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Immersion CoolerNeoCool DipModel BE201/201F/301Instruction ManualFirst Edition●Thank you for choosing BE series immersion NeoCool Dip coolers from Yamato Scientific Co., Ltd.●For proper equipment operation, please read thisinstruction manual thoroughly before use. Alwayskeep equipment documentation safe and close athand for convenient future reference.Warning: Read instruction manual warnings andcautions carefully and completely beforeproceeding.Yamato Scientific America Inc．Santa Clara，CAPrinted on recycled paper1. SAFETY PRECAUTIONS (1)Explanation of Safety Symbols (1)Symbol Glossary (2)Warnings & Cautions (3)2. PRE-OPERATION PROCEDURES (4)Placement Precautions & Procedures (4)3. COMPONENT NAMES & FUNCTIONS (10)Main Unit Overview (10)4. OPERATION PROCEDURE (12)Main Operation (12)Cooling Capacity Curves (Reference Data) (13)Choosing Coolant for Low-T emp Applications (Reference Data) (15)5. HANDLING PRECAUTIONS (16)6. INSPECTION & MAINTENANCE (17)7. STORAGE & DISPOSAL (18)Extended Storage / Unit Disposal (18)Disposal Considerations (18)8. TROUBLESHOOTING (19)Troubleshooting Guide (19)9. SERVICE & REPAIR (20)10. SPECIFICATIONS (21)11. WIRING DIAGRAM (22)12. LIST OF HAZARDOUS SUBSTANCES (23)1.Explanation of Safety SymbolsSymbol GlossaryGeneral WarningDanger!: HighVoltageDanger!:Extremely HotDanger!: MovingPartsDanger!: BlastHazardGeneral CautionCaution:Shock Hazard!Caution: BurnHazard!Caution: Do NotHeat WithoutWater!Caution: MayLeak Water!Caution: WaterOnlyCaution: T oxicChemicalsGeneralRestrictionNo Open FlameDo NotDisassembleDo Not T ouchGeneral ActionRequiredConnect GroundWireLevel InstallationRequiredDisconnect PowerInspectRegularly1.Warnings & CautionsWarning Do not install or operate CF301 unit near flammable or explosive gases/fumes. Unit is NOT fire orSubstances” (PAlways ground this unit properly to avoid electric shock.Damagingshock to the operator.NeverHazardous Substances” (PBe sure there is adequate ventilation when working with certain flammable substances (such as ethanol, etc.), which evaporate quickly at or below room temperature, and emit flammable fumes. Insufficient ventilation may cause a fire or explosion.Caution2. Placement Precautions & ProceduresWarningNever connect ground wire to rods. Doing so may result in fire or electrical shock. 2. Place in suitable locations.Whit Black GreenPlacement Precautions & ProceduresWarning4. DO NOT disassemble or modify.Attempting to disassemble or modifiy this unit in any way may result in malfunction, electric shock.Placement Precautions & ProceduresWarningCaution 6. Place on level surfaces.Place unit on a level and even surface. Failure to do so may result in abnormal vibrations ornoise and damage to the refrigeration system.Placement Precautions & ProceduresCautionPlacement Precautions & ProceduresCautionPlacement Precautions & Procedures3. Main Unit OverviewBE201 front viewBE201 rear viewPower Switch (10A)Operation LampCooling CoilPower Cable(with plug)Cooling Coil SheathHandleHeat VentMain Unit OverviewBE201F/301 front viewBE201F/301 rear viewPower Switch (10A)Operation LampHandle Flexible Cooling Tube BE201F ：500mm BE301 ：1000mmMain OperationImmerse cooling coil in fluid as shown in diagram below. Turn power switch (ELB) “ON” to start operation.Wait at least five minutes to resume after halting an operation (e.g. turning power off). DONOT turn power switch “ON” and “OFF” repeatedly within a short timeframe. Damage tothe refrigeration system may result.Avoid operating unit continuously at fluid temperatures abive 35°C.Cooling Capacity Curves (Reference Data)Analysis provisions・External temperature：23°C・Power：220V AC・CPM：50Hz・Antifreeze fluid：60% Naiburain solution (covered, stirred and heat insulated)・Fluid quantity：BE201/201F: 5 ℓ BE301: 5 ℓ /10ℓ・T emp sensor placement：container centerBE201(5L)BE301(10L)BE201F(5L)BE301(5L)Cooling Capacity Curves (Reference Data) Analysis provisions・Room temperature：20°C・Power supply：220V AC・CPM：50Hz・Antifreeze fluid：60% Naiburain solution (covered, stirred and heat insulated)・Fluid quantity：BE201/201F: 5 ℓ BE301:10ℓ・Temp sensor placement：container centerChoosing Coolant for Low-T emp Applications (Reference Data)An anti-freeze coolant solution is required for applications below 10°C. Select a Naiburain® product with freezing point of 10°C or more below objective temperature. See “select coolant based on operating temperature ” on P .10.0-10-20-30-40-500102030405060708090100-10-20-30-40-50Concentration （wt%） Naiburain ® Freezing PointsT e m p e r a t u r e （°C ）Warning2. DO NOT operate equipment when abnormalities are detected.Caution2. DO NOT place objects on equipment.3. DO NOT operate equipment during thunderstorms.4. DO NOT operate dry.5. Operate equipment as directed.6. Keep upright.6.Daily general maintenance and inspection is recommended to ensure optimal performance.WarningCaution◆ Contact local dealer or Yamato sales office for further assistance.7.Extended Storage / Unit DisposalCaution WarningDisposal Considerations Dispose of or recycle this unit in a responsible and environmentally friendly manner.Yamato Scientific Co., Ltd. strongly recommends disassembling unit, as far as is possible, in order to separate parts and recycle them in contribution to preserving the global environment.Troubleshooting Guide◆If problem persists, turn off power immediately, disconnect power cable and call for service.9.When a problem occurs, terminate operation immediately, turn off main power switch (ELB) and disconnect power cable.Contact a local dealer or Yamato sales office for assistance.The following information is required for all repairs. ● Model name ● Serial Number● Date (year/month/day) of purchase● Description of problem in as much detail as possibleGuaranteed maximum supply period for repair parts is 7 (seven) years from date of discontinuation for BE series NeoCool Dip immersion coolers .“Repair parts” is defined as components which, when installed, allow for continued unit operation.See production/rating label on unit. Refer to P .11 & 12 for location.⌘1 Performance based on AC220V power supply; 20°C±5°C external temperature; 65%RH±20% humidity; no load. Performance will vary depending on operation conditions..⌘2 Protrusions excluded.11. BE201/201F/30112.Never process explosive substances, flammable substances or substances that containexplosives or flammables.Excerpt from T able 1, Hazardous Substances, of Cabinet Order of the Occupational Safety and Health Law (substances related to Articles 1, 6, and 9)Limited liabilityAlways operate equipment in strict compliance to the handling and operation procedures set forth by this instruction manual.Yamato Scientific Co., Ltd. assumes no responsibility for malfunction, damage, injury or death resulting from negligent equipment use.Never attempt to disassemble, repair or perform any procedure on BE series unit which is not expressly mandated by this manual. Doing so may result in equipment malfunction, serious personal injury or death.Notice●Instruction manual descriptions and specifications are subject to change withoutnotice.●Yamato Scientific Co., Ltd. will replace flawed instruction manuals (pages missing,pages out of order, etc.) upon request.Instruction ManualImmersion Cooler NeoCool DipBE201/201F/301First Edition:June 6, 2017Yamato Scientific America Inc.925 Walsh Avenue, Santa Clara, CA 95050Phone: 800.292.6286 / 408.235.7725。

KNT 310Data recorder and data reader for KISTOCKdataloggersWeight 340 gDisplayGraphic display 128 x 128 pixels Dimensions : 50 x 54 mm Blue backlight keypad Metal-coated5 keys and 1 joystickConformityElectromagnetical compatibility(as per NF EN 61326-1 standard)MaterialCompatible with food-industry environmentShock-proof ABS housing Protection IP54Power supply4 alkaline batteries 1,5V LR6EnvironmentAir and neutral gases Auto shut-offAdjustable from 0 to 120 mnTECHNICAL FEA TURES Storage capacity 500 000 points or 50 data setsSpeed of data transfer From kistock to data recorder : 400 values/second From data recorder to PC : 1000 values/second Operating temperature From 0 to 50°C Storage temperature From-20 to +80°C Radio span (in free field)300 m Frequency 868 MHzData storageIn the data recorder until downloading on PCFEA TURES OF HOUSING - Compatible with wireless Kistocks , wired kistocks 2010 and previous ranges- Possibility to record up to 50 datasets- Possibility to view real-time measurements from a kistock datalogger• Side view• Front view • Top viewDIMENSIONS (mm)KEY POINTS57.4161.980.8USING DATA RECORDERBefore downloading data stored from a kistock datalogger, this kistock has to registered in the data recorder.See kilog RF user manual to register a datalogger in the data recorder.➢Turn on the data recorder.➢ Go to “Kistock” with left and right arrows then press OK .➢ Select “RF Connection” with up and down arrows then press OK (see fig.1).A progress bar then the list of registered kistock are displayed.➢ Select the Kistock to download with up and down arrows then press OK (see fig.2).Connection screen then “Infos” screen are displayed. This last screen displays the kistock serial number, dataset name and number of dataset point.From this screen :➢ Select “Discharge“ with left and right arrows then press OK .Discharge screen with its progress bar is displayed.When discharge is finished :➢ Select “Display“ then press OK to visualize main features of the dataset : type of Kistock, serial number, dataset name, dates of beginning and end, number ofmeasurements and of registered channel with minimum and maximum values for each channel (see fig.3).Or➢ Select “New dataset“ then press OKto launch a new dataset.●Discharge date from a wired kistock to the data recorder➢Connect the data recorder and the kistock with the cable.➢ Turn on the data recorder.➢ Go to “Kistock“ with left and right arrows then press OK .➢ Select “Cable Connection » with up and down arrows then press OK (see fig.4).A progress bar is displayed « Infos “ screen. This last screen displays the kistock serial number, dataset name and number of dataset point.From this screen : ➢Select “Discharge“ with left and right arrows then press OK .Discharge screen with its progress bar is displayed.When discharge is finished :➢ Select “Display“ then press OK to visualize main features of the dataset : type of Kistock, serial number, dataset name, dates of beginning and end, number ofmeasurements and of registered channel with minimum and maximum values for each channel (see fig.5).Or➢ Select “New dataset“ then press OK to launch a new dataset.Fig. 4Fig. 2Fig. 3Fig. 1●Data downloading from a wireless kistock to data recorderFig. 5● Set the deviceThis part allows to adjust the following parameters of the data recorder :- Date/Time - Beep- Auto shut-off - Contrast - Backlight - Memory - Language➢From main screen, go to “Params” then press OK .Set date and time :➢ Go to “Date and time” line with up and down arrows then press OK .➢ Set date and time with arrows.➢ Press OK to validate.●Visualize data from a kistock in real-time on the data recorderWhen a Kistock is registered in the data recorder, it is possible to visualize its measurements in real-time :➢ Go to “Kistock” with left and right arrows then press OK .➢ Select “RF connection” with up and down arrows then press OK .➢ Select the Kistock up and down arrows then press OK .➢ Select “Values” with left and right arrows.Data recorder displays values measured by the Kistock. (see fig.7).●Delete dataset stored in the data recorder ➢ Turn the data recorder.➢ Go to “Memory” with left and right arrows.The device asks to erase :➢ Go to YES with up and down arrows to erase all datasets or➢ Go to NO to cancel and back to main screen or press Esc .Fig. 6Fig. 7➢ Select an operator and/or a customer if necessary.➢ Click on “Next” button.➢ Select the dataset file destination that will be created.➢ Select the required option concerning the files management.➢ Click on “Finish” button.●Discharge stored dataset from the data recorder to a computer ➢ Connect the data recorder on the base.➢ Turn on the data recorder.➢ Launch Kilog RF software.➢ Select as communication support the data recorder.➢ Click on “Transmit data” button.➢Tick the dataset to transmit.F T _a n g _n a v e t t e _K N T 310_R F _17/10/11 – R C S 24 (24) P ér i g u e u x 349 282 095 N o n -c o n t r a c t u a l d o c u m e n t – W e r e s e r v e t h e r i g h t t o m o d i f y t h e c h a r a c t e r i s t i c s o f o u r p r o d u c t s w i t h o u t p r i o r n o t i c e .Set backlight :➢Go to “Backlight” line with up and down arrows then press OK .➢ Set backlight between 1 and 9 or on Auto.➢ Press OK to validate.Delete datasets :➢ See previous page.Select the language of the device :➢ Go to “Language” line with up and down arrows then press OK .➢ Select language : French, English or another installed language.➢ Press OK to validate.Set contrast :➢ Go to “Contrast” line with up and down arrows then press OK .➢ Set contrast between 0 and 9.➢ Press OK to validate.Activate or deactivate beep :➢ Go to “BEEP” line with up and down arrows then press OK .➢ Select ON to activate or OFF to deactivate the beep of the keys.➢ Press OK to validate.Activate or deactivate auto shut-off of the data recorder :➢ Go to “Extinction” line with up and down arrows then press OK .➢ Select O FF to deactivate it or the time before automatic shut-off (15, 30, 45 min or 1h).➢ Press OK to validate.●About data recorder :➢ Turn on the device.➢ Go to “Infos” with left and right arrows..➢ Press OK .Data recorder serial number, number of stored datasets and firmware version are displayed.。

