118-055;中文规格书,Datasheet资料

Dual-Wire Dual-Operator Programmable Monitor DescriptionThe patented* Desco Dual-Wire Dual-OperatorProgrammable Monitor monitors two operators and two ESD work worksurfaces eliminating the need for periodic Figure 1. Desco 19665 Dual-Wire Dual-Operator Programmable MonitorFeatures and ComponentsTECHNICAL BULLETIN TB-3019Made in theUnited States of AmericaFigure 2. Dual-Wire Dual-Operator Programmable CBDE FG H I J K LFRONT VIEWBACK VIEWOperation1. Monitoring of the operators will remain in the STANDBY condition until a wrist cord is plugged into the operator remote. STANDBY mode is indicated by a blinking yellow operator LED.10mm snap needs to pierce and clinch bottom side of mat. Snap needs to be at least 12" apart or 72" max. 10mm snap needs to pierce and clinch bottom side of mat. Snap needs to be at least 12" apart or 72" max.OPERATOR 1WORKSURFACEOPERATOR 2WORKSURFACE10mm PUSH & CLINCH SNAP10mm PUSH & CLINCH SNAPBENCH GROUNDMAT 1 WIRING WHITE CABLEMAT 2 WIRING BLACK CABLEWRIST STRAP MONITORWRIST STRAP MONITORELECTRIC GROUNDOPERATOR 2REMOTE JACK BLACK CABLEOPERATOR 2REMOTE JACK WHITE CABLE Screw allows ground cord to be bolted to mat; keeps cord from disconnecting.Figure 3. Installing the Dual-Wire Dual-Operator Programmable MonitorororFigure 4. Connecting a dual-wire wrist strap to the operator remoteSETTING THE OPERATOR TEST VOLTAGE AND TEST LIMITThe Dual-Wire Dual-Operator Monitor’s operator test voltage and high test limit can be set to different values. The operator test voltage can be set to either +5V or +8V, and the operator high test limit can be set to either 10 megohms or 35 megohms. The default voltage is +8V, and the default operator high test limit is 10 megohms. These settings are controlled by a set of 3 switches located inside the monitor’s enclosure.NOTE: Desco recommends re-calibration of the monitor should either setting be changed. See the “Calibration” section for more information.To gain access to these switches, remove the monitor’s cover and position the monitor so the PCB matches the orientation shown in Figure 5. Switches SW1 and SW2 control the operator test voltage. Switch SW3 controls the operator high test limit.Operator Test Voltage+5VSW1 Position: RIGHTSW2 Position: LEFT+8VSW1 Position: LEFTSW2 Position: RIGHTOperator High Test Limit10 megohmsSW3 Position: RIGHT35 megohmsSW3 Position: LEFTCalibrationFrequency of recalibration should be based on the critical nature of those ESD sensitive items handled and the risk of failure for the ESD protective equipment and materials. In general, Desco recommends that calibration be performed annually.Use the EMIT 50524 Limit Comparator for Dual-Wire Monitors to perform periodic testing (once every 6-12 months) of the Dual-Wire Dual-Operator Programmable Monitor. The Limit Comparator can be used on the shop floor within a few minutes virtually eliminating downtime, verifying that the monitor is operating within tolerances. See TB-6542 for more information.Figure 5. Switches SW1, SW2 and SW3 inside the monitor’s enclosure Figure 6. EMIT 50524 Limit Comparator for Dual-Wire MonitorsNIST CalibrationDesco provides a basic, National Institute of Standardsand Technology (NIST) traceable calibration for theproducts that we manufacture. This is sometimesreferred to as a Level 1 calibration.For more on National Institute of Standards andTechnology see:/index.htmlFor more information on the calibration that Desco’sprovides for products that we manufacture see:/Calibration.aspxSpecificationsOperating Voltage 12 VDCOperating Temperature 32°F - 104°F (0 - 40°C)Monitor Dimensions 4.4" x 4.7" x 2.1"(11.2cm x 11.9cm x 5.3cm)Monitor Weight 1.1 lbs (0.5 kg)TEST VOLTAGESOperator +8 V** or +5 VWorksurface 200 mVTEST LIMITSOperator Low Fail: < 1.72 megohmsPass: 2 - 9 megohms**High Fail: > 11.5 megohms**orPass: 2 - 30 megohmsHigh Fail: > 40 megohmsWorksurface Pass: < 3.5 megohmsFail: > 3.8 megohms**DefaultFigure 7. Operator Remote dimensionsReplacement remotes are available as EMIT itemnumbers 50525 and 50526.分销商库存信息: DESCO19665。

