MAX551BCUB+中文资料

前言感谢您采购与使用技嘉G-MAX TM MA系列计算机产品。

为确保您能安全地使用本产品，请您仔细阅读下列说明Ĉ请务必遵守产品中的标示警告及指示。

拆卸及清理本产品前，切记拔掉电源插头。

在任何情况下，请勿用水擦拭机器内部或浸湿机体。

连接一组装任何外围设备前，请先关闭电源。

本产品须使用标示上所指定的电源种类，如果您不确定使用何种电源，请与您的经销商联络。

May/2002■特色介绍G-MAX TM系列产品，系采用技嘉公司研发设计的主板，为先进的Micro ATX架构设计，让您在Windows操作环境中得心应手。

采用灵巧的Micro ATX机箱设计，不但方便组装与维护，更让您日后升级非常容易！■规格说明产品规格Micro ATX计算机机箱技嘉Micro ATX主板电源供应器DVD-ROM / CD-ROM1.44”软驱Multi I/O Card (以实际出货产品为准)键盘(以实际出货产品为准)附件盒主板使用手册系统组装手册主板驱动程序总线连接线束线带整线夹螺丝包鼠标(以实际出货产品为准)SPDIF连接线(以实际出货产品为准)■系统包装说明图键盘(以实际出货产品为准)保证书及软件接线电源线鼠标(以实际出货产品为准)主机一、机箱■尺寸405(D)mm x 180(W)mm x 352(H)mmG-MAX TM机箱由完全符合美国UL规范的材料制成，设计上考虑到空间的节省和易拆卸性（使用拇指螺丝）。

G-MAX TM机箱中予留2个5.25〞和3个3.5〞驱动设备槽位。

同时还具有电磁防护功能，完全符合计算机的安全标准。

二、主板详细资料请看主板的使用手册。

三、电源供应器本产品采用ATX 250W电源供应器，支持软关机。

电源供应器在出厂时将输入电压设置为230V。

注意:在打开计算机前请确认各国的电压预设值。

四、系统设备安装■安装硬盘将机箱后方的螺丝卸下并将侧板向后推出。

■中央处理器1.先将横杆拉起，再将CPU的斜边处与CPU插座的斜边处对齐，然后将CPU插入主板上的CPU插座。

NCP551SN27T1G NCP551SN28T1G NCV551SN36T1GNCP551, NCV551Voltage Regulator - CMOS,Low Iq, Low-Dropout150 mAThe NCP551 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP551series features an ultra −low quiescent current of 4.0 m A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits.The NCP551 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 m F. The device is housed in the TSOP −5 surface mount package. Standard voltage versions are 1.4, 1.5, 1.8, 2.5, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3,3.6, 3.8 and 5.0 V . Other voltages are available in 100 mV steps.Features•Low Quiescent Current of 4.0 m A Typical •Maximum Operating V oltage of 12 V •Low Output V oltage Option•High Accuracy Output V oltage of 2.0%•Industrial Temperature Range of −40°C to 85°C (NCV551, T A = −40°C to +125°C)•NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC −Q100Qualified and PPAP Capable•These Devices are Pb −Free and are RoHS CompliantTypical Applications•Battery Powered Instruments •Hand −Held Instruments •Camcorders and CamerasFigure 1. Representative Block DiagramV inV outEnable OFFON See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet.ORDERING INFORMATIONTSOP −5(SOT23−5, SC59−5)SN SUFFIX CASE 483PIN CONNECTIONS AND MARKING DIAGRAM13N/CVin 2GND Enable4V out5(Top View)xxxAYW G G xxx = Specific Device Code A = Assembly Location Y = YearW = Work Week G = Pb −Free Package(Note: Microdot may be in either location)PIN FUNCTION DESCRIPTIONPin No.Pin Name Description1V in Positive power supply input voltage.2GND Power supply ground.3Enable This input is used to place the device into low−power standby. When this input is pulled low, thedevice is disabled. If this function is not used, Enable should be connected to V in.4N/C No Internal Connection.5V out Regulated output voltage.MAXIMUM RATINGSRating Symbol Value Unit Input Voltage V in0 to 12V Enable Voltage V EN−0.3 to V in+0.3V Output Voltage V out−0.3 to V in+0.3V Power Dissipation P D Internally Limited W Operating Junction Temperature T J+150°COperating Ambient Temperature NCP551NCV551T A−40 to +85−40 to +125°CStorage Temperature T stg−55 to +150°C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionalityshould not be assumed, damage may occur and reliability may be affected.1.This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MIL−STD−883, Method 3015Machine Model Method 200 VCharge Device Model (CDM) tested C3B per EIA/JESD22−C101.tchup capability (85°C) "100 mA DC with trigger voltage.THERMAL CHARACTERISTICSRating Symbol Test Conditions Typical Value Unit Junction−to−Ambient R q JA 1 oz Copper Thickness, 100 mm2250°C/W PSIJ−Lead 2Y J−L2 1 oz Copper Thickness, 100 mm268°C/W NOTE:Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.ELECTRICAL CHARACTERISTICS(V in = V out(nom.) + 1.0 V, V EN = V in, C in = 1.0 m F, C out = 1.0 m F, T A = 25°C, unless otherwise noted.)Characteristic Symbol Min Typ Max UnitOutput Voltage (T A = 25°C, I out = 10 mA) 1.4 V1.5 V1.8 V2.5 V2.7 V2.8 V2.9 V3.0 V3.1 V3.2 V3.3 V3.6 V3.8 V5.0 V V out1.3581.4551.7462.4252.6462.7442.8422.9403.0383.1363.2343.5283.7244.901.41.51.82.52.72.82.93.03.13.23.33.63.85.01.4421.5451.8542.5752.7542.8562.9583.0603.1623.2643.3663.6723.8765.10VOutput Voltage (T A = T low to T high, I out = 10 mA) 1.4 V1.5 V1.8 V2.5 V2.7 V2.8 V2.9 V3.0 V3.1 V3.2 V3.3 V3.6 V3.8 V5.0 V V out1.3441.4401.7282.4002.6192.7162.8132.9103.0073.1043.2013.4923.6864.8501.41.51.82.52.72.82.93.03.13.23.33.63.85.01.4561.5601.8722.6002.7812.8842.9873.0903.1933.2963.3993.7083.9145.150VLine Regulation (V in = V out + 1.0 V to 12 V, I out = 10 mA)Reg line−1030mV Load Regulation (I out = 10 mA to 150 mA, V in = V out + 2.0 V)Reg load−4065mVOutput Current (V out = (V out at I out = 100 mA) −3%)1.4 V−2.0 V (V in = 4.0 V)2.1 V−3.0 V (V in = 5.0 V)3.1 V−4.0 V (V in = 6.0 V)4.1 V−5.0 V (V in = 8.0 V)I o(nom.)150150150150−−−−−−−−mADropout Voltage (I out = 10 mA, Measured at V out−3.0%)1.4 V1.5 V, 1.8 V,2.5 V2.7 V, 2.8 V, 2.9 V,3.0 V, 3.1 V, 3.2 V, 3.3 V, 3.6 V, 3.8 V, 5.0 V V in−V out−−−17013040250220150mVQuiescent Current(Enable Input = 0 V)(Enable Input = V in, I out = 1.0 mA to I o(nom.))1.4 V−2.0 V options, V in = 4.0 V2.1 V−3.0 V options, V in = 5.0 V3.1 V−4.0 V options, V in = 6.0 V4.1 V−5.0 V options, V in = 8.0 V I Q−−0.14.01.08.0m AOutput Voltage Temperature Coefficient T c−"100−ppm/°CEnable Input Threshold Voltage(Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low)V th(en)1.3−−−−0.3VELECTRICAL CHARACTERISTICS (continued)(V in = V out(nom.) + 1.0 V, V EN = V in , C in = 1.0 m F, C out = 1.0 m F, T A = 25°C, unless otherwise noted.)Output Short Circuit Current (V out = 0 V)1.4 V −2.0 V (V in = 4.0 V)2.1 V −3.0 V (V in = 5.0 V)3.1 V −4.0 V (V in = 6.0 V)4.1 V −5.0 V (V in = 8.0 V)I out(max)160160160160350350350350600600600600mA3.Maximum package power dissipation limits must be observed.PD +T J(max)*T A R q JA4.Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.5.NCP551T low = −40°CT high = +85°C NCV551T low = −40°CT high = +125°C.DEFINITIONSLoad RegulationThe change in output voltage for a change in output current at a constant temperature.Dropout VoltageThe input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Power DissipationThe maximum total dissipation for which the regulator will operate within its specifications.Quiescent CurrentThe quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected.Line Transient ResponseTypical over and undershoot response when input voltage is excited with a given slope.Thermal ProtectionInternal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.Maximum Package Power DissipationThe maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current.3.25G R O U N D C U R R E N T (m A )3.05Figure 2. Ground Pin Current versusOutput Current 3.35I out , OUTPUT CURRENT (mA)3.33.13.23.15Figure 3. Ground Pin Current versusOutput Current3.35G R O U N D C U R R E N T (m A )3.153.45I out , OUTPUT CURRENT (mA)3.43.23.33.250.50Figure4. Ground Pin Current versusInput Voltage V in , INPUT VOLTAGE (VOLTS)Figure 5. Ground Pin Current versusInput VoltageG R OU N D P I N C U R R E N T (m A )11.522.533.540.50V in , INPUT VOLTAGE (VOLTS)G R OU N D P I N C U R R E N T (m A )11.522.533.5440004−200200−60064200TIME (m s)Figure 6. Line Transient Response Figure 7. Line Transient Response8TIME (m s)−20004006−400−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )4−−4200TIME (m s)Figure 8. Line Transient Response Figure 9. Line Transient ResponseTIME (m s)−20004006−−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )−600−−4200Figure 10. Line Transient Response Figure 11. Line Transient ResponseTIME (m s)−20004006−−400O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )O U T P U T V O L T A G E D E V I A T I O N (m V )V i n , I N P U T V O L T A G E (V )−600600800TIME (m s)150O U T P U T V O L T A G E D E V I A T I O N (m V )−1000TIME (ms)Figure 12. Load Transient Response ON Figure 13. Load Transient Response OFFTIME (ms)−50000I o u t , O U T P U T C U R R E N T (m A )−O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )Figure 14. Load Transient Response OFF TIME (ms)Figure 15. Load Transient Response ONTIME (ms)150−5005000−−01000O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )O U T P U T V O L T A G E D E V I A T I O N (m V )I o u t , O U T P U T C U R R E N T (m A )12Figure 16. Turn −On Response 3TIME (m s)0132V o u t , O U T P U T V O L T A G E (V )E N A B L E V O L T A G E (V )Figure 17. Turn−On ResponseTIME (m s)V o u t , O U T P U T V O L T A G E (V )E N A B L E V O L T A G E(V )Figure 18. Output Voltage versus Input Voltage Figure 19. Output Voltage versus Input Voltage2V o u t , O U T P U T V O L T A G E (V O L T S )3V in , INPUT VOLTAGE (VOLTS)2.50.51.51V o u t , O U T P U T V O L T A G E (V O L T S )V in , INPUT VOLTAGE (VOLTS)APPLICATIONS INFORMATIONA typical application circuit for the NCP551 series is shown in Figure 20.Input Decoupling (C1)A 0.1 m F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP551package. Higher values and lower ESR will improve the overall line transient response.Output Decoupling (C2)The NCP551 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m W up to 3.0 W can thus safely be used.The minimum decoupling value is 0.1 m F and can be augmented to fulfill stringent load transient requirements.The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response.Enable OperationThe enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to V in .HintsPlease be sure the V in and GND lines are sufficiently wide.When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction.Set external components, especially the output capacitor,as close as possible to the circuit, and make leads as short as possible.ThermalAs power across the NCP551 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature effect the rate of temperature rise for the part.This is stating that when the NCP551 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications.The maximum dissipation the package can handle is given by:PD +T J(max)*T AR q JAIf junction temperature is not allowed above the maximum 125°C, then the NCP551 can dissipate up to 400 mW @ 25°C.The power dissipated by the NCP551 can be calculated from the following equation:P tot +ƪV in *I gnd (I out )ƫ)[V in *V out ]*I outorV inMAX +P tot)V out *I outI GND )I outIf a 150 mA output current is needed then the ground current from the data sheet is 4.0 m A. For an NCP551SN30T1 (3.0 V), the maximum input voltage will then be 5.6 V .Battery or Unregulated VoltageFigure 20. Typical Application CircuitOFFONm FFigure 21. Current Boost RegulatorFigure 22. Current Boost Regulator withShort Circuit LimitFigure 23. Delayed Turn −onFigure 24. Input Voltages Greater than 12 VThe NCP551 series can be current boosted with a PNP transist-or. Resistor R in conjunction with V BE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by V BE of the pass resistor.Short circuit current limit is essentially set by the V BE of Q2 and R1. I SC = ((V BEQ2 − ib * R2) / R1) + I O(max) RegulatorIf a delayed turn −on is needed during power up of several volt-ages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn −on of the bottom regulator.A regulated output can be achieved with input voltages that exceed the 12 V maximum rating of the NCP551 series with the addition of a simple pre −regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (V out ) is shorted to GND .ORDERING INFORMATIONDeviceNominalOutput Voltage Marking Package Shipping†NCP551SN15T1G 1.5LAO TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN18T1G 1.8LAP TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN25T1G 2.5LAQ TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN27T1G 2.7LAR TSOP−5(Pb−Free)3000 / Tape & Reel NCP551SN28T1G 2.8LAS TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN29T1G 2.9LJL TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN30T1G 3.0LAT TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN31T1G 3.1LJM TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN32T1G 3.2LIV TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN33T1G 3.3LAU TSOP−5(Pb−Free)3000 / Tape & ReelNCP551SN50T1G 5.0LAV TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN14T1G* 1.4AAT TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN15T1G* 1.5LFZ TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN18T1G* 1.8LGA TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN25T1G* 2.5LGB TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN27T1G* 2.7LGC TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN28T1G* 2.8LGD TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN30T1G* 3.0LGE TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN31T1G* 3.1LJR TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN32T1G* 3.2LFR TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN33T1G* 3.3LGG TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN36T1G* 3.6AEJ TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN38T1G* 3.8AD5TSOP−5(Pb−Free)3000 / Tape & ReelNCV551SN50T1G* 5.0LGF TSOP−5(Pb−Free)3000 / Tape & ReelNOTE:Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specific-ations Brochure, BRD8011/D.*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.PACKAGE DIMENSIONSTSOP −5SN SUFFIX CASE 483−02ISSUE KNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLDFLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A.5.OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION.TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2FROM BODY .DIM MIN MAX MILLIMETERS A 3.00 BSC B 1.50 BSC C 0.90 1.10D 0.250.50G 0.95 BSC H 0.010.10J 0.100.26K 0.200.60M 0 10 S2.503.00__ǒmm inchesǓ*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*2XDETAIL ZTOP VIEWON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at /site/pdf/Patent −Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONNCP551SN27T1G NCP551SN28T1G NCV551SN36T1G。