Mercedes-Benz MBN 31 030 Engineering Standard Date Published: 2008-03 Category: 31 Total No. of Pages (Including Annex): 12Person in Charge: DemmerPlant 019; Dept.: EP/QIN Date of Translation: 2008-07 Phone: +49(0)711-17-3 48 32 Decorative surface texturesDefinitions, design instructionsDekorative Oberflächentexturen; Begriffe, KonstruktionshinweiseForewordThis Standard specifies the representation of decorative surface textures such as wood and leather grain, ripples or profiling on drawings. It only applies to surface textures created for stylistic reasons. Technical requirements may also play a role, of course, such as the touch and feel (ergonomic, pleasant feel when touching) of controls. DIN EN ISO 8785 shall apply with regard to the qualitative description of surface textures created for technical reasons.This standard shall be used in conjunction with:- a collection of surface texture samples which is available for inspection in the De-sign/Interior trim Department or at a location designated by that department.ChangesNormative references updated, standard designation of decorative patterns (sequence standard number – pattern number) updated.Annex A1 List of pattern numbers newly arranged and updated to present status.Editorial revision and adaptation to template in accordance with MBN 820.NOTE: No guarantee can be given in respect of this translation. In all cases the latest German-language version of this Standard shall be taken as authoritative.Copyright Daimler AG 2008Contents1Scope (2)2Normative References (2)3Abbreviations, Acronyms, Definitions, & Symbols (2)4Specification of Surface Texture (3)4.1Indications on Drawings (3)4.2Transitional Rules (4)Annex A (informative) Decorative Surface Textures (5)A.1List of Decorative Pattern Numbers (5)1 ScopeThe surface textures covered by this Standard are located in the visible area of parts made of plastics, elastomers, natural products (e.g. leather, wood), paper products, laminated textiles, on extruded parts or on covers manufactured from the above-mentioned materials on parts. The relevant surface texture can only be achieved on a suitable material or substrate using the specific forming method.The suppliers indicated in the pattern number list (see Annex A1) are the original manufacturers of the relevant surface textures. The decorative patterns may also be applied by other suppliers, however, as Daimler-Benz AG holds the utility patents with all associated rights.2 Normative ReferencesDBL 5300 09.1989 withdrawn Supply Specification: Grains and surfaces of interior trim ma-terials; only a relevant Approval of procurement sources (BQF) existed with a list-ing of pattern numbers 5300.00 to 5300.99DIN EN ISO 128-20 Technical drawings - General principles of presentation - Part 20: Basic conven-tions for linesDIN EN ISO 8785 Geometrical Product Specifications (GPS) - Surface imperfections - Terms, defini-tions and parameters (ISO 8785:1998)MBN 31020-1Title blocks for design drawings; realization and processingVDA 2005 Technical Drawings – Specification of surface texture3 Abbreviations, Acronyms, Definitions, & SymbolsEtched grain: A surface texture applied with tools whereby the negative is applied by means of an etch-ing process.Decorative pattern number: A non-classifying designation with 6-digit number for a surface texture cor-responding to a surface texture sample.Electroerosive surface: A surface texture created on the mold as a negative by means of electro-thermal erosion using discharges (as spark or arc in a dielectric).Galvanic grain: A surface texture created on the mold as a negative by means of galvanic removal. Wood-type grain: Natural, reproduced or imitated surface texture as found in layered materials such as wood, sedimentary rock etc.Leather-type grain: Surface characterized by the irregular arrangement of surface characteristics, e.g. leather-like, sand-cast-type.Surface characteristics: In analogy with DIN EN ISO 8785: grooves, dimples, pinholes, pores, granules, waves, furrows, scales, stepped plates and chisel marks (for graphic representation, refer to DIN EN ISO 8785).Surface texture: In accordance with DIN EN ISO 8785: Repeated or accidental deviations from the geo-metrical surface in the three-dimensional topography of the surface.Embossed grain: A surface texture created by embossing in films and sheets etc.Profiling: A surface texture created by the regular arrangement of surface characteristics.Ripples: A surface texture created by the regular arrangement of grooves.4 Specification of Surface TextureThe relevant decorative surface texture and the related decorative pattern number is specified exclusively by Styling taking into account design-related conditions.4.1 Indications on DrawingsOn drawings, the relevant surface shall be identified in accordance with VDA 2005 by the basic symbol with circle as follows:The associated decorative pattern number shall be entered in the basic title block in the block “Pattern MBN 31030“ in accordance with MBN 31020-1.When different decorative surface textures are to be provided on one part, the relevant areas shall be identified as follows, for example:Enter the symbol * only in the block “Pattern MBN 31030” which is then detailed near the basic title block, e.g. as follows: * Pattern A: MBN 31030 000012 Pattern B: MBN 31030 530001PatternUsing the 3 D Master method:The indications, e.g. Pattern MBN 31030 000012, are here entered directly above the surface symbol.If only part of a surface is to be provided with a surface texture, the relevant area shall be marked using long dashed dotted line no. 04 in accordance with DIN EN ISO 128-20, e.g.:4.2 Transitional RulesThe following recoding applies with regard to the indications in accordance with DBL 5300 used until 1989: The DBL no. with product version is converted into a 6-digit decorative pattern number, e.g.:End of Main Document# # # # #NEW OLDDecorative pattern number DBL no. with PVPattern MBN 31030 530001Leather-type grain DBL 5300.01Annex A (informative)Decorative Surface TexturesA.1 List of Decorative Pattern NumbersThis list supersedes the so-called BQF for DBL 5300. Numbers starting with 53 ….. are identical with the former DBL numbers without “.” in front the of the “product version code“.Decorative pattern number Surface texture Type of part Original supplier, supplierdesignation000001 Embossed grain no. 47 161 Protective step covertopsleeper Phönix 23/11/89000002 Etched grain OP 971/371 Inlay mat W124 new Phönix 07/03/90000003 Etched grain no. 8180(aft. 530038) Large parts for en-gine compartmentfrom W140Standex International21/09/90000004 Knurled structure DIN 82 GF1,6/45 degrees (spoiler R129) Spoiler section Metzler09/10/90000005 Etched grain MT 4662 (as al-ternative to530095/530077/DEK 530077embossed grain)[100% = 0,12 mm – 10°80% = 0,09 mm – 7,5°60% = 0,07 mm – 6°40% = 0,05 mm – 4° ] Moldings Standex International24/11/90000006 Etched grain MT 9055[0,08 mm – 5,5 degrees] Technical partsW 202Standex International15/02/91000007 Sand blasting Headlights glass rim Bosch15/02/91000008 Embossed grainABS sheet/PVC expandedsheet MB-Tex Instrument panel,center consoleW 202Göppinger Kaliko LPB15/02/91 Benecke000009 Etched grain MT 84200,17 mm – 7,5 degrees(aft. 000008) Moldings paintedW 202Standex International15/02/91000010 Embossed grain- no application - Headliner film W 202 Göppinger Kaliko LL15/02/91- no application -000011 Etched grain MT 8420[0,11 mm – 5 degrees](flatter version of 000009) Moldings W 202 Standex International07/06/91000012 Embossing chessboard (profil-ing)Surface no. 3871 Aluminum parts ano-dized W202Erbslöh Aluminium al000013 Carbon pattern Cover housing top,ashtray bottom,Gallery 190 E 2.328/08/91000014 Black wood pattern Cover housing top,ashtray bottomGallery 190 E 1.828/08/91000015 Etched grain MT 90530,03 – 0,04 mm – 3 degrees Moldings W 202 Standex International15/10/91(weaker version DEK 000006)000016 Etched grain MT 80790,085 mm Nubbed surface inentry areaO 404Standex International03/03/92000017 Etched grain MT 113450,03/0,07Etched grain no. 153 Bumper surface(T 1N/TO/SkN)Hohenloher Formstruktur02/04/92000018 IMD – chessboard Moldings + paintMethod co. WAFA WAFA 12/07/92000019 Etched grain – honeycomb Speaker grilleTO Spain Spain 23/11/93000020 Etched grain MT 1055-8(analogous to 3 M film struc-ture) Headlamp surroundsno. 404,Seat belt buckleW202Standex International10/10/92000021 Embossed grain no. 497PVC sheet Dust shield rearbackrestBenecke Kaliko000022 Etched grain MT 8292 0,50mm Nubbed textureT1N / TOStandex International03/09/93000023 Etched grain MT 46480,02 to 0,06 mm Bumpers, add-onparts commercialvehiclesStandex International15/11/93000024 Etched grain MT 8289120 % = 0,16 mm100 % = 0,13 mm80 % = 0,09 mm60 % = 0,05 mm Pattern 000011Optimized roundedStandex InternationalFeb. 1994000025 Etched grain MT 8289120 % = 0,15 mm100 % = 0,12 mm80 % = 0,09 mm60 % = 0,07 mm Pattern 000005OptimizedStandex International06/04/94000026 Etched grain structure MT84100,11 mm 8°0,08 mm 6°0,05 mm 4°0,03 mm 2°Ribs of footrest T1N Standex International 000027 Floor mats TO Commercial vehicles Perstorp000028 Etched grain MT 8237 (oldnumber 80/1 / 8410)0,22 mm Ribs of footrestT1N/commercialvehiclesStandex International04/94000029 Etched grain MT 15124120 % 0,08 – 0,16100 % 0,069 – 0,14680 % 0,057 – 0,127 AAV (W163) Standex International(17/01/96)000030 Etched grain W 168100806040 W 168 Eschmann Stahl03/1995000031 Etched grainpattern 000008 opti.pattern 000024 opti. C 208 Eschmann Stahl06/1995000032 Etched grain MT 8392 TO Standex International08/1995000033 Etched grainmodification grain 000024 R170 StandexInternnational11/1995000034 Eroded grain MT8260 Standex International17/01/1996000035 Etched grain MT 11070 Cover soft-effectpaintwork C208Standex International000036 Embossed grain TPO Protective step filmall model seriesHornschuch000037 Grain telephone console C208 / W220 Standex25/04/96 000038 New leather grain (films) W220 Standex25/04/96000039 Grain MT 8038(mod. 000017) Outer sillW169Standex10/07/96000040 Grain MT 8163 Exterior parts W163(AAV) Standex 10/06/97000041 Leather grain “Colombino“MT8468 Steering wheel/gearshift bellows leatherStandex06/03/97000042 Embossed grain for ABSmatching 5300.77 Briccola(Italy)06/02/98000043 Grain0,055 mm - 4° Fascia/coverCommercial vehiclemodel refinementpackage Mopf 99Standex14/07/98000044 Leather grain “real“ for plastics(injection moldings) Standex14/07/98000045 R230 Leather grain “real“ forplastics (injection moldings) R230 Standex14/06/99000046 Panel material W168 telephoneconsole Metzeler 12/01/2000000047 InlaymatTPO compact filmPattern: MERB Hornschuch18/01/2000000048 Leather grain Catania Bader19/01/2000000049 Inlay mat waffle structure 14/03/2000000050 Fine structure mirror,overpaintableKrüth000051 Leather-real-grain, further de-velopment 000044Eschmann 000052 Structurebumpers,overpain-table 0,04/205°Standex000053 Leather embossing for Des-igno “Snake“Bader 000054 Grain R171000055 Pattern Etnea/dual gloss(66% von 000048) Parts made of PPBR169Krüth000056 Modified and reduced grainPattern Etnea reduced/dualgloss (40% of 000048) Parts made of PPBR169Krüth000057 Artificial leather material NCV2 ERA000058 Grain from 530003 shift bel-lows, MT 100068 G-Class StandexInternational000059 Embossed grain for ABS-panels, matching 530077 KVS6 Briccola,Italy000060 EPP grain under bunks000061 Grain for technical partsHighly reduced pattern Etnea,20% of 000048BR169 Krüth000062 Soft-Torino, reduced graindepth of 000045Film Benecke-Kaliko 000063 Lugano leather grain000064 Etnea/dual gloss ABS partsW251 / W164Krüth000065 Etnea single gloss ABS parts Krüth000066 Etnea reduced/single gloss ABS parts Krüth000067 Grain DoorsillNCV2000068 As leather unembossed PUR headlinerR230Benecke-Kaliko000069 CATENA PU mold skin W164 Krüth000070 Dot structure Molding area I-panelNCV2Krüth000071 PVC film (1,0 mm), Vulcaflex NCV3 sun visor Vulcaflex, Rebbert12/10/2007000072 Soft-Torino, reduced graindepth of 000045Injection molding Standex International000073 Crossed HPL surfaceAcc. Getalit “Colfu“WESTAG 000074 Notassigned000075 Etnea/singleglossDegree of gloss 2,2-2,8 PC/ABS parts Krüth08/11/2002000076 Nappa leather embossing W221 Boxmark14/01/2003000077 “Fabric” structure “Stoffstruk-tur” BR169 Krüth14/05/2003000078 PatternBergamo,Replacement for 000041 Steering wheelleather24/06/2003000079 Pattern“Pearl“ ExteriorW164 12/08/2003 000080 Pattern VL 05/09/03 Edge protectionBR169/24517/09/2003000081 Nubbedinlay(dots) Friedola27/01/20004000082 Pattern“Belluno“grain 542 C216 Benecke-Kaliko20/02/2004000083 Pattern Toyota GR004/C FasciasTurkey30/03/2004000084 Grain Murano 80%, injectionmolding, PP parts BR207 Krüth/Standex10/08/2006000085 Grain Murano, valid for skin,film and PP parts 204 basic grain 16/11/2004KrüthBenecke-Kaliko000086 EtchedgrainEG2604(0,26mm/14° demolding) Front end C216 26/07/2005Eschmann000087 Outdoor grain M257,Artificial leather with perfora-tion G-Class 08/02/2006Hornschuch000088 Outdoor grain M302,artificial leather G-Class 08/02/2006Hornschuch000089 Grain for PVC artificial leather NCV3 seat 13/04/2006Friedola 000090 Grain for PVC film NCV3 sun visor 13/04/2006Wordle Story000091 Textile grain, D-pillar“Rheintech II“ BR164 13/04/2006Krüth000092 Rubber grain window frameDepth 0,03 26/06/2006Standex000093 Etched grain MT9042 fornappa steering wheel car-cass/airbag cap BR207/212 21/02/2008Standex000094 Grain Murano 80%, injectionmolding ABS + PC-ABS parts BR207 Krüth/Standex10/08/2006000095 Pattern MURANO,single gloss grain ABS + PC-ABSparts, panels Bay-blend T85Krüth16/11/2004000096 Grain “Buffalo“ (MREN)PVC-KL (poss. PUR-KL) X204 31/02/2006Hornschuch000097 Not assigned000098 Bergamo pattern 90 µm(100%) steering wheel carcass R230 model refine-ment package Mopf2– steering wheel in-mould (IMC)Standex06/03/2007000099 PVC wear protection, Pearl BR169, 204 TMG07/03/2008 000100 Not assigned530000 Etched grain 8095, 0,13 mmround matt Moldings StandexInternational530001 Etched grain 8181, 0,13 mmround