CSAE20114-0151-11489

NOTES: VALID UNLESS OTHERWISE SPECIFIED 1. GENERAL:a. APPLICATION SPECIFICATION SEE: AS-34062-000 -CONTAINS: PRODUCT INTRODUCTION, PRODUCT SUMMARY, CONNECTOR ASSEMBLY, PACKAGING INFORMATION, CONNECTOR MATING, SERVICE INSTRUCTIONS, ELECTRICAL CONTINUITY CHECKING, CRIMPING, AND TROUBLESHOOTING. -DESIGNED TO MATE WITH DEVICE CONNECTION AS SPECIFIED IN DRAWING EWCAP 150-S-002-1-Z01. AVAILIBLE AT /. -DESIGNED TO MATE WITH BLADE SEALED ASSEMBLY AS SPECIFIED IN DRAWING: SD-34675-001 -ASSEMBLY SHIPPED WITH TPA IN PRE-LOCK (SEE TPA PRE-LOCK VIEW IN SHEET 4)b. PRODUCT SPECIFICATION SEE: PS-34062-000 CONTAINS: SCOPE, PRODUCT DESCRIPTION, INTEGRAL COMPONENTS AND ACCESSORIES, APPLICABLE DOCUMENTS AND SPECIFICATIONS, RATINGS, PERFORMANCE, PACKAGING, GAUGE AND FIXTURES, AND OTHER INFORMATION. c. PACKAGING SPECIFICATION PER MOLEX DRAWING: PK-30907-879 d. PARTS MUST BE IN COMPLIANCE TO MOLEX CHEMICAL SUBSTANCES FOR PRODUCTS AND PACKAGING SPECIFICATION: QEHS-699000-301e. DATA MUST BE SUBMITTED UNDER THE MOLEX PART NUMBER TO IMDS (COMPANY ID#13255) 2. DESIGN - MATERIALS:a. SEE BOM TABLE IN SD-34062-004 3. DESIGN - GEOMETRY:a. THIS IS A 100% CAD GENERATED PART. THE CAD MATHEMATICAL DATA IS THE MASTER FOR THIS PART. FOR DIMENSIONAL OR ANY INFORMATION NOT SHOWN ON THIS DRAWING, ANALYZE THE CAD MODEL.b. GEOMETRIC DIMENSIONS AND TOLERANCES PER ASME Y14.5M - 1994c. EDGES AND UNDIMENSIONED DETAILS PER ISO13715d. CORNERS SHOWN AS SHARP TO BE R 0.2 MAX.e. LETTERING SHALL BE 0.15 MAX RAISED IN 0.25 MAX RECESS PAD.THIS INCLUDES RECYCLING CODE, CAVITY ID, VENDOR IDENTIFICATION,AND CUSTOMER MATERIAL NUMBER.f. VISUAL DEFECTS SHALL MEET COSMETIC STANDARD PS-45499-002 (Class B)g. LASER MARKING: TBD TABLE OF CONTENTS SHEET NO.SHEET DESCRIPTION1NOTES 2, 3CONFIGURATIONS 4RECEPTACLE CONNECTOR ASSEMBLY 5MOLEX INTERFACEJ19NX RE-MASTERING J18ADDED DIM ICD 64REV.DESCRIPTION INSPECTION BALLOON NUMBER LOG GENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL ± 3.0°4 PLACES±3 PLACES±THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM 4:1DRWN BY DATE KCUNNINGHAM 2011/11/08CHK'D BY DATE MX150 2 WAY CABLE SEAL RECEPTACLE CONN. SYSTEM (5.0MM PITCH)2017/05/152017/06/14QUALITY SYMBOLS =0=0=0CPA OPTIONAL SEE BOM CONNECTOR HOUSING FOR OPTIONS SEE BOM RING SEAL FOR OPTIONS SEE BOM TPA B B C CD DE EF FG GHH JJ K K L LSHEET DESCRIPTIONCONFIGURATIONS OPTION B OPTION COPTION EOPTION F2.255.504X 1.50R 3.0±1.0R OPTION A OPTION DGENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL ± 3.0°4 PLACES ±3 PLACES±THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM 2:1DRWN BY DATE KCUNNINGHAM 2011/11/08CHK'D BY DATE MX150 2 WAY CABLE SEAL RECEPTACLE CONN. SYSTEM (5.0MM PITCH)2017/05/152017/06/14QUALITY SYMBOLS =0=0=05.504X 1.50R NON CLIP-SLOT OPTIONSCALE 4:1MINIMUM PASS-THRU WITH NO CLEARANCE APPLIES TO NON-CLIP SLOT OPTIONS A, C, D & G23.40⌀MINIMUM PASS-THRU WITH NO CLEARANCE APPLIES TO NON-CLIP SLOT OPTIONS B, E & F26.00⌀6.50REAR VIEWREAR VIEWB BC CD DE EF FG GHH J JK KL LGENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL ± 3.0°4 PLACES ±3 PLACES±THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM 2:1DRWN BY DATE KCUNNINGHAM 2011/11/08CHK'D BY DATE MX150 2 WAY CABLE SEAL RECEPTACLE CONN. SYSTEM (5.0MM PITCH)2017/05/152017/06/14QUALITY SYMBOLS =0=0=0SHEET DESCRIPTIONCONFIGURATIONS MINIMUM PASS-THRU WITH NO CLEARANCE APPLIES TO CLIP-SLOT OPTIONS A, C & D25.50⌀MINIMUM PASS-THRU WITH NO CLEARANCE APPLIES TO CLIP-SLOT OPTION B 26.00⌀OPTION B W/CLIP-SLOT *OPTION C W/CLIP-SLOT ** WITH CLIP-SLOT CONFIGURATIONSDO NOT MEET USCAR PACKAGING FRAME REQUIREMENTSCLIP-SLOT OPTION SCALE 4:1OPTION A W/CLIP-SLOT *6.50 2.255.503.0±1.0R 4X 1.50R 5.504X 1.50R OPTION D W/CLIP-SLOT *B B C CD DE EF FG GH HJ JK KL LGENERAL TOLERANCES (UNLESS SPECIFIED)ANGULAR TOL ± 3.0°4 PLACES ±3 PLACES ±THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE MM 4:1DRWN BY DATE KCUNNINGHAM 2011/11/08CHK'D BY DATE MX150 2 WAY CABLE SEAL RECEPTACLE CONN. SYSTEM (5.0MM PITCH)2017/05/152017/06/14QUALITY SYMBOLS =0=0=0SHEET DESCRIPTIONRECEPTACLE CONNECTOR ASSEMBLY OPTIONAL LASER MARKING SURFACESEE NOTE 3g 3.3532.230.85±0.20HOUSING MOLD CAVITY CODE RECYCLE CODE TERMINAL CAVITY ID.MANUFACTURINGLOCATION CODETERMINAL CAVITY IDCHARTED DIMENSIONS CONFIGURATIONS DIMENSIONS A B OPTIONS A, C, D16.622.0OPTION B16.623.9OPTION E20.223.9OPTION F16.623.9OPTION G18.422.0OPTIONS A, C, D W/CLIP-SLOT19.222.0OPTION B W/CLIP-SLOT19.223.9OPTIONAL LASER MARKING SURFACESEE NOTE 3gSECTION B -B B B TPA SHOWN IN5.00 2.50DIM A MAX.DIM B MAX.AA31.30B B C CD DE EF FG GH HJJ K KL LMX150 2 WAY CABLE SEAL RECEPTACLE CONNECTION SYSTEM (5.0mm PITCH)BOM AND PIN OUT SHEET ABBREVIATION COLOR MATERIAL A-BLK BLACK PA6 GF30B-LG LIGHT GRAY PA6 GF30B-BLK BLACK PA6 GF30C-BLKBLACK PA6 GF30D-BLKBLACK PA6 GF30D-LGLIGHT GRAY PA6 GF30E-BLKBLACK PA6 GF30F-LGLIGHT GRAY PA6 GF30G-BLKBLACK PA6 GF30A-BLK-CLIPBLACK PA6 GF30B-LG-CLIPLIGHT GRAY PA6 GF30B-BLK-CLIPBLACK PA6 GF30C-BLK-CLIPBLACK PA6 GF30D-BLK-CLIPBLACK PA6 GF30D-LG-CLIPLIGHT GRAY PA6 GF30A-BLK-SVBLACK PA6 GF30C-BLK-SVBLACK PA6 GF30D-BLK-SVBLACK PA6 GF30R3MEDIUM BLUE INHERENTLY LUBRICATED SILICONE R4GREEN INHERENTLY LUBRICATED SILICONE CPARED PBT GF30TPA NATURAL PBT GF30FOR ADDITIONAL INFORMATION SEE SD-34062-002HOUSING OPTION/COLOR TPA CPA RING SEAL OPTION A, BLACK, W/O CPA34062-0021A-BLK TPA R3-40°C TO 125°C 12SALEABLE OPTION B, LIGHT GRAY, W/O CPA34062-0022B-LG TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, W/O CPA34062-0023C-BLK TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, W/O CPA34062-0024D-BLK TPA R3-40°C TO 125°C 12SALEABLE OPTION D, LIGHT GRAY, W/O CPA34062-0029D-LG TPA R3-40°C TO 125°C 12SALEABLE OPTION A, BLACK, W/ CPA34062-0025A-BLK TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION B, LIGHT GRAY, W/ CPA34062-0026B-LG TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, W/ CPA34062-0027C-BLK TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, W/ CPA34062-0028D-BLK TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION D, LIGHT GRAY, W/ CPA34062-0030D-LG TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION A, BLACK, WITH CLIPSLOT, W/O CPA34062-0031A-BLK-CLIP TPA R3-40°C TO 125°C 12SALEABLE OPTION B, LIGHT GRAY, WITH CLIPSLOT, W/O CPA34062-0032B-LG-CLIP TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, WITH CLIPSLOT, W/O CPA34062-0033C-BLK-CLIP TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, WITH CLIPSLOT, W/O CPA34062-0034D-BLK-CLIP TPA R3-40°C TO 125°C 12SALEABLE OPTION D, LIGHT GRAY, WITH CLIPSLOT, W/O CPA34062-0035D-LG-CLIP TPA R3-40°C TO 125°C 12SALEABLE OPTION A, BLACK, WITH CLIPSLOT, W/ CPA34062-0036A-BLK-CLIP TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION B, LIGHT GRAY, WITH CLIPSLOT, W/ CPA34062-0037B-LG-CLIP TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, WITH CLIPSLOT, W/ CPA34062-0038C-BLK-CLIP TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, WITH CLIPSLOT, W/ CPA34062-0039D-BLK-CLIP TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION D, LIGHT GRAY, WITH CLIPSLOT, W/ CPA34062-0040D-LG-CLIP TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION A, BLACK, SEVERE VIBRATION, W/ CPA34062-4006A-BLK-SV TPA CPA R4-40°C TO 155°C 12SALEABLE OPTION C, BLACK, SEVERE VIBRATION, W/ CPA34062-4008C-BLK-SV TPA CPA R4-40°C TO 155°C 12SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, SEVERE VIBRATION, W/ CPA34062-4009D-BLK-SV TPA CPA R4-40°C TO 155°C 12SALEABLE OPTION E, BLACK, W/O CPA34062-0041E-BLK TPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION F, LIGHT GRAY, W/O CPA34062-0042F-LG TPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION G, BLACK, W/O CPA34062-0043G-BLK TPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION E, BLACK, W/ CPA34062-0044E-BLK TPA CPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION F, LIGHT GRAY, W/ CPA34062-0045F-LG TPA CPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION G, BLACK, W/ CPA34062-0046G-BLK TPA CPA R4-40°C TO 155°C 2SALEABLE PREFERRED, FULLY SHROUDED OPTION A, BLACK, W/ CPA34062-0047A-BLK TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION B, LIGHT GRAY, W/O CPA34062-0048B-LG TPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, W/O CPA34062-0049C-BLK TPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, LIGHT GRAY, W/ CPA34062-0050B-LG TPA CPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, W/ CPA34062-0051C-BLK TPA CPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, LIGHT GRAY, WITH CLIPSLOT, W/O CPA34062-0052B-LG-CLIP TPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, WITH CLIPSLOT, W/O CPA34062-0053C-BLK-CLIP TPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, LIGHT GRAY, WITH CLIPSLOT, W/ CPA34062-0054B-LG-CLIP TPA CPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, WITH CLIPSLOT, W/ CPA34062-0055C-BLK-CLIP TPA CPA R4-40°C TO 155°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION C, BLACK, SEVERE VIBRATION, W/O CPA34062-4003C-BLK-SV TPA R4-40°C TO 155°C 12SALEABLE PREFERRED, FULLY SHROUDED OPTION D, BLACK, SEVERE VIBRATION, W/O CPA34062-4004D-BLK-SV TPA R4-40°C TO 155°C 12SALEABLE OPTION D, BLACK, WITH CLIPSLOT, W/ CPA34062-0056D-BLK-CLIP TPA CPA R4-40°C TO 155°C 12SALEABLE OPTION A, BLACK, WITH CLIPSLOT, W/ CPA34062-0057A-BLK-CLIP TPA CPA R3-40°C TO 125°C 12SALEABLE OPTION B, BLACK, W/O CPA34062-0058B-BLK TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, BLACK, W/ CPA34062-0059B-BLK TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, BLACK, WITH CLIPSLOT, W/O CPA34062-0060B-BLK-CLIP TPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDED OPTION B, BLACK, WITH CLIPSLOT, W/ CPA 34062-0061B-BLK-CLIP TPA CPA R3-40°C TO 125°C 123SALEABLE PREFERRED, FULLY SHROUDEDCOMMENTS INSERT, TPA 13HOUSING OPTION C - SEVERE VIBRATION HOUSING OPTION D - SEVERE VIBRATION RING SEAL TEMP. CLASS 3RING SEAL TEMP. CLASS 4CPA 2RECOMMENDED MATING DEVICEPRODUCTION TOOL STATUS ASSEMBLY DESCRIPTION ASSEMBLY PART NUMBERCOMPONENTTHE PRESENCE OF AN ABBREVIATION INDICATES THE PRESENCE OF THAT COMPONENT.ASSEMBLY OPERATING TEMPERATURE HOUSING OPTION D WITH CLIPSLOT E-34675-001MOLEX INLINE MALE CONNECTOR 3HOUSING OPTION C WITH CLIPSLOT HOUSING OPTION F HOUSING OPTION G HOUSING OPTION A WITH CLIPSLOT HOUSING OPTION B WITH CLIPSLOT cart 150-S-002-1-Z01HOUSING OPTION B 2MOLEX INTERFACE SD-34062-002SHEET 5HOUSING OPTION D HOUSING OPTION E HOUSING OPTION A - SEVERE VIBRATION HOUSING OPTION B WITH CLIPSLOT BOM/ APPLICABLE COMPONENTS TABLE HOUSING OPTION D WITH CLIPSLOT RECOMMENDED MATING DEVICE TABLEDESCRIPTION HOUSING OPTION A HOUSING OPTION B ABBREVIATION DESCRIPTION DRAWINGINFORMATION ADDITIONAL INFORMATIONUSCAR INTERFACE 1HOUSING OPTION C HOUSING OPTION D ECN NO.: 614442DATE:2019/3/26DOCUMENT NO.: SD-34062-004REVISION: A3PAGE: 1 OF 1。

