A 40-Gbps integrated clock and data recovery circuit in a 50-GHz FT silicon bipolar technology

SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.SHARC®Embedded ProcessorADSP-21266Rev. CInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for anyinfringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: FAX: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.SUMMARYHigh performance 32-bit/40-bit floating-point processor optimized for high performance audio processingCode compatibility—at assembly level, uses the same instruction set as other SHARC DSPsProcesses high performance audio while enabling low system costsAudio decoders and postprocessor algorithms support nonvolatile memory that can be configured to contain a combination of PCM 96 kHz, Dolby® Digital, Dolby Digital Surround EX TM, DTS-ES TM Discrete 6.1, DTS-ES Matrix 6.1, DTS® 96/24 5.1, MPEG2 AAC LC, MPEG2 BC 2ch, WMA-PRO V7.1, Dolby Pro Logic II, Dolby Pro Logic 2x, and DTS Neo:6TMVarious multichannel surround-sound decoders are con-tained in ROM. For configurations of decoder algorithms, see Table2 on Page6.Single-instruction multiple-data (SIMD) computational archi-tecture—two 32-bit IEEE floating-point/32-bit fixed-point/ 40-bit extended precision floating-point computational units, each with a multiplier, ALU, shifter, and register file High bandwidth I/O—a parallel port, an SPI port, six serial ports, a digital audio interface (DAI), and JTAGDAI incorporates two precision clock generators (PCGs), an input data port (IDP) that includes a parallel data acquisi-tion port (PDAP), and three programmable timers, all under software control by the signal routing unit (SRU) On-chip memory—2M bits on-chip SRAM and a dedicated 4M bits on-chip mask-programmable ROMThe ADSP-21266 is available with a 150 MHz or a 200 MHz core instruction rate. For complete ordering information, see Ordering Guide on Page44.Figure 1.Functional Block DiagramADSP-21266 KEY FEATURESSerial ports offer left-justified sample-pair and I2S support via 12 programmable and simultaneous receive or trans-mit pins, which support up to 24 transmit or 24 receive I2S channels of audio when all 6 serial ports (SPORTs) are enabled or 6 full duplex TDM streams of up to 128 channels per frameAt 200 MHz (5 ns) core instruction rate, the ADSP-21266 operates at 1200 MFLOPS peak/800 MFLOPS sustained performance whether operating on fixed- or floating-point data; 400 MMACS sustained performance at 200 MHz Super Harvard Architecture—three independent buses for dual data fetch, instruction fetch, and nonintrusive, zero-overhead I/O2M bits on-chip dual-ported SRAM (1M bit block 0, 1M bit block 1) for simultaneous access by core processor and DMA4M bits on-chip dual-ported mask-programmable ROM(2M bits in block 0 and 2M bits in block 1)Dual data address generators (DAGs) with modulo and bit-reverse addressingZero-overhead looping with single-cycle loop setup, providing efficient program sequencingSingle instruction multiple data (SIMD) architecture provides:Two computational processing elementsConcurrent execution—each processing element executes the same instruction, but operates on different data Parallelism in buses and computational units allows single cycle executions (with or without SIMD) of a multiplyoperation; an ALU operation; a dual memory read orwrite; and an instruction fetchTransfers between memory and core at up to four 32-bit floating- or fixed-point words per cycle, sustained2.4 GBps bandwidth at 200 MHz core instruction rate; 900 Mbps is available via DMAAccelerated FFT butterfly computation through a multiply with add and subtract instructionDMA controller supports:22 zero-overhead DMA channels for transfers between theADSP-21266 internal memory and serial ports (12), the input data ports (IDP) (eight), the SPI-compatible port(one), and the parallel port (one)32-bit background DMA transfers at core clock speed, inparallel with full-speed processor executionJTAG background telemetry for enhanced emulation featuresIEEE 1149.1 JTAG standard test access port and on-chip emulationDual voltage: 3.3 V I/O, 1.2 V coreAvailable in 136-ball BGA and 144-lead LQFP packages; avail-able in RoHS compliant packagesDigital audio interface includes six serial ports, two precision clock generators, an input data port, three programmable timers, and a signal routing unit Asynchronous parallel/external port provides:Access to asynchronous external memory16 multiplexed address/data lines that can support 24-bitaddress external address range with 8-bit data or 16-bit address external address range with 16-bit data66M byte/sec transfer rate for 200 MHz core rate50M byte/sec transfer rate for 150 MHz core rate256 word page boundariesExternal memory access in a dedicated DMA channel8- to 32-bit and 16- to 32-bit word packing options Programmable wait state options: 2 to 31 CCLKsSerial ports provide:Six dual data line serial ports that operate at up to50M bits/sec for a 200 MHz core and up to 37.5M bits/sec for a 150 MHz core on each data line—each has a clock, frame sync, and two data lines that can be configured as either a receiver or transmitter pairLeft-justified sample-pair and I2S support, programmable direction for up to 24 simultaneous receive or transmit channels using two I2S-compatible stereo devices perserial portTDM support for telecommunications interfaces including 128 TDM channel support for newer telephony inter-faces such as H.100/H.110Up to 12 TDM stream support, each with 128 channelsper frameCompanding selection on a per channel basis in TDM mode Input data port provides an additional input path to the SHARC core configurable as either eight channels of I2S or serial data or as seven channels plus a single 20-bit wide synchronous parallel data acquisition portSupports receive audio channel data in I2S, left-justifiedsample pair, or right-justified modeSignal routing unit (SRU) provides configurable and flexible connections between all DAI components, six serial ports, two precision clock generators, three timers, an input data port/parallel data acquisition port, 10 interrupts, six flag inputs, six flag outputs, and 20 SRU I/O pins (DAI_Px) Serial peripheral interface (SPI)Master or slave serial boot through SPIFull-duplex operationMaster-slave mode multimaster supportOpen-drain outputsProgrammable baud rates, clock polarities, and phases3 muxed flag/IRQ lines1 muxed flag/timer expired lineROM-based security features:JTAG access to memory permitted with a 64-bit key Protected memory regions that can be assigned to limitaccess under program control to sensitive codePLL has a wide variety of software and hardware multi-plier/divider ratiosRev. C|Page 2 of 44|October 2007ADSP-21266Rev. C |Page 3 of 44|October 2007TABLE OF CONTENTSSummary ............................................................... 1Key Features ........................................................... 2Table of Contents .................................................... 3Revision History ...................................................... 3General Description ................................................. 4ADSP-21266 Family Core Architecture ...................... 4ADSP-21266 Memory and I/O Interface Features ......... 6Target Board JTAG Emulator Connector .................... 9Development Tools ............................................... 9Evaluation Kit ..................................................... 10Designing an Emulator-Compatible DSP Board (Target)10Additional Information ......................................... 10Pin Function Descriptions ........................................ 11Address Data Pins as Flags ..................................... 14Core Instruction Rate to CLKIN Ratio Modes ............. 14Address Data Modes ............................................. 14ADSP-21266 Specifications ....................................... 15Operating Conditions ........................................... 15Electrical Characteristics ........................................ 15Package Information ............................................ 16ESD Caution ...................................................... 16Absolute Maximum Ratings ................................... 16Timing Specifications ........................................... 16Output Drive Currents .......................................... 37Test Conditions ................................................... 37Capacitive Loading ............................................... 37Environmental Conditions ..................................... 38Thermal Characteristics ........................................ 38136-Ball BGA Pin Configurations ............................... 39144-Lead LQFP Pin Configurations ............................. 42Package Dimensions ................................................ 43Surface-Mount Design .......................................... 44Ordering Guide (44)REVISION HISTORY9/07—Rev. B to Rev. CCorrected all outstanding document errata.Added new section Package Information .................. 16Revised Timing Specifications ................................ 16Ordering Guide .. (44)ADSP-21266 GENERAL DESCRIPTIONThe ADSP-21266 SHARC DSP is a member of the SIMDSHARC family of DSPs featuring Analog Devices Super Har-vard Architecture. The ADSP-21266 is source code compatible with the ADSP-2126x, ADSP-21160, and ADSP-21161 DSPs as well as with first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. Like other SHARC DSPs, the ADSP-21266 is a 32-bit/40-bit floating-point proces-sor optimized for high performance audio applications with its dual-ported on-chip SRAM, mask-programmable ROM, multi-ple internal buses to eliminate I/O bottlenecks, and an innovative digital audio interface.As shown in the functional block diagram in Figure1 on Page1, the ADSP-21266 uses two computational units to deliver a 5 to 10 times performance increase over previous SHARC proces-sors on a range of DSP algorithms. Fabricated in a state-of-the-art, high speed, CMOS process, the ADSP-21266 DSP achieves an instruction cycle time of 5 ns at 200 MHz or 6.6 ns at150 MHz. With its SIMD computational hardware, the ADSP-21266 can perform 1200 MFLOPS running at 200 MHz, or 900 MFLOPS running at 150 MHz.Table1 shows performance benchmarks for the ADSP-21266. The ADSP-21266 continues SHARC’s industry-leading stan-dards of integration for DSPs, combining a high performance 32-bit DSP core with integrated, on-chip system features. These features include 2M bit dual-ported SRAM memory, 4M bit dual-ported ROM, an I/O processor that supports 22 DMA channels, six serial ports, an SPI interface, external parallel bus,and digital audio interface.The block diagram of the ADSP-21266 in on Page1 illustrates the following architectural features:•Two processing elements, each containing an ALU, multi-plier, shifter, and data register file•Data address generators (DAG1, DAG2)•Program sequencer with instruction cache•PM and DM buses capable of supporting four 32-bit data transfers between memory and the core at every core pro-cessor cycle•Three programmable interval timers with PWM genera-tion, PWM capture/pulse width measurement, andexternal event counter capabilities•On-chip dual-ported SRAM (2M bit)•On-chip dual-ported, mask-programmable ROM(4M bit)•JTAG test access port•8- or 16-bit parallel port that supports interfaces to off-chip memory peripherals•DMA controller•Six full-duplex serial ports•SPI-compatible interface•Digital audio interface that includes two precision clockgenerators (PCG), an input data port (IDP), six serial ports, eight serial interfaces, a 20-bit synchronous parallel input port, 10 interrupts, six flag outputs, six flag inputs, threeprogrammable timers, and a flexible signal routing unit(SRU)Figure2 shows one sample configuration of a SPORT using the precision clock generator to interface with an I2S ADC and an I2S DAC with a much lower jitter clock than the serial port would generate itself. Many other SRU configurations are possible.ADSP-21266 FAMILY CORE ARCHITECTUREThe ADSP-21266 is code compatible at the assembly level with the ADSP-2136x and ADSP-2116x, and with the first generation ADSP-2106x SHARC DSPs. The ADSP-21266 shares architec-tural features with the ADSP-2136x and ADSP-2116x SIMD SHARC family of DSPs, as detailed in the following sections. SIMD Computational EngineThe ADSP-21266 contains two computational processing ele-ments that operate as a single-instruction multiple-data (SIMD) engine. The processing elements are referred to as PEX and PEY and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY may be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruction is executed in both processing ele-ments, but each processing element operates on different data. This architecture is efficient at executing math intensive audio algorithms.Entering SIMD mode also has an effect on the way data is trans-ferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the band-width between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file.Table 1.ADSP-21266 Benchmarks (at 200 MHz)Benchmark Algorithm Speed(at 200 MHz)1024 Point Complex FFT (Radix 4, with reversal)61.3 μsFIR Filter (per tap)11Assumes two files in multichannel SIMD mode.3.3 nsIIR Filter (per biquad)113.3 ns Matrix Multiply (pipelined)[3×3] × [3×1] [4×4] × [4×1]30 ns 53.3 nsDivide (y/x)20 nsInverse Square Root30 nsRev. C|Page 4 of 44|October 2007ADSP-21266Rev. C |Page 5 of 44|October 2007Independent, Parallel Computation UnitsWithin each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform all opera-tions in a single cycle. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing ele-ments. These computation units support IEEE 32-bit single precision floating-point, 40-bit extended precision floating-point, and 32-bit fixed-point data formats.Data Register FileA general-purpose data register file is contained in eachprocessing element. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) register files, combined with the ADSP-2126x enhanced Har-vard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0–R15 and in PEY as S0–S15.Single-Cycle Fetch of Instruction and Four Operands The ADSP-21266 features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the pro-gram memory (PM) bus transfers both instructions and data (see Figure 1 on Page 1). With the ADSP-21266’s separate pro-gram and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one instruction (from the cache), all in a single cycle.Instruction CacheThe ADSP-21266 includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective—only the instructions whose fetches conflict with PM bus data accesses are cached. This cache allows full-speed execution of core, looped operations such as digital filter multiply-accumulates, and FFT butterfly processing.Data Address Generators with Zero-Overhead Hardware Circular Buffer SupportThe ADSP-21266’s two data address generators (DAGs) are used for indirect addressing and implementing circular data buffers in hardware. Circular buffers allow efficient program-ming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters andFigure 2.ADSP-21266 System Sample ConfigurationADSP-21266Fourier transforms. The two DAGs of the ADSP-21266 contain sufficient registers to allow the creation of up to 32 circular buff-ers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reduce over-head, increase performance, and simplify implementation. Circular buffers can start and end at any memory location. Flexible Instruction SetThe 48-bit instruction word accommodates a variety of parallel operations for concise programming. For example, theADSP-21266 can conditionally execute a multiply, an add, and a subtract in both processing elements while branching and fetch-ing up to four 32-bit values from memory—all in a single instruction.ADSP-21266 MEMORY AND I/O INTERFACE FEATURESThe ADSP-21266 adds the following architectural features to the SIMD SHARC family core:Dual-Ported On-Chip MemoryThe ADSP-21266 contains two megabits of internal SRAM and four megabits of internal mask-programmable ROM. Each block can be configured for different combinations of code and data storage (see memory map, Figure3). Each memory block is dual-ported for single-cycle, independent accesses by the core processor and I/O processor. The dual-ported memory, in com-bination with three separate on-chip buses, allows two data transfers from the core and one from the I/O processor, in a sin-gle cycle.The ADSP-21266 is available with a variety of multichannel surround-sound decoders, preprogrammed in on-chip ROM memory. Table2 indicates the configurations of decoder algo-rithms provided.The ADSP-21266’s SRAM can be configured as a maximum of 64K words of 32-bit data, 128K words of 16-bit data, 42K words of 48-bit instructions (or 40-bit data), or combinations of differ-ent word sizes up to two megabits. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit float-ing-point storage format is supported that effectively doubles the amount of data that can be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point for-mats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data using the DM bus for transfers, and the other block stores instructions and data using the PM bus for transfers.Using the DM bus and PM buses, with one dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available inthe cache.DMA ControllerThe ADSP-21266’s on-chip DMA controller allows zero-over-head data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simul-taneously executing its program instructions. DMA transfers can occur between the ADSP-21266’s internal memory and its serial ports, the SPI-compatible (serial peripheral interface) port, the IDP (input data port), parallel data acquisition port (PDAP), or the parallel port. Twenty-two channels of DMA are available on the ADSP-21266—one for the SPI interface, 12 via the serial ports, eight via the input data port, and one via the processor’s parallel port. Programs can be downloaded to the ADSP-21266 using DMA transfers. Other DMA features include interrupt generation upon completion of DMA trans-fers, and DMA chaining for automatic linked DMA transfers. Digital Audio Interface (DAI)The digital audio interface provides the ability to connect vari-ous peripherals to any of the SHARC DSP’s DAI pins(DAI_P20–1).Connections are made using the signal routing unit (SRU, shown in the block diagram on Page1).The SRU is a matrix routing unit (or group of multiplexers) that enables the peripherals provided by the DAI to be intercon-nected under software control. This allows easy use of the DAI associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with noncon-figurable signal paths.The DAI also includes six serial ports, two precision clock gen-erators (PCGs), an input data port (IDP), six flag outputs and six flag inputs, and three timers. The IDP provides an additional input path to the ADSP-21266 core, configurable as either eight channels of I2S or serial data, or as seven channels plus a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA channel that is independent from the ADSP-21266’s serial ports.For complete information on using the DAI, see theADSP-2126x SHARC DSP Peripherals Manual.Serial PortsThe ADSP-21266 features six full duplex synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices such as the Analog Devices AD183x family of audio codecs, ADCs, and DACs. TheTable 2.Multichannel Surround-Sound Decoder Algorithmsin On-Chip ROMAlgorithms B ROM C ROM D ROMPCM Yes Yes YesAC-3Yes Yes YesDTS 96/24v2.2v2.3v2.3AAC (LC)Yes Yes Coefficients onlyWMAPRO 7.1 96 KHz No No YesMPEG2 BC 2ch Yes Yes NoNoise Yes Yes YesDPL2x/EX DPL2Yes YesNeo:6/ES (v2.5046)Yes Yes YesRev. C|Page 6 of 44|October 2007ADSP-21266Rev. C|Page 7 of 44|October 2007serial ports are made up of two data lines, a clock, and frame sync. The data lines can be programmed to either transmit or receive and each data line has its own dedicated DMA channel.Serial ports are enabled via 12 programmable and simultaneous receive or transmit pins that support up to 24 transmit or 24 receive channels of audio data when all six SPORTs are enabled, or six full duplex TDM streams of 128 channels per frame.The serial ports operate at up to one-quarter of the DSP core clock rate, providing each with a maximum data rate of 50M bits/sec for a 200 MHz core and 37.5M bits/sec for a150MHz core. Serial port data can be automatically transferred to and from on-chip memory via a dedicated DMA. Each of theserial ports can work in conjunction with another serial port to provide TDM support. One SPORT provides two transmit sig-nals while the other SPORT provides two receive signals. The frame sync and clock are shared.Serial ports operate in four modes: •Standard DSP serial mode •Multichannel(TDM)mode •I 2S mode•Left-justified sample pair modeFigure 3.ADSP-21266 Memory MapADSP-21266Left-justified sample pair mode is a mode where in each frame sync cycle, two samples of data are transmitted/received—one sample on the high segment of the frame sync, the other on the low segment of the frame sync. Programs have control over var-ious attributes of this mode.Each of the serial ports supports the left-justified sample-pair and I2S protocols (I2S is an industry-standard interface com-monly used by audio codecs, ADCs, and DACs) with two data pins, allowing four left-justified sample-pair or I2S channels (using two stereo devices) per serial port with a maximum of up to 24 audio channels. The serial ports permit little-endian or big-endian transmission formats and word lengths selectable from 3 bits to 32 bits. For the left-justified sample pair and I2S modes, data-word lengths are selectable between 8 bits and 32 bits. Serial ports offer selectable synchronization and transmit modes as well as optional μ-law or A-law companding selection on a per channel basis. Serial port clocks and frame syncs can be internally or externally generated.Serial Peripheral (Compatible) InterfaceSerial peripheral interface is an industry-standard synchronous serial link, enabling the ADSP-21266 SPI-compatible port to communicate with other SPI-compatible devices. SPI is an interface consisting of two data pins, one device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can operate in a multimaster environment by interfacing with up to four other SPI-compatible devices, either acting as a master or slave device. The ADSP-21266 SPI-compatible peripheral implementation also features programmable baud rates at up to 50 MHz for a core clock of 200 MHz and up to 37.5 MHz for a core clock of 150 MHz, clock phases, and polarities. The ADSP-21266 SPI-compatible port uses open-drain drivers to support a multimaster configuration and to avoid data contention. Parallel PortThe parallel port provides interfaces to SRAM and peripheral devices. The multiplexed address and data pins (AD15–0) can access 8-bit devices with up to 24 bits of address, or 16-bit devices with up to 16 bits of address. In either mode, 8- or 16-bit, the maximum data transfer rate is one-third the core clock speed. As an example, a clock rate of 200 MHz is equivalent to 66M byte/sec, and a clock rate of 150 MHz is equivalent to50M byte/sec.DMA transfers are used to move data to and from internal memory. Access to the core is also facilitated through the paral-lel port register read/write functions. The RD, WR, and ALE (address latch enable) pins are the control pins for the parallel port.TimersThe ADSP-21266 has a total of four timers: a core timer able to generate periodic software interrupts, and three general-pur-pose timers that can generate periodic interrupts and be independently set to operate in one of three modes:•Pulse waveform generation mode•Pulse width count/capture mode•External event watchdog modeThe core timer can be configured to use flag3 as a timer expired output signal, and each general-purpose timer has one bidirec-tional pin and four registers that implement its mode of operation: a 6-bit configuration register, a 32-bit count register, a 32-bit period register, and a 32-bit pulse width register. A sin-gle control and status register enables or disables all three general-purpose timers independently.ROM-Based SecurityThe ADSP-21266 has a ROM security feature that provides hardware support for securing user software code by preventing unauthorized reading from the internal code when enabled. When using this feature, the DSP does not boot-load any exter-nal code, executing exclusively from internal SRAM/ROM. Additionally, the DSP is not freely accessible via the JTAG port. Instead, a unique 64-bit key, which must be scanned in through the JTAG or test access port, will be assigned to each customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the correct key is scanned.Program BootingThe internal memory of the ADSP-21266 boots at system power-up from an 8-bit EPROM via the parallel port, an SPI master, an SPI slave, or an internal boot. Booting is determined by the boot configuration (BOOT_CFG1–0) pins. Selection of the boot source is controlled via the SPI as either a master or slave device, or it can immediately begin executing from ROM. Phase-Locked LoopThe ADSP-21266 uses an on-chip phase-locked loop (PLL) to generate the internal clock for the core. On power-up, the CLK_CFG1–0 pins are used to select ratios of 16:1, 8:1, and 3:1. After booting, numerous other ratios can be selected via soft-ware control. The ratios are made up of software configurable numerator values from 1 to 64 and software configurable divi-sor values of 2, 4, 8, and 16.Power SuppliesThe ADSP-21266 has separate power supply connections for the internal (V DDINT), external (V DDEXT), and analog (A VDD/A VSS) power supplies. The internal and analog supplies must meet the 1.2 V requirement. The external supply must meet the 3.3 V requirement. All external supply pins must be connected to the same power supply.Note that the analog supply pin (A VDD) powers theADSP-21266’s internal clock generator PLL. To produce a sta-ble clock, it is recommended that PCB designs use an externalRev. C|Page 8 of 44|October 2007。

