Interplay of Electroweak Precision Observables and B Physics Observables

V2426A SeriesIntel®3rd Gen Core™CPU,EN50155railway computer with2mini PCIe expansion slotsFeatures and Benefits•Intel Celeron/Core i7processor•2peripheral expansion slots for various I/O,WLAN,mini-PCIe expansionmodule cards•Dual independent DVI-I displays•2Gigabit Ethernet ports with M12X-coded connectors•1SATA connector and1CFast socket for storage expansion•M12A-coded power connector•Compliant with EN50121-4•Complies with all EN50155mandatory test items1•Ready-to-run Debian7,Windows Embedded Standard7,and Windows10Embedded IoT Enterprise2016LTSB platforms•-40to70°C wide-temperature models available•Supports SNMP-based system configuration,control,and monitoring(Windows only)CertificationsIntroductionThe V2426A Series embedded computers are based on the Intel3rd Gen processor,and feature4RS-232/422/485serial ports,dual LAN ports,3 USB2.0hosts,and dual DVI-I outputs.In addition,the V2426A Series computers comply with the mandatory test items of the EN50155standard, making them suitable for a variety of industrial applications.The dual megabit/Gigabit Ethernet ports with M12X-coded connectors offer a reliable solution for network redundancy,promising continuous operation for data communication and management.As an added convenience,the V2426A computers have6DIs and2DOs for connecting digital input/output devices.In addition,the CFast socket,SATA connector,and USB sockets provide the V2426A computers with the reliability needed for industrial applications that require data buffering and storage expansion.Moreover,the V2426A computers come with2peripheral expansion slots for inserting different communication modules(2-port CAN module,or HSDPA,GPS,or WLAN module),an8+8-port digital input/output module,and a2-port serial module,giving greater flexibility for setting up different industrial applications at field sites.Preinstalled with Linux Debian7or Windows Embedded Standard7,the V2426A Series provides programmers with a friendly environment for developing sophisticated,bug-free application software at a low cost.Wide-temperature models of the V2426A Series that operate reliably in a-40 to70°C operating temperature range are also available,offering an optimal solution for applications subjected to harsh environments.1.This product is suitable for rolling stock railway applications,as defined by the EN50155standard.For a more detailed statement,click here:/doc/specs/EN_50155_Compliance.pdfAppearanceFront View Rear ViewSpecificationsComputerCPU V2426A-C2Series:Intel®Celeron®Processor1047UE(2M cache,1.40GHz)V2426A-C7Series:Intel®Core™i7-3517UE Processor(4M cache,up to2.80GHz) System Chipset Mobile Intel®HM65Express ChipsetGraphics Controller Intel®HD Graphics4000(integrated)System Memory Pre-installed4GB DDR3System Memory Slot SODIMM DDR3/DDR3L slot x1Supported OS Linux Debian7Windows Embedded Standard7(WS7E)32-bitWindows Embedded Standard7(WS7E)64-bitStorage Slot 2.5-inch HDD/SSD slots x1CFast slot x2Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(M12X-coded)x2Serial Ports RS-232/422/485ports x4,software selectable(DB9male)USB2.0USB2.0hosts x1,M12D-coded connectorUSB2.0hosts x2,type-A connectorsAudio Input/Output Line in x1,Line out x1,M12D-codedDigital Input DIs x6Digital Output DOs x2Video Output DVI-I x2,29-pin DVI-I connectors(female)Expansion Slots2peripheral expansion slotsDigital InputsIsolation3k VDCConnector Screw-fastened Euroblock terminalDry Contact On:short to GNDOff:openI/O Mode DISensor Type Dry contactWet Contact(NPN or PNP)Wet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage24to30VDCLED IndicatorsSystem Power x1Storage x1LAN2per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial InterfaceBaudrate50bps to921.6kbpsFlow Control RTS/CTS,XON/XOFF,ADDC®(automatic data direction control)for RS-485,RTSToggle(RS-232only)Isolation N/AParity None,Even,Odd,Space,MarkData Bits5,6,7,8Stop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage12to48VDCPower Connector M12A-coded male connectorPower Consumption 3.78A@12VDC0.96A@48VDCPower Consumption(Max.)47W(max.)Physical CharacteristicsHousing AluminumIP Rating IP30Dimensions(with ears)275x92x154mm(10.83x3.62x6.06in)Dimensions(without ears)250x86x154mm(9.84x3.38x6.06in)Weight3,000g(6.67lb)Installation DIN-rail mounting(optional),Wall mounting(standard) Protection-CT models:PCB conformal coating Environmental LimitsOperating Temperature Standard Models:-25to55°C(-13to131°F)Wide Temp.Models:-40to70°C(-40to158°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFRailway EN50121-4,IEC60571Railway Fire Protection EN45545-2Safety EN60950-1,UL60950-1Shock IEC60068-2-27,IEC61373,EN50155Vibration IEC60068-2-64,IEC61373,EN50155DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime304,998hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x V2426A Series computerInstallation Kit1x wall-mounting kitDocumentation1x document and software CD1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name CPU Memory(Default)OS CFast(CTO)Backup CFast(CTO)SSD/HDD Tray(CTO)PeripheralExpansionSlotsOperatingTemp.ConformalCoatingV2426A-C2Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-25to55°C–V2426A-C2-T Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C–V2426A-C2-CT-T Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C✓V2426A-C7Core i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-25to55°C–V2426A-C7-T Core i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C–V2426A-C7-CT-T i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C✓V2426A-C2-W7E Celeron1047UE4GB8GB1(Optional)1(Optional)2-25to55°C–V2426A-C2-T-W7E Celeron1047UE4GB8GB1(Optional)1(Optional)2-40to70°C–V2426A-C7-T-W7E i7-3517UE4GB8GB1(Optional)1(Optional)2-40to70°C–Accessories(sold separately)Battery KitsRTC Battery Kit Lithium battery with built-in connectorCablesCBL-M12XMM8PRJ45-BK-100-IP67M12-to-RJ45Cat-5E UTP gigabit Ethernet cable,8-pin X-coded male connector,IP67,1mCBL-M12(FF5P)/Open-100IP67A-coded M12-to-5-pin power cable,IP67-rated5-pin female M12connector,1mA-CRF-RFQMAM-R2-50Wi-Fi Extension Cable QMA(male)to SMA(male)adapter with50cm cable x1A-CRF-QMAMSF-R2-50Cellular Extension Cable QMA(male)to SMA(female)adapter with50cm cable x1A-CRF-CTPSF-R2-50GPS Extension Cable TNC to SMA(female)adapter with50cm cable x1ConnectorsM12A-5PMM-IP685-pin male circular threaded D-coded M12USB connector,IP68M12X-8PMM-IP678-pin male X-coded circular threaded gigabit Ethernet connector,IP67M12A-5P-IP68A-coded screw-in sensor connector,female,IP68,4.05cmM12A-8PMM-IP678-pin male circular threaded A-codes M12connector,IP67-rated(for field-installation)Power AdaptersPWR-24270-DT-S1Power adapter,input voltage90to264VAC,output voltage24V with2.5A DC loadPower CordsPWC-C7AU-2B-183Power cord with Australian(AU)plug,2.5A/250V,1.83mPWC-C7CN-2B-183Power cord with two-prong China(CN)plug,1.83mPWC-C7EU-2B-183Power cord with Continental Europe(EU)plug,2.5A/250V,1.83mPWC-C7UK-2B-183Power cord with United Kingdom(UK)plug,2.5A/250V,1.83mPWC-C7US-2B-183Power cord with United States(US)plug,10A/125V,1.83mWall-Mounting KitsV2400Isolated Wall Mount Kit Wall-mounting kit with isolation protection,2wall-mounting brackets,4screwsStorage KitsFK-75125-02Storage bracket,4large silver screws,4soft washers,4small sliver bronze screws,1SATA powercable,4golden spacers(only for the V2406and V2426)Expansion ModulesEPM-DK022mini PCIe slots for wireless modules,-25to55°C operating temperatureEPM-DK03GPS receiver with2mini PCIe slots for wireless modules,-25to55°C operating temperatureEPM-30322isolated RS-232/422/485ports with DB9connectors,-40to70°C operating temperatureEPM-31122isolated CAN ports with DB9connectors,-25to55°C operating temperatureEPM-34388DIs and8DOs,with3kV digital isolation protection,2kHz counter,-40to70°C operating AntennasANT-GPS-OSM-05-3M BK Active GPS antenna,26dBi,1572MHz,L1band antenna for GPSANT-LTEUS-ASM-01GSM/GPRS/EDGE/UMTS/HSPA/LTE,omni-directional rubber duck antenna,1dBiANT-WDB-ARM-02 2.4/5GHz,omni-directional rubber duck antenna,2dBi,RP-SMA(male)ANT-LTE-ASM-02GPRS/EDGE/UMTS/HSPA/LTE,omni-directional rubber duck antenna,2dBiANT-WCDMA-AHSM-04-2.5m GSM/GPRS/EDGE/UMTS/HSPA,omni-directional magnetic base antenna,4dBiWireless Antenna CablesA-CRF-MHFQMAF-D1.13-14.2Digital Interface Mini card internal antenna with QMA connector x1,locking washer x1,O-ring x1,nutx1DIN-Rail Mounting KitsDK-DC50131DIN-rail mounting kit,6screwsWireless PackagesEPM-DK3G Package Gemalto PHS8-P3G mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK Wi-Fi Package SprakLAN WPEA-121N Wi-Fi mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK LTE-EU Package Gemalto PLS8-E LTE mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK LTE-US Package Gemalto PLS8-X LTE mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padWireless Antenna Packages3G Antenna Package3G external antenna with QMA(male)to SMA(female)adapter and50-cm cables x2,3G externalantenna with SMA connectors x2,cellular extension cableLTE-US Antenna Package LTE-US external antenna with QMA(male)to SMA(female)adapter and50-cm cables x2,LTE-USexternal antenna with SMA connector x2,cellular extension cableLTE-EU Antenna Package LTE-EU external antenna with QMA(male)to SMA(female)adapter with50-cm cables x2,LTE-EUexternal antenna with SMA connectors x2,cellular extension cableWi-Fi Antenna Package External antenna with QMA internal cable,Wi-Fi extension cableGPS Antenna Package External antenna with TNC to SMA(female)adapter and a50-cm cable,SMA antenna(26dBi,1572MHz,L1band),GPS extension cable©Moxa Inc.All rights reserved.Updated Jan22,2020.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

