LS-BGA829A-31中文资料

8205a芯片参数8205A芯片是一种晶体管型功放，也被称为N-MOSFET晶体管，主要用于单声道音频放大器，功率放大器，电源管理电路等。

其主要特点是功率高、响应速度快、降噪性能好、失真率低、可靠性高等，受到广泛的应用和欢迎。

下面介绍8205A芯片的一些关键参数：1. 负载电阻(RL) - 指芯片输出端的最大负载电阻，超过该值会导致芯片过热、失真、甚至损坏。

对于8205A芯片，其典型输出负载电阻(RL)为8欧姆，最大输出功率为4W。

2. 工作电压(Vdss) - 指芯片能够承受的最大电压值，它取决于芯片的工艺和设计。

8205A芯片的最大工作电压(Vdss)为55V，静态电流(Id)最大可达4A。

3. 输入电容(Ciss) - 指芯片输入端的总电容值，它对于信号传输的带宽和响应速度有极大影响。

8205A芯片的总输入电容(Ciss)为620pF，输出电容(Coss)为140pF。

4. 开关时间(t-on、t-off) - 指芯片在转换工作状态时所需的时间，即开关时间。

开关时间越短，工作状态转换越快，芯片响应速度越快。

8205A芯片的开关时间为20ns。

5. 内部电阻(Rds(on)) - 指芯片工作时的内部电阻值，它能直接影响芯片的能耗和热量产生。

8205A芯片的内部电阻(Rds(on))为45mΩ，可以有效降低功耗和热量产生。

6. 线性失真(LD) - 指芯片在采样信号时产生的非线性变形，会导致输出信号变形和失真。

8205A芯片的线性失真(LD)仅为0.02%，可保持良好的音质。

7. 工作温度范围 - 指芯片正常工作的温度范围。

8205A芯片的工作温度范围为-55℃ ~ 150℃，适用于多种恶劣的工作环境。

总的来说，8205A芯片具备高效、稳定、精确的特点，广泛应用于音频功放、汽车音响和其他需要高保真度的电子设备。

在设计和选型时，需要根据所需的输出功率、输入电压、负载电阻等参数，综合考虑选择最合适的芯片。

ZC829, ZDC833, ZMV829, ZMDC830, ZV831 Series Device DescriptionA range of silicon varactor diodes for use in frequency control and filtering.Featuring closely controlled CV characteristics and high Q.Low reverse current ensures very low phase noise performance.Available in single or dual common cathode format in a wide rage of miniature surface mount packages.Features·Close tolerance C-V characteristics ·High tuning ratio ·Low I R (typically 200pA)·Excellent phase noise performance ·High Q·Range of miniature surface mount packagesApplications·VCXO and TCXO·Wireless communications ·Pagers ·Mobile radio*Where steeper CV slopes are required there is the 12V hyperabrupt range.ZC930, ZMV930, ZV930, ZV931 Series 830 seriesISSUE 6 - JANUARY 20021SILICON 28V HYPERABRUPT VARACTOR DIODES830 seriesISSUE 6 - JANUARY 20022PARTCapacitance (pF)V R =2V,f=1MHzMin Q V R =3V f=50MHzCapacitance RatioC 2/C 20at f=1MHzMIN.NOM.MAX.MIN.MAX.829A 7.388.29.02250 4.3 5.8829B 7.798.28.61250 4.3 5.8830A 9.010.011.0300 4.5 6.0830B 9.510.010.5300 4.5 6.0831A 13.515.016.5300 4.5 6.0831B 14.2515.015.75300 4.5 6.0832A 19.822.024.2200 5.0 6.5832B 20.922.023.1200 5.0 6.5833A 29.733.036.3200 5.0 6.5833B 31.3533.034.65200 5.0 6.5834A 42.347.051.7200 5.0 6.5834B 44.6547.049.35200 5.0 6.5835A 61.268.074.8100 5.0 6.5835B 64.668.071.4100 5.0 6.5836A 90.0100.0110.0100 5.0 6.5836B95.0100.0105.0100 5.06.5TUNING CHARACTERISTICS at Tamb = 25°CPARAMETER SYMBOLMAX UNIT Forward currentI F 200mA Power dissipation at T amb =25ЊC SOT23P tot 330mW Power dissipation at T amb =25ЊC SOD323P tot 330mW Power dissipation at T amb =25ЊC SOD523P tot250mW Operating and storage temperature range-55to +150ЊCABSOLUTE MAXIMUM RATINGSPARAMETERCONDITIONS MIN.TYP.MAX.UNIT Reverse breakdown voltage I R =10uA 25V Reverse voltage leakageV R =20V 0.220nA Temperature coefficient of capacitanceV R =3V,f =1MHz300400ppCm/ЊCELECTRICAL CHARACTERISTICS at Tamb = 25°C830 seriesTYPICAL CHARACTERISTICSISSUE 6 - JANUARY 20023830 seriesISSUE 6 - JANUARY 20024O R D E R C O D E S A N D P A R T M A R K I N GR E E L C O D ER E E L S I Z ET A P E W I D T HQ U A N T I T Y P E R R E E LT A7i n c h (180m m )8m m3000T C13i n c h (330m m )8m m 10000T A P E A N D R E E L I N F O R M A T I O NT h e o r d e r c o d e s a r e s h o w n a s T A w h i c h i s f o r 7i n c h r e e l s .F o r 13i n c h r e e l s s u b s t i t u t e T C i n p l a c e o f T A i n t h e o r d e r c o d e .ISSUE 6 - JANUARY 20025830 seriesSOT23 PACKAGE DIMENSIONSSOD323 PACKAGE DIMENSIONSZetex plcFields New Road ChaddertonOldham, OL9 8NP United KingdomTelephone (44) 161 622 4422Fax: (44) 161 622 4420Zetex GmbHStreitfeldstraße 19D-81673 München GermanyTelefon: (49) 89 45 49 49 0Fax: (49) 89 45 49 49 49Zetex Inc700 Veterans Memorial Hwy Hauppauge, NY11788USATelephone: (631) 360 2222Fax: (631) 360 8222Zetex (Asia) Ltd3701-04Metroplaza, Tower 1Hing Fong Road Kwai Fong Hong KongTelephone: (852) 26100 611Fax: (852) 24250 494These offices are supported by agents and distributors in major countries world-wide.This publication is issued to provide outline information only which (unless agreed by the Company in writing)may not be used,applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned.The Company reserves the right to alter without notice the specification,design,price or conditions of supply of any product or service.For the latest product information,log on to©Zetex plc 2001830 series6ISSUE 6 - JANUARY 2002DIM MILLIMETRES MIN.MAX A ᎏ0.800A10.0000.100A20.6000.800b10.1600.300c 0.0800.220D 0.7000.900E 1.500 1.700E1 1.100 1.300L 0.2000.400L10.1700.230⍜1Њ4Њ10ЊSOD523 PACKAGE DIMENSIONSSOD323 PACKAGE DIMENSIONS。