The Summit® X460-G2 series is based on Extreme Networks® revolutionaryExtremeXOS®, a highly resilient OS that provides continuous uptime, manageability and operational efficiency. Each switch offers the same high-performance, non-blocking hardware technology, in the Extreme Networks tradition of simplifying network deployments through the use of common hardware and software throughout the network.The Summit X460-G2 switches are effective campus edge switches that support Energy Efficient Ethernet (EEE – IEEE 802.3az) with IEEE 802.3at PoE-plus and can also serve as aggregation switches for traditional enterprise networks. The Summit X460-G2 series is also an option for DSLAM or CMTS aggregation, or for active Ethernet access.The Summit X460-G2 can also be used as a top-of-rack switch for many data center environments with features such as high-density Gigabit Ethernet for concentrated data center environments; XNV™ (ExtremeXOS Network Virtualization) for centralized network-based Virtual Machine (VM) inventory, VM location history and VM provisioning; Direct Attach™ to offload VM switching from servers, thereby improving performance; high-capacity Layer 2/Layer 3 scalability for highly virtualized data centers; and intra-rack and cross-rack stacking with industry-leading flexibility.Comprehensive Security Management• User policy and host integrity enforcement, and identity management • Universal Port Dynamic Security Profiles to provide fine granular securitypolicies in the network• Threat detection and response instrumentation to react to network intrusion with CLEAR-Flow Security Rules Engine• Denial of Service (DoS) protection and IP security against man-in-the-middle and DoS attacks to harden the network infrastructureFlexible Port ConfigurationSummit X460-G2 offers flexible port configurations. For Summit X460-G2 24 port copper models with 10Gb uplinks with four dedicated Gigabit Ethernet fiber ports and four shared Gigabit Ethernet fiber ports, the switch can have up to 8 fiber GbE ports, while still providing 20 Gigabit Ethernet copper ports (PoE-plus or non-PoE). The Summit X460-G2 24 port copper models with 1Gb uplinks can provide up to 12 SFP ports with 20 Gigabit Ethernet ports or eight SFP ports with 24 copper GbE ports.All models come equipped with either 4 ports of SFP+ 10 GbE or 4 ports of SFP 1GbE resident on the faceplate of each model. Through an optional VIM slot, Summit X460-G2 switches can be equipped with an additional 2 ports of 10 GbE for a total of six 10 Gigabit Ethernet ports on the 10Gb uplink models.As another option, each unit can be equipped with 2 ports of QSFP+ 40 Gigabit Ethernet for uplinks or stacking.High-Performance StackingUp to eight Summit X460-G2 switches can be stacked using three different methods of stacking: SummitStack, SummitStack-V, and SummitStack-V160.SUMMITSTACK — STACKING USING COPPER CX4 CONNECTIONSThe Summit X460-G2 supports SummitStack by using the Summit X460-G2-VIM-2ss module, which offers high-speed 40 Gbps stacking performance and provides compatibility with the Summit X440, X460, X460-G2 and X480 stackable switches running the same version of ExtremeXOS.SUMMITSTACK-V — FLEXIBLE STACKING OVER 10GbEExtremeXOS supports the SummitStack-V capability using 2 of the native 10 GbE ports on the faceplate as stacking ports, enabling the use of standard cabling and optics technologies used for 10 GbE SFP+, SummitStack-V provides long-distance 40 Gbps stacking connectivity of up to 40 km while reducing the cable complexity of implementing a stacking solution. SummitStack-V is compatible with SummitX440, X460, X460-G2, X480, X670, X670V, X670-G2 and X770 switches running the same version of ExtremeXOS. SummitStack-V enabled 10 GbE ports must be physically direct-connected.Note: Stacking will NOT be supported on the 10GbE fiber VIM and the 10GbE copperVIM with initial X460-G2 shipments.Note: SummitStack-V is NOT supported on the 1GbE (SFP) front panel faceplateports of non-10Gb X460-G2 models.SUMMITSTACK-V160 — FLEXIBLE STACKING OVER 40GbEThe Summit X460-G2 also supports high-speed 160 Gbps stacking, which is idealfor demanding applications where a high volume of traffic traverses through the stacking links, yet bandwidth is not compromised through stacking.SummitStack-V160 can support passive copper cable (up to 3m), active multi-mode fiber cable (up to 100m), and QSFP+ optical transceivers for 40 GbE up to 10km. With SummitStack-V160, the Summit X460-G2 provides a flexible stacking solution inside the data center or central office to create a virtualized switching infrastructure across rows of racks. SummitStack-V160 is compatible with Summit X460-G2, X480, X670V, X670-G2 and X770 switches running the same version of ExtremeXOS.Intelligent Switching and MPLS/H-VPLS SupportSummit X460-G2 supports sophisticated and intelligent Layer 2 switching, as well as Layer 3 IPv4/IPv6 routing including policy-based switching/routing, Provider Bridges, bidirectional ingress and egress Access Control Lists, and bandwidth control by 8 Kbps granularity both for ingress and egress.T o provide scalable network architectures used mainly for Carrier Ethernet network deployment, Summit X460-G2 supports MPLS LSP-based Layer 3 forwarding and Hierarchical VPLS (H-VPLS) for transparent LAN services. WithH-VPLS, transparent Layer 3 networks can be extended throughout the Layer 3 network cloud by using a VPLS tunnel between the regional transparent LAN services typically built by Provider Bridges (IEEE 802.1ad) technologyIEEE 802.3at PoE-plusIEEE 802.3af Power over Ethernet has been widely used in the campus enterprise edge network for Ethernet-powered devices such as wireless access points, Voice over IP phones, and security cameras. Ethernet port extenders such as Extreme Networks ReachNXT™ 100-8t can also utilize PoE, making installation and management easier and reducing maintenance costs. The newer IEEE 802.3at PoE-plus standard expands upon Power over Ethernet by increasing the power limitup to 30 watts, and by standardizing power negotiation by using LLDP. SummitX460-G2 supports IEEE 802.3at PoE-plus and supports standards-compliant PoE devices today and into the future.1588 Precision Time Protocol (PTP)Summit X460-G2 offers Boundary Clock (BC), Transparent Clock (TC), and Ordinary Clock (OC) for synchronizing phase and frequency and allowing the network and the connected devices to be synchronized down to microseconds of accuracy over Ethernet connection.Audio Video Bridging (AVB)The X460-G2 series supports IEEE 802.1 Audio Video Bridging to enable reliable, real-time audio/video transmission over Ethernet. AVB technology delivers the quality of service required for today’s high-definition and time-sensitive multimedia streams.Ordering NotesThe X460-G2 base switches do not ship with fan trays or power supplies. The fan tray and power supplies must be ordered separately as well as any of the optional VIMS. There is only one optional VIM slot on each X460-G2 switch. The optional Timing Module has a separate dedicated slot on the back of the X460-G2 switch.CPU/MEMORY• 64-bit MIPS Processor, 1 GHz clock• 1GB ECC DDR3 DRAM• 4GB eMMC Flash• 4MB packet bufferLED INDICATORS• Per port status LED including power status• System Status LEDs: management, fan and powerENVIRONMENTAL SPECIFICATIONS• EN/ETSI 300 019-2-1 v2.1.2 - Class 1.2 Storage• EN/ETSI 300 019-2-2 v2.1.2 - Class 2.3 Transportation • EN/ETSI 300 019-2-3 v2.1.2 - Class 3.1e Operational• EN/ETSI 300 753 (1997-10) - Acoustic Noise• ASTM D3580 Random Vibration Unpackaged 1.5 G OPERATING CONDITIONS• T emp: 0° C to 50° C (32° F to 122° F)• Humidity: 10% to 95% relative humidity, non-condensing • Altitude: 0 to 3,000 meters (9,850 feet)• Shock (half sine): 30 m/s2 (3 G), 11 ms, 60 shocks• Random vibration: 3 to 500 Hz at 1.5 G rms PACKAGING AND STORAGE SPECIFICATIONS • T emp: -40° C to 70° C (-40° F to 158° F)• Humidity: 10% to 95% relative humidity, non-condensing• Packaged Shock (half sine): 180 m/s2 (18 G), 6 ms, 600shocks• Packaged Vibration: 5 to 62 Hz at velocity 5 mm/s, 62 to 500 Hz at 0.2 G• Packaged Random Vibration: 5 to 20 Hz at 1.0 ASD w/–3 dB/oct. from 20 to 200 Hz• Packaged Drop Height: 14 drops minimum on sides and corners at 42 inches (<15 kg box)REGULATORY AND SAFETYNorth American ITE• UL 60950-1 2nd Ed., Listed Device (U.S.)• CSA 22.2 #60950-1-03 2nd Ed. (Canada)• Complies with FCC 21CFR 1040.10 (U.S. Laser Safety)• CDRH Letter of Approval (US FDA Approval) European ITE• EN 60950-1:2007 2nd Ed.• EN 60825-1+A2:2001 (Lasers Safety)• TUV-R GS Mark by German Notified Body• 2006/95/EC Low Voltage DirectiveInternational ITE• CB Report & Certificate per IEC 60950-1 2nd Ed. +National Differences• AS/NZX 60950-1 (Australia /New Zealand)EMI/EMC STANDARDSNorth American EMC for ITE• FCC CFR 47 part 15 Class A (USA)• ICES-003 Class A (Canada)European EMC Standards• EN 55022:2006+A1:2007 Class A• EN 55024:A2-2003 Class A includes IEC 61000-4-2, 3, 4, 5, 6, 11• EN 61000-3-2,8-2006 (Harmonics)• EN 61000-3-3 2008 (Flicker)• ETSI EN 300 386 v1.4.1, 2008-04 (EMC T elecommunications)• 2004/108/EC EMC DirectiveInternational EMC Certifications• CISPR 22: 2006 Ed 5.2, Class A (International Emissions)• CISPR 24:A2:2003 Class A (International Immunity)• IEC 61000-4-2:2008/EN 61000-4-2:2009 ElectrostaticDischarge, 8kV Contact, 15 kV Air, Criteria A• IEC 61000-4-3:2008/EN 61000-4-3:2006+A1:2008 Radiated Immunity 10V/m, Criteria A• IEC 61000-4-4:2004 am1 ed.2./EN 61000-4-4:2004/A1:2010 Transient Burst, 1 kV, Criteria A• IEC 61000-4-5:2005 /EN 61000-4-5:2006 Surge, 2 kV L-L, 2 kV L-G, Level 3, Criteria A• IEC 61000-4-6:2008/EN 61000-4-6:2009 ConductedImmunity, 0.15-80 MHz, 10V/m unmod. RMS, Criteria A• IEC/EN 61000-4-11:2004 Power Dips & Interruptions, >30%,25 periods, Criteria CCOUNTRY SPECIFIC• VCCI Class A (Japan Emissions)• ACMA (C-Tick) (Australia Emissions)• CCC Mark• KCC Mark, EMC Approval (Korea)TELECOM STANDARDS• ETSI EN 300 386:2001 (EMC T elecommunications)• ETSI EN 300 019 (Environmental for T elecommunications)• NEBS Level 3 compliant to portions of GR-1089 Issue 4 &GR-63 Issue 3 as defined in SR3580 with exception to filter requirement• CE 2.0 CompliantIEEE 802.3 MEDIA ACCESS STANDARDS• IEEE 802.3ab 1000BASE-T• IEEE 802.3z 1000BASE-X• IEEE 802.3ae 10GBASE-X• IEEE 802.3at PoE Plus• IEEE 802.3az (EEE)* Bystander Sound Pressure is presented for comparison to other products measured using Bystander Sound Pressure. **Declared Sound Power is presented in accordance with ISO-7779:2010(E), ISO 9296:2010 per ETSI/EN 300 753:2012-01SUMMIT X460-G2 VIM-2T2-port 10 Gigabit Ethernet module, provides two 10GBase-T copper ports. SUMMIT X460-G2 VIM-2SSSummitStack module has two SummitStack stacking ports, and provides a 40 Gigabit stacking solution. This stacking module offers compatibility with other Extreme Networks stackable switches, which are Summit X440, Summit X460, and SummitX480.Ordered EmptyRequired: First Power Supply with Air Flow Direction ordered separatelyOptional:Redundant/Additive Power Supply with Air Flow Direction ordered separatelyOptional: Timing Module for SyncE and 1588 PTP ordered separatelyRequired: Fan Tray with Air Flow Direction ordered separatelyOptional: VIM Cardsordered separately* = data networking, not stacking/contact Phone +1-408-579-2800©2014 Extreme Networks, Inc. All rights reserved. Extreme Networks and the Extreme Networks logo are trademarks or registered trademarks of Extreme Networks, Inc. in the United States and/or other countries. All other names are the property of their respective owners. For additional information on Extreme Networks Trademarks。

IGLOO®2 FPGAsThe Industry’s Lowest-Power FPGAs/FPGA2IGLOO ®2 FPGAsIGLOO ®2 FPGAs Offer More Resources in Low-Density Devices With the Lowest Power, Proven Security and Exceptional ReliabilityIGLOO2 FPGAs are ideal for general-purpose functions such as Gigabit Ethernet or dual-PCI Express control planes, bridgingfunctions, (I/O) expansion and conversion, video/image processing, system management and secure connectivity. FPGAs are used in communications, industrial, medical, defense and aviation markets.IGLOO2 FeaturesMore Resources in Low-Density Devices• PCIe ® Gen 2 support in 10K LE• High-performance memory subsystem • Highest I/O densityWith Clear Advantages• Lowest power• Reduces total power by up to 50% • 70 mW per 5G SERDES (PCIe Gen 2) • Proven security• Protection from overbuilding and cloning • Secure boot for FPGA and processors • Exceptional reliability• SEU immune zero FIT Flash FPGA configuration •Reliable safety-critical and mission-critical systemsIGLOO2 FPGA ArchitectureIGLOO2 FPGAs offer 5K–150K LEs with a high-performance memory subsystem, up to 512 KB embedded Flash, 2 × 32 KB embedded SRAM, two Direct Memory Access (DMA) engines and two Double Data Rate (DDR) memory controllers. Architecture highlights include:• Up to 16× transceiver lanes • PCIe Gen 2, XAUI/XGXS+, generic ePCS mode at 3.2G • Up to 150K LEs, 5 Mbits SRAM, 4 Mbits eNVM• Hard 667 Mbps DDR2/3 controllers• Integrated DSP processing blocks• Power as low as 7 mW standby, typical• DPA-hardened, AES256, SHA256, on-demand NVM dataintegrity check • SEU-protected/tolerant memories: eSRAMs, DDR bridgesPCI ExpressDDR3 ControllerSecure FlashIGLOO2 FPGAs3PCIe 1G Control Plane• PCIe Gen 2 in 10K LE devices With I/O expansionMulti-Axis Motor Control• Deterministic and secure multi-axis/high-RPM solutions • Motor control IP and development kitAudio Processing, Storage, and Retrieval• I 2S-to-SPI bridge allows multiple audio recordings and playbacks/FPGA4Bridging and Co-Processing• SERDES to bridge CPRI, ADC/DACSecure Connectivity• Best-in-class security data communications and anti-tamper • Ultra-low static power for portabilityBoard Initialization• PMBus, instant-onIGLOO2 FPGAs5IGLOO2 FPGA FeaturesHigh-Performance Memory Subsystem• 64 KB embedded SRAM (eSRAM)• Up to 512 KB embedded nonvola -tile memory (eNVM)• One SPI/COMM_BLK• DDR bridge (2 port) with 64-bit AXI interface• Non-blocking, multi-layer AHB bus matrix allowing multi-master scheme supporting 4 masters and 8 slaves• Two AHB/APB interfaces to FPGA fabric (master/slave capable)• Two DMA controllers to offload data transactions• 8-channel peripheral DMA (PDMA) for data transfer between softperipherals in fabric and embedded eSRAMs, as well as support for memory-to-memory transfers• eSRAM and external DDR memory for efficient data movement between embedded real-time memoriesIGLOO2 FPGA SERDES• Up to 16 lanes at up to 5 Gbps • Dual-based reference clocks with single-lane rate granularity• Tx and Rx PLLs programmable for each lane• Reference clock is shared by groups of two lanes• Transmitter features• Programmable pre/post-emphasis • Programmable impedance • Programmable amplitude• Receiver features • Programmable termination• Programmable linear equalization• Built-in system debug features• PRBS gen/chk • Constant patterns • LoopbacksIGLOO2 FPGA Math Block• High-performance and power-optimized multiplication operations • Supports 18 × 18-signed multiplica -tion (natively)• Supports 17×17 unsigned multiplication• Supports dot product: the multi-plier computes (A[8:0] × B[17:9] + A[17:9] × B[8:0]) × 29 independent third input C with data width 44-bits completely registered• Supports both registered and unregistered inputs and outputs• Internal cascade signals(44-bit CDIN and CDOUT)enable cascading of the Math Blocks to supportlarger accumulator, adder,and subtractor withoutextra logic • Supports loopback capability• Adder support: (A×B) + C or (A×B) +D or (A×B) + C + D • Clock-gated inputand output registers for poweroptimizationsSUBA [17:0]B [17:0]C [43:0]CARRYIN ARSHFT17CDSELFDBKSELIGLOO2 FPGA Logic Element• A fully permutable 4-input LUT • A dedicated carry chain based on the carry look-ahead technique• A separate flip-flop that can be used independently from the LUT • Clock-gated input and output registers for power optimizationsA B C D CINLUT_BYPENSYNC_SRCLK RSTCO LORO/FPGA6Design ResourcesLibero ® SoC Design SoftwareLibero SoC Design Suite offers high productivity with its comprehensive, easy-to-learn, easy-to-adopt development tools that are used for designing with Microchip’s power-efficient Flash-based IGLOO2 devices. The suite integrates industry-standard Synopsys Synplify Pro synthesis and Mentor Graphics ModelSim simulation with best-in-class constraints management, debug capabilities, timing analysis, power analysis, secure production programming and push button design flow.This comprehensive suite features an intuitive design flow with GUI wizards to guide the design process. Its easy-to-adopt single-click synthesis to programming flow integrates industry-standard third-party tools, a rich IP library of DirectCores and Companion -Cores and supports complete reference designs and development kits.https:///product-directory/design-resources/1750-libero-socIGLOO2 Evaluation Kit• Gives designers access to IGLOO2 FPGAs that offer leadership in I/O density, security, reliability and low power for mainstream applications • Supports industry-standard interfaces including Gigabit Ethernet, USB 2.0 OTG, SPI, I 2C and UART• Can be powered by a 12V power supply or the PCIe connector and includes a FlashPro4 programmerBoard features• IGLOO2 FPGA in the FGG484 package (M2GL010T -1FGG484)• JTAG/SPI programming interface• Gigabit Ethernet PHY and RJ45 connector • USB 2.0 OTG interface connector • 1 GB LPDDR, 64 MB SPI Flash • Headers for I 2C, UART, SPI, GPIOs • ×1 Gen2 PCIe edge connector •Tx/Rx/Clk SMP pairs/existing-parts/parts/143976Intellectual PropertyMicrochip enhances your design productivity by providing an extensive suite of proven and optimized IP cores for use with FPGAs. Our extensive suite of IP cores covers all key markets and applications. Our cores are organized as either Microchip-developed DirectCores or third-party-developed CompanionCores. Most DirectCores are available for free within our Libero tool suite and include common communications interfaces, peripherals, and processing elements.Below are a few key DirectCores and CompanionCores. Click the below link for more details on IP Cores./product-directory/design-resources/5092-ip-coresIGLOO2 FPGA Product Family*Feature availablility is package dependent.Highlighted devices can migrate vertically in the same packageIGLOO2 FPGAs7SupportMicrochip is committed to supporting its customers in de-veloping products faster and more efficiently. We maintain a worldwide network of field applications engineers and technical support ready to provide product and system assistance. For more information, please visit :• Technical Support: /support • Evaluation samples of any Microchip device: /sample • Knowledge base and peer help: /forums• Sales and Global Distribution: /salesTrainingIf additional training interests you, Microchip offers several resources including in-depth technical training and reference material, self-paced tutorials and significant online resources.• Overview of Technical Training Resources: /training • MASTERs Conferences: /masters • Developer Help Website:/developerhelp • Technical Training Centers: /seminarsMicrochip Technology Inc. | 2355 W. Chandler Blvd. | Chandler AZ, 85224-6199Sales Office ListingAMERICASAtlanta, GATel: 678-957-9614Austin, TXTel: 512-257-3370Boston, MATel: 774-760-0087Chandler, AZ (HQ) Tel: 480-792-7200Chicago, ILTel: 630-285-0071Dallas, TXTel: 972-818-7423Detroit, MITel: 248-848-4000Houston, TXTel: 281-894-5983Indianapolis, IN Tel: 317-773-8323 Tel: 317-536-2380Los Angeles, CA Tel: 949-462-9523 Tel: 951-273-7800Raleigh, NCTel: 919-844-7510New York, NY Tel: 631-435-6000San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270Canada - Toronto Tel: 905-695-1980EUROPEAustria - WelsTel: 43-7242-2244-39Denmark - Copenhagen Tel: 45-4450-2828Finland - Espoo Tel: 358-9-4520-820France - ParisTel: 33-1-69-53-63-20Germany - Garching Tel: 49-8931-9700Germany - HaanTel: 49-2129-3766-400Germany - Heilbronn Tel: 49-7131-67-3636Germany - Karlsruhe Tel: 49-721-62537-0Germany - Munich Tel: 49-89-627-144-0Germany - Rosenheim Tel: 49-8031-354-560EUROPEIsrael - Ra’anana Tel: 972-9-744-7705Italy - MilanTel: 39-0331-742611Italy - PadovaTel: 39-049-7625286Netherlands - Drunen Tel: 31-416-690399Norway - Trondheim Tel: 47-7289-7561Poland - Warsaw Tel: 48-22-3325737Romania - Bucharest Tel: 40-21-407-87-50Spain - MadridTel: 34-91-708-08-90Sweden - Gothenberg Tel: 46-31-704-60-40Sweden - Stockholm Tel: 46-8-5090-4654UK - Wokingham Tel: 44-118-921-5800ASIA/PACIFICAustralia - Sydney Tel: 61-2-9868-6733China - BeijingTel: 86-10-8569-7000China - Chengdu Tel: 86-28-8665-5511China - Chongqing Tel: 86-23-8980-9588China - Dongguan Tel: 86-769-8702-9880China - Guangzhou Tel: 86-20-8755-8029China - Hangzhou Tel: 86-571-8792-8115China - Hong Kong SAR Tel: 852-2943-5100China - NanjingTel: 86-25-8473-2460China - QingdaoTel: 86-532-8502-7355China - Shanghai Tel: 86-21-3326-8000China - Shenyang Tel: 86-24-2334-2829China - Shenzhen Tel: 86-755-8864-2200China - SuzhouTel: 86-186-6233-1526China - WuhanTel: 86-27-5980-5300China - Xiamen Tel: 86-592-2388138China - XianTel: 86-29-8833-7252ASIA/PACIFICChina - ZhuhaiTel: 86-756-321-0040India - Bangalore Tel: 91-80-3090-4444India - New Delhi Tel: 91-11-4160-8631India - PuneTel: 91-20-4121-0141Japan - Osaka Tel: 81-6-6152-7160Japan - TokyoTel: 81-3-6880-3770Korea - Daegu Tel: 82-53-744-4301Korea - Seoul Tel: 82-2-554-7200Malaysia - Kuala Lumpur Tel: 60-3-7651-7906Malaysia - Penang Tel: 60-4-227-8870Philippines - Manila Tel: 63-2-634-9065SingaporeTel: 65-6334-8870Taiwan - Hsin Chu Tel: 886-3-577-8366Taiwan - Kaohsiung Tel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600Thailand - Bangkok Tel: 66-2-694-1351Vietnam - Ho Chi Minh Tel: 84-28-5448-21005/15/19The Microchip name and logo, the Microchip logo, IGLOO and Libero are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies.© 2019, Microchip Technology Incorporated. All Rights Reserved. 11/19 DS00003294A。