MAX-1000 矩阵系统用户手册HONEYWELL Co,. Ltd.目录1．综述1.1 简介1.2 CCTV键盘1.3 模拟操作面板1.4 其它设备1.5 本手册所作的前提假定1.6 本手册所用的惯例击键数字范围注意要点监示器信息1.7 厂商联络方式1.8 商标注明2 启动2.1 输入你的选择号码,怎样和为什么?2.2 监示器选择2.3 摄像机选择2.4 PTZ摄像机控制2.5 VCR选择2.6 CCTV键盘控制VCR2.7 摄像机录像2.8 辅助装置和复用器3 扫描序列的使用3.1 什么是扫描序列?什么是扫描序列3.2 启动扫描序列3.3 中止扫描序列3.4 暂停扫描序列3.5 产生新的扫描序列3.6 扫描序列的编辑用新的摄像机选择进行替换删除该摄像机选择插入新的摄像机选择3.7 改变停顿周期3.8 为一个摄像机增加停顿4 宏语言的使用4.1 什么是宏程序?齐投摄像机选择摄像机漫游自动控制4.2 宏语言的执行4.3 产生一个新的宏程序4.4 宏程序的删除4.5 我能编辑一个宏程序吗?5 警报管理5.1 什么是警报?5.2 外部警报输入5.3 摄像机故障警报视频丢失低电平视频5.4 PTZ解码箱故障警报5.5 PTZ解码箱防拆警报5.6 VCR警报5.7 其它装置警报5.8 警报堆栈5.9 在警报堆栈上移位5.10 清除警报6 键盘的其它功能6.1 快速摄像机选择6.2 设置摄像机视场(PTZ预置位) 6.3 调用摄像机视场(PTZ预置位) 6.4 摄像机PTZ复位6.5 选择代用摄像机6.6 隐藏显示的字符6.7 显示SMARTEXTTM7 菜单系统7.1 什么是菜单系统?访问菜单系统退出菜单系统7.2 从菜单上选择移动菜单进入窗口7.3 键盘操作员登记7.4 键盘操作员注销7.5 激活／中止视频输入中止一个摄像机激活一个摄像机7.6 锁定／释放视频输入控制锁定一个PTZ摄像机释放一个PTZ摄像机锁定／释放一个PTZ摄像机7.7 锁定／释放视频输出选项锁定视频输出选项释放视频输出选项锁定／释放视频输出选项7.8 中止／激活警报输入中止警报输入激活警报输入9.3 字符显示定时9.4 监示器黑屏9.5 黑屏暂停9.6 监示器访问9.7 操作员对系统的访问9.8 操作员的级别划分9.9 CCTV键盘定时9.1 0 自动注销9.11 摄像机故障检测视频丢失低电平视频1 0 排除提示10.1 摄像机选择第一章概述1.1简介MAX一1000 CCTV管理系统是一个强功能的计算机控制视频切换矩阵。