iem9 weIEM9 WE: A Guide to High-Fidelity In-Ear MonitorsIntroduction:With advancements in audio technology, musicians, audio engineers, and music enthusiasts are constantly on the lookout for high-fidelity audio solutions that can accurately reproduce sound, providing detailed clarity and immersive experiences. In-ear monitors (IEMs) have become increasingly popular due to their ability to deliver high-quality sound directly into the ears, eliminating outside noise and offering personalized sound experiences. In this document, we will explore the IEM9 WE, a premium in-ear monitor known for its exceptional sound quality and comfort.Section 1: Overview of the IEM9 WE1.1 Design and Construction:The IEM9 WE is designed with attention to detail, both aesthetically and functionally. It features a lightweight and ergonomic design, ensuring a comfortable fit for long listening sessions. The monitor is crafted using high-quality materials, providing durability and longevity.1.2 Sound Technology:With cutting-edge sound technology, the IEM9 WE offers an exceptional audio experience. It employs multiple balanced armature drivers, each focusing on different frequency ranges, resulting in a well-balanced sound reproduction. The drivers are meticulously tuned to provide accurate and detailed sound across the entire frequency spectrum.1.3 Customization Options:To cater to individual preferences, the IEM9 WE offers customization options. Users can choose different sound signatures, such as neutral, bass-boosted, or vocal-oriented, ensuring a tailored listening experience. Additionally, the IEMs can be personalized with custom artwork or engravings, adding a touch of individuality.Section 2: Sound Quality and Performance2.1 Clarity and Detail:The IEM9 WE excels in reproducing intricate details in audio recordings. Whether it is the delicate plucking of guitar strings or the crispness of vocals, every element of the sound is rendered with accuracy. The monitor's wide frequency response ensures that no nuances are lost.2.2 Imaging and Soundstage:One of the standout features of the IEM9 WE is its ability to create an immersive soundstage. The placement of instruments and vocals is precise, giving the listener a sense of space and depth. The monitor's impressive imaging capabilities allow users to pinpoint the exact location of sounds.Section 3: Comfort and Fit3.1 Secure Fit:The IEM9 WE provides a secure fit, thanks to its ergonomic design and a variety of ear tip options. It ensures that the monitors stay in place during vigorous movement, making it suitable for live performances and active listening.3.2 Noise Isolation:With its snug fit, the IEM9 WE effectively blocks ambient noise, allowing users to concentrate on their music without any distractions. Whether in a noisy environment or on stage, the monitors provide an immersive listening experience by isolating external sounds.Section 4: Durability and Maintenance4.1 Build Quality:The IEM9 WE is constructed with durability in mind. The housing is made from high-quality materials that can withstand heavy usage and protect the internal components. The cables are detachable and replaceable, allowing for easy maintenance and reducing the need for complete unit replacement.4.2 Cleaning and Care:Proper cleaning and maintenance are essential to prolonging the life of IEMs. The IEM9 WE comes with a cleaning tool and instructions for cleaning the monitors and ear tips. Regular cleaning prevents the buildup of earwax and ensures optimal sound quality.Conclusion:The IEM9 WE is a high-fidelity in-ear monitor known for its exceptional sound quality, comfortable fit, and durability. Its advanced sound technology, customization options, and immersive soundstage make it a popular choice among musicians, audio professionals, and music enthusiasts. Investing in the IEM9 WE guarantees an audio experience that captures every detail of your favorite music, bringing it to life.。

全息投影手环的作文英语Title: The Revolutionary Holographic Projection Wristband。

In recent years, technology has advanced by leaps and bounds, bringing forth innovations that redefine the way we perceive and interact with the world around us. Among these remarkable advancements stands the holographic projection wristband, a groundbreaking invention poised to revolutionize the realm of wearable technology. In this essay, we delve into the myriad capabilities and implications of this cutting-edge device.At its core, the holographic projection wristband integrates state-of-the-art holographic technology into a sleek, wearable form factor. Unlike traditional displays, which are confined to flat screens, this wristband projects three-dimensional holograms into the surrounding space, creating an immersive visual experience for the user and those around them.One of the most notable features of the holographic projection wristband is its versatility. Whether it's for entertainment, communication, education, or productivity, the wristband offers a wide range of applications limited only by imagination. Imagine being able to watch your favorite movies or concerts in full 3D, with holographic images appearing as if they were right in front of you. Furthermore, the wristband could serve as a communication tool, allowing users to engage in holographic video calls with friends, family, or colleagues from anywhere in the world.In the realm of education, the holographic projection wristband holds immense potential to revolutionize learning experiences. Imagine students being able to visualize complex concepts in three dimensions, bringing subjectslike biology, physics, and history to life in ways never before possible. With interactive holographic simulations, learning becomes not only more engaging but also more effective, as students gain a deeper understanding of abstract concepts through immersive experiences.Moreover, the wristband could significantly enhance productivity in various fields. For professionals such as architects, engineers, and designers, being able tovisualize and manipulate 3D models directly in front ofthem could streamline the design process and foster greater creativity. In business settings, presentations could become more dynamic and engaging, as speakers use holographic visuals to convey their ideas with impact.Beyond its practical applications, the holographic projection wristband also has the potential to reshape entertainment and social interactions. Imagine attendinglive events where holographic performers interact with the audience in real-time, blurring the lines between thevirtual and the physical worlds. Additionally, thewristband could enable new forms of social media, where users share holographic experiences and engage with each other in immersive virtual environments.Of course, with any new technology, there are also considerations regarding privacy, security, and ethical use.As holographic projections become more commonplace in everyday life, it will be essential to establish clear guidelines and regulations to protect users' privacy and prevent misuse of the technology.In conclusion, the holographic projection wristband represents a paradigm shift in wearable technology, offering a glimpse into a future where interactions with digital content are no longer confined to screens but seamlessly integrated into our surroundings. With its vast potential for entertainment, education, productivity, and social interaction, the wristband heralds a new era of immersive experiences limited only by our imagination. As we continue to push the boundaries of technological innovation, the possibilities presented by the holographic projection wristband are truly limitless.。

Rev. 0 Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Speci cations subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support ADI 中文版数据手册是英文版数据手册的译文，敬请谅解翻译中可能存在的语言组织或翻译错误，ADI 不对翻译中存在的差异或由此产生的错误负责。

