cd\ #进入根目录‎cd #显示当前目‎录cd /d d:\mp3 #可以同时更‎改盘符和目‎录cd "Docum‎e nts and Setti‎n gs"\All users‎文件名带空‎格，路径前需要‎加上引号！！如果更改到‎的目录不存‎在，则出错返回 error‎l evel‎=15 md创建目‎录md abc #在当前目录‎里建立子目‎录abcmd d:\a\b\c #如果d:\a 不存在，将会自动创‎建6 rd删除目‎录rd abc #删除当前目‎录里的abc 子目录，要求为空目‎录rd /s/q d:\temp #删除d:\temp 文件夹及其‎子文件夹和‎文件，不需要按Y 确认7 del删除‎文件del d:\test.txt #删除指定文‎件，不能是隐藏‎、系统、只读文件del *.*删除当前目‎录里的所有‎文件，不包括隐藏‎、系统、只读文件，要求按Y 确认del /q/a/f d:\temp\*.*删除d:\temp 文件夹里面‎的所有文件‎，包括隐藏、只读、系统文件，不包括子目‎录del /q/a/f/s d:\temp\*.*删除d:\temp 及子文件夹‎里面的所有‎文件，包括隐藏、只读、系统文件，不包括子目‎录8 ren文件‎重命名ren 1.txt 2.bak #把1.txt 更名为2.bakren *.txt *.ini #把当前目录‎里所有.txt文件‎改成.ini文件‎ren d:\temp tmp #支持对文件‎夹的重命名‎9 cls清屏‎10 type显‎示文件内容‎type c:\b oot.ini #显示指定文‎件的内容，程序文件一‎般会显示乱‎码type *.txt #显示当前目‎录里所有.txt文件‎的内容11 copy拷‎贝文件copy c:\test.txt d:\复制c:\test.txt 文件到d:\copy c:\test.txt d:\test.bak复制‎c:\test.txt 文件到d:\ ，并重命名为‎test.bakcopy c:\*.*复制c:\ 所有文件到‎当前目录，不包括隐藏‎文件和系统‎文件不指定‎目标路径，则默认目标‎路径为当前‎目录copy con test.txt从屏‎幕上等待输‎入，按C trl+Z 结束输入，输入内容存‎为test‎.txt文件‎c on代表‎屏幕，prn代表‎打印机，nul代表‎空设备copy 1.txt + 2.txt 3.txt合并‎1.txt 和2.txt 的内容，保存为3.txt 文件如果不‎指定3.txt ，则保存到1.txtcopy test.txt +复制文件到‎自己，实际上是修‎改了文件日‎期12 title‎设置cmd‎窗口的标题‎title‎新标题 #可以看到c‎m d窗口的‎标题栏变了‎13 ver显示‎系统版本14 label‎和vol设置‎卷标vol #显示卷标label‎ #显示卷标，同时提示输‎入新卷标label‎c:syste‎m #设置C盘的‎卷标为 syste‎m15 pause‎暂停命令运行该命令‎时，将显示下面‎的消息：请按任意键‎继续 . . .一般用于看‎清楚屏幕上‎显示的内容‎16 rem 和::注释命令注释行不执‎行操作17 date 和time日‎期和时间date #显示当前日‎期，并提示输入‎新日期，按"回车"略过输入date/t #只显示当前‎日期，不提示输入‎新日期time #显示当前时‎间，并提示输入‎新时间，按"回车"略过输入time/t #只显示当前‎时间，不提示输入‎新时间18 goto 和:跳转命令:label‎ #行首为:表示该行是‎标签行，标签行不执‎行操作goto label‎ #跳转到指定‎的标签那一‎行19 find (外部命令)查找命令find "abc" c:\test.txt在c:\test.txt 文件里查找‎含abc 字符串的行‎如果找不到‎，将设 error‎l evel‎返回码为1‎find /i "abc" c:\test.txt查找‎含abc 的行，忽略大小写‎find /c "abc" c:\test.txt显示‎含abc 的行的行数‎20 more (外部命令)逐屏显示more c:\test.txt #逐屏显示c:\test.txt 的文件内容‎21 tree显‎示目录结构‎tree d:\ #显示D盘的‎文件目录结‎构22 &顺序执行多‎条命令，而不管命令‎是否执行成‎功c: & cd\ & dir /w相当于把‎下面3行命‎令写到1行‎去了c:cd\dir /w23 &&顺序执行多‎条命令，当碰到执行‎出错的命令‎后将不执行‎后面的命令‎f: && cd\ && dir >c:\test.txt注意‎如果f盘不‎存在，那么后面2‎条命令将不‎会执行find "ok" c:\test.txt && echo 成功如果找‎到了"ok"字样，就显示"成功"，找不到就不‎显示24 ||顺序执行多‎条命令，当碰到执行‎正确的命令‎后将不执行‎后面的命令‎find "ok" c:\test.txt || echo 不成功如果‎找不到"ok"字样，就显示"不成功"，找到了就不‎显示25 |管道命令前一个命令‎的执行结果‎输出到后一‎个命令dir *.* /s/a | find /c ".exe"管道命令表‎示先执行dir 命令，对其输出的‎结果执行后‎面的find 命令该命令‎行结果：输出当前文‎件夹及所有‎子文件夹里‎的.exe文件‎的个数type c:\test.txt|more这‎个和more c:\test.txt 的效果是一‎样的26 > 和>>输出重定向‎命令> 清除文件中‎原有的内容‎后再写入>> 追加内容到‎文件末尾，而不会清除‎原有的内容‎主要将本来‎显示在屏幕‎上的内容输‎出到指定文件‎中指定文件‎如果不存在‎，则自动生成‎该文件echo hello‎world‎>c:\test.txt生成‎c:\test.txt文件‎，内容为he‎l lo world‎这个格式在‎批处理文件‎里用得很多‎，可以生成.reg .bat .vbs 等临时文件‎type c:\test.txt >prn屏幕‎上不显示文‎件内容，转向输出到‎打印机echo hello‎world‎>con在屏‎幕上显示h‎e llo world‎，实际上所有‎输出都是默‎认>con 的copy c:\test.txt f: >nul拷贝‎文件，并且不显示‎"文件复制成‎功"的提示信息‎，但如果f盘‎不存在，还是会显示‎出错信息copy c:\test.txt f: >nul 2>nul不显‎示"文件复制成‎功"的提示信息‎，并且f盘不‎存在的话，也不显示错‎误提示信息‎echo ^^W ^> ^W>c:\test.txt生成‎的文件内容‎为^W > W^ 和> 是控制命令‎，要把它们输‎出到文件，必须在前面‎加个^ 符号27 <从文件中获‎得输入信息‎，而不是从屏‎幕上一般用于 date time label‎等需要等待‎输入的命令‎@echo offec‎h o 2005-05-01>temp.txtda‎t e <temp.txtde‎l temp.txt这样‎就可以不等‎待输入直接‎修改当前日‎期28 %0 %1 %2 %3 %4 %5 %6 %7 %8 %9 %*命令行传递‎给批处理的‎参数%0 批处理文件‎本身%1 第一个参数‎%9 第九个参数‎%* 从第一个参‎数开始的所‎有参数在C盘根目‎录新建te‎s t.bat，内容如下：@echo offec‎h o cho cho .cho %*运行cmd‎，输入c:\test.bat "/a" /b /c /d可以看出‎每个参数的‎含意修改tes‎t.bat内容‎如下@echo offec‎h o cho %~1echo‎cho %~f0ech‎o %~d0ech‎o %~p0ech‎o %~n0ech‎o %~x0ech‎o %~s0ech‎o %~a0ech‎o %~t0ech‎o %~z0再运行cm‎d，输入c:\test.bat "/a" /b /c /d可以参照‎call/? 或for/? 看出每个参‎数的含意注‎意这里可以‎对文件进行‎日期比较和‎大小比较echo load "%%1" "%%2">c:\test.txt生成‎的文件内容‎为load "%1" "%2"批处理文件‎里，用这个格式‎把命令行参‎数输出到文件31 set设置‎变量引用变量可‎在变量名前‎后加% ，即%变量名%set #显示目前所‎有可用的变‎量，包括系统变‎量和自定义‎的变量echo %Syste‎m Driv‎e% #显示系统盘‎盘符。