RT8290A®©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.General DescriptionThe RT8290A is a high efficiency synchronous step-down DC/DC converter that can deliver up to 3A output current from 4.5V to 23V input supply. The RT8290A's current mode architecture and external compensation allow the transient response to be optimized over a wide range of loads and output capacitors. Cycle-by-cycle current limit provides protection against shorted outputs and soft-start eliminates input current surge during start-up. The RT8290A also provides output under voltage protection and thermal shutdown protection. The low current (<3μA)shutdown mode provides output disconnection, enabling easy power management in battery-powered systems. The RT8290A is awailable in an SOP-8 (Exposed Pad)package.3A, 23V, 340kHz Synchronous Step-Down ConverterFeatures●4.5V to 23V Input Voltage Range●1.5% High Accuracy Feedback Voltage ●3A Output Current●Integrated N-MOSFET Switches ●Current Mode Control●Fixed Frequency Operation : 340kHz ●Output Adjustable from 0.925V to 20V ●Up to 95% Efficiency●Programmable Soft-Start●Stable with Low-ESR Ceramic Output Capacitors ●Cycle-by-Cycle Over Current Protection ●Input Under Voltage Lockout ●Output Under Voltage Protection ●Thermal Shutdown Protection ●PSM / PWM Auto-Switched●Thermally Enhanced SOP-8 (Exposed Pad) Package ●RoHS Compliant and Halogen FreeApplications●Industrial and Commercial Low Power Systems ●Computer Peripherals ●LCD Monitors and TVs●Green Electronics/Appliances●Point of Load Regulation of High-Performance DSPs,FPGAs and ASICs.Ordering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝Suitable for use in SnPb or Pb-free soldering processes.G : Green (Halogen Free and Pb Free)Simplified Application CircuitOUTVRT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.RT8290AGSP : Product NumberYMDNN : Date CodeFunctional Pin DescriptionPin Configurations(TOP VIEW)SOP-8 (Exposed Pad)SS BOOT VIN GNDSW FBEN COMPRT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Block DiagramAbsolute Maximum Ratings (Note 1)●Supply Voltage, V IN ------------------------------------------------------------------------------------------−0.3V to 25V●Switching Voltage, SW -------------------------------------------------------------------------------------−0.3V to (V IN + 0.3V)●SW (AC) 30ns-------------------------------------------------------------------------------------------------−5V to 30V●BOOT Voltage -------------------------------------------------------------------------------------------------(V SW − 0.3V) to (V SW + 6V)●The Other Pins ------------------------------------------------------------------------------------------------−0.3V to 6V ●Power Dissipation, P D @ T A = 25°CSOP-8 (Exposed Pad)--------------------------------------------------------------------------------------1.333W ●Package Thermal Resistance (Note 2)SOP-8 (Exposed Pad), θJA ---------------------------------------------------------------------------------75°C/W SOP-8 (Exposed Pad), θJC --------------------------------------------------------------------------------15°C/W ●Junction T emperature ----------------------------------------------------------------------------------------150°C ●Lead Temperature (Soldering, 10 sec.)------------------------------------------------------------------260°C●Storage T emperature Range -------------------------------------------------------------------------------−65°C to 150°C ●ESD Susceptibility (Note 3)HBM (Human Body Model)---------------------------------------------------------------------------------2kV MM (Machine Model)----------------------------------------------------------------------------------------200VRecommended Operating Conditions (Note 4)●Supply Voltage, V IN ------------------------------------------------------------------------------------------4.5V to 23V ●Enable Voltage, V EN -----------------------------------------------------------------------------------------0V to 5.5V●Junction T emperature Range -------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range -------------------------------------------------------------------------------−40°C to 85°CRT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC ismeasured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.Electrical Characteristics(V = 12V, T = 25°C unless otherwise specified)RT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Application CircuitOUT 3.3V/3A VRT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Operating CharacteristicsReference Voltage vs. Temperature0.9100.9150.9200.9250.9300.9350.940-50-25255075100125Temperature (︒C)R e f e r e n c e V o l t a g e (V)Reference Voltage vs. Input Voltage0.9200.9220.9240.9260.9280.9300.9324681012141618202224Input Voltage (V)R e f e r e n c e V o l t a g e (V )Efficiency vs. Output Current01020304050607080901000.010.1110Output Current (A)E f f i c i e n c y (%)Output Voltage vs. Output Current3.203.223.243.263.283.303.323.343.363.383.400.00.30.60.91.21.51.82.12.42.73.0Output current (A)O u t p u t V o l t a g e (V)Frequency vs. Input Voltage3003053103153203253303353403453504681012141618202224Input Voltage (V)F r e q u e n c y (k H z )Frequency vs. Temperature300305310315320325330335340345350-50-25255075100125Temperature (︒C)F r e q u e n c y (k H z )RT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Current Limit vs. Temperature3.03.54.04.55.05.56.06.57.0-50-25255075100125Temprature ( C)C u r r e n t L i m i t (A)Time (5ms/Div)Power On from VIN I L (2A/Div)V IN = 12V, V OUT = 3.3V, I OUT = 3AV IN (5V/Div)V OUT (2V/Div)Power Off from VINTime (5ms/Div)I L (2A/Div)V IN (5V/Div)V OUT (2V/Div)V IN = 12V, V OUT = 3.3V, I OUT = 3ASwitching WaveformTime (1μs/Div)V OUT (10mV/Div)V SW (10V/Div)V IN = 12V, V OUT = 3.3V, I OUT = 3AI L (2A/Div)Load Transient ResponseTime (100μs/Div)I OUT (2A/Div)V OUT(100mV/Div)V IN = 12V, V OUT = 3.3V, I OUT = 0.3A to 3ALoad Transient ResponseTime (100μs/Div)I OUT (2A/Div)V OUT(100mV/Div)V IN = 12V, V OUT = 3.3V, I OUT = 1.5A to 3ART8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Power On from ENTime (10ms/Div)V IN = 12V, V OUT = 3.3V, I OUT = 3AI OUT (2A/Div)V EN (2V/Div)V OUT (2V/Div)Power Off from ENTime (10ms/Div)I OUT (2A/Div)V EN (2V/Div)V OUT (2V/Div)V IN = 12V, V OUT = 3.3V, I OUT = 3ART8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe RT8290A is a synchronous high voltage buck converter that can support the input voltage range from 4.5V to 23V and the output current can be up to 3A.Output Voltage SettingThe resistive voltage divider allows the FB pin to sense the output voltage as shown in Figure 1.Figure 1. Output Voltage SettingThe output voltage is set by an external resistive voltage divider according to the following equation :⎛⎫+ ⎪⎝⎭OUT FB R1V = V 1R2where V FB is the feedback reference voltage (0.925V typ.).External Bootstrap DiodeConnect a 10nF low ESR ceramic capacitor between the BOOT pin and SW pin. This capacitor provides the gate driver voltage for the high side MOSFET .It is recommended to add an external bootstrap diode between an external 5V and the BOOT pin for efficiency improvement when input voltage is lower than 5.5V or duty ratio is higher than 65%. The bootstrap diode can be a low cost one such as 1N4148 or BAT54.The external 5V can be a 5V fixed input from system or a 5V output of the RT8290A. Note that the external boot voltage must be lower than 5.5V.Figure 2. External Bootstrap DiodeOUT OUT L IN V V I =1f L V ⎡⎤⎡⎤∆⨯-⎢⎢⎥⨯⎣⎦⎣⎦Having a lower ripple current reduces not only the ESR