Data Sheet Fujitsu Notebook LIFEBOOK E4412Fujitsu recommends Windows 11 Pro.Data SheetFujitsu Notebook LIFEBOOK E4412Your Well-Equipped Everyday PartnerThe Fujitsu LIFEBOOK E4412 is exclusively designed for office workers needing a powerful and well-equipped notebook that offers a fair price-performance ratio. Great connectivity options such as 4 G/LTE or Intel® Thunderbolt™ 4, an integrated fingerprint sensor and a modern robust design help you to work efficiently wherever you are.Modern and robust designReliable mobility, ease of use and modern looks for everyday business demands Ultra slim 19.9 mm entry notebook starting at 1.35 kg with magnesium LCD lid Enjoy an ergonomic viewing experience with an anti-glare 14.0-inch FHD display Reliable and secure performanceProtect your notebook and business data from unauthorized access at all times Fingerprint sensorBuilt-in Privacy Camera Shutter: Protecting your privacyInfrared Camera: Allows face recognistion with Windows Hello Intel® Iris® Xe GraphicsBest in class connectivityBe flexible and stay productive wherever you areFull set of ports with a full-sized HDMI, LAN connector and USB Type-C with Intel® Thunderbolt™ 4 Embedded 4G/LTE enables you to access and transfer data fasterConvenient serviceability and upgradeabilityEasy access to key components to reduce upgrade time and costsBattery, memory, internal storage and connectivity components can be changed with easeComponentsBase unit LIFEBOOK E4412Operating systemsOperating system pre-installed Windows 11 Pro. Fujitsu recommends Windows 11 Pro for business.Windows 11 HomeWindows 10 Pro. Fujitsu recommends Windows 11 Pro for business.Microsoft OS support information Windows 11 requires for first device setup:- Internet connectivity- Microsoft account for Home editions or organizational account (e.g. ADD) for Pro editionsAfter product end of life, Fujitsu continues to test and support new Windows releases for max. 5 years, depending onextension of hardware services through warranty top ups.For more details please visit our Fujitsu Service Statement under https:///IndexProdSupport.asp?lng=com&OpenTab=Operating system notes The use of Windows Operating System is subject to acceptance of the End User License Agreement of Microsoft asapplicable under the relevant Microsoft program.Processor Intel® Core™ i7-1255U processor (10C, up to 4.7 GHz) *, ***Intel® Core™ i5-1235U processor (10C, up to 4.4 GHz) *, ***Intel® Core™ i3-1215U processor (6C, up to 4.4 GHz) ** Processor only for retail, SMB, education and government***Processor supports Intel® vPro® EssentialMemory modules 4 GB (1 module(s) 4 GB) DDR4, 3,200 MT/s, SO DIMM8 GB (1 module(s) 8 GB) DDR4, 3,200 MT/s, SO DIMM16 GB (1 module(s) 16 GB) DDR4, 3,200 MT/s, SO DIMM32 GB (1 module(s) 32 GB) DDR4, 3,200 MT/s, SO DIMMHard disk drives (internal)PCIe-SSD, 512 GB M.2 NVMe module, SEDPCIe-SSD, 256 GB M.2 NVMe module, SEDPCIe-SSD, 1 TB M.2 NVMe module, SEDHard disk notes Durability in accordance with the manufacturer’s indications on read and write cycles.Interface add on cards/components(optional)4G/ LTE (optional)Quectel EM120R-GL (4G Cat.12) (Downlink speed 600 MB/s, Uplink speed 150 MB/s)LTE Sierra Wireless EM7421B (Cat.7) (Downlink speed up to 300 Mbit/s, Uplink speed up to 150 Mbit/s)Display35.6 cm (14.0-inch), FHD, 1,920 x 1,080 pixel, Anti-glare IPS display, 250 cd/m² (FHD), 700:1 (FHD)MultimediaCamera Built-in webcam (HD) with Status LED Built-in Infrared webcam (HD) with Status LED Camera notes720p, 1 megapixels, 1280 x 720, with Privacy Camera ShutterMicrophone dual digital array microphoneBase unitBase unit LIFEBOOK E4412General system informationChipset Integrated in CPUSupported capacity RAM (min.) 4 GBSupported capacity RAM (max.)64 GBMemory slots 2 SO DIMM (DDR4, 3200 MHz)General system informationMemory notes Dual channel supportLAN10/100/1,000 MBit/s Intel® I219LMIntegrated WLAN Intel WiFi 6E AX211 - WLAN, BT, SRD cat. 2BIOS version UEFI Specification 2.8BIOS features InsydeH2O BIOSAudio type On boardAudio codec Realtek ALC257Audio features2x built-in speakers (stereo)MIL-STD tested Yes, selected MIL-STD-810H tests passed.MIL-STD-810H test results are not a guarantee of future performance under identified test conditions.Accidental damage is not covered under standard international limited warranty.GraphicsBase unit LIFEBOOK E4412Graphics brand name Intel® UHD Graphics (with Single channel memory), Intel® Iris® Xe Graphics (with Dual channel memory) Graphics notes Shared memory depending on main memory size and operating systemInterfacesAudio: line-in / line-out1Internal microphones2x digital array microphones (optional)USB 3.2 Gen1 (5 Gbps) total2x Type-A (1 with Anytime USB charge functionality)Thunderbolt™ 4 total2x Type-C with USB4 (40 Gbps, Power Delivery (15W), DP 1.4 out)HDMI*************************************Ethernet (RJ-45) 1 (with status LED)Memory card slots 1 microSD 3.0 StandardmicroSD card: 2GBmicroSDHC card: 32GBmicroSDXC card: 2TBSpeed Class: up to UHS-I (104MB/s)SIM card slot 1 (Nano-SIM, only for models with configuration WWAN ready or with 4G LTE modules)eSIM card eSIM integrated in 4G LTE module - Dual SIM (DSSA) supportedKensington Lock support 1 - Recommendation: Kensington’s Micro Security SaverPort Replicator interfaces (optional)USB Type-C PR Thunderbolt™ 4 PRDC-in 1 (19V/90W required) 1 (20V/170W required)Power on switch11Audio: line-in / line-out11Audio: comments Combo jack for headset usage Combo jack for headset usageUSB 3.2 Gen1 (5 Gbps) total3x Type-A - 5V/0.9A, 4.5W1x Type-C - 15W---USB 3.2 Gen2 (10 Gbps) total---2x Type-A - 5 V/0.9 A, 4.5 W1x Type-A - 5 V/2.4 A, 12 W2x Type-C - 5 V/1.5 A, 4.5 W charging portUSB 4.0 Gen3 (20 Gbps) total---1x Type-C - TBT4 up to 60 W (PD v2.0-1.1), 5-20 V/3. 0Aupstream (PC), Intel AMT support (vPRO) to client1x Type-C - TBT4 up to 15 W (PD v2.0-1.1), 5 V/3.0 Adownstream, power output to peripheral DisplayPort1x v1.2 2x v1.4++VGA1---HDMI text****************************************************************************Interface Notes1x USB Type-C to Client - Up to 60 W (PD v2.0-1.1) poweroutput to client or 4.5W input 1x USB Type-C to Client - Thunderbolt™ 4 up to 60 W (PD v2.0-1.1), 5-20V/3.0A upstream (PC), Intel AMT support (vPRO)Kensington Lock support no1Ethernet (RJ-45) 1 (10/100/1000) 1 (10/100/1000 Mbit/s, 2,5 Gbps)Port Replicator interfaces (optional)Notes Number of simultaneous used displays and its possible resolutions and frequencies depend on mobile system anddisplay interface type.Please consult always also the manual of the connected client.Keyboard and pointing devicesSpill-resistant keyboard, Available with standard keyboard or backlit keyboardNumber of keyboard keys: 85, Keyboard pitch: 19 mm, Keyboard stroke: 1.7 mmMulti gesture touchpad with two mouse buttonsWireless technologiesAntennas 2 Dual band WLAN antennas, +2 4G LTE antennas optionalBluetooth v5.3 hardware ready but may run at lower version due to OS limitationIntegrated WLAN Intel WiFi 6E AX211 - WLAN, BT, SRD cat. 2WLAN encryption WPA/WPA2/WPA3 (Wi-Fi Protected Access)WLAN notes WiFi 6E is supported by Windows 11 OS only - Windows 10 OS supports WiFi 6 only.Import and usage according to country-specific regulations.Integrated LTE or UMTS(4G) LTE Quectel EM120R-GL (Cat.12) - eSIM integrated - UMTS,LTE(4G) LTE Quectel EM05-G (Cat.4) - eSIM integrated - UMTS,LTE(4G) LTE Sierra Wireless EM7421B (Cat.7) - eSIM integrated - UMTS,LTELTE/UMTS/GPS notes OptionalNFC NoGPS Embedded in 4G module if configured with WWANPower supplyAC Adapter20 V / 65 W (3.25 A), 100 V - 240 V, 50 Hz - 60 Hz, 3-pin (grounded) Type-C AC-Adapter slim&lightAC Adapter20 V / 65 W (3.25 A), 100 V - 240 V, 50 Hz - 60 Hz, 3-pin (grounded) Type-C AC-Adapter standard1st battery options Li-Ion battery 4-cell, 3,915 mAh, 60 Wh1st battery Lithium polymer battery 4-cell, 60 Wh, 3915 mAhBattery features Quick Charge: 80% in 1hRuntime 1st battery10h 30min (up to)Battery notes Battery runtime information is based on worldwide acknowledged BAPCo® MobileMark® 2018. Refer to www.bapco.com for additional details.The BAPCo® MobileMark® Benchmark provides results that enable direct product comparisons betweenmanufacturers. It does not guarantee any specific battery runtime which actually can be lower and may varydepending on product model, configuration, application and power management settings. The battery capacitydecreases slightly with every re-charge and over its lifetime.Noise emissionNoise emission Please refer to the Eco DeclarationDimensions / Weight / EnvironmentalDimensions (W x D x H)322 x 211 x 19.9 mm12.68 x 8.31 x 0.78 inchWeight 1.35 kg (starting from)Weight (lbs)starting from 2.98 lbsWeight notes Weight may vary depending on actual configurationOperating ambient temperature 5 - 35 °C (41 - 95 °F)ComplianceProduct LIFEBOOK E4412Model5E14A3Europe CECBGlobal TCO Certified 9.0ENERGY STAR® 8.0EPEAT® Gold (dedicated regions)Compliance link https:///sites/certificatesAdditional SoftwareAdditional software (preinstalled)Fujitsu Plugfree Network (network management utility)Fujitsu Anytime USB Charge UtilityFujitsu Battery UtilityFujitsu Function ManagerFujitsu DeskUpdate (driver and utility tool)Additional software (notes)Use of accompanying and/or additional Software is subject to proactive acceptance of the respective LicenseAgreements /EULAs/ Subscription and support terms of the Software manufacturer as applicable for the relevantSoftware whether preinstalled or optional. The software may only be available bundled with a software supportsubscription which – depending on the Software - may be subject to separate remuneration.ManageabilityManageability technology PXE Boot codeWake-on-LANManageability software DeskView ClientDeskView Instant BIOS ManagementSupported standards WMI (Windows Management Instrumentation)PXE (Preboot Execution Environment)DMI (Desktop Management Interface)SMBIOS (System Management BIOS)CIM (Common Information Model)BootP (made4you)Manageability link https:///global/products/computing/pc/manageability/SecurityPhysical Security Kensington Lock supportSystem and BIOS Security User and supervisor BIOS passwordUser Security Embedded fingerprint sensor (optional)TPM 2.0Hard disk passwordSecurity Notes The properties of the product provide a baseline for product security and therefore end-customer IT security.However, these properties are not sufficient on their own to protect the product from all existing threats, such asintrusion attempts, data exfiltration and other forms of cyberattacks. To customize security settings, please usethe configuration options as available for the respective product. During operation, the IT security of this productis within the responsibility of the respective administrator/end-user of the product. Please note, that Fujitsu as amanufacturer does not make any policy prescriptions or advocacy statements regarding IT security best practicesand/or general product operation.WarrantyWarranty period 1 year (for countries in EMEIA)Warranty type Bring-in Service / Collect & Return Service (depending on country)Warranty Terms & Conditions /warrantyDigital bug fixes Subject to availability and following their generic release for the product, bug fixes and function-preserving patchesfor product-related software (firmware) can be downloaded from the technical support at: https://support.ts.fujitsu.com/ free of charge by entering the respective product serial number. For application software supplied togetherwith the product, please directly refer to the support websites of the respective software manufacturer.Product Support - the perfect extensionRecommended Service9x5, Onsite Response Time: Next Business DaySpare Parts availability at least 5 years after shipment, for details see https:///Service Weblink/emeia/products/product-support-services/Recommended AccessoriesPLEVIER TACAN 14The Plevier Tacan 14 leather notebook bag provides a diverse range offeatures to optimize your carrier needs. With a shoulder strap, fast access pocket on the rear side and two compartments for your device and additional accessories, the bag provides multifunctional and protective space for your belongings. Its brown leather design creates a sleek finish to create a carrier that is high quality in both functionality and appearance.Order Code: S26391-F1193-L64Prestige Trolley 17The Fujitsu Prestige Trolley 17 protects and transports notebooks withup to 17 inch screens, along with clothes and toiletries. It is the perfectcompanion in a city environment or for overnight stays with four spacious compartments. Smooth running wheels and a telescopic handle ensure convenience, while the central section protects your notebook with shock-absorbing foam.Order Code: S26391-F1194-L130Top Case 14 (2021)The FUJITSU Accessories Top Case 14 protects notebooks with up to 14-inch screens. A padded top-loading notebook compartment with shock-absorbing foam provides excellent protection for your notebook. The bag is equipped with a front compartment for storage of power adapters, office supplies or personal items.Order Code: S26391-F20-L120Wireless Mouse WI860 BTCThe Wireless Mouse WI860 BTC can be paired with up to 3 different clients, 2x Bluetooth and 1x wireless USB Type-C dongle.With the blue optical sensor, it works on nearly all surfaces with an 3-step adjustable DPI selector (800/1600/2400).The mouse charges wirelessly through Qi or by USB Type-C cable.A utility button on the side is programmable. The default functions are optimized for Teams calls.Order Code:S26381-K474-L100ContactFujitsu Technology Solutions GmbH Website: 2023-11-27 EM-ENworldwide project for reducing burdens on the environment.Using our global know-how, we aim to contribute to the creation of a sustainable environment for future generations through IT.Please find further information at http://www./global/about/environmenttechnical specification with the maximum selection of components for the named system and not the detailed scope ofdelivery. The scope of delivery is defined by the selection of components at the time of ordering.Technical data is subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective owner, the use of which by third parties for their own purposes may infringe the rights of such owner.The overall product has been designed and manufactured for general office use, regular personal use and ordinary industrial use.More informationAll rights reserved, including intellectual property rights. Designations may be trademarks and/or copyrights of therespective owner, the use of which by third parties for their own purposes may infringe the rights of such owner. For further information see https:///global/about/resources/terms/ Copyright 2023 Fujitsu Technology Solutions GmbH。

OVERVIEWB 3.2 Gen 1 6.HDMI2.12.E-camera shutter switch7.Power connector3.Ethernet (RJ-45)8.Thunderbolt 44.Thunderbolt 49.Headphone / microphone combo jack (3.5mm)5.3x USB 3.2 Gen 1 (one Always On)PERFORMANCEProcessorProcessor Family11th Generation Intel® Core™ i5 / i7 ProcessorProcessor**Operating SystemOperating System**Windows® 11 Pro 64••Windows 11 Home 64Windows 10 Pro 64••Windows 10 Home 64•No operating systemGraphicsGraphics**Monitor SupportMonitor SupportSupports up to 4 independent displays (native display and 3 external monitors via HDMI® and USB-C®)• HDMI supports up to 7680x4320@60Hz• USB-C supports up to 5120x3200@60HzChipsetChipsetIntel HM570 chipsetMemoryMax Memory[1]•Up to 32GB DDR4-2933 offering•Up to 32GB DDR4-3200 offeringMemory SlotsTwo DDR4 SO-DIMM slots, dual-channel capableMemory Type**•DDR4-2933•DDR4-3200Notes:1.The max memory is based on the test results with current Lenovo® memory offerings. The system may support more memory as the technology develops.StorageStorage Support[1]Up to two drives, 2x M.2 SSD• M.2 2242 SSD up to 512GB• M.2 2280 SSD up to 1TBStorage SlotTwo M.2 slots• One M.2 2280 PCIe® Gen 3x4 slot, supports M.2 2242/2280 SSD• One M.2 2280 PCIe Gen 4x4 slot, supports M.2 2242/2280 SSDStorage Type**Notes:1.The storage capacity supported is based on the test results with current Lenovo storage offerings. The system may support larger storage as the technology develops.Removable StorageOpticalNoneCard ReaderNo card readerMulti-MediaAudio ChipHigh Definition (HD) Audio, Realtek® ALC3306 codecSpeakersStereo speakers, 2W x2, Nahimic AudioMicrophoneDual array microphoneCameraHD 720p, with E-camera shutter, fixed focusBatteryBattery**Integrated Li-Polymer 60Wh battery, supports Rapid Charge Pro (charge up to 50% in 30min)••Integrated Li-Polymer 80Wh battery, supports Rapid Charge Pro (charge up to 50% in 30min)Max Battery Life[1]MobileMark® 2018: 7.5 hrNotes:1.All battery life claims are approximate maximum and based on results using the MobileMark 2014, MobileMark 2018, JEITA 2.0, continuous 1080p video playback (with 150nits brightness and default volume level) or Google Power Load Test (PLT) battery-life benchmark tests. Actual battery life will vary and depends on many factors such as product configuration and usage, software use, wireless functionality, power management settings, and screen brightness. The maximum capacity of the battery will decrease with time and use.Power AdapterPower Adapter**[1]•230W slim tip (3-pin) AC adapter, 100-240V, 50-60Hz•300W slim tip (3-pin) AC adapter, 100-240V, 50-60HzNotes:1.AC adapter offerings depend on the country.DisplayDisplay**[1]TouchscreenNon-touchNotes:California Electronic Waste Recycling Fee1.In California, per state law, Lenovo charges an electronic waste recycling fee on this covered device at the time of sale of the product.For more information, go to https:///Electronics/ConsumerInput DeviceKeyboard**•Phantom blue model: 6-row, multimedia Fn keys, numeric keypad, black keycap•Stingray model: 6-row, multimedia Fn keys, numeric keypad, moon white keycapKeyboard Backlight**Blue backlight••White backlight•4-Zone RGB backlightTouchpadButtonless Mylar® surface multi-touch touchpad, 69 x 104 mm (2.72 x 4.09 inches)Mechanical[1]Dimensions (WxDxH)362.56 x 260.61 x 22.5-25.75 mm (14.27 x 10.26 x 0.89-1.01 inches)Weight2.4 kg (5.3 lbs)Case Color**•Phantom blue (top), shadow black (bottom)•Stingray (top), dove grey (bottom)Surface TreatmentPaintingCase MaterialPC + ABS (top), PC + ABS (bottom)System LightingNo system lightingNotes:1.The system dimensions and weight vary depending on configurations.CONNECTIVITYNetworkOnboard EthernetGigabit Ethernet, 1x RJ-45WLAN + Bluetooth®[1][2]Wi-Fi® 6, 802.11ax 2x2 Wi-Fi + Bluetooth 5.1, M.2 cardNotes:1.Bluetooth 5.2 is hardware ready but may run at a lower version due to OS limitation2.Wi-Fi 6 full features might be limited by country-level restrictions.Ports[1]Standard Ports3x USB 3.2 Gen 1••1x USB 3.2 Gen 1 (Always On)•1x Thunderbolt™ 4 / USB4® 40Gbps (support data transfer and DisplayPort™ 1.4)1x Thunderbolt 4 / USB4 40Gbps (support data transfer, Power Delivery and DisplayPort 1.4)••1x HDMI 2.1•1x Ethernet (RJ-45)•1x Headphone / microphone combo jack (3.5mm)•1x Power connectorNotes:1.The transfer speed of following ports will vary and, depending on many factors, such as the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment, will be slower than theoretical speed.USB 2.0: 480 Mbit/s;USB 3.2 Gen 1 (SuperSpeed USB 5Gbps, formerly USB 3.0 / USB 3.1 Gen 1): 5 Gbit/s;USB 3.2 Gen 2 (SuperSpeed USB 10Gbps, formerly USB 3.1 Gen 2): 10 Gbit/s;USB 3.2 Gen 2x2 (SuperSpeed USB 20Gbps): 20 Gbit/s;Thunderbolt 3/4: 40 Gbit/sSECURITY & PRIVACYSecuritySecurity ChipFirmware TPM 2.0 integrated in SoCFingerprint ReaderNo fingerprint readerBIOS Security•Power-on password•Supervisor passwordHard disk password•Other SecurityE-Camera shutterSERVICEWarrantyBase Warranty**[1]•1-year depot service1-year depot with 2-year system board service (Korea only)••2-year (1-yr battery) depot service•3-year (1-yr battery) depot service•No base warrantyNotes:1.More information of warranty policy, please access https:///warrantyENVIRONMENTALOperating EnvironmentTemperature[1]•At altitudes up to 2438 m (8,000 ft)- Operating: 5°C to 35°C (41°F to 95°F)- Storage: 5°C to 43°C (41°F to 109°F)•At altitudes above 2438 m (8,000 ft)- Maximum temperature when operating under the unpressurized condition: 31.3°C (88°F)HumidityOperating: 8% to 95% at wet-bulb temperature 23°C (73°F)••Storage: 5% to 95% at wet-bulb temperature 27°C (81°F)AltitudeMaximum altitude (without pressurization): 3048 m (10,000 ft)Notes:1.When you charge the battery, its temperature must be no lower than 10°C (50°F).ACCESSORIESBundled AccessoriesBundled AccessoriesLenovo Legion™ M300 RGB Gaming Mouse (USB connector)••NoneCERTIFICATIONSGreen CertificationsGreen Certifications•ErP Lot 3•RoHS compliant•Feature with ** means that only one offering listed under the feature is configured on selected models.Lenovo reserves the right to change specifications or other product information without notice. Lenovo is not •responsible for photographic or typographical errors. LENOVO PROVIDES THIS PUBLICATION “AS IS,”WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allowdisclaimer of express or implied warranties in certain transactions, therefore this disclaimer may not apply to you.•The specifications on this page may not be available in all regions, and may be changed or updated without notice.。