matt Moldings StandexInternational530002 Embossed grain 379 Film material Benecke Kaliko Embossed grain 1213 Film material AlkorEmbossed grain P 163 Film material FreudenbergEmbossed grain 29 Film material HolzapfelEmbossed grain BKN Film material HornschuchEmbossed grain DBM Film material Benecke KalikoEmbossed grain K 5 Film material Roser530003 Embossed grain 178 Film material Benecke KalikoEmbossedgrain1043FilmmaterialLeatherAlkorEmbossed grain P 245 Film materialLeatherFreudenbergEmbossed grain UHPD Film material HornschuchEmbossed grain AUBT Leather Benecke KalikoEmbossed grain Turf Film material Roser530004 Etched grain 8045, 0,03 mmround mattMoldings Standex International530005 Etched grain 8451, 0,03 mmround matt Moldings StandexInternational530006 Galvanic grain (embossedgrain 178)Moldings 530007 Embossed grain 478 Film material Benecke Kaliko Embossed grain 69 Film material Holzapfel 530008 Embossed grain 391 Film material Benecke Kaliko Embossed grain CFW pepita Film material FreudenbergEmbossed grain 81 FP Film material HolzapfelEmbossed grain BGF Film material HornschuchEmbossed grain DGB Film material Benecke Kaliko 530009 Embossed grain 475 Film material Benecke Kaliko Embossed grain P 329 Film material FreudenbergEmbossed grain UHPS Film material HornschuchEmbossed grain ASD Film material Benecke Kaliko 530010 Embossed grain 194 Film material Benecke Kaliko Embossed grain WV Film material Hornschuch 530011 Embossed grain Rona Leather Roser 530012 Profiling 56 b Extruded section Happich530013 Etched grain 8169, 0,14 mmround matt Moldings StandexInternational530014 Embossed grain w. cross stitchHWQ/FLP 406 LGFilm material Benecke Kaliko 530015 Embossed grain 104 LG Film material Happich 530016 45/1Textured paint DBL 7392.30Painted parts Möller530017 Etched grain 8143; 0,14 mmround matt Moldings StandexInternational530018 Etched grain 2078, 3,84 m Moldings Seibel Embossed grain 193 Film material Rehau 530019 Etched grain 2079, 4,50 mm Moldings Seibel530020 Etched grain 2088, 3,80 mm Moldings Seibel 530021 Etched grain 2089, 4,50 mm Moldings Seibel530022 Etched grain 1055 MT,0,03 mm Moldings StandexInternational530023 Embossed grain 56 Film material Holzapfel 530024 Leather grain 133 Deep-drawn semi-finished productUniroyal530025 Embossed grain 188, 3,00 mmEmbossed grain R36, 4,50 mm Deep-drawn semi-finished productUniroyal530026 Etched grain MX1555,0.03 mm round mattINVALID Replaced by 530075Etched grain 152/2,0,18 mm round mattINVALID Replaced by 530051530027 Etched grain 26036, 0,03 mmround matt Moldings StandexInternational530028 Etched grain 22, 0,03 mmround matt Moldings Verein.Werkstätten530029 Etched grain 68, 0,03 mmround matt Moldings Verein.Werkstätten530030 Embossed grain 16 Film material Phoenix530031 Ripples with underlyingleather-type grain 07-102Film material Phoenix530032 Etched grain 8055, 0,08 mmround mattMoldings Standex International530033 Etched grain 8166, 0,05 mmround matt Moldings StandexInternational530033 Etched grain 8166, 0,05 mmround matt FES Moldings StandexInternational530034 Embossed grain GFO Film material Benecke Kaliko 530035 Electroerosivesurface(Rz= 9-13µm)Moldings Field 24, VDI 3400 530036 Electroerosivesurface(Rz= 12-16µm)Moldings Field 27, VDI 3400 530037 Electroerosivesurface(Rz= 16-20µm)Moldings Field 30, VDI 3400 530038 Electroerosivesurface(Rz= 21-25µm)Moldings Field 33, VDI 3400 530039 Embossed grain 17 Film material Phoenix530040 Etched grain 8362, 0,16 mmround matt Moldings StandexInternational530041 Etched grain 8036, 0,11 mmround matt Moldings StandexInternational530042 Ripples parallel (linewidth/distance = 3/7) Moldings StandexInternational530043 Etched grain 0,01 mm roundmatt Moldings StandexInternational530044 Etched grain 8045, 0,01 mmFES Moldings StandexInternational530045 Etched grain 8098, 0,04 roundmatt Moldings StandexInternational530046 Etched grain 212, 0,03 mmround mattMoldings Eschmann 530047 Electroerosivesurface(Rz= 37-45µm)Moldings Field 36, VDI 3400530048 Etched grain 8248, 0,14 mmround matt Moldings StandexInternational530049 Etched grain 8182, 0,06 mmround matt Moldings StandexInternational530050 Etched grain 25, 0,03 mmround matt Moldings Verein.Werkstätten530051 Replaced by 5300 75530052 Etched grain 8074, 0,06 mmround mattMoldings Standex International 530053 Embossed grain 259 Film material Benecke KalikoEmbossed grain 83 Film material HolzapfelEmbossed grain MKG Film material HornschuchEmbossed grain DSF Film material Benecke Kaliko530054 Etchedgrain Moldings Holzapfel530055 Etched grain 8498-K 004 G,0,04 mm heavily roundedMoldings Standex International 530056 Embossed grain 8 Film material Schlegel 8530057 Rhombic texture 471245 – 49 /121- Phoenix530058 Etched grain MT 8283,0,20 mm Moldings StandexInternational530059 Galvanic grain 178, as530003, flatter grain Moldings Accordingtoapproval530060 Embossed grain 79 / Benecke Film material Happich530061 Embossed grain Turf K 78 as530003spikedFilm material leather DB-Internal530062 Embossed grain Turf K 78 as530003perforatedFilm material leather Recaro530063 Etched grain K 1600 G Moldings Standex Intertnational 530064 Embossed grain Turf K 78 as530003extremely finely perforatedFilm material leather Recaro530065 Roughly chased Film material leather According to approval530066 Electroerosive surfaceRa 9,00 Moldings VDI guideline 3400 field39530067 ElectroerosivesurfaceRa 12,50 Moldings VDI guideline 3400 field42530068 ElectroerosivesurfaceRa 18,00 Moldings VDI guideline 3400 field45530069 Embossed grain La 3601 Film material HagedornEmbossed grain no. 1 Film material MetzlerEmbossed grain no. 6 Film material Flachglas AG 530070 Etched grain K 3500 A Moldings J. & F. Krüth530071 Etched grain 8230, 0,08 mmround mattMoldings Standex International 530072 Grooves no. 44 Phoenix-Gummiwerke 530073 Embossed grain 228 Film material Benecke Kaliko 530074 Grooves no. 102 Phoenix-Gummiwerke530075 Etched grain MX 1555,0,18 mm round matt Moldings StandexInternational530076 Paper embossing AUB, castleather-type grainPaper embossing Benecke KalikoPaper embossing 1158, castleather-type grainPaper embossing Benecke Kaliko530077 Embossed grain 289, VKZ, NG90Film material Benecke Kaliko530078 Etched grain no. G 149, NG90, 0,12mm and 0,06mm Moldings EschmannStahl530079 Embossed grain no. 147 Film material Uniroyal KunstoffeEmbossed grain no. 8 Em-bossing MetzlerThermoplast530080 Embossed grain 80235 Film material Pegulan530081 Etched grain K 2400 Moldings Standex International 530082 Embossed grain LP Film material Benecke Kaliko 530083 Embossed grain no. 197similar to 530033Film material Uniroyal Kunstoffe530084 Embossed grain no. 375 Film material Benecke Kaliko530085 Etched grain no. 4570 / 23006,0,010 to 0,012 mm Moldings StandexInternational530086 Embossed grain no. 17(Profile 17.3309)Profiled material Draftex530087 Rubber surface treatmentJET-grainRubber parts Reitter / Schefenacker530088 Embossed grain Rona NappaParana 1113 for leather steer-ing wheel, perspiration resis-tant (1,1 to 1,3 mm) Leather Roser14/11/1986530088 / smooth Embossed grain Rona NappaParana 1113 for leather steer-ing wheel, perspiration resis-tant (1,1 to 1,3 mm); smoothfor shift and U bellowsLeather Roser14/11/1986530089 Etched grain K 7000 K (LN 1) Moldings Standex International 530090 Etched grain 8181, 0,16 mmround matt; deep for soft-feeling paintPainted moldings Standex International530091 Leather grainRosanil DF/W EK78 and AK78 Upholstery leather,softRoser530092 Etched grain 65/1, 0,03 roundmatt Air deflectorsliding/tilting sunroofStandex International530093 Etched grain no. G 149, 0,02mm deep (NG90)Moldings Eschmann-Stahl 530094 Embossed grain no. 164 Uniroyal 530095 Moldedgraingalvanic/electroerosive aft. 530077 (NG90)Moldings Petri (12/88) 530096 Moldedgraingalvanic/electroerosive aft. 530003(passenger cars)Moldings Petri (12/88)530097 Diagonalpyramid(Accutech no. 02) StandexInternational530098 Powder grain 3/1000 mm Coating door handle Huf, Ymos, UbrigFingscheidt 530099 Rubber mat steps topsleeper Rubber mat steps Phönix5/89-End of list -End of Annex A# # # # #。

QFNHTQFPSimplified Application CircuitTPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 200710-W STEREO CLASS-D AUDIO POWER AMPLIFIERCheck for Samples:TPA3101D2FEATURESAPPLICATIONS•Televisions•10-W/ch into an 8-ΩLoad From a 13-V Supply •9.2-W/ch into an 8-ΩLoad From a 12-V Supply DESCRIPTION•Operates from 10V to 26VThe TPA3101D2is a 10-W (per channel)efficient,•87%Efficient Class-D Operation Eliminates Class-D audio power amplifier for driving bridged-tied Need for Heat Sinksstereo speakers.The TPA3101D2can drive stereo •Four Selectable,Fixed Gain Settings speakers as low as 4Ω.The high efficiency of the •Differential InputsTPA3101D2,87%,eliminates the need for an external heat sink when playing music.•Thermal and Short-Circuit Protection With Auto Recovery FeatureThe gain of the amplifier is controlled by two gain select pins.The gain selections are 20,26,32,•Clock Output for Synchronization With 36dB.Multiple Class-D DevicesThe outputs are fully protected against shorts to •Surface Mount 7mm ×7mm,48-pin QFN GND,V CC ,and output-to-output shorts with an auto Packagerecovery feature and monitor output.•Surface Mount 7mm ×7mm,48-pin HTQFP PackagePlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright ©2005–2007,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.TPA3101D2SLOS473C–DECEMBER2005–REVISED These devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range(unless otherwise noted)(1)UNITV CC Supply voltage AVCC,PVCC–0.3V to30VSHUTDOWN,MUTE–0.3V to V CC+0.3VV I Input voltage GAIN0,GAIN1,RINN,RINP,LINN,LINP,MSTR/SLV,–0.3V to VREG+0.5VSYNCContinuous total power dissipation See Thermal Information TableT A Operating free-air temperature range–40°C to85°CT J Operating junction temperature range(2)–40°C to150°CT stg Storage temperature range–65°C to150°CR(Load)Load Resistance 3.2ΩMinimumHuman body model(3)(all pins)±2kV Electrostatic discharge Machine model(4)(all pins)±200VCharged-device model(5)(all pins)±500V(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratingsonly,and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The TPA3101D2incorporates an exposed thermal pad on the underside of the chip.This acts as a heatsink,and it must be connectedto a thermally dissipating plane for proper power dissipation.Failure to do so may result in the device going into thermal protection shutdown.See TI Technical Briefs SCBA017D and SLUA271for more information about using the QFN thermal pad.See TI Technical Briefs SLMA002for more information about using the HTQFP thermal pad.(3)In accordance with JEDEC Standard22,Test Method A114-B.(4)In accordance with JEDEC Standard22,Test Method A115-A(5)In accordance with JEDEC Standard22,Test Method C101-ATHERMAL INFORMATIONPHP RGZTHERMAL METRIC(1)(2)UNITS48(PINS)48(PINS)q JA Junction-to-ambient thermal resistance28.526.4q JCtop Junction-to-case(top)thermal resistance1919q JB Junction-to-board thermal resistance10.514.4°C/Wy JT Junction-to-top characterization parameter0.30.2y JB Junction-to-board characterization parameter 6.4 6.3q JCbot Junction-to-case(bottom)thermal resistance0.7 1.7(1)For more information about traditional and new thermal metrics,see the IC Package Thermal Metrics application report,SPRA953.(2)For thermal estimates of this device based on PCB copper area,see the TI PCB Thermal Calculator.RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN MAX UNITV CC Supply voltage PVCC,AVCC1026VSHUTDOWN,MUTE,GAIN0,GAIN1,MSTR/SLV,V IH High-level input voltage2VSYNCSHUTDOWN,MUTE,GAIN0,GAIN1,MSTR/SLV,V IL Low-level input voltage0.8VSYNC2Submit Documentation Feedback Copyright©2005–2007,Texas Instruments IncorporatedProduct Folder Link(s):TPA3101D2TPA3101D2 SLOS473C–DECEMBER2005–REVISED SEPTEMBER2007RECOMMENDED OPERATING CONDITIONS(continued)over operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS MIN MAX UNITSHUTDOWN,V I=V CC,V CC=24V125MUTE,V I=V CC,V CC=24V75I IH High-level input currentµAGAIN0,GAIN1,MSTR/SLV,SYNC,V I=VREG,2V CC=24VSHUTDOWN,V I=0,V CC=24V2I IL Low-level input currentµASYNC,MUTE,GAIN0,GAIN1,MSTR/SLV,V I=01V,V CC=24VV OH High-level output voltage FAULT,I OH=1mA VREG-0.6VV OL Low-level output voltage FAULT,I OL=-1mA AGND+0.4Vf OSC Oscillator frequency R osc Resistor=100kΩ,MSTR/SLV=2V200300kHzT A Operating free-air temperature–4085°C DC CHARACTERISTICST A=25°C,V CC=24V,R L=8Ω(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITClass-D output offset voltage(measured|V OS|V I=0V,Gain=36dB550mV differentially)Bypass reference for input amplifier VBYP,no load 1.1 1.25 1.45V4-V internal supply voltage VREG,no load,V CC=10V to26V 3.754 4.25VV CC=12V to24V,inputs ac coupled to AGND,PSRR DC Power supply rejection ratio-70dBGain=36dBI CC Quiescent supply current SHUTDOWN=2V,MUTE=0V,no load,filter2226.5mAor snubberI CC(SD)Quiescent supply current in shutdown mode SHUTDOWN=0.8V,no load,filter or snubber300400µAI CC(MUTE)Quiescent supply current in mute mode MUTE=2V,no load,filter or snubber810mAHigh Side370V CC=12V,I O=500mA,r DS(on)Drain-source on-state resistance Low side370mΩT J=25°CTotal780950GAIN0=0.8V192021GAIN1=0.8V dBGAIN0=2V252627G GainGAIN0=0.8V313233GAIN1=2V dBGAIN0=2V353637 Gain matching Between channels2%t ON Turn-on time C(VBYP)=1µF,SHUTDOWN=2V25mst OFF Turn-off time C(VBYP)=1µF,SHUTDOWN=0.8V0.1ms DC CHARACTERISTICST A=25°C,V CC=12V,R L=8Ω(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITClass-D output offset voltage(measured|V OS|V I=0V,Gain=36dB550mV differentially)Bypass reference for input amplifier VBYP,no load 1.1 1.25 1.45V4-V internal supply voltage VREG,no load 3.754 4.25VV CC=12V to24V,Inputs ac coupled to AGND,PSRR DC Power supply rejection ratio-70dBGain=36dBI CC Quiescent supply current SHUTDOWN=2V,MUTE=0V,no load,filter1822.5mAor snubberI CC(SD)Quiescent supply