losses in the output capacitors but also the output voltage ripple. High frequency with small ripple current can achieve highest efficiency operation. However, it requires a large inductor to achieve this goal.For the ripple current selection, the value of ΔI L = 0.2375(I MAX ) will be a reasonable starting point. The largest ripple current occurs at the highest V IN . To guarantee that the ripple current stays below the specified maximum, the inductor value should be chosen according to the following equation :OUT OUT L(MAX)IN(MAX)V V L =1f I V ⎡⎤⎡⎤⨯-⎢⎥⎢⎥⨯∆⎣⎦⎣⎦Inductor Core SelectionThe inductor type must be selected once the value for L is known. Generally speaking, high efficiency converters can not afford the core loss found in low cost powdered iron cores. So, the more expensive ferrite or mollypermalloy cores will be a better choice.The selected inductance rather than the core size for a fixed inductor value is the key for actual core loss. As the inductance increases, core losses decrease. Unfortunately,increase of the inductance requires more turns of wire and therefore the copper losses will increase.Ferrite designs are preferred at high switching frequency due to the characteristics of very low core losses. So,design goals can focus on the reduction of copper loss and the saturation prevention.Soft-StartThe RT8290A contains an external soft-start clamp that gradually raises the output voltage. The soft-start timing can be programmed by the external capacitor betweenSS pin and GND. The chip provides a 6μA charge current for the external capacitor. If a 0.1μF capacitor is used to set the soft-start, the period will be 15.5ms (typ.).Inductor SelectionThe inductor value and operating frequency determine the ripple current according to a specific input and output voltage. The ripple current ΔI L increases with higher V IN and decreases with higher inductance.RT8290A©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Ferrite core material saturates “hard ”, which means that inductance collapses abruptly when the peak design current is exceeded. The previous situation results in an abrupt increase in inductor ripple current and consequent output voltage ripple.Do not allow the core to saturate!Different core materials and shapes will change the size/current and price/current relationship of an inductor.T oroid or shielded pot cores in ferrite or permalloy materials are small and do not radiate energy. However, they are usually more expensive than the similar powdered iron inductors. The rule for inductor choice mainly depends on the price vs. size requirement and any radiated field/EMI requirements.C IN and C OUT SelectionThe input capacitance, C IN, is needed to filter the trapezoidal current at the source of the high side MOSFET .To prevent large ripple current, a low ESR input capacitor sized for the maximum RMS current should be used. The RMS current is given by :This formula has a maximum at V IN = 2V OUT , whereI RMS = I OUT /2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief.Choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design.For the input capacitor, a 10μF x 2 low ESR ceramic capacitor is recommended. For the recommended capacitor, please refer to table 3 for more detail.The selection of C OUT is determined by the required ESR to minimize voltage ripple.Moreover, the amount of bulk capacitance is also a key for C OUT selection to ensure that the control loop is stable.Loop stability can be checked by viewing the load transient response as described in a later section.The output ripple, ΔV OUT, is determined by :RMS OUT(MAX)I = I OUT L OUT 1V I ESR 8fC ⎡⎤∆≤∆+⎢⎣⎦The output ripple will be highest at the maximum input voltage since ΔI L increases with input voltage. Multiplecapacitors placed in parallel may be needed to meet the ESR and RMS current handling requirement. Dry tantalum,special polymer, aluminum electrolytic and ceramic capacitors are all available in surface mount packages.Special polymer capacitors offer very low ESR value.However, it provides lower capacitance density than other types. Although Tantalum capacitors have the highest capacitance density, it is important to only use types that pass the surge test for use in switching power supplies.Aluminum electrolytic capacitors have significantly higher ESR. However, it can be used in cost-sensitive applications for ripple current rating and long term reliability considerations. Ceramic capacitors have excellent low ESR characteristics but can have a high voltage coefficient and audible piezoelectric effects. The high Q of ceramic capacitors with trace inductance can also lead to significant ringing.Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, V IN . At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at V IN large enough to damage the part.Checking Transient ResponseThe regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. When a load step occurs, V OUT immediately shifts by an amount equal to ΔI LOAD (ESR) and C OUT also begins to be charged or discharged to generate a feedback error signal for the regulator to return V OUT to its steady-state value. During this recovery time, V OUT can be monitored for overshoot or ringing that would indicate a stability problem.RT8290A11DS8290A-01 November 2014©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Thermal ConsiderationsFor continuous operation, do not exceed the maximum operation junction temperature 125°C. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient.The maximum power dissipation can be calculated by following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum operation junction temperature, T A is the ambient temperature and the θJA is the junction to ambient thermal resistance.For recommended operating conditions specification, the maximum junction temperature is 125°C. The junction to ambient thermal resistance θJA is layout dependent. For SOP-8 (Exposed Pad) package, the thermal resistance θJA is 75°C/W on the standard JEDEC 51-7 four-layers thermal test board. The maximum power dissipation at T A = 25°C can be calculated by following formula :P D(MAX) = (125°C − 25°C) / (75°C/W) = 1.333W for SOP-8 (Exposed Pad) packageThe maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA . The derating curve in Figure 3 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation.Layout ConsiderationsFollow the PCB layout guidelines for optimal performance of the RT8290A.❝Keep the traces of the main current paths as short and wide as possible.❝Put the input capacitor as close as possible to the device pins (VIN and GND).❝SW node is with high frequency voltage swing and should be kept in a small area. Keep sensitive components away from the SW node to prevent stray capacitive noise pick-up.❝Place the feedback components as close to the FB pin and COMP pin as possible.❝The GND pin and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection.Figure 3. Derating Curve of Maximum Power DissipationInput capacitor must be placed Figure 4. PCB Layout Guide0.00.20.40.60.81.01.21.41.6255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )RT8290A12DS8290A-01 November 2014 ©Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Table 3. Suggested Capacitors for Cand CRT8290A13DS8290A-01 November 2014Richtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei City Hsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers shouldobtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.Outline DimensionBFHMI(Bottom of Package)8-Lead SOP (Exposed Pad) Plastic Package。

