1591XXMFLBK,1591XXMFLGY, 规格书,Datasheet 资料

Bezeichnung :description :Marking = part numberEigenschaften / properties Lerrlaufinduktivität/initial inductance Nenn-Induktivität /33%Umgebungstemperatur / temperature:+20°CWE-Superflux ME08-01-01ME 07-01-01NameDatum / dateÄnderung / modificationVersion 1Version 2 D Prüfgeräte / test equipment :HP 34401 A & Fluke 54II für/for I DC; Luftfeuchtigkeit / humidity:WAYNE KERR 3260B für/for L 0; I SAT Elektrische Eigenschaften / electrical properties :SPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCI.................................................................................................Kontrolliert / approvedWürth Elektronik eiSos GmbH & Co. KGD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Geprüft / checked AIEIW-200Basismaterial / base material:Umgebungstemp. / ambient temperature: -40°C - +100°C F Werkstoffe & Zulassungen / material & approvals :G Eigenschaften / general specifications :Metra HIT 27I für/for R DCE Testbedingungen / test conditions :Würth Elektronik..................................................................................Arbeitstemperatur / operating temperature: -40°C - +150°C Freigabe erteilt / general release:Kunde / customerDraht / wire: blackcoating:not exceed 150°C under worst case operating conditions.http://www.we-online.deDatum / date..................................................................................Unterschrift / signatureIt is recommended that the temperature of the part doesBezeichnung :description :H Induktivitätskurve / Inductance curve :ME08-01-01ME 07-01-01NameDatum / dateSPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCIDATUM / DATE : 2008-01-01Freigabe erteilt / general release:Kunde / customer....................................................................................................................................................................Datum / dateUnterschrift / signature Würth ElektronikVersion 2..............................................................................................................................................Version 1D-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400http://www.we-online.deGeprüft / checked Kontrolliert / approvedÄnderung / modificationWürth Elektronik eiSos GmbH & Co. KGBezeichnung :description :I Temperaturanstieg / Temperature rise curve :ME08-01-01ME 07-01-01NameDatum / dateVersion 1Freigabe erteilt / general release:Kunde / customerGeprüft / checked Kontrolliert / approvedÄnderung / modification...............................................................................................................................................................Datum / dateUnterschrift / signatureWürth ElektronikVersion 2..........................................................................................................................................http://www.we-online.deD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co. KGBezeichnung :description :ME08-01-01ME 07-01-01NameDatum / dateSPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCIFreigabe erteilt / general release:Kunde / customer...................................................................................................................................................................................................................................Version 1Datum / dateUnterschrift / signature Würth ElektronikD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Geprüft / checked Kontrolliert / approvedÄnderung / modificationWürth Elektronik eiSos GmbH & Co. KGVersion 2.................................................................................The Force for tearing off cover tape is 20 to 70 grams in arrow direction150°feeding directionThis electronic component has been designed and developed for usage in general electronic equipment. Before incorporating this component into any equipment where higher safety and reliability is especially required or if there is the possibility of direct damage or injury to human body, for example in the range of aerospace, aviation, nuclear control, submarine, transportation, (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc, Würth Elektronik eiSos GmbH must be informed before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.分销商库存信息: WURTH-ELECTRONICS 744325240。

J201 - J202MMBFJ201 - MMBFJ203P D Total Device DissipationDerate above 25°C 6255.03502.8WmW/°CR q JC Thermal Resistance, Junction to Case125°C/W R q JA Thermal Resistance, Junction to Ambient357556°C/W* Device mounted on FR-4 PCB 1.6” ´1.6” ´0.06"Dimensions in MillimetersJ201 - J202 / MMBFJ201 - MMBFJ203 N-Channel General Purpose AmplifierJ201 - J202 / MMBFJ201 - MMBFJ203Rev. I31TRADEMARKSThe following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use andis not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of Terms ACEx ®Build it Now™CorePLUS™CROSSVOLT ™CTL™Current Transfer Logic™EcoSPARK ®Fairchild ®Fairchild Semiconductor ®FACT Quiet Series™FACT ®FAST ®FastvCore™FPS™FRFET ®Global Power Resource SMGreen FPS™Green FPS™ e-Series™GTO™i-Lo ™IntelliMAX™ISOPLANAR™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MillerDrive™Motion-SPM™OPTOLOGIC ®OPTOPLANAR ®®PDP-SPM™Power220®Power247®POWEREDGE ®Power-SPM™PowerTrench ®Programmable Active Droop™QFET ®QS™QT Optoelectronics™Quiet Series™RapidConfigure™SMART START™SPM ®STEALTH™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™The Power Franchise ®TinyBoost™TinyBuck™TinyLogic ®TINYOPTO™TinyPower™TinyPWM™TinyWire™µSerDes™UHC ®UniFET™VCX™Datasheet Identification Product Status DefinitionAdvance InformationFormative or In DesignThis datasheet contains the design specifications for product development. Specifications may change in any manner without notice.Preliminary First ProductionThis datasheet contains preliminary data; supplementary data will be pub-lished at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontin-ued by Fairchild semiconductor. The datasheet is printed for reference infor-mation only.分销商库存信息: FAIRCHILD MMBFJ201。

MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales RepresentativeMMSZ4686T1G MMSZ4686T1G.。

5.1 5.0 4.02012-06-272012-05-022009-06-30SStSStRStSStCZWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H4: Classification Wave Soldering Profile:H5: Classification Wave ProfileProfile FeaturePreheat- Temperature Min (T smin )- Temperature Typical (T stypical ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Δ preheat to max Temperature Peak temperature (T p )Time of actual peak temperature (t p )Ramp-down rate - Min - Typical - MaxTime 25°C to 25°C Pb-Free Assembly 100°C 120°C 130°C 70 seconds 150°C max.250°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesSn-Pb Assembly 100°C 120°C 130°C 70 seconds 150°C max.235°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesrefer to EN 61760-1:2006H Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SDof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data-sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical wave soldering specification, otherwise no warranty will be sustai-ned.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744710215。

EUROPEBasingstoke, UK +44 1256 812812AUSTRALASIAQueenstown, SA, Australia +61 8 8240 2244CANADAGuelph, Ontario (519) 822-2960St. Laurent, Quebec (514) 343-9010USACheektowaga, NY (716) 651-0086w w w .h a mm o n d mf g .c o m20©Flanged Lid Version - Polystyrene (1591 Series)ACCESSORIESOTHER KEY FEATURES• Electronic instrument enclosures, designed for mounting printed circuit boards.• Designed for applications where the enclosure needs to be easily wall or shelf mounted.• Perfect where extra enclosure security is required by restricting access to lid screws.• Integral card guides accept 1.5 mm (0.062”) P .C. cards.• Two piece lap joint construction provides protection against access of dust and splashing water.• Designed to meet IP54• Molded in economical black polystyrene.• Lid is secured with black self-tapping #4 x 0.5” Philips screws.Unit assembled with self-tappingscrews...Economical black polystyrene material...Lap joint construction...P .C. Board Card Adaptors Allows horizontal mounting of P.C.board(s). See “Accessories Section” for full details!1591Z6 - Package of 61591Z50 - Package of 501591Z100 - Package of 100Replacement Screws Self-tapping type, black oxide,#4 x 0.5”1591TS100BK- Package of 100P .C. board standoffs molded into lid...P .C. Board ScrewsSelf-tapping type, used for bosses in the 1591 lid for P .C. board installation. #4 x 1/4” (6.4 mm)1593ATS50 - Package of 501593ATS100 - Package of 100芯天下--/21w w w .h a m m o n d mf g .c o m©CANADAGuelph, Ontario (519) 822-2960St. Laurent, Quebec (514) 343-9010USACheektowaga, NY (716) 651-0086EUROPEBasingstoke, UK +44 1256 812812AUSTRALASIAQueenstown, SA, Australia +61 8 8240 2244Flanged Lid Version - Polystyrene (1591 Series)For detailed drawings, CAD files and color photos visitour website at:NOTES:- Assembled height = dimension “C” + 0.16” (4.0 mm)- Average wall thickness: 0.08” (2.0 mm)芯天下--/。