BC556/557/558/559/560 SILICON TRANSISTORSWITCHING AND AMPLIFIER• HIGH VOLTAGE: BC556, V CEO = -65V • LOW NOISE: BC559, BC560• Complement to BC546 ... BC 550ABSOLUTE MAXIMUM RATINGS (T A =25°C)ELECTRICAL CHARACTERISTICS (T A =25°C)h FE CLASSIFICATIONCharacteristicSymbol RatingUnitCollector-Base Capacitance: BC556: BC557/560: BC558/559Collector-Emitter Voltage: BC556: BC557/560: BC558/559Emitter-Base Voltage Collector Current (DC)Collector Dissipation Junction Temperature Storage TemperatureV CBOV CEOV EBO I C P C T J T STG-80-50-30-65-45-30-5-100500150-65 ~ 150V V VV V V V mA mW °C °C CharacteristicSymbol Test Conditions Min Typ Max Unit Collector Cut-off Current DC Current GainCollector Emitter Saturation Voltage Collector Base Saturation Voltage Base Emitter On Voltage Current Gain Bandwidth Product Collector Base CapacitanceNoise Figure : BC556/557/558 : BC559/560: BC559 : BC560I CBO h FEV CE (sat)V BE (on)V BE (on)f T C CBO NF NFV CB = -30V, I E =0V CE = -5V, I C =2mA I C = -10mA, I B = -0.5mA I C = -100mA, I B = -5mA I C = -10mA, I B = -0.5mA I C = -100mA, I B = -5mA V CE = -5V, I C = -2mA V CE = -5V, I C = -10mA V CE = -5V, I C = -10mA V CB = -10V, f=1MHz V CE = -5V, I C = -200µA f=1KHz, R G =2K ΩV CE = -5V, I C = -200µA R G =2K Ωf=30~15000MHz110-600-90-250-700-900-660150211.21.2-15800-300-650-750-800610442nA mV mV mV mV mV mV MHz pF dB dB dB dBClassificationA B C h FE110-220200-450420-800TO-921. Collector2. Base3. Emitter©1999 Fairchild Semiconductor CorporationRev. BBC556/557/558/559/560 SILICON TRANSISTORTRADEMARKSACEx™CoolFET™CROSSVOLT™E 2CMOS TM FACT™FACT Quiet Series™FAST ®FASTr™GTO™HiSeC™The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.As used herein:ISOPLANAR™MICROWIRE™POP™PowerTrench™QS™Quiet Series™SuperSOT™-3SuperSOT™-6SuperSOT™-8TinyLogic™1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status Definition Advance InformationPreliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Formative or In DesignFirst ProductionFull ProductionNot In ProductionDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.。

芯片pn551a参数全文共四篇示例，供读者参考第一篇示例：芯片PN551A是一款高性能、多功能的芯片，在电子产品中广泛应用。

它具有很多强大的参数和功能，下面我们来详细介绍一下它的各项参数。

芯片PN551A的尺寸为5mm x 5mm x 1mm，非常小巧，适合安装在各种小型电子产品中。

它采用了先进的工艺技术，具有高度集成的芯片结构，同时具备了高性能的处理能力和低功耗的特点。

芯片PN551A支持多种接口协议，包括I2C、SPI和UART等，使得它能够与不同类型的主控芯片进行通信，实现更加灵活的应用场景。

它还支持多种传输速率，可以满足不同产品的通信需求。

芯片PN551A具有丰富的功能模块，包括蓝牙、射频、NFC、USB等，涵盖了多种无线通信方式，能够实现蓝牙音频传输、数据传输、支付功能等多种应用场景。

它还具有强大的数据处理能力，能够实现实时的数据传输和处理，使产品性能更加优越。

芯片PN551A还具有丰富的安全功能，包括身份认证、加密解密、随机数生成等多种安全机制，可以保护产品的数据安全。

它还支持多种电源管理模式，能够实现低功耗的工作状态，延长产品的使用时间。

芯片PN551A是一款具有多项强大参数和功能的芯片，适用于各种小型电子产品中，能够满足不同需求的设计要求。

它具有高性能、低功耗、丰富的功能模块、多种通信接口、强大的数据处理能力和安全功能等特点，是一款非常值得推荐的芯片。

第二篇示例：芯片PN551A采用的是32位ARM Cortex-M4内核，运行主频可达到100MHz。

这样的高性能处理器可以保证芯片在进行复杂计算和数据处理时能够快速高效地完成任务。

低功耗设计也是芯片PN551A 的特点之一，可以在保证性能的同时延长电池续航时间，提高产品的使用体验。

芯片PN551A内置了多种接口和外设模块，例如USB接口、SPI 接口、I2C接口等，可以方便地与外部设备进行通信和数据交换。

芯片还内置了丰富的模拟和数字引脚，可以满足各种外部传感器和器件的连接需求。

Features• BV CEO > -45V, -60V & -80V• I C = -1A Continuous Collector Current • I CM = -2A Peak Pulse Current• Low Saturation Voltage V CE(sat) <************• Gain Groups 10 and 16• Complementary NPN Types: BCX54, 55, and 56• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen- and Antimony-Free. "Green" Device (Note 3)•For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAPcapable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https:///quality/product-definitions/Mechanical Data• Case: SOT89• Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020•Terminals: Matte Tin Finish Leads; Solderable per MIL-STD-202 Method 208•Weight: 0.052 grams (Approximate)Applications • Medium Power Switching or Amplification Applications • AF Driver and Output StagesOrdering Information (Note 4)Product Compliance Marking Reel Size (inches)Tape Width (mm)Quantity per ReelBCX51TA Standard AA 7 12 1,000 BCX51-13R Standard AA 13 12 4,000 BCX5110TA Standard AC 7 12 1,000 BCX5116TA Standard AD 7 12 1,000 BCX5116TC Standard AD 13 12 4,000 BCX52TA Standard AE 7 12 1,000 BCX5210TA Standard AG 7 12 1,000 BCX5216TA Standard AM 7 12 1,000 BCX53TA Standard AH 7 12 1,000 BCX5310TA Standard AK 7 12 1,000 BCX5316TA Standard AL 7 12 1,000 BCX5316TC Standard AL 13 12 4,000 BCX5316-13R Standard AL 13 12 4,000 BCX5110TC Standard AC 13 12 4,000 BCX51TC Standard AA 13 12 4,000 BCX5210TC Standard AG 13 12 4,000 BCX5216TC Standard AM 13 12 4,000 BCX52TC Standard AE 13 12 4,000 BCX5310TC Standard AK 13 12 4,000 BCX53TCStandardAH13124,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.2. See https:///quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at https:///design/support/packaging/diodes-packaging/.Top View Device SymbolTop View Pin-Out SOT89E C BMarking InformationAbsolute Maximum Ratings (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol BCX51 BCX52 BCX53 Unit Collector-Base Voltage V CBO -45 -60 -100 V Collector-Emitter Voltage V CEO -45-60 -80V Emitter-Base Voltage V EBO -5 V Continuous Collector CurrentI C -1 A Peak Pulse Collector Current (Single pulse) I CM -2 Continuous Base CurrentI B -100 mAPeak Pulse Base Current (Single pulse) I BM-200Thermal Characteristics (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol Value Unit Power Dissipation(Note 5) P D1 W(Note 6) 1.5 (Note 7) 2.0 Thermal Resistance, Junction to Ambient Air (Note 5) R θJA 125 °C/W (Note 6) 83 (Note 7)60 Thermal Resistance, Junction to Lead (Note 8) R θJL 13 °C/W Thermal Resistance, Junction to Case (Note 9)R θJC 27 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150°CESD Ratings (Note 10)CharacteristicSymbol Value Unit JEDEC ClassElectrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine ModelESD MM400VCNotes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.8. Thermal resistance from junction to solder-point (on the exposed collector pad).9. Thermal resistance from junction to the top of the case.10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.xx = Product Type Marking Code, as follows:BCX51 = AA BCX52 = AEBCX53 = AH BCX5110 = AC BCX5210 = AG BCX5310 = AK BCX5116 = AD BCX5216 = AMBCX5316 = ALThermal Characteristics and Derating Information2550751001251500.00.20.40.60.81.0Derating CurveTemperature (°C) M a x P o w e r D i s s i p a t i o n (W )Transient Therm al Im pedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x P o w e r D i s s i p a t i o n (W )Copper Area (sqmm)M a x i m u m P o w e r (W )Copper Area (sqmm)T h e r m a l R e s i s t a n c e (°C /W )Note:11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.Typical Electrical Characteristics (@ T A = +25°C, unless otherwise specified.)-I , COLLECTOR CURRENT (A)C h ,D C C U R RE N T G A I NF E Fig. 2 Typical DC Current Gain vs. Collector CurrentDC Current Gain vs. Collector Current -V , COLLECTOR-EMITTER VOLTAGE (V)CE I , C O L L E C T O R C U R R E N T (A )CFig. 1 Typical Collector Current vs. Collector-Emitter VoltageCollector Current vs. Collector-Emitter Voltage -h FE V I CI C V V CETypical Electrical Characteristics (continued.)0.20.40.60.81.0-V , B A S E -E M I T T E R T U R N -O N V O L T A G E (V )B E (O N)-I , COLLECTOR CURRENT (A)C -V , C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E (V )C E (S A T )Fig. 4 Typical Collector-Emitter Saturation Voltagevs. Collector Current 0.20.40.60.81.01.2-V , B A S E -E M I T T E R S A T U R A T I O N V O L T A G E (V B E (S AT )-I , COLLECTOR CURRENT (mA)C f , G A I N -B A ND W I D T H P R O D U C T (M H z )T Fig. 6 Typical Gain-Bandwidth Product vs. Collector Current V , REVERSE VOLTAGE (V)R C A P A C I T A N C E (p F )Fig. 7 Typical Capacitance Characteristics -V B E (s a t ), B A S E -E M I T T E R S A T U R A T I O N V O L T A G E )-V B E (o n ), B A S E -E M I T T E R T U R N -O N V O L T A G E (V )-V C E (s a t ) , C O L L E C T O R -E M I T T E RC v V RVCE(sat) V I Cf T V I CPackage Outline DimensionsPlease see /package-outlines.html for the latest version.SOT89SOT89Dim Min Max TypA 1.40 1.60 1.50B 0.50 0.62 0.56B1 0.42 0.540.48c 0.35 0.43 0.38D 4.40 4.60 4.50D1 1.62 1.83 1.733D2 1.61 1.81 1.71E 2.40 2.60 2.50E2 2.05 2.35 2.20e - - 1.50H 3.95 4.25 4.10H1 2.63 2.93 2.78L 0.90 1.20 1.05L1 0.327 0.527 0.427z 0.20 0.40 0.30All Dimensions in mmSuggested Pad LayoutPlease see /package-outlines.html for the latest version.SOT89Dimensions Value(in mm)C 1.500G 0.244X 0.580X1 0.760X2 1.933Y 1.730Y1 3.030Y2 1.500Y3 0.770Y4 4.530TOP VIEW。