三极管封装：TO-92、TO-92S、TO-92NL、TO-126、TO-251、TO-251A、TO-252、TO-263（3线）、TO-220、T0-3、SOT-23、SOT-143、SOT-143R、SOT-25、SOT-26、TO-50。

电源芯片封装‎：SOT-23、T0-220、TO-263、SOT-223。

以TO-92,T0-3,TO-220,TO-263,SOT-23最常用[attach‎m ent=297]（这是TO-220封装）1、BGA(ball grid array)球形触点陈列‎，表面贴装型封‎装之一。

在印刷基板的‎背面按陈列方‎式制作出球形‎凸点用以代替‎引脚，在印刷基板的‎正面装配LS‎I芯片，然后用模压树‎脂或灌封方法‎进行密封。

也称为凸点陈‎列载体(PAC)。

引脚可超过2‎00，是多引脚LS‎I用的一种封装‎。

封装本体也可‎做得比QFP‎(四侧引脚扁平‎封装)小。

例如，引脚中心距为‎1.5mm 的360 引脚BGA 仅为31mm‎见方；而引脚中心距‎为0.5mm 的304 引脚QFP 为40mm 见方。

而且BGA 不用担心QFP‎那样的引脚变‎形问题。

该封装是美国‎M otoro‎l a 公司开发的，首先在便携式‎电话等设备中‎被采用，今后在美国有‎可能在个人计‎算机中普及。

最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为22‎5。

现在也有一些‎L SI 厂家正在开发‎500 引脚的BGA‎。

BGA 的问题是回流‎焊后的外观检‎查。

现在尚不清楚‎是否有效的外‎观检查方法。

有的认为，由于焊接的中‎心距较大，连接可以看作‎是稳定的，只能通过功能‎检查来处理。

美国Moto‎r ola 公司把用模压‎树脂密封的封‎装称为OMP‎A C，而把灌封方法‎密封的封装称‎为GPAC(见OMPAC‎和GPAC)。

2、BQFP(quad flat packag‎e with bumper‎)带缓冲垫的四‎侧引脚扁平封‎装。

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DcXi_x0im]y v @/\X 5^q50DcXi_v @;5^q p {3K X.p F k Z <c l y DcXi_+0im],S 7z F 5^k i S`[\f Cq p k i ROJ oH y 0im]v @qR P @763459nK l ,|`z n K l 9nK l ,H [9nK l k ,^E,B A E x c *F \{30gm I A >T W T F g T z 80F D 345^s `y V i S 7q40uF 5f RP@303+7D C+d 2z i \D ,`1x 7F v W 19z A ^5f RP@402+7q50{D C >=6<5S 7y +d 2.p 08y X D Jr :0s .,.]K *?\X _~w iU<70vt wl 0mdXf }4X {Z <s A 0jnjPBA32::70ag^PBA32::80ag^PBA32::;0ag^PBA32:;20ag^PBA32:;30ag^G P 2<{2:1451422:v @j C {QUQ v @m ;{4I@1kiYX231X D Jr L }3433v 8{U g 0jnj v @5f>E\vp 9R q;^Pv ,]jnj k ,46+F A L B1CKN +41nvx u 3Y HL R p k +;^|zk H L ko +41|zk A L {p .+;^0jnj k ,HL ko +460jnj +F A\+F 0jnj k ,,]k q H q`p n x S d `{HL BKN U 0+>},s3n S d `{A L R p k +;^z J ,S d c ZHL {p .+463d A \+F ]k q L i `+_l ^E H Ao ~L k ,Pv ,aR u A 3467F \{N s R P @s z i R w k U h :{h N p a i p +d p D c X i _p v 8z ,.]K *?N E h }qR P @9n ;0[3.s ~9i B G A CH e n k T [t Y 7<H rb .o ~k T G A J3.s ~9i B ;0CH e n k T [t Y 7<H >u 8t 9n ;0,A U q z 9Y 7A9n k T B t @A ,A U K34DcXi_{C =/\.z y F q 3N p h,5L B1CKN +41nvx u 3Y HL R p k +;^o 4+:1c ZHL ko +41o 4+:1z 3Y AL R p k +;^q8F q HL ko +41AL {p .+;^q8F q HL k +41HL {p.+;^?+F ,k ,A^E]k q H >E L i `+e nA3465L B1CKN +41nvx u 3Y HL R p k +;^o 4+:1c ZHL ko +41o 4+:1z 3Y A L R p k +;^q8F q HL ko +41A L {p .+;^]?h,HL k +41HL {p .+;^?+F ,k ,A ^E]k q H >E L +=1c @+;^S d L g AL i `+e nA346q8F q {C =y q8F q 3N p h,q8{31A h |:{{3l :F q 3N 5L B1CKN +41nvx u 3Y HL R p k +;^o 4+:1c ZHL ko +41o 4+:1z 3Y AL R p k +;^q8{31A h |:HL ko +41AL {p .+;^?u Z ,k ,H 5HL k +41HL {p .+;^?u Z ,k ,AL ko +u Z k ,[u Z g j g q`p P XB Au Z g j g HL ko +w >46X <A d F \zgm 80C k 2>q .z l [s H{8A z .n3a Y q i `O A z s H B A.z q 80F3u .z y v @qL i `+e nA 3467F \{30q8{3n Ah |:D m N N X D z gm F \ZS `P }[J |A:z i B H F t E d 6q40gm DJ?PF u.Cq GM z 80F 5^B s O ?p G O p R a z u.M T q 50gmA h |:Cq ^J V A z W @k i p7u.M T z 9r u.h,z 80F345^WC y u.M T qD c X i _}R ~}k ~?_~C *z}{~}.~?K *z}ko ~?N s q8F qq8bo F q z ;o z w V S y :f q8F q~T O ~;O~v 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+f <{t c /Af <]k q HL{p .+>=x @A S d H L R p k +>z n ~P B ]2l F}x 2li /B ]L ~+o *M H}x 2li }g B ]L Q +o *M AGAL i `+e nA534]Q {Q Y ]Q E cA w {U g A h A w60d 46H1?c *L >?u 8,G O +>E H1H L U 0+466oH L D ^+46R r H1?z n I \I k -0B+,-C@I k x 0B jkl C@K |B `ab C c q k B n H C H1?