MAX3373EEBL中文资料

M A X471M A X472的中文资料大全(总4页)-本页仅作为预览文档封面，使用时请删除本页-MAX471/MAX472的特点、功能美国美信公司生产的精密高端电流检测放大器是一个系列化产品，有MAX471/MA X472、 MAX4172/MAX4173等。

它们均有一个电流输出端，可以用一个电阻来简单地实现以地为参考点的电流/电压的转换，并可工作在较宽电压内。

MAX471/MAX472具有如下特点：●具有完美的高端电流检测功能；●内含精密的内部检测电阻（MAX471）；●在工作温度范围内，其精度为2%；●具有双向检测指示，可监控充电和放电状态；●内部检测电阻和检测能力为3A，并联使用时还可扩大检测电流范围；●使用外部检测电阻可任意扩展检测电流范围（MAX472）；●最大电源电流为100μA；●关闭方式时的电流仅为5μA；●电压范围为3～36V；●采用8脚DIP/SO/STO三种封装形式。

MAX471/MAX472的引脚排列如图1所示，图2所示为其内部功能框图。

表1为MAX471/MAX472的引脚功能说明。

MAX471的电流增益比已预设为500μA/A，由于2kΩ的输出电阻（ROUT）可产生1V/A的转换，因此±3A时的满度值为3V.用不同的ROUT电阻可设置不同的满度电压。

但对于MAX471，其输出电压不应大于VRS+。

对于MAX472，则不能大于。

MAX471引脚图如图１所示，MAX472引脚图如图２所示。

MAX471/MAX472的引脚功能说明引脚名称功能MAX471MAX47211SHDN关闭端。

正常运用时连接到地。

当此端接高电平时，电源电流小于5μA2，3-RS+内部电流检测电阻电池（或电源端）。

“+”仅指示与SIGN输出有关的流动方向。

封装时已将2和3连在了一起-2空脚-3RG1增益电阻端。

通过增益设置电阻连接到电流检测电阻的电池端44GND地或电池负端55SIGN集电极开路逻辑输出端。

PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)MC3303D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM MC3303DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM MC3303N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC MC3303PW ACTIVE TSSOP PW 1490Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM MC3303PWR ACTIVE TSSOP PW 142000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM MC3403D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM MC3403DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM MC3403N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC MC3403NSLE OBSOLETE SO NS 14None Call TI Call TIMC3403NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM MC3403PW ACTIVE TSSOP PW 1490Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM MC3403PWRACTIVETSSOPPW142000Pb-Free (RoHS)CU NIPDAULevel-1-250C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currentlyavailable -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Mar-2005元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

Chip Beads(SMD)For Power LineMPZ Series MPZ2012 T ypeFEATURES• The MPZ series are multilayer chip impeders for power supply line applications.•High miniaturized, these parts nonetheless exhibit low DC resistance and high current handling capability.•The products contain no lead and also support lead-free soldering.•It is a product conforming to RoHS directive.APPLICATIONSNoise elimination of DC power supply lines for USB interface circuitry, personal computers, electronic games, hard disk drives, and other general electronic equipment.Also effective as a noise countermeasure in signal lines.PRODUCT IDENTIFICATION (1)Series name(2)Dimensions L ×W (3)Material code(4)Nominal impedance 331: 330Ω at 100MHz (5)Characteristic type (6)Packaging style T: T apingRECOMMENDED SOLDERING CONDITION REFLOW SOLDERINGSHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERNTEMPERATURE RANGESPACKAGING STYLE AND QUANTITIESHANDLING AND PRECAUTIONS•Before soldering, be sure to preheat components. The preheat-ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C.•After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling.•The inductance value may change due to magnetic saturation if the current exceeds the rated maximum.•Do not expose the inductors to stray magnetic fields.•Avoid static electricity discharge during handling.•When hand soldering, apply the soldering iron to the printed cir-cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds.Conformity to RoHS DirectiveMPZ 2012 S 331A T (1) (2) (3) (4) (5) (6)Operating/storage–55 to +125°CPackaging style QuantityT aping4000 pieces/reel•Please contact our Sales office when your application are considered the following:The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.ELECTRICAL CHARACTERISTICS∗1Test equipment : E4991A or equivalentTest tool : 16192A or equivalent∗2Please refer to the graph of RATED CURRENT vs. TEMPERA TURECHARACTERISTICS(DERATING) about the rating current at 85°C or more in temperature of the product.RATED CURRENT vs. TEMEPERATURE CHARACTERISTICS (DERATING)TYPICAL ELECTRICAL CHARACTERISTICSZ, X, R vs. FREQUENCY CHARACTERISTICS MPZ2012S300A MPZ2012S101AMPZ2012S221AMPZ2012S331AMPZ2012S601APACKAGING STYLESREEL DIMENSIONSTAPE DIMENSIONSPart No.Impedance (Ω)[100MHz]∗1DC resistance (Ω)max.Rated current ∗2(A)max.MPZ2012S300A 30±10Ω0.015MPZ2012S101A 100±25%0.024MPZ2012S221A 220±25%0.043MPZ2012S331A 330±25%0.05 2.5MPZ2012S601A600±25%0.12。