AEC – Q005 - REV-PB-FREE TEST REQUIREMENTSAcknowledgmentAny document involving a complex technology brings together experience and skills from many sources. The Automotive Electronics Council would especially like to recognize the following significant contributors to the development and initial release of this document:Sustaining Members:Earl Fischer Autoliv Gary Fisher Johnson ControlsMark A. Kelly Delphi Corporation Thomas VanDamme TRW AutomotiveBob Hulka, Jr. Delphi Corporation Larry Dudley TRW AutomotiveRick Forster Continental Corporation Robert V. Knoell Visteon Corporation Hadi Mehrooz Continental Corporation Ken Kirby, Jr. Visteon Corporation Jim Peace Continental Corporation Ron Haberl Visteon Corporation Technical Members:Tim Haifley Altera James Williams Texas InstrumentsJames Molyneaux Analog Devices Diana Siddall Texas InstrumentsMike Gibson Analog Devices Guillemette Paour Tyco ElectronicsHeinz Reiter Austriamicrosystems Robert Cid Tyco ElectronicsHerwig Klimesch Austriamicrosystems Ted Krueger VishayMike Klucher Cirrus Logic Arthur Chiang VishayXin Miao Zhao Cirrus Logic Anca Voicu XilinxRene Rodgers Cypress Semiconductor Daniel Joo XilinxFred Whitwer Cypress SemiconductorGeorge Platko Fairchild SemiconductorJoe Fazio Fairchild Semiconductor Associate Members:Nick Lycoudes Freescale Andrew Yap Grace Semiconductor Kenton Van Klompenberg Gentex Arthur Cheng Grace Semiconductor Werner Kanert Infineon Technologies Kuotung Cheng TSMCAlexander Mueller Infineon Technologies Ken Wu TSMCJohn Bertaux International RectifierLyn Zastrow ISSIBanjie Bautista ISSI Guest Members:Peter Blais Kemet David Locker AMRDECHolger Zillgen Kemet Jeff Jarvis AMRDECTom Lawler Lattice SemiconductorSohail Malik Lattice SemiconductorJoe Wurts Maxim Other Contributors:Tom Tobin Maxim Maurice Brodeur Analog DevicesMike Buzinski Microchip Brian Jendro Continental Corporation Nick Martinez Microchip John Timms Continental Corporation Annette Nettles NEC Electronics Jeff Price Delphi CorporationTony Walsh NEC Electronics Marc Dittes InfineonMichael Wieberneit NEC Electronics Harry Sax InfineonZhongning Liang NXP Semiconductors Mary Carter-Barrios KemetDi Bayes NXP Semiconductors Masamichi Murase NEC ElectronicsMark Gabrielle ON Semiconductor Pascal Oberndorff NXP Semiconductors Daniel Vanderstraeten ON Semiconductor Bruce Townsend SpansionKen Berry Renesas Technology Michael Hundt STMicroelectronicsFrancis Classe Spansion Harry Siegel STMicroelectronicsAdam Fogle Spansion Doug Romm Texas InstrumentsBrian Mielewski STMicroelectronics John Kampell Texas InstrumentsSteve Maloy TDK Patrick Neyman Tyco ElectronicsRichard Tse TDK Huixian Wu VishayBill Hopfe Visteon CorporationNOTICEAEC documents contain material that has been prepared, reviewed, and approved through the AEC Technical Committee.AEC documents are designed to serve the automotive electronics industry through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than AEC members, whether the standard is to be used either domestically or internationally.AEC documents are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action AEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the AEC documents. The information included in AEC documents represents a sound approach to product specification and application, principally from the automotive electronics system manufacturer viewpoint. N o claims to be in conformance with this document shall be made unless all requirements stated in the document are met.Inquiries, comments, and suggestions relative to the content of this AEC document should be addressed to the AEC Technical Committee on the link .Published by the Automotive Electronics Council.This document may be downloaded free of charge, however AEC retains the copyright on this material. By downloading this file, the individual agrees not to charge for or resell the resulting material.Printed in the U.S.A.All rights reservedCopyright © 2009 by the Automotive Electronics Council. This document may be freely reprinted with this copyright notice. This document cannot be changed without approval from the AEC Component Technical Committee.PB-FREE TEST REQUIREMENTS1. SCOPEThis document contains a set of tests and defines the minimum requirements for qualification of lead free (Pb-free) metallurgy for components to be used in any automotive electronics application. For a component to be considered Pb-free compatible, its properties, including but not limited to plating materials and package configuration, must be compatible with Pb-free manufacturing processes. Use of this document does not relieve the supplier of their responsibility to meet their own company's internal qualification program. In this document, "user" is defined as all customers using a component qualified per this specification. The user is responsible to confirm and validate all q ualification data that substantiates conformance to this document.1.1 PurposeThe purpose of this specification is to determine that a component is capable of passing the specified stress tests and thus can be expected to give a certain level of quality/reliability in the application. The science of whisker growth, including growth models and accelerated test methods, is not fully understood at the time of release of this standard. Further, the existence of tin whiskers over time does not ensure component or system failure. The environmental tests specified in this document for whisker growth evaluation require conditions of temperature, humidity and temperature cycling which are currently believed to best exacerbate whisker growth in Sn-plated leads a nd terminations. The user and supplier need to consider the applicable risks when using components with Sn-plated leads in sensitive applications.1.2 Reference DocumentsCurrent revision of the referenced documents will be in effect at the date of agreement to the qualification plan. Subsequent qualification plans will automatically use updated revisions of these referenced documents.1.2.1 JEDECJESD201 Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface FinishesJESD22-A104 Temperature CyclingJESD22-A111 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State DevicesJESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability TestingJESD22-A121 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface FinishesJESD22-B102 SolderabilityJESD22-B106 Resistance to Solder HeatJP002 Current Tin Whiskers Theory and Mitigation Practices Guideline1.2.2 IPC/JEDECJ-STD-020 Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices 1.2.3 EIA/IPC/JEDECEIA/IPC/JEDEC J-STD-075 - Classification of Non-IC Electronic Components for Assembly Processes1.3 Terms and Definitions1.3.1 Lead Free (Pb-free) Plating Finish: A component plating finish is considered Pb-free if the followingrequirements are met:a. Complies with the latest version of the Global Automotive Declarable Substance List (GADSL).Refer to GADSL () for detailed requirements and exemptions.b. Is compliant to Pb-free board assembly process reflow profile(s) and material(s) as required herein.1.3.2 Preferred Pb-Free FinishesDue to the risk of Sn whiskers, non Sn-based finishes may be preferred. However, solderability performance may indicate a preference of (matte) Sn plating. Therefore, careful consideration must be given to the plating finish material and the intended component manufacturing process.A verified whisker mitigation practice is required when Sn-based finishes are used, unless otherwise agreedbetween user and supplier on a case-by-case basis. Refer to Section 5 of JP002 for information and examples of verified mitigation practices.1.3.3 Restricted Pb-Free Finishes1.3.3.1 Tin-Bismuth (SnBi) alloy finishes containing greater than 5% Bismuth may not be acceptable foruse in SnPb solder processes due to the formation of a low-melting point ternary eutectic compound (SnPbBi). Refer to JP002 for details on SnBi. Use of SnBi alloy finishes in SnPb solder processes requires user approval and must meet the requirements stated in this specification.1.3.3.2 Plated Tin-Copper (SnCu) alloy finishes are not acceptable for use in any solder process due toenhanced whisker formation and growth resulting from the introduction of Copper. Refer to JP002 for details on SnCu. Use of SnCu alloy finishes requires user approval and must meet the requirements stated in this specification.2. EQUIPMENTNot Applicable3. QUALIFICATION TESTSWhen a component involves Pb-free and/or Pb-free compatible materials, certain tests (as defined in this document) must be performed and resulting data submitted for review before the component can be approved for use. These tests are in addition to all electrical/mechanical testing required in the applicable part specification and include solderability, resistance to solder heat (if applicable), moisture sensitivity (MSL), and Sn whisker testing. Where applicable, tests should include exposure to and/or use of standard SnPb (e.g., Sn60/Pb40, Sn63/Pb37, Sn25/Pb75, etc.) and Pb-free (SAC305 or similar Pb-free alloy with liquidus of 217°C to 227°C) solder to examine and confirm forward and backward assembly compatibility of the Pb-free components. The user must approve any deviation from the test requirements defined herein.3.1 SolderabilityAll plated component terminations and/or surfaces shall be tested for solderability per JESD22-B102. Allthrough-hole components shall be solderability tested using the “Dip and Look” method.All coarse pitch (external lead pitch > 0.5mm) Surface mount components shall be tested using either the “Surface Mount Process Simulation Test" method or "Dip and Look" test method. It is recommended that all fine external