High performance 802.11ac Wave 2 wirelessThe Cisco Meraki MR42 is a fourradio, cloud-managed 3x3 MU-MIMO 802.11ac Wave 2 access point. Designed for next-generation deployments in offices, schools, hospitals, shops, and hotels, the MR42 offers performance, security, and simple management.The MR42 provides a maximum 1.9 Gbps frame rate with concurrent 802.11ac Wave 2 and 802.11n 3x3:3 MIMO radios. A dedicated third radio provides real-time WIDS/WIPS with automated RF optimization. In addition, an integrated fourth radio delivers Bluetooth Low Energy (BLE) scanning and Beaconing functionality.With a combination of cloud management,high perfomance hardware, multipleradios, and advanced software features,the MR42 makes an outstanding platformfor the most demanding of uses today andtomorrow. These uses include high-densitydeployments and support for applicationslike voice and high-definition video.MR42 and Meraki cloudmanagement: a powerfulcombinationManagement of the MR42 is handledthrough the Meraki cloud, enablingrapid deployment across multiple siteswithout the need for time-consumingtraining or costly certifications. Since theMR42 is self-configuring and managedover the web, it can be deployed at aremote location in a matter of minutes,even without on-site IT staff.24/7 monitoring via the Meraki clouddelivers real-time alerts if the networkencounters problems. Remote diagnostictools enable immediate troubleshootingover the web, meaning multi-site, distributednetworks can be easily managed.The MR42’s firmware is automatically keptup to date via the cloud. New features, bugfixes, and enhancements are deliveredseamlessly over the web. This means nomanual software updates to download ormissing security patches to worry about.Product Highlights»3x3:3 MU-MIMO 802.11ac Wave 2»1.9 Gbps aggregate dual-band frame rate»24x7 real-time WIDS/WIPS and spectrum analytics via dedicated third radio»Integrated Bluetooth Low Energy Beacon andscanning radio»Enhanced transmit power and receive sensitivity »Full-time WiFi location tracking via dedicated 3rd radio »Integrated enterprise security and guest access»Application-aware traffic shaping»Optimized for voice and video»Self-configuring, plug-and-play deployment»Sleek, low-profile design blends into office environmentsMR42Dual-band 802.11ac Wave 2 access point with separate radios dedicated to security, RF management, and BluetoothAggregate data rate of up to 1.9 GbpsA 5 GHz 3x3:3 radio and a 2.4 GHz 3x3:3 radio offer a combined aggregate dual-band frame rate of 1.9 Gbps. Supports upto 1,300 Mbps in the 5 GHz band and 600 Mbps in the 2.4 GHz band. Technologies like transmit beamforming and enhanced receive sensitivity allow the MR42 to support a higher client density than typical enterprise-class access points, resultingin fewer APs for a given deployment. Multi User Multiple InputMultiple Output (MU-MIMO)With support for the 802.11ac Wave 2 standard, the MR42 offers MU-MIMO for efficient transmission to multiple clients. Especially suited for enviroments with numerous mobile devices, MU-MIMO enables multiple clients to receivedata simultanously. This increasesthe total network perfomance and improves the end user experience.Third radio delivers 24x7 wireless security and RF analyticsThe MR42’s sophisticated, dedicateddual-band radio scans the environment continuously, characterizing RF interference and containing wireless threats like rogue access points. No longer choose between wireless security, advancedRF analysis, and serving client data: a dedicated third radio means that all three occur in real-time, without any impactto client traffic or AP throughput. Bluetooth Low Energy Beaconand scanning radioAn integrated fourth radio for Bluetooth Low Energy (BLE) provides seamless deployment of BLE Beacon functionality and effortless visibility of BLE devices. The MR42 enables the next generation of location-aware applications while futureproofing your deployment, making it ready for any new customer engagement strategies.Automatic cloud-based RF optimization The MR42’s sophisticated, automatedRF optimization means that there is noneed for the dedicated hardware andRF expertise typically required to tune awireless network. The RF analysis datacollected by the dedicated third radiois continuously fed back to the Merakicloud. This then automatically tunesthe MR42’s channel selection, transmitpower, and client connection settingsfor optimal performance under eventhe most challenging RF conditions.Integrated enterprise security andguest accessThe MR42 features integrated, easy-to-usesecurity technologies to provide secureconnectivity for employees and guests alike.Advanced security features such as AEShardware-based encryption and WPA2-Enterprise authentication with 802.1X andActive Directory integration provide wire-likesecurity while still being easy to configure.One-click guest isolation provides secure,Internet-only access for visitors. Our policyfirewall (Identity Policy Manager) enablesgranular access control at the group ordevice level. PCI compliance reports checknetwork settings against PCI requirementsto simplify secure retail deployments.Enterprise Mobility Management(EMM) & Mobile DeviceManagement (MDM) integrationMeraki Systems Manager natively integrateswith the MR42 to offer simple automaticsecurity that is context aware. Rapidlydeploy self-service MDM enrolment withoutinstalling additional equipment or dynami-cally tie firewall policies to client posture.End-to-end security has never been so easy.Application-aware traffic shapingThe MR42 includes an integrated layer 7packet inspection, classification, and controlengine, enabling you to set QoS policiesbased on traffic type. Prioritize your missioncritical applications, while setting limits onrecreational traffic, e.g., peer-to-peer andvideo streaming. Importantly, controls canbe implemented per network, per SSID,per user group, or per individual user.Voice and video optmizationsIndustry standard QoS features are easyto configure and come built in. WirelessMulti Media (WMM) access categories,802.1p, and DSCP industry standardsall ensure important applications getpriorotized correctly, not only on theMR42, but on other steps in the trafficflow. Unscheduled Automatic PowerSave Delivery (U-APSD) ensures minimalbattery drain on wireless VoIP phones.Low-profile, modern, userfriendly designDespite its extensive capabilities, theMR42 is packaged in a sleek, low-profileenclosure that blends seamlessly intoany environment. This makes it ideal formodern offices, high end retail locations,and discrete deployments. Using humaninterface design principles, even thephysical installation and mountingexperience has been developed to eliminateerror and simplify installation process.Self-configuring, self-maintaining,always up-to-dateWhen plugged in, the MR42 automaticallyconnects to the Meraki cloud, downloadsits configuration, and joins the appropriatenetwork. If new firmware is required,this is retrieved by the AP and updatedautomatically. This ensures the network ismaintained with bug fixes, security updates,and new features managed for you.Advanced analyticsDrill down into exceptional detail withhighly granular traffic analytics. Understandhow your network is used with access tonumerous datasets. Extend your visibilityto the physical world with journey trackingthrough location analytics. View vistornumbers, dwell time, repeat visit rates, andtrack trends. Fully customize your analysiswith raw data available via simple APIs.FeaturesSpecificationsRadios2.4 GHz 802.11b/g/n client access radio5 GHz 802.11a/n/ac client access radio2.4 GHz & 5 GHz dual-band WIDS/WIPS, spectrum analysis, & location analytics radio2.4 GHz Bluetooth radio with Bluetooth Low Energy (BLE) and Beacon supportConcurrent operation of all four radiosMax aggregate frame rate 1.9 Gbit/sSupported frequency bands (country-specific restric-tions apply):2.412-2.484 GHz5.150-5.250 GHz (UNII-1)5.250-5.350 GHZ (UNII-2)5.470-5.600, 5.660-5.725 GHz (UNII-2e)5.725 -5.825 GHz (UNII-3)AntennaIntegrated omni-directional antennas (5 dBi gain at 2.4 GHz, 5.5 dBi gain at 5 GHz)Individual antenna elements for each radio802.11ac Wave 2 and 802.11n Capabilities3 x 3 multiple input, multiple output (MIMO) with three spatial streamsSU-MIMO and MU-MIMO supportMaximal ratio combining (MRC) & beamforming20 and 40 MHz channels (802.11n), 20, 40, and 80 MHz channels (802.11ac)Up to 256-QAM on both 2.4 GHz & 5 GHzPacket aggregationPowerPower over Ethernet: 37 - 57 V (802.3at required with functionality-restricted 802.3af mode supported) Alternative 12 V DC inputPower consumption: 20W max (802.3at)Power over Ethernet injector and DC adaptersold separatelyLED IndicatorsMulti color & multi function status indicatorInterfaces1x 10/100/1000Base-T Ethernet (RJ45)1x DC power connector (5.5 mm x 2.5 mm,center positive)MountingAll standard mounting hardware includedDesktop, ceiling, and wall mount capableCeiling tile rail (9/16, 15/16 or 1 ½” flush or recessedrails), assorted cable junction boxesBubble level on mounting cradle for accurate horizon-tal wall mountingPhysical SecurityTwo security screw options (included)Kensington lock hard pointConcealed mount plate with anti-tamper cable bayEnvironmentOperating temperature: 32 °F to 104 °F (0 °C to 40 °C)Humidity: 5 to 95% non-condensingPhysical Dimensions10.0” x 6.1” x 1.5” (253.4 mm x 155.8 mm x 37.1 mm), notincluding deskmount feet or mount plateWeight: 25 oz (0.7kg)SecurityIntegrated Layer 7 firewall with mobile device policymanagementReal-time WIDS/WIPS with alerting and automaticrogue AP containment with Air MarshalFlexible guest access with device isolationVLAN tagging (802.1q) and tunneling with IPsec VPNPCI compliance reportingWEP, WPA, WPA2-PSK, WPA2-Enterprise with 802.1XEAP-TLS, EAP-TTLS, EAP-MSCHAPv2, EAP-SIMTKIP and AES encryptionEnterprise Mobility Management (EMM) & MobileDevice Management (MDM) integrationQuality of ServiceAdvanced Power Save (U-APSD)WMM Access Categories with DSCP and802.1p supportLayer 7 application traffic identification and shapingMobilityPMK and OKC credential support for fastLayer 2 roamingDistributed or centralized layer 3 roamingAnalyticsEmbedded location analytics reporting anddevice trackingGlobal L7 traffic analytics reporting per network, perdevice, per applicationWarrantyLifetime hardware warranty with advanced replace-ment includedOrdering InformationMR42-HW: Meraki MR42 Cloud Managed 802.11ac APMA-PWR-30W-XX: Meraki AC Adapter for MR Series(XX = US, EU, UK or AU)MA-INJ-4-XX: Cisco Meraki 802.3at Power over Ether-net Injector (XX = US, EU, UK or AU)Note: Meraki access point license required.Compliance & StandardsIEEE Standards Array 802.11b802.11g802.11a802.11n802.11ac802.11h802.11i802.11e802.11k802.11r802.11uSafety ApprovalsUL 60950-1CAN/CSA-C22.2 No. 60950-1IEC 60950-1EN 60950-1UL 2043 (Plenum Rating)Radio ApprovalsFCC Part 15C, 15ERSS-247 (Canada)EN 300 328, EN 301 893 (Europe)AS/NZS 4268 (Australia/NZ)NOM-121 (Mexico)NCC LP0002 (Taiwan)For additional country-specific regulatory information, please contact Meraki salesEMI Approvals (Class B)FCC Part 15BICES-003 (Canada)EN 301 489-1-17, EN 55032, EN 55024 (Europe)CISPR 22 (Australia/NZ)VCCI (Japan)Exposure ApprovalsFCC Part 2RSS-102 (Canada)EN 50385, EN 62311, EN 62479 (Europe)AS/NZS 2772 (Australia/NZ)Signal Coverage Patterns。