如需确认任何词语的准确性，请参考ADI 提供的最新英文版数据手册。

典型应用电路CHANNEL 2BUCK REGULATOR (1.2A/2.5A/4A)CHANNEL 3BUCK REGULATOR(1.2A)OSCILLATOR INT VREG 100mAQ1Q2L1L2VREGSYNC/MODERT FB1BST1SW1DL1PGND DL2SW2BST2FB2L3BST3SW3FB3PGND3L4BST4SW4FB4PGND4VREGPVIN1COMP1EN1PVIN2COMP2EN2PVIN3PWRGD SS34COMP3EN3PVIN4COMP4EN4C2C1C4C3C5C6C7C8C9C10C11C12C134.5V TO 15VVOUT1VOUT2VOUT3VOUT4R ILIM1R ILIM2VREGEXPOSED PADSS12C0VDDCHANNEL 5200mA LDO REGULATORFB5PVIN5EN5VOUT5C14C15VOUT51.7V TO 5.5VADP5052CHANNEL 1BUCK REGULATOR (1.2A/2.5A/4A)CHANNEL 4BUCK REGULATOR(1.2A)10900-001图1.带四通道降压调节器和200 mA LDO 调节器的5通道集成式电源解决方案产品特性宽输入电压范围：4.5 V 至15 V输出精度：±1.5%(整个温度范围内)可调开关频率范围：250 kHz 至1.4 MHz 可调/固定输出选项，可通过工厂熔丝调节电源调节通道1和通道2：带低端FET 驱动器的可编程1.2 A/2.5 A/4 A 同步降压调节器通道3和通道4：1.2 A 同步降压调节器通道5：200 mA 低压差(LDO)调节器针对小负载要求，5.1 V LDO 电源始终处于激活状态8 A 单通道输出(通道1和通道2并联工作)精密使能，0.8 V 精确阈值有源输出放电开关FPWM 或自动PWM/PSM 模式选择频率同步输入或输出针对OVP/OCP 故障提供可选的闩锁保护所选通道的电源良好指示UVLO 、OCP 和TSD 保护48引脚7 mm × 7 mm LFCSP 封装结温范围：−40°C 至+125°C应用小型蜂窝基站FPGA 和处理器应用安防和监控医疗应用概述ADP5052在一个48引脚LFCSP 封装中集成了四个高性能降压调节器和一个200 mA 低压差(LDO)调节器，可满足严苛的性能和电路板空间要求。

The MKE 600 is the ideal video camera/camcorder micro-phone able to handle even demanding filmic challenges. Due to its high directivity, the MKE 600 picks up sounds coming from the direction in which the camera is pointing and effectively attenuates noise coming from the sides and rear. The switchable “Low Cut” filter additionally minimizes wind noise.Because some video cameras/camcorders do not provide phantom power, the MKE 600 can also be battery powered.A battery on/off switch prevents the battery from dischar-ging prematurely; “Low Batt” is displayed.ARTICLE INFORMATIONMKE 600Art. no. 505453FEATURES• Pronounced directivity• Maximal rejection of side noise• Switchable …Low Cut“ filter minimizes wind noise• Phantom or battery powering• Battery switch with …Low Batt“ indicator• Rugged all-metal housing• Very good suppression of structure-borne noiseDELIVERY INCLUDES• MKE 600 Shotgun microphone• MZS 600 Shock mount• MZW 600 Foam windshield• KA 600 Adapter cable• Pouch• Quick guide• Safety guideSennheiser electronic GmbH & Co. KG · Am Labor 1 · 30900 Wedemark · Germany · POLAR PATTERNFREQUENCY RESPONSE0510152025dB30°30°60°60°90°90°120°150°120°150°0°180°125 Hz 250 Hz 500 Hz 1000 Hz 2000 Hz 4000 Hz 8000 Hz 16000 HzLinear Low CutdBV -20-30-40-50-60-705010205010002005000100020000HzSPECIFICATIONSPick-up pattern super-cardioid/lobar Frequency response 40 – 20,000 HzSensitivity with P48 powering: 21 mV/Pa with battery powering: 19 mV/Pa Max. SPL with P48 powering: 132 dB SPL with battery powering: 126 dB SPL Equivalent noise level A-weighted with P48 powering: 15 dB (A)with battery powering: 16 dB (A)Power supply48 V ± 4 V (P48, IEC 61938) via XLR-3 orbattery/rechargeable battery (AA size, 1.5 V/1.2 V)Current consumption with P48 powering: 4.4 mA Operating time with battery approx. 150 h …Low Batt“ indicator < 1.05 V; approx. 8 h of remaining operating time after initial display Temperature range Operation: -10 °C to +60 °C Dimensions ⌀ 20 mm x 256 mm Weight128 g (without battery)。

1VGA/DVI/HDMI/stereo support via adapter/connector/bracket | 2 NVIDIA Quadro Sync II board sold separately. Learn more at /quadro | 3 Windows 7, 8, 8.1, 10 and Linux | 4 Please refer to http://developer /video-encode-decode-gpu-support-matrix for details on NVIDA GPU video encode and decode support | 5 Product is based on a published Khronos Specification, and is expected to pass the Khronos Conformance Testing Process when available. Current conformance status can be found at /conformance | 6 GPU supports DX 12.0 API Hardware Feature Level 12_1© 2018 NVIDIA Corporation. All rights reserved. NVIDIA, the NVIDIA logo, Quadro, nView, CUDA, and NVIDIA Pascal are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. All other trademarks and copyrights are the property of their respective owners.Extreme Visual Computing Performance in a Single Slot Form Factor .The NVIDIA Quadro P4000 combines a 1792 CUDA core Pascal GPU, large 8 GB GDDR5 memory and advanced display technologies to deliver the performance and features that are required by demanding professional applications. The ability to create an expansive visual workspace of up to four 5K displays (5120x2880 @ 60Hz) with HDR color support lets you view your creations in stunning detail. The P4000 is specially designed with the performance that is necessary to drive immersive VR environments. Additionally, you can create massive digital signage solutions of up to thirty-two 4K displays per system by connecting multiple P4000s via Quadro Sync II 2.Quadro cards are certified with a broad range of sophisticated professional applications, tested by leading workstation manufacturers, and backed by a global team of support specialists. This gives you the peace of mind to focus on doing your best work. Whether you’re developing revolutionary products or telling spectacularly vivid visual stories, Quadro gives you the performance to do it brilliantly.FEATURES >Four DisplayPort 1.4 Connectors 1 >DisplayPort with Audio >3D Stereo Support with Stereo Connector 1 >NVIDIA GPUDirect ™ Support >Quadro Sync II 2 Compatibility >NVIDIA nView ® Desktop Management Software >HDCP 2.2 Support >NVIDIA Mosaic 3 >Dedicated hardware video encode and decode engines 4SPECIFICATIONS GPU Memory 8 GB GDDR5 Memory Interface 256-bit Memory Bandwidth Up to 243 GB/s NVIDIA CUDA ® Cores 1792 System Interface PCI Express 3.0 x16 Max Power Consumption 105 W Thermal Solution Active Form Factor 4.4” H x 9.5” L, Single Slot, Full Height Display Connectors 4x DP 1.4 Max Simultaneous Displays 4 direct, 4 DP 1.4 Multi-Stream Display Resolution 4x 4096x2160 @ 120Hz 4x 5120x2880 @ 60Hz Graphics APIs Shader Model 5.1, OpenGL 4.55, DirectX 12.06, Vulkan 1.05Compute APIsCUDA, DirectCompute, OpenCL ™ UNMATCHED POWER.UNMATCHED CREATIVE FREEDOM. NVIDIA ® QUADRO ®P4000NVIDIA QUADRO P4000 | DATA SHEET | JUN18To learn more about the NVIDIA Quadro P4000 visit /quadro。

Product Training -In troduct ion to IAG LoudspeakersBaffle 障板，enclosure （cabinet）箱体-Sealed box / Infinite baffle 密闭式/ 无限障板式Bass reflex 低音反射式Tune port / reflex port 调谐器管Auxiliary Bass Radiator （ABR）辅助低音辐射器（俗称假低音）Tran smission line 传输线式（俗称迷宫式）Drive units 驱动单元（喇叭）-Dyn amic （Movin g-coil） Loudspeakers 电动（动圈）式扬声器Electrostatic Loudspeakers 静电式扬声器Treble un it / tweeter 高音单元Midra nge driver 中音单元Midbass driver 中低音单元Bass driver / woofer 低音单元subwooferCrossover分频器Crossover n etwork 分频网路Comp onen tsi n a crossover n etwork - in ductor 电感器,capacitor 电容器,resistor 电阻,choke扼流圈Crossover frequency 分频点/ 交越点Full range 全音域or Multi-way 多路2⑶N/.5 : "" usually in dicates the additi on of a sec ond woofer that plays the same bass rangeas the main woofer but rolls off far before the main woofer does.Filter slopes 衰减斜度of crossover networks —1st order 一阶分频(6dB/octave)2nd order 二阶分频(12dB/octave)3rd order 三阶分频(18dB/octave)4th order 四阶分频(24dB/octave)Frequency 频率 -expressed in Hz (Hertz) 周,kHz (kilo Hertz) 千周，MHz (Mega Hertz) 兆周，etc.Frequency spectrum 频谱Audio frequency 音频covers range from 20Hz ~ 20kHzSound pressure level (SPL) 声压电平Efficiency 效率and Sensitivity 灵敏度Sensitivity is expressed in decibels (dB) 分贝.Is one filter slope superior to another?Theoretically a steeper filter slope results in a more uniform frequency response, which is vital in the reproduction ofclassic music. Nevertheless, this can be achieved by adopting the much gen tler (1st order) filter slope with appropriate correct ing circuit (equalizati on).Curre nt IAG loudspeakersClassic Series -Li ncol n HCP -Richmond AnniversaryTwin-Pipe Tech no logy (TPT) bass load ing -A meld of quarter wave length 四分之一波长 andMission EX-800 Series -MX Series -79 Series -Active subwoofers -M-iSphereQuad Electrostatic loudspeakers (ESL)2905, ESL 2805Dynamic loudspeakers -L Series, L2 SeriesStudio monitors11 L ClassicWharfedale Airedale Classic Heritage -Neo -Opus Series —Evo Series - Castle Knight Seriesreflex loadingsModels ESLDiamond 10 -Diamond 9 -Obsidian HCP -Active subwoofers -SPC Series - SPC 8, SPC 10, SPC 12Multi-channel versus Stereo (2-channel)何谓，，，声道? “.1 ”代表超低音声道( LowFrequency Effect )。