current in shutdown mode SHUTDOWN=0.8V,no load,filter or snubber180300µAI CC(MUTE)Quiescent supply current in mute mode MUTE=2V,no load,filter or snubber79mA Copyright©2005–2007,Texas Instruments Incorporated Submit Documentation Feedback3Product Folder Link(s):TPA3101D2TPA3101D2SLOS473C–DECEMBER2005–REVISED DC CHARACTERISTICS(continued)T A=25°C,V CC=12V,R L=8Ω(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNITHigh Side370V CC=12V,I O=500mA,r DS(on)Drain-source on-state resistance Low side370mΩT J=25°CTotal780950GAIN0=0.8V192021GAIN1=0.8V dBGAIN0=2V252627G GainGAIN0=0.8V313233GAIN1=2V dBGAIN0=2V353637t ON Turn-on time C(VBYP)=1µF,SHUTDOWN=2V25mst OFF Turn-off time C(VBYP)=1µF,SHUTDOWN=0.8V0.1ms AC CHARACTERISTICST A=25°C,V CC=24V,R L=8Ω(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT200mV PP ripple from20Hz–1kHz,K SVR Supply ripple rejection–70dBGain=20dB,Inputs ac-coupled to AGNDP O Continuous output power THD+N=0.09%,f=1kHz(thermally limited)10W THD+N Total harmonic distortion+noise f=1kHz,P O=5W(half-power)0.09%100µVV n Output integrated noise20Hz to22kHz,A-weighted filter,Gain=20dB–80dBV Crosstalk V O=1Vrms,Gain=20dB,f=1kHz–92dBMaximum output at THD+N<1%,f=1kHz,SNR Signal-to-noise ratio102dBGain=20dB,A-weightedThermal trip point150°CThermal hysteresis30°C AC CHARACTERISTICST A=25°C,V CC=12V,R L=8Ω(unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP MAX UNIT200mV PP ripple from20Hz–1kHz,K SVR Supply ripple rejection–70dBGain=20dB,Inputs ac-coupled to AGNDTHD+N=7%,f=1kHz8.7THD+N=10%,f=1kHz9.2P O Continuous output power WTHD+N=10%,f=1kHz,V CC=13V10THD+N=0.26%,f=1kHz,R L=4Ω(thermally10limited)THD+N Total harmonic distortion+noise R L=8Ω,f=1kHz,P O=4.5W(half-power)0.08%R L=4Ω,f=1kHz,P O=5W(half-power)0.11%100µVV n Output integrated noise20Hz to22kHz,A-weighted filter,Gain=20dB–80dBV Crosstalk P o=1W,Gain=20dB,f=1kHz–94dBMaximum output at THD+N<1%,f=1kHz,SNR Signal-to-noise ratio98dBGain=20dB,A-weightedThermal trip point150°CThermal hysteresis30°C4Submit Documentation Feedback Copyright©2005–2007,Texas Instruments IncorporatedProduct Folder Link(s):TPA3101D2N V B L O U N B S L O U V R E A G N R O S B S L O U L O UG N R O S V R E V B Y A G N B S L L O U T L O U T L O U T L O U T B S L G N PGNDL TPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 200748PIN,QFN PACKAGE48PIN,HTQFP PACKAGE(TOP VIEW)(TOP VIEW)TERMINAL FUNCTIONSTERMINALI/ODESCRIPTIONQFN HTQFP NAME NO.NO.Shutdown signal for IC (LOW =disabled,HIGH =operational).TTL logic SHUTDOWN 4444I levels with compliance to AVCC.RINN 22I Negative audio input for right channel.Biased at VREG/2.RINP 33I Positive audio input for right channel.Biased at VREG/2.LINN 66I Negative audio input for left channel.Biased at VREG/2.LINP 55I Positive audio input for left channel.Biased at VREG/2.GAIN087,8I Gain select least significant bit.TTL logic levels with compliance to VREG.GAIN199IGain select most significant bit.TTL logic levels with compliance to VREG.1,12,13,GND 24,25,36,Connect to the thermal pad.37Mute signal for quick disable/enable of outputs (HIGH =outputs high-Z,MUTE 4545I LOW =outputs enabled).TTL logic levels with compliance to AVCC.TTL compatible output.HIGH =short-circuit fault.LOW =no fault.Only FAULT 4646O reports short-circuit faults.Thermal faults are not reported on this terminal.BSLP 1818I/O Bootstrap I/O for left channel,positive high-side FET.Power supply for left channel H-bridge,not internally connected to PVCCR PVCCL 26,2726,27or AVCC.LOUTP 19,2019,20O Class-D 1/2-H-bridge positive output for left channel.PGNDL 28,2928,29Power ground for left channel H-bridge.LOUTN 21,2221,22O Class-D 1/2-H-bridge negative output for left channel.BSLN 2323I/O Bootstrap I/O for left channel,negative high-side FET.VCLAMPL 3030Internally generated voltage supply for left channel bootstrap capacitor.VCLAMPR 3131Internally generated voltage supply for right channel bootstrap capacitor.BSRN 3838I/O Bootstrap I/O for right channel,negative high-side FET.ROUTN 39,4039,40O Class-D 1/2-H-bridge negative output for right channel.PGNDR32,3332,33Power ground for right channel H-bridge.Copyright ©2005–2007,Texas Instruments IncorporatedSubmit Documentation Feedback5Product Folder Link(s):TPA3101D2TPA3101D2SLOS473C–DECEMBER2005–REVISED TERMINAL FUNCTIONS(continued)TERMINALI/O DESCRIPTIONQFN HTQFPNAMENO.NO.ROUTP41,4241,42O Class-D1/2-H-bridge positive output for right channel.PVCCR34,3534,35Power supply for right channel H-bridge,not connected to PVCCL or AVCC. BSRP4343I/O Bootstrap I/O for right channel,positive high-side FET.AGND4,174,17Analog ground for digital/analog cells in core.ROSC1414I/O I/O for current setting resistor of ramp generator.Master/Slave select for determining direction of SYNC terminal.HIGH=Master mode,SYNC terminal is an output;LOW=slave mode, MSTR/SLV1010ISYNC terminal accepts a clock input.TTL logic levels with compliance toVREG.Clock input/output for synchronizing multiple class-D devices.Direction SYNC1111I/Odetermined by MSTR/SLV terminal.Input signal not to exceed VREG.Reference for preamplifier.Nominally equal to1.25V.Also controls start-up VBYP1616Otime via external capacitor sizing.4-V regulated output for use by internal cells,GAINx,MUTE,andVREG1515OMSTR/SLV pins only.Not specified for driving other external circuitry.High-voltage analog power supply.Not internally connected to PVCCR or AVCC4847,48PVCCL.1,7,12,NC13,24,25,Not internally connected.36,37,47Connect to AGND and PGND–should be star point for both grounds.Internal resistive connection to AGND and PGND.Thermal vias on the PCB Thermal Pad---should connect this pad to a large copper area on an internal or bottomlayer for the best thermal performance.The Thermal Pad must be solderedto the PCB for mechanical reliability.6Submit Documentation Feedback Copyright©2005–2007,Texas Instruments IncorporatedProduct Folder Link(s):TPA3101D2BSRNVCLAMPR PVCCRPVCCL LOUTPTPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 2007FUNCTIONAL BLOCK DIAGRAMTable 1.TABLE OF GRAPHS (1)FIGURETHD+N Total harmonic distortion +noise vs Frequency 1,2,3,4THD+NTotal harmonic distortion +noise vs Output power 5,6,7,8Closed-loop response vs Frequency 9,10Output power vs Supply voltage 11.12Efficiencyvs Output power 13,14V CC Supply current vs Total output power 15,16Crosstalkvs Frequency 17,18k SVR Supply ripple rejection ratiovs Frequency19,20(1)All graphs were measured using the TPA3101D2EVM.Copyright ©2005–2007,Texas Instruments Incorporated Submit Documentation Feedback7Product Folder Link(s):TPA3101D20.003100.0050.010.020.050.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r t i o n - %f - Frequency - Hz2020k501002005001k 2k5k 10k f - Frequency - Hz0.003100.0050.010.020.050.10.20.5125T H D - T o t a l H a r m o n i c D i s t or t i o n - %0.003100.0050.010.020.050.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r t i o n - %f - Frequency - Hz0.003100.0050.010.020.050.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r ti o n - %f - Frequency - HzTPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 2007TOTAL HARMONIC DISTORTION +NOISETOTAL HARMONIC DISTORTION +NOISEvsvsFREQUENCYFREQUENCYA.Power above 10W may require increased heatsinking.A.Power above 10W may require increased heatsinking.Figure 1.Figure 2.TOTAL HARMONIC DISTORTION +NOISETOTAL HARMONIC DISTORTION +NOISEvsvsFREQUENCYFREQUENCYA.Power above 10W may require increased heatsinking.A.Power above 10W may require increased heatsinking.Figure 3.Figure 4.8Submit Documentation FeedbackCopyright ©2005–2007,Texas Instruments IncorporatedProduct Folder Link(s):TPA3101D20.01100.020.050.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r t i o n - %P - Output Power - WO 10m4050m 100m 200m 1251020P - Output Power - WOT H D - T o t a l H a r m o n i c D i s t o r t i o n - %0.01100.020.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r t i o n - %P - Output Power - WO 0.01100.020.10.20.5125T H D - T o t a l H a r m o n i c D i s t o r t i o n - %P - Output Power - WO TPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 2007TOTAL HARMONIC DISTORTION +NOISETOTAL HARMONIC DISTORTION +NOISEvsvsOUTPUT POWEROUTPUT POWERA.Power above 10W may require increased heatsinking.A.Power above 10W may require increased heatsinking.Figure 5.Figure 6.TOTAL HARMONIC DISTORTION +NOISETOTAL HARMONIC DISTORTION +NOISEvsvsOUTPUT POWEROUTPUT POWERA.Power above 10W may require increased heatsinking.A.Power above 10W may require increased heatsinking.Figure 7.Figure 8.Copyright ©2005–2007,Texas Instruments Incorporated Submit Documentation Feedback9Product Folder Link(s):TPA3101D2f - Frequency - HzG a i n −d BP h a s e −of - Frequency - HzG a i n −d BP h a s e −oV - Supply Voltage - V CC 101214161820222426P O −O u t p u t P o w e r −WV - Supply Voltage - VCC 10111213P O −O u t p u t P o w e r −WTPA3101D2SLOS473C –DECEMBER 2005–REVISED SEPTEMBER 2007CLOSED LOOP RESPONSECLOSED LOOP RESPONSEvsvsFREQUENCYFREQUENCYFigure 9.Figure 10.OUTPUT POWEROUTPUT POWERvsvsSUPPLY VOLTAGESUPPLY VOLTAGEFigure 11.Figure 12.10Submit Documentation FeedbackCopyright ©2005–2007,Texas Instruments IncorporatedProduct Folder Link(s):TPA3101D2P O −Output Power (Per Channel)−W010203040506070809010002468101214161820E f f i c i e n c y −%P O −Output Power (Per Channel)−W 01020304050607080901000246810121415E f f i c i e n c y −%P O −T otal Output Power −W 00.511.522.510203040I C C −S u p p l y C u r r e n t −AP O −T otal Output Power −W0.511.522.510203040I C C −S u p p l y C u r r e n t −AEFFICIENCYEFFICIENCYvsvsOUTPUT POWEROUTPUT POWERFigure 13.Figure 14.SUPPLY CURRENTSUPPLY CURRENTvsvsTOTAL OUTPUT POWERTOTAL OUTPUT POWERFigure 15.Figure 16.−140−120−100−80−60-40f −Frequency −HzC r o s s t a l k −d B201001k10k 20k−140−120−100−80−60-40f −Frequency −HzC r o s s t a l k −d B201001k10k 20k−100−90−80−70−60−50−40−30−20−100f −Frequency −Hzk S V R −S u p p l y R i p p l e R e j e c t i o n R a t i o −d B201001k10k 20k−100−90−80−70−60−50−40−30−20−100f −Frequency −Hzk S V R −S u p p l y R i p p l e R e j e c t i o n R a t i o −d B201001k10k 20kCROSSTALKCROSSTALKvsvsFREQUENCYFREQUENCYFigure 17.Figure 18.SUPPLY RIPPLE REJECTION RATIOSUPPLY RIPPLE REJECTION RATIOvsvsFREQUENCYFREQUENCYFigure 19.Figure 20.u t p u tt d o w n M u t e t r o lDifferentialAnalog InputsAPPLICATION INFORMATIONFigure 21.Stereo Class-D With Differential Inputs (QFN)utputtdownMutetrolSingle-EndedAnalogInputs4-StepGain ControlSynchronize MultipleClass-D DevicesFigure22.Stereo Class-D With Single-Ended Inputs(QFN)t p u to w n u t e o lDifferentialAnalog InputsFigure 23.Stereo Class-D With Differential Inputs (HTQFP)utputtdownMutetrolSingle-EndedAnalogInputs4-StepGain ControlSynchronize MultipleClass-D DevicesFigure24.Stereo Class-D With Single-Ended Inputs(HTQFP)0 V -12 V+12 VCurrentOUTPDifferential V oltageAcross LoadCLASS-D OPERATIONThis section focuses on the class-D operation of the TPA3101D2.Traditional Class-D Modulation SchemeThe traditional class-D modulation scheme,which is used in the TPA032D0x family,has a differential output where each output is 180degrees out of phase and changes from ground to the supply voltage,V CC .Therefore,the differential prefiltered output varies between positive and negative V CC ,where filtered 50%duty cycle yields 0V across the load.The traditional class-D modulation scheme with voltage and current waveforms is shown in Figure 25.Note that even at an average of 0V across the load (50%duty cycle),the current to the load is high,causing high loss and thus causing a high supply current.Figure 25.Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms into anInductive Load With No InputTPA3101D2Modulation SchemeThe TPA3101D2uses a modulation scheme that still has each output switching from 0to the supply voltage.However,OUTP and OUTN are now in phase with each other with no input.The duty cycle of OUTP is greater than 50%and OUTN is less than 50%for positive output voltages.The duty cycle of OUTP is less than 50%and OUTN is greater than 50%for negative output voltages.The voltage across the load sits at 0V throughout most of the switching period,greatly reducing the switching current,which reduces any I 2R losses in the load.