Data SheetOctober 2, 2009Austin MicroLynx TM SMT Non-isolated Power Modules:3.0Vdc – 5.8Vdc input; 0.75Vdc to4.0Vdc Output; 5A Output Current* UL is a registered trademark of Underwriters Laboratories, Inc. †CSA is a registered trademark of Canadian Standards Association.ApplicationsDistributed power architectures Intermediate bus voltage applications Telecommunications equipment Servers and storage applications Networking equipmentFeaturesCompliant to RoHS EU Directive 2002/95/EC (-Z versions)Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Delivers up to 5A output currentHigh efficiency – 94% at 3.3V full load (V IN = 5.0V) Small size and low profile: 20.3 mm x 11.4 mm x 5.97 mm (0.80 in x 0.45 in x 0.235 in)Low output ripple and noise High Reliability:Calculated MTBF = 19M hours at 25o C Full-load Constant switching frequency (300 kHz) Output voltage programmable from 0.75 Vdc to 4.0Vdc via external resistor Line Regulation: 0.3% (typical)Load Regulation: 0.4% (typical) Temperature Regulation: 0.4 % (typical) Remote On/OffOutput overcurrent protection (non-latching) Wide operating temperature range (-40°C to 85°C)UL * 60950-1Recognized, CSA †C22.2 No. 60950-1-03 Certified, and VDE ‡0805:2001-12 (EN60950-1) LicensedISO** 9001 and ISO 14001 certified manufacturing facilitiesDescriptionThe Austin MicroLynx TM SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to 5A of output current with full load efficiency of 94.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 4.0Vdc over a wide range of input voltage (V IN = 3.0 – 5.8Vdc). Their open-frame construction and small footprint enable designers to develop cost- and space-efficient solutions. Standard features include remote On/Off, programmable output voltage, overcurrent and overtemperature protection.RoHS CompliantAbsolute Maximum RatingsStresses in excess of the absolute maximum ratings can cause permanent damage to the device. These areabsolute stress ratings only, functional operation of the device is not implied at these or any other conditions inexcess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings forextended periods can adversely affect the device reliability.Parameter Device Symbol Min Max UnitInput Voltage All V IN -0.3 5.8 Vdc ContinuousOperating Ambient Temperature All T A -40 85 °C (see Thermal Considerations section)Storage Temperature All T stg -55 125 °CElectrical SpecificationsUnless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.Parameter Device Symbol Min Typ Max UnitOperating Input Voltage V O,set ≤ V IN – 0.5V V IN 3.0 ⎯ 5.8 VdcAdc Maximum Input Current All I IN,max 5.0(V IN= V IN, min to V IN, max, I O=I O, max V O,set = 3.3Vdc)Input No Load Current V O,set = 0.75 Vdc I IN,No load 20 mA (V IN = 5.0Vdc, I O = 0, module enabled) V O,set = 3.3Vdc I IN,No load45 mAInput Stand-by Current All I IN,stand-by0.6 mA(V IN = 5.0Vdc, module disabled)Inrush Transient All I2t 0.04 A2sInput Reflected Ripple Current, peak-to-peak(5Hz to 20MHz, 1μH source impedance; V IN, min toAll 35 mAp-pV IN, max, I O= I Omax ; See Test configuration section)Input Ripple Rejection (120Hz) All 30 dB CAUTION: This power module is not internally fused. An input line fuse must always be used.This power