VISULAS 532s from ZEISS Compact laser workstationfor state-of-the-art retinal therapy2// PRECISION MADE BY ZEISSDelivering precise and effective therapy.ZEISS VISULAS 532SWhen darkness led to enlightenment, when spontaneous retinal damage led to an effective therapy.1949Sun coagulatorby Prof. Gerd Meyer-Schwickerath1964Light coagulator 5000Light coagulator1957VISULAS Argon1987VISULAS 532s2001VISULAS 532s VITE20091998VISULAS 5322007VISULAS Trion2010VISULAS Trion VITESparked by the solar eclipse in 1945 anddriven by visionary partnersZEISS has been committed to precision, innovation and passionfor more than half a century in retinal photocoagulation. Eversince the first photocoagulation with sunlight was testedfrom the rooftop of a Hamburg eye clinic in 1949, dedicatedZEISS employees have sought intense dialogue with visionaryophthalmologists of their time. Dialogue that led, in 1957, tothe first commercially available photocoagulator in the world.Simultaneously this marked the birth of contactless surgery onthe human eye.ZEISS has been a strong driving force behind the focusedoptical therapy of retinal diseases. Committed to this tradition,the VISULAS 532s from ZEISS ranks seamlessly into a chain ofinnovative solutions with one sole objective: precise, effectiveand gentle therapy to preserve the eyesight and quality of lifeof patients.3Effective and reproducible treatmentThe VISULAS 532s is setting performance benchmarks. The efficient solid-state laser reveals its sustainable strength even in high-demand practices. The VISULAS 532s has sufficient power reserves for any treatment strategy – whether it is with short laser pulses in the millisecond range for a gentle grid treatment, or long pulses for an effective retinopexy or even angioma sclerotherapy. Its built-in thermoelectric cooling system ensures maximum temporal stability of the laser power and thusmeets the basic prerequisite for reproducible clinical results.Exceptionally precise beam control and treatment accuracy. Extremely compact and reliable in daily clinical practice.Outstandingly ergonomic and intuitive to operate. TheVISULAS ® 532s from ZEISS is an impressive, powerful,diode-pumped solid-state laser for controlled and gentlephotocoagulation of the retina.4ZEISS VISULAS 532sMastering everyday life in the clinic.Reliable. Competent. Superior.3D illustration of a single pulse coagulationFundus image of a single pulse coagulationnear the optic nerve headA laser workstation par excellenceIn combination with the ZEISS Laser Slit Lamp LSL 532s, the ZEISS VISULAS 532sbecomes a perfectly integrated laser workstation.The electronic micromanipulator allows for sensitive, synchronous laser beampositioning and slit lamp illumination. The ParFocus zoom system delivers a homo-geneous, sharply-defined and reproducible laser spot on the retina, which minimizesheat-related side effects on the patient’s cornea. The active ClearView physiciansafety filter offers not only a unique and true-to-color slit lamp image, but alsoreliably protects the physician, automatically swinging into position when thetherapy beam is activated.Navigate efficiently and confidentlyThe VISULAS 532s has a language-independent color touch screen for convenientand easy operation. The removable control panel can easily adjust to the viewingangle of the user. The PowerPress control enables direct selection of the powersetting, without losing sight of the patient’s fundus.Navigating with fingertip precision:the electronic micromanipulator.… can be placed ergonomicallyon the instrument table.Removable control panel …56In addition to the conventional single-spot mode, theVISULAS ® 532s VITE from ZEISS can also operate in multi-spot mode. A linear sequence of up to 12 laser pulsescan be triggered at the touch of a button on the slit lampjoystick of the ZEISS VISULAS 532s VITE .Significantly reduce treatment timesThe automated micromanipulator reliably controls the fast progression of an entire sequence of laser spots. Extremely precise, and long-term stable linear motors move the laser beam in just a few milliseconds to the next pre-calculated target position reducing conventional treatment time by 30 % to 60 %1).Customize treatment strategiesThe active control on the trigger button of the slit lamp allows the physician tomaintain control over treatment progress at all times, with “fingertip precision”.A slight rotation or movement of the joystick is all that is needed to adjust theposition of the aiming beam as treatment proceeds. Flexible and precise. A multi-spot cascade allows the treatment strategy to be customized to the irregularcontours of the retina.Intelligently streamline treatment workflowsThe clear layout of the graphic elements on the control panel follows a logicalsequence and efficiently supports clinical workflows. Multi-spot treatmentparameters, such as spot spacing, number of laser spots per sequence, and angle of orientation of a sequence, are homogeneously embedded in the VISULAS 532s user interface and can be adjusted during treatment. The illuminated SPOTviewdisplay allows the physician to continuously monitor the laser spot diameter, even in darkened environments.ZEISS VISULAS 532s VITEExpanding with your needs.Fast. Flexible. Physician-controlled.3D illustration of a contoured VITE cascade Fresh and pigmented laser lesions(pulse duration: 20 ms)2)7Handle treatment interruptions with no stressThe physician may interrupt treatment at any time in an instant: with spot precisionwithin the current sequence and in a controlled manner. This ensures the physicianmaximum precision and the patient optimum protection.Comparison of average treatment time per 100 laser lesions for PRP treatments in conventional single-pulse mode of the VISULAS 532s (Group A: 35 patients) compared with PRP treatments in multi-spot mode of the VISULAS 532s VITE (Group B2: 37 patients). Time saving of around 40 %1).1) Roeckl A, Blum M: Multispot laser photocoagulation with the VISULAS 532s VITE:A comparative study of 101 patients, Publication no. 000000-1839-880, LAS.2979, 06 / 2010.2)Roeckl A, Blum M: Pan-retinal laser photocoagulation with reduced pulse duration – first experienceswith linear spot cascades, Klinische Monatsblätter der Augenheilkunde, 2011 (DOI: 10.1055 / s-0031-1273432)[sec]604020073.4 s44.8 s Conventionalindividual treatment VISULAS 532s VITE treatmentZEISS VISULAS 532s VITEResults to be proud of.Effective. Gentle. Comfortable.The VISULAS ® 532s VITE from ZEISS offers a clinically effective and gentle retinal laser therapy for conventional treatment strategies, such as pan-retinal photocoagulation, central grid coagulation and central focal coagulation.The must-have feature: conventional therapy with single pulsesThe VISULAS 532s provides effective single-spot treatment using laser parameters that have established themselves as the evidence-based gold standard in accordance with the results of major clinical studies for the treatment of diabetic retinopathyand diabetic maculopathy (DRS, ETDRS, mETDRS, ).The exclusive add-on: conventional therapy with spot sequencesThe particular advantage of the VISULAS 532s VITE : it is the only coagulation laser that conforms to study-recommended laser settings, not only in the single-spot mode but also in the multi-spot mode (e.g. 50 ms pulse duration or 50 μm laser beam diameter).Initial clinical results prove that a significant reduction in treatment time can beachieved – without compromising the gold standard.The compelling highlight: gentle therapy with short pulsesWith the VISULAS 532s, it is also possible in short-pulse mode to set laser lesions efficiently and in a controlled fashion, with typical laser pulse duration between 10 and 40 ms – thanks to guaranteed laser output of 1.5 watt. Although a higher laser output is necessary to compensate for the lower pulse duration, in order to achieve a lesion of the same intensity, short-pulse photocoagulation is a gentlealternative to conventional laser therapy. This is due to a significantly lower energy load per unit per area 2).Combined grid / PRP treatmentwith VITE cascades3)83D illustration of a circular VITE cascadeIn addition, shorter laser pulses cause less damage to surrounding tissue,since thermal conduction is not able to progress as far during the shorter pulsedurations, thus protecting the inner layers of the retina (see images). Thissignificantly enhances patient comfort 2). Short pulses create sharply outlinedlesions with highly controlled heat propagation. Clinical research is currentlyunderway on the potential positive effects of the combination of short pulsedurations and small beam diameters.9OCT B scans (Cirrus™ HD-OCT by Carl Zeiss Meditec AG) prove: A 20 ms laser pulse shows a less extensive lesion than a 200 ms pulse 3) (the beam diameter was 100 μm in both cases).2) Roeckl A, Blum M: Pan-retinal laser photocoagulation with reduced pulse duration – first experienceswith linear spot cascades, Klinische Monatsblätter der Augenheilkunde, 2011 (DOI: 10.1055 / s-0031-1273432)3)Dr. Fang Lu, West China Hospital, Sichuan University, Chengdu, China10The VISULAS ® 532s from ZEISS is designed for universal use. Due to its adaptable concept, the VISULAS 532s is ready to use in a blink of an eye – for the outpatient retina clinic or operating room. A wide range of applicators and high-quality accessories compliment the high-performance, multifaceted VISULAS 532s.VISULINK 532 / U – compatible with many diagnostic slit lamps The VISULINK ® 532 / U – consisting of optical laser link and mechanical adapter – offers spot sizes of 50 μm to 1000 μm, and is equipped with a true-to-color physician safety filter. It converts diagnostic slit lamps made by ZEISS, or e.g. Haag-Streit into fully-fledged laser workstations in an instant. The easy to use mechanism allows fast switching between different diagnostic slit lamps. To use the slit lamp diagnostically, the VISULINK 532 / U can be swiveled out of the way.LIO 532s / Trion – high contrast and reliableThe Heine indirect ophthalmoscope specifically is modified for the application requirements of ZEISS: the LIO 532s / Trion is suitable for both the VISULAS 532s and the multi-wavelength laser VISULAS Trion. It is light and stable and stands out in particular due to its high aiming beam contrast compared to the retinal background. VISULINK 532s/ U in operationLIO 532s/ Trion indirect ophthalmoscopeTechnical dataVISULAS 532sLSL 532s / LSL 532s VITE laser slit lampLaser beam delivery Interlaced with slit illumination systemLaser treatment spot size continuously adjustable, 50–1,000 µm(without contact lens), parfocal, larger spot sizesdepending on contact lens usedIllumination 12 V, 30 W brightness continuously adjustableSlit adjustment Slit length: variable in steps of 1 / 3 / 5 / 9 / 14 mmSlit width: continuously adjustable from 0 to 14 mmSlit image rotation: 0°, ±45°, 90°Magnification 5 x, 8 x, 12 x, 20 x, 32 xPhysician safety filter True-to-color, ClearViewMicromanipulator Servo-electricWeight11 kg (24.2 lbs)Tonometer, co-observation tube, video documentationequipment from the range of accessories for the slitlamps SL120 and SL130VISULINK 532 / ULaser treatment spot size continuously adjustable, 50–1,000 µm(without contact lens), parfocalCompatible slit lamps ZEISS SL 115 Classic, SL 120, SL 130, 20 SL, 30 SLHaag Streit 900 ® BM / 900® BQPhysician safety filter True-to-colorWeight 0.4 kg (0.9 lbs)Accessories Transport case for VISULINK 532 / U and VISULAS 532s11ZEISS VISULAS 532s – strong performance in the operating room With the coagulation laser VISULAS 532s and the surgical microscope OPMI LUMERA ® 700 ZEISS provides surgeons with a perfect duo which interact in harmony, guaranteeing successful surgical interventions in the posterior eye segment. The variable view, font size and color contrast of VISULAS 532s display are predestined for application in the operating room: all parameters are always clear and distinctly legible – even from a distance and in a darkened environment.The precise centration of the aiming and therapeutic beam, combined with the integrated slit illumination of the OPMI LUMERA 700, create an optimally illuminated treatment field and thus guarantees confident operation, whether in the periphery or in the vicinity of the macula. The fixed ClearView physician safety filter only minimally increases the height of the view for the operator. The active physician safety filter always provides effective protection when the laser is triggered. It gives the operator unfiltered vision when the laser is not in use.Laser endoprobe with protective capVISULAS 532s and OPMI LUMERA 700in the operating roomE N _31_010_0022I I P r i n t e d i n G e r m a n y . C Z -I /2017 I n t e r n a t i o n a l e d i t i o n : O n l y f o r s a l e i n s e l e c t e d c o u n t r i e s .T h e c o n t e n t s o f t h e b r o c h u r e m a y d i f f e r f r o m t h e p r o d u c t ’s c u r r e n t a p p r o v a l s t a t u s o f a p p r o v a l i n y o u r c o u n t r y . P l e a s e c o n t a c t o u r r e g i o n a l r e p r e s e n t a t i v e f o r m o r e i n f o r m a t i o n . S u b j e c t t o c h a n g e i n d e s i g n a n d s c o p e o f d e l i v e r y a n d a s a r e s u l t o f o n g o i n g t e c h n i c a l d e v e l o p m e n t . V I S U L A S i s a r e g i s t e r e d t r a d e m a r k o f C a r l Z e i s s M e d i t e c A G o r o t h e r c o m p a n i e s o f t h e Z E I S S G r o u p i n G e r m a n y a n d /o r o t h e r c o u n t r i e s . © C a r l Z e i s s M e d i t e c A G , 2017. A l l c o p y r i g h t s r e s e r v e d .Carl Zeiss Meditec AG Goeschwitzer Strasse 51–52 07745 Jena Germany/contacts/visulas532s0297。