COM Express® PMC/XMC Ultra LiteCarrierConnect Tech Inc.Tel:519-836-129142 Arrow Road Toll:800-426-8979 (North America only)Guelph, Ontario Fax:519-836-4878N1K 1S6 Email:********************* *********************** CTIM-00431 Revision 0.06 2018-01-08Table of ContentsPreface (4)Disclaimer (4)Customer Support Overview (4)Contact Information (4)Limited Product Warranty (5)Copyright Notice (5)Trademark Acknowledgment (5)ESD Warning (6)Revision History (6)Introduction (7)Product Features and Specifications (7)Product Overview (8)Block Diagram (8)Connector Locations (9)Connector Summary (10)Jumper Summary (11)Detailed Feature Pinouts and Functional Descriptions (11)Serial/GPIO Connector (11)VGA Video Connector (12)COM Express Module Connector (12)LVDS Video Connector (13)miniPCIe/mSATA Slots (14)Dual Function miniPCIe/mSATA Slots (14)Jumper Selection (14)Half and Full Length miniPCIe/mSATA module Installation (14)External SATA Connector (16)CPU Fan (16)System and Miscellaneous Connector (17)SIM Socket (17)HD Audio Connector (18)Software Support for the CS4207 (18)USB 2.0 Connector (18)DisplayPort Connector (19)HDMI / DVI / VGA from DisplayPort++ (19)10/100/1000 Ethernet (GBE) (20)USB 3.0/2.0 Connector (20)microSD CARD Connector (21)Power Connector (21)SATA/LVDS Power Connector (22)XMC Connector (22)PMC Connector (23)Typical Hardware Installation Procedure (24)On-board Indicator LEDs (24)Jumper Settings (25)J1 Jumper – LVDS PANEL (25)J2 Jumper – RTC Battery (25)J3 Jumper – RTC Battery (25)J6 Jumper – Shutdown Battery (25)J6 Jumper – Power Control (26)J4 Jumper – mSATA/miniPCIe (26)J8 Jumper – USB (26)J7 Jumper – GPIO-V (26)Thermal & Current Consumption Details (27)Thermal Details (27)Mechanical Details (27)Cables and Cable Kit Information (28)Cable Kits (28)CKG028 –“Full” Cable Kit (28)CKG021 –“Starter” Cable Kit (28)PrefaceDisclaimerThe info rmation contained within this user’s guide, including but not limited to any productspecification, is subject to change without notice.Connect Tech assumes no liability for any damages incurred directly or indirectly from anytechnical or typographical errors or omissions contained herein or for discrepancies between theproduct and the user’s guide.Customer Support OverviewIf you experience difficulties after reading the manual and/or using the product, contact theConnect Tech reseller from which you purchased the product. In most cases the reseller can help you with product installation and difficulties. In the event that the reseller is unable to resolveyour problem, our highly qualified support staff can assist you. Our support section is available24 hours a day, 7 days a week on our website at: /support/resource-center/.See the contact information section below for more information on how to contact us directly. Our technical support is always free.Contact InformationMail/CourierConnect Tech Inc.Technical Support42 Arrow RoadGuelph, OntarioCanada N1K 1S6Email/Internet********************************************Telephone/FacsimileTechnical Support representatives are ready to answer your call Monday through Friday, from8:30 a.m. to 5:00 p.m. Eastern Standard Time. Our numbers for calls are:Toll Free: 800-426-8979 (North America only)Telephone: 519-836-1291 (Live assistance available 8:30 a.m. to 5:00 p.m. EST,Monday to Friday)Facsimile: 519-836-4878 (on-line 24 hours)Limited Product WarrantyConnect Tech Inc. provides a two-year Warranty for the COM Express® PMC/XMC Ultra LiteCarrier. Should this product, in Connect Tech Inc.'s opinion, fail to be in good working orderduring the warranty period, Connect Tech Inc. will, at its option, repair or replace this product atno charge, provided that the product has not been subjected to abuse, misuse, accident, disaster or non-Connect Tech Inc. authorized modification or repair.You may obtain warranty service by delivering this product to an authorized Connect Tech Inc.business partner or to Connect Tech Inc. along with proof of purchase. Product returned toConnect Tech Inc. must be pre-authorized by Connect Tech Inc. with an RMA (Return MaterialAuthorization) number marked on the outside of the package and sent prepaid, insured andpackaged for safe shipment. Connect Tech Inc. will return this product by prepaid groundshipment service.The Connect Tech Inc. Limited Warranty is only valid over the serviceable life of the product.This is defined as the period during which all components are available. Should the product prove to be irreparable, Connect Tech Inc. reserves the right to substitute an equivalent product ifavailable or to retract the Warranty if no replacement is available.The above warranty is the only warranty authorized by Connect Tech Inc. Under nocircumstances will Connect Tech Inc. be liable in any way for any damages, including any lostprofits, lost savings or other incidental or consequential damages arising out of the use of, orinability to use, such product.Copyright NoticeThe information contained in this document is subject to change without notice. Connect TechInc. shall not be liable for errors contained herein or for incidental consequential damages inconnection with the furnishing, performance, or use of this material. This document containsproprietary information that is protected by copyright. All rights are reserved. No part of thisdocument may be photocopied, reproduced, or translated to another language without the priorwritten consent of Connect Tech, Inc.Copyright 2016 by Connect Tech, Inc.Trademark AcknowledgmentConnect Tech, Inc. acknowledges all trademarks, registered trademarks and/or copyrights referred to in this document as the property of their respective owners.Not listing all possible trademarks or copyright acknowledgments does not constitute a lack ofacknowledgment to the rightful owners of the trademarks and copyrights mentioned in thisdocument.ESD WarningElectronic components and circuits are sensitive toElectroStatic Discharge (ESD). When handling any circuitboard assemblies including Connect Tech COM Expresscarrier assemblies, it is recommended that ESD safetyprecautions be observed. ESD safe best practices include,but are not limited to:∙Leaving circuit boards in their antistatic packaginguntil they are ready to be installed.∙Using a grounded wrist strap when handling circuitboards, at a minimum you should touch a groundedmetal object to dissipate any static charge that maybe present on you.∙Only handling circuit boards in ESD safe areas,which may include ESD floor and table mats, wriststrap stations and ESD safe lab coats.∙Avoiding handling circuit boards in carpeted areas.∙Try to handle the board by the edges, avoidingcontact with components.Revision HistoryIntroductionConnect Tech’s PMC/XMC Ultra Lite Carrier is an extremely small carrier board featuringrugged, locking connectors and offers the ultimate durability. The PMC/XMC Ultra Lite Carrier is ideal for space constrained applications, harsh environments, demanding conditions and supports extended temperature ranges of -40°C to +85°C.Product Features and SpecificationsProduct Overview Block DiagramConnector LocationsConnector SummaryJumper SummaryDetailed Feature Pinouts and Functional Descriptions Serial/GPIO ConnectorThe CCG013 allows access to the COM Express modules GPIO by routing them out to a GPIO header. Also present is a direct connected RS-232 signal that utilizes the COM Express module’s UART.VGA Video ConnectorTo allow for greater flexibility, the CCG013 provides a VGA Video output. Routed directly from the COM Express Type 6, this provides additional video output formats for operation.COM Express Module ConnectorThe processor and chipset are implemented on the CCG013s COM Express Type 6 module, whichconnects to the CCG013 Carrier Board via a Tyco fine pitch stacking connector.LVDS Video ConnectorThe CCG013 provides dual 18 or 24 bit LVDS display channels via P9, which are connected directly from the COM Express Type 6 module.Note [1]: This voltage can be selected from Jumper J2 to be +3.3V, +5V, or +12VminiPCIe/mSATA SlotsDual Function miniPCIe/mSATA SlotsThe CCG013 has two special dual purpose miniPCIe/mSATA slots. Each of these slots can accept either a miniPCIe module or an mSATA SSD module. These slots have special circuitry that allows for the selection between connecting PCIe lanes or SATA lanes.Each of these slots are also provided with a USB 2.0 in addition to the PCIe as per the mini PCIe specification, see below for a block diagram of the slots functionality.miniPCIe/mSATA Dual Functionality Diagram**Please note, a SIM card is only availabe on miniPCIe/mSATA slot 0Jumper SelectionHalf and Full Length miniPCIe/mSATA module InstallationThe CCG013 comes with dual mounting solutions to allow for the population of a half and a full length module. If you would prefer to have a single slot or both slots populated with half-length hardware at the ****************************************************************************.External SATA ConnectorThe CCG013 provides two SATA plugs that are SATA-PCIe/104 switched. Please see SATA-PCIe/104 switching description for additional details.CPU FanSystem and Miscellaneous ConnectorThe System header can be used to connect the power button, reset button, and LED’s required to monitor the module performance or state.SIM SocketHD Audio ConnectorThe CCG013s features HD Audio capabilities with the assistance of the Cirrus Logic CS4207 Codec device. From the codec, 1 microphone input and 1 headphone output are available.Software Support for the CS4207The audio codec used on the PMC/XMC Ultra Lite Carrier board is the CS4207 from Cirrus Logic.Additional drivers will be needed to properly operate audio on the PMC/XMC Ultra Lite Carrier . Some downloadable links can be found below.Windows XP Driver :/en/support/lic/lic3.html?uri=/en/pubs/software/CS4207_WinXP_1-0-0-38.zip Windows 7/8 Driver :/en/support/lic/lic3.html?uri=/en/pubs/software/CS4207_LogoedDriverPackage_6-6001-1-39.zipLinux Driver : Included in kernels 2.6.30 and up.USB 2.0 ConnectorThe CCG013 has multiple USB Ports. USB 2.0 Port 6 is sourced directly from the COM Express module. USB 2.0 Port 7 however has multiple functionality options. Using Jumper J727, Port 7 can either be a Client USB, or it can be used to connect the SD Card to the COM Express module.Note [2]: USB 2.0 Port 7 can be optionally be used as client USB. Simply remove the Jumper from J8A to enable Note [3]: USB 2.0 Port 7 can be optionally be used to enable the SD Card. Simply remove the Jumper from J8B to enableDisplayPort ConnectorTwo DisplayPort++ connections from the COM Express module are available and can be configured to output DisplayPort, or HDMI/DVI/VGA through the use of a dongle. The configuration of each interface is setup via the COM Express module’s BIOS settings. Refer to the COM Express module’s documentation for more details.Note [4]: Cable assembly must tie high (+3.3V) for adapter output (HDMI/DVI/VGA) and low (GND) for DisplayPort outputHDMI / DVI / VGA from DisplayPort++The COM Express Type 10 Mini Carrier’s DisplayPort++ connector can be used for display outputs other than DisplayPort. The use of HDMI, DVI or VGA can be done through a simple dongle or cable assembly like the ones shown below. These can be purchased from any OEM vendor (such as ) or directly through Connect Tech.10/100/1000 Ethernet (GBE)The CCG013 features dual 10/100/1000 Ethernet Ports. GBE 0 is sourced from the COM Express module. Meanwhile, GBE 1 is sourced from an Intel 82574 PCIe PHY Controller located on the CCG013 Carrier Board, connected via PCIe x1 to the COM Express module.USB 3.0/2.0 ConnectorThe CCG013 provides up to a maximum of 4 USB 3.0 Ports. The USB 3.0 signals are sourced directlyfrom the COM Express Type 6 module, and run through a Pericom Semiconductor PI3EQX7502AIZDE re-driver. Over current protection, power supply filtering and ESD protection is provided.microSD CARD ConnectorThe CCG013 provides a microSD Card Slot. This microSD can be accessed by the COM Express module[9]Note [9]: USB 2.0 Port 7 can be optionally be used to enable the SD Card. Simply remove the Jumper from J8B to enablePower ConnectorThe CCG013 accepts a single power input to power all on-board devices. The CCG013 accepts a wide input range of +12V to +48V for operation.SATA/LVDS Power ConnectorThe CCG013 also provides power for external SATA Hard Drives and/or LVDS screens. The power connectors can be found next the External SATA connectors.XMC ConnectorThe CCG016 allows for I/O expansion with two XMC slots, both capable of x8 PCI Express connectivity.The XMC connectors comply with the VITA 42.0/42.3 standard. +VPWR is +5V, with an option to move to +12V +VPWR power.PMC ConnectorThe CCG016 allows for I/O expansion with two PMC slots, both capable of 32bit PCI connectivity. TheTypical Hardware Installation Procedure1.Ensure all external system power supplies are OFF.2.Install the necessary cables for the application. At a minimum, this would include:a)Power cable to the input power connectorb)Connect a video display cablec)Keyboard and mouse via USBd)SATA or mSATA hard driveFor additional information on the relevant cables, please see the Cables and Interconnects section of this manual.3.Connect the power cable to power supply4.Ensure your power supply is in the range of +12V to +48V DC5.Switch ON the power supply. DO NOT power up your system by plugging in live power.On-board Indicator LEDsThe CCG013 has 10 on-board indicator LEDs.** D32 Only on when on-board NAND option is implemented.Jumper SettingsThe CCG013 utilizes jumper blocks to control various features like LVDS, mSATA/miniPCIe switching, and Client USB.J1 Jumper – LVDS PANELJ2 Jumper – RTC BatteryJ3 Jumper – RTC BatteryJ6 Jumper – Shutdown BatteryJ6 Jumper – Power ControlJ4 Jumper – mSATA/miniPCIeNote [11]: See mSATA/miniPCIe Slots for detailed description of functionalityJ8 Jumper – USBJ7 Jumper – GPIO-VThermal & Current Consumption DetailsBelow are measurements taken with the CCG013 running in various configurations. Some values will change depending on what COM Express module, and what PMC/XMC modules are installed. Please refer to the module or card m anufacturer’s manual for full details on the current consumption of the particular module or peripheral you are using.Note [12]: COM Express Type 6 Module used for measurements - 4th Gen i7-4700Thermal DetailsAll components on the CCG013 are rated to a maximum operating temperature of -40°C to +85°C. Mechanical DetailsA complete 3D STEP Model file of the carrier can be downloaded here:/ftp/3d_models/CCG013_3D_MODEL.zipCables and Cable Kit InformationCable KitsThe following tables summarize the PMC/XMC Ultra Lite Carrier’s available cable kits from Connect Tech.CKG062 –“Full” Cable KitCKG021 –“Starter” Cable Kit。