General DescriptionThe MAX6653/MAX6663/MAX6664 are ACPI-compliant local and remote-junction temperature sensors and fan controllers. These devices measure their own die tem-perature, as well as the temperature of a remote-PN junction and control the speed of a DC cooling fan based on the measured temperature. Remote tempera-ture measurement accuracy is ±1°C from +60°C to +100°C. Temperature measurement resolution is 0.125°C for both local and remote temperatures.Internal watchdog set points are provided for both local and remote temperatures. There are two comparison set points for local temperatures and two for remote temperatures. When a set point is crossed, the MAX6653/MAX6663/MAX6664 assert either the INT or THERM outputs. These outputs can be used as inter-rupts, clock throttle signals, or overtemperature shut-down signals. Two pins on the MAX6653 control the power-up values of the comparison set points, provid-ing fail-safe protection even when the system is unable to program the trip temperatures. The MAX6653 has two additional shutdown outputs, SDR and SDL , that are triggered when the remote or local temperatures exceed the programmed shutdown set points. The INT output for the MAX6653/MAX6663 and THERM outputs for the MAX6653/MAX6663/MAX6664 can also function as inputs if either is pulled low to force the fan to full speed, unless this function is masked by the user.The MAX6653/MAX6663/MAX6664 are available in 16-pin QSOP packages and operate over the -40°C to +125°C temperature range.ApplicationsPersonal Computers Servers Workstations Telecom Equipment Networking Equipment Test Equipment Industrial ControlsFeatureso Remote-Junction Temperature Sensor Within ±1°C Accuracy (+60°C to +100°C)o ACPI-Compatible Programmable Temperature Alarms o 0.125°C Resolution Local and Remote-Junction Temperature Measurement o Programmable Temperature Offset for System Calibration o SMBus 2-Wire Serial Interface with Timeout o Automatic or Manual Fan-Speed Control o PWM Fan Control Outputo Fan-Speed Monitoring and Watchdog o Fan Fault and Failure Indicators o Compatible with 2-Wire or 3-Wire Fans (Tachometer Output)o +3V to +5.5V Supply Rangeo Additional Shutdown Set Point (MAX6653)o Controlled PWM Rise/Fall TimesMAX6653/MAX6663/MAX6664Temperature Monitors andPWM Fan Controllers________________________________________________________________Maxim Integrated Products1Pin Configurations19-2865; Rev 1; 12/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering InformationTypical Operating Circuits appear at end of data sheet.Functional Diagram appears at end of data sheet.M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.All Voltages Are Referenced to GNDTACH/AIN..............................................................-0.3V to +5.5V V CC ...........................................................................-0.3V to +6V DXP, ADD, CRIT0, CRIT1........................-0.3V to + (V CC + 0.3V)DXN.......................................................................-0.3V to +0.8V SMBDATA, SMBCLK, INT , THERM ,FAN_FAULT , SDL , SDR ............................................-0.3V to +6V SMBDATA, INT , THERM , FAN_FAULT ,PWM_OUT Current..............................................-1mA to +50mADXN Current .......................................................................±1mA ESD Protection (all pins, Human Body Model)..................2000V Continuous Power Dissipation (T A = +70°C)16-Pin QSOP (derate 8.3 mW/°C above +70°C)..........667mW Operating Temperature Range .........................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +165°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICSMAX6653/MAX6663/MAX6664Temperature Monitors andPWM Fan Controllers_______________________________________________________________________________________3Note 2:Not production tested, guaranteed by design.ELECTRICAL CHARACTERISTICS (continued)M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllers 4_______________________________________________________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)REMOTE TEMPERATURE ERROR vs. REMOTE-DIODE TEMPERATUREREMOTE-DIODE TEMPERATURE (°C)T E M P E R A T U R E E R R O R (°C )110956580-105203550-25-40125-1.5-1.0-0.500.51.01.52.0-2.0LOCAL TEMPERATURE ERROR vs. DIE TEMPERATUREM A X 6653 t o c 04DIE TEMPERATURE (°C)L O C A L T E M P E R A T U R E E R R O R (°C )110956580-105203550-25-40125-1.5-1.0-0.500.51.01.52.0-2.01000.0010.010.1110100REMOTE TEMPERATURE ERROR vs. POWER-SUPPLY NOISE FREQUENCY2POWER-SUPPLY NOISE FREQUENCY (MHz)R E M O T E T E M P E R A T U R E E R R O R (°C )468135797-20.0010.010.1110100LOCAL TEMPERATURE ERROR vs. POWER-SUPPLY NOISE FREQUENCY-10POWER-SUPPLY NOISE FREQUENCY (MHz)R E M O T E T E M P E R A T U R E E R R O R (°C )215643TEMPERATURE ERRORvs. COMMON-MODE NOISE FREQUENCYCOMMON-MODE NOISE FREQUENCY (MHz)0.00010.11100.0010.01100T E M P E R A T U R E E R R O R (°C )12-22461088765432100.011100.1100TEMPERATURE ERRORvs. DIFFERENTIAL-MODE NOISE FREQUENCYDIFFERENTIAL-MODE NOISE FREQUENCY (MHz)T E M P E R A T U R E E R R O R (°C )TEMPERATURE ERROR vs. DXP-DXN CAPACITANCEDXP-DXN CAPACITANCE (nF)T E M P E R A T U R E E R R O R (°C )1-5-4-3-2-101101002.03.02.54.03.54.55.03.05.5STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S T A N D B Y S U P P L Y C U R R E N T (µA )4.03.54.55.0AVERAGE OPERATING SUPPLY CURRENTvs. CONVERSION RATECONVERSION RATE (Hz)S U P P L Y C U R R E N T (µA )32150100150200250300350400450500004MAX6653/MAX6663/MAX6664Temperature Monitors and PWM Fan Controllers Array_______________________________________________________________________________________5M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllers 6Detailed DescriptionThe MAX6653/MAX6663/MAX6664 are local/remote temperature monitors and fan controllers for micro-processor-based systems. These devices communi-cate with the system through a serial SMBus interface.The serial bus controller features a hard-wired address pin for device selection, an input line for a serial clock,and a serial line for reading and writing addresses and data (see Functional Diagram ).The MAX6653/MAX6663/MAX6664 fan control section can operate in three modes. In the automatic fan-control mode, the fan ’s power-supply voltage is automatically adjusted based on temperature. The control algorithm parameters are programmable to allow optimization to the characteristics of the fan and the system. RPM select mode forces the fan speed to a programmed tachome-ter value. PWM duty cycle select mode allows user selection of the PWM duty cycle. PWM rise and fall times are limited to maximize fan reliability.To ensure overall system reliability, the MAX6653/MAX6663/MAX6664 feature an SMBus timeout so that the MAX6653/MAX6663/MAX6664 can never “lock ” the SMBus. F urthermore, the availability of hard-wired default values for critical temperature set points ensures the MAX6653 controls critical temperature events properly even if the SMBus is “locked ” by some other device on the bus.SMBus Digital InterfaceF rom a software perspective, the MAX6653/MAX6663/MAX6664 appear as a set of byte-wide registers. These devices use a standard SMBus 2-wire/I 2C-compatible serial interface to access the internal registers. The MAX6653/MAX6663/MAX6664 slave address can be set to three different values by the input pin ADD(Table 2) and, therefore, a maximum of three MAX6653/MAX6663/MAX6664 devices can share the same bus.The MAX6653/MAX6663/MAX6664 employ four stan-dard SMBus protocols: Write Byte, Read Byte, Send Byte, and Receive Byte (Figures 1, 2, and 3). The short-er Receive Byte protocol allows quicker transfers, pro-vided that the correct data register was previously selected by a Read Byte instruction. Use caution with the shorter protocols in multimaster systems, since a second master could overwrite the command byte with-out informing the first master.Alert Response AddressThe MAX6653/MAX6663/MAX6664 respond to the SMBus alert response address, an event which typical-ly occurs after an SMBus host master detects an INT interrupt signal going active (referred to as ALERT in SMBus nomenclature). When the host master puts the alert response address (0001 1001) on the bus, all devices with an active INT output respond by putting their own address onto the bus. The alert response can activate several different slave devices simultaneously,similar to the I 2C general call. If more than one slave attempts to respond, bus arbitration rules apply, and the device with the lowest address code wins. The master then services the devices from the lowest address up.MAX6653/MAX6663/MAX6664Temperature Monitors and PWM Fan ControllersFigure 1. SMBus ProtocolsFigure 2. SMBus Write Timing Diagram_______________________________________________________________________________________7The MAX6663 resets its INT output and some of the status bits in the status register after responding to an alert response address; however, if the error condition that caused the interrupt is still present, INT is reassert-ed on the next monitoring cycle. INT is maskable to allow full control of ALERT conditions.Temperature MeasurementThe MAX6653/MAX6663/MAX6664 contain on-chip tem-perature sensors to sense their own die (local) tempera-tures. These devices can also measure remote temperatures such as the die temperature of CPUs or other ICs having on-chip temperature-sensing diodes, or discrete diode-connected transistors as shown in the Typical O perating Circuits . F or best accuracy, the dis-crete diode-connected transistor should be a small-signal device with its collector and base connected together.The on-chip ADC converts the sensed temperature and outputs the temperature data in the format shown in Tables 3 and 4. The temperature measurement resolution is 0.125°C for both local and remote temperatures. The temperature accuracy is within ±1°C for remote tempera-ture measurements from +60°C to +100°C.The Local Temperature Offset (0Dh) and Remote Temperature Offset (0Eh) registers allow the measured temperature to be increased or decreased by a fixed value to compensate for errors due to variations in diode resistance and ideality factor (see the Remote Diode Considerations section). The reported temperature is the measured temperature plus the correction value. Both the measured temperature and the reported value are limited by the sensor ’s temperature range. F or example, if a remote thermal diode is being measured and its tempera-ture is 135°C, the measured temperature is the maximumvalue of 127.875°C. If the remote offset value is set to -10°C, the reported value is 117.875°C, not 125°C.The temperature conversion rate is programmable using bits [4:2] of the fan filter register (23h) as shown in Table 5.The DXN input is biased at 0.65V above ground by an internal diode to set up the analog-to-digital inputs for a differential measurement. The worst-case DXP-DXN dif-ferential input voltage range is from 0.25V to 0.95V.Excess resistance in series with the remote diode caus-es about 0.5°C error per ohm. Likewise, a 200µV offset voltage forced on DXP-DXN causes about 1°C error.High-frequency EMI is best filtered at DXP and DXN with an external 2200pF capacitor. This value can be increased to about 3300pF, including cable capacitance.Capacitance higher than 3300pF introduces errors due to the rise time of the switched current source.M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllers 8Temperature Comparisonand Interrupt System At the end of each conversion cycle, the converted temperature data are compared to various set-point thresholds to control the INT, THERM, SDL, and SDR outputs. All temperature threshold limits are stored in the threshold limit registers (Table 6) and can be changed through the SMBus digital interface.THERM is an active-low thermal-overload output indicat-ing that the THERM overtemperature set point is exceed-ed. With the THERM threshold set to an appropriate value, the THERM output can be used to control clock throttling. When this pin is pulled low by an external signal, a status bit (bit 7, status register 2) is set, and the fan speed is unconditionally forced to full-on speed. The only way to reset the status bit is to read status register 2. Connect a 10kΩpullup resistor between THERM and V CC.MAX6653/MAX6663/MAX6664Temperature Monitors and PWM Fan Controllers _______________________________________________________________________________________9M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan ControllersINT is an open-drain digital output that reports the sta-tus of temperature interrupt limits and fan out-of-limit conditions. Set bit 1 of configuration register 1 (00h) to 1 to enable INT output or reset this bit to zero to disable the INT output function. Status register 1 contains sta-tus information for the conditions that cause INT to assert. Reading status register 1 resets INT , but INT is reasserted if the fault condition still exists. Connect a 10k Ωpullup resistor between INT and V CC .SDL and SDR are open-drain digital outputs on the MAX6653 that can be used to shut the system down based on the local (die) temperature of the MAX6653 or the temperature of the remote sensor, respectively. The trip thresholds for SDL and SDR are normally set above the THERM and INT limits. Their power-up values are set by the CRIT1 and CRIT0 pins, as shown in Table 1.Fan-Speed ControlThe MAX6653/MAX6663/MAX6664 fan-control section can operate in one of three modes depending on the set-ting of bit 7 to bit 5 of configuration register 1 (00h).Regardless of the mode of operation, the PWM output fre-quency is programmable, and the fan speed is measured with the result stored in the fan-speed register (08h).PWM Output FrequencyThe PWM output frequency is programmed by bit 5, bit 4, and bit 3 of the fan characteristics register (20h),regardless of the mode of operation. See Table 7.Fan-Control ModeThe mode of fan-speed control operation is set by bit 7,bit 6, and bit 5 in configuration register 1 (00h), as shown in Table 8.PWM Duty-Cycle Fan-Control ModeBits [3:0] of the fan-speed configuration register set the PWM duty cycle. See Table 9 for more details.RPM Select Fan-Control ModeIn RPM select mode, the MAX6653/MAX6663/MAX6664adjust their PWM output duty cycle to match a selected fan speed measured by a tachometer count value. Before selecting this mode by setting bits [7:5] of configuration register 1 (00h) to 0x1, the desired tachometer count value should be written to the fan tachometer high-limit register (10h). In this mode, the MAX6653/MAX6663/MAX6664 are not able to detect underspeed fan faults because the fan tachometer high-limit register (10h) func-tions as the target tachometer count.The MAX6653/MAX6663/MAX6664 detect fan stall faults by comparing the fan-speed reading to the full-scale constant of 254 (F Eh). Therefore, the MAX6653/MAX6663/MAX6664 signal a fan fault when the fan-speed reading is 255 (FFh). Note that the RPM mode cannot be used for speeds below 10% of the fan ’s maximum speed. It is important to verify that a fan works properly at lower RPM values if a low-RPM oper-ation in this mode is desired.MAX6653/MAX6663/MAX6664Temperature Monitors andPWM Fan Controllers11Automatic Fan-Control ModeAutomatic fan-speed control is selected by setting bits [7:5] of configuration register 1 (00h) to 100 (to control speed based on the remote temperature) or 101 (to control speed based on both remote and local temper-ature). Program a threshold, or starting temperature TMIN, and the desired temperature range, T RANGE , into the local temp T MIN /T RANGE register (24h) for local temperature and into the remote temp T MIN /T RANGE register (25h) for remote temperature (Tables 10 and 11). If the fan control responds to both local and remote temperatures, the higher PWM duty cycle has priority.When the temperature exceeds T MIN , the fan is enabled at a minimum duty cycle programmed in bits [3:0] of the fan-speed configuration register (22h). The duty cycle increases in proportion to the temperature difference and reaches 100% at a temperature equal to (T MIN + T RANGE ). A hysteresis of 5°C is built into the T MIN set point to prevent the fan from starting and stop-ping when the temperature is at the set point.Spin-UpTo ensure proper fan startup, the MAX6653/MAX6663/MAX6664 can be set to drive the fan to 100% duty cycle for a short period on startup, and then revert to the correct duty cycle. The spin-up time is programmed by bits [2:0] in the fan characteristics register (20h).The spin-up feature can be disabled by setting bit 7 of the fan-filter register (23h) to 1; POR value is zero.Table 12 shows programming of the spin-up time.Fan-Filter ModeWhen the MAX6653/MAX6663/MAX6664 are used for automatic fan-speed control, the fan-filter mode helps minimize the audible effects of varying fan speeds. The fan-filter mode limits the rate at which fan speed can change. Each time a new temperature measurement is made, the fan-filter mode allows the PWM duty cycle to increment by a selectable amount. The duty cycle can change by 1/240, 2/240, 4/240, or 8/240 (0.416%,0.833%, 1.667%, or 3.333%) of the PWM period after each temperature-monitoring cycle. This prevents sud-den changes in fan speed, even when temperature changes suddenly.The filter mode is set by bit 0 of the fan-filter register (23h). To enable the fan-filter mode, write a 1 to this bit.Bits [6:5] of the same register control the size of the PWM steps.Note that the rate of change depends on both the value selected by the fan-filter bits and on the temperatureM A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllersmeasurement rate, which is controlled by bits [4:2] of the fan-filter register (23h). Table 5 shows the effect of the temperature measurement rate control bits. As an example, assume that the temperature measurement rate is 2Hz, or 0.5s per monitoring cycle, and the fan-fil-ter rate is 0.416% per monitoring cycle. For the fan drive to change from 50% to 100% requires 50% / 0.416% =120 temperature monitoring cycles. Thus, for a tempera-ture-monitoring cycle of 0.5s, the time required for the drive to change from 50% to 100% is 60s.Fan-Speed MeasurementThe fan speed is measured by using the relatively slow tachometer signal from the fan to gate an 11.25kHzclock frequency into a fan-speed counter. The mea-surement is initialized on the starting edge of a PWM output if fan-speed measurement is enabled by setting bit 2 of configuration register 2 (01h) to 1. Counting begins on the leading edge of the second tachometer pulse and lasts for two tachometer periods or until the counter overranges (255). The measurement repeats unless monitoring is disabled by resetting bit 2 in the configuration register 2 (01h). The measured result is stored in the fan-speed reading register (08h).The fan-speed count is given by:where RPM = fan speed in RPM.N determines the speed range and is programmed by bits [7:6] in the fan characteristics register (20h) as shown in Table 14. When the speed falls below the value in the speed range column, a fan failure is detected.The TACH/AIN input can be either a digital signal (from the fan ’s tachometer output) or an analog signal,depending on the setting of bit 2 of the configuration register 1 (00h). The default setting is zero, which sets up TACH/AIN as a digital input. F or the analog input (Figure 4), the detected voltage threshold is typically at 250mV, which is appropriate for sensing the voltage of a sense resistor connected to the ground lead of a 2-wire fan. The AIN input only responds to pulse widths greater than 10µs.F igure 5 shows a schematic using a current-sensing resistor and a coupling capacitor to derive the tachometer information from the power-supply current of a 2-wire fan. This circuit allows the speed of a 2-wire fan to be measured even though the fan has no tachometer signal output. The sensing resistor, R SENSE, converts the fan commutation pulses into a voltage and this voltage is AC-coupled into the TACH/AIN input through coupling capacitor C1. The value of R SENSE is on the order of 1Ωto 5Ω, depending on the fan, and the value of the coupling capacitor C1 is 0.01µF. When using this method, set bit 2 of configu-ration register 1 to 1.Fan-Fault Detection The FAN_FAULT output is used to indicate fan slow down or failure. POR disables the FAN_FAULT output on the MAX6653/MAX6663. POR enables FAN_FAULT output on the MAX6664. If FAN_FAULT is not enabled, writing a logic 1 to bit 4 of configuration register 1 (00h) enables the FAN_FAULT output pin. Either under-speed or stalled fans are detected as fan faults. FAN_FAULT is asserted low only when five consecutive interrupts are generated by the MAX6653/MAX6663/ MAX6664s’INT due to fan faults. The MAX6653/ MAX6664 apply 100% duty cycle for the duration of the spin-up time once an INT is asserted. The MAX6663 goes to 100% duty cycle for the duration of the spin-up time once INT is asserted and status register 1 is read. Fan-fault detection works by comparing the value of the fan tachometer high-limit register (10h) with the value of the fan-speed reading register (08h), which contains the value of the most recent fan-speed measurement. Note that the value of the fan-speed reading register (08h) must exceed the value of the fan tachometer high limit (10h) by 1 in order to qualify as a fault. The fault gener-ates an interrupt signal by asserting the INT output, but does not cause the FAN_FAULT output to assert until five consecutive failures have been detected. The fan runs at 100% duty cycle when five consecutive failures have been detected, whether FAN_FAULT is enabled or not. As an example of the function of the fan-fault detection, assume a fan is stalled or under speed. The MAX6663 ini-tially indicates the failure by generating an interrupt on the INT pin. The fan fault bit (bit 1) of interrupt status register 1 (02h) is also set to 1. Once the processor has acknowl-edged the INT by reading status register 1, the INT is cleared. PWM_OUT is then brought high for a 2s (fan spin-up default, Table 12) spin-up period to restart the fan. Subsequent fan failures cause INT to be reasserted and PWM_OUT to be brought high (following a status register 1 read) for a spin-up period each time to restart the fan. Once the fifth tachometer failure occurs, the FAN_FAULT is asserted to indicate a critical fan failure.A MAX6653/MAX6664 example is somewhat simpler. Again assume the fan is stalled or under speed. The MAX6653/MAX6664 initially indicate the failure by gener-ating an interrupt on the INT pin. The fan fault bit of the interrupt status register is set to 1. PWM_OUT goes high for the programmed spin-up time (2s default) to restart the fan. Each subsequent fan failure causes another spin-up. Once the fifth tachometer failure occurs, the FAN_FAULT output is asserted (if enabled) and the PWM output is driven to 100%.When the FAN_FAULT output is disabled (register 00h, bit 4), spin-ups are still attempted whenever the tach count is greater than the value in the fan tachometer high-limit register (10h). If fan faults and their associat-ed spin-ups are not desired, the fan tachometer high-limit register (10h) to F F. This prevents the tach count from ever exceeding the limit and faults are not detect-ed. Simply disabling the tachometer input (register 01h, bit 2) leaves the fan fault function enabled and can result in fan faults.Figure 5. Using the MAX6653/MAX6663/MAX6664 with a2-Wire FanMAX6653/MAX6663/MAX6664Temperature Monitors and PWM Fan Controllers______________________________________________________________________________________13M A X 6653/M A X 6663/M A X 6664Temperature Monitors and PWM Fan Controllers 14______________________________________________________________________________________Alarm SpeedF or the MAX6663, the alarm speed bit, bit 0 of status register 1 (02h), indicates that the PWM duty cycle is 100%, excluding the case of fan spin-up. F or the MAX6653/MAX6664, this bit indicates that the THERM output is low. Once this bit is set, the only way to clear it is by reading status register 1. However, the bit does not reassert on the next monitoring cycle if the condi-tion still exists. It does assert if the condition is discon-tinued and then returns.Power-On Default ConditionsAt power-up, the MAX6653/MAX6663/MAX6664 are monitoring temperature to protect the system against thermal damage. The PWM outputs are in known states.Note that although the "Monitoring" bit (Configuration register 1, Bit 0) is enabled, automatic fan speed control does not begin until a 1 is rewritten to Bit 0.Other default conditions as listed in the Register Summary section.After applying power to the MAX6653/MAX6663/MAX6664, set the desired operating characteristics (fan configuration, alarm thresholds, etc.). Write to Configuration register 1 last. When a 1 is first written to Bit 0 of this register, fan control will commence as determined by the register contents.PC Board LayoutF ollow these guidelines to reduce the measurement error of the temperature sensors:1)Place the MAX6653/MAX6663/MAX6664 as closeas is practical to the remote diode. In noisy environ-ments, such as a computer motherboard, this dis-tance can be 4in to 8in (typ). This length can be increased if the worst noise sources are avoided.Noise sources include CRTs, clock generators,memory buses, and ISA/PCI buses.2)Do not route the DXP-DXN lines next to the deflec-tion coils of a CRT. Also, do not route the traces across fast digital signals, which can easily intro-duce 30°C error, even with good filtering.3)Route the DXP and DXN traces in parallel and inclose proximity to each other, away from any higher voltage traces, such as 12VDC. Leakage currents from PC board contamination must be dealt with carefully since a 20M Ωleakage path from DXP to ground causes about 1°C error. If high-voltage traces are unavoidable, connect guard traces to GND on either side of the DXP-DXN traces (Figure 6).4)The 10-mil widths and spacing recommended inFigure 6are not absolutely necessary, as they offer only a minor improvement in leakage and noise over narrow traces. Use wider traces when practical.5)Add a 200Ωresistor in series with VCC for bestnoise filtering (see Typical Operating Circuits).Figure 6. Recommended DXP/DXN PC Traces。