@U k H1?q;^Br H1?AE n H H1?i K I z n ~q k B n H C H1?H vH1n H H ,g [L ~@Q +;^z J ,`|HL +-++-H1A K 0H H1q k B ^C |H Gv z n ~q k B n H C H1?HLB c @a @c C +7p n x ;^n H B0+2@1+2CHL Q +;^B1+2CHL u +g [L Q +w >;^B ^C |H HL +-++-H1A G e j \h e \jSQPM320SM@T_\e X KXe Jfl\io0B?Q [w T Tt P j o0dg6g n q 2d y 0Kg50dg5@[X p r *0dg\^E p b C J~/o0Xl`^[ge^h N S 70NLE a ij C {KN5v @m ;{307K@1e\jWkgeg31j\ij137L B1CKN +41nvx u 3Y HL R p k +;^r 6;/96/;c ZHL ko +41r 6;/96/;z 3Y AL R p k +;^i_HL ko +41AL {p .+;^M 4~,H Gh 6NHL k +41L h 6NHf <]k q HL {p .+;^M 4~,H G H L ko +^E A^E]k q HL ko +^E ]_HL R p k +zn u B G H G AL D C 1|c +41H G OS 3Y A \H Gh 6N 3Y u HL D ^+z n H1?H H1N F \sN |\g H >L ko ++-H +-g wBOS NF N |O [sN |HL ko +^E AH1?c *{a =B V m C aR u B 0d 46H1?c *CAf <H G ]k q H >L .]K *+.H G \|~E b {A 3?6o E b {qH G H \B n ,E b{C q;q L H G L BKN U 0+w >6oAL i `+e nA53467\?U },1bJ F W R 1b c1D ,L1B?{a =B h T C q ,c /c cB GH v K w r 6;/4{774:o 79|x 6x{/-167470?2,FsK w k ,\R vK N ,Z j q GH +-h T D L1H]+P 1D v S?U },1b \a B Q 8T h c H [9n U }k ,Hs <41|x 6x 46|x 6x c *HL +-+w >ARNeN<RNeN X DRNeg +H y F \97{30+H Gej\c y RNeN t @HQf v+B M T +g @W P +H d`Zhfif]j 0e\j ]hXd\mfhbz r g f v M T +g /8G {z {+H 2z +g ,[8f v /+H d`Zhfif]j 0e\j ]hXd\mfhbz f 2HQf v N E w o *{.z +H q40R 0,N y t @c K F D C w ~s 7c f @5f z I +i \D v <c f T {qi_{W b a i89R N e NG e j \h e \j38RNeNt @+H |RNeN\6v @+={`]w ;K w |x 6x 2,,1b H ;^B ;@\\T P k 8\\r 6;/4{774:o 79|x 6x{/-167470?\\j}v /.2+z /9</9\\|n j}v /.2+z /9</9<l B \\z 1+9260\\j ..z 1+9/.m 29/-;79?\\U }k ,{Aa]c <f 7>E ~|x 6x ^EU },k ,{q ,c /Ab]3?6o U }k ,{H _Q t y/57</z1+9/.m 29/-;79?6oAr 6;/4{774:o 79|x 6x{/-167470?]5:2K w I L t r 6;/4{774:o 79|x 6x{/-167470?]5:246K w H ;^B w />;C \\B r j 09//C \\B w />;C \\B w />;C \\B w />;C \\l 47:/A2,K w g VAR N e gx a v @{x akb Z @F f y v @5f>E <vp 9R q R H k ,466oc *AL m^nvx +41nvx u 3Y HL R p k +;^|zkc ZHL ko +41nvx z 3Y AL R p k +;^v @8c ZHL ko +41AL {p .p R p k +;^?6o ,k ,HL k ?+-HS ;q k ,\Q dZ P AL mvx q w +|n S d r @[L .+;^x a HLko +416o`{AL R p k +;^c ZAL ko +466oHc *2J H q`XBg jA 34675f>E <vp 9R q ,k ,46J o c *A L m^nvx +41nvx u 3Y HL R p k +;^|zk c ZHL ko +41z 3Y AL {p .p R p k +;^?J o ,k ,HL k ?+-HS ;q k ,Q dZ AL mvx q w +|n S d r @g H ;^J o HL ko +AL {p .+;^v E,j n s r V a Z k ,{Y ;q a Z k ,{g L Q +>41r z k ,{Z AL ko +;@J o Hc *2J H q`XBg jA 3467F \{305RNeN .+d p a i p hN pDJ?PFp v 8yMT eRP@q 40F 5^j _y+d O @q50F 5^=S v @y `N 1`i M T q60{RNeN .F 5^v @x a X D q705f RNeN X D 2z d `,\6+B y B -^z I +y <31RNeN oH q 39v @y b lF \<8X D \e2K >p x a 7T v @z sF D B K >v @k C {s v @A z .q8K >v @{31=S 1h N 1a i v @y K >1kiYX271XggLGIC0ag^1kiYX271XggLGIC0ag^=x a >=K >>kiYX23kiYX24=K >>=x a >v@y b lF\9730G O7.]D C Z y RP@H^C D m D z X\X5^U m7G y e K p G+40pR K z.u `1F4B c c z F D m80^/z n+7y f.i`q4080y RP@H^[Y7S+M z Q m+v r722d?q>=kb+7gm I f y H^e@n@J RP@>^i R_z`9,d5w G O7.]D C Z y3k4B z1D m3U19q50R K+7yF e z kb q p yF e z G O7.]D C Z0g B*HQ y2<R:F TO y z i\D`1B*0g Q1y|2>,z d F\1C D80^/q60RP@+7y v@+g S75^D?Q54S7z M5^LQDP S7y0g z F5^LQDP S7y K>M T q 70d;6{v@0g h\@P.RP@+7z I+i\D T j F y+gv@q80{+g-m c l F y{T hM T2z d F Q S>,M W X X D?z I+,d5+g yc l Q1q9080I f7+g W T z4t mT TK y y+B+g z V X{v@0g/D C2z gm RP@+ 7y=q F n x-F yR_z\D,`1x7c:/X D F T f19q d T>`:+=05 +g B A_6y z i9*K3U W T q:0R K+g yF4l y n/4z3708n M T,n K:C i-q RB z f19D3U c c q F,d5w F y3U5fn6A q;0t+g`1V2<F5c M T/`1r+g_U s[8B*2z t\+g\D|2c m D 3U xE I Y q F\X B>t\M T/`0s B A Y.z5+g*K3U xE q320u`1e K F4B c c z d T>d h j H+u U e K Y+/V~3V;m87k3y@J RP@402e K3q3:。