lead pitch (=0.5mm) surface mount components be tested using the "Surface Mount Process Simulation Test" method due to solder bridging issues. If “Dip and Look” is used for fine pitch components, a technique for addressing solder bridging must be documented and included in the test report defined in Section 3.5.Issues have been observed with the Dip and Look Test for certain metallurgies and package configurations.For these cases, the Surface Mount Process Simulation Test should also be performed as verification.All exceptions to the applicable test method(s) must be noted in the part specification.3.1.1 PreconditioningAll components are to be preconditioned according to conditions A, C, or E per JESD22-B102 (see Table 1 for exposure requirements). Refer to the applicable AEC Stress Test Qualification document (e.g., Q100, Q101, and/or Q200) for required precondition type.Table 1: Preconditioning RequirementsCondition Precondition Type Exposure Time Leadfinish MaterialA 1 Hour ± 5 min. nontin and nontin-alloyC Steam Precondition8 Hours ± 15 min. tin and tin-alloyE *150°C Dry Bake 16 Hours ± 30 min. Alternative to steam precondition* Note: Refer to the applicable AEC Stress Test Qualification document (e.g., Q100, Q101, and/or Q200) to determine if Dry Bake precondition is allowed.3.1.2 Solderability - Dip and Look TestSolderability testing using the Dip and Look test method shall be performed per JESD22-B102 Method 1 and shall include both Pb-free and backward compatibility (SnPb) test conditions.3.1.3 Solderability - Surface Mount Process Simulation TestSolderability testing using the Surface Mount Process Simulation Test method shall be performed per JESD22-B102 Method 2 and shall include both Pb-free and backward compatibility (SnPb) test conditions.Unless otherwise agreed upon between user and supplier, the nominal stencil thickness, solder alloy, and reflow parameters (e.g., temperature and time) shall be as defined in JESD22-B102 Method 2.3.1.4 Wetting Balance Solderability TestWetting balance solderability testing is NOT REQUIRED for Pb-free solderability evaluation. It is a test that can augment the other required solderability test methods during problem-solving. Further details can be found in Appendix A.3.2 Resistance to Solder HeatResistance to Solder Heat testing must be performed per the applicable JEDEC JESD22-B106 (for Through-Hole Mounted D evices), or, if requested by the user, JESD22-A111 (for Small Surface Mount Devices).Deviation requires agreement between user and supplier on a case-by-case basis. All exceptions to the applicable test specification(s) must be noted in the part specification.3.2.1 Through-Hole ComponentsResistance to solder heat testing of through-hole components shall be performed using the Pb-free solderbath test conditions per JESD22-B106.3.2.2 Full Body Immersion Wave Solder of Small Surface Mount ComponentsNote: It is strongly recommended that active SMT components not be attached by bottom-side wave solder processes. Full Body Immersion testing shall only be performed if requested by the user. The user MUST consult the supplier to understand the risks (e.g., MSL change, maximum reflow temperature, ramp rates, etc.) and safeguards (e.g., dry storage, pre-bake, etc.) needed if an active SMD component is to be attached via bottom-side wave solder process.Resistance to solder heat testing of surface mount components (if applicable) shall be performed per JEDEC JESD22-A111. Testing shall use dry samples (no moisture soak) and u se dual wave simulation at the 260°C classification test condition as defined in Table 1 of JESD22-A111.3.3 Moisture SensitivityComponents representative of device families shall be tested to determine moisture sensitivity level (MSL) classification p er one of the following standards for both SnPb and Pb-free solder profiles. The user shall be notified of any change in existing MSL classification when transitioning from SnPb to Pb-free. All exceptions must be noted in the part specification.3.3.1 IPC/JEDEC J-STD-020 - Moisture/Reflow Sensitivity Classification for Nonhermetic Solid StateSurface Mount DevicesThe purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability.3.3.2 EIA/IPC/JEDEC J-STD-075 - Classification of Non-IC Electronic Components for Assembly ProcessesThis standard outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This specification does not establish re-work conditions.3.4 Tin (Sn) Whis ker Acceptance Testing3.4.1 Whisker acceptance testing shall be compliant to JESD201, with additional requirements asdefined herein.3.4.2 Additional Requirements (addendum to JESD201)3.4.2.1 Test SamplesSamples shall be representative of actual package configuration and surface finish technology using the proposed Pb-free finish, including any trim and form operations that occur after the plating process.Similarity acceptance qualification for changes in package configuration and/or component assembly process requires agreement between user and supplier on a case-by-case basis. Refer to Table 1 and Section 5.2 of JESD201 for more information.3.4.2.2 Sample Preconditioning - Board MountingDue to the addition of solder alloy material and its interaction with the Pb-free plating finish material, use of a solder alloy or attaching test samples to a printed circuit board using a soldering operation is prohibited.Deviation requires agreement between user and supplier on a case-by-case basis.3.4.2.3 Validation of Whisker Acceptance Test ConditionsThe test conditions defined in JESD201 have been shown to generate whiskers. If whisker growth is not detected on test samples during the required test duration for the Temperature Cycling or High Temperature / Humidity Storage (55°C ±3°C and 85% ±3% RH) test conditions, data demonstrating capability to generate whisker growth (e.g., additional samples, coupons, etc.) must be provided to validate the test conditions that were used.NOTE: The lower Temperature / Humidity Storage test condition (30°C ±2°C and 60% ±3% RH) per JESD201 is exempt from this requirement.3.4.3Acceptance CriteriaA component will be defined as passing Sn whisker acceptance testing if all test samples meet the criteriaestablished by the Class level 2 requirements as defined in JESD201 or as negotiated between the user and supplier.3.5 Reporting of Results3.5.1 Solderability, Resistance to Solder Heat, and Moisture Sensitivity Test ResultsUpon completion of the required testing defined herein, a report of the testing performed and detailed results, as defined below, must be submitted to the user. Deviation requires agreement between user and supplier on a case-by-case basis.a. Plating Finish Details•Component type, package base metal, underlayer (if used), and finish material(s)•Material thickness valuesb. Sample Details•Package configuration (e.g., lead pitch, pin count, lead form, etc.)•Plating lot date•Preconditioning used•Sample sizesc. Test Details•Testing performed (e.g., solderability, MSL, etc.)•Documentation of solder alloy and/or solder profile/temperature used (e.g., SnPb, Pb-free, etc.)•Technique used for fine pitch solderability test “dip and look” method (if applicable).•Exceptions to any tests performed (e.g., test conditions, sample sizes, etc.)d. Test Results•Acceptance criteria (for all tests performed)•Summary of results and supporting test data3.5.2 Sn Whisker Acceptance Test ResultsA report of the Sn Whisker Accpetance testing performed and detailed results compliant to JESD201Section 7 must be submitted to the user. Additional information, as defined below, shall be included in the report. Deviation requires agreement between user and supplier on a case-by-case basis.a. Additional Sample Details•Package configuration (e.g., lead pitch, pin count, lead form, etc.)APPENDIX A - Informative subjects:A.1 Wetting Balance Testing:In the event that component solderability issues are encountered, the Wetting Balance Test method can bea valuable investigation technique. Wetting balance testing can be useful when used for a lot-to-lotcomparison, where a method of plating variability identification is desired. Some considerations when using wetting balance as a quantitative investigation tool include:•Not all wetting balance machines are equal, some are called solder checking or solderability machines, but in fact can not do the test properly and do not have the ability to adjust for differentmediums•The wetting balance baseline for SnPb solder has been established as:o Density of solder at 245°C (8150 kg/m3) for Sn60/Pb40 Alloyo Surface tension of solder = 0.4 mN/mm•Recent testing is suggesting a wetting balance baseline for Pb-Free as:o Density of solder at 255°C (7410 kg/m3) for SAC305 Alloyo Surface tension of Pb-free solder = 0.5 mN/mmNote that previously published SnPb wetting balance test data only applies to testing performed at 245°C and using Sn60/Pb40 solder alloy material. Any change to temperature (e.g., 215°C) or solder alloy (e.g., Pb-free alloy material) would require new data collection and possible adjustments to the test equipment and/or test procedure.Previously published reports have shown that the wetting balance test does not correlate to actual solderability test results. Components failing a wetting balance test may experience no failures during the solder or assembly process, while components passing a wetting balance test may experience failures during the solder or assembly process.AEC - Q005 - REV-AJune 1, 2010Component Technical Committee Automotive Electronics CouncilPage 8 of 8 Revision History Rev # - A Date of changeFeb. 12, 2009June 1, 2010Brief summary listing affected sections Initial Release. Format Updated.。