MAX 10嵌入式存储器用户指南订阅反馈UG-M10MEMORY2015.11.02101 Innovation Drive San Jose, CA 内容MAX® 10嵌入式存储器概述..............................................................................1-1 MAX 10嵌入式存储器体系结构和功能............................................................2-1 MAX 10嵌入式存储器一般特性............................................................................................................2-1控制信号...........................................................................................................................................2-1奇偶校验位......................................................................................................................................2-2读使能...............................................................................................................................................2-2Read-During-Write..........................................................................................................................2-3字节使能...........................................................................................................................................2-3Packed模式支持.............................................................................................................................2-4地址时钟使能支持.........................................................................................................................2-5异步清零...........................................................................................................................................2-6 MAX 10嵌入式存储器操作模式............................................................................................................2-7支持的存储器操作模式.................................................................................................................2-8 MAX 10嵌入式存储器时钟模式............................................................................................................2-9时钟模式中的异步清零..............................................................................................................2-10同时的读和写中的输出读数据.................................................................................................2-10时钟模式的独立时钟使能..........................................................................................................2-10 MAX 10嵌入式存储器配置...................................................................................................................2-11端口宽度配置................................................................................................................................2-11双端口模式的存储器配置..........................................................................................................2-11最大模块深度配置.......................................................................................................................2-12 MAX 10嵌入式存储器设计考量........................................................................3-1实现外部冲突解决.....................................................................................................................................3-1定制Read-During-Write行为..................................................................................................................3-1相同端口Read-During-Write模式.............................................................................................3-2混合端口Read-During-Write模式.............................................................................................3-3考虑上电状态和存储器初始化...............................................................................................................3-4控制时钟以降低功耗.................................................................................................................................3-5选择Read-During-Write输出..................................................................................................................3-6 RAM：1-Port IP内核参考.................................................................................4-1 RAM：MAX 10器件的1-Port IP 内核信号.........................................................................................4-2MAX 10器件的RAM: 1-Port IP内核参数............................................................................................4-3RAM: 2-PORT IP内核参考................................................................................5-1 MAX 10器件的RAM: 2-Port IP内核信号(简单双端口RAM)........................................................5-5 MAX 10器件的RAM: 2-Port IP内核信号(真双端口RAM) ...........................................................5-7 MAX 10器件的RAM: 2-Port IP内核参数............................................................................................5-9 ROM：1-PORT IP内核参考..............................................................................6-1 MAX 10器件的ROM：1-PORT IP内核信号......................................................................................6-2 MAX 10器件的ROM：1-PORT IP内核参数......................................................................................6-4 ROM: 2-PORT IP内核参考................................................................................7-1 ROM: MAX 10器件的2-PORT IP内核信号........................................................................................7-3 MAX 10器件的ROM:2-Port IP内核参数 ...........................................................................................7-4移位寄存器（基于RAM）IP内核参考............................................................8-1 MAX 10器件的移位寄存器(基于RAM)IP内核信号........................................................................8-1 MAX 10器件的移位寄存器(基于RAM) IP内核参数.......................................................................8-2 FIFO IP内核参考................................................................................................9-1 MAX 10器件的FIFO IP内核信号 ........................................................................................................9-2 MAX 10器件的FIFO IP内核参数 ........................................................................................................9-4ALTMEMMULT IP内核参考...........................................................................10-1 MAX 10器件的ALTMEMMULT IP内核信号..................................................................................10-1 MAX 10器件的ALTMEMMULT IP内核参数..................................................................................10-2 MAX 10嵌入式存储器用户指南的附加信息...................................................A-1 MAX 10嵌入式存储器用户指南的文档修订历史.............................................................................A-1MAX® 10嵌入式存储器模块已被优化，以用于诸如高吞吐量数据包处理、嵌入式处理器编程和嵌入式数据存储的应用程序。