ad829各部分作用AD829是一款高性能、低噪音全差分放大器，常被用于音频放大、传感器信号放大等应用。

它是ADI（Analog Devices Inc.）公司生产的集成电路，具有许多特性和功能，包括低噪音、高增益、高输入阻抗等。

下面将详细介绍AD829的各个部分的作用及其特点。

1.输入级AD829的输入级是一个全差分放大器，有两个输入引脚：正相位输入（IN+)和反相位输入（IN-）。

它的主要作用是将输入信号转换为差分信号，为后续的放大提供基础。

输入级具有高输入阻抗和低噪音的特点，可以有效地提取输入信号，并最小化干扰。

2.增益控制电路AD829内置了一个可调增益电路，可以通过控制输入级的输入电流来调节放大倍数。

增益控制电路通常由一个电阻网络组成，通过改变阻值来调节增益。

这种可调增益的特性使得AD829非常适用于各种应用场景，可以根据需要灵活地调节放大倍数。

3.差分放大级差分放大级是AD829的核心部分，它负责放大输入信号。

该级别具有高增益和低失真的特点，能够有效地放大差分信号，并保持高信噪比。

差分放大级一般采用双极性晶体管、场效应管等器件搭配，以实现理想的放大效果。

4.输出级AD829的输出级负责将放大后的信号输出到外部负载。

输出级通常采用共射/共漏极放大电路，以提供较大的输出功率，并保持较低的失真。

输出级还可通过调节基极电阻或负载电阻等参数，来适应不同的负载特性。

5.电源管理电路AD829的电源管理电路用于提供稳定可靠的电源供电。

它负责电源滤波、稳压和保护等功能，确保芯片的正常工作。

电源管理电路还可以通过调整偏置电压等参数，来优化整个电路的性能。

6.温度补偿电路AD829内置了温度补偿电路，用于自动调节放大器的增益、输入阻抗和输出阻抗等参数，以保持稳定的性能。

温度补偿电路能够有效地抵消由于温度变化引起的偏移和漂移，提高放大器的稳定性和可靠性。

7.输入和输出保护电路AD829的输入和输出保护电路能够保护芯片免受静电放电、过电压和过电流等损害。

第四章整机原理分析及信号流程介绍第一节微处理器（MCU）控制电路本机的特色就是将MCU也集成于IC201(TMPA8829)内，IC第（6）、（7）脚外接8MHZ晶振，由晶振产生基准时钟，这个时钟信号是识别数据的基础，在电路中对数据进行识别要靠时钟信号来定位，这样才能准确的进行解码。