BATTERY MANAGEMENT Jul 09, 1998 Switch-Mode Battery Charger Delivers 5AThe fast-charge controller IC3 (Figure 1) normally directs current to the battery via an external pnp transistor. In this circuit, the transistor is replaced with a 5A switching regulator (IC1) that delivers equivalent power with higher efficiency.Figure 1. By controlling the PWM duty cycle of switching regulator IC1, the fast-charge controller (IC3) makes efficient delivery of the battery's charging current.IC1 is a 5A buck switching regulator whose output is configured as a current source. Its internal power switch (an npn transistor) is relatively efficient because V CE(SAT) is small in comparison with the 15V-to-40V inputs. (For applications that require 2A or less, the low-saturation, non-Darlington power switch of a MAX726 offers better efficiency.)R6 senses the battery-charging current and enables IC3 to generate an analog drive signal at DRV. The signal is first attenuated by the op amp to assure stability by reducing gain in the control loop. It then drives IC1's compensation pin (VC), which gives direct access to the internal PWM comparator. IC3 thus controls the charging current via the PWM duty cycle of IC1. The Q1 buffer provides current to the DRV input.Loop stability is also determined by the feedback loop's dominant pole, set by C4 at the CC terminal of IC3. If you increase the value of the battery filter capacitor (C5), you should make a proportional increase in the value of C4. Lower values, however, assure good transient response. If your application produces load transients during the fast-charge cycle, check the worst-case response to a load step. To assure proper termination of the charge, battery voltage should settle within 2msec to 5mV times N (where N is the number of battery cells). More InformationMAX713:QuickView-- Full (PDF) Data Sheet-- Free Samples。