2048像素CCD 线性传感器（黑白）概述ILX551A 是一种专为传真、图像扫描仪和OCR 设计的小型CCD 线性传感器，该传感器能够以200DPI （每英寸点数）的密度读取B4尺寸的文档。

内置的时钟发生器能向外提供5V 的逻辑驱动电平。

功能•有效像素数：2048像素•像素大小：14μm （间距14μm ）内置定时发生器和时钟驱动器•超低延迟•最大时钟频率：5MHz 绝对最大额定值•电源电压 V DD111V V DD26V •工作温度–10 to +55°C•储存温度–30 to +80°C引脚配置（顶视图）内部电路框图E00439-PS索尼保留更改产品和规格的权利，恕不另行通知。

该信息不以任何暗示或其他专利、知识产权的方式传达任何许可。

所示的应用电路（如有）是说明设备操作的典型示例。

对于因使用这些电路而引起的任何问题，Sony 概不负责。

– 1–ILX551A22 针 DIP (Cer-DIP)V O U TV D D 2φR O GS H S WV D D 2G N DφC L KV D D 2N CN CN CN CV OUT NC NC SHSW φCLK NC NC V DD2V DD2NC φROGV DD2V DD2V DD1GND NC GND NC NC NC NC GND– 2–单位pF pF最大值——典型值1010最小值——符号C φCLK C φROG项目φCLK 引脚输入电容φROG 引脚输入电容引脚输入电容项目单位V V最大值9.55.25典型值9.05.0最小值8.54.75项目V DD1V DD2推荐电源电压值引脚状态Pin 4 SHSWGND V DD2使用模式S/H Yes No 单位V V最大值5.50.5典型值5.0—最小值4.50.0输入时钟高电平输入时钟低电平推荐输入脉冲电压值引脚定义引脚号符号描述1234567891011V OUT NC NC SHSW φCLK NC NC V DD2V DD2NC φROG信号输出NC NC 时钟脉冲NC NC 5V 电源5V 电源NC 时钟脉冲引脚号符号描述1213141516171819202122GND NC NC NC NC GND NC GND V DD1V DD2V DD2地NC NC NC NC 地NC 地9V 电源5V 电源5V 电源注）升高和降低电源电压的规则要提高电源电压，请先升高VDD1（9V ），然后升高VDD2（5V ）。