Japan Aviation Electronics Industry,Ltd.Connector DivisionNo.JAHL-1594-E Page 1/15Title:Handling Manual forMX19/MX19A series connectorRev.DATEDCN No.ByCHKDAPRVD115Feb.00-J.Miyamoto M.ShinmyoT.Totani1229Jan.19028264Y.Obata ―H.Obikane 136Mar.19028707Y.Obata―H.ObikaneHandling Manual Originating Dept.:Connector Div.3rd Engineering Dept.Contents table;1.Purpose2.Applicable items3.Crimping3-1.Applicable wires3-2.Stripping length of wire insulators 3-3.Part description3-4.Criteria for crimping items3-5.Other cautions for crimping process4.How to insert4-1.Contacts 4-2.Dummy plug5.How to withdraw contact6.How to engage/separate connector7.Cautionary statement△72019/03/071.PurposeThis document provides the handling on MX19/MX19A series connectors.2.Applicable items2.1HousingTable2-1MX19/MX19A Connector HousingTerminals No.Type Product Name Body Color Matseal color2 (Fig.2-1)Pin housingMX19002P51BlackBrown(Fig.2-4)MX19002P52GraySocket housingMX19002S51BlackMX19002S52Gray4(Fig.2-2)Pin housingMX19004P51BlackMX19004P52GraySocket housingMX19004S51BlackMX19004S52Gray2(Fig.2-1)Pin housing MX19A002P53GrayGreen(Fig.2-4)Socket housingMX19A002S53GrayMX19A002S54Black3(Fig.2-3)Socket housingMX19A003S51BlackGreen(Fig.2-4)MX19A003S52Light BlueMX19A003S53Gray2.2Contacts and Dummy plugTable2-2MX19Contacts and Dummy plugType Product Name NOTEPin contact MX19P10K451Sn platting Fig.2-5Socket contact MX19S10K451Sn platting Fig.2-6Dummy plug MX19000XD1Color:white Fig.2-7Pin housing Socket housing Pin housing Socket housing Fig.2-1MX192-terminals type Fig.2-2MX194-terminals typeMX19A003S51MX19A003S52(Key type A)MX19A003S53(Key type B)Fig.2-3MX193-terminals type△2△3△4△7△8△9△11△7△9911Fig.2-4Matseal color confirmationFig.2-5Pin contact Fig.2-6Socket contact Fig.2-7Dummy plug3.CrimpingJAE’s applicator is described on the following table.Table3-1JAE Crimping ApplicatorType Automatic applicator Semi-automatic applicatorProduct name350-MX19-3B350-MX19-23.1Applicable wire typeTable3-2Applicable wire for MX19/MX19A connector Wire type Conductor construction (No./Shape or size)Calc.Conductor of cross-section [mm 2]Wire insulator [mm]ApplicablehousingCAVS 0.3mm 27/Round compressed0.3717φ1.4 ～1.5MX19002P5*MX19002S5*MX19004P5*MX19004S5*MX19A002P5*MX19A002S5*MX19A003S5*CPTL 227 / φ0.13 0.3717φ1.57 (Ref.) CAVS 0.5mm 27/Round compressed0.563φ1.6 ～1.7AVSS 0.3mm 27 / φ0.260.3717φ1.4 ～1.5AVSS 0.5mm 27 / φ0.13 0.563φ1.6 ～1.7FLRY-B 0.5mm 216 / φ0.196 0.4536φ1.4 ～1.7FLRY-A 0.35mm 27 / φ0.245 0.33φ1.2 ～1.3MX19A002P5*MX19A002S5*MX19A003S5*FLRY-B 0.35mm 212 / φ0.1910.3402φ1.2 ～1.4Check the matseal color from a housing back side.△7△9△7△9△7△9△7△9△5△5△7△8△9△103.2Stripping length of wire insulatorsCheck the stripping length of wire insulators (refer to Fig.3-2.)On the wire treatment,must check the damaged insulator,damaged,missing and/or disordered conductor (refer to Fig.3-1.)Fig.3-1Defective wire treatment for crimplingFig.3-2Stripping length for MX19contact crimping3.3Part description 3.3.1Pin contactFig.3-3Part description of pin contactContact Length A [mm]MX19P10K4512～2.5mmMX19S10K451M19P09K3F2M19S09K3F2FailFail Fail Fail△73.3.2Socket contactFig.3-4Part description of Socket contact3.4Criteria for crimping items "Properly crimped contact"is as follows:1.Meet the crimp height shown in Table 3-3.2.The bell-mouth (no crimping on conductor)is attached.3.The tip of conductor sticks out 0.5mm (or less)from the conductor barrel.4.All conductor of wire is within the conductor barrel.5.Any wire insulator is NOT crimped into the conductor barrel.6.No cracks and/or burrs etc.is in crimping area.Table3-3Appropriate crimp heightWire type Crimp height [mm]Crimp wide [mm](Ref.)Crimp height of wire insulator [mm]CAVS0.3mm 20.73～0.831.48～1.54 1.6～1.7CPTL 220.73～0.83 1.48～1.54 1.7～1.9CAVS 0.5mm 20.75～0.85 1.52～1.58 1.7～1.9AVSS 0.3mm 20.73～0.83 1.48～1.54 1.55AVSS 0.5mm 20.75～0.85 1.52～1.58 1.7～1.9FLRY-A 0.35mm 20.73～0.83 1.48～1.54 1.55FLRY-B 0.35mm 20.73～0.83 1.48～1.54 1.4FLRY-B 0.5mm 20.75～0.851.52～1.581.6NOTE 1:Crimp height dimension is formed by JAE's applicator.NOTE 2:Crimp width/height and crimp height of wire insulators are reference valuesonly.△3△4△7△10△4△53.4Criteria for crimping itemsIf a crimped MX19contact has any following defective item,the crimping work is failure.DON’T usethe failure crimping contact.4.Contact and dummy plug insertion 4.1Contact insertion1.Visual inspection,the connector has no breakage,deformation,discoloration,and/or damage etc.2.Aligned the axis and direction between a contact and a cavity.3.Handling the wire of the near position of contact for not to be occurred bending.4.Contact insertion is completely done until the contact locking part sounded.(Check the terminal insertion by pulling the wire with little force.)NOTE:If the contactinsertion is tight or incapable,DON’T force to insert,check the direction of contact.Tight (or incapable)insertion will cause a contact deformation,crack and/or disconnection.Fig.4-1Contact insertionFig.4-2Example of contact deformation by wrong contact insertionRight wayWrongway△2△34.2Dummy plug insertion1.Check by visual inspection,the connector has no breakage,deformation,discoloration,and/or damage etc.2.Aligned the axis between a dummy plug and acavity.3.Inserting a dummy pluginto cavity,insertion is the end-face of dummy-plug by connector's.Acceptance Criteria:Base on the housing end-face,Dummy plug’s end-face is within 0+0.5/-0.5mm.NOTE:DON’T apply unnecessary force toon inserting dummy plug.Fig.4-3Dummy plug insertiona.Absence insertionb.over insertionFig.4-4Failure dummy plug insertion△45.Contact withdraw 1.Visual inspection,the connector has no breakage,deformation,discoloration,and/or damage etc.2.Push lightly the wire with crimpling contact.3.Insert a withdrawing tool into a tool cavity,as following Fig.6-2and Fig.6-3.4.When the toe of withdrawing tool met the molding lance,release contact locking.5.Withdraw the wire on straight axis.Fig.5-1Pin contact withdrawFig.5-2Socket contact withdrawNOTE:Suitable dimension for withdrawing tool (JAE’s withdrawing tool is “ET-MX19.”)NOTE:DON’T snag a contact on grommet by forcedly withdrawing.NOTE:The limitation frequency for withdrawing at one cavity is 3times.If you find any damage anddeformation,DON’T use it,change to the new one.NOTE:DON’T apply unnecessary force on withdrawing.NOTE:Withdrawing tool insertion is only a “tool cavity,”never inserting the contactcavity.±0.03△26.How to engage connector6.1Engaging1.Check the contact insertion.2.Check by visual inspection,the connector has no breakage,deformation,discoloration,and/or damage etc.in contacts and housing.3.Aligned the direction with the engagement aperture.4.Insert the connector into the housing until the lock parts sounded.NOTE:DON’T apply unnecessary force to connector on inserting/separating connector.NOTE:If housings insertion is tight or incapable,DON’T force to insert,check the direction of contact.Tight (or incapable)insertion will cause a connector deformation,crack and/or disconnection.Fig.6-1Connectorinsertion6.2Connector separation methodHold socket housing,and pull out the connector straightly;1:Depressing the lock arm of socket housing.2:Releasing the engagement lock.NOTE:On separating the connector,DON’T pulling only wires and prying the connector.NOTE:In case of incapable of separation,DON’T force it to pull out.Check the engagement lock is released.NOTE:DON’T apply unnecessary force to connector on inserting/separating connector.Fig.6-2Connectorseparation7.Cautionary Statements7.1Sealing rubber set Care must be taken when handling MX19and MX19A series connector body to avoid rotation of the seal.Once the seal has been rotated,twisted,turned or displaced,JAE cannot take liability for loss or displacement of seal in any post-JAE operations,and can offer noguaranteeon the performance of theconnector.”NOTE.Extreme care is tobeexercised when using rubber,latex or rubber coat fabric gloves.These gloves are designed to havehigh tactileadhesion &will cause displacement of thesealifmis-handled.(a)Rotated (b)Twisted /Turned(c)DisplacedFig.7-1Examples for failure state of seal ring△12△137.Cautionary Statements 7.2Caution。