General DescriptionThe MAX3311E/MAX3313E are low-power, 5V EIA/TIA-232-compatible transceivers. All transmitter outputs and receiver inputs are protected to ±15kV using the Human Body Model, making these devices ideal for applications where more robust transceivers are required.Both devices have one transmitter and one receiver.The transmitters have a proprietary low-dropout trans-mitter output stage enabling RS-232-compatible opera-tion from a +5V supply with a single inverting charge pump. These transceivers require only three 0.1µF capacitors and will run at data rates up to 460kbps while maintaining RS-232-compatible output levels.The MAX3311E features a 1µA shutdown mode. In shutdown the device turns off the charge pump, pulls V- to ground, and the transmitter output is disabled.The MAX3313E features an INVALID output that asserts high when an active RS-232 cable signal is connected,signaling to the host that a peripheral is connected to the communication port.________________________ApplicationsDigital Cameras PDAs GPS POSTelecommunications Handy Terminals Set-Top BoxesFeatureso ESD Protection for RS-232-Compatible I/O Pins±15kV—Human Body Modelo 1µA Low-Power Shutdown (MAX3311E)o INVALID Output (MAX3313E)o Receiver Active in Shutdown (MAX3311E)o Single Transceiver (1Tx/1Rx) in 10-Pin µMAX PackageMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX________________________________________________________________Maxim Integrated Products1Pin Configurations19-1910; Rev 0; 1/01Ordering InformationFor price, delivery, and to place orders,please contact Maxim Distribution at 1-888-629-4642,or visit Maxim’s website at .Typical Operating CircuitM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND.............................................................-0.3V to +6V V- to GND................................................................+0.3V to -7V V CC + |V-|............................................................................+13V Input VoltagesTIN, SHDN to GND...............................................-0.3V to +6V RIN to GND......................................................................±25V Output VoltagesTOUT to GND................................................................±13.2V ROUT, INVALID to GND.....................…-0.3V to (V CC + 0.3V)Short-Circuit DurationTOUT to GND.........................................................ContinuousContinuous Power Dissipation10-Pin µMAX (derate 5.6mW/°C above +70°C)..........444mW Operating Temperature RangesMAX331_ECUB.................................................0°C to +70°C MAX331_EEUB..............................................-40°C to +85°C Junction Temperature.....................................................+150°C Storage Temperature Range............................-65°C to +150°C Lead Temperature (soldering, 10s)................................+300°CMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)TIMING CHARACTERISTICSM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 4_______________________________________________________________________________________Typical Operating Characteristics(V CC = +5V, 0.1µF capacitors, transmitter loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)0428612101410001500500200025003000SLEW RATEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs )-5-4-3-2-10123456050010001500200025003000TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )010001500500200025003000SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)Detailed DescriptionSingle Charge-Pump Voltage ConverterThe MAX3311E/MAX3313E internal power supply has a single inverting charge pump that provides a negative voltage from a single +5V supply. The charge pump operates in a discontinuous mode and requires a flying capacitor (C1) and a reservoir capacitor (C2) to gener-ate the V- supply.RS-232-Compatible DriverThe transmitter is an inverting level translator that con-verts CMOS-logic levels to EIA/TIA-232 compatible lev-els. It guarantees data rates up to 460kbps with worst-case loads of 3k Ωin parallel with 1000pF. When SHDN is driven low, the transmitter is disabled and put into tri-state. The transmitter input does not have an internal pullup resistor.RS-232 ReceiverThe MAX3311E/MAX3313E receiver converts RS-232signals to CMOS-logic output levels. The MAX3311E receiver will remain active during shutdown mode. The MAX3313E INVALID indicates when an RS-232 signal is present at the receiver input, and therefore when the port is in use.The MAX3313E INVALID output is pulled low when no valid RS-232 signal level is detected on the receiver input.MAX3311E Shutdown ModeIn shutdown mode, the charge pump is turned off, V- is pulled to ground, and the transmitter output is disabled (Table 1). This reduces supply current typically to 1µA.The time required to exit shutdown is less than 25ms.Applications InformationCapacitor SelectionThe capacitor type used for C1 and C2 is not critical for proper operation; either polarized or nonpolarized capacitors are acceptable. If polarized capacitors are used, connect polarity as shown in the Typical Operating Circuit . The charge pump requires 0.1µF capacitors. Increasing the capacitor values (e.g., by a factor of 2) reduces power consumption. C2 can beincreased without changing C1’s value. However, do not increase C1’s value without also increasing the value of C2 and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum 0.1µF capacitors, make sure the capacitance does not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor ’s equivalent series resis-tance (ESR) usually rises at low temperatures and influ-ences the amount of ripple on V-.To reduce the output impedance at V-, use larger capacitors (up to 10µF).Bypass V CC to ground with at least 0.1µF. In applica-tions sensitive to power-supply noise generated by the charge pump, decouple V CC to ground with a capaci-tor the same size as (or larger than) charge-pump capacitors C1 and C2.Transmitter Output when ExitingShutdownFigure 1 shows the transmitter output when exiting shutdown mode. The transmitter is loaded with 3k Ωin parallel with 1000pF. The transmitter output displays no ringing or undesirable transients as the MAX3311E comes out of shutdown. Note that the transmitter is enabled only when the magnitude of V- exceeds approximately -3V.High Data RatesThe MAX3311E/MAX3313E maintain RS-232-compati-ble ±3.7V minimum transmitter output voltage even atMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX5Figure 1. Transmitter Output when Exiting Shutdown or Powering Up10µs/divSHDNTOUT5V/div1.5V/divTIN = GNDTIN = V CCM A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX 6_______________________________________________________________________________________high data rates. Figure 2 shows a transmitter loopback test circuit. Figure 3 shows the loopback test result at 120kbps, and Figure 4 shows the same test at 250kbps.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The MAX3311E/MAX3313E driver outputsand receiver inputs have extra protection against static discharge. Maxim ’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim ’s E versions keep working without latchup; whereas, competing products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the product family are characterized for protection to ±15kV using the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 5 shows the Human Body Model, and Figure 6shows the current waveform it generates when dis-charged into low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just RS-232 inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Figure 4. Loopback Test Results at 250kbps2µs/divTOUTTINROUTFigure 3. Loopback Test Results at 120kbps 5µs/divTOUTTINROUTMAX3311E/MAX3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX_______________________________________________________________________________________7Figure 5. Human Body ESD Test ModelFigure 6. Human Body Current WaveformPin Configurations (continued)Chip InformationTRANSISTOR COUNT: 278M A X 3311E /M A X 3313E±15kV ESD-Protected, 460kbps, 1µA,RS-232-Compatible Transceivers in µMAX Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2001 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.______________________________________________________________Pin Description。