Data Sheet Fujitsu Notebook LIFEBOOK U7412Fujitsu recommends Windows 11Pro.Data SheetFujitsu Notebook LIFEBOOK U7412The FujitsuLIFEBOOK U7412is amodern slim&light notebookforbusiness professionals seeking optimum mobility forbusiness tripsandergonomicsin theoffice.Basedon the12th generation I n t e l ®Core ™processor,a14-inch screen,light weight of 1.18kg and an all-daybatteryruntime enablesit to provide excellent mobility and portability.Elegant design and great mobilityMaximize your productivity with premiumnotebooksproviding ultimateconvenience ■Thanks tothe completemagnesium housing,the weight of the remarkably slim18.9mmultra-mobile notebookstarts at1.18kg■The I n t e l ®Evo ™v P r o ®platform offersagreat thin-and-light notebook experience■EnjoytheI n t e l ®I r i s ®XeGraphicswith an FHD orHD display■The outdoor-friendly anti-glare,FHD touch panelcomeswith anarrowbezel design in awarm silver coloredchassis Excellent securityEnhance your securitywith outstandingfeatures to best protect yournotebookand companydata ■Integrated PalmSecure ™or fingerprint sensor■infrared Camera:Allowsfacerecognition withWindows Hello ■ePrivacy F i lter :Keepsafe fromprying eyes■Built-in Privacy Camera Shutter:Protecting your privacy ■SMartCard readerPremium connectivityStay flexibleand productive within amodern workplace environment ■Compactandversatile I n t e l ®Thunderbolt ™4USBType-Cconnectorto charge your laptop, transferfilesatfastedspeeds,connectexternal monitors andother peripherals■Fullset ofinterfaceswith full-size LAN connectorandHDMI ■Embedded 5G/LTEUltra-Mobile Meets UltraSecureConvenient upgradeabilityDirect access tokeycomponentsreducesupgradetimeand costs ■Battery,memoryandinternal storage canbe changedeasilyFamilyconceptReduce youracquisition costaswellasthecomplexity ofyourITequipment■Family port replicator forthe wholeLIFEBOOK E5andU7Seriesensures ultimateflexibility and shared workplace concepts■Shared componentssuch astheUSBType-Cport replicator,USBType-CAC Adapter,BIOS andBit Image across the ultra-mobile LIFEBOOK U7familyComponentsBaseunit LIFEBOOKU7412Operating systemsOperating system pre-installed Windows11 P r o.FujitsurecommendsWindows11Proforbusiness. Windows 11 HomeWindows10 P r o.FujitsurecommendsWindows11Proforbusiness.Microsoft OS support information Aftertheendoftheproduct lifeFujitsuwill continue totestand support allupcoming Windows releases foraperiod ofmaximum5years,depending on theavailable extensionof hardwareservicesthrough FujitsuWarranty topups.Fordetailspleasesee“Fujitsu Service StatementforWindows General Availability Channel”athttps:///IndexProdSupport.asp?lng=com&OpenTab=Operating system notes TheuseofWindows Operating Systemissubjectto acceptanceof theEndUserLicense Agreement ofMicrosoft as applicable under the relevantMicrosoft program.Processor I n t e l®Core™i7-1270P processor(12C,upto4.8GHz)I n t e l®Core™i7-1255Uprocessor(10C,up to4.7GHz)*I n t e l®Core™i5-1250Pprocessor(12C,up to4.4GHz)I n t e l®Core™i5-1245Uprocessor (10C,up to4.4GHz)I n t e l®Core™i5-1240Pprocessor(12C,upto4.4GHz)*I n t e l®Core™i5-1235U processor(10C,upto4.4GHz)*I n t e l®Core™i3-1215U processor(upto4.4GHz)**Processor only forr etai l,SMB,educationand governmentMemorymodules4GB(1module(s)4GB)DDR4, 3,200MT/s,SO DIMM8GB(1module(s)8GB)DDR4, 3,200MT/s,SO DIMM16GB(1module(s)16GB)DDR4, 3,200MT/s,SO DIMM32GB(1module(s)32GB)DDR4, 3,200MT/s,SO DIMMHarddiskdrives(internal)PCIe-SSD,512 GBM.2NVMe module,SEDPCIe-SSD,256 GBM.2NVMe module,SEDPCIe-SSD,2T BM.2NVMemodule,SEDPCIe-SSD,1T BM.2NVMe module,SEDHard disknotes Accessiblecapacity mayv ar y,also depending on usedsoftware.Interfaceaddoncards/components(optional)5GLTE FibocomFM350-GL(5GSub-6/cat.19)(Downlink speed5G-3740 MB/s,4G-1600 MB/s,Uplink speed5G-835MB/s, 4G -211MB/s)Display35.6cm(14.0-inch),IPS,FHD,1,920x1,080pixel,Anti-glare multi-touch,300c d/m²(Touch),700:1(Touch)35.6cm(14.0-inch),HD,1,366x768pixel,Anti-glaredisplay,220c d/m²(HD),500:1(HD)35.6cm(14.0-inch),FHD,1,920x1,080pixel,Anti-glareIPS display,400c d/m²(FHD),800:1(FHD)35.6cm(14.0-inch),FHD,1,920x1,080pixel,Anti-glareePrivacyFilter,400c d/m²(eP F),1000:1(ePF) MultimediaCamera Built-in webcam(HD)with StatusBuilt-in Infraredwebcam(HD)with StatusLEDLEDCamera notes720p,1 megapixels,1280 x720,with Privacy CameraShutterMicrophone dualdigital arraymicrophoneBase unitBaseunit LIFEBOOK U7412General system informationChipset IntegratedSupportedcapacity RAM(min.)4GBSupportedcapacity RAM(max.)64GBMemoryslots2SO DIMM(DDR4,3200MHz)Memorynotes DualchannelsupportLAN10/100/1,000MBit/s I n t e l®I219LMIntegrated WLAN IntelWiFi6EAX211-WLAN,B T,SRD cat.2BIOS version UEFI Specification2.8BIOS features InsydeH2OBIOSAudio type OnboardAudio codec Realtek ALC257Audio features2x built-in speakers(2Weach),Stereo audioMIL-STD tested Y e s,selectedMIL-STD-810H tests passed.MIL-STD-810H testresults arenot aguaranteeof futureperformance under identified testconditions.Accidental damage is not coveredunder standardinternational limited warranty.Color WarmSilverMaterial MagnesiumGraphicsBaseunit LIFEBOOK U7412Graphicsbrand name I n t e l®UHD Graphics(with Single channelmemory),I n t e l®I r i s®XeGraphics(withDualchannelmemory) Graphicsnotes Sharedmemorydepending on mainmemorysize andoperating systemInterfacesAudio:line-in/line-out1Internal microphones2xdigital arraymicrophones(optional)USB3.2Gen1(5Gbps)total2xType-A(1with Anytime USBchargefunctionality)USB4.0Gen3(20Gbps) total2xType-C I n t e l® Thunderbolt™4(40Gbps),PowerDelivery (15W),DPoutHDMI1*************************************Ethernet(RJ-45)1(withstatusLED)Memorycardslots1microSD 3.0StandardmicroSD card:2GBmicroSDHC card:32GBmicroSDXC card:2TBSpeedClass:upto UHS-I(104MB/s)SmartCard slot1(optional)SIM cardslot 1 (Nano-SIM,only formodelswith configuration WWAN readyorwith4G/5GL T Emodules)eSIM card eSIM integrated in4G/5GL T Emodules-Dual SIM(DSSA)supportedDocking connectorforPortReplicator1-PRModel:NPR50Kensington Locksupport1-Recommendation:Kensington’s Micro Security SaverPort Replicatorinterfaces(optional)USBType-C PR Thunderbolt™4PR Mechanical PRModel:NPR50DC-in1(19V/90Wrequired)1(20V/170W required)1(19V/90Wrequired) Poweron switch111Audio:line-in/line-out------1Audio:comments1Combojackforheadsetusage1Combojackforheadsetusage Combo-PortData Sheet Fujitsu Notebook LIFEBOOK U7412Fujitsu recommends Windows11Pro. Port Replicatorinterfaces(optional)USB3.2Gen1(5Gbps)total------4xType-A2xType-CDisplayPort1xV1.22xV1.4++2(upto2x3840x216060Hz) VGA1---1(upto1920x12006Hz)HDMI text1V2.0b1(upto4096x216060Hz)Interface Notes3xType-A-5V/0.9A,4.5W1xType-C-15W1xType-C-Upto 60W(PDv2.0-1.1)poweroutputtoclientor4.5Winput 2xType-A-5V/0.9A,4.5W1xType-A-5V/2.4A,12W2xType-C-5V,1.5A/4.5W chargingport1xType-C-T B T4upto60W(PDv2.0-1.1),5-20V/3.0Aupstream(P C),IntelAMT support (vPRO)1xType-C-T B T4upto15W(PDv2.0-1.1),5V/3.0Adownstream,poweroutputtoclientTheshown up to resolutions aremaximumvalueseachport andwillbe different depending on Multi-Displaycombinations.Kensington Locksupport no11(lockPortreponly)Ethernet(RJ-45)11(10/100/1000Mbit/s,2,5Gbps)1Notes Number ofsimultaneous useddisplays andits possibleresolutionsand frequencies dependon mobile system anddisplay interface type.Pleaseconsult alwaysalso themanualofthe connectedclient.1RJ45(10/100/1000)Keyboardandpointing devicesSpill-resistant keyboard,Available with standardkeyboardor backlit keyboardNumber ofkeyboardkeys:85,Keyboardpitch:19 m m,Keyboardstroke:1.7mmMulti gesture touchpad with two mouse buttonsWireless technologiesAntennas 2 Dual bandWLAN antennas,2+2L T EantennasoptionalBluetooth v5.2Integrated WLAN IntelWiFi6EAX211-WLAN,B T,SRD cat.2WLANencryption WP A/WP A2/WP A3(Wi-F i ProtectedAccess)WLANnotes WiFi6Eis supportedbyWindows11OS only-Windows10 OS supportsWiFi6only.#Import and usage accordingto country-specific regulations.Integrated L T Eor UMTS(5G)L T EFibocomFM350-GL(Sub-6/cat.19)-eSIM integrated-UMTS,LTE,5GLT E/U MT S/G P S notes OptionalNFC NoGPS Embeddedin4G/5Gmoduleif configured withWWANPowersupplyACAdapter20V/65W(3.25A),100V-240V,50Hz-60H z,3-pin(grounded)Type-C AC-Adapter slim&lightACAdapter20V/65W(3.25A),100V-240V,50Hz-60H z,3-pin(grounded)Type-C AC-Adapter standard1st batteryoptions Li-Ionbattery4-cell,3,915mAh,60Wh1stbattery Lithiumpolymerbattery4-cell,60Wh,3915mAhBattery features QuickCharge:80%in 1hRuntime1st battery tbcNoise emissionNoise emission Pleaser efertotheEcoDeclarationDimensions/Weight/EnvironmentalDimensions(W xD xH)322x211x18.9mm12.68x8.31x0.74inchWeight starting from1.18kgWeight(lbs)starting from2.60lbsWeight notes Weight mayvarydepending on actualconfigurationOperating ambient temperature5-35°C(41-95°F)Operating relative humidity20-80%ComplianceModel7U14A3Germany GS(planned)Europe CECBUSA/Canada FCC(dependingon configuration)(planned)Global TCOCertified9.0Russia EACinprogressChina CCC(planned)Compliancelink https:///sites/certificatesAdditional SoftwareAdditional software(preinstalled)Fujitsu Plugfree Network(network managementutility)Fujitsu Anytime USB Charge UtilityFujitsu Battery UtilityFujitsu FunctionManagerFujitsu DeskUpdate(driver andutility tool)Additional software(notes)Useof additional softwareis subjectto proactive acceptanceofthe respective EndUserLicenseAgreementas applicable forthe relevant softwarewhether preinstalled oroptional.This also appliesforanyavailable patches thereof.ManageabilityManageability technology I n t e l®vPro™technology/iAMT(dependingonprocessor) PXEBoot codeWake-on-LANManageability software DeskViewClientDeskViewInstant BIOS ManagementSupportedstandards WMI(Windows ManagementInstrumentation)PXE(Preboot ExecutionEnvironment)DMI(DesktopManagementInterface)SMBIOS(SystemManagementBIOS) CIM(CommonInformation Model)BootP(made4you)Manageability link /fts/manageabilitySecurityPhysical Security Kensington LocksupportSystemandBIOS Security Userand supervisor BIOS passwordUserSecurity Accessprotectionvia internal SmartCard reader(optional) Embedded fingerprint sensor(optional)Embedded P al m S ecur e®sensor(optional) Hard diskpasswordSecurityNotes Thesecurity features included in theproduct alonecannot protectfromanyand allintrusion attemptsandcyberattacks.Foran adequate overalllevelof ITsecurity,further ITsecurity measures(e.g.supplementaryvirusscannersettings,firewall,access rights management,encryption etc.)must be adoptedindependentlyof theavailable systemconfiguration options. HencetheoverallITsecurity fortheproductis within the soleresponsibility of therespective user/administrator ofthe product.WarrantyWarranty period 3 years Next Business DayWarranty type Onsite Service within metro areasWarrantyT er m s&Conditions Warranty Information –Client Computing Devices : Fujitsu AustraliaDigitalbug fixes Subject to availability and following their generic release forthe product,bug fixes and function-preservingpatches forproduct-related software(firmware)canbe downloaded fromthe technical support a t:https:///freeof chargeby entering therespective product serial number.Forapplicationsoftwaresuppliedtogether with the product,pleasedirectlyr efertothe support websites of therespectivesoftwaremanufacturer.ProductSupport Services-theperfectextensionRecommendedService9x5,Onsite ResponseT i m e:Next BusinessDayWarrantySparePartsavailability5yearsafterendofproduct lifeService Weblink /emeia/products/product-support-services/Recommended AccessoriesThunderbolt™4Port Replicator FirstThunderbolt™Port Replicatoron the marketproviding enhancedsecurity and fullsupport ofI n t e l®AMT(vPro®).Theuniversalport caneasily connectalmosteverything with asingle cable andhigh speed-datatransfer.This smart workspace solutionkeepsyour deskcleanandtidy.Port ReplicatorforLIFEBOOK U7x12,E5x12,U7411andU7511Flexibility,expandability,desktop replacement,investment protection–to name justafewbenefitsof Fujitsu’s docking options.USBType-C Port Replicator2Connecttoyour peripherals.Adapt tothetaskon demand.Theuniversal USBType-C interface supports you to get your peripheral devices connectedeasily.MultiplyyourUSBportstoconnectyourperipheralsas wellasyourexternal display via HDMI,DisplayPort orVGA.Youalso canchargeyour external USBdeviceswithouttheneedofanyadditional charger.Battery4cell60Wh The4cell60Whbatteryrequires avoltage of 14.4Vandhasacapacityof 4170mAh.Theweight ofthebatteryis342 gms andtherecharge timeof thecellis60minutesfora80%charge and150minutesforacomplete 100%charge.CONTACTFujitsuProduct TeamFujitsu Product Portfolio Website:Fujitsu products,solutions &services In addition toFujitsuNotebookLIFEBOOK U7412,Fujitsuprovides arange ofplatform solutions.They combine reliable Fujitsu productswith thebest in services,know-how,andworldwide partnerships.Fujitsu PortfolioBuilding on industrystandards,Fujitsu offers afullportfolio of IThardwareand software products,services,solutions,andcloud offerings,ranging from clients to data centersolutions,and includes thebroad stackof Business Solutions,aswellasthefullstack of Cloud offering.This allowscustomers t o leverage alternative sourcing and delivery models t o increase th ei rbusiness agilityan d t o improve th ei r I T operation’s puting Products/global/products/computing/Softwarehttps:// /au/support/client-com puting-devices/notebooks/More informationLearnmoreabout FujitsuNotebook LIFEBOOK U7412,pleasecontact your Fujitsusales representative or Fujitsu Business partner,or visit ourwebsite.https:///au/products /computing/pc/notebooks/Fujitsu green policy innovation Fujitsu Green Policy Innovation is our worldwideproject forreducingburdens on theenvironment.Using our global know-h ow ,weaimto contribute tothecreationofasustainable environment forfuture generations through IT.Pleasefind further informationatSustainable Manufacturing -Fujitsu Uvance : Fujitsu AustraliaCopyrightsAllrights reserved,including intellectual propertyrights.Changes totechnical data reserved.Deliveryis subject to availability. Designations maybe trademarksand/or copyrights of the respective manufacturer,theuseofwhichby thirdparties fortheir own purposesmayinfringe therights of such owner More informationAllrights reserved,includingintellectualpropertyrights.Changesto technicaldatareserved.Deliveryis subjectto availability.Designations maybetrademarksand/orcopyrights of therespectivemanufacturer,theuseofwhich by thirdpartiesfortheir own purposes mayinfringetherights ofsuch owner.Copyright2022FujitsuProductPleasenotethatthedatasheet reflects the technical specification with themaximum selectionof components for thenamed system andnot thedetailed scope of delivery.Thescope ofdelivery is defined by theselectionofcomponents atthe timeof ordering.Technical datais subject tomodification and delivery subject to availability.Any liability thatthedataand illustrationsare complete, actual,or correct isexcluded.Designations maybe trademarksand/or copyrights of the respective owner,the useofwhichby third parties fortheir own purposesmayinfringe therightsof such owner.T h e overall product h as b een designed and manufactured f o r general offi ce u s e ,regular personal use,andordinary industrial use.Disclaimer。

技术文件技术文件名称：OTN标准简介技术文件编号：版本：V1.0共41页(包括封面)拟制苑岩审核会签标准化批准深圳市中兴通讯股份有限公司信息安全：本文为公司信息资产，请阅读者注意保密工作，信息安全分类如下：●技术原理属于机密文档，保密期为无限期；开局指导属于内部公开文档；维护经验属于内部公开文档。

●发布范围：公司内部文档更新：●如相关产品文档资料缺乏，统一反馈至***********.cn，经记录后，分派给相应事业部文档发布管理员，由其组织人员确认并协调编写，审核通过后，由文档发表管理员统一上载归档，并发布新编资料通知。

●如现有文档存在问题，请将信息反馈至***********.cn，经记录后，分派给相应事业部文档发布管理员，尤其组织人员进行确认并填写修订记录，确认完成后由文档发布管理员再次记录更新结果，经验证通过后，统一更新相关文档。

重大更新应以技术通告形式立即发布周知；常规更新每季度以邮件形式发布周知。

目录1 引言 (5)1.1 编写目的 (5)1.2 预期的读者和阅读建议 (5)1.3 文档约定 (5)2 术语、定义和缩略语 (5)3 参考文档 (6)4 背景介绍 (6)4.1 背景 (6)5 OTN标准简介 (8)5.1 OTUk帧的结构 (8)5.1.1 OTUk开销 (8)5.1.2 OTUk的FEC (12)5.1.3 OTUk帧的加扰 (14)5.2 ODUk的帧结构 (14)5.2.1 ODUk的PM开销 (16)5.2.2 ODUk的TCM开销 (18)5.2.3 ODUk中的其他开销 (22)5.3 OPUk的帧结构 (24)5.3.1 OPUk开销 (24)5.3.2 和映射有关的OPUk开销 (26)5.4 OTN的维护信号（Maintenance signals） (26)5.4.1 常见的维护信号 (26)5.4.2 OTUk的维护信号 (27)5.4.3 ODUk的维护信号 (27)5.5 客户信号的映射 (28)5.5.1 Mapping of CBR2G5, CBR10G and CBR40G signals (e.g.,STM-16/64/256) into OPUk (28)5.5.2 10GE（10.3125Gbps）业务到OTU2(11.1G)的映射 (32)5.5.3 4个ODU1到1个OPU2的映射（Mapping ODUk signals into the ODTUjksignal）335.5.4 同步映射和异步映射的比较 (40)1引言1.1编写目的本文档作为OTN标准G.709的普及性介绍文档，对G.709标准做了一个较为简单的介绍。