SY58016L3.3V, 10Gbps Differential CML Line Driver/Receiver with Internal TerminationMLF and Micro LeadFrame are trademarks of Micrel, Inc.Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • General DescriptionThe SY58016L is a high-speed, current mode logic (CML) differential receiver. It is ideal for interfacing with high frequency sources. It can be used as a Line Receiver, Line Driver, and Limiting Amplifier. The device can be operated from DC to 10Gbps. The input incorporates internal termination resistors, and directly interfaces to a CML logic signal. The output is CML compatible, and includes 50Ω load resistors.Data sheets and support documentation can be found on Micrel’s web site at: .Features• Accepts up to 10.7Gbps data • < 45ps edge rate • Gain ≥ 4V/V• CML/PECL differential inputs • CML outputs • Internal 50Ω input termination • Internal 50Ω output load resistors• Available in die or 16-pin (3mm x 3mm) MLF packageApplications• Backplane buffering• OC-3/OC-192 SONET clock or data distribution/driver • All GigE clock or data distribution/driver • Fibre Channel distribution/driver________________________________________________________________________________________________Package/Ordering InformationPart NumberPackage TypeOperating RangePackage MarkingSY58016LXC DIE 25°C — SY58016LMG MLF-16 Industrial 016L SY58016LMGTR* MLF-16 Industrial016L*Tape and ReelPin DescriptionPin NumberPin NamePin Function1.4D, /D CML, PECL differential inputs with internal 50Ω pull-up resistors.2,3,10,11 VTR Transmission Line Return: Normally connected to the most positive supply. 6, 7, 14, 15 Exposed pad VEE Most negative supply. Exposed pad to be at the same electrical potential as VEE pins.12, 9 Q, /Q CML differential outputs with internal 50Ω pull-up resistors. 5, 8, 13, 16VCCPositive power supply: +3.3V nominal.________________________________________________________________________________________________Functional Block DiagramTypical PerformanceAbsolute Maximum Ratings (1)Supply Voltage (V CC —V EE )..........................................+4.0V Output Voltage (V OUT ).................................Max. V CC +0.5V ............................................................Min. V CC to -1.0V Maximum Input Current (I IN )......................................±25mA Maximum Output Current (I OUT )................................±25mA Lead Temperature (Soldering, 10 sec.).....................220°COperating Ratings (2)Supply Voltage (V IN ) Input Voltage (V CC =0V).........................-1.0V to +0.5V Input Voltage (V EE =0V).............V CC -1.0V to V CC +0.5V Ambient Temperature (T A )...........................-40°C to +85°C Storage Temperature (T S ).........................-65°C to +150°C Package Thermal ResistanceInput Voltage (V CC =0V)................................-1.0V to +0.5V MLF (θJA ) Still Air...........................................................60°C/W 500lfpm..........................................................54°C/W MLF (ψJB) (4)32°Notes:1.Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only, and functional operation is notimplied at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.2. The data sheet limits are not guaranteed if the device is operated beyond the operation ratings.3. The device is guaranteed to meet the CD specifications, show in the table above, after thermal equilibrium has been established. The device is tested in a socket such that transverse airflow of ≥500lfpm is maintained.4.Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.DC Electrical Characteristics (4)V EE = GND; V CC =3.3V ±10%.Symbol ParameterCondition Min Typ MaxUnitsI EE Power Supply Current — 50 75 mA R IN Input Resistance 40 50 60 Ω R OUT Output Source Impedance40 50 60Ω V IH Input HIGH Voltage V CC – 0.9 — V CC VV IL Input LOW Voltage V CC – 1.0 — V CC – 0.1 V V OH Output HIGH VoltageV CC – 0.040V CC – 0.010V CC VV OL Output LOW Voltage (1) — V CC – 0.400V CC – 0.325VV OUT(swing)Output Voltage Swing(1)325 400 — mVp-pNote:1. 50Ω output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition.Input/Output SwingFigure 1. Input/Output SwingAC Electrical CharacteristicsSymbol Parameter Condition Min Typ Max UnitsfMAX Maximum Data Rate 10.7 — — Gbps t PLH t PHL Propagation Delay—100150psRandom Jitter (1) — — 1.5 ps (rms)t JITTER Deterministic Jitter (2) — — 15 ps (pk-pk) V IN Minimum Input Swing (3) 100 — — mVp-pt r, t fOutput Rise/Fall times (20% to 80%)(4)— 30 45 psNotes:1. Measured with a K28.7 comma detect character pattern, measured at 10Gbps. See Figure 2: Eye Diagram.2. Measured with a K28/5 pattern 223-1PRBS pattern at 10Gbps.3.Minimum input swing for which AC parameters are guaranteed. See Figure 1. Reduced input swing will impact maximum data rate and the resulting eye pattern.4. 50Ω load and input swing is more than 100mVp-p.Eye DiagramFigure 2. Eye Diagram16 LEAD Micro LeadFrame™ (MLF-16)分销商库存信息: MICRELSY58016LMI。

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