-12 VCurrentDifferentialVoltage Across Load-12 VCurrentDifferentialVoltage Across LoadFigure 26.The TPA3101D2Output Voltage and Current Waveforms Into an Inductive LoadEfficiency:LC Filter Required With the Traditional Class-D Modulation SchemeThe main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results in maximum current flow.This causes more loss in the load,which causes lower efficiency.The ripple current is large for the traditional modulation scheme,because the ripple current is proportional to voltage multiplied by the time at that voltage.The differential voltage swing is 2x V CC ,and the time at each voltage is half the period for the traditional modulation scheme.An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle,while any resistance causes power dissipation.The speaker is both resistive and reactive,whereas an LC filter is almost purely reactive.The TPA3101D2modulation scheme has little loss in the load without a filter because the pulses are short and the change in voltage is V CC instead of 2x V CC .As the output power increases,the pulses widen,making the ripple current larger.Ripple current could be filtered with an LC filter for increased efficiency,but for most applications the filter is not needed.An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load.The filter has less resistance but higher impedance at the switching frequency than the speaker,which results in less power dissipation,therefore increasing efficiency.When to Use an Output Filter for EMI SuppressionDesign the TPA3101D2without the filter if the traces from amplifier to speaker are short (<10cm).Powered speakers,where the speaker is in the same enclosure as the amplifier,is a typical application for class-D without a filter.Most applications require a ferrite bead filter.The ferrite filter reduces EMI around1MHz and higher(FCC and CE only test radiated emissions greater than30MHz).When selecting a ferrite bead,choose one with high impedance at high frequencies,but low impedance at low frequencies.Use an LC output filter if there are low frequency(<1MHz)EMI-sensitive circuits and/or there are long wires from the amplifier to the speaker.When both an LC filter and a ferrite bead filter are used,the LC filter should be placed as close as possible to the IC followed by the ferrite bead filter.Figure27.Typical LC Output Filter,Cutoff Frequency of28kHz,Speaker Impedance=8ΩFigure28.Typical LC Output Filter,Cutoff Frequency of28kHz,Speaker Impedance=4ΩFerriteFigure29.Typical Ferrite Chip Bead Filter(Chip Bead Example:Fair-Rite2512067007Y3)0f −Frequency −Hz1020304050607030 M230 M 430 M 630 M 830 ML i m i t L e v e l −d B (V i n )m National Technical Systems, Plano Tx Radiated Emissions 30 MHz - 1000 MHzFCC B LimitsFCC B LimitPeak dB-10Using the LC filter in Figure 27,the TPA3101D2EVM passed the FCC Part 15Class B radiated emissions test with 21inch speaker wires.Quasi-peak measurements were taken for the 4standard test configurations,and the TPA3101D2EVM passed with at least 14-dB margin.A plot of the peak measurement for the horizontal rear configuration is shown in Figure 30.Figure 30.Radiated Emissions Prescan 30MHz -1000MHzInductors used in LC filters must be chosen carefully.A significant change in inductance at the peak output current of the TPA3101D2will cause increased distortion.The change of inductance at currents up to the peak output current must be less than 0.1m H per amp to avoid this.Also note that smaller inductors than 33m H may cause an increase in distortion above what is shown in preceding graphs of THD versus frequency and output power.Capacitors used in LC filters must also be chosen carefully.A significant change in capacitance at the peak output voltage of the TPA3101D2will cause increased distortion.LC filter capacitors should have DC-voltage ratings of at least twice the peak application voltage (the power supply voltage)and should be made of X5R or better material.In all cases,avoid using capacitors with loose temperature ratings like Y5V.TPA3101D2Closest Competitor t - Time = 100s/div m V - V o l t a g e = 10 V /d i vTPA3101D2Closest Competitort - Time = 20s/divm V - V o l t a g e = 1 V /d i v Adaptive Dynamic Range ControlFigure 31.1-kHz Sine Output at 10%THD+N Figure 32.8-kHz Sine Output at 10%THD+NThe Texas Instruments patent-pending adaptive dynamic range control (ADRC)technology removes the notch inherent in class-D audio power amplifiers when they come out of clipping.This effect is more severe at higher frequencies as shown in Figure 32.Gain setting via GAIN0and GAIN1inputsThe gain of the TPA3101D2is set by two input terminals,GAIN0and GAIN1.The gains listed in Table 2are realized by changing the taps on the input resistors and feedback resistors inside the amplifier.This causes the input impedance (Z I )to be dependent on the gain setting.The actual gain settings are controlled by ratios of resistors,so the gain variation from part-to-part is small.However,the input impedance from part-to-part at the same gain may shift by ±20%due to shifts in the actual resistance of the input resistors.For design purposes,the input network (discussed in the next section)should be designed assuming an input impedance of 12.8k Ω,which is the absolute minimum input impedance of the TPA3101D2.At the lower gain settings,the input impedance could increase as high as 38.4k ΩTable 2.Gain SettingINPUT IMPEDANCE AMPLIFIER GAIN (dB)(k Ω)GAIN1GAIN0TYP TYP 002032012616103216113616INPUT RESISTANCEChanging the gain setting can vary the input resistance of the amplifier from its smallest value,16k Ω±20%,to the largest value,32k Ω±20%.As a result,if a single capacitor is used in the input high-pass filter,the -3dB or cutoff frequency may change when changing gain steps.Input Signalf =12Z C pi if= c12Z Cpi i-3 dBf cC=i12Z f pi cThe-3-dB frequency can be calculated using e the Z I values given in Table2.(1) INPUT CAPACITOR,C IIn the typical application,an input capacitor(C I)is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation.In this case,C I and the input impedance of the amplifier(Z I)form a high-pass filter with the corner frequency determined in Equation2.(2) The value of C I is important,as it directly affects the bass(low-frequency)performance of the circuit.Consider the example where Z I is20kΩand the specification calls for a flat bass response down to20Hz.Equation2is reconfigured as Equation3.(3) In this example,C I is0.4µF;so,one would likely choose a value of0.47m F as this value is commonly used.If the gain is known and is constant,use Z I from Table2to calculate C I.A further consideration for this capacitor is the leakage path from the input source through the input network(C I)and the feedback network to the load.This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom,especially in high gain applications.For this reason,a low-leakage tantalum or ceramic capacitor is the best choice.When polarized capacitors are used,the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at2V,which is likely higher than the source dc level.Note that it is important to confirm the capacitor polarity in the application.Additionally,lead-free solder can create dc offset voltages and it is important to ensure that boards are cleaned properly.Power Supply Decoupling,C SThe TPA3101D2is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure that the output total harmonic distortion(THD)is as low as possible.Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker.The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients,spikes,or digital hash on the line,a good low equivalent-series-resistance(ESR) ceramic capacitor,typically0.1m F to1µF placed as close as possible to the device V CC lead works best.For filtering lower frequency noise signals,a larger aluminum electrolytic capacitor of220m F or greater placed near the audio power amplifier is recommended.The220m F capacitor also serves as local storage capacitor for supplying current during large signal transients on the amplifier outputs.The PVCC terminals provide the power to the output transistors,so a220µF or larger capacitor should be placed on each PVCC terminal.A10µF capacitor on the AVCC terminal is adequate.。

Electrical Characteristics CharacteristicSymNotesMinimumTypicalMaximumUnitsCenter Frequency, +25 °C Absolute Frequency f C 2,3,4,5433.845433.995MHz Tolerance from 433.920 MHz∆f C ±75kHz Insertion Loss IL 2,5,6 1.5 2.2dBQuality Factor Unloaded Q Q U 5,6,7900050 Ω Loaded Q Q L 1458Temperature StabilityTurnover Temperature T O 6,7,8102540°C Turnover Frequencyf O f C Frequency Temperature CoefficientFTC 0.032ppm/°C 2Frequency AgingAbsolute Value during the First Year |f A |1≤10ppm/yr DC Insulation Resistance between Any Two Terminals51.0M ΩRF Equivalent RLC ModelMotional Resistance R M 5, 7, 919.4ΩMotional Inductance L M 63.8µH Motional Capacitance C M 2.11fF Shunt Static CapacitanceC O 5, 6, 9 2.4pF Test Fixture Shunt InductanceL TEST2, 755.1nHLid Symbolization (in addition to Lot and/or Date Codes)655 // YWWS•Ideal for European 433.92MHz Transmitters •Very Low Series Resistance •Quartz Stability•Surface-mount Ceramic Case•Complies with Directive 2002/95/EC (RoHS)The RO3101A is a true one-port, surface-acoustic-wave (SAW) resonator in a surface-mount, ceramic case. It provides reliable, fundamental-mode, quartz frequency stabilization of fixed-frequency transmitters operating at 433.92MHz. This SAW is designed specifically for remote control and wireless security transmitters operating in Europe under ETSI I-ETS 300 220.Absolute Maximum Ratings RatingValueUnitsCW RF Power Dissipation (See: Typical Test Circuit)+0dBm DC Voltage Between Terminals (Observe ESD Precautions)±30VDC Case Temperature-40 to +85°C Soldering Temperature (10 seconds / 5 cycles maximum)260°C433.92 MHzSAW ResonatorRO3101ACAUTION: Electrostatic Sensitive Device. Observe precautions for handling.Notes:1.Frequency aging is the change in f C with time and is specified at +65 °C or less. Aging may exceed the specification for prolonged temperaturesabove +65 °C. Typically, aging is greatest the first year after manufacture, decreasing in subsequent years.2.The center frequency, f C , is measured at the minimum insertion loss point, IL MIN , with the resonator in the 50Ω test system (VSWR ≤ 1.2:1). The shunt inductance, L TEST , is tuned for parallel resonance with C O at f C . Typically, f OSCILLATOR or f TRANSMITTER is approximately equal to the resonator f C .3.One or more of the following United States patents apply: 4,454,488 and 4,616,197.4.Typically, equipment utilizing this device requires emissions testing and government approval, which is the responsibility of the equipment manufacturer.5.Unless noted otherwise, case temperature T C =+25±2°C.6.The design, manufacturing process, and specifications of this device aresubject to change without notice.7.Derived mathematically from one or more of the following directly measured parameters: f C , IL, 3dB bandwidth, f C versus T C , and C O .8.Turnover temperature, T O , is the temperature of maximum (or turnover) frequency, f O . The nominal frequency at any case temperature, T C , may be calculated from: f =f O [1-FTC (T O -T C )2]. Typically oscillator T O is approximately equal to the specified resonator T O .9.This equivalent RLC model approximates resonator performance near the resonant frequency and is provided for reference only. The capacitance C O is the static (nonmotional) capacitance between the two terminals measured at low frequency (10MHz) with a capacitance meter. Themeasurement includes parasitic capacitance with "NC” pads unconnected. Case parasitic capacitance is approximately 0.05pF. Transducer parallel capacitance can by calculated as: C P ≈C O -0.05pF.10.Tape and Reel standard per ANSI / EIA 481.PbElectrical ConnectionsThe SAW resonator is bidirectional and may beinstalled with either orientation. The two terminalsare interchangeable and unnumbered. The calloutNC indicates no internal connection. The NC padsassist with mechanical positioning and stability.External grounding of the NC pads isrecommended to help reduce parasiticcapacitance in the circuit.Typical Test CircuitThe test circuit inductor, L TEST, is tuned to resonate with the static capacitance, C O, at F C.Typical Application Circuits Equivalent Model Temperature Characteristics The curve shown on the right accounts for resonator contribution only and does not include LC component temperature contributions.CaseDimensionsMillimeters InchesMin Nom Max Min Nom MaxA 4.87 5.00 5.130.1910.1960.201B 3.37 3.50 3.630.1320.1370.142C 1.45 1.53 1.600.0570.0600.062D 1.35 1.43 1.500.0400.0570.059E0.670.800.930.0260.0310.036 F0.370.500.630.0140.0190.024G 1.07 1.20 1.330.0420.0470.052H- 1.04--0.041-I- 1.46--0.058-J-0.50--0.019-K- 1.05--0.041-L- 1.44--0.057-M-0.71--0.028-PCB Land PatternTop View分销商库存信息: RFMRO3101A。

Documentation of the Master/Slave Application of thefollowing Controllers:- E1100-GP (-HC, -XC)- E1130-DP (-HC, -XC)- E1100-RS (-HC, -XC)- E1100-DN (-HC, -XC)- E1100-CO (-HC, -XC)Master/Slave V3.9User ManualMaster/Slave ApplicationPage 2/10User Manual Master/Slave Application / 21.08.2008NTI AG / LinMot© 2008 NTI AGThis work is protected by copyright.Under the copyright laws, this publication may not be reproduced or transmitted in any form, electronic or mechanical, including photocopying, recording, microfilm, storing in an information retrieval system, not even for didactical use, or translating, in whole or in part, without the prior written consent of NTI AG. LinMot® is a registered trademark of NTI AG. NoteThe information in this documentation reflects the stage of development at the time of press and is therefore without obligation. NTI AG reserves itself the right to make changes at any time and without notice to reflect further technical advance or product improvement.Document version 3.9 / Aug 2008Master/Slave ApplicationNTI AG / LinMot User Manual Master/Slave Application / 21.08.2008 Page 3/10Table of Content1. S YSTEM O VERVIEW ........................................................................................................4 2. C ONNECTING THE CAN BUS ...........................................................................................4 Pin Assignment of the COM / Config Connector (X5):.....................................................4 Pin Assignment of the CMD Connectors X7/X8 :.............................................................5 Master/Slave Wiring over COM Connector X5:................................................................5 Pin Assignment of the Master Encoder Connectors X10/X11 for the GP servos:............6 CAN/RS 485 Termination.................................................................................................6 3...........................................................................................................................................6 4. U SING THE M ASTER /S LAVE SW......................................................................................7 5. M ASTER S LAVE P ARAMETERS .........................................................................................8 6. R ECONNECTION AFTER Q UICK S TOP / E RROR .................................................................9 7. C ONTACT A DDRESSES . (10)Master/Slave ApplicationPage 4/10 User Manual Master/Slave Application / 21.08.2008 NTI AG / LinMot1. System OverviewThe Master/Slave application SW is an additional firmware part for the following features:• Current master motor with a maximum of three current slave