General DescriptionThe MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communica-tions interfaces, particularly applications where ±12V is not available.These parts are especially useful in battery-powered sys-tems, since their low-power shutdown mode reduces power dissipation to less than 5µW. The MAX225,MAX233, MAX235, and MAX245/MAX246/MAX247 use no external components and are recommended for appli-cations where printed circuit board space is critical.________________________ApplicationsPortable Computers Low-Power Modems Interface TranslationBattery-Powered RS-232 Systems Multidrop RS-232 Networks____________________________Features Superior to Bipolaro Operate from Single +5V Power Supply (+5V and +12V—MAX231/MAX239)o Low-Power Receive Mode in Shutdown (MAX223/MAX242)o Meet All EIA/TIA-232E and V.28 Specifications o Multiple Drivers and Receiverso 3-State Driver and Receiver Outputs o Open-Line Detection (MAX243)Ordering InformationOrdering Information continued at end of data sheet.*Contact factory for dice specifications.MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers________________________________________________________________Maxim Integrated Products 1Selection Table19-4323; Rev 9; 4/00Power No. of NominalSHDN RxPart Supply RS-232No. of Cap. Value & Three-Active in Data Rate Number (V)Drivers/Rx Ext. Caps (µF)State SHDN (kbps)FeaturesMAX220+52/24 4.7/10No —120Ultra-low-power, industry-standard pinout MAX222+52/2 4 0.1Yes —200Low-power shutdownMAX223 (MAX213)+54/54 1.0 (0.1)Yes ✔120MAX241 and receivers active in shutdown MAX225+55/50—Yes ✔120Available in SOMAX230 (MAX200)+55/04 1.0 (0.1)Yes —120 5 drivers with shutdownMAX231 (MAX201)+5 and2/2 2 1.0 (0.1)No —120Standard +5/+12V or battery supplies; +7.5 to +13.2same functions as MAX232MAX232 (MAX202)+52/24 1.0 (0.1)No —120 (64)Industry standardMAX232A+52/240.1No —200Higher slew rate, small caps MAX233 (MAX203)+52/20— No —120No external capsMAX233A+52/20—No —200No external caps, high slew rate MAX234 (MAX204)+54/04 1.0 (0.1)No —120Replaces 1488MAX235 (MAX205)+55/50—Yes —120No external capsMAX236 (MAX206)+54/34 1.0 (0.1)Yes —120Shutdown, three stateMAX237 (MAX207)+55/34 1.0 (0.1)No —120Complements IBM PC serial port MAX238 (MAX208)+54/44 1.0 (0.1)No —120Replaces 1488 and 1489MAX239 (MAX209)+5 and3/52 1.0 (0.1)No —120Standard +5/+12V or battery supplies;+7.5 to +13.2single-package solution for IBM PC serial port MAX240+55/54 1.0Yes —120DIP or flatpack package MAX241 (MAX211)+54/54 1.0 (0.1)Yes —120Complete IBM PC serial port MAX242+52/240.1Yes ✔200Separate shutdown and enableMAX243+52/240.1No —200Open-line detection simplifies cabling MAX244+58/104 1.0No —120High slew rateMAX245+58/100—Yes ✔120High slew rate, int. caps, two shutdown modes MAX246+58/100—Yes ✔120High slew rate, int. caps, three shutdown modes MAX247+58/90—Yes ✔120High slew rate, int. caps, nine operating modes MAX248+58/84 1.0Yes ✔120High slew rate, selective half-chip enables MAX249+56/1041.0Yes✔120Available in quad flatpack packageFor free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/ReceiversABSOLUTE MAXIMUM RATINGS—MAX220/222/232A/233A/242/243ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243(V CC = +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T A = T MIN to T MAX ‚ unless otherwise noted.)Note 1:Input voltage measured with T OUT in high-impedance state, SHDN or V CC = 0V.Note 2:For the MAX220, V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ..............................................................-0.3V to (V CC - 0.3V)R IN (Except MAX220)........................................................±30V R IN (MAX220).....................................................................±25V T OUT (Except MAX220) (Note 1).......................................±15V T OUT (MAX220)...............................................................±13.2V Output VoltagesT OUT ...................................................................................±15V R OUT .........................................................-0.3V to (V CC + 0.3V)Driver/Receiver Output Short Circuited to GND.........Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 18-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW20-Pin Plastic DIP (derate 8.00mW/°C above +70°C)..440mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C)...696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 20-Pin Wide SO (derate 10.00mW/°C above +70°C)....800mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C).....800mW 18-Pin CERDIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX2_ _AC_ _, MAX2_ _C_ _.............................0°C to +70°C MAX2_ _AE_ _, MAX2_ _E_ _..........................-40°C to +85°C MAX2_ _AM_ _, MAX2_ _M_ _.......................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________3Note 3:MAX243 R2OUT is guaranteed to be low when R2IN is ≥0V or is floating.ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243 (continued)(V= +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T = T to T ‚ unless otherwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 4_________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX220/MAX222/MAX232A/MAX233A/MAX242/MAX243108-1051525OUTPUT VOLTAGE vs. LOAD CURRENT-4-6-8-2642LOAD CURRENT (mA)O U T P U T V O L T A G E (V )1002011104104060AVAILABLE OUTPUT CURRENTvs. DATA RATE65798DATA RATE (kbits/sec)O U T P U T C U R R E N T (m A )203050+10V-10VMAX222/MAX242ON-TIME EXITING SHUTDOWN+5V +5V 0V0V 500µs/div V +, V - V O L T A G E (V )MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________5V CC ...........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................+0.3V to -14V Input VoltagesT IN ............................................................-0.3V to (V CC + 0.3V)R IN ......................................................................................±30V Output VoltagesT OUT ...................................................(V+ + 0.3V) to (V- - 0.3V)R OUT .........................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T OUT ......................................Continuous Continuous Power Dissipation (T A = +70°C)14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)....800mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C)..........1.07W24-Pin Plastic DIP (derate 9.09mW/°C above +70°C)......500mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).........762mW20-Pin Wide SO (derate 10 00mW/°C above +70°C).......800mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C).......941mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W 44-Pin Plastic FP (derate 11.11mW/°C above +70°C).....889mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C)..........727mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C)........800mW 20-Pin CERDIP (derate 11.11mW/°C above +70°C)........889mW 24-Pin Narrow CERDIP(derate 12.50mW/°C above +70°C)..............1W24-Pin Sidebraze (derate 20.0mW/°C above +70°C)..........1.6W 28-Pin SSOP (derate 9.52mW/°C above +70°C).............762mW Operating Temperature RangesMAX2 _ _ C _ _......................................................0°C to +70°C MAX2 _ _ E _ _...................................................-40°C to +85°C MAX2 _ _ M _ _ ...............................................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CABSOLUTE MAXIMUM RATINGS—MAX223/MAX230–MAX241ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241 (continued)(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________78.56.54.55.5TRANSMITTER OUTPUT VOLTAGE (V OH ) vs. V CC7.08.0V CC (V)V O H (V )5.07.57.46.02500TRANSMITTER OUTPUT VOLTAGE (V OH )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.46.27.27.0LOAD CAPACITANCE (pF)V O H (V )1500100050020006.86.612.04.02500TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE6.05.011.09.010.0LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )1500100050020008.07.0-6.0-9.04.55.5TRANSMITTER OUTPUT VOLTAGE (V OL ) vs. V CC-8.0-8.5-6.5-7.0V CC (V)V O L (V )5.0-7.5-6.0-7.62500TRANSMITTER OUTPUT VOLTAGE (V OL )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES-7.0-7.2-7.4-6.2-6.4LOAD CAPACITANCE (pF)V O L (V )150010005002000-6.6-6.810-105101520253035404550TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CURRENT-2-6-4-886CURRENT (mA)V +, V - (V )420__________________________________________Typical Operating CharacteristicsMAX223/MAX230–MAX241*SHUTDOWN POLARITY IS REVERSED FOR NON MAX241 PARTSV+, V- WHEN EXITING SHUTDOWN(1µF CAPACITORS)MAX220-13SHDN*V-O V+500ms/divM A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 8_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS—MAX225/MAX244–MAX249ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)Note 4:Input voltage measured with transmitter output in a high-impedance state, shutdown, or V CC = 0V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ‚ ENA , ENB , ENR , ENT , ENRA ,ENRB , ENTA , ENTB ..................................-0.3V to (V CC + 0.3V)R IN .....................................................................................±25V T OUT (Note 3).....................................................................±15V R OUT ........................................................-0.3V to (V CC + 0.3V)Short Circuit (one output at a time)T OUT to GND............................................................Continuous R OUT to GND............................................................ContinuousContinuous Power Dissipation (T A = +70°C)28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 40-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...611mW 44-Pin PLCC (derate 13.33mW/°C above +70°C)...........1.07W Operating Temperature RangesMAX225C_ _, MAX24_C_ _ ..................................0°C to +70°C MAX225E_ _, MAX24_E_ _ ...............................-40°C to +85°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering,10sec)..............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________9Note 5:The 300Ωminimum specification complies with EIA/TIA-232E, but the actual resistance when in shutdown mode or V CC =0V is 10M Ωas is implied by the leakage specification.ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249 (continued)(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 10________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX225/MAX244–MAX24918212345TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE86416LOAD CAPACITANCE (nF)T R A N S M I T T E R S L E W R A T E (V /µs )14121010-105101520253035OUTPUT VOLTAGEvs. LOAD CURRENT FOR V+ AND V--2-4-6-88LOAD CURRENT (mA)O U T P U T V O L T A G E (V )64209.05.012345TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.05.58.5LOAD CAPACITANCE (nF)V +, V (V )8.07.57.06.5MAX220–MAX249Drivers/Receivers______________________________________________________________________________________11Figure 1. Transmitter Propagation-Delay Timing Figure 2. Receiver Propagation-Delay TimingFigure 3. Receiver-Output Enable and Disable Timing Figure 4. Transmitter-Output Disable TimingM A X 220–M A X 249Drivers/Receivers 12______________________________________________________________________________________ENT ENR OPERATION STATUS TRANSMITTERSRECEIVERS00Normal Operation All Active All Active 01Normal Operation All Active All 3-State10Shutdown All 3-State All Low-Power Receive Mode 11ShutdownAll 3-StateAll 3-StateTable 1a. MAX245 Control Pin ConfigurationsENT ENR OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All Active RA1–RA4 3-State,RA5 Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll 3-StateAll Low-Power Receive Mode All Low-Power Receive Mode 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RB5 Low-Power Receive ModeTable 1b. MAX245 Control Pin ConfigurationsTable 1c. MAX246 Control Pin ConfigurationsENA ENB OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All 3-State All Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll ActiveRA1–RA4 3-State,RA5 Active All Active 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RA5 Low-Power Receive ModeMAX220–MAX249Drivers/Receivers______________________________________________________________________________________13Table 1d. MAX247/MAX248/MAX249 Control Pin ConfigurationsM A X 220–M A X 249_______________Detailed DescriptionThe MAX220–MAX249 contain four sections: dual charge-pump DC-DC voltage converters, RS-232 dri-vers, RS-232 receivers, and receiver and transmitter enable control inputs.Dual Charge-Pump Voltage ConverterThe MAX220–MAX249 have two internal charge-pumps that convert +5V to ±10V (unloaded) for RS-232 driver operation. The first converter uses capacitor C1 to dou-ble the +5V input to +10V on C3 at the V+ output. The second converter uses capacitor C2 to invert +10V to -10V on C4 at the V- output.A small amount of power may be drawn from the +10V (V+) and -10V (V-) outputs to power external circuitry (see the Typical Operating Characteristics section),except on the MAX225 and MAX245–MAX247, where these pins are not available. V+ and V- are not regulated,so the output voltage drops with increasing load current.Do not load V+ and V- to a point that violates the mini-mum ±5V EIA/TIA-232E driver output voltage when sourcing current from V+ and V- to external circuitry. When using the shutdown feature in the MAX222,MAX225, MAX230, MAX235, MAX236, MAX240,MAX241, and MAX245–MAX249, avoid using V+ and V-to power external circuitry. When these parts are shut down, V- falls to 0V, and V+ falls to +5V. For applica-tions where a +10V external supply is applied to the V+pin (instead of using the internal charge pump to gen-erate +10V), the C1 capacitor must not be installed and the SHDN pin must be tied to V CC . This is because V+is internally connected to V CC in shutdown mode.RS-232 DriversThe typical driver output voltage swing is ±8V when loaded with a nominal 5k ΩRS-232 receiver and V CC =+5V. Output swing is guaranteed to meet the EIA/TIA-232E and V.28 specification, which calls for ±5V mini-mum driver output levels under worst-case conditions.These include a minimum 3k Ωload, V CC = +4.5V, and maximum operating temperature. Unloaded driver out-put voltage ranges from (V+ -1.3V) to (V- +0.5V). Input thresholds are both TTL and CMOS compatible.The inputs of unused drivers can be left unconnected since 400k Ωinput pull-up resistors to V CC are built in (except for the MAX220). The pull-up resistors force the outputs of unused drivers low because all drivers invert.The internal input pull-up resistors typically source 12µA,except in shutdown mode where the pull-ups are dis-abled. Driver outputs turn off and enter a high-imped-ance state—where leakage current is typically microamperes (maximum 25µA)—when in shutdownmode, in three-state mode, or when device power is removed. Outputs can be driven to ±15V. The power-supply current typically drops to 8µA in shutdown mode.The MAX220 does not have pull-up resistors to force the ouputs of the unused drivers low. Connect unused inputs to GND or V CC .The MAX239 has a receiver three-state control line, and the MAX223, MAX225, MAX235, MAX236, MAX240,and MAX241 have both a receiver three-state control line and a low-power shutdown control. Table 2 shows the effects of the shutdown control and receiver three-state control on the receiver outputs.The receiver TTL/CMOS outputs are in a high-imped-ance, three-state mode whenever the three-state enable line is high (for the MAX225/MAX235/MAX236/MAX239–MAX241), and are also high-impedance whenever the shutdown control line is high.When in low-power shutdown mode, the driver outputs are turned off and their leakage current is less than 1µA with the driver output pulled to ground. The driver output leakage remains less than 1µA, even if the transmitter output is backdriven between 0V and (V CC + 6V). Below -0.5V, the transmitter is diode clamped to ground with 1k Ωseries impedance. The transmitter is also zener clamped to approximately V CC + 6V, with a series impedance of 1k Ω.The driver output slew rate is limited to less than 30V/µs as required by the EIA/TIA-232E and V.28 specifica-tions. Typical slew rates are 24V/µs unloaded and 10V/µs loaded with 3Ωand 2500pF.RS-232 ReceiversEIA/TIA-232E and V.28 specifications define a voltage level greater than 3V as a logic 0, so all receivers invert.Input thresholds are set at 0.8V and 2.4V, so receivers respond to TTL level inputs as well as EIA/TIA-232E and V.28 levels.The receiver inputs withstand an input overvoltage up to ±25V and provide input terminating resistors withDrivers/Receivers 14Table 2. Three-State Control of ReceiversMAX220–MAX249Drivers/Receivers______________________________________________________________________________________15nominal 5k Ωvalues. The receivers implement Type 1interpretation of the fault conditions of V.28 and EIA/TIA-232E.The receiver input hysteresis is typically 0.5V with a guaranteed minimum of 0.2V. This produces clear out-put transitions with slow-moving input signals, even with moderate amounts of noise and ringing. The receiver propagation delay is typically 600ns and is independent of input swing direction.Low-Power Receive ModeThe low-power receive-mode feature of the MAX223,MAX242, and MAX245–MAX249 puts the IC into shut-down mode but still allows it to receive information. This is important for applications where systems are periodi-cally awakened to look for activity. Using low-power receive mode, the system can still receive a signal that will activate it on command and prepare it for communi-cation at faster data rates. This operation conserves system power.Negative Threshold—MAX243The MAX243 is pin compatible with the MAX232A, differ-ing only in that RS-232 cable fault protection is removed on one of the two receiver inputs. This means that control lines such as CTS and RTS can either be driven or left floating without interrupting communication. Different cables are not needed to interface with different pieces of equipment.The input threshold of the receiver without cable fault protection is -0.8V rather than +1.4V. Its output goes positive only if the input is connected to a control line that is actively driven negative. If not driven, it defaults to the 0 or “OK to send” state. Normally‚ the MAX243’s other receiver (+1.4V threshold) is used for the data line (TD or RD)‚ while the negative threshold receiver is con-nected to the control line (DTR‚ DTS‚ CTS‚ RTS, etc.). Other members of the RS-232 family implement the optional cable fault protection as specified by EIA/TIA-232E specifications. This means a receiver output goes high whenever its input is driven negative‚ left floating‚or shorted to ground. The high output tells the serial communications IC to stop sending data. To avoid this‚the control lines must either be driven or connected with jumpers to an appropriate positive voltage level.Shutdown—MAX222–MAX242On the MAX222‚ MAX235‚ MAX236‚ MAX240‚ and MAX241‚ all receivers are disabled during shutdown.On the MAX223 and MAX242‚ two receivers continue to operate in a reduced power mode when the chip is in shutdown. Under these conditions‚ the propagation delay increases to about 2.5µs for a high-to-low input transition. When in shutdown, the receiver acts as a CMOS inverter with no hysteresis. The MAX223 and MAX242 also have a receiver output enable input (EN for the MAX242 and EN for the MAX223) that allows receiver output control independent of SHDN (SHDN for MAX241). With all other devices‚ SHDN (SH DN for MAX241) also disables the receiver outputs.The MAX225 provides five transmitters and five receivers‚ while the MAX245 provides ten receivers and eight transmitters. Both devices have separate receiver and transmitter-enable controls. The charge pumps turn off and the devices shut down when a logic high is applied to the ENT input. In this state, the supply cur-rent drops to less than 25µA and the receivers continue to operate in a low-power receive mode. Driver outputs enter a high-impedance state (three-state mode). On the MAX225‚ all five receivers are controlled by the ENR input. On the MAX245‚ eight of the receiver out-puts are controlled by the ENR input‚ while the remain-ing two receivers (RA5 and RB5) are always active.RA1–RA4 and RB1–RB4 are put in a three-state mode when ENR is a logic high.Receiver and Transmitter EnableControl InputsThe MAX225 and MAX245–MAX249 feature transmitter and receiver enable controls.The receivers have three modes of operation: full-speed receive (normal active)‚ three-state (disabled)‚ and low-power receive (enabled receivers continue to function at lower data rates). The receiver enable inputs control the full-speed receive and three-state modes. The transmitters have two modes of operation: full-speed transmit (normal active) and three-state (disabled). The transmitter enable inputs also control the shutdown mode. The device enters shutdown mode when all transmitters are disabled. Enabled receivers function in the low-power receive mode when in shutdown.M A X 220–M A X 249Tables 1a–1d define the control states. The MAX244has no control pins and is not included in these tables. The MAX246 has ten receivers and eight drivers with two control pins, each controlling one side of the device. A logic high at the A-side control input (ENA )causes the four A-side receivers and drivers to go into a three-state mode. Similarly, the B-side control input (ENB ) causes the four B-side drivers and receivers to go into a three-state mode. As in the MAX245, one A-side and one B-side receiver (RA5 and RB5) remain active at all times. The entire device is put into shut-down mode when both the A and B sides are disabled (ENA = ENB = +5V).The MAX247 provides nine receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs each control four drivers. The ninth receiver (RB5) is always active.The device enters shutdown mode with a logic high on both ENTA and ENTB .The MAX248 provides eight receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs control four drivers each. This part does not have an always-active receiver. The device enters shutdown mode and trans-mitters go into a three-state mode with a logic high on both ENTA and ENTB .The MAX249 provides ten receivers and six drivers with four control pins. The ENRA and ENRB receiver enable inputs each control five receiver outputs. The ENTA and ENTB transmitter enable inputs control three dri-vers each. There is no always-active receiver. The device enters shutdown mode and transmitters go into a three-state mode with a logic high on both ENTA and ENTB . In shutdown mode, active receivers operate in a low-power receive mode at data rates up to 20kbits/sec.__________Applications InformationFigures 5 through 25 show pin configurations and typi-cal operating circuits. In applications that are sensitive to power-supply noise, V CC should be decoupled to ground with a capacitor of the same value as C1 and C2 connected as close as possible to the device.Drivers/Receivers16______________________________________________________________________________________。