a AN-551APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • 781/329-4700 • World Wide Web Site: Power Management of the ADV7172/ADV7173 Video EncoderINTRODUCTIONThis application note describes the different power op-erating modes of the ADV7172/ADV7173 and how the device should be configured or used in order to use power as efficiently as possible.THE THREE POWER OPERATING MODES AVAILABLE ON THE ADV7172/ADV7173The ADV7172/ADV7173 has three power operating modes:Normal Power Mode at 5 V or 3.3 VWhen all DACs are switched on, the current consumed is set by R SET1 for the large DACs (DAC A, B, C), R SET2 for the small DACs (DAC D, E, F) and V REF. See Tables I and II for the different current settings.Low Power ModeLow Power Mode is only available at an operating volt-age of 5 V. It only takes effect when the large DACs (A, B, C) are switched on. This facility will reduce the average current consumed by each large DAC (which is powered on) by approximately 40%.How Does Low Power Mode Work?Considering each DAC as a group of current sources, when any current source has a DAC code of zero (i.e., off), the DAC current is switched to ground and current is con-sumed unnecessarily. If the current source is then switched off instead of being switched to ground, the current consumed can be reduced by approximately 40%.Sleep ModeSleep Mode is available at 5 V and 3.3 V operation. The current consumed by the ADV7172/ADV7173 is typi-cally less than 20 µA. This mode can be used while powering up or while configuring the registers.Two M ode Registers allow control over Sleep M ode: Mode Register 2, “Sleep Mode Control” and Mode Reg-ister 6, “Power Up Sleep M ode.” In M ode Register 2, Sleep Mode is enabled when the according bit (MR27)“Sleep M ode Control” is set to Logic 1 and disabled when it is set to Logic 0.When enabled, the current consumption of the ADV7172/ADV7173 is typically less than 20 µA. If the de-vice is set to operate in Sleep Mode and if Sleep Mode is disabled in setting the according bit (MR27) to Logic 0,the device will come out of Sleep Mode and resume nor-mal operation.Also, if the device is set to operate in Sleep Mode and a reset is applied, the device will come out of Sleep Mode and resume normal operation. This mode will only oper-ate when Mode Register 6, “Power-Up Sleep Mode” is disabled (set to Logic 1), otherwise Sleep Mode is con-trolled by the PAL_NTSC and SCRESET/RTC pin.Note that the I2C interface still operates in Sleep Mode.Mode Register 6M R60 “Power-Up in Sleep M ode” allows the user to control powering up the device in Sleep Mode to facili-tate low power consumption before the I2C is initialized. The device will power up in Sleep Mode if the SCRESET/ RTC pin and the NTSC_PAL pin are tied high and the “Power-Up Sleep M ode” control (M R60) is set to En-abled (set to a Logic 0). This bit is always set to 0 after powering up or after applying a reset.When “Power-Up Sleep M ode” is disabled or set to a Logic 1, Sleep Mode control passes to Mode Register 2,“Sleep Mode Enable” control.THERE ARE SEVERAL METHODS TO REDUCE POWER CONSUMPTION OF THE ADV7172/ADV71731. Operating Voltage: 5 V Low Power Mode2. Operating Voltage:3.3 V3. Sleep Mode4. Turn Off Unused DACs5. External Buffering6. TV AutodetectOperating Voltage: 5 V Low Power ModeMode Register 1, Bit 6, “Low Power Mode Control” al-lows the Low Power Mode to be selected. Note, that Low Power Mode is only available at 5 V operation.Low Power Mode will reduce the average current con-sumed by each DAC by approximately 40%.In normal mode the current consumed is set by R SET1, R SET2 and V REF. In Low Power M ode this set current is reduced by approximately 40%. For each DAC the rela-tionship between R SET1/V REF and R SET2/V REF and the out-put current is unchanged by this.–2–AN-551Operating Voltage: 3.3 VIdeal or optimum performance is achieved when the de-vice is operated at 3.3 V and DAC A, B, C (large DACs) are set to an output current of:I OUT = 18 mAwhereR SET 1 = 300 ΩR SET 2 = 600 ΩR LOAD = 75 Ω (Single Terminated Load)Sleep ModeIs available at 5 V and 3.3 V operation.The current consumption of the ADV7172/ADV7173 is typically less than 20 µA.As mentioned before, this mode can be used while powering up the device or while configuring the regis-ters. See Sleep Mode section for details on how to oper-ate Sleep Mode.Turn Off Unused DACsIt is recommended that whenever a DAC is not used, it should be switched off.This is done in Mode Register 1, where each DAC can be individually powered off. Refer to Table I and Table II for further details.External BufferingExternal buffering is another way to reduce power con-sumption. Whereas DAC D, E, F (small DACs) always need buffering, buffering on DACs A, B, C is optional (when DAC D, E, F are not used). In the shown configura-tion the DACs A, B, C are running at 18 mA, which is half of their full current capability. This allows a reduction in power dissipation by 50% in the current that these DACs consume.600V CVBSGCHROMARB300Figure 1.Output DAC Buffering ConfigurationThe resistors are given the following values:R SET1 = 300 ΩR SET2 = 600 ΩR LOAD = 75 Ω Single TerminatedIt is further recommended to use this configuration at an operating voltage of 3.3 V. This allows optimum DAC performance and adds extra isolation on the video outputs.OUTPUT TOOUTPUT FILTER/TV MONITORINPUTFigure 2.Recommended DAC Output Buffer Using an Op AmpTV AutodetectThis feature allows the user to determine whether or not the DACs are correctly terminated. This facility is avail-able for DACs A, B, C since unconnected (not used)DACs increase power consumption.Mode Register 6 allows automatic detection of untermi-nated DACs:1.The “DAC Termination Mode” control allows to select between correct 75 Ω or 150 Ω termination.Note that double terminated 75 Ω becomes 37.5 Ω (i.e.,75 Ω on the DAC end and 75 Ω on the TV end) and 150 Ωbecomes 75 Ω. For this reason the Autodetect facility cannot operate if the large DACs are buffered, since buffering results in a fixed termination, regardless if cor-rectly or incorrectly terminated at the buffer output.Mode Register 6 “DAC Termination Mode” control (Bit 4) allows the user to select between two Autodetect Termination modes:1 × Mode = 75 Ω Termination (Single-Terminated)2 × Mode = 150 Ω Termination (Single-Terminated)Mode Register 6 “Comp Autodetect Mode” control (Bit 3) and “Luma Autodetect” control (Bit 2) allow the choice between two functions:Mode0Correct termination of the DAC is checked and indicated with the according Status bit set to “1” or when using the Evaluation Software, Mode Register 6 (Autodetect Status) a green button indicates correct termination.If not correctly terminated, the user has the choice to power down the DAC or not. This can be done by using Mode Register 1.AN-551Mode1Correct termination of the DAC is checked and indicated with the according Status bit set to “1” or when using the Evaluation Software, M ode Register 6 (Autodetect Status) a green button indicates correct termination.If not correctly terminated, the DAC is automatically powered down.Correct termination is checked at intervals of one frame to decide whether or not the DACs are to be powered down.SETTINGS FOR R SET1, R SET2, R LOADOperating Voltage: 5 V/Normal ModeThe values for R SET1 and R SET2 determine what current will be consumed by each DAC and, therefore, what power will be consumed.The current consumed is calculated as:I OUT = (V REF×K )/R SETV OUT = I OUT×R LOADV REF = 1.235 VK = 4.2146DAC A, B, C (Large DACs)R SET2 is used for the small DACs and has no effect on the output current of the large DACs.I OUT = 34.7 mA R SET1 = 150 ΩR LOAD = 75 Ω (Single-Terminated)I OUT = 5 mA R SET1 = 1041 ΩR LOAD = 262.5 Ω(Buffered, Scaled Output Load)See Table I and Table II for further details.DAC D, E, F (Small DACs)R SET1 is used for the large DACs and has no effect on the output current of the small DACs.I OUT = 8.66 mA R SET2 = 600 ΩR LOAD = 150 ΩI OUT = 5 mA R SET2 = 1041 ΩR LOAD = 262.5 Ω(Buffered, Scaled Output Load)See Table I and Table II for further detailsOperating Voltage: 3.3 V/Normal ModeThe same settings for R SET1 and R SET2 apply for 3.3 V op-eration as shown above for 5 V operation.3.3 V operation will reduce the power dissipation due tothe V × I = P formula, i.e., the current is unchanged whilethe voltage decreases from 5 V to 3.3 V.JUNCTION TEMPERATUREIt is important to keep in mind that at no time the maxi-mum junction temperature of 110°C should be exceeded:Junction Temperature = [V AA(Σ of I OUT + I CCT) ×θJA]+70°CI CCT=Circuit Current or Digital Supply Current=Continuous Current Required to Drive theDeviceI CCT=78 mA at V AA = 5 VI CCT=40 mA at V AA = 3.3 VI DAC=Total Current to Drive All DACs=10 mA + (Σ of the Average Currents Con-sumed by Each DAC)=10 mA + (Σ of I OUT of Each DAC)I OUT=Average Current Consumed by DACθJA=Junction-to-Ambient Thermal Resistance 54.6°C/Win Still Air On a Four-Layer PCBθJC=Junction-to-Case Thermal Resistance 16.7°C/Win Still Air On a Four-Layer PCBV AA=Supply VoltageP TOTAL=V AA× I TotalI TOTAL=I CCT + Σ of I OUT–3–AN-551Table I.DAC Current ConsumptionJunctionLow I OUT I OUT I OUT I OUT I OUT I OUT Temp DACSupply DAC Power DAC A DAC B DAC C DAC D DAC E DAC F Degrees Output I CCT I DAC I TOTAL P TOTAL Voltage Buffering ON(mA)(mA)(mA)(mA)(mA)(mA)Celsius Configuration(mA)(mA)(mA)(mW)5 V No No34.734.734.78.668.668.66126.8Not Allowed78140.08208.081040.4No Yes20.8220.8220.82OFF OFF OFF108.3Allowed7872.46140.46702.3 Yes No55555599.5Allowed7840108540 Yes Yes333OFF OFF OFF93.8Allowed781987435No No OFF34.734.78.668.668.66117.3Not Allowed78105.38173.38866.9 No Yes OFF20.8220.82OFF OFF OFF102.7Allowed7851.64119.64598.2 Yes No OFF5555598.1Allowed7835103515 Yes Yes OFF33OFF OFF OFF92.9Allowed781684420No No OFF OFF34.78.668.668.66107.9Allowed7870.68138.68693.4 No Yes OFF OFF20.82OFF OFF OFF97Allowed7830.8298.82494.1 Yes No OFF OFF555596.8Allowed783098490 Yes Yes OFF OFF3OFF OFF OFF92.1Allowed781381405 No No OFF OFF OFF8.668.668.6698.3Allowed7835.98103.98519.9 No Yes OFF OFF OFF OFF OFF OFFYes No OFF OFF OFF55595.4Allowed782593465 Yes Yes OFF OFF OFF OFF OFF OFFNo No OFF OFF OFF OFF8.668.6696Allowed7827.3295.32476.6 No Yes OFF OFF OFF OFF OFF OFFYes No OFF OFF OFF OFF5594Allowed782088440 Yes Yes OFF OFF OFF OFF OFF OFFNo No OFF OFF OFF OFF OFF8.6693.7Allowed781886.66433.3 No Yes OFF OFF OFF OFF OFF OFFYes No OFF OFF OFF OFF OFF592.7Allowed781583415 Yes Yes OFF OFF OFF OFF OFF OFFNo No34.734.734.78.668.66OFF124.4Not Allowed78131.42199.42997.1 No Yes20.8220.8220.82OFF OFF OFF108.3Allowed7872.46140.46702.3 Yes No55555OFF98.1Allowed7835103515 Yes Yes333OFF OFF OFF93.8Allowed781987435 No No34.734.734.78.66OFF OFF122.1Not Allowed78122.76190.76953.8 No Yes20.8220.8220.82OFF OFF OFF102.7Allowed7851.64119.64598.2 Yes No5555OFF OFF96.8Allowed783098490 Yes Yes333OFF OFF OFF93.8Allowed781987435No No34.734.734.7OFF OFF OFF119.7Not Allowed78114.1182.1910.5 No Yes20.8220.8220.82OFF OFF OFF108.3Allowed7872.46140.46702.3 Yes No555OFF OFF OFF95.4Allowed782593465 Yes Yes333OFF OFF OFF93.8Allowed781987435 No No34.734.7OFF OFF OFF OFF110.2Allowed7879.4147.4737 No Yes20.8220.82OFF OFF OFF OFF102.7Allowed7851.64119.64598.2 Yes No55OFF OFF OFF OFF94Allowed782088440 Yes Yes33OFF OFF OFF OFF92.9Allowed781684420No No34.7OFF OFF OFF OFF OFF100.8Allowed7844.7112.7563.5 No Yes20.82OFF OFF OFF OFF OFF96.9Allowed7830.8298.82494.1 Yes No5OFF OFF OFF OFF OFF92.7Allowed781583415 Yes Yes3OFF OFF OFF OFF OFF92.1Allowed781381405–4––5–AN-551Table II.DAC Current ConsumptionI OUT I OUT I OUT I OUT I OUT I OUT Supply DACDAC A DAC B DAC C DAC D DAC E DAC F Junction Temp I CCT I DAC I TOTAL P TOTAL VoltageBuffering (mA)(mA)(mA)(mA)(mA)(mA)Degrees Celsius (mA)(mA)(mA)(mW)3.3 VNo 34.734.734.78.668.668.66100.640140.08170.08561.3Yes 55555582.6404070231No OFF 34.734.78.668.668.6694.440105.38135.4446.8Yes OFF 5555581.7403565214.5No OFF OFF 34.78.668.668.6688.14070.68100.7332.3Yes OFF OFF 555580.8403060198No OFF OFF OFF 8.668.668.6681.94035.9865.9217.5Yes OFF OFF OFF 55579.9402555181.5No OFF OFF OFF OFF 8.668.6680.34027.3257.32189.2Yes OFF OFF OFF OFF 5579402050165No OFF OFF OFF OFF OFF 8.6678.84018.6648.66160.6Yes OFF OFF OFF OFF OFF 578.1401545148.5No 34.734.734.78.668.66OFF 99.140131.42161.42532.7Yes 55555OFF 81.7403565214.5No 34.734.734.78.66OFF OFF 97.540122.76152.8504.2Yes 5555OFF OFF 80.8403060198No 34.734.734.7OFF OFF OFF 95.940114.1144.1475.5Yes 555OFF OFF OFF 79.9402555181.5No 34.734.7OFF OFF OFF OFF 89.74079.4109.4361.02Yes55OFFOFFOFFOFF79402050165P R I N T E D I N U .S .A .E 3554–2–6/99。