CN4090‐9118型输入/输出模块安装使用说明书注意和警告不要安装任何已经损坏的Simplex 产品当你打开Simplex 产品的时候，应检查产品是否在运输中有损坏，如果有，请立即向运输公司索赔并通知Simplex 。

电气危害在做任何内部调整或维修的时候，务必断开电源，并由具有Simplex 认证资格的技术人员进行技术维护。

静电危害静电会损坏元器件。

因此，请遵照以下规定： 1. 在打开或安装元器件时，确保自身接地。

2. 在移除元器件时，确保用绝缘材料包裹起来。

介绍CN4090-9118型输入/输出模块为4100U 提供一路输出控制和一路T-Sense 监视区域输入。

T-Sense 输入分为四种状态：开路（Open ），正常（Normal ），限流（Limited ）以及短路（Short ）。

本出版物由以下部分组成： 模块规格说明 ................................................................................................................................... 1 指示灯状态说明 ............................................................................................................................... 2 模块地址设置说明 ........................................................................................................................... 2 模块接线端子说明 ........................................................................................................................... 3 模块接线说明 ................................................................................................................................... 3 编程设置........................................................................................................................................... 4 安装说明. (4)模块规格说明机械特征尺寸 高 x 宽 x 深 （63mm x 86mm x 86mm ） 温度 -10°C ～ 50°C湿度范围最大到95%相对温度（无凝露） 电气特征 通讯 IDNetIDNet 负载 占用一个物理地址和一个单位负载 配线规格 0.82mm 2～2.08mm 2（18～12AWG ） 工作电压 18～32V DC （标称24VDC ）IDNet 距离参考 从控制器到最远回路设备距离为762米 T 分支总计距离为3048米T-Sense 输入要求 必须采用大于0.82mm 2（18AWG ）的双绞线，最长距离为152米 继电器触点负载 （阻性）2A/30VDC 0.5A/125V AC终端电阻输出终端电阻：10k Ω ½W输入终端电阻：开路电阻1.8k Ω ½W ，短路电阻4.7k Ω ½W指示灯状态说明正常状态 模块故障 巡检指示灯闪烁 常亮正常状态 动作状态 输入动作 熄灭 常亮 输出动作 熄灭常亮* 指示灯颜色为红色模块地址设置说明CN4090-9118型输入/输出模块使用8位拨码开关（SW1）进行地址设置，参见表1。

No. CNAS L1115 第 1 页 共 12 页中国合格评定国家认可委员会认 可 证 书 附 件(No. CNAS L1115)名称: 富港电子（东莞）有限公司Foxlink 实验室 地址：广东省东莞市东坑镇工业大道签发日期：2010年07月12日 有效期至：2012年03月22日附件1 认可的检测能力范围No. CNAS L1115 第2 页共12 页No. CNAS L1115 第3 页共12 页No. CNAS L1115 第4 页共12 页No. CNAS L1115 第5 页共12 页No. CNAS L1115 第 6 页 共 12 页CHINA NATIONAL ACCREDITATION SERVICE FOR CONFORMITY ASSESSMENTAPPENDIX OF ACCREDITATION CERTIFICATE(No. CNAS L1115)NAME: Fugang Electronic (Dongguan) Co., Ltd. Foxlink LaboratoryADDRESS ：Industry Avenue, Dongkeng Town, Dongguan, Guangdong, ChinaDate of Issue: 2010-07-12 Date of Expiry: 2012-03-22APPENDIX 1 SCOPE OF ACCREDITED TESTINGNo. CNAS L1115 第7 页共12 页No. CNAS L1115 第8 页共12 页No. CNAS L1115 第9 页共12 页No. CNAS L1115 第10 页共12 页No. CNAS L1115 第 11 页 共 12 页中国合格评定国家认可委员会认 可 证 书 附 件(No. CNAS L1115)名称: 富港电子（东莞）有限公司Foxlink 实验室 地址：广东省东莞市东坑镇工业大道签发日期：2010年07月12日 有效期至：2012年03月22日附件3 认可的授权签字人及领域No. CNAS L1115 第 12 页 共 12 页CHINA NATIONAL ACCREDITATION SERVICE FOR CONFORMITY ASSESSMENTAPPENDIX OF ACCREDITATION CERTIFICATE(No. CNAS L1115)NAME: Fugang Electronic (Dongguan) Co., Ltd. Foxlink LaboratoryADDRESS ：Industry Avenue, Dongkeng Town, Dongguan, Guangdong, ChinaDate of Issue: 2010-07-12 Date of Expiry: 2012-03-22APPENDIX 3 ACCREDITED SIGNATORIES AND SCOPE。

尊敬的用户：西安西核彩桥实业科技有限公司地处西安市高新技术开发区，是专业生产火灾报警联动控制系统的高新技术企业，是中美合资西安盛赛尔电子有限公司（systemsensor）的紧密型合作伙伴。

公司自主研发的CH8000系列智能火灾报警控制系统，全面采用美国盛赛尔公司（systemsensor）的设计理念、先进技术、通讯协议、制造工艺，与国际火警行业的先进技术同步，该系统全面兼容盛赛尔公司生产的智能型、常规型、特殊型产品，具有工作稳定、扩展性强、容量大、网络化等特点。

公司拥有优秀的团队、先进的设备、超前的理念，遍及全国的销售服务网络，产品广泛应用于石油、化工、电信、移动、钢铁等国家重点行业和大型楼宇场馆，以可靠的产品，优质的服务，诚信的文化赢得用户的满意。

公司将和全体销售服务商一起为用户竭诚服务，以我卓越科技，护航您美好未来。

目录1、JTY-LZ-ZM991智能离子感烟火灾探测器2、JTY-GD-ZM992智能光电感烟火灾探测器3、JTW-BD-ZM995智能感温火灾探测器4、JTY-GD-882光电感烟火灾探测器5、JTW-BD-885感温火灾探测器6、JTYJ-GD-2630/B 独立式感烟火灾探测报警器7、JTYJ-GD-2690/B 独立式感烟火灾探测报警器8、BAEM1224S型红外光束感烟火灾探测器9、AEC2361a 可燃气体探测报警器10、AEC2371a 可燃气体探测报警器11、J-SAP-M-SB8304 编址手动火灾报警按钮12、J-SAP-M-SB8304/H 编址消火栓报警按钮13、SM8301 输入模块14、KM8302 输入/输出模块15、KM8302B 切换模块16、DB8307 总线短路保护器17、M902M 探测器接口模块18、SG8306A 编址声光警报器19、ZH8310A 现场转换盒20、SSM24-6 警铃21、SG8306 声光警报器22、CH8504 放气指示灯23、CH8505 紧急启停按钮24、CH8507 手/自动转换盒25、CH8316/20/48/72 路接线端子箱26、CH8907/6/12/20模块箱27、FS-100 火灾显示盘28、CH8605 多线联动控制盘29、CH8601 总线手动控制盘30、JB-QB-CH8000 火灾报警控制器（联动型）31、JB-QB-CH8800 火灾报警控制器（联动型）32、JB-QB-CH8000/S 火灾报警控制器33、JB-MH-CH8500 气体灭火控制器34、JB-QB-CH8800 气体灭火控制器35、CH8909 CRT火灾彩色平面图形显示系统36、GB9242 消防广播主机37、DH9251 多线火警电话主机38、DH9261 总线制火警电话主机39、CH9200 壁挂广播通讯柜1、JTY-LZ-ZM991智能离子感烟火灾探测器功能描述及技术指标◆适用于发生火灾后产生大量的烟和少量热的场所，如宾馆、饭店、办公楼、机房、医院、学校等各种室内场所。

Terminal CPXMódulos de E/S analógicas CPX-4AE-T/CPX-4AE-IAmplio margen•CPX-4AE-T: menores costes del sistema y de almacenamiento mediante conexión directa de detectores de temperatura,termómetros de resistencia eléctrica tipos PT y N•Prescindir de costosos detecto-res con convertidores integra-dosSoluciones específicasConexiones en función de la apli-cación, de las características del módulo electrónico y del están-dar válido en la empresa.Menos es másTecnología avanzada para reducir costos y ahorrar tiempo y espa-cio.•Menores costos por canal con cuatro canales por módulo •Menos tiempos improductivos mediante diagnóstico por cana-les e indicación de fallos con LED por canal, unidad manual CPX-MMI o bus de campo /Ethernet•Terminales más compactos gra-cias a la gran cantidad de cana-les por móduloLos nuevos módulos de E/S son óptimos para una gran cantidad de canales analógicos o detectores de temperatura en la automatización de procesos. CPX-4AE-T para la detección de temperaturas desde -200°C hasta 850 °C; CPX-4AE-I para señales desde 4 hasta 20 mA.Medir temperaturas,captar señales,ahorrar espacio.210.8.PSIProduct Short InformationFesto AG &Co.KGRuiter Strasse 8273734 EsslingenInternet Tel. ++49 (0)711 347-0 Fax ++49 (0)711 347-2144E-mail service_international@270406R e s e r v a d o e l d e r e c h o d e m o d i f i c a c i ónTerminal CPXMódulos de E/S analógicas CPX-4AE-T / CPX-4AE-IAmplia modularidadMás economía mediante la utili-zación de módulos electrónicos.Medir temperaturas, caudales,presiones y distancias.CPX: diversidad de conexiones Gran cantidad de funciones eléc-tricas. El encadenamiento de la placa de alimentación, módulo electrónico y placa de alimenta-ción permite numerosas combi-naciones. Elección rápida y man-tenimiento sencillo gracias a la sustitución de módulos electróni-cos sin modificar el cableado.TipoCPX-4AE-ICPX-4AE-TMódulos de entradas analógicas Captación de señales Detección de temperaturas Cantidad de entradas 44Cantidad de salidas ––Línea característica ––Resolución12 Bit16 BitNivel de conm./Margen señales 0 ... 20 mA, 4 ... 20 mA Fuente de intensidad constante Alim. máx. de corr. por canal 40 mA En función del detector Alim. máx. de corr. por módulo 0,7 A0,7 A Detectores P . ej. sensor de presión y vacío SDE–DetectoresSensores de presión, detectores de caudal PT 100, PT 200, PT 500, PT 1000y medidores de distancias Ni 100, Ni 120, Ni 500, Ni 1000Margen de temperatura –PT estándar: -200 °C ... 850 °C DetectoresPT entorno: -120 °C ... 130 °C NI estándar: -60 °C ... 180 °CConexiones para detectores 2, 3, 4 hilos 2, 3, 4 hilos ParametrizaciónFormato de datos, valores límite, factor de escala Formato de datos, valores límite, factor de escala,detector de temperatura, comportamiento de la fuente de corriente en caso de sobrecargaDiagnóstico 4 LED para errores de canal y 1 LED para error de móduloFuncionesParametrización y diagnóstico por canal, señales del canal defectuoso a través de la red o en CPX-MMIMPA1 y MPA2Bloque de enlace CPX-GE-7/8" 5 cont.CPX-4AE-ISensor de presión SDE1Medidor de distancias SOELDetector de caudal SFE1Módulo electrónico CPX-4AE-TDetector de temperatura PT 100Datos técnicos。