一.synhts合成器（1）bells 铃声（2）filter过滤（3）lead 引领(4)sequencer 音序器（5）5th&7th 第五第七号（6）accordion手风琴（7）氛围（8）basic waves 基本波（9）brutal 残酷的（10）china&asia亚洲（11）chord和弦（12）dance舞蹈（13）detuned 失谐（14）digital 数字型（15）digital dx数码（16）dramatic 激昂剧变（17）dreaming 梦幻（18）effects效果器（19）electronica电子乐（20）cliding滑行，滑顺（21）harp竖琴(22)kraftwerk 电子乐队（23）melody麦乐迪优美旋律（24）metallic金属(25)mixed allround全能混合（26）organic 有机（27）phasing相位（28）power能量权利（29）ring modulation环调制（30)science fiction 科学幻想（31)synth pop流行合成器（32）techno高科技舞曲（34）techno和谐（35）vintage string synth老式串联电子合成器二.bess 贝司（1）analog模拟（2）digital数字（3）过滤（4）真实（5）5th&7th(6)attack 攻击（7）chorusf合唱副歌（8）舞蹈（9）detuned失谐（10）distortion失真（11）funk(12)fx （13)lead领导（14）low freq低频（15）modulation调制（16）moogy情绪喜怒无常（17）noisy嘈杂（18）organ电子琴（19）paddy帕蒂（20）pulse脉冲（21）ring modulation环调制（22）saw声表面波滤波器(23)short突然，短路，做空（24）soft slow 柔和缓慢（25）square 面积平房（26）sub 替身，子（27）sync同步录音（28）techno高科技舞曲（29）unisono 和谐（30)wintage strings synth老式串联电子合成器三.pads 铺底（1）analog模拟（2）brass铜管（3）digital电子（4)filter滤波器（5）modulation analog调制模拟（6）orchestral pizzicato管弦乐拨奏（7）wintage strings synth老式串联电子合成器（8）finger手指拨弄指法（9）5th$7th(10) attack攻击（11）bells铃声（12）bendy slide 柔韧和滑步弯曲（14）dance 舞蹈（15）detuned失谐（16）discordant 不和谐的（17）distortion失真（18）dream&chillout 梦幻与弛放音乐（19）electronica电子乐（20）fast 感光快速（21）fx electronica外汇电子（22）glass透镜玻璃态（23）guitar吉他（24）high高（25）lead melody 引领麦乐迪乐（26）low freqency 低频（27）morphing渐变变形（28）movie影视（29）movie horror恐怖电影（30）organic有机（31）piano钢琴（32）ring modulation 环调制（33）sample&hold采样和保持（34）soft 柔软（35）spacy宽大（36）sync同步（37）techno泰嘉乐，高科技舞曲四.voices呼声（1）atmosphere气氛（2）digital数字（4）filter滤波器（5）real真实（6）short突然短的做空（7)singing歌唱（8)synthetic合成（9）vintage string synth老式串联电子合成器（10）vocoders语言合成器五.piano 钢琴（1）70S（2）90s digital 90s数字（3）bells铃声（4）clavinet古钢琴(5)dance 舞蹈（6）e- piano fm电钢琴fm（7）e- piano fixed 固定电钢琴（8）grand piano 三角大钢琴（9）harpsichord大键琴（10）layer壳，图层（11）music box音乐盒子(12)rhodes 罗德（13）synth采样器（14)toys玩具（15）vintage string synth老式串联电子合成器（16）wurlitzer 沃利策风琴六.organs风琴（１）cheezy芝士（２）chords和弦（３）church礼拜堂（４）classic 经典（５）classic舞蹈（６）jazz爵士（７）rotation旋转（8）simple简单（9）synth合成器（10）vintage string synth老式串联电子合成器七.brass 铜管乐（1）section 切片部分（2）solo独奏（3）5th&7th(4)lead领导引领（5）string synth字符串的合成器八.guitar吉他（1）mix混合（２）acoustic声场（３）distortion失真（４）ｅ－guitar电吉他（５）synth合成器九.percussion打击乐（1）mixed简单（2）chimes风铃（3）kalimba卡巴拉琴非洲（4）marimba 木琴(5)metallic金属（6）steel drum 钢鼓（7）铁颤音琴（8）wood木制十．Effects 效果器（1）atmosphere气氛（2）computer cames 电脑游戏（3）dance 舞蹈（4）drums鼓（5）class课堂（6）horror恐怖（7）noise噪音（8）ring modulation环调制（9）sample&hold采样与保持（10）science科学&fiction小说还1不错的泰坦电子。

JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。

VTE视音频分析仪，VTS视频分析仪通过移动设备将媒体内容传输到高清设备，这一应用已经不再是一个未来的憧憬，而已成为现实。

这就是为什么越来越多的智能手机和平板电脑制造商正在转向新的移动高清视频接口―MHL。

罗德与施瓦茨公司现在推出了一个紧凑型一体化解决方案，集互操作性和应用测试于一身。

手机和平板电脑的制造商将受益于此解决方案：与传统的测试设备相比，新的方案更简单易用且有更高的性价比。

R&SVTE是模块化，可扩展的测试平台，应用于视频和音频设备的开发和质检环节；经济型的R&S VTS系统适用于生产线。

这两款产品均支持MHL接口测试模块。

MHL接口支持高清视频和音频内容的传输，典型的应用是智能手机或平板电脑通过LTE接收视频，然后通过MHL将高清图像和音频将传送到高清电视上。

R&S VTE和在R&S VTS是集所有系统功能于一身的解决方案，不但支持MHL协议测试，而且具有视音频分析功能。

可实时分析视频和音频参数，例如InfoFrames和HDCP。

可用于测试输入和输出，支持MHL系统协议的一致性测试。

R&S VTE具有视音频检查功能，可通过对不同图像的检测和客观分析，来判断移动设备解码后的视频信号的劣化。

R&S VTE的是一台全面的，3U高度，1/2 19"寸宽度的紧凑型仪器；经济型的R&S VTS 只有1U高度。

这两款产品均内置处理器，无需外接电脑控制。

设备支持远程控制，经济节能，R&S VTE独有极具艺术性的触摸屏操作方式。

罗德与施瓦茨公司提供自动测试软件，配合MHL测试选件，可以轻松实现自动化测试。

用户也可以自定义的测试流程，并输出测试报告。

模块化的设计，为用户提供了更高效的解决方案，灵活地满足测试要求并降低成本。

R&S VTE可支持3种不同测试测试模块，在MHL测试模块之外，罗德与施瓦茨公司还将提供HDMI，模拟视音频，射频等测试模块。

介绍全息技术英语作文Title: Exploring the World of Holographic Technology。

In today's digital era, holographic technology has emerged as a groundbreaking innovation that revolutionizes the way we perceive and interact with the world around us. From entertainment and education to healthcare and manufacturing, holographic technology holds immensepotential in various fields. This essay delves into the intricacies of holographic technology, its applications,and its impact on society.Holography, derived from the Greek words "holos" (whole) and "graphein" (to write), is the science and practice of creating three-dimensional images called holograms. Unlike traditional photographs, which capture only the intensityof light, holograms record both the intensity and phase of light waves, providing a more realistic and immersivevisual experience.One of the most remarkable aspects of holographic technology is its versatility in applications. In the realm of entertainment, holograms have transcended the boundaries of traditional performances, enabling artists to stage virtual concerts and resurrect deceased icons for awe-inspiring performances. These holographic concerts not only captivate audiences but also preserve the legacy of legendary performers for future generations.Moreover, holographic technology has revolutionized the way we perceive visual content in education and training. By creating lifelike simulations and virtual models, educators can enhance learning experiences and facilitate better understanding of complex subjects such as anatomy, physics, and architecture. Medical students, for instance, can explore detailed holographic representations of the human body, allowing them to study anatomy in unprecedented detail.In the field of healthcare, holographic technology holds immense promise for medical imaging and diagnostics. Holographic displays can provide physicians withinteractive 3D representations of patient data, enabling more accurate diagnoses and personalized treatment plans. Furthermore, surgeons can use holographic overlays during procedures to visualize internal structures in real-time, leading to improved surgical outcomes and patient safety.Beyond entertainment and healthcare, holographic technology is poised to revolutionize communication and collaboration. With the advent of holographic telepresence, individuals can interact with remote counterparts as if they were physically present, transcending geographical barriers and fostering seamless collaboration across borders. This technology has the potential to reshape the way we conduct business, hold meetings, and connect with others on a global scale.In the realm of design and manufacturing, holographic technology is driving innovation and efficiency. Designers and engineers can use holographic displays to visualize and manipulate 3D models with unparalleled precision, accelerating the product development process and reducing time-to-market. Additionally, holographic prototypingenables manufacturers to test product designs in virtual environments, minimizing costly errors and optimizing production workflows.Despite its myriad benefits, holographic technology also presents ethical and societal challenges that warrant careful consideration. As holograms become increasingly indistinguishable from reality, questions arise regarding the authenticity of digital content and the potential for misuse, such as the creation of deceptive or misleading visuals. Moreover, concerns about privacy and data security may arise as holographic telepresence becomes more prevalent, raising questions about the boundaries between public and private spaces.In conclusion, holographic technology represents a paradigm shift in how we perceive and interact with the world, offering unprecedented opportunities for innovation across various industries. From entertainment and education to healthcare and manufacturing, holographic technology is poised to reshape the way we live, work, and communicate in the digital age. However, as we embrace the potential ofholographic technology, it is essential to address ethical considerations and ensure that its benefits are harnessed responsibly for the betterment of society.。

英语作文-电子乐器制造行业技术创新助推发展The electronic musical instrument industry stands as a testament to the power of technological innovation. From the early days of analog synthesizers to the modern era of digital sound production, the evolution of these instruments has been driven by a relentless pursuit of new sounds and better performance capabilities.In the beginning, electronic instruments were often bulky, expensive, and limited in their capabilities. The Moog synthesizer, one of the first widely used electronic instruments, was a revolutionary product that allowed musicians to create sounds that had never been heard before. However, it was also large, complex, and required a deep understanding of its inner workings to produce the desired sounds.As technology advanced, so did the instruments. The introduction of microprocessors and digital technology in the 1980s brought about a significant change. Digital synthesizers, drum machines, and samplers became smaller, more affordable, and more powerful. Musicians could now access a vast array of sounds and manipulate them in ways that were previously impossible.The development of MIDI (Musical Instrument Digital Interface) was another leap forward. This standard allowed different electronic instruments and computers to communicate with each other, opening up new possibilities for composition and live performance. It enabled a single musician to control multiple instruments simultaneously, leading to the rise of one-person bands and complex, layered recordings.Today, the industry continues to innovate at a rapid pace. Software synthesizers and digital audio workstations have democratized music production, making it accessible to anyone with a computer. These tools offer an almost infinite palette of sounds and effects, along with the ability to edit and refine recordings with precision.The impact of these technological advancements is not limited to the instruments themselves. They have also transformed the way music is created, performed, and consumed. Electronic instruments have given rise to new genres and subcultures, from the synth-pop of the 1980s to the EDM (Electronic Dance Music) of today.Moreover, the integration of artificial intelligence and machine learning is paving the way for the next generation of electronic instruments. AI algorithms can now generate music, learn from a musician's style, and even collaborate in the creative process. This not only pushes the boundaries of what is musically possible but also challenges our very notions of creativity and authorship.In conclusion, the electronic musical instrument industry is a vibrant field characterized by constant change and innovation. Its history is a chronicle of technological breakthroughs that have expanded the horizons of music. As we look to the future, it is clear that the fusion of technology and music will continue to enrich our cultural landscape in ways we can only begin to imagine. The journey of electronic instruments is far from over; it is evolving every day, with each new development offering a glimpse into the future of music. 。