I2C总线数据包含各种控制信息，它通过第（57）脚数据线SDA和（58）脚时钟线SCL连接IC001（存储器）和TU101（高频调谐器）作为频段和选台等控制。

MCU内接PAL/NTSC/SECAM电路、行场消隐控制、读取ROM/RAM存储器保存数据、控制屏幕文字显示，读取内存数据，像菜单字符、频道号等都被存储在ROM 存储器中，各种变量的值都保存在RAM随机存储器中，其配合外围电路有：IC001储存器（AT24C16）、 Q009和Q010等组成的CPU复位控制、IR001遥控接收器、S1001～S1006按键控制电路等，它们采用I2C总线接口控制和CPU发出相应指令控制。

1、微控制器MCU的特点（原理方框图如图1-1所示）(1)、高速8位CPU(TLCS-870/X系列)。

具有412条指令，寻址方式丰富，指令执行速度快，指令执行时间：0.5uS(时钟8MHz)；具有64K bytes ROM，并有 ROM校正功能； 64 bytes SFR（特殊功能寄存器，包括程序状态字、中断控制字、外设控制字、外设状特字、系统控制字寄存器）；128 bytes DBR（数据缓冲寄存器，包括OSD控制寄存器、遥控信号寄存器）；128 bites GPR（通用寄存器阻，共16组，每组有8×8位寄存器）；2048 bites RAM（数据寄存器与堆栈区）。

（2）、I/O端口* 一路14-bit PWM输出，用于电压合成式高频调谐器的控制。

* 一路7-bit PWM输出* 二路8-bit A/D转换器，用于面板轻触键位信号的输入* 遥控信号预处理端口* 二通道16-bit内部定时器/计数器* 二通道8-bit内部定时器/计数器* 时间基准定时器，Watchdog 定时器* 16个中断源：外部5个，内部11个* I2C总线接口：在芯片内部MCU部分与TV解码部分通过I2C总线通讯，传送控制指令字，读取解码电路的工作状态字。

1、BGA(ball grid array‎)球形触点陈‎列，表面贴装型‎封装之一。

在印刷基板‎的背面按陈‎列方式制作‎出球形凸点‎用以代替引脚，在印刷基板‎的正面装配‎L SI 芯片，然后用模压‎树脂或灌封‎方法进行密‎封。

也称为凸点陈列载体‎(PAC)。

引脚可超过‎200，是多引脚L‎S I 用的一种封‎装。

封装本体也‎可做得比Q‎F P(四侧引脚扁‎平封装)小。

例如，引脚中心距‎为1.5mm 的360 引脚 BGA 仅为31m‎m见方；而引脚中心‎距为0.5mm 的304 引脚QFP‎为40mm‎见方。

而且BGA‎不用担心QF‎P那样的引脚‎变形问题。

该封装是美‎国Moto‎r ola 公司开发的‎，首先在便携‎式电话等设‎备中被采用‎，今后在美国‎有可能在个人计‎算机中普及‎。

最初，BGA 的引脚(凸点)中心距为1‎.5mm，引脚数为2‎25。

现在也有一些LSI‎厂家正在开‎发500 引脚的BG‎A。

BGA 的问题是回‎流焊后的外‎观检查。

现在尚不清‎楚是否有效‎的外观检查‎方法。

有的认为，由于焊接的‎中心距较大‎，连接可以看‎作是稳定的‎，只能通过功‎能检查来处‎理。

美国Mot‎o rola‎公司把用模‎压树脂密封‎的封装称为‎O MPAC‎，而把灌封方‎法密封的封‎装称为GPAC(见OMPA‎C和GPAC‎)。

2、BQFP(quad flat packa‎g e with bumpe‎r)带缓冲垫的‎四侧引脚扁‎平封装。

QFP 封装之一，在封装本体‎的四个角设‎置突起(缓冲垫) 以防止在运送‎过程中引脚‎发生弯曲变‎形。

美国半导体‎厂家主要在‎微处理器和‎A SIC 等电路中采用此封装。

引脚中心距‎0.635mm‎，引脚数从8‎4到196 左右(见QFP)。

3、碰焊PGA‎(butt joint‎pin grid array‎)表面贴装型‎P GA 的别称(见表面贴装‎型PGA)。

w w w .j w l 989.c nA P P i -I A T S J C E R E P A I T R I J S J G35款液晶純賴电路錄点■电压(三)22. JUC 7.820.00181680 型主板（组件号：JUC 6.690.00184729,ZLS 73G i 机芯）逻辑电路（实测机型：长虹43C 1U )23. TP .VST 69T .PB 729 型主板（XB 6A-DT 机芯）逻辑电路（实测机型：长虹32D 2000)24. LCS 46PU 2L 01液晶屏逻辑板(实测机型：长虹55D 2PJ[□景曙光O i o g r a rs25. JUC7.820.00182077 型主板（组件号：JUC6.690.00184516，ZLH74Gi 机芯）逻辑电路（实测机型：长虹43Q3T_LJ7W)26. V390DJ1-CS1 型逻辑板（对应屏型号：V420DK1-LS1Rev.C l,实测机型：长虹 UD42B6000iD)O i a y r a r sw w w.j w l989.c nA T=»F»i_I A.r v l C E：R E T=>A I T R I7S I G27. JUC7.820.00182077 型主板（对应屏型号：C430U15-E4-A(A)、T430QVN03.1>逻辑电路（实测机型：长虹43Q3TLJ7W)328. J U C7.820.00200004 型主板（组件号：JUC6.690.00206632 ,ZLM75G- iDT 机芯 >逻辑电路（实测机型：长虹32D3700i(LJBB> >29. MT4601B02-1-C-2型逻辑板（对应屏型号：TT4761B01 -4,实测机型：三洋 48CE590A1(AM7366M6 主板>>D i a y r a r s T^l30. LQ601R3HB2KM液晶屏逻辑板（实测机型：长虹60D2P>31. T430QVN01.1型逻辑板（对应屏型号：C500U14-E1-A(G1 )_Q2FU,实测机型：长虹50Q2>32. V500HJ1-CE6 型逻辑板（对应屏型号：V580HJ1-LE6 Rev.C l,实测机型：长虹 LED58C3000iD)。