Data Sheet Fujitsu Notebook LIFEBOOK E5512Fujitsu recommends Windows 11 Pro.Data SheetFujitsu Notebook LIFEBOOK E5512The Fujitsu LIFEBOOK E5512 is designed for office workers needing a powerful and fully equipped notebook. Thanks to the 12th generation Intel® Core™ processor you can work efficiently wherever you are. Advanced security features like PalmSecure™ are protecting your business data against unauthorized access. Modern Standby provides you an instantly ready and always connected notebook.New ultra-slim and lightweight designReliable mobility, ease of use and modern good looks for everyday business demands New ultra-slim 20.1 mm entry notebook starting at 1.65 kg with magnesium LCD lidEnjoy an ergonomic viewing experience with a 15.6-inch outdoor friendly anti-glare HD or FHD display with touch optionReliable and secure performanceProtect your business data from unauthorized access at all times Integrated PalmSecure™ or finger print sensorInfrared Camera: Allows face recognition with Windows Hello Intel® Iris® Xe GraphicsBuilt-in Privacy Camera Shutter: Protecting your privacy SmartCard readerBest in class connectivityBe flexible and stay productive anywhere, anytimeCompact and versatile Intel® Thunderbolt™ 4 USB Type-C connector to charge your laptop, transfer files at fast speeds, connect external monitors and other peripherals Full set of ports with a full-sized HDMI and LAN connector and USB Type-CBased on the latest 12th Gen Intel® Core™ processors, enabling data to be processed faster Convenient serviceability and upgradeabilityEasy access to key components reduces upgrade time and costsBattery, memory, internal storage and connectivity components can be changed with ease Long-term stable platformProtect your investments and be ready for shared desk conceptsThis LIFEBOOK E5 Series provides an extraordinary guaranteed product lifecycle of 24 months.ComponentsBase unit LIFEBOOK E5512Operating systemsOperating system pre-installed Windows 11 Pro. Fujitsu recommends Windows 11 Pro for business.Windows 11 HomeWindows 10 Pro. Fujitsu recommends Windows 11 Pro for business.Microsoft OS support information Windows 11 requires for first device setup:- Internet connectivity- Microsoft account for Home editions or organizational account (e.g. ADD) for Pro editionsAfter product end of life, Fujitsu continues to test and support new Windows releases for max. 5 years, depending onextension of hardware services through warranty top ups.For more details please visit our Fujitsu Service Statement under https:///IndexProdSupport.asp?lng=com&OpenTab=Operating system notes The use of Windows Operating System is subject to acceptance of the End User License Agreement of Microsoft asapplicable under the relevant Microsoft program.Processor Intel® Core™ i7-1265U processor (10C, up to 4.8 GHz) **Intel® Core™ i7-1255U processor (10C, up to 4.7 GHz) *, ***Intel® Core™ i5-1245U processor (10C, up to 4.4 GHz) **Intel® Core™ i5-1235U processor (10C, up to 4.4 GHz) *, ***Intel® Core™ i3-1215U processor (6C, up to 4.4 GHz) *Intel® Celeron® processor 7305 (5C, 1.1 GHz) ** Processor only for retail, SMB, education and government** Processor supports Intel® vPro® Enterprise***Processor supports Intel® vPro® EssentialMemory modules 4 GB (1 module(s) 4 GB) DDR4, 3,200 MT/s, SO DIMM8 GB (1 module(s) 8 GB) DDR4, 3,200 MT/s, SO DIMM16 GB (1 module(s) 16 GB) DDR4, 3,200 MT/s, SO DIMM32 GB (1 module(s) 32 GB) DDR4, 3,200 MT/s, SO DIMMHard disk drives (internal)PCIe-SSD, 512 GB M.2 NVMe module, SEDPCIe-SSD, 256 GB M.2 NVMe module, SEDPCIe-SSD, 2 TB M.2 NVMe module, SEDPCIe-SSD, 1 TB M.2 NVMe module, SEDHard disk notes Accessible capacity may vary, also depending on used software.Interface add on cards/components(optional)4G/ LTE (optional)Quectel EM120R-GL (4G Cat.12) (Downlink speed 600 MB/s, Uplink speed 150 MB/s)Quectel EM05-G (4G Cat.4) (Downlink speed 150 MB/s, Uplink speed 50 MB/s)LTE Sierra Wireless EM7421B (Cat.7) (Downlink speed up to 300 Mbit/s, Uplink speed up to 150 Mbit/s)Display39.6 cm (15.6-inch), IPS, FHD, 1,920 x 1,080 pixel, Anti-glare multi-touch, 250 cd/m² (Touch), 700:1 (Touch)39.6 cm (15.6-inch), HD, 1,366 x 768 pixel, Anti-glare display, 220 cd/m² (HD), 500:1 (HD)39.6 cm (15.6-inch), FHD, 1,920 x 1,080 pixel, Anti-glare IPS display, 250 cd/m² (FHD), 700:1 (FHD)MultimediaCamera Built-in webcam (HD) with Status LED Built-in Infrared webcam (HD) with Status LED Camera notes720p, 1 megapixels, 1280 x 720, with Privacy Camera ShutterMicrophone dual digital array microphoneBase unitBase unit LIFEBOOK E5512General system informationChipset Integrated in CPUSupported capacity RAM (min.) 4 GBSupported capacity RAM (max.)64 GBMemory slots 2 SO DIMM (DDR4, 3200 MHz)Memory notes Dual channel supportLAN10/100/1,000 MBit/s Intel® I219LMIntegrated WLAN Intel WiFi 6E AX211 - WLAN, BT, SRD cat. 2BIOS version UEFI Specification 2.8BIOS features InsydeH2O BIOSAudio type On boardAudio codec Realtek ALC257Audio features2x built-in speakers (2 W each), Stereo audioMIL-STD tested Yes, selected MIL-STD-810H tests passed.MIL-STD-810H test results are not a guarantee of future performance under identified test conditions.Accidental damage is not covered under standard international limited warranty.GraphicsBase unit LIFEBOOK E5512Graphics brand name Intel® UHD Graphics (with Single channel memory), Intel® Iris® Xe Graphics (with Dual channel memory) Graphics notes Shared memory depending on main memory size and operating systemInterfacesAudio: line-in / line-out1Internal microphones2x digital array microphones (optional)USB 3.2 Gen1 (5 Gbps) total3x Type-A (1 with Anytime USB charge functionality)Thunderbolt™ 4 total2x Type-C with USB4 (40 Gbps, Power Delivery (15W), DP 1.4 out)HDMI**************************************Ethernet (RJ-45) 1 (with status LED)Memory card slots 1 microSD 3.0 StandardmicroSD cardmicroSDHC cardmicroSDXC cardSpeed Class: up to UHS-ISmartCard slot 1 (optional)SIM card slot 1 (Nano-SIM, only for models with configuration WWAN ready or with 4G LTE modules)eSIM card eSIM integrated in 4G LTE moduleDocking connector for Port Replicator 1 - PR Model: NPR50Kensington Lock support 1 - Recommendation: Kensington’s Micro Security SaverPort Replicator interfaces (optional)USB Type-C PR Thunderbolt™ 4 PR Thunderbolt™ 4 PR Mechanical PRModel: NPR50DC-in 1 (19V/90W required) 1 (20V/170W required) 1 (20V/170W required) 1 (19V/90W required) Power on switch1111Audio: line-in / line-out1111Audio: comments Combo jack for headsetusage Combo jack for headsetusageCombo jack for headsetusageCombo-PortUSB 3.2 Gen1 (5 Gbps) total3x Type-A - 5V/0.9A, 4.5W1x Type-C - 15W ------4x Type-A2x Type-CUSB 3.2 Gen2 (10 Gbps) total---2x Type-A - 5 V/0.9 A, 4.5 W1x Type-A - 5 V/2.4 A, 12 W2x Type-C - 5 V/1.5 A, 4.5 Wcharging port 2x Type-A - 5 V/0.9 A, 4.5 W1x Type-A - 5 V/2.4 A, 12 W2x Type-C - 5 V/1.5 A, 4.5 W charging port---Port Replicator interfaces (optional)USB 4.0 Gen3 (20 Gbps) total---1x Type-C - TBT4 up to 60 W(PD v2.0-1.1), 5-20 V/3. 0Aupstream (PC), Intel AMTsupport (vPRO) to client1x Type-C - TBT4 up to 15W (PD v2.0-1.1), 5 V/3.0 Adownstream, power outputto peripheral 1x Type-C - TBT4 up to 60 W (PD v2.0-1.1), 5-20 V/3. 0A upstream (PC), Intel AMT support (vPRO) to client1x Type-C - TBT4 up to 15W (PD v2.0-1.1), 5 V/3.0 A downstream, power outputto peripheral---DisplayPort1x v1.2 2x v1.4++ 2x v1.4++ 2 (up to 2x 3840x2160 60Hz) VGA1------ 1 (up to 1920x1200 6Hz)HDMI text 1 -Supports 4k@60Hz asspecified in HDMI 2.0b 1 - supports 4k@60Hz asspecified in HDMI 2.0b1 - Supports 4k@60Hz asspecified in HDMI 2.0b1 -Supports 4k@60Hz asspecified in HDMI 2.0bInterface Notes1x USB Type-C to Client - Upto 60 W (PD v2.0-1.1) poweroutput to client or 4.5Winput 1x USB Type-C to Client -Thunderbolt™ 4 up to 60W (PD v2.0-1.1), 5-20V/3.0Aupstream (PC), Intel AMTsupport (vPRO)1x USB Type-C to Client -Thunderbolt™ 4 up to 60W (PD v2.0-1.1), 5-20V/3.0Aupstream (PC), Intel AMTsupport (vPRO)---Kensington Lock support no11 1 (lock Portrep only)Ethernet (RJ-45) 1 (10/100/1000) 1 (10/100/1000 Mbit/s, 2,5Gbps)1 (10/100/1000 Mbit/s, 2,5Gbps)1 (10/100/1000)Notes Number of simultaneous used displays and its possible resolutions and frequencies depend on mobile system anddisplay interface type.Please consult always also the manual of the connected client.Keyboard and pointing devicesSpill-resistant keyboard with number block, Available with standard keyboard or backlit keyboardNumber of keyboard keys: 106, Keyboard pitch: 18.4 mm, Keyboard stroke: 1.7 mmMulti gesture touchpad with two mouse buttonsWireless technologiesAntennas 2 Dual band WLAN antennas, +2 4G LTE antennas optionalBluetooth v5.3 hardware ready but may run at lower version due to OS limitationIntegrated WLAN Intel WiFi 6E AX211 - WLAN, BT, SRD cat. 2WLAN encryption WPA/WPA2/WPA3 (Wi-Fi Protected Access)WLAN notes WiFi 6E is supported by Windows 11 OS only - Windows 10 OS supports WiFi 6 only.Import and usage according to country-specific regulations.LTE/UMTS/GPS notes OptionalIntegrated WWAN(4G) LTE Quectel EM120R-GL (Cat.12) - eSIM integrated - UMTS,LTE(4G) LTE Quectel EM05-G (Cat.4) - eSIM integrated - UMTS,LTE(4G) LTE Sierra Wireless EM7421B (Cat.7) - eSIM integrated - UMTS,LTENFC NoGPS Embedded in 4G module if configured with WWANPower supplyAC Adapter20 V / 65 W (3.25 A), 100 V - 240 V, 50 Hz - 60 Hz, 3-pin (grounded) Type-C AC-Adapter slim&lightAC Adapter20 V / 65 W (3.25 A), 100 V - 240 V, 50 Hz - 60 Hz, 3-pin (grounded) Type-C AC-Adapter standard1st battery Lithium polymer battery 4-cell, 65 Wh, 4,280 mAhBattery features Quick Charge: 80% in 1hRuntime 1st battery9h 30min (up to)Battery notes Battery runtime information is based on worldwide acknowledged BAPCo® MobileMark® 2018. Refer to www.bapco.com for additional details.The BAPCo® MobileMark® Benchmark provides results that enable direct product comparisons betweenmanufacturers. It does not guarantee any specific battery runtime which actually can be lower and may varydepending on product model, configuration, application and power management settings. The battery capacitydecreases slightly with every re-charge and over its lifetime.Noise emissionNoise emission Please refer to the Eco DeclarationDimensions / Weight / EnvironmentalDimensions (W x D x H)357.4 x 230 x 20.1 mm14.07 x 9.06 x 0.79 inchWeight 1.65 kg (starting from)Weight (lbs)starting from 3.64 lbsWeight notes Weight may vary depending on actual configurationOperating ambient temperature 5 - 35 °C (41 - 95 °F)Operating relative humidity20 - 80 %ComplianceProduct LIFEBOOK E5512Model5E15A3Germany GS (planned)Europe CECBUSA/Canada FCC (depending on configuration)Global TCO Certified 9.0ENERGY STAR® 8.0EPEAT® Gold (dedicated regions)China CCC (depending on configuration)Compliance link https:///sites/certificatesAdditional SoftwareAdditional software (preinstalled)Microsoft Office (1 month trial for new Microsoft® Office 365 customers. Buy Microsoft Office.)McAfee® LiveSafe™ (provides award-winning antivirus protection for your PC and much more. 30 days trial pre-installed)Fujitsu Plugfree Network (network management utility)Fujitsu Anytime USB Charge UtilityFujitsu Function ManagerFujitsu Battery UtilityFujitsu DeskUpdate (driver and utility tool)Additional software (optional)Drivers & Utilities DVD (DUDVD)Recovery DVD for Windows®Nero Essentials XLMicrosoft® Office Professional 2021Microsoft® Office Home and Business 2021(Need to buy license to activate the pre-installed Microsoft Office. Purchase and activation only in the region inwhich it was acquired.)Additional software (notes)Use of accompanying and/or additional Software is subject to proactive acceptance of the respective LicenseAgreements /EULAs/ Subscription and support terms of the Software manufacturer as applicable for the relevantSoftware whether preinstalled or optional. The software may only be available bundled with a software supportsubscription which – depending on the Software - may be subject to separate remuneration.ManageabilityManageability technology Intel® vPro™ technology/iAMT (depending on processor)PXE Boot codeWake-on-LANManageability software DeskView ClientDeskView Instant BIOS ManagementSupported standards WMI (Windows Management Instrumentation)PXE (Preboot Execution Environment)DMI (Desktop Management Interface)SMBIOS (System Management BIOS)CIM (Common Information Model)BootP (made4you)Manageability link https:///global/products/computing/pc/manageability/SecurityPhysical Security Kensington Lock supportSystem and BIOS Security User and supervisor BIOS passwordSecurity User SecurityEmbedded fingerprint sensor (optional)Embedded PalmSecure® sensor (optional)Smartcard reader (optional)TPM 2.0Hard disk passwordSecurity NotesThe properties of the product provide a baseline for product security and therefore end-customer IT security. However, these properties are not sufficient on their own to protect the product from all existing threats, such as intrusion attempts, data exfiltration and other forms of cyberattacks. To customize security settings, please use the configuration options as available for the respective product. During operation, the IT security of this product is within the responsibility of the respective administrator/end-user of the product. Please note, that Fujitsu as a manufacturer does not make any policy prescriptions or advocacy statements regarding IT security best practices and/or general product operation.Warranty Warranty period 1 year (for countries in EMEIA)Warranty typeBring-in Service / Collect & Return Service (depending on country)Warranty Terms & Conditions /warrantyDigital bug fixesSubject to availability and following their generic release for the product, bug fixes and function-preserving patches for product-related software (firmware) can be downloaded from the technical support at: https:/// free of charge by entering the respective product serial number. For application software supplied together with the product, please directly refer to the support websites of the respective software manufacturer.Product Support - the perfect extension Recommended Service 9x5, Onsite Response Time: Next Business DaySpare Parts availability at least 5 years after shipment, for details see https:///Service Weblink/emeia/products/product-support-services/Recommended AccessoriesThunderbolt™ 4 Port ReplicatorFirst Thunderbolt™ Port Replicator on the market providing enhancedsecurity and full support of Intel® AMT (vPro®).The universal port can easily connect almost everything with a single cable and high speed-data transfer. This smart workspace solution keeps your desk clean and tidy.Order Code: FPCPR401BP Port Replicator for LIFEBOOKU7x13, U7x12, E5x13, E5x12,U7411 and U7511Flexibility, expandability, desktop replacement, investment protection – to name just a few benefits of Fujitsu’s docking options.Order Code: FPCPR402BPBattery 4 cell 65 WhThe 4 cell 65 Wh battery has a the recharge time of the cell is 60 minutes for a 80% charge.Order Code: FPCBP592BQCANVAS ANDERSON 15The PLEVIER CANVAS ANDERSON 15 leather and canvas case is a compact and classic carrier for on the go. Available for notebooks up to 15 inches with two compartments and two accessory sections, protection for your device ensured. A subtle design canvas and nappa leather shade.Order Code:S26391-F1193-L68Prestige Trolley 17The Fujitsu Prestige Trolley 17 protects and transports notebooks withup to 17 inch screens, along with clothes and toiletries. It is the perfectcompanion in a city environment or for overnight stays with four spacious compartments. Smooth running wheels and a telescopic handle ensure convenience, while the central section protects your notebook with shock-absorbing foam.Order Code: S26391-F1194-L130Prestige Backpack 16The Fujitsu Prestige Backpack 16 protects notebooks with up to 16-inchdisplays. It contains one large main compartments, two elastic mesh side pocket and three front bays with zipper. The padded back compartment provides protection for your notebook, while the other sections store power adaptors and office supplies. Padded shoulder straps and back cushions provide comfort on the move.Order Code: S26391-F1194-L137Wireless Mouse WI860 BTCThe Wireless Mouse WI860 BTC can be paired with up to 3 different clients, 2x Bluetooth and 1x wireless USB Type-C dongle.With the blue optical sensor, it works on nearly all surfaces with an 3-step adjustable DPI selector (800/1600/2400).The mouse charges wirelessly through Qi or by USB Type-C cable.A utility button on the side is programmable. The default functions are optimized for Teams calls.Order Code:S26381-K474-L100ContactFujitsu Technology Solutions GmbH Website: 2023-08-02 EM-ENworldwide project for reducing burdens on the environment.Using our global know-how, we aim to contribute to the creation of a sustainable environment for future generations through IT.Please find further information at http://www./global/about/environmenttechnical specification with the maximum selection of components for the named system and not the detailed scope ofdelivery. The scope of delivery is defined by the selection of components at the time of ordering.Technical data is subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective owner, the use of which by third parties for their own purposes may infringe the rights of such owner.The overall product has been designed and manufactured for general office use, regular personal use and ordinary industrial use.More informationAll rights reserved, including intellectual property rights. Designations may be trademarks and/or copyrights of therespective owner, the use of which by third parties for their own purposes may infringe the rights of such owner. For further information see https:///global/about/resources/terms/ Copyright 2023 Fujitsu Technology Solutions GmbH。

1. A V Connector --- Audio and video connector2. VGA Connector3. Mini-VGA Connector4. DVI Connector --- Digital Visual Interface5. Mini-DVI Connector6. Micro-DVI Connector7. HDMI --- High-Definition Multimedia Interface8. BNC9. DisplayPort10. Mini DisplayPort11. RCA connector12. S-Video13. Component video & component video connecor/out --- YPbPr14. Composite Video15. VIVO ---- Video In Video Out16. SCART17. D-Terminal18. Digital Flat Panel19. RS232C串口20. Banana connector21. Binding post 接线柱/接线螺母22. D-subminiature23. Speakon connector24. TRS connector25. XLR connector26. VESA Plug and Display27. TV aerial plug28. EVC --- Enhanced Video Connector26. IEEE 1394 interface1. AV Connector --- Audio and video connectorAV接口又称（RCARCA）,是指目前一些车载GPS设备，通过自身携带的音、视频端子，连接AV 线路将自身的数据图像声音等，输出到其它显示及视听设备上，如外接显示器或耳机等，接口主要有AV复合端子，S-VIDEO端子，耳机接口等。

APPLICATIONS• All industrial applications requiring Ethernet• All industrial equipment with RJ45 connectivity• Industry Computers• Hubs• Routers• Wireless access pointsELECTRICAL• 10 / 100 Base-T Ethernet, 1 Gbps• Dielectric Withstanding Voltage: 2250 V DCMECHANICAL• -40…+85 °C; min. 750 mating cyclesMATERIALS• Plating thickness 0,76 µm [30 µinch] gold over1,27 µm [50 µinch] nickel• UL 94 V-0• 260 °C reflow capable• High grade LCP (liquid crystal polymer material)STANDARDS & SPECIFICATIONS• IEC 60603-7-51 for 1 Gbps• IEC 60603-7-5 for 10 / 100 Mbps• Product Specification 108-94552• Application Specification 114-94447PRODUCT COMPLIANCE• UL recognized• RoHS compliantIndustrial RJ45 jacks with integrated magnetics offer a highlyintegrated connectivity solution-from the cable to the physicallayer-for Industrial Ethernet. Integrating the magnetics into thejack allows for a much improved EMI noise shielding, enablingmore reliable connections. A standardized portfolio with 1x1straight and R / A, 1x2, 2x1 form factors addresses many ofthe industrial applications, which allows customers to find thesolution they are looking for. Specific industrial requirementssuch as high reliability through improved corrosion resistance,extended temperature range and long product lifetime areall addressed, including support of the latest reflow solderingproduction processes.KEY FEATURES• Extended temperature. range -40…+85 °C• Minimum product life requirement of 10 years• 260 °C reflow Pin in Paste Soldering• Plating thickness 0,76 µm [30 µinch] gold over1,27 µm [50 µinch] nickel• Improved EMI integrity and signal integrity performance• Both current and voltage mode PHY-chips supportedBENEFITS• The standardized RJ45 jack portfolio with integratedmagnetics with 1x1 straight and R / A, 1x2, 2x1 form factorsaddresses many of the industrial applications• Integrated magnetics reduces the (analog) design effortsrequired by the customer• Thicker gold plating (30 µinch over 50 µinch nickel) improvescorrosion resistance reducing equipment electrical problemsover lifetime• TE’s products (260 °C reflow capable) fit industrialassembly / solder processes without the need for an extraassembly / solder step• Extended temperature range addresses industrial equipmentrequirements where standard temperature (0…70 °C) rangeis too limited• Offering standardized T ape & Reel or Tray packing for fullyautomated or manual assembly process• PLC’s• Switches• All Ethernet enabled equipmentDescription Speed Ports Orientation Tab LEDs Packaging VoltageModeCurrentMode TE PNRJ45 JACK INT.MAG. 10/100 1x1 INV.10 / 1001 x 1R / A Up No T&R No Yes2301994-1 RJ45 JACK INT.MAG. 10/100 LED 1x1 INV.10 / 1001 x 1R / A Up Yes T&R No Yes2301994-2 RJ45 JACK INT.MAG. 10/100 1x1 INV.10 / 1001 x 1R / A Up No T&R No Yes2301994-3 RJ45 JACK INT.MAG. 10/100 1x1 10 / 1001 x 1R / A Down No T&R No Yes2301994-4 RJ45 JACK INT.MAG. 1Gb 1x1 INV.1G1 x 1R / A Up No T&R Yes Yes2301994-5 RJ45 JACK INT.MAG. 1Gb 1x1 1G1 x 1R / A Down No T&R Yes Yes2301994-6 RJ45 JACK INT.MAG. 1Gb 1x1 1G1 x 1R / A Down No T&R No Yes2301994-7 RJ45 JACK INT.MAG. 10/100 LED 1x1 INV.10 / 1001 x 1R / A Up Yes T&R No Yes2301994-8 RJ45 JACK INT.MAG. 10/100 LED 1x1 10 / 1001 x 1R / A Down Yes T&R No Yes2301994-9 RJ45 JACK INT.MAG. 1Gb LED 1x1 1G1 x 1R / A Down Yes T&R Yes Yes1-2301994-0 RJ45 JACK INT.MAG. 1Gb LED 1x1 INV. low1G1 x 1R / A Up Yes T&R Yes Yes1-2301994-1 RJ45 JACK INT.MAG. 1Gb LED 1x1 1G1 x 1R / A Down Yes T&R No Yes1-2301994-2RJ45 JACK INT.MAG. Gb 1x1 VERT. 1G1 x 1Vertical–No T&R Yes Yes2301995-1 RJ45 JACK INT.MAG. 10/100 1x1 VERT.10 / 1001 x 1Vertical–No T&R No Yes2301995-2 RJ45 JACK INT.MAG. 10/100 LED 1x1 VERT.10 / 1001 x 1Vertical–Yes T&R No Yes2301995-3 RJ45 JACK INT.MAG. 1Gb LED 1x1 VERT.1G1 x 1Vertical–Yes T&R Yes Yes2301995-4RJ45 JACK INT.MAG. 10/100 1x2 INV.10 / 1001 x 2R / A Up No T&R No Yes2301996-1 RJ45 JACK INT.MAG. 10/100 1x2 10 / 1001 x 2R / A Down No T&R No Yes2301996-2 RJ45 JACK INT.MAG. 1Gb 1x2 INV.1G1 x 2R / A Up No T&R Yes Yes2301996-3 RJ45 JACK INT.MAG. 1Gb 1x2 1G1 x 2R / A Down No T&R Yes Yes2301996-4 RJ45 JACK INT.MAG. 10/100 LED 1x2 INV.10 / 1001 x 2R / A Up Yes T&R No Yes2301996-5 RJ45 JACK INT.MAG. 10/100 LED 1x2 10 / 1001 x 2R / A Down Yes T&R No Yes2301996-6 RJ45 JACK INT.MAG. 1Gb LED 1x2 INV.1G1 x 2R / A Up Yes T&R Yes Yes2301996-7 RJ45 JACK INT.MAG. 1Gb LED 1x2 1G1 x 2R / A Down Yes T&R Yes Yes2301996-8RJ45 JACK INT.MAG. 10/100 1x1 INV.10 / 1001 x 1R / A Up No Tray No Yes5-2301994-1 RJ45 JACK INT.MAG. 10/100 LED 1x1 INV.10 / 1001 x 1R / A Up No Tray No Yes5-2301994-2 RJ45 JACK INT.MAG. 10/100 1x1 INV.10 / 1001 x 1R / A Up No Tray No Yes5-2301994-3 RJ45 JACK INT.MAG. 10/100 1x110 / 1001 x 1R / A Down No Tray No Yes5-2301994-4 RJ45 JACK INT.MAG. 1Gb 1x1 INV.1G1 x 1R / A Up No Tray Yes Yes5-2301994-5 RJ45 JACK INT.MAG. 1Gb 1x1 1G1 x 1R / A Down No Tray Yes Yes5-2301994-6 RJ45 JACK INT.MAG. 1Gb 1x1 1G1 x 1R / A Down No Tray No Yes5-2301994-7 RJ45 JACK INT.MAG. 10/100 LED 1x1 INV.10 / 1001 x 1R / A Up Yes Tray No Yes5-2301994-8 RJ45 JACK INT.MAG. 10/100 LED 1x1 10 / 1001 x 1R / A Down Yes Tray No Yes5-2301994-9 RJ45 JACK INT.MAG. 1Gb LED 1x1 1G1 x 1R / A Down Yes Tray Yes Yes6-2301994-0 RJ45 JACK INT.MAG. 1Gb LED 1x1 INV. - low1G1 x 1R / A Up Yes Tray Yes Yes6-2301994-1 RJ45 JACK INT.MAG. 1Gb LED 1x1 1G1 x 1R / A Down Yes Tray No Yes6-2301994-2TE ConnectivityAutomation & Control Pfnorstr. 1D-64293 Darmstadt Germany+49 6151 607 1999 LEGAL ENTITY/rj45magneticsTE Connectivity, TE Connectivity (logo) and Every Connection Counts are trademarks. All other logos, productsand/or company names referred to herein might be trademarks of their respective owners.The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard T erms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application.© 2017 TE Connectivity Ltd. family of companies All Rights Reserved.1-1773921-5 06/2017 Original: WRPRODUCT SHEETFor additional features or requests, please reach out to your TE sales representative or our customer care specialists.DescriptionSpeedPortsOrientationTabLEDsPackagingVoltage Mode Current ModeTE PNRJ45 JACK INT.MAG. Gb 1x1 VERT.1G 1 x 1Vertical –No Tray Yes Yes 5-2301995-1RJ45 JACK INT.MAG. 10/100 1x1 VERT.10 / 1001 x 1Vertical –No Tray No Yes 5-2301995-2RJ45 JACK INT.MAG. 10/100 LED 1x1 VERT.10 / 1001 x 1Vertical –Yes Tray No Yes 5-2301995-3RJ45 JACK INT.MAG. 1Gb LED 1x1 VERT.1G1 x 1Vertical–YesTrayYesYes5-2301995-4RJ45 JACK INT.MAG. 10/100 1x2 INV .10 / 1001 x 2R / A Up No Tray No Yes 5-2301996-1RJ45 JACK INT.MAG. 10/100 1x2 10 / 1001 x 2R / A Down No Tray No Yes 5-2301996-2RJ45 JACK INT.MAG. 1Gb 1x2 INV .1G 1 x 2R / A Up No Tray Yes Yes 5-2301996-3RJ45 JACK INT.MAG. 1Gb 1x21G 1 x 2R / A Down No Tray Yes Yes 5-2301996-4RJ45 JACK INT.MAG. 10/100 LED 1x2 INV .10 / 1001 x 2R / A Up Yes Tray No Yes 5-2301996-5RJ45 JACK INT.MAG. 10/100 LED 1x2 10 / 1001 x 2R / A Down Yes Tray No Yes 5-2301996-6RJ45 JACK INT.MAG. 1Gb LED 1x2 INV .1G 1 x 2R / A Up Yes Tray Yes Yes 5-2301996-7RJ45 JACK INT.MAG. 1Gb LED 1x21G1 x 2R / ADownYesTrayYesYes5-2301996-8RJ45 JACK INT.MAG. 10/100 2x110 / 1002 x 1R / A Down No Tray No Yes 2301997-2RJ45 JACK INT.MAG. 1Gb 2x11G 2 x 1R / A Down No Tray Yes Yes 2301997-4RJ45 JACK INT.MAG. 10/100 LED 2x110 / 1002 x 1R / A Down Yes Tray No Yes 2301997-5RJ45 JACK INT.MAG. 1Gb LED 2x11G2 x 1R / ADownYesTrayYesYes2301997-7。