法国（RADIO-ENERGIE）雷恩编码器常用型号：RKA190-PSDV-1418-PV1650-SD55RCO100M-S2-1612-SW-30-SC010-R2RCM58S-32057-S3009RCI444RS-1024-JBX1-S101RCI120T25X2N1CR10000S20MRCM58-B1A1G-0016-DR23RCM58-SS2-18-00-36-10SC-R4RCI580136S002RCI580136S002-30CRCI90TS01024SJBX3，RCI115TSCT11024S11，RCI115TSCT22048S11RCI90TS-01024-S-T45RCI90TS-1000-S-0081RCI90TS-1000-M-S005RCI90T-HSA4-1024-S005+ RCI90T-HSA4-0050-S007+RCOE01RO1480BR（模块式编码器）RCI90T-HSA4-1024-S005+ RCI90T-HSA4-0050-S007（模块式编码器）RCI444R FS11 4 2048JBX2RCI444R-001024-012-SA010RCI444R-002048-012-SA010RCI444R-1000-S175RCI58B BS15 2 04096 CA02RCI58B HS15 2 01024 23C1(插头式）RE.0110S1CB0.005CARE.0444R1B0.04CA003ALT02C08507042+RE.0444R1CB0.2CA+联轴器125V100TT05-03 100MN23-7170H-CR-22MC/1000/20M/A0009401/10-10AHM916//5SSG//131//B06//S6R1//615EZAMH5_14//P-SS-G-13B12D5-S6R050ASH930 5CP G 13 C7R150ASH9305CPG13C7R100CD50-1500-L005-OP10CD80MEC-204.8-L005-P10CM12H-1024-006 1024HTLCMB1350-01000-M420-AL001-H030CP14L2.1-Φ11/2.1-Φ16PIF1111 5G5MC 100 BRPIF1111 5G5MC BR 01024BRPIF11R11 5G5MC 01024BRPIH12-425G5MC1024CR020PIH5-12/5GTMC/2048/CR020R81H-1024-255170-HR-A3RCH5848R/1024-00112HZRCI.58.GHM5.10.2G2.Z.2500.G3.B.01.1RCI160TS-T50-1024-JBX1-S10C + C350A01RCI160TS-TA8-500-JBX3-TL350-S25CRCI16TS-TK35-1024-JBX3-LH200-S101RCI40C-081KTL-E10RCI40TS-1024-S105RCI444R FS11 4 1024 JBX1RCI444R FS11 4 1200 JBX1RCI444R FS11 4 2048JBX1RCI510-2048S005RCI58B BS15 2 01024 23C1(插头式）RCI58B BS15 2 01024 CA01RCI58B BS15 2 01024 CA02RCI58B BS15 2 02048 CA02RCI58B HS15 2 02048 23C1(插头式）RCI58B-BS15-2-01024-23C1（配母插头加2米电缆）RCI58B-BS15-2-01024-CA0210-30VDC HTLRCI58B-HS12-2-01024 23C1RCI58B-HS12-2-10000 23C1RCI58B-HS12-2-2800 23C1RCI58B-HS14-2-01024-CA01RCI58C-BS05-01024-CR020RCI58C-FS3-F-1024-1RCI58T FS10 S 01024 CA02(电缆式）RCI58T-21105-2048RCI58T-HS12-S-01024-CA02-S002RCI58T-HS14-1-01024-CA02RCI58T-HS14-S-01024-CA02-S001RCI58T-HS14-S-01024-CA05-S001RCI58T-HS14-S-01024-CA05-S005RCI58TS-1024-S105-IP67RCI58TS-HS14-C-01024-CA01RCI90B HS20 1 01024 CA02RCI90B HS25 1 1024 CA02RCI90B HS30 1 01024 23C1(插头式）RCI90B HS30 1 01024 CA01RCI90B HS30 1 01024 CA02RCI90B HS42 1 01024 CA02RCI90C-100-00102-RCI90C-1BVD-1024-51-S1RCI90C-1BVA-1024-F1+9416RCI90C-1BVD-1024-F1+9416RCI90C-1EVD-1024-51-S002RCI90-GHW945-1024-S016-BL200RCI90TS-02500-S001RCI90TS-HS16-C-01000-CA02-S001RCI90TS-HS16-C-01024-JBX3-F150-S001RCI90TS-HS20-C-01024-CA01-S002RCI90TS-HS25-C-01024-23A0-F150-S007RCI90TS-HS30-C-01024-CA01-S002RCI90TS-HS30-C-01024-CA02-S001RCI90TS-T5HD-1024-E1-S000RCM90SS-TC20-25-S003RCO 058 R 06 2 9 BR 00600 I1RCO 058 R 06 5 9 BR 01024 I1RCO 058 R 06 5 9 BR 02048 I1RCO 058 R 06 5 9 BR 04096 I1RCO 058 R 06 8 9 BR 00200 I1RCO E01R O 0825 BRRCO E01R O 1480 BRRCO INT 444 R - Shaft end 11x30 mmRCO-058-R0689 BR-200I1RCOE01 RO950BRRCOE01 RO990BRRHI115-FS01-1024-S023RKL-200-A42-S10RM170H//CR//22MC//1000//30M//A009RMF510-5DP-PGR-6425SRMF510-PROF-001S152-129 EBD00656TYPE-115110080705-1024-GM028-DC24VASF5-10//5CPG//13//C6B//KF001AVS58N-011K1ROGN-0012CMF15-11-5533-1024-BR-A91COM 20337-AMI10H-16//5533//1024//BGR//LH150I5H14-5533-1024-CR2000-AMI5F-10-5533-01024-CR2000-A075PCIPE-11M+MPCE553301024BGR1024HTL,UB=10...30VDCPCIPE-11M+MPCE553301024BGR1024HTL,UB=10...30VDC**h5**通轴PCIPE-11M+MPCE553301024BGR1024HTL,UB=10...30VDC**s5**非通轴PCIPE-5880GS + RCOE-S1416BR-2KBDP + RCOS-HO825BR **PIF11R1159BR001024I//RF006PIF510-PG5MC-4096DR//MK016PIF510-PG5MC-4096-DR//MK016PKA190-PPSB-01316-BGR-1H200-SD25 DC12-30VPREO-1416-C300105(含GSD软件）RC19B HS30 1 01024 CA03RCDW-25KM-HLS25 (SN:12010C08P)RCI190-GHW930-2G29-5000-G3R010RCI444R 11 59BR 00 1024 I1RCI444R1159BR00/1024/I1RCI444R1159BR00/500/I1RCI444R-FS11-01024-4-BJX1-T115RCI444r-fS11-1000-4-JBX1RCI444R-FS11-1024-SB103+9401RCI444R-FS11-S-01024-JBX1RCI58B-00460RCI58B-FS10-S-01024-CA01RCI58EEX-1024-S12103(防爆编码器）RCI58T-16-02048-S102RCI58TB-T3-1024-S05RCI90 GHW9205 G59 1024 G6 RXXIRCI90C-1BVA-4096-F1+9416RCI90C-T359-1000-BR-S115/BF150RCI90T-HS30-S-01024-CA05-S002RCI90TS-38-01024-S104RCI90TS-HS25-C-01024-F150-S104RCI90TX-1024-S30105 (含附件）RCM58C-1BESA-1312-S1+9416RCM90SS-T30-25-S005+接头3米电缆+附件RCM9-12T//BGB//13B16//XTR00-S003RCOE-4K6B-200216 (SN:7526810)RCS5S-S10-13-SG100+9401RCDW-25KM-HLS25 拉线盒RCOF-42875F-5093RPEO-1418-C900115RCI58EEX-1024-S12103(防爆编码器）RCI90TX-1024-S30105 (含附件）M5F10-5-P-25-CR2000RONE-50025-4768K（SN:7726805 ）RONE-160758DNRONE-70047-2269K（SN:8014109）RCOF-42875F-5093（SN:704915）RCOF-42875F-5093（SN:704715）RCM90SP-T20-1319-CT12R-S107 **SD** 9445/018-D20RCOF-D1416-TS20057RCI090-C01-NH-D00-1024-003RCON-TS105-SS10200RCOF-D0016-TT10024RCON-DEKX3-S819115RCOF-42875F-5093( SN:704704 )RCOE-4K6B-200216RCI58TS-HS14-00020-CA01-S103RCI90TS-T30-1024-S003RCI190-HA05-S-01024-23C1-F150RCI90TS-T30-1024-S003RCI90TS-HS30-C-01024-CA01-S102RCI100TP-S36T-1024-CR20-F0150RCI90T-11045-415-APRCI190-HA05-S-01024-23C1-F350-S007 RCI190-HA05-S-01024-23C1-F350-S007 *** RKA190-PPSB-01316-BGR-LH200-SD25RCI58T-00130/1024RCI58T-HS14-01024-CA01-S106RCI90TS-HS25-C-01024-JBX3-S117RCI58B-00125/1024RCM9SP-TA5-325-S138RCI90TS-HS30-C-01024-23C1-S101RCI100TS-200451DRCI58B-FS10-S-01024-CA01FRABA—项目型号OCD58-33058UCD58-303600DOCD58-300610BRCI90C-1BVA-1024-F2RCM9120E-1416-S107RCI58C-1BVA-1024-F2M9F12P-1313-DR-S101COI-60157-1KBH-S101RCI90TS-HS30-C-01000-CA02-S002RCOE-4K6B-200216（增量）RCDW-25KM-HLS25（拉绳）RCOF-42875F-5093（增量）RPEO-1418-C900115（绝对）RCI58EEX-1024-S12103RCI90TX-1024-S30105 (含附件）RCI58TS-H10-S037RCI125-1024HT007-T150AC1501-2C10-5PG-0013-26AC1501-2C10-5F-1213-8AC1500-T12-5SG-1212-26AC1500-B15-5F-1213-8RCI90C-1BVD-1024-51-S1**soRCI58TS-HS14-C-01024-CA01MRE-32SP061FKBRCI158B-D0460配套弹片RCI158B-D0460HTL-2048-M60-S0013RCI115-1024-M2303RCI58B-HS12-SS2083RCM90SP-T30-SS12GCCI58-20674-SS103RCOF-6K4B-DV0418RCOF-1313-CS9182RCOE-1215V-PD6530I5H-1024-DRRCI160-T20-NH-BR-10204-TX150RCM58-2C10-5F-1213-8RCM58-B10-5SG-0812-28RCI160-T35-NH-BR-10204-TX200RCM58SP-PROF-001RCON-1416-PV3004 （SN:505423)SLJ-11/11RCM9120E-1416-S107RCI58TS-T4-01024-CA05-S002RDON-T0025-TS20031AC1501-2C10-5F-1213-8-S1RCS9SP-HA03-13G-S207RCON-TP1416-DF2015RKA190-PPSB-01316-BGR-LH200-SD25 AC1500-B12-5PG-1213-16-S07RCI100TS-P20035DRCM58SP-M10-SS1213UCD58-303600DRCI100TS-200451DOCD58-300610BPIF-1000-C05DRCI90TS-HS30-C-01024-23C1-S101 RE.0588US1CB0.06CARCM9SP-TA5-325-S138RCM5-SP-T20-1312-S106RCON-DEKX3-S819115 (SN:605327) RCOF-42875F-5093( SN:704704 ) RCOE-4K6B-200216 (SN:7526810) RCOE-4K6B-200216 (SN:7526810)CC1400-4T6-65-300-26RCOF-D1416-TS20057 (SN:805321)RCI090-C01-NH-D00-1024-003 (SN:201404093568) RCON-TS105-SS10200 (SN:505421)RCOF-D0016-TT10024 (SN:605701)9445/018-D20RCM90SP-T20-1319-CT12R-S107 **SD**RCM9SP-TA5-325-S138CC1601-4T60-23-2048-26RCM90SP-T20-1312-S106**OD**RCI90TS-HS20-C-01024-CA01-S002CC1401-2C6-23-2048-16CC1501-2C10-65-1024-26RONE-50025-4768K（SN:7726805 ）RONE-160758DN (SN:9920115)RCOF-42875F-5093（SN:704915）RCOF-42875F-5093（SN:704715）AC1501-2C10-5F-1213-8AC1500-T12-5SG-1212-26AC1500-B15-5F-1213-8CC1610-4T60-23-26-S001RCI90C-01430RCI58TS-T4-01024-CA05-S002PIF11R115G5MC01024BR11RF001RCOE-4K6B-200216 (SN:7526810)RCDW-25KM-HLS25 (SN:12010C08P)RCOF-42875F-5093（SN:704915）RPEO-1418-C900115 (SN:704950)RCOE-4K6B-200216 (SN:7526810)RCDW-25KM-HLS25 (SN:12010C08P)RCOF-42875F-5093（SN:704915）RPEO-1418-C900115 (SN:704950)RCOE-4K6B-200216 (SN:7526810)RCDW-25KM-HLS25 (SN:12010C08P)RCOF-42875F-5093（SN:704915）RPEO-1418-C900115 (SN:704950)RCI58EEX-1024-S12103(防爆编码器）RCI90TX-1024-S30105 (含附件）RCI90TX-1024-S30105 (含附件）RCI90T-11045-415-AP (含插头带线）RCI58T-00130/1024RCI90TS-T30-T-1024-S003RCI58C-1BVA-1024-F2RCI58C-1BVA-1024-F2RCI58C-1BVA-1024-F2COI-60157-1KBH-S101RCM9120E-1416-S107RCI90C-1BVA-1024-F2RCM9120E-1416-S107RCI90C-1BVA-1024-F2RCM9120E-1416-S107RCI90C-1BVA-1024-F2RCI190-HA05-S-01024-23C1-F350-S007 *** CC1900E-4S30-65-1024-29-HSCC1900E-4S45-65-1024-29-HSRCI190-HA05-S-01024-JBX3-F250-S007 *** AC1501-2C10-5SB-1213-26AC1501-2C10-5SB-1213-26AC1501-2C10-5SB-1213-28AC1500-B10-5F-1213-8CC1900-4T16-65-01024-26CC1900-4T25-65-01024-26CC1500-4T14-65-04096-26CC1500-4T14-65-01024-26CC1210-4T38-65-04096-26COM20232-PG/1212/S102RCI58C-FS10-S-01024-CA02-S001RKA190-1200DN-PB25-ST175RCI58T-HS14-1024-S002RCI90TS-HS30-C-01024-CA02-S001 QXPC 3550RCI90C-02146OCD58-33058RCI58B-00125/1024RCI90TS-HS30-C-01024-CA01-S001RCM912-1316-S102M9F12-5SG-1312-DR278K0096RCI510-2048S005RCI90TS-HS25-C-01024-JBX3-S117RCI90TS-HS16-C-01024-JBX3-F150-S001 RCI90TS-HS25-C-01024-JBX3-S117RCI90TS-HS25-C-01024-JBX3-F150-S005 COM 20337-AMCOM 20337-AMRCM90SP-T20-1319-CT12R-S107 **SD** MI16H-45//5533//2048//BGR//LH300+ES100 RCM90SP-T16-25-S005EL115A1000S8/24L11X3MRRCI90TS-T30-T-1024-S003CD230-MEC-12000-300-L001+-OP10+PHM510-1312 RCI90TS-HS25-C-01024-23A0-F150-S007RKI-C-F150RCI90C-1BVA-4096-F1+9416CC1500-4T10-65-1024-26。