PNP Silicon Amplifier TransistorMarking:Type Number Internal StructureE1.COLLECTOR2.BASE3.EMITTERV EBO -5V Power Dissipation @T C =25°C P D 1.5WEmitter-Base Voltage BC556BC558BC556BC558Collector-Base VoltageCollector-Emitter VoltageV CEO-30-30VV-800.625W Features•Halogen Free Available Upon Request By Adding Suffix "-HF"•Epoxy Meets UL 94 V-0 Flammability Rating•Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information)Maximum Ratings @ 25°C Unless Otherwise Specified•Operating Junction Temperature Range: -55℃ to +150℃•Storage Temperature Range: -55℃ to +150℃•Thermal Resistance: 200℃/W Junction to Ambient •Thermal Resistance: 83.3℃/W Junction to Case-65BC557BC557-50-45ParameterSymbol Rating Unit V CBOP D Continuous Collector Current I C -0.1A Power Dissipation @T A =25°CBase-Emitter Voltage V BE -0.55-0.7V V CE =-5V, I C =-2mA Emitter-Base Breakdown VoltageI E =-100µA, I C =0I C =-2mA, I B =0BC558BC556BC558V-0.1µA V CE =-60V, I B =0BC556BC558-0.1µA V CB =-70V, I E =0BC556Collector-Emitter Breakdown VoltageV (BR)CEO -30I CBOBC557-45BC557-30Collector Cutoff Current-65V (BR)EBO Collector-Emitter Saturation Voltage V CE(sat)-0.65V I C =-100mA, I B =-5mA -0.3V DC Current Gain6pF V CE =-5V, I C =-2mA I C =-10mA, I B =-0.5mA Base-Emitter Saturation Voltage MHz V CE =-5V,I C =-10mA, f=100MHz Classification of h FEB AC 120-220180-460420-800RangeRank V CB =-25V, I E =0V EB =-5V, I C =0-0.1µA µA-5V Electrical Characteristics @ T A =25°C Unless Otherwise SpecifiedParameterSymbolMin TypMaxUnitsConditions-80BC556Collector-Base Breakdown VoltageI C =-100µA, I E =0V (BR)CBO -50BC557VTransition Frequencyf T150Output Capacitance C ob Emitter Cutoff Current I EBO -0.1-0.82h FE 120800I C =-100mA, I B =-5mA -1V V V CE =-5V, I C =-10mA -0.8V I C =-10mA, I B =-0.5mA V BE(sat)V CB =-10V, I E =0, f=1MHz BC557BC558I CEO Collector Cutoff Current -0.1µA V CB =-45V, I E =0-0.1µA V CE =-40V, I B =0-0.1µA V CE =-25V, I B =0BC557/BC558I C , COLLECTOR CURRENT (mAdc)Figure 1. Normalized DC Current Gain2.0I C , COLLECTOR CURRENT (mAdc)Figure 2. “Saturation” and “On” Voltages–0.20.2I C , COLLECTOR CURRENT (mA)Figure 4. Base–Emitter Temperature Coefficient–0.6–0.7–0.8–0.9–1.0–0.501.61.22.02.82.4–1.2–1.6–2.00–0.4–0.8h F E , N O R M A L I Z E D D C C U R R E N T G A I NV , V O L T A G E (V O L T S )V C E , C O L L E C T O R –E M I T T E R V O L T A G E (V )θV B , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )1.51.00.70.50.3–0.2–10–100–1.0–0.5–1.0–2.0–5.0–10–20–50–100–200V R , REVERSE VOLTAGE (VOLTS)Figure 5. Capacitances 10Figure 6. Current–Gain – Bandwidth Product–2.0–3.0–5.0–10I C , COLLECTOR CURRENT (mAdc)–0.41.080100200300400602040307.05.03.02.0–0.5C , C A P A C I T A N C E (p F )f T , C U R R E N T –G A I N – B A N D W I D T H P R O D U C T (M H z )–0.6–1.0–2.0–4.0–6.0–10–20–30–40150–1.0–20–30–501.0BC556I C , COLLECTOR CURRENT (AMP)Figure 7. DC Current Gain I C , COLLECTOR CURRENT (mA)Figure 8. “On” Voltage–0.8–1.0–0.61.02.0–200–0.1–0.20.20.5Figure 9. Collector Saturation Region I B , BASE CURRENT (mA)I C , COLLECTOR CURRENT (mA)Figure 10. Base–Emitter Temperature Coefficient–1.0–1.2–1.6–2.00–0.4–0.8V C E , C O L L E C T O R –E M I T T E R V O L T A G E (V O L T S )θV B , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )h F E , D C C U R R E N T G A I N (N O R M A L I Z E D )V , V O L T A G E (V O L T S )–1.4–1.8–2.6–3.0–1.0–2.0–5.0–10–20–50–100Figure 11. Capacitance –0.5–1.0–2.0–5.0–10–V R , REVERSE VOLTAGE (VOLTS)40I C , COLLECTOR CURRENT (mA)Figure 12. Current–Gain – Bandwidth Product–0.1–0.2–502.0–100100200500502020106.04.0C , C A P A C I T A N C E (p F )f T , C U R R E N T –G A I N – B A N D W I D T H P R O D U C T208.0Ordering InformationDevice PackingPart Number-AP Ammo Packing: 20Kpcs/CartonPart Number-BP Bulk:1k/Bag,100K/Ctn; Note : Adding "-HF" Suffix for Halogen Free, eg. Part Number-TP-HF。

5-Inch HDMI LCD Dis-play with CapacitiveMulti -Touch TouchscreenSKU: U6103IntroductionThis UCTRONICS Display is a 5” LCD capacitive touchscreen display which receives video/audio signals through the HDMI port, and the touchscreen input through a micro -USB port. It requires three connections: 1)a USB cable connected to a 5V power supply, 2)an HDMI cable and 3)another USB cable (for touchscreen) both connected to the video output device. The 5-finger touch feature requires OS and software support. It is well integrated with single -board com-puters such as the Raspberry Pi series, and serves as a small screen for your PC or video game consoles. The micro -HDMI to HDMI adapter cable is to use with micro -HDMI de-vices like the Raspberry Pi 4, and the HDMI -to -HDMI connector is an alternative to a stand-ard HDMI cable.Package Contents● 1 x UCTRONICS 5” LCD HDMI displaywith a capacity multi -touch touchscreen ● 1 x Micro -HDMI to HDMI adapter cablefor Raspberry Pi 4 and other micro -HDMI devices● 1 x HDMI -to -HDMI connector as an HDMIcable alternative for Pi 3B+ and earlier models ● 1 x Micro USB to USB cable for USBtouch controller ● 1 x Instruction manualUCTRONICS Team● Website: ● GitHub Link For Software Package :https:///UCTRONICS/UCTRONICS_HDMI_CTS ● Email:*********************Note1. The native pixels of this display is 800 x 480. It will downscale HDMI inputs with larger resolutions and squeeze the original aspect ratios to match its own.2. Avoid EMI (electromagnetic interference) while using this display. The capacitive touchscreen may misbehave when placed near some power adapters, mouse, or data cables.3. Feed enough power to this display with an extra cable. An underpowered display may encounterunstable connections. Power adapters are preferred over onboard USB ports. We ’ve included one cable, but you need two for both power and touch. 4. The touchscreen double -click action is not per-fectly supported in Raspbian due to the limited response time and system driver issues. It will work properly on another operating system such as Win-dows 10.5. The USB touch port also takes power input, so you can try to power the display and add touchscreen support with a single cable. However, the Raspberry Pi does not natively support HDMI hotplug, and you need to set hdmi_force_hotplug=1 in config.txt . Please refer to the official page for more details: https:///documentation/configuration/config -txt/video.mdFeatures and Specs●Native Resolution: 800 x 480●Supported Input Resolution: Up to 1920x 1080 and auto downscaling●Power Consumption: 500mA @ 5V●Plug-and-Play Touchscreen: CapacitiveUSB-enabled touch controller●Multi-touch: 5-finger touch (requires OSand software support)●Raspberry Pi Friendly: Support all RPimodels (Pi Zero requires an extra HDMIadapter)●Touchscreen Monitor: Work as a com-pact monitor with USB touchscreen con-troller●Backlight Control: On-board modeswitch button for turning on/off the LCDbacklight●HDMI Audio Split: Extract audio out ofthe HDMI signal to the 3.5mm audio jack Use the Display●Power the display through the PWR port(Micro USB power) until you see theUCTRONICS logo.●Connect the display to your video outputdevice with an HDMI cable or the HDMI-to-HDMI adapter until you see the videofeed. Use the micro-HDMI to HDMIadapter if the connector does not match.●Connect the USB touch port of the dis-play to the USB port on the video outputdevice to enable touchscreen features.CONNECTORS EXPLANATIONThe connectors on the back of the display Add the native resolution to RPiThe input resolution may be downscaled to fit the native pixels, which will make the on-screen contents unreadable. Follow the steps below to add the native 800 x 480 resolution to the Raspberry Pi for a one-to-one mapping with regard to pixels.wget https:/// UCTRONICS/UCTRONICS_HDMI_CTS/master/uc586/hdmi_480x800_cfg.shsudo chmod +x hdmi_480x800_cfg.shsudo ./hdmi_480x800_cfg.shFor Raspberry Pi 4sudo nano /boot/config.txtComment out the following 2 lines#dtoverlay=vc4-fkms-v3d#max_framebuffers=2。