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UM11817Introduction to 18-cell slider battery pack emulatorRev. 1 — 17 February 2023User manualIntroduction to 18-cell slider battery pack emulatorIntroduction to 18-cell slider battery pack emulator 1 IntroductionThe BATT-18EMULATOR board can emulate a multi-cell battery pack that can be easily hooked-up to the evaluation boards for MC33774 18-cell battery cell controllers (BCCs):•RD33774ADSTEVB - distributed board with single MC33774•RD33774CNT3EVB - centralized board with three MC33774The user can connect the BATT-18EMULATOR board for a quick evaluation of NXP BCC ICs, or to help the users in their software development. These boards basically provide a very intuitive way:•To change the voltage across any of the 18 cells of an emulated battery pack•To change the voltage across some analog inputs of the BCC IC that are typically used as temperature sensorsFigure 1. BATT-18EMULATOR2 Getting started2.1 Kit contents/packing listThe kit contents include:•BATT-18EMULATOR, 18-cell slider battery pack emulator•25 W AC-DC adapter with +5 VDC/5 A single output - DC plug type P1J (2.1 × 5.5 × 11 mm), tuning fork type, center positive•Adapter cable DC plug 2.1 × 5.5 × 11 mm to 2.5 × 5.5 × 9.5 mmIntroduction to 18-cell slider battery pack emulator 3 Getting to know the hardware3.1 Board features•18 slider potentiometers to adjust the cells voltage between 1.2 V and 3.3 V. The maximum total voltage has been limited to 60 V.•Three cells voltage can be inverted to apply voltages from −1.2 V to −3.3 V•Maximum current capability per channel: 200 mA•Three connectors for MC33774 evaluation boards connections•Temperature sensor output voltage can vary from 0 V to +4.95 V to simulate negative temperature coefficient (NTC) sensor3.2 Board functionsThe board has been designed and optimized for the operating conditions described in Table 1 and Table 2. Usage of the board beyond these conditions can lead to malfunction and damage.Table 1. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).[1]The maximum input supply current depends on the setup: number of boards connected, cells voltage, activated cell balancing channels; seeSection 3.3.3.[1]With jumpers setting, it is possible to get negative voltages from −3.3 V to −1.2 V for cells 13, 8 and 4; see Section 3.3.4.Introduction to 18-cell slider battery pack emulator 3.3 Board functional descriptionFigure 2. BATT-18EMULATOR board elements3.3.1 DescriptionEach cell emulation is made of a 5 V to 5 V unregulated isolated DC-DC converter and an adjustable regulator. The regulator output voltage is set thanks to a voltage slider. Minimum voltage is 1.2 V and maximum is set to 3.3 V.3.3.2 Connection and configurationThe emulator board requires a 5 V DC power supply with 5 A current capability. The power supply is connected to the board via J3 a Ø2.5 mm jack connector or using the 2 mm bananas J2(+) and J1(−). The center pinis connected to the positive voltage and the ring terminal to the ground. The input of the board is 5 A fuse protected. An LED allows the user to check that the board is powered up. If the voltage is present on the jack connector but the LED is off, then check the fuse F1.Up to three evaluation boards RD33774ADSTEVB or one RD33774CNT3EVB can be connected using connectors J4, J5, and J6 with no specific order.3.3.3 Current consumptionThe slider pack should be supplied with a +5 V AC-DC adapter or with a lab supply. The required supply current depends on several parameters described below.With no board connected, the default supply current on the 5 V primary is around 500 mA [19 × 28 mA (DC-DC typ supply current)].One RD33774ADSTEVB board, communicating, no balancing activated, consumes around 10.5 mA. Then the total supply current required on the 5 V primary is around 700 