module can be used in a wide variety of applications, ranging from simple standalone operation to beingpart of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, toachieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided inthis data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can beused. Refer to the fuse manufacturer’s data sheet for further information.Electrical Specifications(continued)Parameter Device Symbol Min Typ Max UnitV O, set Output Voltage Set-point All V O, set –2.0 ⎯+2.0 % =25°C)(V IN=IN, min, I O=I O, max, T AV O, set Output Voltage All V O, set –3%⎯+3% %(Over all operating input voltage, resistive load,and temperature conditions until end of life)Adjustment Range All V O 0.7525 4.0 VdcSelected by an external resistorOutput RegulationV O, set Line (V IN=V IN, min to V IN, max) All⎯0.3 %Load (I O=I O, min to I O, max) AllV O, set⎯0.4 %V O, set Temperature (T ref=T A, min to T A, max) All ⎯0.4 %Output Ripple and Noise on nominal output(V IN=V IN, nom and I O=I O, min to I O, maxCout = 1μF ceramic//10μFtantalum capacitors)RMS (5Hz to 20MHz bandwidth) All ⎯10 15 mV rmsPeak-to-Peak (5Hz to 20MHz bandwidth) All ⎯40 50 mV pk-pkExternal CapacitanceESR ≥ 1 mΩ AllC O, max ⎯⎯1000 μFC O, max ⎯⎯3000 μFESR ≥ 10 mΩ AllOutput Current All I o 0 ⎯ 5 AdcOutput Current Limit Inception (Hiccup Mode ) All I O, lim ⎯220 ⎯% I oOutput Short-Circuit Current All I O, s/c ⎯ 2 ⎯Adc(V O≤250mV) ( Hiccup Mode )Efficiency V O,set = 0.75Vdc η79.0 %=25°C V O, set = 1.2Vdc η85.0 % V IN= V IN, nom, T AI O=I O, max , V O= V O,set V O,set = 1.5Vdc η87.0 %V O,set = 1.8Vdc η88.5 %V O,set = 2.5Vdc η92.0 %V O,set = 3.3Vdc η94.0 %V O,set = 4.0Vdc η95.0 %Switching Frequency All f sw ⎯300 ⎯kHzDynamic Load Response(dIo/dt=2.5A/μs; V IN = V IN, nom; T A=25°C) All V pk ⎯130 ⎯mVLoad Change from Io= 50% to 100% ofIo,max; 1μF ceramic// 10 μF tantalumPeak DeviationSettling Time (Vo<10% peak deviation) All t⎯25 ⎯μss(dIo/dt=2.5A/μs; V IN = V IN, nom; T A=25°C) All V pk ⎯130 ⎯mVLoad Change from Io= 100% to 50%of Io,max:1μF ceramic// 10 μF tantalumPeak DeviationSettling Time (Vo<10% peak deviation) All t⎯25 ⎯μssElectrical Specifications(continued)Parameter Device Symbol Min Typ Max UnitResponseDynamicLoad(dIo/dt=2.5A/μs; V V IN = V IN, nom; T A=25°C) All V pk ⎯50 ⎯mVLoad Change from Io= 50% to 100% of Io,max;Co = 2x150 μF polymer capacitorsPeak DeviationSettling Time (Vo<10% peak deviation) All t⎯50 ⎯μss(dIo/dt=2.5A/μs; V IN = V IN, nom; T A=25°C) All V pk ⎯50 ⎯mVLoad Change from Io= 100% to 50%of Io,max:Co = 2x150 μF polymer capacitorsPeak DeviationSettling Time (Vo<10% peak deviation) All t⎯50 ⎯μssGeneral SpecificationsParameter Min Typ Max UnitHours000,000=25°C) 19,Calculated MTBF (I O=I O, max, T AWeight ⎯ 2.8 (0.1) ⎯g (oz.)Feature SpecificationsUnless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.Parameter Device Symbol Min Typ Max UnitRemote On/Off Signal interface(V IN=V IN, min to V IN, max; Open collector pnp or equivalentCompatible, Von/off signal referenced to GNDSee feature description section)Logic Low (On/Off Voltage pin open - Module ON)Von/Off All V IL―― 0.4 V Ion/Off All I IL―― 10 μALogic High (Von/Off > 2.5V – Module Off)Von/Off All V IH――V IN V Ion/off All I IH―― 1 mA Turn-On Delay and Rise Times(I O=I O, max , V IN = V IN, nom, T A = 25 o C, )All Tdelay 3.9 msec Case 1: On/Off input is set to Logic Low (ModuleON) and then input power is applied (delay frominstant at which V IN =V IN, min until Vo=10% of Vo,set)All Tdelay 3.9 msec Case 2: Input power is applied for at least one secondand then the On/Off input is set to logic Low (delay frominstant at which Von/Off=0.3V until Vo=10% of