motors to increaseforce, the current delay in all slaves is about 300us• Gantry master motor with maximum of three gantry slave motors, which have thesame position setpoints. The setpoint delay for all slaves is about 300us.If a synchronous communication mode is used, or if the cycle time of the used fieldbus is short enough, it is recommended to realise the master gantry mode within the PLC, because of higher flexibility and easier use (2 normal axisinstead of 1 master axis with attached slave information; especially in the error handling case).The Master/Slave application SW supports the Master/Slave communication link either over the CAN bus (X7/X8, X10/X11 or X5) or the RS485 (X7/X8 or X5). For the CAN businterfaces (like CANopen or DeviceNet) the RS485 based link has to be used. For all other interfaces the CAN bus link mode should be used, because the RS232 maintenance link on X5 Connector is still available. The performance of both links CAN or RS485 is the same.If the Master/Slave is linked over the RS485 it is not possible anymore to configure to debug the controller over the RS232 (X5). LinMot-Talk1100 supports an USB to CAN converter (Part No. 0150-3134 ) for this purpose.2. Connecting the CAN busPin Assignment of the COM / Config Connector (X5):DSUB 9 male:Pin 1 RS-485 Y Pin 6 RS-485 B Pin 2 RS-232 TX Pin 7 RS-485 Z Pin 3 RS-232 RX Pin 8 CAN L Pin 4 RS-485 APin 9CAN HPin 5GNDMaster/Slave ApplicationNTI AG / LinMot User Manual Master/Slave Application / 21.08.2008 Page 5/10Pin Assignment of the CMD Connectors X7/X8 :The CMD connector exists only on the E1100-DP(-HC/-XC) and E1100-RS(-HC/-XC) controllers, 2xRJ45 with 1:1 connected signals. Standard twisted pairs: 1/2, 3/6, 4/5, 7/8. Over the X7/X8 the CAN-Bus linked or the RS485 linked Master/Slave mode could be used.Use a crossed Ethernet patch cable (Art. Nr. 0150-1853) between the master and first slave, and a normal patch cable 1:1 (Art. Nr. 0150-1852) between the slaves.MasterSlave 1 Slave 2 Slave 3,4Crossed patch cable normal patch cable normal patch cable Art. Nr. 0150-1853 Art. Nr. 0150-1852 Art. Nr. 0150-1852Master/Slave Wiring over COM Connector X5:If the CMD connectors (X7/X8) are used for wiring a fieldbus, the Master/Slave can be wired over the COM connector X5:RS485 Master/Slave Wiring on X5:Master Slave 1 Slave 2 Slave 3,4Pin 4 RS-485 A ------ Pin 1 RS-485 Y ------ Pin 1 RS-485 Y ------ Pin 1 RS-485 Y Pin 6 RS-485 B ------ Pin 7 RS-485 Z ------ Pin 7 RS-485 Z ------ Pin 7 RS-485 Z Pin 1 RS-485 Y ------ Pin 4 RS-485 A ------ Pin 4 RS-485 A ------ Pin 4 RS-485 A Pin 7 RS-485 Z ------ Pin 6 RS-485 B ------ Pin 6 RS-485 B ------ Pin 6 RS-485 BCAN Master/Slave Wiring on X5:Master Slave 1 Slave 2 Slave 3,4Pin 8 CAN L --------- Pin 8 CAN L --------- Pin 8 CAN L --------- Pin 8 CAN L Pin 9 CAN H --------- Pin 9 CAN H --------- Pin 9 CAN H --------- Pin 9 CAN HPin 1 RS485 A Pin 2 RS485 B Pin 3 RS485 Y Pin 4/5 Ground Pin 6 RS485 Z Pin 7 CAN H Pin 8 CAN LMaster/Slave ApplicationPage 6/10 User Manual Master/Slave Application / 21.08.2008 NTI AG / LinMotPin Assignment of the Master Encoder Connectors X10/X11 for the GPservos:With the E1100-GP(-HC/-XC) controllers, the CAN bus is also available on the two RJ45 connectors X10 (ME IN) and X11 (ME OUT) with 1:1 connected signals. Standard twisted pairs: 1/2, 3/6, 4/5, 7/8. Use Ethernet cables according the EIA / TIA 568A standard to loop through the CAN bus over this connector (Art. Nr. 0150-1852). Over the X10/X11 connection only the CAN bus linked Master/Slave mode can be used (no RS485)!CAN/RS 485 TerminationThe CAN bus must be terminated by two 120 Ohm resistors at both ends of the bus line, according the following scheme:For easy installation, the LinMot E1100 controllers have built in termination resistors, which have to be activated on both the master and the slave servo, using the Master/Slave application SW over CAN bus and the RS 485 link.The built in termination resistor for the CAN bus can be activated by setting the dip switch “CAN Term” to “ON”. The built in termination resistor for the RS 485 bus can be activated by setting the dip switch “RS485 Term” to “ON”.Pin 1 A Pin 2 /A Pin 3 B Pin 4 Z PIN 5 /Z Pin 6 /BPin 7 CAN H Pin 8 CAN LMaster/Slave ApplicationNTI AG / LinMot User Manual Master/Slave Application / 21.08.2008 Page 7/104. Using the Master/Slave SWTo install the Master/Slave application software start the LinMot-Talk1100 SW (if already started and logged in then logout), click on the Install Firmware button and select the installation script://Firmware_V3Sxxyyzz.sctThen choose the application “MasterSlave”The same Master/Slave application SW has to be loaded to the master as well as the slave servo controller(s).Select the required serial link CAN or RS 485 (UPID 3EF7h).After the Master/Slave application SW has been installed, log in the servo controller and select the correct Master/Slave mode (UPID 30D4h) on all servo controllers. The rest can be left as configured by default.After power up the master servo controller try to connect to its slave controller, when itsucceed to connect to the slave, the application Warn Flag bit 15 vanish ant the connection state (UPID 3A98h or 3A99h) changes to 1 which means ‘Data Exchange’.The state of the slave servo controller can be monitored over the variables “Slave 0..2 State Var” (UPID 3B70h, UPID 3B72h, UPID 3B74h,).As the slave servo is in a streaming mode (current or position) in state 8 ‘Operation Enabled’ bit 5 ‘Motion Active’ normally is set and bit 6 ‘In Target Position’ is cleared in the Slave State Var. Bit 8 ‘Homed ‘ indicates if the slave servo has correctly homed or not.The slave state machine is controlled from the master, so if connecting a serial fieldbus link to the slave servo for monitoring reasons, take care not to write to the slave’s controlword. So with Profibus DP interface do not configure the control status module for any slave, the status word can be watched by using a monitoring channel UPID 1D51h.NOTE: Both master and slave(s) have to be configured by using the MotorWizard.Master/Slave ApplicationPage 8/10 User Manual Master/Slave Application / 21.08.2008 NTI AG / LinMot5. Master Slave ParametersThe Master/Slave servo controllers have an additional parameter tree branch, which can beconfigured with the distributed LinMot-Talk1100 software. With these parameters, the Master/Slave behavior is set up. The software LinMot-Talk1100 can be downloaded from under the section download, software & manuals.Master Slave Mode defines the master/slave behavior of the controller.CAN [0] Master/Slave communication over CAN bus1Mbaud.RS485[1] Master/Slave communication over RS485.Master Slave Mode defines the master/slave behavior of the controller.Disable [0] Servo controller runs without Master Slavebehavior.Current Master[1] Servo controller acts as current master Current Slave [2] Servo controller acts as current slave Gantry Master [3] Servo controller acts as gantry master Gantry Slave [4] Servo controller acts as gantry slaveMaster Config In this section the further master configuration is done.Master MACID The ID of the master servo, default = 1. Do not change this parameter.Number of Slaves The number of slaves, a maximum of three slaves is possibleSlave Config In this section the further slave configuration is done.Slave MACID The ID for all slave servos, default = 2. Do not change this parameter.Slave Number Every used slave has to be defined with a unique number (0-2,allocation upwards)Direction Choose ‘Normal’ if the slave motor is mounted in the same way as themaster and moves in the same direction as the master does, otherwise choose ‘Inverted’.CAN Baud Rate In this section the CAN baud rate is configured.Baud Rate Parameter Definition The CAN baud rate is fixed to 1M baud by this parameter.Master/Slave ApplicationNTI AG / LinMot User Manual Master/Slave Application / 21.08.2008 Page 9/106. Reconnection after Quick Stop / ErrorAfter a quick stop or an error it is important to synchronize the position of the master and the slave axis. In this case use the state ”Go to Initial Position”(see “State Machine” in the document Usermanual_MotionCtrSW_1100”.Master/Slave ApplicationPage 10/10 User Manual Master/Slave Application / 21.08.2008 NTI AG / LinMot7. Contact Addresses-----------------------------------------------------------------------------------------------------------------------------SWITZERLAND NTI AGHaerdlistr. 15CH-8957 SpreitenbachSales and Administration:+41-(0)56-419 91 91 office@Tech. Support:+41-(0)56-544 71 00 support@Tech. Support (Skype) :skype:support.linmotFax: +41-(0)56-419 91 92 Web: /-----------------------------------------------------------------------------------------------------------------------------USA LinMot, Inc. 5750 Townline RoadElkhorn, WI 53121Sales and Administration: 877-546-3270 262-743-2555Tech. Support: 877-804-0718262-743-1284Fax: 800-463-8708262-723-6688E-Mail: us-sales@Web:/-----------------------------------------------------------------------------------------------------------------------------Please visit / to find the distribution near you.Smart solutions are…。

SPECIFICATIONSANALOG VOLTAGE OUTPUT D/A Converter: DAC8554Number of Channels: OM-USB-3101: 4 OM-USB-3103: 8 OM-USB-3105: 16Output Ranges (Software-Selectable): Calibrated: ±10V , 0V to 10VUncalibrated: ±10.2V , -0.04V to 10.08V Resolution: 16 bitsU 4, 8, or 16 Analog Voltage Outputs U 16-Bit Resolution U 100 S/s Update RateU 8 Digital I/O, One 32-Bit Counter/Timer U Synchronous DAC UpdatesThe new OM-USB-3101, OM-USB-3103, andOM-USB-3105 are voltage output USB 2.0 full-speed modules. Each module provides 4, 8, or 16 voltage outputs. All modules provide synchronous and concurrent voltage updates.All OM-USB-3100 Series modules provide eightdigital I/O lines and one 32-bit event counter and are powered by the 5V USB supply from the computer.Analog OutputAll OM-USB-3100 Series modules provide either 4, 8, or 16 channels of 16-bit analog output.Each channel is software-selectable for either a bipolar voltage output range of ±10 V or unipolar range of 0 to 10V . Channel outputs can be updated individually or simultaneously.SoftwareThe OM-USB-3100 Series modules ship with an impressive array of software including the new TracerDAQ ®, a full-featured, out-of-the-box data logging, viewing, and analysis application.Driver support and detailed example programs are included for Universal Library programming libraries for Microsoft ® Visual Studio ® programming languages, and other languages, including DASYLab ®, and ULx for NI LabVIEW ® (comprehensive library of Vls and example programs compatible with 32-bit and 64-bit LabVIEW v8.5 through 2012) and InstaCal TM installation, calibration and test utility-powerful solutions for programmers and nonprogrammers alike. Thesemodules operate under Microsoft Windows ® XP (32-bit only) and VIST A/7 AND 8 (32-bit and 64-bit) operating systems.Synchronous DAC UpdatesAll OM-USB-3100 Series modules have asynchronous DAC load connection pin (SYNCLD) that simultaneously updates DAC outputs on multiple devices. Y ou can configure this with software as an input (slave mode) or as an output (master mode).In slave mode, the SYNCLD pin receives the D/A LOAD signal from an external source. When the SYNCLD pin receives the trigger signal, the analog outputs are updated simultaneously.In master mode, the internal D/A LOAD signal is sent to the SYNCLD pin. Y ou can then synchronize with a second device of the same type and simultaneously update the DAC outputs on each device.On power up and reset, the SYNCLD pin is set to slave mode (input).Digital I/OAll OM-USB-3100 Series modules have eightbidirectional digital I/O connections. The digital DIO lines can be independently programmed for input or output. All digital pins are floating by default. A screw terminal connection is provided to configure for pull-up (5V) or pull-down (0V).Counter InputEach OM-USB-3100 Series module has a 32-bit event counter for counting TTL pulses. The counter increments when the TTL levels transition from low to high. The counter accepts frequency inputs of up to 1 MHz.Absolute Accuracy (Calibrated Output):±10V: ±4.0 LSB0 to 10V: ±22.0 LSBRelative Accuracy (±LSB):±10V, 0 to 10V: 4.0 typical, 12.0 maximumOM-USB-3101 shown smaller than actual size.Output Transient(±10V to 0 to 10V or 0 to 10V to ±10V):Range Selection: The output voltage level defaults to 0V when the output voltage range is reconfigured, the host computer is reset, shut down, or suspended, or a reset command is issued to the device.Duration: 5 µs typicalAmplitude: 5V p-p typicalHost Computer is Reset, Powered On, Suspended, or a Reset Command is Issued to Device:The duration of this output transient is depends highly on the enumeration process of the host computer. Typically, the output is stable after two seconds. Duration: 2 s typicalAmplitude: 2V p-p typicalInitial Power On:Duration: 50 ms typicalAmplitude: 5V peak typicalDifferential Nonlinearity: The maximum differential nonlinearity specification applies to the entire operating temperature range. This specification also accounts for the maximum errors due to the software calibration algorithm (in calibrated mode only) and the DAC8554 nonlinearities)C alibrated: ±1.25 LSB typical, -2 LSB to 1 LSB maximumUncalibrated: ±0.25 LSB typical, ±1 LSB maximum Output Current (VOUTx Pins): ±3.5 mA typical Output Short-Circuit Protection (VOUTx Connected to AGND): IndefiniteOutput Coupling: DCPower On and Reset State:DACs Cleared to Zero-Scale: 0V, ±50 mV typical Output Range: 0 to 10VOutput Noise:0 to 10V Range: 14.95 µVrms typical±10V Range: 31.67 µVrms typicalSettling Time (To 1 LSB Accuracy): 25 µS typical Slew Rate:0 to 10V Range: 1.20V/µS typical±10V Range: 1.20V/µS typicalThroughput:S ingle-Channel: 100 S/s maximum,system-dependentM