mA [500 mA + (19 × 10.5 mA)].If three boards are connected, then the supply current is 500 mA + (3 × 19 × 10.5 mA) = 1 A.If cell balancing is activated, the primary current depends on the cell voltage, the balancing resistance, and the number of balancing metal-oxide-semiconductor field-effect transistor (MOSFET) activated.Introduction to 18-cell slider battery pack emulator On RD33774ADSTEVB, the balancing resistance is 22 Ω per cell balancing channel. With V cell = 3.3 V, the peak balancing current is 150 mA peak, 75 mA average assuming a 50 % duty cycle. If N cell balancing MOSFETs are activated, then N × 75 mA are added to the primary current needed. If one board is connected and all18 cell balancing MOSFETs are activated, then the total current is 700 mA + 18 × 75 mA = 2 A. Each individual channel (200 mA of current capability) has to provide 10.5 mA + 75 mA averaged or 10.5 mA + 150 mA peak. Note: The current is limited to 180 mA per channel. If several boards are connected, it is recommended toavoid to activate same cell balancing channels at the same time on all the boards.3.3.4 Cell polarity selectionThree pairs of jumpers allow the polarity to be reversed for cell polarities for cell4 (C5M − C4M), cell8(C9M − C8M) and cell13 (C14M − C13M) therefore providing voltages between −1.2 V and −3.3 V; see Table 3.Note: Jumper selections should be done prior to supplying the BATT-18EMULATOR. Adjacent cell voltages are impacted when changing the polarities.3.3.5 External voltage injectionThe three jumpers can also be used as injection points to inject voltages above slider ranges: −1.2 V < V inj <+1.2 V or 3.3 V < V inj, typically to evaluate MC33774 cell terminal measurements at very low voltage (busbars) or a high-voltage cell.As example, to inject a voltage between C5M and C4M, remove jumper J8, keep jumper J7 1-2, and connect a floating supply between J8-2 and J7-1 or 2. Do not exceed maximum ratings and keep cell voltage in the range −5 V to +5 V.3.3.6 Temperature sensor simulationA separate slider allows the variation of the voltage across the temperature sensors.The temperature sensor output voltage can vary from 0 V to +4.95 V. It can mimic the temperaturevariation from −48 °C to +200 °C of a 10 kΩ NTC sensor. This output voltage is connected to four different general‑purpose input/output (GPIO) on the MC33774 (GPIO 1, 2, 7, 8) configured as ratiometric inputs with10 kΩ pull‑up resistors to VAUX (3.3 V typ.).3.4 MC33774 board connectionsThree 32 pins connectors (JAE Electronics MX34032NF2) J4, J5, J6 are connected in parallel as perthe following schematic Figure 3. Up to three boards (for example, RD33774ADSTEVB) or one boardRD33774CNT3EVB can be connected on any of these connectors.Introduction to 18-cell slider battery pack emulator Slider cell 0 is setting the voltage between C0M (cell0M) and C1M (cell0P), slider cell 1 is setting the voltage between C1M (cell1M) and C2M (cell1P), and so on, slider cell 17 is setting the voltage between C17M(cell17M) and C17P (cell17P).C17P-PWR and GND (pin 21) are used to supply the RD33774ADSTEVB and are separated from C17P andC0M respectively to avoid any voltage drop due to the current consumption of the evaluation boards.The slide temperature sensor is connected on pin 17 to pin 20 (NTC1, 2, 7 and 8 for RD33774DSTEVB).Figure 4. BATT-18EMULATOR connected to three RD33774DSTEVBIntroduction to 18-cell slider battery pack emulator 4 SchematicFigure 5. SchemaIntroduction to 18-cell slider battery pack emulator 5 Legal information5.1 DefinitionsDraft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.5.