Vo, set)All Trise― 4.2 8.5 msec Output voltage Rise time (time for Vo to rise from 10%of V o,set to 90% of Vo, set)Output voltage overshoot – Startup ― 1 % V O, setI O= I O, max; V IN = 3.0 to 5.8Vdc, T A = 25 o COvertemperature Protection All T⎯150 ⎯°Cref(See Thermal Consideration section)Input Undervoltage LockoutTurn-on Threshold All ⎯ 2.2 ⎯VTurn-off Threshold All ⎯ 2.0 ⎯VCharacteristic CurvesThe following figures provide typical characteristics for the Austin MicroLynx TM SMT modules at 25ºC.E F F I C I E N C Y , η (%)E F F I C I E N C Y , η (%)E F F I C I E N C Y , η (%)E F F I C I E N C Y , η (%)E F F I C I E N C Y , η (%)E F F I C I E N C Y , η (%)(Vout = 1.5Vdc). (Vout = 3.3Vdc).Characteristic CurvesThe following figures provide typical characteristics for the Austin MicroLynx TM SMT modules at 25ºC.E F F I C I E N C Y , η (%)Characteristic Curves (continued)The following figures provide typical characteristics for the Austin MicroLynx TM SMT modules at 25ºC.INPUTCURRENT,IIN(A)INOUTPUTCURRENT,OUTPUTVOLTAGEIO(A)(2A/div)VO(V)(1mV/div)TIME, t (5 μs/div)Figure 8. Input voltage vs. Input Current(Vout = 2.5Vdc).Figure 11. Transient Response to Dynamic LoadChange from 50% to 100% of full load (Vo = 3.3Vdc). OUTPUTVOLTAGEVO(V)(2mV/div)TIME, t (2μs/div) O UTPUTCURRENT,OUTPUTVOLTAGEIO(A)(2A/div)VO(V)(1mV/div)TIME, t (5 μs/div)Figure 9. Typical Output Ripple and Noise(Vin = 5.0V dc, Vo = 0.75 Vdc, Io=5A).Figure 12. Transient Response to Dynamic LoadChange from 100% to 50% of full load (Vo = 3.3 Vdc). OUTPUTVOLTAGEVO(V)(2mV/div)TIME, t (2μs/div) O UTPUTCURRENT,OUTPUTVOLTAGEIO(A)(2A/div)VO(V)(5mV/div)TIME, t (10μs/div)Figure 10. Typical Output Ripple and Noise(Vin = 5.0V dc, Vo = 3.3 Vdc, Io=5A).Figure 13. Transient Response to Dynamic LoadChange from 50% to 100% of full load (Vo = 5.0 Vdc,Cext = 2x150 μF Polymer Capacitors).Characteristic Curves (continued)The following figures provide typical characteristics for the Austin MicroLynx TM SMT modules at 25ºC.O U T P U T C U R R E N T , O U T P U T V O L T A G E I O (A ) (2A /d i v ) V O (V ) (50m V /d i v )TIME, t (10μs/div)O U T P U T V O L T A G E , I N P U T V O L T A G E V o (V ) (1V /d i v ) V I N (V ) (2V /d i v )TIME, t (2 ms/div)Figure 14. Transient Response to Dynamic LoadChange from 100% of 50% full load (Vo = 5.0 Vdc, Cext = 2x150 μF Polymer Capacitors).Figure 17. Typical Start-Up with application of Vin(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 5A).O U T P U T V O L T A G E O n /O f f V O L T A G EV O V ) (1V /d i v ) V O n /o f f (V ) (2V /d i v )TIME, t (2 ms/div)O U T P U T V O L T A G E O n /O f f V O L T A G EV O V ) (1V /d i v ) V O n /o f f (V ) (2V /d i v )TIME, t (2 ms/div)Figure 15. Typical Start-Up Using Remote On/Off (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 5.0A).Figure 18. Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias=1.0Vdc).O U T P U T V O L T A G E O n /O f f V O L T A G E V O V ) (1V /d i v ) V O n /o f f (V ) (2V /d i v )TIME, t (2 ms/div)O U T P U T C U R R E N T ,I O (A ) (5A /d i v )TIME, t (5ms/div)F igure 16. Typical Start-Up Using Remote On/Off withLow-ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 5.0A, Co = 1050μF).Figure 19. Output short circuit Current (Vin = 5.0Vdc, Vo = 0.75Vdc).Characteristic Curves (continued)The following figures provide thermal derating curves for the Austin MicroLynx TM SMT modules.O U T P U T C U R R E N T , I o (A )A O U T P U T C U R R E N T , I o (A )A Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc).Figure 23. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3dc,Vo=0.75 Vdc).O U T P U T C U R R E N T , I o (A )AMBIENT TEMPERATURE, T A CFigure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc).O U T P U T C U R R E N T , I o (A )AFigure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc).分销商库存信息:GEAXH005A0X-SRZ AXH005A0X-SR。