Agilent HDMP-1687Four Channel SerDes Circuit for Gigabit Ethernet and Fibre ChannelData SheetFunctional DescriptionThe HDMP-1687 is a four channel SERDES device. HDMP-1687 is in a 208-ball TBGA package with four 1.0625/1.25 Gbps serial I/O. This integrated circuit provides a low-cost, low-power, small-form-factor physical-layer solution for multi-link Gigabit Ethernet/Fibre Channel interfaces. This IC may be used to directly drive copper cables, or it may be used to interface with opti-cal transceivers. Each IC contains transmit and receive channel cir-cuitry for all four channels.The transmitter section accepts10-bit-wide parallel TTL data on each channel and serializes it intoa high-speed serial stream. The parallel data is expected to be8B/10B encoded (or equivalent). Four banks of parallel data are latched into the input registers of the transmitter sections on the ris-ing edge of RFCT.Receive data are latched out with separate clock pins for each chan-nel. These pins may be single 106.25/125 MHz TTL clock outputs RC [0:3] [1] or dual 53.125/62.5 MHz TTL pairs RC [0:3] [0:1] to serve legacy applications where single SerDes devices were usedbefore. The receive clock modeselect (RCM0) pin is used to de-fine the designer’s choice.RCM0 Receive Clock Mode0half speed dual clocks1full speed single clocksThe SYNC pin enables bytesyncdetection on all four channels.When a comma character isdetected on any channel, its corre-sponding SYN [0:3] pin goes high.A single LOOP pin is provided forall channels to enable the localloopback function.HDMP-1687 Block DiagramThe following is a description ofthe blocks in each channel. Ex-cept for the transmit PLL section,circuits for the channels are inde-pendent. Figure 1 shows how thisIC may be connected to a protocoldevice that controls four channels.Each channel of the four channelSERDES (Figure 2) was designedto transmit and receive 10-bit-wide characters over dedicateddifferential high-speed lines. Theparallel data applied to the trans-mitter is expected to be encodedper the 8B/10B encoding scheme,with special reserve characters forlink management purposes. Otherencoding schemes will also workas long as they provide dc balanceand sufficient transition density.In order to accomplish this task,the SERDES circuitry incorporatesthe following:Features•Four ANSI x3.230- 1994 Fibre Chan-nel (FC-O) or IEEE 802.3z GigabitEthernet compatible SerDes ina single package•Supports serial data rates of 1062.5MBd (Fibre Channel) & 1250 MBd(Gigabit Ethernet)•Based on X3T11 Fibre Channel”10 bit specification“•Uses reference clock (RFCT) for Txdata latching•Half or full speed Rx clocks•5-Volt tolerant TTL I/Os•Low power consumption•208 ball, 23 mm TBGA package•Single +3.3 V power supply•1.5 kV ESD protection on all pins•Equalizers on inputs•Copper drive capability•Buffered line logic outputsApplications•1250 MBd Gigabit Ethernet highdensity ports•1062.5 MBd Fibre Channel interface•Mass storage system I/O channel•Work station/server I/O channel•FC interface for disk drives andarrays•Serial backplanes•Clusters•TTL parallel I/Os•High-speed phase locked loops •Parallel-to-serial converter •High-speed serial clock and data recovery circuitry •Comma character recognition circuitry for 8B/10B •Character alignment circuitry •Serial-to-parallel converterPARALLEL INPUT LATCHThe transmitter accepts 10-bit wide single-ended TTL parallel data at inputs TX [0:3] [0:9]. The RFCT pin is used as transmit byte clock. The TX [0:3] [0:9] and RFCT signals must be properly aligned, as shown in Figure 3. RFCT is also used as a clean fre-quency reference for the receiver PLLs.TX PLL/CLOCK GENERATORThe transmitter Phase Locked Loop and Clock Generator (TX PLL/CLOCK GENERATOR) block generates all internal clocks needed by the transmitter section to perform its functions. These clocks are based on the supplied reference clock (RFCT). RFCT is used as the frequency reference clock for the PLL as well as for the incoming data latches. The RFCT clock is multiplied by 10 to generate the serial rate clock necessary for clocking the high speed serial outputs.FRAME MUXThe FRAME MUX accepts the10-bit wide parallel data from the INPUT LATCH. Using internally generated high speed clocks, this parallel data is multiplexed into serial data streams. The data bits are transmitted sequentially, from TX [0:3] [0] to TX [0:3] [9]. SERIAL OUTPUT SELECTThe OUTPUT SELECT block provides for an optional internal loopback of the high speed serial signal for testing purposes.In normal operation, LOOP is setlow and the serial data stream isplaced at SO [0:3]±. Whenwrap-mode is activated by settingLOOP high, the SO [0:3]± pinsare held static at logic 1 and theserial output signal is internallywrapped to the INPUT SELECTblock of the receiver section.SERIAL INPUT SELECTThe INPUT SELECT block deter-mines whether the signal atSI [0:3]± or the internal loop-back serial signal is used. Innormal operation, LOOP is setlow and the serial data is ac-cepted at SI [0:3]±. When LOOPis set high, the outgoing highspeed serial signal is internallylooped-back from the transmittersection to the receiver section.This feature allows parallelloopback testing, exclusive of thetransmission medium.RX PLL/CLOCK RECOVERYThe RX PLL/CLOCK RECOVERYblock is responsible for frequencyand phase locking onto the in-coming serial data stream andrecovering the bit and byteclocks. The Rx PLL continuallyfrequency locks onto the refer-ence clock, and then phase locksonto the selected input datastream. The frequency lock partof the PLL is shared among allchannels. Phase locking is per-formed separately on each chan-nel. An internal signal detectioncircuit monitors the presence ofthe input, and invokes the phasedetection once the minimumdifferential input signal level issupplied (AC Electrical Specifica-tions). Once bit locked, the re-ceiver generates the high speedsampling clock at serial datarates for the input sampler.SERIAL INPUT SAMPLERThe INPUT SAMPLER convertsthe serial input signal into a highspeed serial bit stream. In orderto accomplish this, it uses thehigh speed serial clock recoveredfrom the RX PLL/CLOCK RECOV-ERY block. This serial bit streamis sent to the FRAME DEMUXAND BYTE SYNC block.FRAME DEMUX, BYTE SYNCThe FRAME DEMUX, BYTESYNC block is responsible forrestoring the 10-bit parallel datafrom the high speed serial bitstream. This block is also re-sponsible for recognizing thecomma character (K28.5+) ofpositive disparity (0011111xxx).When recognized, the FRAMEDEMUX, CHAR SYNC blockworks with the RX PLL/CLOCKRECOVERY block to properlyselect the parallel data edge outof the bit stream so that thecomma character starts at bitRX [0:3] [0]. When a commacharacter is detected and realign-ment of the receiver byte clockRC [0:3] [0:1] is necessary, thisclock is stretched, not slivered, tothe next possible correct align-ment position. This clock will befully aligned by the start of thesecond 4-byte ordered set. Thesecond comma character receivedwill be aligned with the risingedge of RC [0:3] [1] and willfollow it with a delay. This delayguarantees hold time at the re-ceiving ICs input latches. Commacharacters of positive disparitymust not be transmitted in con-secutive bytes to allow the re-ceiver byte clocks to maintaintheir proper recovered frequen-cies.PARALLEL OUTPUT DRIVERSThe OUTPUT DRIVERS presentthe 10-bit parallel recovered databyte properly aligned to thereceive byte clocks RC [0:3][0:1] as shown in Figure 5.These output data buffers providesingle ended TTL compatiblesignals.Figure 1. Typical application using HDMP-1687.Figure 2. Block diagram of HDMP-1687.SO [0:3]±CAP0LOOPRFCTRC[0:3][1]RX [0:3][0:9]TX[0:3][0:9]CAP1SYNCSYN [0:3] SI [0:3]±CC Symbol Parameter Units Min.Typ.Max.T txsetup Tx Input Setup Time ns 1.5T txhold Tx Input Hold Time ns 0.5t_txlat [1]Transmitter Latencyns 2.3bits2.8Note:1. The transmitter latency, as shown in Figure 4, is defined as the time between the latching in of the parallel data word (as triggered by the rising edge of the transmit byte clock, RFCT) and the transmission of the first serial bit of that parallel word (defined by the edge of the first bit transmitted).Figure 3. Transmitter section timing.Figure 4. Transmitter latency.TX [0:3] [0:9]RFCT 1.4 V2.0 V0.8 VTiming Characteristics for Fibre Channel – Transmitter Section T = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 V Symbol Parameter Units Min.Typ.Max.T txsetup Tx Input Setup Time ns 2.0T txhold Tx Input Hold Time ns 1.5t_txlat [1]Transmitter Latencyns 3.8bits4.0Note:1. The transmitter latency, as shown in Figure 4, is defined as the time between the latching in of the parallel data word (as triggered by the rising edge of the transmit byte clock, RFCT) and the transmission of the first serial bit of that parallel word (defined by the edge of the first bit transmitted).CC Symbol Parameter Units Min.Typ.Max.f_lock Frequency Lock at Powerup µs 500b_sync [1,2]Bit Sync Time bits 2500t rxsetup RX [0:3][0:9] Output Setup Time (Data Valid Before Clock)ns 2.5t rxhold RX [0:3][0:9] Output Hold Time (Data Valid After Clock)ns 2.0T duty RC [0:3][0] and RC [0:3][1] Duty Cycle %4060t A-B Rising Edge Time Difference between RBC0 and RBC1 (Half Rate)ns 7.58.5t_rxlat [3]Receiver Latencyns 20.7bits26.0Notes:1.This is the recovery time for input phase jumps, per the Fibre Channel Specification X3.230-1994 FC-PH Standard, Sec 5.3.2.Tested using C PLL = 0.1 µF.3. The receiver latency, as shown in Figure 6, is defined as the time between receiving the first serial bit of a parallel data word (defined as the edge of the first serial bit) and the clocking out of that parallel word (defined by the rising edge of the receive byte clock, RC[0:1]).RX [0:3] [0:9]RC [0:3] [1]SYNCRC [0:3] [0]Timing Characteristics for Fibre Channel – Receiver Section T = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 V Symbol Parameter Units Min.Typ.Max.f_lock Frequency Lock at Powerup µs 500b_sync [1,2]Bit Sync Time bits 2500t rxsetup RX [0:3][0:9] Output Setup Time (Data Valid Before Clock)ns 3.0t rxhold RX [0:3][0:9] Output Hold Time (Data Valid After Clock)ns 1.5T duty RC [0:3][0] and RC [0:3][1] Duty Cycle %4060t A-B Rising Edge Time Difference between RBC0 and RBC1 (Half Rate)ns 8.99.9t_rxlat [3]Receiver Latencyns 22.4bits28.0Notes:1.This is the recovery time for input phase jumps, per the Fibre Channel Specification X3.230-1994 FC-PH Standard, Sec 5.3.2.Tested using C PLL = 0.1 µF.3. The receiver latency, as shown in Figure 6, is defined as the time between receiving the first serial bit of a parallel data word (defined as the edge of the first serial bit) and the clocking out of that parallel word (defined by the rising edge of the receive byte clock, RC[0:1]).Absolute Maximum RatingsT A = 25°C, except as specified. Operation in excess of any one of these conditions may result in permanent damage to this device. Continuous operation at these minimum or maximum ratings is not recommended.Symbol Parameter Units Min.Max.V CC Supply Voltage V –0.5 4.0V IN,TTL TTL Input VoltageV –0.7V CC + 2.8V IN,HS_IN HS_IN Input Voltage (Differential)V 2.2I O,TTL TTL Output Sink / Source Current mA ± 13T stg Storage Temperature °C –65+150T j Junction Temperature °C 0+125T CCase Temperature°C0+95Guaranteed Operating RatesT = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 V Parallel Clock Rate (MHz)Serial Baud Rate (MBaud)Min.Max.Min.Max.124.0126.012401260Gigabit Ethernet 105.25107.251052.51072.5Fibre ChannelFigure 6. Receiver latency.RX [0:3] [0:9]SI [0:3] ±RC [0:3] [1]Figure 5b. Receiver section timing (single receive clock).RX [0:3] [0:9]RC [0:3] [1]Transceiver Reference Clock RequirementsT= 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 VSymbol Parameter Units Min.Typ.Max.f Nominal Frequency (for Gigabit Ethernet Compliance)MHz125f Nominal Frequency (for Fibre Channel Compliance)MHz106.25F tol Frequency Tolerance ppm–100+100 Symm Symmetry (Duty Cycle)%4060TTL I/O DC Electrical SpecificationsT A = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 VSymbol Parameter Units Min.Typ.Max.V IH,TTL TTL Input High Voltage Level,V2 5.5 Guaranteed High Signal for All InputsV IL,TTL TTL Input Low Voltage Level,V00.8 Guaranteed Low Signal for All InputsV OH,TTL TTL Output High Voltage Level, I OH = –400 µA V 2.2V CCV OL,TTL TTL Output Low Voltage Level, I OL = 1 mA V00.5I IH,TTL Input High Current, V IN = 2.4 V, V CC = 3.45 VµA40I IL,TTL Input Low Current, V IN = 0.4 V, V CC = 3.45 VµA–600I CC,TRx Transceiver V CC Supply Current, T A = 25°C mA800AC Electrical Specifications (TRx)T A = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 VSymbol Parameter Units Min.Typ.Max.t r,TCi RFCT Rise Time, 0.8 to 2.0 Volts ns0.2 2.4t f,TCi RFCT Fall Time, 2.0 to 0.8 Volts ns0.2 2.4t r,TTLin Input TTL Rise Time, 0.8 to 2.0 Volts ns 1.0t f,TTLin Input TTL Fall Time, 2.0 to 0.8 Volts ns 1.0t r,TTLout Output TTL Rise Time, 0.8 to 2.0 Volts, 10 pF Load ns 1.5 2.4t f,TTLout Output TTL Fall Time, 2.0 to 0.8 Volts, 10 pF Load ns 1.1 2.4t rs, HS_OUT HS_OUT Single-Ended SO [0:3]± Rise Time ps200300t fs, HS_OUT HS_OUT Single-Ended SO [0:3]± Fall Time ps200300t rd, HS_OUT HS_OUT Differential Rise Time ps200300t fd, HS_OUT HS_OUT Differential Fall Time ps200300V IP,HS_IN HS_IN Input Peak-To-Peak Differential Voltage mV20012002000V OP,HS_OUT[1]HS_OUT Output Pk-Pk Diff. Voltage (Z0=50 Ohms, Fig.10)mV100013001800 Note:1. Output Peak-to-Peak Differential Voltage specified as SO [0:3]+ minus SO [0:3]–. The output will be 25% higher when terminating into 75 Ω loads.Figure 7a. Eye diagram of a high speed differential output for Gigabit Ethernet.Figure 7b. Eye diagram of a high speed differential output for Fibre Channel.Output Jitter Characteristics – Transmitter SectionT A = 0°C Ambient to +85°C Case, V CC = 3.15 V to 3.45 VSymbol Parameter Units Typ. RJ[1]Random Jitter at SO [0:3]±, the High Speed Electrical Data Port,ps11 specified as 1 sigma deviation of the 50% crossing point (RMS)DJ[1]Deterministic Jitter at SO [0:3]±, the High Speed Electrical Data Port (pk-pk)ps36 Note:1. Defined by Fibre Channel Specification X3.230-1994 FC-PH Standard, Annex A, Section A.4 and tested using measurement method shownin Figure 8.I/O Type Definitions I/O Type DefinitionI-TTL Input TTL, floats high when left open O-TTL Output TTLHS_OUT 50 Ω matched output driver. Will drive AC coupled 50 Ω loads. PECL Level Compatible (Figure 10).HS_IN PECL Level Compatible. Must be AC coupled (Figure 10).C External Circuit Node SPower Supply or GroundPin Input Capacitance (TRx)Symbol ParameterUnits Typ.Max.C INPUT Input Capacitance on TTL Input PinspF1.6Figure 8. Transmitter jitter measurement method.(STATIC K28.7)A. BLOCK DIAGRAM OF RJ MEASUREMENT METHODFUNCTIONB. BLOCK DIAGRAM OF DJ MEASUREMENT METHODNotes:1.θJA is measured in a still air environment at 25°C on a standard 3 x 3" FR4 PCB as specified in EIA/JESD 51-7.2.θJC data relevant for packages used with external heat sink.3.To determine the actual junction temperature in a given application, use the following: T J = T T + (ψJT x P D ), where T T is the case temperature measured on the top center of the package and P D is the power being dissipated.Thermal and Power Characteristics (TRx)T = 0°C Ambient to 85°C Case, V CC = 3.15 V to 3.45 V Symbol ParameterUnits Typ.Max.P D, TRx Transceiver Power Dissipation, Outputs Connected W 2.6 3.3per Recommended Bias Terminations with Idle Pattern θJA [1]Thermal Resistance: Junction to Ambient °C/W 15.8θJC [2]Thermal Resistance: Junction to Case°C/W 2.5ψJT [3]Thermal Characterization Parameter: Junction to Package Top°C/W1.1Figure 9. O-TTL and I-TTL simplified circuit schematic. Figure 10. HS_OUT and HS_IN simplified circuit schematic.V BB 1.4 VNOTES:1. HS_IN INPUTS SHOULD NEVER BE CONNECTED TO GROUND AS PERMANENT DAMAGE TO THE DEVICE MAY RESULT.2. CAPACITORS MAY BE PLACED AT THE SENDING END OR THE RECEIVING END.Figure 11. Pinout of HDMP-1687 (top view).* Previously RFC1 changed to RFCT for data sheet consistency.Filtering Schematic0102030405060708091011121314151617ABCDEFGHJKLMNPRTUTO V CC A PI-FILTER (SEE SCHEMATIC)Guidelines for Decoupling Capacitor Placements/Connections+10 µF V CC*TRx I/O DefinitionName Type SignalSI [0:3]+HS_IN Serial Data Inputs: High-speed inputs. Serial data is accepted from the SI [0:3]±SI [0:3]–inputs when LOOP is low.SO [0:3]+HS_ OUT Serial Data Outputs: High speed outputs. These lines are active when LOOP isSO [0:3]–set low. When LOOP is set high, these outputs are held static at logic 1.SYNC I-TTL Enable Byte Sync Input: When high, turns on the internal byte sync functions toallow clock synchronization to a comma character of positive disparity (0011111XXX).When the line is low, the function is disabled and will not reset registers and clocks,or strobe the SYN [0:3] lines.SYN [0:3]O-TTL Byte Sync Outputs: Active high outputs. Used to indicate detection of a commacharacter of positive disparity (0011111XXX) when SYNC is enabled.N/C These pins need to be left open. Do not apply voltage on this pin.LOOP I-TTL Loopback Enable Input: When set high, the high speed serial signal is internallywrapped from the transmitter’s serial loopback outputs back to the receiver‘sloopback inputs. Also when in loopback mode, the SO [0:3]± outputs are held staticat logic 1. When set low, SO [0:3]± outputs and SI [0:3]± inputs are active.RCM0I-TTL Receivers Clocking Mode Definition Pins: These pins define how receivedparallel data are driven as follows:RCM0 Receive Clock Mode0 half speed dual clocks1 full speed single clocksRC [0:3] [0:1]O-TTL Receiver Byte Clocks: The receiver sections drive 125 MHz receive byte clocksRC [0:3] [1]. Alternatively, they may drive half speed clocks RC [0:3] [0:1]. See RCM0definition.RFCT I-TTL Reference Clock and Transmit Byte Clock: A 125 MHz clock supplied by the hostsystem. The transmitter sections accept this signal as the frequency reference clock.It is multiplied by 10 to generate the serial bit clock and other internal clocks. Thetransmit sections use this clock as the transmit byte clock for transmitting paralleldata at TX [0:3] [0:9].RX [0:3] [0]O-TTL Data Outputs: Four 10 bit data bytes. RX [0:3] [0] are the first bits received.RX [0:3] [1]RX [0:3] [2]RX [0:3] [3]RX [0:3] [4]RX [0:3] [5]RX [0:3] [6]RX [0:3] [7]RX [0:3] [8]RX [0:3] [9]CAP0C Loop Filter Capacitor: A loop filter capacitor for the internal PLLs must be connected CAP1across the CAP0 and CAP1 pins. (typical value = 0.1µF).TRx I/O Definition, continuedName Type SignalTX [0:3] [0]I-TTL Data Inputs: Four 10 bit, 8B/10B encoded data bytes. TX [0:3] [0] are the first bitsTX [0:3] [1]transmitted.TX [0:3] [2]TX [0:3] [3]TX [0:3] [4]TX [0:3] [5]TX [0:3] [6]TX [0:3] [7]TX [0:3] [8]TX [0:3] [9]V CC S Power Supply: Nominally 3.3 volts. Used for logic and TTL inputs.V CCA S Analog Power Supply: Nominally 3.3 volts. Used to provide a clean supplyline for the PLLs and high speed analog cells.VCR3-0S Rx TTL Output Power Supply: Nominally 3.3 volts.Used for all TTL receiver output buffer cells.VCP3-0S High Speed Output Supply: Nominally 3.3 volts. Used only for the last stageof the high speed transmitter output cells (HS_OUT) as shown in Figure 10.Due to high current transitions, this Vcc should be well bypassed to a ground plane. GND S Ground: Nominally 0 volts. All GND pads on the chip are connected to one ground slugin the package which then distributes these to GND balls.GNDA S Analog Ground: Normally 0 volts. All GND pads on the chip are connected to oneground slug in the package, which then distributes these to GND balls.208 Ball 23 mm x 23 mm TBGA Package DrawingTOP VIEWProcedure to follow for soldering the HDMP-1687, 208-ball TBGA package:IR or Convective Reflow per IPC/JEDEC J-STD-020A standard for BGA IR Reflow.Package DrawingDETAIL AY∅ eee XZMSYMBOL MIN.NOM.MAX.A 1.35 1.50 1.65A10.600.650.70A20.850.900.95A30.15D23.00 ± 0.20D120.32 BSCE23.00 ± 0.20E120.32 BSCMD/ME17N208N14O0.60b0.600.750.90e 1.27 ± 0.10DIMENSIONS IN MILLIMETERSSYMBOL MIN.NOM.MAX.ddd0.15eee0.30TOLERANCE OF FORM AND POSITION Data subject to change.Copyright © 2001 Agilent Technologies, Inc. September 21, 2001。