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.Suitability for use in automotive applications — This NXP product has been qualified for use in automotive applications. If this product is usedby customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless ofany information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.In no event shall NXP Semiconductors, its affiliates or their suppliersbe liable to customer for any special, indirect, consequential, punitiveor incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages.Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors,its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecyclesto reduce the effect of these vulnerabilities on customer’s applicationsand products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP.NXP has a Product Security Incident Response Team (PSIRT) (reachableat *************) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.Introduction to 18-cell slider battery pack emulatorNXP — wordmark and logo are trademarks of NXP B.V.5.3 TrademarksNotice: All referenced brands, product names, service names, andtrademarks are the property of their respective owners.Introduction to 18-cell slider battery pack emulatorTablesTab. 1.Limiting values (4)Tab. 2.Electrical characteristics (4)Tab. 3.Cell voltage polarity selection (6)FiguresFig. 1.BATT-18EMULATOR (3)Fig. 2.BATT-18EMULATOR board elements (5)Fig. 3.Cell connector schematic ..................................7Fig. 4.BATT-18EMULATOR connected to threeRD33774DSTEVB (7)Fig. 5.Schema (8)UM11817All information provided in this document is subject to legal disclaimers.© 2023 NXP B.V. All rights reserved. User manual Rev. 1 — 17 February 202311 / 12Introduction to 18-cell slider battery pack emulatorContents1Introduction (3)2Getting started (3)2.1Kit contents/packing list (3)3Getting to know the hardware (4)3.1Board features (4)3.2Board functions (4)3.3Board functional description (5)3.3.1Description (5)3.3.2Connection and configuration (5)3.3.3Current consumption (5)3.3.4Cell polarity selection (6)3.3.5External voltage injection (6)3.3.6Temperature sensor simulation (6)3.4MC33774 board connections (6)4Schematic (8)5Legal information (9)Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.© 2023 NXP B.V.All rights reserved.For more information, please visit: Date of release: 17 February 2023。

18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118B*All third-party trademarks are the property of their respective owners. Their use neither constitutes a claim of the trademark nor affiliation of the trademark owners with MUSIC Tribe. Product names are mentioned The 3,200-Watt TM S118B is a frontloaded 18" subwoofer systemdesigned for a wide range of music andlive sound reinforcement applications.Engineered to work in conjunctionwith TURBOSOUND loudspeakermanagement systems, the TM S118Bprovides optimal FOH performance,as well as exceptional drum and sidefill monitoring duties.A bass reflex port design enclosure,with a high powered carbon fibre loaded 18" low frequency driver that utilizes a specialised voice coil wound on both the inside and outside of the coil former for higher magnetic density, better heat dissipation, high power handling capacity, and improved efficiency. T he T MS118B subwoofer provides fast and accurate transient response for virtually distortion-free operation – even in the most demanding performances.Finished in a highly durable semi matt black paint, the cabinet is constructed from 18 mm (3/4") birch plywood – and includes a rugged powder coated perforated steel mesh grille backed with reticulated foam, an integral 20 mm threaded pole mount for satellite speaker applications, and durable carry handles that are strategically placed for easy transport. The rear panel connector plate carries Neutrik speakON* NL4 connectors, with switchable input and link connections to accommodate standalone subwoofer applications, or subwoofer and satellite speaker connectivity via 4 core speaker cabling.