This document was generated on 08/13/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:19011-0036Status:ActiveDescription:InsulKrimp™ Piggyback Quick Disconnect, Tab 6.35 x 0.81mm, 18-22 AWG, Red Insulator, ReelDocuments:Drawing (PDF)Product Specification PS-19902-011 (PDF)Product Specification PS-19902-008 (PDF)RoHS Certificate of Compliance (PDF)Agency CertificationCSA LR18689ULE79133GeneralProduct Family Quick Disconnects Series19011Crimp Quality Equipment YesProduct Name InsulKrimp™Type Quick Disconnect UPC822350948753PhysicalBarrel Type Closed Color - Resin Natural Flammability 94V-0GenderFemale Glow-Wire Compliant No InsulationPVC Lock to Mating Part No Material - Resin PVC Net Weight 1.026/g OrientationStraight Packaging TypeReel Polarized to Mating Part Yes Tab Thickness 0.81mm Tab Width6.35mm Temperature Range - Operating 105°CWire Insulation Diameter 2.79mm max.Wire Size AWG 18, 20, 22Wire Size mm²0.35 - 0.80ElectricalVoltage - Maximum600V AC Material InfoOld Part NumberAA-2301TReference - Drawing NumbersProduct Specification PS-19902-008, PS-19902-011Sales DrawingSD-19011-004Seriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHC Not ReviewedLow-Halogen Status Not ReviewedNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 19011SeriesApplication Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #Crimp Dies for MTA-105 Tape Applicator used in TM-2000™ Press,and ATP-301 Air Crimping Press for Mylar Tape Mounted Terminals0198002120This document was generated on 08/13/2012PLEASE CHECK FOR LATEST PART INFORMATION/分销商库存信息: MOLEX 0190110036。

Philips Semiconductors Product specificationDual diodeBYM359Xfast, high-voltageFEATURESSYMBOLQUICK REFERENCE DATA• Low forward volt drop • Fast switching• Soft recovery characteristic • High thermal cycling performance• Isolated mounting tabGENERAL DESCRIPTIONPINNINGSOT186ACombined damper and modulator PIN DESCRIPTION diodes in an isolated plastic envelope for horizontal deflection in 1damper cathode colour TV and PC monitors.The BYM359X contains diodes 2common anode/cathode with performance characteristics designed specifically for3modulator anode.applications from 16kHz to 56kHz The BYM359X series is supplied in the conventional leaded SOT186A package.LIMITING VALUEST j = 25 ˚C unless otherwise statedDAMPERMODULATOR SYMBOL PARAMETERCONDITIONSMIN MAX MIN MAX UNIT V RSM Peak non-repetitive reverse -1500-800V voltage.V RRM Peak repetitive reverse voltage -1500-600V V RWM Crest working reverse voltage -1300-600V I F(AV)Average forward current sinusoidal;a=1.57-10-8A I F(RMS)RMS forward current-15.7-11.0A I FRM Peak repetitive forward current t=25 µs δ= 0.5-20-16.0A T hs ≤ 83 ˚C I FSMPeak non-repetitive forward t = 10ms -60-60A currentt = 8.3 ms -66-66Asinusoidal;with reapplied V RWM(MAX)T stg Storage temperature-40150-40150˚C T JOperating junction temperature -150-150˚C123casePhilips Semiconductors Product specification Dual diode BYM359X fast, high-voltageISOLATION LIMITING VALUE & CHARACTERISTICThs= 25 ˚C unless otherwise specifiedSYMBOL PARAMETER CONDITIONS MIN.TYP.MAX.UNITVisol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal--2500V three terminals to external waveform;heatsink R.H. ≤ 65% ; clean and dustfreeCisol Capacitance from T2 to external f = 1 MHz-10-pF heatsinkTHERMAL RESISTANCESDAMPER MODULATOR SYMBOL PARAMETER CONDITIONS TYP.MAX.TYP.MAX.UNITRth j-hs Thermal resistance junction to with heatsink- 4.8- 4.8K/W