轴承型号字母含义1 内部结构A ——内部设计与标准不同的轴承。

A ——角接触球轴承,接触角为 30度。

A5——角接触球轴承,接触角为 25度。

B ——角接触球轴承,接触角为 40度。

C ——角接触球轴承,接触角为 15度。

C ——圆锥滚子轴承,接触角为 20度。

D ——圆锥滚子轴承,接触角为 28度。

C , CA (带黄铜实体保持架, CD (带冲压保持架——高负载调心滚子轴承。

E ——高负载圆柱滚子轴承。

H ——高负载推力调心滚子轴承。

J ——圆锥滚子轴承的外圈滚道的小端径,角度,外圈宽度与 ISO 规定一致。

(2材料g ——套圈,滚动体为渗碳钢。

H ——套圈,滚动体为不锈钢。

(3保持架M ——铜合金实体保持架。

T ——合成树脂保持架。

W ——冲压保持架。

V ——无保持架。

(4密封圈,防尘盖Z , ZS ——一面带钢板防尘盖。

ZZ , ZZS ——两面带钢板防尘盖。

D , DU ——一面带接触式橡胶密封圈。

DD , DDU ——两面带接触式橡胶密封圈。

V ——一面带非接触式橡胶密封圈。

VV ——两面带非接触式橡胶密封圈。

(5套圈形状K ——圆锥孔,锥度 1:12。

K30——圆锥孔,锥度 1:30。

E ——套圈上有切口或油孔。

E4——外圈上带油槽,油孔。

N ——外圈外径带止动槽。

NR ——外圈外径带止动槽,止动环。

(6配合及衬垫DB ——背靠背成对安装。

DF ——面对面成对安装。

DT ——串联成对安装。

+K——外圈带衬垫。

+L——内圈带衬垫。

+KL——内,外圈带衬垫。

(7游隙C1——向心轴承径向游隙,比 C2游隙小。

C2——向心轴承径向游隙,比标准游隙小。

CN (省略——向心轴承径向标准游隙。

C3——向心轴承径向游隙,比标准游隙大。

C4——向心轴承径向游隙,比 C3游隙大。

C5——向心轴承径向游隙,比 C4游隙大。

CC1——圆柱滚子轴承(不可互换径向游隙,比 CC2游隙小。

CC2——圆柱滚子轴承(不可互换径向游隙,比标准游隙小。

CMOS IC应用手册S-8209A系列的应用示例Rev.1.0_00S-8209A系列是带电量平衡功能的电池保护用IC。

本应用手册是说明有关使用S-8209A系列的具有代表性的电路连接示例的参考资料。

有关产品的详情和规格，请确认该产品的数据表。

使用S-8209A系列可构成以下应用电路。

• 2节以上的多节电池串联保护电路•带电量平衡功能的电池保护电路CMOS IC应用手册S-8209A系列的应用示例Rev.1.0_00目录1. 使用S-8209A系列的多节电池串联保护电路 (3)1.1 电池保护IC的连接示例 (3)1.2 工作说明 (4)1.2.1通常状态 (4)禁止充电状态 (5)1.2.2禁止放电状态 (6)1.2.3电量平衡功能 (7)1.2.4延迟电路 (7)1.2.51.3 时序图 (8)1.3.1过充电检测 (8)过放电检测 (9)1.3.22. 备有过放电状态通信功能的应用电路示例 (10)2.1 电池保护IC的连接示例 (10)2.2 工作说明 (11)2.3 过放电检测的时序图 (12)3. 注意事项 (13)4. 相关资料 (13)CMOS IC应用手册Rev.1.0_00S-8209A系列的应用示例1.使用S-8209A系列的多节电池串联保护电路S-8209A系列可以通过将CTLC、CTLD端子与其他的S-8209A系列CO、DO端子相连，构成多个串联连接电池的保护电路。

1. 1电池保护IC的连接示例图1表示使用S-8209A系列的多节电池串联保护电路示例。

图1注意 1. 上述参数有可能未经预告而更改。

2.上述连接图以及参数仅供参考，并不作为保证工作的依据。

请在进行充分的评价基础上设定实际的应用电路的参数。

CMOS IC应用手册S-8209A系列的应用示例Rev.1.0_001.2工作说明在此说明图1中的使用S-8209A系列的多节电池串联保护电路示例的工作。

1. 2. 1通常状态以下对通常状态下的工作进行说明。

SPARKLEIOT ®深圳市星火思创科技有限公司XH-007L版本V1.02021年10月20日编号：XH007LCN特点⏹芯片特性●内置低功耗32位CPU ，可以兼作应用处理器●主频支持48MHz ●工作电压：1.8V~3.6V ●外设：PWM/UART⏹ZigBee 特性●支持802.15.4MAC/PHY●工作信道11-**********.483GHz ，空口速率250Kbps●最大+10dBm 的输出功率，输出功率动态>35dB●板载PCB 天线，天线增益1.08dBi ●支持硬件加密，支持AES 128模块外设●5xPWM●工作温度范围：-40℃-105℃●模块尺寸：18mm*15mm*3mm ●模块颜色：白色支持网●亚马逊网关系列●三星网关系列●飞利浦网关系列●涂鸦网关系列●Hubitat 网关系列●易微联系列●ZigBee 开源平台等应用场景●球泡灯●灯带●吸顶灯●射灯●其他商用照明和情景照明模块型号名称天线类型XH-007L板载PCB 天线典型应用文档更新说明日期版本更新内容2021-10-20V1.0初次发布目录一.产品概述 (4)二.接口定义 (6)三.外型与尺 (8)四.电气特性 (9)五.射频功耗 (10)六.ZigBee射频特征 (11)七.推荐炉温曲线 (12)八.模块最小系统.........................................................................错误！未定义书签。

九.推荐PCB设计（以XH-C3F为例） (15)十.外围走线建议 (17)免责申明和版权公告 (18)一.产品概述XH-007L模块一颗高集成度的无线射频处理器芯片TLSR8258和少量外围器件构成，内置了802.15.4PHY/MAC Zigbee网络协议栈和丰富的库函数。

ZTU内嵌低功耗的32位CPU内核，1024KB flash，64KB RAM和丰富的外设资源。