GaAs SPDT Terminated Switch DC - 2.5 GHz SW-337, SW-338, SW-339V2.00M/A-COM, Inc.1Specifications Subject to Change Without Notice.Electrical Specifications, T A = ±25°CFeaturesVery Low Power Consumption: 75 µWLow Insertion Loss: 0.5 dBHigh Isolation: 33 dB up to 2 GHz (SW-337, SW-338)28 dB up to 2 GHz (SW-339)Very High Intercept Point: 46 dBm IP 3Nanosecond Switching SpeedTemperature Range: -40°C to +85°C Low Cost SOIC8 Plastic Package Tape and Reel Packaging Available 1DescriptionM/A-COM’s SW-337, SW-338 and SW-339 are GaAs MMIC SPDT terminated switches in a low cost SOIC 8-lead surface mount plastic package. They are ideally suited for use where very low power consumption is required.Typical applications include transmit/receive switching,switch matrices, and filter banks in systems such as: radio and cellular equipment, PCM, GPS, fiber optic modules,and other battery powered radio equipment. The difference between the switches is in the pin configuration.The SW-337, SW-338 and SW-339 are fabricated with monolithic GaAs MMICs using a mature 1-micron process.The process features full chip passivation for increased performance and reliability.SO-8(0.19-0.25)Part Number Package SW-337 PIN SOIC 8 LeadSW-337 TR Forward Tape & Reel SW-337 RTR Reverse Tape & Reel SW-338 PIN SOIC 8 LeadSW-338 TR Forward Tape & Reel SW-338 RTR Reverse Tape & Reel SW-339 PIN SOIC 8 LeadSW-339 TR Forward Tape & Reel SW-339 RTRReverse Tape & ReelOrdering InformationSW-337, SW-338SW-339Parameter Test Conditions2Unit Min.Typ.MaxMin.Typ.Max.Insertion LossDC – 0.1 GHz dB 0.40.60.40.6 DC – 0.5 GHz dB 0.50.70.50.7DC – 1.0 GHz dB 0.50.70.50.7DC – 2.0 GHzdB 0.70.90.70.9Isolation DC – 0.1 GHzdB 50535053DC – 0.5 GHz dB 43464346DC – 1.0 GHz dB 3639 3538DC – 2.0 GHzdB30332528VSWR On DC – 2.0 GHz1.2:1 1.2:1Off DC –2.0 GHz1.2:1 1.2:1Trise, Tfall 10% to 90% RF, 90% to 10% RF nS 77Ton, Toff 50% Control to 90% RF, 50% Control to 10% RF nS 1010Transients In Band mV 2525One dB Input Power 0.05 GHz dBm 2525Compression Point Input Power 0.5 –2.0 GHz dBm 30302nd Order Measured Relative 0.05 GHz dBm 6060Intercept to Input Power 0.5 – 2.0 GHzdBm 6565(for two-tone input power up to +5 dBm)3rd Order Measured Relative 0.05 GHz dBm 4040Intercept to Input Power 0.5 – 2.0 GHzdBm4646(for two-tone input power up to +5 dBm)1. Refer to "Tape and Reel Packaging" Section, or contact factory.2. All measurements with 0, -5 control voltages at 1 GHz in a 50Ωsystem, unless otherwise specified.q q qq q q q q8-Lead SOP outline dimensionsNarrow body .150(All dimensions per JEDEC No. MS-012-AA, Issue C)Dimensions in ( ) are in mm.Unless otherwise noted: .xxx = ±0.010 (.xx = ±0.25).xx = ±0.02 (.x = ±0.5)元器件交易网GaAs SPDT Terminated Switch SW-337, SW-338, SW-339V2.00M/A-COM, Inc.2Specifications Subject to Change Without Notice.Parameter Absolute Maximum 1Max. Input Power 0.05 GHz +27 dBm 0.5 – 2.0 GHz +34 dBm Control Voltage +5V, -8.5V Operating Temperature -40°C to +85°C Storage Temperature-65°C to +150°CAbsolute Maximum RatingsPin ConfigurationSW-337SW-338SW-339Truth TableTypical Performance@ +25°C1. Operation of this device above any one of these parameters maycause permanent damage.RF1GND GND RF2B A RF1GND GND RF2A B BRF2GND GND FREQUENCY (GHz)2.01.51.00.50.51.01.52.02.5L O S S (d B )ISOLATION vs FREQUENCYVSWR vs FREQUENCYINSERTION LOSS vs FREQUENCYFREQUENCY (GHz)2.01.81.61.41.21.00.51.01.52.02.5V S W R8070605040302010000.51.01.52.02.5FREQUENCY (MHz)I S O L A T I O N (d B )Pin Pin Pin No.Description No.Description No.Description1A1B1RF Common2RF Common2RF Common2GND 3B 3A 3RF14GND 4GND 4A 5RF15RF15B 6GND 6GND 6RF27GND 7GND 7GND 8RF28RF28GNDCondition of Switch Control InputsRF Common to Each RF PortA B RF1RF210ON OFF 01OFFON"0" – 0 – -0.2V @ 20 µA max."1" – -5V @ 30 µA Typ to -8V @ 720 µA max.Functional SchematicsElectrical Schematic元器件交易网。