Structure ReflowActuator configuration FlatActuator length20mmNumber of detent30Number of pulse15Push-on switch WithTravel of push-on switch 1.5mmOperating life100,000 cyclesOperating temperature range-40℃ to +85℃ElectricalperformanceRatings10mA 5V DCOutput signal Two phase A and BMax./min. operatingcurrent(Resistiveload)10mA/1mAInsulation resistance100MΩ min. 250V DCVoltage proof300V AC for 1 minute or 360V AC for 1sMechanical performance Detent torque12±5mN·m (Initial)10±4mN·m (After reflow) Push-pull strength100NPush-on switch specifications ContactarrangementSingle pole single throw (Push-on) Travel 1.5±0.5mmOperating force4±2NRating0.1A 5V DC (1mA 5V DC min. ratings)Contact resistance(Initial100mΩ max./200mΩ max.11mm Size Metal Shaft Type EC11 Seriesperformance/Afterlifetime)Operating life100,000 timesJapan600 Minimum order unit(pcs.)Export600 DimensionsMounting Hole DimensionsOutput WaveSliding NoiseAt R=5kΩ Chattering: 3ms max. Bounce: 2ms max.Packing SpecificationsTray1 case / Japan300Number of packages(pcs.)6001 case / exportpackingExport package measurements (mm)369×283×263Soldering ConditionsExample of Reflow Soldering Condition1. Heating methodDouble heating method with infrared heater.2. Temperature measurementThermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.3. Temperature profileA B C D E F G H No. of reflows 260℃230℃180℃150℃ 2 min.max.3s40s 4 min.max. 2 time max.(1)When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot airreflow oven or a type that uses infrared rays in combination with hot air.(2)The temperatures given above are the maximum temperatures at the terminals of the potentiometer when employing a hot air reflow method. The temperature of the PC board and the surface temperature of the potentiometer may vary greatly depending on the PC board material, its size and thickness. Ensure that the surface temperature of the potentiometer does not rise to 250°C or greater.(3)Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.Reference for Hand SolderingTip temperature350±10℃ max.Soldering time3(+1, 0)sNo. of solders 2 timeProduct VarietiesSingle-shaft Type1) Knurled Type Unit : mm Style (Shaft diameter : φ5.975)2) Flat Type Unit : mm Style (Shaft diameter : φ5.975)3) Slotted Type Unit : mm Style (Shaft diameter : φ5.975)Notes are common to this series/models.1. This site catalog shows only outline specifications. When using the products, please obtain formalspecifications for supply.2. Please place purchase orders per minimum order unit (integer).3. Products other than those listed in the above chart are also available. Please contact us for details.4. This products can be used in vehicles.Although these products are designed to perform over a wide operating temperature range, please ensure that you receive and read the formal delivery specifications before use.。