heatsink compoundRth j-a Thermal resistance junction to in free air.55--55K/W ambientSTATIC CHARACTERISTICSTj= 25 ˚C unless otherwise statedDAMPER MODULATOR SYMBOL PARAMETER CONDITIONS TYP.MAX.TYP.MAX.UNITVF Forward voltage IF= 6.5 A 1.1 1.45 1.15 1.55VIF= 6.5 A; Tj= 125˚C 1.05 1.3 1.1 1.45VI R Reverse current VR= VRWM1025010100µAVR= VRWM50500100600µATj= 100 ˚CDYNAMIC CHARACTERISTICSTj= 25 ˚C unless otherwise statedDAMPER MODULATOR SYMBOL PARAMETER CONDITIONS TYP.MAX.TYP.MAX.UNITt rr Reverse recovery time IF= 1 A; VR≥ 30 V;200300125145ns-dIF/dt = 50 A/µsQs Reverse recovery charge 2 A,30 V,20 A/µs 1.2 2.00.50.7µCVfr Peak forward recovery voltage IF= 6.5 A;27-18.0-VdIF/dt = 50 A/µsPhilips Semiconductors Product specificationDual diodeBYM359Xfast, high-voltagePhilips Semiconductors Product specificationDual diodeBYM359Xfast, high-voltagePhilips Semiconductors Product specificationDual diodeBYM359Xfast, high-voltagePhilips Semiconductors Product specificationDual diodeBYM359Xfast, high-voltageMECHANICAL DATANotes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".Philips Semiconductors Product specification Dual diode BYM359X fast, high-voltageDEFINITIONSData sheet statusObjective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.Limiting valuesLimiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections ofthis specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application informationWhere application information is given, it is advisory and does not form part of the specification.Philips Electronics N.V. 1999All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.分销商库存信息: NXPBYM359X-1500,127。

1. Product profile1.1General descriptionPNP high-voltage low V CEsat Breakthrough In Small Signal (BISS) transistor in a mediumpower SOT223(SC-73) Surface-Mounted Device (SMD) plastic package.1.2Features and benefitsHigh voltageLow collector-emitter saturation voltage V CEsat High collector current capability I C and I CM High collector current gain (h FE ) at high I C AEC-Q101 qualifiedMedium power SMD plastic package1.3ApplicationsElectronic ballastsLED driver for LED chain module LCD backlightingAutomotive motor management Flyback convertersHook switch for wired telecomSwitch Mode Power Supply (SMPS)1.4Quick reference data[1]Pulse test: t p ≤300μs; δ≤0.02.PBHV9050Z500 V, 250 mA PNP high-voltage low V CEsat (BISS) transistorRev. 1 — 19 August 2010Product data sheetTable 1.Quick reference data Symbol ParameterConditions Min Typ Max Unit V CESM collector-emitter peak voltageV BE =0--−500V V CEO collector-emitter voltage open base--−500VI C collector current --−0.25Ah FEDC current gainV CE =−10V; I C =−50mA[1]801603002. Pinning information3. Ordering information4. Marking5. Limiting valuesTable 2.PinningPin Description Simplified outline Graphic symbol1base 2collector 3emitter4collector1324sym0282, 41Table 3.Ordering informationType number Package NameDescriptionVersion PBHV9050ZSC-73plastic surface-mounted package with increasedheat sink; 4 leadsSOT223Table 4.Marking codesType number Marking code PBHV9050ZV9050ZTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit V CBO collector-base voltage open emitter -−500V V CEO collector-emitter voltage open base -−500V V CESM collector-emitter peak voltageV BE =0-−500V V EBO emitter-base voltage open collector-−6V I C collector current -−0.25A I CM peak collector current single pulse; t p ≤1ms -−0.5A I BMpeak base currentsingle pulse; t p ≤1ms -−200mA[1]Device mounted on an FR4Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.[2]Device mounted on an FR4PCB, single-sided copper, tin-plated and mounting pad for collector 6cm 2.6. Thermal characteristics[1]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.