General DescriptionThe MAX3372E–MAX3379E and MAX3390E–MAX3393E ±15kV ESD-protected level translators provide the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V CC and V L , set the logic levels on either side of the device. A low-voltage logic signal present on the V L side of the device appears as a high-voltage logic signal on the V CC side of the device, and vice-versa. The MAX3374E/MAX3375E/MAX3376E/MAX3379E and MAX3390E–MAX3393E unidi-rectional level translators level shift data in one direction (V L →V CC or V CC →V L ) on any single data line. The MAX3372E/MAX3373E and MAX3377E/MAX3378E bidi-rectional level translators utilize a transmission-gate-based design (Figure 2) to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3372E–MAX3379E and MAX3390E–MAX3393E accept V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.All devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family feature a three-state output mode that reduces supply current to less than 1µA, thermal short-circuit protection, and ±15kV ESD protection on the V CC side for greater protection in applications that route sig-nals externally. The MAX3372E /MAX3377E operate at a guaranteed data rate of 230kbps. Slew-rate limiting reduces E MI emissions in all 230kbps devices. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E operate at a guaranteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. (See the Timing Characteristics table.)The MAX3372E –MAX3376E are dual level shifters available in 3 x 3 UCSP™, 8-pin TDFN, and 8-pin SOT23-8 packages. The MAX3377E /MAX3378E /MAX3379E and MAX3390E–MAX3393E are quad level shifters available in 3 x 4 UCSP, 14-pin TDFN, and 14-pin TSSOP packages.________________________ApplicationsSPI™, MICROWIRE™, and I 2C Level TranslationLow-Voltage ASIC Level Translation Smart Card Readers Cell-Phone Cradles Portable POS SystemsPortable Communication Devices Low-Cost Serial Interfaces Cell Phones GPSTelecommunications EquipmentFeatures♦Guaranteed Data Rate Options230kbps8Mbps (+1.2V ≤V L ≤V CC ≤+5.5V)10Mbps (+1.2V ≤V L ≤V CC ≤+3.3V)16Mbps (+1.8V ≤V L ≤V CC ≤+2.5V and +2.5V ≤V L ≤V CC ≤+3.3V)♦Bidirectional Level Translation (MAX3372E/MAX3373E and MAX3377E/MAX3378E)♦Operation Down to +1.2V on V L♦±15kV ESD Protection on I/O V CC Lines ♦Ultra-Low 1µA Supply Current in Three-State Output Mode♦Low-Quiescent Current (130µA typ)♦UCSP, TDFN, SOT23, and TSSOP Packages ♦Thermal Short-Circuit ProtectionMAX3372E–MAX3379E/MAX3390E–MAX3393E±15kV ESD-Protected, 1µA, 16Mbps, Dual/QuadLow-Voltage Level Translators in UCSP________________________________________________________________Maxim Integrated Products119-2328; Rev 2; 11/07For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Ordering InformationUCSP is a trademark of Maxim Integrated Products, Inc.SPI is a trademark of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor Corp.Ordering Information continued at end of data sheet.Selector Guide appears at end of data sheet.+Denotes a lead-free package.T = Tape and reel.M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND.)V CC ...........................................................................-0.3V to +6V I/O V CC_......................................................-0.3V to (V CC + 0.3V)I/O V L_...........................................................-0.3V to (V L + 0.3V)THREE-STATE ...............................................-0.3V to (V L + 0.3V)Short-Circuit Duration I/O V L , I/O V CC to GND...........Continuous Short-Circuit Duration I/O V L or I/O V CC to GND Driven from 40mA Source(except MAX3372E and MAX3377E).....................ContinuousContinuous Power Dissipation (T A = +70°C)8-Pin SOT23 (derate 8.9mW/°C above +70°C)...........714mW 8-Pin TDFN (derate 18.2mW/°C above +70°C)........1455mW 3 x 3 UCSP (derate 4.7mW/°C above +70°C)............379mW 3 x 4 UCSP (derate 6.5mW/°C above +70°C)............579mW 14-Pin TSSOP (derate 9.1mW/°C above +70°C)........727mW 14-Pin TDFN (derate 18.2mW/°C above +70°C)......1454mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICS (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP(V CC= +1.65V to +5.5V, V L= +1.2V to (V CC+ 0.3V), GND = 0, I/O V L_and I/O V CC_unconnected, T A= T MIN to T MAX, unless other-M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 4_______________________________________________________________________________________TIMING CHARACTERISTICS(V CC = +1.65V to +5.5V, V L = +1.2V to (V CC + 0.3V), GND = 0, R LOAD = 1M Ω, I/O test signal of Figure 1, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V, V L = +1.8V, T A = +25°C, unless otherwise noted.) (Notes 1, 2)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________5and not production tested.Note 2:For normal operation, ensure V L < (V CC + 0.3V). During power-up, V L > (V CC + 0.3V) will not damage the device. Note 3:To ensure maximum ESD protection, place a 1µF capacitor between V CC and GND. See Applications Circuits .Note 4:10% to 90% Note 5:90% to 10%TIMING CHARACTERISTICS (continued)(V = +1.65V to +5.5V, V = +1.2V to (V + 0.3V), GND = 0, R = 1M Ω, I/O test signal of Figure 1, T = T to T , unlessM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 6_______________________________________________________________________________________Typical Operating Characteristics(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)V L SUPPLY CURRENT vs. SUPPLY VOLTAGE (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)V CC (V)S U P P L Y C U R R E N T (μA )4.954.403.853.302.752.2010020030040050060001.655.50V CC SUPPLY CURRENT vs. SUPPLY VOLTAGE (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)V CC (V)S U P P L Y C U R R E N T (m A )4.954.403.853.302.752.200.51.01.52.02.53.03.501.65 5.50V L SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)TEMPERATURE (°C)S U P P L Y C U R R E N T (μA )6035-151050100150200250300350400-4085V CC SUPPLY CURRENT vs. TEMPERATURE(DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)TEMPERATURE (°C)S U P P L Y C U R R E N T (μA )6035-151020040060080010001200140016000-4085V L SUPPLY CURRENT vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L= +1.8V)CAPACITIVE LOAD (pF)S U P P L Y C U R R E N T (μA )857055402550100150200250300350010100V CC SUPPLY CURRENT vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)S U P P L Y C U R R E N T (μA )8570554025500100015002000250010100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454030352025152468101214161801050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520155010015020025001050MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________7PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )90807060504030100200300400500600700020100PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )4540353025201536912151050PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V L , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )454035302520155010015020025030001050RISE/FALL TIME vs. CAPACITIVE LOAD(DRIVING I/O V L , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O VL , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )4540353025201524681012141050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )45403530252015501001502002503001050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , VCC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC, V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520152468101201050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )454035302520155010015020025030001050Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )90807060504030100200300400500600700020100PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )4540353025201512345601050PROPAGATION DELAY vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +3.3V, V L = +1.8V)CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )454035302520155010015020025030001050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )908070605040305001000150020002500020100RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )403020246810121050RISE/FALL TIME vs. CAPACITIVE LOAD (DRIVING I/O V CC , V CC = +2.5V, V L = +1.8V)CAPACITIVE LOAD (pF)RI S E /F A L l T I M E (n s )403020501001502002503003501050RAIL-TO-RAIL DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 50pF, DATA RATE = 230kbps)M A X 3372E t o c 25I/O V L_I/O V CC_1V/div 2V/div 1μs/div RAIL-TO-RAIL DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 15pF, DATA RATE = 8Mbps)M A X 3372E t o c 26I/O V L_I/O V CC_1V/div2V/div200ns/divMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSP_______________________________________________________________________________________9Typical Operating Characteristics (continued)(R LOAD = 1M Ω, T A = +25°C, unless otherwise noted. All 230kbps TOCs apply to MAX3372E/MAX3377E only. All 8Mbps and 500kbps TOCs apply to MAX3373E–MAX3376E/MAX3378E/MAX3379E and MAX3390E–MAX3393E only.)EXITING THREE-STATE OUTPUT MODE (V CC = +3.3V, V L = +1.8V, C LOAD = 50pF)MAX3372E toc28I/O V L_I/O V CC_2μs/divTHREE-STATE2V/div1V/div1V/divPin DescriptionOPEN-DRAIN DRIVING(DRIVING I/O V L , V CC = +3.3V, V L = +1.8V,C LOAD = 15pF, DATA RATE = 500kbps)M A X 3372E t o c 27I/O V L_I/O V CC_1V/div2V/div200ns/divM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP 10______________________________________________________________________________________Detailed DescriptionThe MAX3372E –MAX3379E and MAX3390E –MAX3393E E SD-protected level translators provide the level shifting necessary to allow data transfer in a multivoltage system.Externally applied voltages, V CC and V L , set the logic lev-els on either side of the device. A low-voltage logic signal present on the V L side of the device appears as a high-voltage logic signal on the V CC side of the device, and vice-versa. The MAX3374E /MAX3375E /MAX3376E /MAX3379E and MAX3390E –MAX3393E unidirectional level translators level shift data in one direction (V L →V CC or V CC →V L ) on any single data line. The MAX3372E /MAX3373E and MAX3377E /MAX3378E bidi-rectional level translators utilize a transmission-gate-based design (see Figure 2) to allow data translation in either direction (V L ↔V CC ) on any single data line. The MAX3372E –MAX3379E and MAX3390E –MAX3393Eaccept V L from +1.2V to +5.5V and V CC from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems.All devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family feature a three-state output mode that reduces supply current to less than 1µA, thermal short-circuit protection, and ±15kV ESD protection on the V CC side for greater protection in applications that route sig-nals externally. The MAX3372E /MAX3377E operate at a guaranteed data rate of 230kbps. Slew-rate limiting reduces E MI emissions in all 230kbps devices. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E operate at a guaranteed data rate of 8Mbps over the entire specified operating voltage range. Within specific voltage domains, higher data rates are possible. (See the Timing Characteristics table.)Figure 1a. Rail-to-Rail Driving I/O V LFigure 1b. Rail-to-Rail Driving I/O V CCMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPLevel TranslationFor proper operation ensure that +1.65V ≤V CC ≤+5.5V, +1.2V ≤V L ≤+5.5V, and V L ≤(V CC + 0.3V).During power-up sequencing, V L ≥(V CC + 0.3V) will not damage the device. During power-supply sequenc-ing, when V CC is floating and V L is powering up, a cur-rent may be sourced, yet the device will not latch up.The speed-up circuitry limits the maximum data rate for devices in the MAX3372E –MAX3379E , MAX3390E –MAX3393E family to 16Mbps. The maximum data rate also depends heavily on the load capacitance (see the Typical Operating Characteristics ), output impedance of the driver, and the operational voltage range (see the Timing Characteristics table).Speed-Up CircuitryThe MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E–MAX3393E feature a one-shot generator that decreases the rise time of the output. When triggered,MOSFETs PU1 and PU2 turn on for a short time to pull upI/O V L_and I/O V CC_to their respective supplies (see Figure 2b). This greatly reduces the rise time and propa-gation delay for the low-to-high transition. The scope photo of Rail-to-Rail Driving for 8Mbps Operation in the Typical Operating Characteristics shows the speed-up circuitry in operation.Rise-Time AcceleratorsThe MAX3373E–MAX3376E/MAX3378E/MAX3379E and the MAX3390E –MAX3393E have internal rise-time accelerators allowing operation up to 16Mbps. The rise-time accelerators are present on both sides of the device and act to speed up the rise time of the input and output of the device, regardless of the direction of the data. The triggering mechanism for these accelera-tors is both level and edge sensitive. To prevent false triggering of the rise-time accelerators, signal fall times of less than 20ns/V are recommended for both the inputs and outputs of the device. Under less noisy con-ditions, longer signal fall times may be acceptable.Figure 1c. Open-Drain Driving I/O V CCFigure 1d. Open-Drain Driving I/O V LM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Three-State Output ModePull THREE-STATE low to place the MAX3372E –MAX3379E and MAX3390E–MAX3393E in three-state out-put mode. Connect THREE-STATE to V L (logic-high) for normal operation. Activating the three-state output mode disconnects the internal 10k Ωpullup resistors on the I/O V CC and I/O V L lines. This forces the I/O lines to a high-impedance state, and decreases the supply current to less than 1µA. The high-impedance I/O lines in three-state output mode allow for use in a multidrop network.When in three-state output mode, do not allow the voltageat I/O V L_to exceed (V L + 0.3V), or the voltage at I/O V CC_to exceed (V CC + 0.3V).Thermal Short-Circuit ProtectionThermal overload detection protects the MAX3372E –MAX3379E and MAX3390E–MAX3393E from short-circuit fault conditions. In the event of a short-circuit fault, when the junction temperature (T J ) reaches +152°C, a thermal sensor signals the three-state output mode logic to force the device into three-state output mode. When T J has cooled to +142°C, normal operation resumes.Figure 2a. Functional Diagram, MAX3372E/MAX3377E (1 I/O line)Figure 2b. Functional Diagram, MAX3373E/MAX3378E (1 I/O line)±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The I/O V CC lines have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against E SD of ±15kV without damage. The E SD structures withstand high E SD in all states: normal operation, three-state output mode, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways. The I/O V CC lines of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the Contact Discharge method specifiedin IEC 1000-4-23)±10kV using IE C 1000-4-2’s Air-Gap DischargemethodESD Test Conditions E SD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body Model Figure 3a shows the Human Body Model and Figure 3b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the test device through a 1.5kΩresistor.IEC 1000-4-2 The IE C 1000-4-2 standard covers E SD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3372E–MAX3379E and MAX3390E–MAX3393E help to design equipment that meets Level 3 of IEC 1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IE C 1000-4-2 is higher peak current in IE C 1000-4-2, because series resistance is lower in the IE C 1000-4-2 model. Hence, the E SD with-stand voltage measured to IE C 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 4a shows the IEC 1000-4-2 model, and Figure 4b shows the current waveform for the ±8kV, IEC 1000-4-2, Level 4, ESD contact-discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method con-nects the probe to the device before the probe is energized.Machine Model The Machine Model for E SD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just inputs and outputs. Therefore, after PCB assembly, the Machine Model is less relevant to I/O ports.MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSPFigure 3a. Human Body ESD Test ModelFigure 3b. Human Body Current WaveformM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393EApplications InformationPower-Supply DecouplingTo reduce ripple and the chance of transmitting incor-rect data, bypass V L and V CC to ground with a 0.1µF capacitor. See the Typical Operating Circuit. To ensure full ±15kV ESD protection, bypass V CC to ground with a 1µF capacitor. Place all capacitors as close to the power-supply inputs as possible.I 2C Level TranslationThe MAX3373E –MAX3376E , MAX3378E /MAX3379E and MAX3390E–MAX3393E level-shift the data present on the I/O lines between +1.2V and +5.5V, making them ideal for level translation between a low-voltageASIC and an I 2C device. A typical application involves interfacing a low-voltage microprocessor to a 3V or 5V D/A converter, such as the MAX517.Push-Pull vs. Open-Drain DrivingAll devices in the MAX3372E –MAX3379E and MAX3390E–MAX3393E family may be driven in a push-pull configuration. The MAX3373E –MAX3376E /MAX3378E /MAX3379E and MAX3390E –MAX3393E include internal 10k Ωresistors that pull up I/O V L_and I/O V CC_to their respective power supplies, allowing operation of the I/O lines with open-drain devices. See the Timing Characteristics table for maximum data rates when using open-drain drivers.Low-Voltage Level Translators in UCSPFigure 4b. IEC 1000-4-2 ESD Generator Current WaveformFigure 4a. IEC 1000-4-2 ESD Test Model Typical Operating CircuitMAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPApplications CircuitsM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Applications Circuits (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP Applications Circuits (continued)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPApplications Circuits (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPApplications Circuits (continued)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSP Selector Guide*Higher data rates are possible (see the Timing Characteristics table).Ordering Information (continued)+Denotes a lead-free package.**EP = Exposed pad.T = Tape and reel.Ordering Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP**EP = Exposed pad.T = Tape and reel.†Future product—contact factory for availability.M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPin Configurations (continued)Pin Configurations (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSPM A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPin Configurations (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393ELow-Voltage Level Translators in UCSPChip InformationTRANSISTOR COUNT:MAX3372E–MAX3376E: 189MAX3377E–MAX3379E, MAX3390E–MAX3393E:295PROCESS: BiCMOSPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Package Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Package Information (continued)MAX3372E–MAX3379E/MAX3390E–MAX3393E Low-Voltage Level Translators in UCSP (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.)Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)M A X 3372E –M A X 3379E /M A X 3390E –M A X 3393ELow-Voltage Level Translators in UCSPMAX3372E–MAX3379E/MAX3390E–MAX3393E ±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSPMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________31©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Revision History元器件交易网。