CS1124Dual Variable−Reluctance Sensor Interface ICThe CS1124 is a monolithic integrated circuit designed primarily to condition signals used to monitor rotating parts.The CS1124 is a dual channel device. Each channel interfaces to a Variable Reluctance Sensor, and monitors the signal produced when a metal object is moved past that sensor. An output is generated that is a comparison of the input voltage and the voltage produced at the IN Adj lead. The resulting square−wave is available at the OUT pin.When the DIAG pin is high, the reference voltage at IN Adj is increased. This then requires a larger signal at the input to trip the comparator, and provides for a procedure to test for an open sensor.Features•Dual Channel Capability •Built−In Test Mode•On−Chip Input V oltage Clamping •Works from 5.0 V Supply •Accurate Built−In Hysteresis •Pb−Free Packages are AvailableFigure 1. Block Diagramm Pm PSee detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONMAXIMUM RATINGSRating Value Unit Storage Temperature Range−65 to 150°C Ambient Operating Temperature−40 to 125°C Supply Voltage Range (continuous)−0.3 to 7.0V Input Voltage Range (at any input, R1 = R2 = 22 k)−250 to 250V Maximum Junction Temperature150°C ESD Susceptibility (Human Body Model) 2.0kV Lead Temperature Soldering: Reflow: (SMD styles only) (Note 1)230 peak°C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.60 second maximum above 183°C.ELECTRICAL CHARACTERISTICS (4.5 V < V CC < 5.5 V, −40°C < T A < 125°C, V DIAG = 0; unless otherwise specified.) Characteristic Test Conditions Min Typ Max UnitV CC SUPPLYOperating Current Supply V CC = 5.0 V−− 5.0mA Sensor InputsInput Threshold − Positive V DIAG = LowV DIAG = High 135135160160185185mVmVInput Threshold − Negative V DIAG = LowV DIAG = High −185135−160160−135185mVmVInput Bias Current (INP1, INP2)V IN = 0.336 V−16−11−6.0m A Input Bias Current (DIAG)V DIAG = 0 V−− 1.0m AInput Bias Current Factor (K I) (IN Adj = INP × K I)V IN = 0.336 V, V DIAG = LowV IN = 0.336 V, V DIAG = High−152100155−157%INP%INPBias Current Matching INP1 or INP2 to IN Adj, V IN = 0.336 V−1.00 1.0m AInput Clamp − Negative I IN = −50 m AI IN = −12 mA −0.5−0.5−0.25−0.30VVInput Clamp − Positive I IN = +12 mA 5.07.09.0V Output Low Voltage I OUT = 1.6 mA−0.20.4V Output High Voltage I OUT = −1.6 mA V CC − 0.5V CC − 0.2−V Mode Change Time Delay−0−20m s Input to Output Delay I OUT = 1.0 mA− 1.020m s Output Rise Time C LOAD = 30 pF−0.5 2.0m s Output Fall Time C LOAD = 30 pF−0.05 2.0m s Open−Sensor Positive Threshold V DIAG = High, R IN(Adj) = 40 k. Note 229.45486.9k W Logic InputsDIAG Input Low Threshold−−−0.2 × V CC V DIAG Input High Threshold−0.7 × V CC−−VDIAG Input Resistance V IN = 0.3 × V CC , V CC = 5.0 VV IN = V CC, V CC = 5.0 V 8.08.022227070k Wk W2.This parameter is guaranteed by design, but not parametrically tested in production.PACKAGE PIN DESCRIPTIONPIN #SOIC−8PIN SYMBOLFUNCTION1IN Adj External resistor to ground that sets the trip levels of both channels. Functions for both diagnostic and normal mode 2IN1Input to channel 13IN2Input to channel 24GND Ground5DIAG Diagnostic mode switch. Normal mode is low 6OUT2Output of channel 27OUT1Output of channel 18V CCPositive 5.0 volt supply inputORDERING INFORMATIONDevicePackage Shipping †CS1124YD8SOIC−8 NB 96 Units / Rail CS1124YD8G SOIC−8 NB (Pb−Free)96 Units / Rail CS1124YDR8SOIC−8 NB 96 Units / Rail CS1124YDR8GSOIC−8 NB (Pb−Free)96 Units / Rail†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.m PFigure 2. Application DiagramTHEORY OF OPERATIONNORMAL OPERATIONFigure 2 shows one channel of the CS1124 along with the necessary external components. Both channels share the IN Adj pin as the negative input to a comparator. A brief description of the components is as follows:V RS − Ideal sinusoidal, ground referenced, sensor output − amplitude usually increases with frequency, depending on loading.R RS − Source impedance of sensor.R1/R Adj − External resistors for current limiting and biasing.INP1/IN Adj − Internal current sources that determine trip points via R1/R Adj.COMP1 − Internal comparator with built−in hysteresis set at 160 mV.OUT1 − Output 0 V − 5.0 V square wave with the same frequency as V RS.By inspection, the voltage at the (+) and (−) terminals of COMP1 with V RS = 0V are:V++INP1(R1)R RS)(1)V−+IN Adj R Adj(2) As V RS begins to rise and fall, it will be superimposed on the DC biased voltage at V+.V++INP1(R1)R RS))V RS(3) To get comparator COMP1 to trip, the following condition is needed when crossing in the positive direction,V+u V−)V HYS(4) (V HYS is the built−in hysteresis set to 160 mV), or when crossing in the negative direction,V+t V−*V HYS(5) Combining equations 2, 3, and 4, we get:INP1(R1)R RS))V RS u IN Adj R Adj)V HYS(6) therefore,V RS(+TRP)t IN Adj R Adj*INP1(R1)R RS))V HYS(7)It should be evident that tripping on the negative side is:V RS(−TRP)t IN Adj R Adj*INP1(R1)R RS)*V HYS(8)In normal mode,INP1+IN Adj(9) We can now re−write equation (7) as:V RS(+TR)u INP1(R Adj*R1*R RS))V HYS(10) By makingR Adj+R1)R RS(11) you can detect signals with as little amplitude as V HYS.A design example is given in the applications section.OPEN SENSOR PROTECTIONThe CS1124 has a DIAG pin that when pulled high (5.0 V), will increase the IN Adj current source by roughly 50%. Equation (7) shows that a larger V RS(+TRP) voltage will be needed to trip comparator COMP1. However, if no V RS signal is present, then we can use equations 1, 2, and 4 (equation 5 does not apply in this mode) to get:INP1(R1)R RS)u INP1K I R Adj)V HYS(12) Since R RS is the only unknown variable we can solve for R RS,R RS+INP1K I R Adj)V HYSINP1*R1(13) Equation (13) shows that if the output switches states when entering the diag mode with V RS = 0, the sensor impedance must be greater than the above calculated value. This can be very useful in diagnosing intermittent sensor.INPUT PROTECTIONAs shown in Figure 2, an active clamp is provided on each input to limit the voltage on the input pin and prevent substrate current injection. The clamp is specified to handle ±12 mA. This puts an upper limit on the amplitude of the sensor output. For example, if R1 = 20 k, thenV RS(MAX)+20k12mA+240V Therefore, the V RS(pk−pk) voltage can be as high as 480 V. The CS1124 will typically run at a frequency up to 1.8 MHz if the input signal does not activate the positive or negative input clamps. Frequency performance will be lower when the positive or negative clamps are active. Typical performance will be up to a frequency of 680 kHz with the clamps active.CIRCUIT DESCRIPTIONFigure 3 shows the part operating near the minimum input thresholds. As the sin wave input threshold is increased, the low side clamps become active (Figure 4). Increasing the amplitude further (Figure 5), the high−side clamp becomes active. These internal clamps allow for voltages up to −250 V and 250 V on the sensor side of the setup (with R1 = R2 =22 k) (reference the diagram page 1).Figure 6 shows the effect using the diagnostic (DIAG)function has on the circuit. The input threshold (negative) is switched from a threshold of −160 mV to +160 mV when DIAG goes from a low to a high. There is no hysteresis when DIAG is high.Figure 3. Minimum Threshold OperationIN1, 200 mV/divOUT1, 2.0 V/divFigure 4. Low−Side ClampIN1, 5.0 V/divOUT1, 2.0 V/div20 ms/divFigure 5. Low− and High−Side ClampsIN1, 5.0 V/divOUT1, 2.0 V/divFigure 6. Diagnostic OperationDIAG 5.0 V/div20 ms/divIN11.0 V/divOUT15.0 V/divAPPLICATION INFORMATION Referring to Figure 2, the following will be a designexample given these system requirements:R RS+1.5k W(u12k W is considered open)V RS(MAX)+120V pkV RS(MIN)+250mV pkF VRS+10kHz@V RS(MIN)+40V pk−pk1. Determine tradeoff between R1 value and powerrating. (use 1/2 watt package)P D+ǒ120ǸǓ2R1t1ń2WSet R1 = 15 k. (The clamp current will then be 120/15 k = 8.0 mA, which is less than the 12 mA limit.)2. Determine R AdjSet R Adj as close to R1 + R RS as possible. Therefore, R Adj = 17 k.3. Determine V RS(+TRP) using equation (7).V RS(+TRP)+11m A17k*11m A(15k)1.5k))160m V RS(+TRP)+166mV typical(easily meets250mV minimum)4. Calculate worst case V RS(+TRP)Examination of equation (7) and the spec reveals the worst case trip voltage will occur when:V HYS = 180 mVIN Adj = 16 m AINP1 = 15 m AR1 = 14.25 k (5% low)R Adj = 17.85 k (5% High)V RS(+)MAX+16m A(17.85k)*15m A(14.25k)1.5k))180mV+229mVwhich is still less than the 250 mV minimum amplitude of the input.5. Calculate C1 for low pass filteringSince the sensor guarantees 40 V pk−pk @ 10 kHz, a low pass filter using R1 and C1 can be used to eliminate high frequency noise without affecting system performance.Gain Reduction+0.29V20V+0.0145+*36.7dB Therefore, a cut−off frequency, f C, of 145 Hz could be used.C1v12p f C R1v0.07m FSet C1 = 0.047 m F.6. Calculate the minimum R RS that will be indicated as an open circuit. (DIAG = 5.0 V)Rearranging equation (7) givesR RS+ƪV HYS)[INP1K I R Adj]*V RS(+TRP)ƫINP1*R1 But, V RS = 0 during this test, so it drops out.Using the following as worst case Low and High:Worst Case Low (R RS)Worst Case High (R RS) IN Adj23.6 m A = 15 m A × 1.5710.7 m A = 7.0 m A × 1.53 R Adj16.15 k17.85 kV HYS135 mV185 mVINP116 m A 6.0 m AR115.75 k14.25 kK I 1.57 1.53R RS+135mV)23.6m A16.15k*15.75k+16.5kTherefore,R RS(MIN)+16.5k(meets12k system spec) and,R RS(MAX)+185mV)10.7m A17.85k6.0m A*14.25k+48.4kPACKAGE DIMENSIONSSOIC−8 NBCASE 751−07ISSUE AGNOTES:1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDEMOLD PROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5.DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.6.751−01 THRU 751−06 ARE OBSOLETE. NEWSTANDARD IS 751−07.DIMAMIN MAX MIN MAXINCHES4.805.000.1890.197MILLIMETERSB 3.80 4.000.1500.157C 1.35 1.750.0530.069D0.330.510.0130.020G 1.27 BSC0.050 BSCH0.100.250.0040.010J0.190.250.0070.010K0.40 1.270.0160.050M0 8 0 8N0.250.500.0100.020S 5.80 6.200.2280.244 YM0.25 (0.010)Z S X S____ǒmminchesǓSCALE 6:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*PACKAGE THERMAL DATAParameter SOIC−8NB UnitR q JC Typical45°C/WR q JA Typical165°C/WON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。