ultichannel: 100 S/s/#ch maximum,system-dependentANALOG OUTPUT CALIBRATION Recommended Warm-Up Time: 15 minutes minimum on-board precision referenceDC Level: 5.000V ±1 mV maximumTempco: ±10 ppm/°C maximumLong-Term Stability: ±10 ppm/SQRT(1000 hrs) Calibration Method: Software calibration Calibration Interval: 1 yearDIGITAL I/ODigital Logic Type: CMOSNumber of I/O: 8Pull-Up/Pull-Down Configuration: Software-selectable; all pins floating (default). For pull-down, connect the DIO CTL pin to a DGND pin. For pull-up, connect the DIO CTL pin to the 5V pin.Digital I/O Input Loading: TTL (default); 47 KΩ(pull-up/pull down configurations)Digital I/O Transfer Rate (System-Paced):System-dependent, 33 to 1000 port reads/writes or single bit reads/writes per second.Input High Voltage: 2.0V minimum, 5.5V absolute maximumInput Low Voltage: 0.8V maximum, -0.5V absolute minimumOutput High Voltage (IOH = -2.5 mA): 3.8V minimum Output Low Voltage (IOL = 2.5 mA): 0.7V maximum Power On and Reset State: Input SYNCHRONOUS DAC LOADPin Name: SYNCLD (terminal block pin 49)Power On and Reset State: InputPin Type: BidirectionalTermination: Internal 100 K pull-downSoftware-Selectable Direction:Output: Outputs internal D/A LOAD signalI nput: Receives D/A LOAD signal fromexternal sourceInput Clock Rate: 100 Hz maximumClock Pulse Width:Input: 1 µs minimumOutput: 5 µs minimumInput Leakage Current: ±1.0 µA typInput High Voltage: 4.0V minimum, 5.5V absolute maximumInput Low Voltage: 1.0V maximum, -0.5V absolute minimumOutput High Voltage:IOH: -2.5 mA: 3.3V minimumN o Load: 3.8V minimumS YNCLD is a Schmitt trigger input and is over-current protected with a 200 Ω series resistor Output Low Voltage:IOL: 2.5 mA: 1.1V maximumNo Load: 0.6V maximumW hen SYNCLD is in input mode, the analog outputs may either be updated immediately or when a positive edge is seen on the SYNCLD pin (this is under software control). However, the pin must be at a low logic level in order for the DAC outputs to be updated immediately. If an external source is pulling the pin high, no update occurs.COUNTERPin Name: CTRNumber of Channels: 1Resolution: 32-bitsCounter Type: Event counterInput Type: TTL, rising edge triggeredCounter Read/Write Rates (Software-Paced): System dependent, 33 to 1000 reads per secondInput Frequency: 1 MHz maximumHigh Pulse Width: 500 ns minimumLow Pulse Width: 500 ns minimumInput High Voltage: 4.0V minimum, 5.5V absolute maximumInput Low Voltage: 1.0V maximum, -0.5V absolute minimumMEMORYEEPROM: 256 bytesEEPROM Configuration:Address Range: 0x000-0x0FFAccess: Read/writeDescription: 256 bytes user data MICROCONTROLLERType: High performance 8-bit RISC microcontroller Program Memory: 16,384 wordsData Memory: 2048 bytesGENERALOperating Environment: 0 to 70°C (32 to 158°F), 0 to 90% RH non-condensing Communications: USB 2.0 full-speed mode(12 Mbps)Signal I/O Connector: Screw terminalsPower:S upply Current (USB Enumeration): <100 mAS upply Current (Quiescent): Total quiescent current requirement includes up to 10 mA for the status LED. This does not include any potential loading of the digital I/O bits, 5V user terminal,or the VOUTx outputs.OM-USB-3101: 140 mA typicalOM-USB-3103: 160 mA typicalOM-USB-3105: 200 mA typical5V User Output Voltage Range: 4.5 to 5.25V (assumes USB power supply is within specified limits) 5V User Output Current: 10 mA maximum (refers to the total amount of current that can be sourced from the 5V user terminal for general use; also includes any additional contribution due to DIO loading Dimensions: 127 L × 88.9 W × 35.6 H mm(5.0 × 3.5 × 1.4")Weight: 159 g (0.35 lb)The OM-USB-3100 Series data acquisition modules are supplied with TracerDAQ software which is a collection of four virtual instrument applications used to graphically display and store input data and generate output signals:•S trip Chart—Log and graph values acquire fromanalog inputs, digital inputs, temperature inputs and counter inputs•O scilloscope—Display values acquired from analog inputs•F unction Generator—Generate waveforms foranalog outputs•R ate Generator—Generate waveforms for counteroutputs TracerDAQ PRO is an enhanced version of TracerDAQ.A comparison of some of the features included inTracerDAQ vs TracerDAQ PRO is shown below.TracerDAQ Pro Strip Chartwith Measurements. TracerDAQ Strip Chart.Features ComparisonDuty Cycle No Yes OMEGACARE SM extended warranty program is available for models shown on this page. Ask your sales representative for full details when placing an order. OMEGACARE SM covers parts, labor andequivalent loaners.Extended Warranty ProgramSMComes complete with 2 m (6') USB cable and software and operator’s manual on CD.Ordering Example: OM-USB-3101, 4-channel, 16-bit analog voltage output USB module and OCW-1, OMEGACARE extends standard 1 year warranty to a total of 2 years.OM-USB-3103OM-USB-3105All models shownsmaller than actual size.。

Operator’s ManualRegister your machine:/registerAuthorized Service and Distributor Locator: /locatorI M10326-A | Issue D a te Nov-18For use with machines having Code Numbers:12547, 12629Need Help? Call 1.888.935.3877 to talk to a Service Representative Hours of Operation:8:00 AM to 6:00 PM (ET) Mon. thru Fri.After hours?Use “Ask the Experts” at A Lincoln Service Representative will contact you no later than the following business day.For Service outside the USA:Email:*********************************Save for future referenceDate PurchasedCode: (ex: 10859)SAFETYSAFETY PRÉCAUTIONS DE SÛRETÉPageInstallation...............................................................................................................................Section A Technical Specifications................................................................................................................A-1 General Description.......................................................................................................................A-2 Design Features............................................................................................................................A-2 Pre-Operation Installation..............................................................................................................A-3 Safety Precautions................................................................................................................A-3 Exhaust Spark Arrester.........................................................................................................A-3Location/Ventilation.......................................................................................................................A-3 Angle of Operation................................................................................................................A-4Machine Grounding.......................................................................................................................A-4Lift Bail.........................................................................................................................................A-4Trailer...........................................................................................................................................A-4 Vehicle Mounting..................................................................................................................A-5Polarity Control and Cable Sizes....................................................................................................A-5 Pre-Operation Service...................................................................................................................A-5Oil, Fuel........................................................................................................................................A-5Cooling System.............................................................................................................................A-5Battery Charging...........................................................................................................................A-6 Electrical Device Use with this Product.................................................................................A-7 Operation.................................................................................................................................Section B Engine Operation..........................................................................................................................B-1Starting The Perkins Engine..........................................................................................................B-1 High Altitude Operation, Stopping the Engine........................................................................B-1Engine Break-In............................................................................................................................B-2 Welder Operation..........................................................................................................................B-2Duty Cycle....................................................................................................................................B-2Current Control.............................................................................................................................B-2 How to Set Controls for Stick Welding...................................................................................B-3Remote Control.............................................................................................................................B-4Gas-Shielding Flux-Cored Welding................................................................................................B-5 Idler Operation, Auxiliary Power, Fuel Consumption Data......................................................B-5 Accessories.............................................................................................................................Section C Optional Features (Field Installed)..................................................................................................C-1 Maintenance............................................................................................................................Section D Safety Precautions........................................................................................................................D-1General Instructions......................................................................................................................D-1Cooling System.............................................................................................................................D-1Bearings.......................................................................................................................................D-1Commutator and Brushes.............................................................................................................D-1Nameplates..................................................................................................................................D-2Engine Service Chart.....................................................................................................................D-3 GFCI Testing and Resetting Procedure..........................................................................................D-4 Troubleshooting.......................................................................................................................Section E Safety Precautions........................................................................................................................E-1Welder Troubleshooting.........................................................................................................E-2, E-3Electronic Idler Troubleshooting Guide...................................................................................E-4, E-5Engine Troubleshooting Guide .........................................................................................E-6 thru E-8Diagnostic LED Flash Codes .........................................................................................................E-9 Diagrams..................................................................................................................................Section F Wiring Diagrams............................................................................................................................F-1 Dimension Print.............................................................................................................................F-2 Parts Content/details may be changed or updated without notice. For most current Instruction Manuals, go to TABLE OF CONTENTSSAE-300® MPINSTALLATION SAE-300® MPTECHNICAL SPECIFICATIONS - SAE-300®MPINSTALLATIONSAE-300® MPANGLE OF OPERATIONEngines are designed to run in the level condition which is where the optimum performance is achieved. The maximum angle ofcontinuous operation is 20º degrees in all directions, 30º intermittent (less than 10 minutes continuous) in all directions.INSTALLATION SAE-300®MPPRE-OPERATION SERVICECertain Electrical devices cannot be powered to this Product. See Table A.1The Lincoln Electric Company is not responsible for any damage to electrical components improperly connected to this product.ENGINE BREAK-IN Array Lincoln Electric selects high quality, heavy-duty industrial engines for the portable welding machines we offer. While it is normal to see a small amount of crankcase oil consumption during initial operation, excessive oil use, wet stacking (oil or tar like substance at the exhaust port), or excessive smoke is not normal.Larger machines with a capacity of 350 amperes and higher, which are operated at low or no-load conditions for extended periods of time are especially susceptible to the conditions described above. To accomplish successful engine break-in, most