INFRARED RECEIVER MODULE MIM-3xx7H4 DescriptionFeaturesl Photo detector and preamplifier in one packagel Internal filter for PCM frequencyl High immunity against ambient lightl Improved shielding against electric field disturbancel 3.0-Volt supply voltage; low power consumptionl TTL and CMOS compatibilityMIM-3xx7H4 Series Modelsl MIM-3337H4 32.7KHzl MIM-3377H4 36.7KHzl MIM-3387H4 37.9KHzl MIM-3407H4 40.0KHzl MIM-3567H4 56.7KHzBLOCK DIAGRAMREV: A1Absolute Maximum RatingsItem Symbol Ratings Unit RemarkSupply voltage Vs-0.3 ~ 6.0VSupply Current Is 2.5mAOperating temperature T opr-25 ~ + 85o CStorage temperature T stg-25 ~ + 85o CSoldering temperature T sd260o C t≦5 s, 1mm from caseJunction Temperature T j100o CElectro-optical characteristics (Vcc=3.0V)Parameter Symbol Min.Typ.Max.Unit RemarksSupply Voltage Vs 2.7 3.0 5.5VCurrent consumption Icc 1.1 2.5mA Under no signal Response wavelength l p940nmOutput form - - - - - active low output - - - - -H level output voltage V0h 2.8 3.0VL level output voltage V0l0.20.4VH level output pulse width Twh500800m sL level output pulse width Twl500800m sDistance between emitter & detector L110.0m Note 1Half angle Dq±45deg Horizonal directionTest MethodA. Standard TransmitterREV: A1B. Detection Length TestC . Pulse Width TestApplication CircuitREV: A1Dimensions in mmREV: A1CHARACTERISTIC CURVES (T A=25o C)REV: A1INFRARED RECEIVER MODULE MIM-3xx7H4 ReliabilityTest item Test condition StandardHigh temparature Ta=+80o C t=240H Note 2.High temp. & high humi.Ta=+40o C 90%RH t=240H Note 2.Low temparature Ta= -25o C t=240H Note 2.Temperature cycle -25o C(0.5H) ~ +80o C(0.5H) 20cycle Note 2.Dropping Test devices shall be dropped 3 times naturally Note 3.onto hard wooden board from a 75cm height position.NOTE 1. Distance between emitter & detector specifies maximum distance that output wave form satisfiesthe standard under the conditions below against the standerd transmitter.(1)Measuring place ………Indoor without extreme reflection of light.(2)Ambient light source… Detecting surface illumination shall be 200±50Lux under ordinaryhite fluorescense lamp of no high frequency lighting.(3)Standard transmitter … Burst wave indicated in Fig 1. of standard transmittershall be arranged to 50mVp-p under the measuring circuit specified in Fig 2.NOTE 2. (electro-optical charactistics) shall be satisfied after leaving 2 hours in the normal temperature .NOTE 3. (electro-optical charactistics) shall be satisfied and no conoid deformsand destructions of appearance .(excepting deforms of terminals)Inspection standard1.Among electrical characteristics , total number shall be inspected on items blow.1-1 front distance between emitter & detector1-2 Current consumption1-3 H level output voltage1-4 L level output voltage2.Items except above mentioned are not inspected particularly , but shall fully satisfyCAUTION ( When use and storage of this device )1.Store and use where there is no force causing transformation or change in quality .2.Store and use where there is no corrosive gas or sea(salt) breeze .3.Store and use where there is no extreme humidity .4.Solder the lead-pin within the condition of ratings. After soldering do not add extra force .5.Do not wash this device . Wipe the stains of diode side with a soft cloth. You canuse the solvent , ethylalcohol or methylalcohol or isupropylene only .6.To prevent static electricity damage to the Pre-AMP make sure that the human body, the soldering iron is connected to ground before using .7.Put decoupling device between Vcc and GND for reduse the noise from power supply line .8.The performance of remote-control system depends on environments condition and abilityof periferal parts. Customer should evaluate the performance as total system in those conditionsafter system up with components such as commander , micon and this receiver module .Others1.This device is not design to endure radiative rays and heavily charged particles .2.In case where any trouble or questions arise,both parties agress to make full discussioncovering the said problem .REV: A1。