HeadAmp6 PROFESSIONAL SIX CHANNEL HEADPHONE AMPLIFIER OPERATION MANUALIMPORTANT SAFETY INSTRUCTIONS – READ FIRST This symbol, wherever it appears, This symbol, wherever it appears, alerts alerts you to the presence of uninsulated you to important operating and maintenance dangerous voltage inside the enclosure. Voltage instructions in the accompanying literature.that may be sufficient to constitute a risk of shock. Please read manual.Read Instructions:Retain these safety and operating instructions for future reference. Heed all warnings printed here and on the equipment. Follow the operating instructions printed in this user guide.Do Not Open:There are no user serviceable parts inside. Refer any service work to qualified technical personnel only.Power Sources:Only connect the unit to mains power of the type marked on the rear panel. The power source must provide a good ground connection.Power Cord:Use the power cord with sealed mains plug appropriate for your local mains supply as provided with the equipment. If the provided plug does not fit into your outlet consult your service agent. Route the power cord so that it is not likely to be walked on, stretched or pinched by items placed upon or against.Grounding:Do not defeat the grounding and polarization means of the power cord plug. Do not remove or tamper with the ground connection on the power cord.Ventilation:Do not obstruct the ventilation slots or position the unit where the air required for ventilation is impeded. If the unit is to be operated in a rack, case or other furniture, ensure that it is constructed to allow adequate ventilation.Moisture:To reduce the risk of fire or electrical shock do not expose the unit to rain, moisture or use in damp or wet conditions. Do not place a container of liquid on it, which may spill into any openings.Heat:Do not locate the unit in a place close to excessive heat or direct sunlight, as this could be a fire hazard. Locate the unit away from any equipment, which produces heat such as: power supplies, power amplifiers and heaters. Environment:Protect from excessive dirt, dust, heat, and vibration when operating and storing. Avoid tobacco ash, drink spillage and smoke, especially that associated with smoke machines.Handling:To prevent damage to the controls and cosmetics avoid rough handling and excessive vibration. Protect the controls from damage during transit. Use adequate padding if you need to ship the unit. To avoid injury to yourself or damage to the equipment take care when lifting, moving or carrying the unit.Servicing:Switch off the equipment and unplug the power cord immediately if it is exposed to moisture, spilled liquid, objects fallen into opening, or the power cord or plug becomes damaged during a lightning storm or if smoke odor or noise is noted. Refer servicing to qualified technical personnel only.Installation:Install the unit in accordance with the instructions printed in the user guide.The ART HeadAmp6Professional Six Channel Headphone AmplifierIMPORTANT SAFETY INSTRUCTIONS – READ FIRST (1)INTRODUCTION (4)INSTALLATION (4)AC Power Hookup (4)Analog Audio Connections (4)CONTROLS and JACKS (5)Front Panel (5)Direct In Jack (5)Master Volume Control (5)Mute L, Mute R, and Mono Switches (5)Stereo Aux In Jack (5)Out Jack (5)Balance Control (6)Level Control (6)Power Switch (6)Rear Panel (6)Balanced Main Inputs (6)Balanced Main Thru (6)Stereo Headphone Outputs (7)OPERATION (8)APPLICATIONS (9)WARRANTY INFORMATION (11)SERVICE (11)HEADAMP6 SPECIFICATIONS (12)List of FiguresFIGURE 1 - Master Volume, Direct In, and Channel One (5)FIGURE 2 - Rear Panel Inputs (6)FIGURE 3 - Rear Panel Headphone Outputs (7)FIGURE 4 - Headphone Distribution Application (9)FIGURE 5 - Block Diagram (10)INTRODUCTIONThe HeadAmp6 is a full-featured six -channel stereo headphone amplifier that includes six auxiliary inputs to allow separate mixes on each headphone channel. Each output channel also features a dual function Balance control which will pan between Left & Right sides of the main signal bus, or vary the Mix between the main signal bus and the Auxiliary input for that respective channel.Each output channel includes one front and two rear panel stereo 1/4-inch TRS headphone jacks for ease of installation and quick patching capability. Mono, Mute L, and Mute R buttons on each channel select between four operating modes; 1) Stereo, 2) Mono Left, 3) Mono Right, 4) Mono Both (Left & Right) for versatile monitoring solutions. Independent output level controls on each channel personalize monitoring levels.Input options include XLR and 1/4-inch TRS balanced inputs with matching “Thru” jacks for bridging multiple units. An additional front panel stereo 1/4-inch TRS Direct In jack for quick patch override of the rear panel inputs is included for quick insertion of any stereo source. Master Volume control sets the main signal bus level. Eight-segment precision LED level metering on the main bus and four-segment indicators on each output channel provide visual feedback of the signal level at all key points.INSTALLATIONThe HeadAmp6 may be used in a wide variety of applications and environments. Its rack-mountable steel and aluminum enclosure is both attractive and designed for continuous professional use. Mounting location is not critical. However, for better performance and greater reliability we recommend that you not place the unit on top of power amps or other sources of extreme heat, or strong magnetic fields.AC Power HookupThe HeadAmp6 has an internal power supply. Only connect the unit to mains power of the type marked on the rear panel. The power source must provide a good ground connection, and the ground pin on the mains plug should never be defeated.Analog Audio ConnectionsAudio connections to and from the HeadAmp6 are:Rear Balanced Inputs and Outputs: [XLR] Pin 2 = Pos(+), Pin 3 = Neg(-), Pin 1 = Ground[1/4-inch] Tip = Pos(+), Ring = Neg(-), Sleeve = Ground Front Stereo Aux 1/4-inch Inputs: Tip = Left, Ring = Right, Sleeve = GroundFront Direct 1/4-inch Input: Tip = Left, Ring = Right, Sleeve = GroundFront and Rear Stereo Headphone 1/4-inch Outputs: Tip = Left, Ring = Right, Sleeve = Ground •Six Independent High-Power Headphone Amplifier Channels•Dual Function Balance/Mix Control per Channel•Front Panel Stereo Aux Input for each Channel•Multiple Monitoring Settings per Channel•Individual Output Level Control per Channel•Precision Four Segment LED Metering Per Channel•Master Volume Control w/ Eight Segment LED Metering•Front Panel Direct In Jack•One Front and Two Rear Mounted Headphone Jacks per Channel•Connects and Drives up to 18 Headphones Simultaneously•XLR and 1/4” Main Inputs and Outputs•Parallel Main Outputs for Multiple Unit UseCONTROLS and JACKSFront PanelFIGURE 1 - Master Volume, Direct In, and Channel OneDirect In JackThe 1/4-inch TRS (Tip, Ring, Sleeve) jack on the front panel provides a stereo unbalanced input which, when used, will override the rear panel balanced inputs. This input is useful for when you want to temporarily insert a different main input signal from what is connected to the rear inputs, or simply make an unbalanced TRS style connection to another headphone output source.Master Volume ControlThis control adjusts the level of the main signal bus. The eight-segment LED level meter located just to the left of the MASTER VOLUME control displays the audio level on the main signal bus.Mute L, Mute R, and Mono SwitchesThese switches set the stereo headphone outputs to one of three operating modes. (This affects only the headphone outputs and occurs post (after) the balance/mix, and level control sections.)1) All Switches Out = Stereo2) Mute L In & Mute R Out & Mono In = Right Channel Only in Mono3) Mute R In & Mute L Out & Mono In = Left Channel Only in MonoStereo Aux In JackThese stereo TRS jacks provide a means of inserting a direct stereo signal into an individual headphone channel. When a plug is inserted into an AUX INPUT jack the BALANCE control for that particular channel changes function to become a mix control adjusting the mix between the signal coming into that channels stereo AUX IN and the main signal bus.Out JackThis stereo TRS 1/4-inch jack provides a connection for each of six output channels to stereo headphones or to additional headphone distribution amplifiers. Two identical output jacks are provided on the rear panel for each channel as well.Balance ControlThis control provides one of two functions depending on whether there is a plug inserted into the stereo AUX IN for a particular channel.With no plug inserted into the AUX IN jack, the control will vary the Left / Right balance of the main signal bus feed to the channel.With a plug inserted, the control changes function to vary the mix between the stereo signals coming from the main signal bus and the stereo signals coming from the AUX IN for that respective channel. By feeding a return signal for only the vocal microphone of a particular musician into the AUX IN you can use the BALANCE control as a ‘More Me” control by varying the mix between the microphone signal alone, and the main signal bus audio. This effect is heard only in the individual headphones of the specific channel.Level ControlThis control varies the audio output level feeding the front and rear panel 1/4-inch stereo output jacks for each respective channel. The four-segment LED level meter, located above the switches on each channel, displays the audio level for each channel output.Power SwitchThis rocker switch turns the AC power On and Off. A small LED indicator in the rocker button illuminates to indicate that the power is on.Rear PanelFIGURE 2 - Rear Panel InputsBalanced Main InputsThese XLR and 1/4-inch TRS jacks are active balanced and are used for line level signals. The gain sensitivity is identical for both