图1：DisplayPort Platforms图2：Data Rate vs. Number of Displays4. DisplayPort完全开放授权，不用另外支付授权费用HDMI授权费为每年1万美金（对于出货量少于10,000台的制造商，收费会有所降低），另外针对每台加收0.15美金授权费用（如果使用HDMI logo，则为0.05美金/台，使用HDCP功能的话，则只要支付0.04美金/台），授权费按台收取。

每套出售给市场的HDMI设备，包括HDMI线和必要的电路等只按1台的标准收费，但单独出售的HDMI线或者其它设备需要按件收费。

HDMI Licensing charge manufactures an annual fee of US$10,000 (less for manufacturers making less than 10,000 units per year) plus a royalty fee of $0.15 per unit, reduced to $0.05 if the HDMI logo is used, and to $0.04 if HDCP is implemented. The royalty is chargeable per unit sold to the public, so that equipment incorporating or supplied with HDMI cables, integrated circuits, and so on attracts only a single royalty fee; but each HDMI cable or other item sold directly to the public pays a royalty.Chapter 2：What is DisplayPort?DisplayPort标准的发展开始于2006年。

AMD加速处理器列表AMD Accelerated Processing Unit (APU)前称AMD Fusion，整合CPU和GPU。

目录•1 时程表•2 桌上型平台和笔电平台o 2.1 第一代AMD APU，基于AMD 10h（K10、K12/12h）▪ 2.1.1 Llanoo 2.2 第二代AMD APU，基于AMD Piledriver架构▪ 2.2.1 Trinity▪ 2.2.2 Richlando 2.3 第三代AMD APU，基于AMD Jagaur架构▪ 2.3.1 Kabinio 2.4 第四代AMD APU，基于AMD Steamroller架构▪ 2.4.1 Kaverio 2.5 第六代 AMD APU，基于 AMD Excavator 架构▪ 2.5.1 'Carrizo' (2015, 28 nm)o 2.6 第七代 AMD APU，基于 AMD Excavator 架构▪ 2.6.1 'Bristol Ridge' (2016, 28 nm)o 2.7 'Raven Ridge' (2017)•3 服务器核心o 3.1 Opteron X1100-series 'Kyoto' (28nm)o 3.2 Opteron X2100系列 'Kyoto' (2013, 28 nm)o 3.3 Opteron X3000系列 (2017, 28 nm) [26]•4 低功耗核心o 4.1 基于AMD Bobcat架构▪ 4.1.1 Brazos: 'Desna', 'Ontario', 'Zacate' (2011, 40nm)▪ 4.1.2 Brazos 2.0: 'Ontario', 'Zacate' (2012, 40 nm) ▪ 4.1.3 Brazos-T: 'Hondo' (2012, 40 nm)o 4.2 基于AMD Jagaur架构▪ 4.2.1 Temash▪ 4.2.2 Kabinio 4.3 第五代AMD APU 'Beema', 'Mullins'，基于PUMA 核心 (2014, 28 nm)▪ 4.3.1 Mullins▪ 4.3.2 Beemao 4.4 'Carrizo-L' (2015, 28 nm)o 4.5 'Stoney Ridge' (2016,28nm)•5 嵌入式核心o 5.1 G系列▪ 5.1.1 Brazos: 'Ontario' and 'Zacate' (2011, 40 nm) ▪ 5.1.2 'Kabini' (2013, 28 nm)▪ 5.1.3 'Steppe Eagle' (2014, SoC,28nm)▪ 5.1.4 'Crowned Eagle' (2014, SoC,28nm)▪ 5.1.5 I家族: 'Brown Falcon' (2016, SoC,28nm)▪ 5.1.6 J家族: 'Prairie Falcon' (2016, SoC,28nm)▪ 5.1.7 LX家族 (2016, SoC,28nm)o 5.2 R系列▪ 5.2.1 Comal: 'Trinity' (2012, 32 nm)▪ 5.2.2 'Bald Eagle' (2014,28nm)▪ 5.2.3 'Merlin Falcon' (2015, SoC,28nm)•6 另见•7 备注•8 参考资料•9 外部链接时程表代号状态型号制程TDP 核心Radeon coresOntario 已发售C-30, C-50,C-60,C-7040nmbulk9W 1-2 Bobcat 80Zacate 已发售E-240, E-350,E-45040nmbulk18W 1-2 Bobcat 80Llano 已发售A6-3670, A8-3850等32nmSOI35W~100W2-4 K-10/Stars160~400Wichita 原定2012年上半年产品计划被取消28nmbulk~9W 1-2 Bobcat --Krishna 原定2012年上半年产品计划被取消28nmbulk~18W 2-4 Bobcat --Trinity 已发售A10-5800K 等32nmSOI17W~100W2-4Piledrivers128~384Richland 已发售A10-6800K 等32nmSOI17W~100W2-4Piledrivers128~384Kaveri 已发售A10-7850K等28nmSOI15W~95W2-4Steamrollers256~512Kabini 已发售Athlon5350 ,Sempron3850 等28nmSOI9~25W 2-4 Jaguar 128Beema 已发售A6 6410 ,A46310 等28nmSOI15W 2-4 Puma 128Mullins 已发售A10 Micro6700T , 等28nmSOI15W 2-4 Puma 128Carrizo 已发售Athlon X4 835,84528nmSOI 45W~65W2-4Excavator--Bristol Ridge 已出货A10-9700 等28nmSOI35W~65W2-4Excavator256~512桌上型平台和笔电平台第一代AMD APU，基于AMD 10h（K10、K12/12h）第一款Fusion处理器代号为“Swift”，最早将用于代号为“Shrike”笔记型电脑平台。

300Pin MSA 40Gbps Ultra SFF Transponder ModuleRTXM298-301Featuresy Operating Temperature Range from 0°C up to 70°Cy40 Gbps 300 pin MSA complianty40 Gbps NRZ modulationy16 to 1 Multiplexing of 2.5Gb/s signals and 1 to 16De-Multiplexing of 2.5Gb/sy Supports OC-768/STM-256(39.81Gbps) and G.709(43.02Gbps)y Supports VSR20003R2, 3R3, and 3R5y Provides MSA I2C Edition 4compliant control, monitoring,and alarms for opticsmanagementy OIF SFI-5 compliant electrical interfacey Provides both direct input and PLL (jitter reduction circuit) reference clock optionsy Uses standard un-sequencing supply voltagesy 3.5” x4.5” x 0.54” small formfactorApplicationyCross-office Telecommunication & High-speed Data Communication Applicationsy Intra-office SONET/SDH systerms yOptical Cross-connects , Optical switches and routersAbsolute Maximum RatingsParameterSymbolUnitMin MaxReceive Optical Input Power PINP max +6Recommended Operating ConditionsPower Supply VoltageReceive Optical Input Power PINP max -Specifications (T=25q C, BOL ,unless otherwise noted)Bit rate/line coding of optical signals40G/43G NRZOptical transmiter CharacteristicsData RateGbps 39.8143.02Operating Wavelength RangeO nm 15301565dB 35Eye Diagram ITU G.691 complientdBm-6BER=10RL dB27Electrical CharacteristicsLVCMOS Signal CharacteristicsLVCMOS input low level800mV Differential CML Input and Output Signals Symbol Parameter Max Min UnitsR Differential Impedance12575ƻV Maximum Input Voltage 1.15Vp-pInput Reference Clock CharacteristicsParameters conditions Min Typ Max UnitTXREFCK Jitter 1.8ps (RMS)Differential Input Impedance Diff AC Coupled90100110RXREFCK Duty Cycle4555%RXREFCK Accuracy30ppmTXMONCK and RXMONCKParameters Cond Symb Min Typ Max UnitElectrical power suppliesParameters Unit Min Typ MaxPin DescriptionSignal DefinitionElectrical specifications for the SFI-5 interface can be found in OIF2001.145.X and OIF 2001.149.X. The signal descriptions for the SFI-5 bus are reproduced below.Name Type I/O Signal DescriptionTXREFCK AC CoupledLVPECLITransmit Reference Clock provides an alternate timing reference. Theclock is at ¼ data rate of TXDATA and TXDSCTXMONCK Analog O Transmit Monitor Clock provides a single ended clock that can be used to monitor the transmit clock on the mux. This clock shall be turned offRXDSCDiff CML O Receive Deskew channel used to deskew the RX_DATA[15:0]RXREFCK AC CoupledIReceive Reference Clock provides an alternate timing reference. TheRXS LV_CMOS OReceiver Status is an asynchronous signal used to indicate an alarm toI2C_SCL Open Collector I/OI C Clock is a signal used to control the data transfer on the I C serialTXLINETIMSEL LVCMOS ILine Time Select is used to select between source and line (loop)LOS LVCMOS OLoss of Signal is a signal to indicate to the there is no incoming opticalSTAT_INT LVCMOS O Status Interrupt is an electrical “or” of the status register (active low).MOD_RESET LVCMOS I Module Reset is active low and when asserted to its low state will reset the optical module. The module reset will force all components in the transponder to their reset state, including the I2C registers, the laserBlock diagramConnector descriptionFCI Meg-Array 300 position receptacle, 1.27 mm x 1.27 mm (0.050 x 0.050 inch) ball to ball pitch, FCI part number 84501-10X. Mating line card connector shall be FCI part number 84500-002.Package Outline (Unit:mm)3,1 $Ordering informationSpecificationRTXM298-301300pin40G1550nm EML0 ~ +3dBmPIN-6dBm(Max)0~702kmWTD reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.Edition 2009-12-01Published by Wuhan Telecommunication Devices Co.,Ltd.Copyright © WTDAll Rights Reserved.。

What if you could design with the highest performance AND the lowest power? With the benefi ts of both FPGAs AND ASICs? With design software delivering the highest logic utilization AND the fastest compile times? You can, with Altera’s new 40-nm Stratix ® IV FPGAs and HardCopy ® IV ASICs. Our devices deliver new levels of integration, freeing you to innovate without compromise.So go ahead—think AND, not OR.Altera @ 40 nmthink not ORANDStratix IV FPGAs and HardCopy IV ASICs • 2Two variants per family, both resource rich• Stratix IV E and GX FPGAs and HardCopy IV E and GX ASICs provide rich logic, memory, and digital signal processing (DSP) resources for diverse, high-end applications. Multiple Stratix IV E FPGA family members are pin-compatible with Stratix III FPGAs in the same package, so you can start your design with Stratix III FPGAs and later port to our newer and larger devices.• Stratix IV GX FPGAs and HardCopy IV GX ASICs include the advantages of the same integrated transceiver block for high-bandwidth serial interface applications.Innovation without compromiseWe’re proud to introduce the market’s fi rst 40-nm devices—our Stratix IV FPGA family and HardCopy IV ASIC family. Both device families, available with and without transceivers, deliver performance and power advantages that are ideal for large system-on-a-chip (SOC) designs. Along with our leading-edge Quartus ® II design software, our newest programmable solutions deliver:• The highest density, highest performance, AND lowest power • Unprecedented system bandwidth AND superior signal integrity • The benefi ts of FPGAs AND ASICs• The highest performance, highest logic utilization, AND fastest compile times•Earliest access to 40-nm technology AND a low-risk path to productionThat’s why Altera at 40 nm gives you the freedom to think AND, not OR.Migrate your Stratix III designs to higher density Stratix IV FPGAs using Quartus II software.Stratix IV E device package planNumber indicates available user I/O pins, LVDS pairs Vertical migration (same V CC , GND, in-system programmability (ISP), and input pins)All Stratix series devices are offered in commercial and industrial temperatures and RoHS-compliant packages.*FBGA: FineLine BGA (fl ip chip)480, 56Stratix IV FPGAs and HardCopy IV ASICs • 3Stratix IV FPGA Programmable Power TechnologyHighest density, highestperformance, AND lowest powerBuilding on the advanced, proven Stratix III FPGA architecture, and through the advantages of 40-nm process technology, Stratix IV FPGAs give you the highest density, highest perfor-mance, and lowest power consumption.Highest density and highest performance—• Up to 680K high-performance logic elements (LEs)• DSP blocks—with a parallel architecture and up to 1,360 embedded 18x18 multipliersrunning at 550 MHz, Stratix IV FPGAs deliver up to 748 GMACS of DSP performance, a level unmatched by competing devices• TriMatrix memory—three memory block sizes with up to 22.4 Mbits of embedded memory running at 600 MHz• An FPGA fabric that is two speed grades, or 35 percent, faster than that of the nearest competitorLowest power—• Programmable Power Technologyautomatically optimizes logic, DSP , and memory blocks for the lowest power at the required performance• 50 percent less power consumption compared to competing devices• Additional power consumption reduction of more than 50 percent, when you migrate your design from Stratix IV devices to HardCopy IV ASICsWith Programmable Power Technology, powermapping is fully automated by Quartus II software, based on timing constraints. As a result, you get high performance where you need it, and lowest power everywhere else.Strengthening DSP performance With peak performance rated at 748 GMACS, Stratix IV FPGAs achieve the highest DSP performance among FPGAs. Along with raw multiplier resources, the Stratix IV architecture also includes abundant logic, registers (about 400 registers per multiplier), and embedded memory bandwidth (more than 3,000 36-bit memory ports). This combination provides a critical advantage when implementing the highest performanceDSP applications.Stratix IV device family planNotes:1Full-duplex serial transceiversHigh-speed logic Low-power logicUnused low-power logicTiming critical pathLogic arrayStratix IV FPGAs and HardCopy IV ASICs • 4Stratix IV GX FPGAs feature transceiver and memory interfaces designed to deliver superior signal integrity:• Dynamically reconfi gurable transmit pre-emphasis and receiver equalization allow you to drive a 50-inch backplane on FR-4 at 6.375 Gbps• Plug & Play Signal Integrity allows you to change the position of backplane cards on the fl y, without having to manually reconfi gure your backplane equalization settings, through two key functions:H ot socketing, the ability to hot swap –transceiver cardsA daptive dispersion compensation engine –(ADCE), which monitors and adjusts the receiver equalizer for the best eye opening • Dedicated memory interface circuitry supports the latest high-performance memory inter-faces; low simultaneous switching noise (SSN) and superior eye quality, through chip- and package-level enhancements, enable 1067-Mbps DDR3 interfacesWith these capabilities, you can design backplane systems with truly universal cards that can fi t into multiple card positions. Y ou also gain fl exibility for a wide range of FPGA applications and confi gurations while enjoying low bit-error rate (BER) operation.Unprecedented system bandwidth AND superior signal integrityTransceiver-based Stratix IV GX FPGAs give you the resources to achieve a new level of system bandwidth. Th e device’s high-performance core features up to 530K LEs, as well as high levels of transceiver and memory bandwidth:• Up to 48 high-speed transceivers supporting data rates of up to 8.5 Gbps, including hard intellectual property (IP) protocols and signal integrity optimization blocks• Up to four hard IP blocks for PCI Express (PCIe) compliant with PCIe Base Specifi cation 2.0, 1.1, or 1.0, supporting x1, x2, x4, and x8 confi gurations. Y ou’ll also have support for end-port and root-port applications.• LVDS support up to 1.6 Gbps• Up to four 72-bit high-speed DDR3 interfaces at 1,067 Mbps (533 MHz)Th e enhanced transceiver block in Stratix IV GX FPGAs supports key protocols including PCIe, Ethernet, Serial RapidIO®, GPON, CPRI, OBSAI, HyperTransport™ 3.0, SERDES Framer Interface Level 5 (SFI-5), and Interlaken. Th e block includes dynamically reconfi gurable transceivers for selecting diff erent protocols, data rates, and physical medium attachment (PMA) settings without interrupting adjacent transceiver channels.Stratix IV architectural elements1,067-Mbps externalDDR3 memory interfacesUp to 1,360 embedded multipliers for high-throughput DSP 70K-680K LEsUp to 1,104 flexible I/OsUp to 48 tranceiversat up to 8.5 GbpsDynamically configurable phase-locked loops (PLLs)1.6-Gbps LVDSUp to 22.4-Mbits embedded memoryUp to 4X hard IP forPCIe x8 Gen1 and Gen2Stratix IV FPGAs deliver 2X the density and a two-speed-grade advantage over FPGAs from the nearest competitor, making them ideal for large designs in a variety of industries, from telecommunications to military to broadcast.Stratix IV FPGAs and HardCopy IV ASICs • 5HardCopy design fl owSystem development with traditional ASIC The benefi ts of FPGAs AND ASICsWith an equivalent transceiver block andpackage- and pin-compatibility to Stratix IV GX FPGAs, HardCopy IV GX ASICs help you achieve the lowest risk and lowest total cost in ASIC designs with embedded transceivers. Experience the benefi ts of FPGAs within-system, at-speed seamless prototyping using Stratix IV FPGAs, and completely prepare your system for production prior to ASIC handoff . Altera uses a proven turnkey process to create low-cost, low-power, functionally equivalent, pin-compatible HardCopy IV ASICs in just 9 to 14 weeks. Our turnkey process includes full test insertion, so your design teams can focus on your innovative technology. In short, HardCopy IV ASICs off er:• More than 50 percent power consumption reduction, on average, over their FPGA prototypes• Up to 100 percent increase in core performance • 9 to 12 months saved in system time to market, through FPGA-based design and verifi cation methodology• Total development cost reduced to one-fi ft h that of standard-cell ASICs, through decreased design verifi cation time and resources, EDA tooling costs, and NRE mask costs• Increased single event upset (SEU) immunity and design security• Signifi cantly smaller die-sizes than the FPGAprototypes, lowering manufacturing costsHardCopy IV device family planNotes:1 Not all modes supported on all channels2 ASIC gates calculated as 12 gates per LE; 5,000 gates per 18x18 multiplierStratix IV FPGAs and HardCopy IV ASICs • 6With a higher density device, you’ll need a higher productivity design tool for faster design completion. Look to Quartus II soft ware, the only design environment you’ll need. Choose from soft and hard IP cores, and create two device implementations from a single design—one for Stratix IV FPGAs and one for HardCopy IV ASICs. With true hardware and soft ware co-design and co-verifi cation, you’ll eliminate re-spins and avoid system delays to get to market faster.Number one in performance and productivity for high-density FPGAs, Quartus II soft ware v8.0 is the fi rst FPGA vendor soft ware to support 40-nm devices. Th e soft ware off ers many advantages:• Performance optimization techniques, along with the Stratix IV FPGA routing architecture, result in optimal device performance—on average, a full two-speed-grade advantage over the nearest competitor.• Advanced place-and-route algorithms, coupled with the logic architecture, enable you to achieve the highest logic utilization.• Advanced place-and-route algorithms, with multiprocessor support, deliver compilation times that are three times faster than those of the nearest competitor. Further reducecompilation times by up to 70 percent with the soft ware’s incremental compilation feature, which compiles only the changed partitions in your design. Incremental compilation also supports a team-based design fl ow.Quartus II soft ware also includes industry-lead-ing productivity features such as PowerPlaypower optimization, TimeQuest timing analyzer, and SOPC Builder. Th ese features automatically minimize power consumption, and enable faster timing closure and faster design development.Highest performance, highest logic utilization, AND fastest compile timesStratix IV FPGAs and HardCopy IV ASICs • 7Ready to learn more?With Altera at 40 nm, it’s not about sacrifi cing one benefi t to gain another. So if you’re ready to think AND, not OR, contact your local Altera® sales representative or FAE, or visit our website for white papers, webcasts, and more onStratix IV FPGAs and HardCopy IV ASICs.Where Stratix IV FPGAs and HardCopy IV ASICs can helpAltera understands the requirements of end-market solutions that drive silicon and IP development. That’s why we’ve created building blocks that ease integration of various functions, and continue to provide a robust ecosystem to source a variety of these IP cores.More reasons to think AND, not ORBecause true design success calls for a compre-hensive set of resources, we complement our silicon and design soft ware with embedded processors, embedded soft ware development tools, pre-verifi ed and confi gurable IP cores, development kits, and reference designs. Newly updated design resources to support our 40-nm devices include Nios® II embedded processors v8.0 and MegaCore® IP Library v8.0.Nios II embedded processors v8.0 extend the embedded soft ware capabilities of our 40-nm devices. With our latest version, you can add a memory protection unit to address the needs of safety-critical applications, or a memory manage-ment unit to provide both memory protection and virtual memory support. Y ou can also:• Accelerate time-critical soft ware subroutines automatically by converting ANSI C code into hardware accelerators with the Nios IIC-to-Hardware (C2H) Acceleration Compiler • Add dozens of 300-MIPS processors in a single high-density device• Add hardware accelerators to boost system performance and/or reduce system power consumptionOur MegaCore IP Library v8.0 introduces new hard IP for PCIe, compliant with PCIe Base Specifi cation 2.0, 1.1, or 1.0 for Stratix IV GX FPGAs, supporting x1, x2, x4, and x8 confi gura-tions. Select and confi gure both hard and soft IP from a single GUI. Th is release also includes more video and image processing cores and adds many new features to existing IP functions./thinkANDnotORCopyright © 2008 Altera Corporation. All rights reserved. Altera, the stylized Altera logo, specifi c device designations, and all other words and logos that are identifi ed as trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending applications, mask work rights, and copyrights. Altera warrants performance of its semiconductor products to current specifi cations in accordance with Altera’s standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifi cations before relying on any published information and before placing orders for products or services. June 2008, 8K GB-01007-1.1Altera Corporation101 Innovation Drive San Jose, CA 95134USAAltera European HeadquartersHolmers Farm Way High Wycombe Buckinghamshire HP12 4XFUnited KingdomTelephone: (44) 1 494 602 000Altera Japan Ltd.Shinjuku I Tower 32F 6-5-1, Nishi ShinjukuShinjuku-ku, Tokyo 163-1332JapanTelephone: (81) 3 3340 9480www.altera.co.jpAltera International Ltd.Unit 11- 18, 9/FMillennium City 1, Tower 1388 Kwun Tong Road Kwun TongKowloon, Hong KongTelephone: (852) 2 945 。