##Front loaded subwoofer for portable PA and installation applications##800 Watts continuous,3,200 Watts peak power##Ideal for FOH, side anddrum fill applications##Carbon fibre loaded18" low frequency driver with inside/outside wound coil##Switchable input and link connections for 4 corespeaker cables##Low distortion bass reflexport design##18 mm (3/4”) birch plywood enclosure with hard wearing semi matt black paint finish##Rugged powder coated perforated steel mesh grille##20 mm threaded pole mount to support satellite speaker##Durable handles for easy lifting and carrying##Neutrik speakON* NL4 connectors for reliable long life operation##10-Year Warranty Program*##Designed and engineered in the U.K.18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118BYou Are CoveredWe always strive to provide the best possible Customer Experience. Our products are made in our own MUSIC Tribe factory using state-of-the-art automation, enhanced production workflows and quality assurance labs with the most sophisticated test equipment available in the world. As a result, we have one of the lowest product failure rates in the industry, and we confidently back it up with a generous Warranty program .18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118BFrequency Response Sensitivity 1 W / 1 mImpedance201001k10k20k62687480869298104110Frequency (Hz)S o u n d P r e s s u r e L e v e l (d B )200HZ Low Pass201001k 10k 20k110100300Frequency (Hz)M a g n e t u d e (O h m s )18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118BDimensionsTOP BOTTOM FRONTSIDEBACK597 [23.5]513 [20.2]750 [29.5]250 [9.8]217.3 [8.6]322.3 [12.7]175.4 [6.9]205.4 [8.1]CLCLCLCL18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118BTechnical SpecificationsSystemFrequency Response38 Hz – 200 Hz ±3 dB32 Hz – 200 Hz -10 dBNominal Dispersion Half spacePower Handling (IEC)800 W continuous, 3,200 W peak Sensitivity97 dBMaximum SPL126 dB continuous, 132 dB peak Impedance8 ΩComponents 1 x 18" (460 mm) LF driver EnclosureConnectors 2 x Neutrik speakON* NL4WiringSwitch position 1+/1-Pins 1+ / 1- input, pins 2+ / 2- link Switch position 2+/2-Pins 1+ / 1- link, pins 2+ / 2- input Dimensions HWD513 x 597 x 750 mm (20.2 x 23.5 x 29.5") Net Weight39.8 kg (87.6 lbs) Construction18 mm (3/4") birch plywoodFinish Semi matt black paintGrille Powder-coated perforated steel Flying Hardware —AccessoriesTPOLE60-20, 60 cm pole with a 20 mm thread TPOLE90-20, 90 cm pole with a 20 mm thread TPOLE120-20, 120 cm pole with a 20 mm threadTMS118B18" Front Loaded Subwoofer for Portable PAand Installation Applications18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118BFor service, support or more information contact the TURBOSOUND location nearest you:EuropeM USIC Tribe Brands UK Ltd.Tel: +44156 273 2290Email: C ***********************************************************************USA/CanadaM USIC Tribe Commercial NV Inc.Tel: +1 702 800 8290Email: C ***********************************************************************JapanM USIC Tribe Services JP K.K.Tel: +81 3 6231 0453Email: C ***********************************************************************MUSIC Tribe accepts no liability for any loss which may be suffered by any person who relies either wholly or in part upon any description, photograph, or statement contained herein. Technical specifications, appearances and other information are subject to change without notice. All trademarks are the property of their respective owners. MIDAS, KLARK TEKNIK, 18" Front Loaded Subwoofer for Portable PA and Installation ApplicationsTMS118B。