the XLR and 1/4-inch TRS jacks. Signals applied to these jacks feed the main signal buss. (NOTE: the front panel DIRECT IN jack overrides these inputs when it is used.)Balanced Main ThruThese XLR and 1/4-inch TRS jacks are hardwired in parallel with the corresponding BALANCED MAIN INPUT jacks. The BALANCED MAIN THRU jacks are useful for daisy chaining multiple HeadAmp6 units together.FIGURE 3 - Rear Panel Headphone OutputsStereo Headphone OutputsThese stereo TRS jacks are the main outputs for each channel of the headphone amplifier. They are wired in parallel with the corresponding output jacks on the front panel. Either front panel, rear panel, or both front and rear panel outputs can be used simultaneously to drive headphones or they can be used as feeds to additional headphone amplifiers in a distributed audio network.NOTE: The HeadAmp6 is optimized to drive typical headphone load impedances of 32 to 600 Ohms. It is not recommended to drive total impedances lower than 16 Ohms however it can be done without damage and will result in limited maximum output power, and possible clipping distortion depending on the output level and load. When driving multiple headphones from an individual output channel of the HeadAmp6 (paralleling), the available output power is split among the various headphones, and due to the combined load impedances the output may also become limited by premature clipping of the output signal. Most modern headphones are medium to high impedance and require only milliwatts to achieve full acoustic output so this should rarely be a problem. If it is a problem simply lower the level or lower the total count of headphones on a particular channel in order to increase the total load impedance as seen by the channel output.There is no direct relationship between headphone load impedance and SPL output. The relevant specification that determines acoustic output is the sensitivity spec of the headphone, i.e. how much SPL it will put out for a given level of input signal, usually rated at 1 mW. Sensitivity is determined by the overall design and construction of the transducer. Typically the power required is about 1/1000th of the equivalent amplifier power required to drive a speaker. Therefore typical headphone amplifiers provide power levels in the 10mW to 20 mW ranges in order to achieve a very reasonable SPL output. Even an 8 Ohm headphone (if you can find one since they are rare) can be driven to full SPL output by the HeadAmp6 if it has a high enough sensitivity, regardless of the fact that the output voltage swing will be limited due to the overload protection circuitry.OPERATIONStart with the MASTER VOLUME and LEVEL controls on all channels set fully counter-clockwise. Set the BALANCE controls to their 12 o’clock positions. Set all MUTE and MONO switches to their “OUT” position. Using the appropriate balanced or unbalanced cables, (unbalanced cables will work in the rear panel inputs as well, but with the remote possibility of increased noise), connect the rear panel BALANCED MAIN Inputs to the audio monitor signal source to be distributed to the headphones. Alternatively connect the audio signal source to the front panel DIRECT IN jack using a stereo TRS 1/4-inch plug.If connecting more than one HeadAmp6 to the same audio monitor signal source, simply daisy-chain the units by connecting from the BALANCED MAIN THRU connectors of the first unit to the BALANCED MAIN INPUT connectors of the next unit, etc. (NOTE: Daisy chaining only works with the rear panel connectors. The front panel DIRECT IN jack only feeds its respective HeadAmp6 unit directly.)Connect headphones, or leads to additional headphone amps, (like the ART HeadAmp 4) to either the front or rear panel HEADPHONE OUTPUT jacks (or both) using stereo 1/4-inch TRS plugs.If using the HeadAmp6 Auxiliary Mixer function, connect the stereo signals that are to be mixed into individual output channels to the appropriate AUX IN jacks using a stereo 1/4-inch TRS plug. (NOTE: For a mono signal use a TRS plug with the Tip and Ring tied together, or use one of the front panel MONO buttons to create a mono output to the headphones.) The AUX IN signal will only be heard in that specific channel depending on the position of the BALANCE and LEVEL controls for that particular channel.Turn on the POWER switch and with the audio monitor signal active and playing increase the MASTER VOLUME control to achieve a reading on the MASTER LED bar-graph level indicator which is high enough to light the green and yellow LEDs yet avoid lighting the RED CLIP LED on loud passages and audio peaks. Doing this will assure that a strong signal is available to drive each of the six individual channel amplifiers, and subsequently each channel amplifier will be able to run with less gain (a lower setting of the individual channel LEVEL controls), thereby optimizing the signal-to-noise ratio at the headphone outputs.Next set the LEVEL control on each channel to a comfortable listening level for the particular headphones being used on that channel.NOTE: When using the Auxiliary Mixer to add a signal such as a direct vocal into an individual headphone channel, in order to enhance that particular vocal in the mix (providing “More Me”) for the person listening to that headphone channel, the relative phase of the signal coming into the stereo AUX IN will determine whether the stereo AUX IN signal sums or subtracts from the main signal bus. The “More Me” effect will only result if the two signals add together in phase. If they are antiphase (180 degrees out of phase), the stereo AUX IN signal will actually subtract the vocal out of the mix in the headphones for that one channel. Most consoles and microphone preamps will have a phase invert switch with which to set the desired operating mode if this is an issue.APPLICATIONSFIGURE 4 - Headphone Distribution ApplicationFIGURE 5 – Block DiagramWARRANTY INFORMATIONLimited Warranty:Applied Research and Technology will provide warranty and service for this unit in accordance with the following warrants:Applied Research and Technology, (A R T) warrants to the original purchaser that this product and the components thereof will be free from defects in workmanship and materials for a period of three years from the date of purchase. Applied Research and Technology will, without charge, repair or replace, at its option, defective product or component parts upon prepaid delivery to the factory service department or authorized service center, accompanied by proof of purchase date in the form of a valid sales receipt.Exclusions:This warranty does not apply in the event of misuse or abuse of the product or as a result of unauthorized alterations or repairs. This warranty is void if the serial number is altered, defaced, or removed.A R T reserves the right to make changes in design or make additions to or improvements upon this product without any obligation to install the same on products previously manufactured.A R T shall not be liable for any consequential damages, including without limitation damages resulting from loss of use. Some states do not allow limitations of incidental or consequential damages, so the above limitation or exclusion may not apply to you. This warranty gives you specific rights and you may have other rights, which vary, from state to state.For units purchased outside the United States, an authorized distributor of Applied Research and Technology will provide service.SERVICEThe following information is provided in the unlikely event that your unit requires service.1) Be sure that the unit is the cause of the problem. Check to make sure the unit has power, all cables are connected correctly, and the cables themselves are in working condition. You may want to consult with your dealer for assistance in troubleshooting or testing your particular configuration.2) If you believe the ART unit is at fault, go to . You may contact Customer Service for more assistance, or directly request a Return Authorization for service in the “resources” area of the website.3) If you are returning the unit for service, pack the unit in its original carton or a reasonable substitute. The original packaging may not be suitable as a shipping carton, so consider putting the packaged unit in another box for shipping. Print the RA number clearly on the outside of the shipping box.4) Include, with your unit, a note with the RA number and your contact information including a daytime phone number, preferably attached to the top of the unit.Fill in the following information for your reference:Date of purchase ___________________Purchased from ___________________Serial number ___________________HEADAMP6 SPECIFICATIONSInput Connections: XLR-F balanced (2),¼-inch balanced (9)Output Connections: XLR-M balanced (2),¼-inch balanced (2),¼-inch stereo headphone (18)Input Impedance: 40K Ohms Main,10K Ohms Direct,15K Ohms Aux InOutput Impedance: <12 Ohms HeadphonesMaximum Input Level: +21dBu (all inputs)Maximum Output Level: 150mW (600 Ohm Headphones)500mW (32 Ohm Headphones)150mW (8 Ohm Headphones)Maximum Gain: 22dBSignal to Noise Ratio: >90dB typicalTHD: <.01% typicalDynamic Range: >101dB typicalCMRR: >40dBPhase Shift: <10 degrees, 20Hz - 20kHzPower Requirements: 120VAC / 50-60Hz, or 230VAC / 50 Hz, 15 WattsDimensions: (HxWxD inch) 1.75 x 19 x 6Dimensions: (HxWxD mm) 44.5 x 483 x 152Weight: 5.3 lbs. (2.4kg)Ref: 0 dBu = 0.775VAC RMSART maintains a policy of constant product improvement. ART reserves the right to make changes in design or make additions to or improvements upon this product without any obligation to install the same on products previously manufactured. Therefore, specifications are subject to change without notice.E-mail: ***********************© 2010 Applied Research & Technology HA6-5004-101。