[2]Device mounted on an FR4PCB, single-sided copper, tin-plated and mounting pad for collector 6cm 2.P tot total power dissipation T amb ≤25°C[1]-700mW [2]-1400mW T j junction temperature -150°C T amb ambient temperature −55+150°C T stgstorage temperature−65+150°CTable 5.Limiting values …continuedIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditions Min Max Unit Table 6.Thermal characteristics Symbol ParameterConditions Min Typ Max Unit R th(j-a)thermal resistance fromjunction to ambient in free air[1]--175K/W [2]--90K/W R th(j-sp)thermal resistance from junction to solder point--20K/W7. Characteristics[1]Pulse test: t p ≤300μs; δ≤0.02.Table 7.CharacteristicsT amb =25°C unless otherwise specified.Symbol ParameterConditionsMin Typ Max Unit I CBOcollector-base cut-off currentV CB =−360V; I E =0A --−100nA V CB =−360V; I E =0A; T j =150°C--−10μA I CES collector-emitter cut-off currentV CE =−360V; V BE =0V --−100nA I EBO emitter-base cut-off current V EB =−5V; I C =0A --−100nAh FEDC current gainV CE =−10V I C =−10mA [1]100160300I C =−50mA [1]80160300I C =−100mA[1]70150-V CEsatcollector-emitter saturation voltageI C =−20mA; I B =−2mA [1]-−115−200mV I C =−50mA; I B =−10mA [1]-−95−200mV I C =−100mA; I B =−20mA[1]-−140−350mV V BEsat base-emitter saturation voltage I C =−50mA; I B =−10mA [1]-−0.75−0.9V t d delay time V CC =−20V; I C =−0.05A; I Bon =−5mA; I Boff =10mA-75-ns t r rise time -1600-ns t on turn-on time -1675-ns t s storage time -1200-ns t f fall time -550-ns t off turn-off time -1750-ns f T transition frequency V CE =−10V;I E =−10mA; f =100MHz -50-MHz C c collector capacitance V CB =−20V; I E =i e =0A; f =1MHz-6-pF C eemitter capacitanceV EB =−0.5V;I C =i c =0A;f =1MHz -170-pF8. Test information8.1Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.9. Package outline10. Packing informationTable 8.Packing methodsThe indicated -xxx are the last three digits of the 12NC ordering code.[1]Type number Package Description Packing quantity10004000 PBHV9050Z SOT2238mm pitch, 12mm tape and reel-115-135[1]For further information and the availability of packing methods, see Section14.11. Soldering12. Revision historyTable 9.Revision historyDocument ID Release date Data sheet status Change notice Supersedes PBHV9050Z v.120100819Product data sheet--分销商库存信息: NXPPBHV9050Z,115。

1.1 1.02012-06-282012-04-01SStSStSStWWWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]H1: Classification Reflow Profile for SMT components:H2: Classification Reflow ProfilesProfile FeaturePreheat- Temperature Min (T smin ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Ramp-up rate (T L to T P )Liquidous temperature (T L )Time (t L ) maintained above T L Peak package body temperature (T p )Time within 5°C of actual peak temperature (t p )Ramp-down rate (T P to T L )Time 25°C to peak temperature Pb-Free Assembly 150°C 200°C60-180 seconds 3°C/ second max.217°C60-150 seconds See Table H320-30 seconds 6°C/ second max.8 minutes max.refer to IPC/JEDEC J-STD-020DH3: Package Classification Reflow TemperaturePB-Free Assembly PB-Free Assembly PB-Free Assembly Package Thickness< 1.6 mm 1.6 - 2.5 mm ≥ 2.5 mmVolume mm³<350260°C 260°C 250°CVolume mm³350 - 2000260°C 250°C 245°CVolume mm³>2000260°C 245°C 245°Crefer to IPC/JEDEC J-STD-020DH Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-GDTof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical reflow soldering specification, otherwise no warranty will be sustai-ned.•Wave soldering is not applicable. Reflow soldering is recommended.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 760301103。