diesel-powered equipment needs only to be run at a reasonably heavy load within the rating of the welder for some period of time during the engine’s early life. However, if the welder is subjected to extensive light loading, occasional moderate to heavy loading of the engine may sometimes be necessary. Caution must be observed in correctly loading a diesel/generator unit.1. Connect the welder output studs to a suitable resistive loadbank. Note that any attempt to short the output studs byconnecting the welding leads together, direct shorting of the output studs, or connecting the output leads to a length ofsteel will result in catastrophic damage to the generator and voids the warranty.2. Set the welder controls for an output current and voltagewithin the welder rating and duty cycle. Note that anyattempt to exceed the welder rating or duty cycle for anyperiod of time will result in catastrophic damage to thegenerator and voids the warranty.3. Periodically shut off the engine and check the crankcase oillevel.HOW TO SET CONTROLS FOR STICK WELDING1. Set theRight Dial (Fine Current and OCV) to 70.2. Set the Left Dial (Coarse Current) to the Desired Current.3. For more forceful arc increase coarse current and decrease fine current. For softer arc increase fine current and decrease coarse current.K857-1 and K2627-2Remote Control unit can also be used as the Right Dial (Fine Current and OCV or wire voltage).STICK / TIG WELDINGStart by setting the right-side Fine Current and OCV control dial to 70,then set the left-side Coarse Current control dial to the desired current using the dial markings as an approximate guideline. Arc characteristics and small changes in output can then be adjusted using the Fine Current and OCV control dial. A K857-1 Remote Control or K2627-2Remote with receptacle unit can also be used as the Fine Control and OCV control dial.OCV Boost increases OCV at lower fine current settings and is recommended for stick welding. Position the "OCV Boost" switch to "Classic" when low OCV at low fine current settings is desired such as when TIG welding.SELF-SHIELDED FLUX-CORED WELDINGStart by setting the Wire (CV) / Stick (CC) toggle switch to the Wire (CV)position. Then set the left-side Coarse Current control dial to 270. Now move the Voltage Adjustment dial to the desired voltage. Move the Coarse Current control to the left for a softer arc and to the right for a crisper arc.a.When welding or drawing power for lights or tools(approximately 100 watts minimum) from the receptacles,the idler solenoid deactivates and the engine operates at high idle speed. b.When welding ceases or the power load is turned off, apreset time delay of about 15 seconds starts. This time delay cannot be adjusted. c.If the welding or power load is not re-started before the endof the time delay, the idler solenoid activates and reduces the engine to low idle speed.AUXILIARY POWERIf GFCI is tripped, See the MAINTENANCE section for detailed information on testing and resetting the GFCI.The AC auxiliary power, supplied as a standard, has a rating of 3.0 KVA of 120/240 VAC (60 hertz). Set fine current adjustment at 100 for maximum auxiliary power.With the 3.0 KVA, 120/240 VAC auxiliary power, one 120V duplex protected by GFCI and one 240V duplex, grounding type receptacle with 2 pole, 15 amp circuit breaker.The rating of 3.0 KVA permits a maximum continuous current of 13 amps to be drawn from the 240V duplex receptacle. 20 amps can be drawn from the 120V duplex receptacle. The total combined load of all receptacles is not to exceed 3.0 KVA.An optional power plug kit is available. When this kit is specified,the customer is supplied with a plug for each receptacle.IDLER OPERATIONStart the engine with the “Idler” switch in the “High” position.Allow it to run at high idle speed for several minutes to warm the engine. See Specifications for operating speeds.The idler is controlled by the “Idler” toggle switch on the welder control panel. The switch has two positions as follows:1.In the “High” position, the idler solenoid deactivates,and the engine goes to high idle speed. The speed is controlled by the governor.2. In the “Auto” / position, the idler operates as follows:SAE-300®MP WITH KUBOTA D1503 DIESEL ENGINE TYPICAL FUEL CONSUMPTION DATAGAS-SHIELDED FLUX-CORED WELDINGStart by setting the Wire (CV) / Stick (CC) toggle switch to the Wire (CV)position. Then set the left-side Coarse Current control dial to 220. Now move the Voltage Adjustment dial to the desired voltage. Move the Coarse Current control to the left for a softer arc and to the right for a crisper arc.MIG WELDINGStart by setting the Wire (CV) / Stick (CC) toggle switch to the Wire (CV)position. Then set the left-side Coarse Current control dial to 220. Now move the Voltage Adjustment dial to the desired voltage. Move the Coarse Current control to the left for a softer arc and to the right for a crisper arc.CARBON ARC GOUGINGSet both the Coarse Current and Fine Current O.C.V controls tomaximum for carbon arc gouging in the CC (constant current) mode. If the CV (constant voltage) mode is desired, set the Wire (CV) / Stick (CC)toggle switch to the Wire (CV) position. Then set the left-side Coarse Current control to 270 and the Voltage Adjustment dial to maximum output.Low Idle-No Load0.25 gal/hr ( 0.95 ltrs/hr)SAE-300® MPACCESSORIESMAINTENANCESAE-300® MPSAFETY PRECAUTIONSReplace brushes when they wear within 1/4” of the pigtail. A complete set of replacement brushes should be kept on hand. Lincoln brushes have a curved face to fit the commutator. Have an experienced maintenance person seat these brushes by lightly stoning the commutator as the armature rotates at full speed until contact is made across the full face of the brushes. After stoning, blow out the dust with low pressure air.To seat slip ring brushes, position the brushes in place. Then slide one end of a piece of fine sandpaper between slip rings and brushes with the coarse side against the brushes. With slight additional finger pressure on top of the brushes, pull the sandpaper around the circumference of the rings - in direction of rotation only until brushes seat properly. In addition, stone slip ring with a fine stone. Brushes must be seated 100%.Arcing or excessive exciter brush wear indicates a possible misaligned shaft. Have an authorized Field Service Shop check and realign the shaft.NAMEPLATESWhenever routine maintenance is performed on this machine or at least yearly - inspect all nameplates and labels for legibility. Replace those which are no longer clear. Refer to the parts list for the replacement item number.GFCI TESTING AND RESETTING PROCEDUREThe GFCI should be properly tested at least once every month or whenever it is tripped. To properly test and reset the GFCI:• If the GFCI has tripped, first carefully remove any load and check it for damage.• If the equipment has been shut down, it must be restarted.• The equipment needs to be operating at high idle speed and any necessary adjustments made on the control panel so that the equipment is providing at least 80 volts to the receptacle input terminals.• The circuit breaker for this receptacle must not be tripped. Reset if necessary.• Push the "Reset" button located on the GFCI. This will assure normal GFCI operation.• Plug a night-light (with an "ON/OFF" switch) or other product (such as a lamp) into the Duplex receptacle and turn the product "ON".• Push the "Test" button located on the GFCI. The night-light or other product should go "OFF".• Push the "Reset" button, again. The light or other product should go "ON" again.If the light or other product remains "ON" when the "Test" button is pushed, the GFCI is not working properly or has been incorrectly installed (miswired). If your GFCI is not working properly, contact a qualified, certified electrician who can assess the situation, rewire the GFCI if necessary or replace the device.TROUBLE SHOOTINGSAE-300® MPHOW TO USE TROUBLESHOOTING GUIDEService and Repair should only be performed by Lincoln Electric Factory Trained Personnel. Unauthorized repairs performed on this equipment may result in danger to the technician and machine operator and will invalidate your factory warranty. For your safety and to avoid Electrical Shock, please observe all safety notes and precautions detailed throughout this manual.TROUBLE SHOOTINGSAE-300® MPObserve all Safety Guidelines detailed throughout this manualPROBLEMS POSSIBLE RECOMMENDEDSAE-300® MPTROUBLE SHOOTING Observe all Safety Guidelines detailed throughout this manualTROUBLE SHOOTINGSAE-300® MPELECTRONIC IDLER TROUBLESHOOTING GUIDEWith Idler Control Switch in the Auto Position,TROUBLE SHOOTINGSAE-300® MPELECTRONIC IDLER TROUBLESHOOTING GUIDEWith Idler Control Switch in the AUTO Position, Engine Will Not Pick Up Speed When:TROUBLE SHOOTINGSAE-300® MPObserve all Safety Guidelines detailed throughout this manualE-7TROUBLE SHOOTINGObserve all Safety Guidelines detailed throughout this manualSAE-300® HEE-8TROUBLE SHOOTINGSAE-300® MPObserve all Safety Guidelines detailed throughout this manualPROBLEMS POSSIBLE RECOMMENDEDE-9TROUBLE SHOOTINGSAE-300® HE Diagnostic LED Flash Codes(LED tied in harness at control board) Long Flash ShortFlashDescription2 1 23 3 2 Negative armature in cvmode code3 3 VArm>90V in cvmode code after CR2enable4 2 Control board 18V Supply is under 16.2V 4 1 Control board 36V Supply is under 29.2V5 1 Control board serial communication error 43Control board 15V supply under codeField coil shorted- fault can only be reset by restarting welder Welder output short circuit or overload, fault resets by restarting welderF-1DIAGRAMSSAE-300® MPN O T E : T h i s d i a g r a m i s f o r r e f e r e n c e o n l y . I t m a y n o t b e a c c u r a t e f o r a l l m a c h i n e s c o v e r e d b y t h i s m a n u a l. T h e s p e c i f i c d i a g r a m f o r a p a r t i c u l a r c o d e i s p a s t e d i n s i d e t h e m a c h i n e o n o n e o f t h e e n c l o s u r e p a n e l s . I f t h e d i a g r a m i s i l l e g i b l e , w r i t e t o t h e S e r v i c e D e p a r t m e n t f o r a r e p l a c e m e n t . G i v e t h e e q u i p m e n t c o d e n u m b e r .F-2DIAGRAMSSAE-300® MPN O T E : T h i s d i a g r a m i s f o r r e f e r e n c e o n l y . I t m a y n o t b e a c c u r a t e f o r a l l m a c h i n e s c o v e r e d b y t h i s m a n u a l. T h e s p e c i f i c d i a g r a m f o r a p a r t i c u l a r c o d e i s p a s t e d i n s i d e t h e m a c h i n e o n o n e o f t h e e n c l o s u r e p a n e l s . I f t h e d i a g r a m i s i l l e g i b l e , w r i t e t o t h e S e r v i c e D e p a r t m e n t f o r a r e p l a c e m e n t . G i v e t h e e q u i p m e n t c o d e n u m b e r .F-3DIAGRAMSSAE-300® MPS 10766-15ATENÇÃOJapaneseChineseKoreanArabicREAD AND UNDERSTAND THE MANUFACTURER’S INSTRUCTION FOR THIS EQUIPMENT AND THE CONSUMABLES TO BE USED AND FOLLOW YOUR EMPLOYER’S SAFETY PRACTICES.SE RECOMIENDA LEER Y ENTENDER LAS INSTRUCCIONES DEL FABRICANTE PARA EL USO DE ESTE EQUIPO Y LOS CONSUMIBLES QUE VA A UTILIZAR, SIGA LAS MEDIDAS DE SEGURIDAD DE SU SUPERVISOR.LISEZ ET COMPRENEZ LES INSTRUCTIONS DU FABRICANT EN CE QUI REGARDE CET EQUIPMENT ET LES PRODUITS A ETRE EMPLOYES ET SUIVEZ LES PROCEDURES DE SECURITE DE VOTRE EMPLOYEUR.LESEN SIE UND BEFOLGEN SIE DIE BETRIEBSANLEITUNG DER ANLAGE UND DEN ELEKTRODENEINSATZ DES HER-STELLERS. DIE UNFALLVERHÜTUNGSVORSCHRIFTEN DES ARBEITGEBERS SIND EBENFALLS ZU BEACHTEN.ATENÇÃOJapaneseChineseKoreanArabicLEIA E COMPREENDA AS INSTRUÇÕES DO FABRICANTE PARA ESTE EQUIPAMENTO E AS PARTES DE USO, E SIGA AS PRÁTICAS DE SEGURANÇA DO EMPREGADOR.CUSTOMER ASSISTANCE POLICYThe business of The Lincoln Electric Company is manufacturing andselling high quality welding equipment, consumables, and cuttingequipment. Our challenge is to meet the needs of our customers andto exceed their expectations. On occasion, purchasers may askLincoln Electric for advice or information about their use of ourproducts. We respond to our customers based on the best informationin our possession at that time. Lincoln Electric is not in a position towarrant or guarantee such advice, and assumes no liability, withrespect to such information or advice. We expressly disclaim anywarranty of any kind, including any warranty of fitness for anycustomer’s particular purpose, with respect to such information oradvice. As a matter of practical consideration, we also cannot assumeany responsibility for updating or correcting any such information oradvice once it has been given, nor does the provision of informationor advice create, expand or alter any warranty with respect to the saleof our products.Lincoln Electric is a responsive manufacturer, but the selection anduse of specific products sold by Lincoln Electric is solely within thecontrol of, and remains the sole responsibility of the customer. Manyvariables beyond the control of Lincoln Electric affect the resultsobtained in applying these types of fabrication methods and servicerequirements.Subject to Change – This information is accurate to the best of ourknowledge at the time of printing. Please refer to for any updated information.TABLE OF CONTENTSINSTALLATIONOPERATIONACCESSORIESMAINTENANCETROUBLE SHOOTINGDIAGRAMS。

Rev. 10.0–03.09.20211SKYPER®Two channel driver core Driver CoreOrder Number L5063101Datasheet valid for L5063101 Index 08SKYPER 42 LJ R Features*•Two output channels •Integrated power supply•Separated failure/signal transmission •Selectable dead time•Dynamic short-circuit detection•SoftOff in case of secondary side error •Active clamping•Selectable filter setting •Multi failure management •ROHS, UL recognizedTypical Applications•Driver for IGBT modules in bridge circuits in industrial applicationRemarks•The insulation test is not performed as 100% series test at SEMIKRON •The maximum DC-Link voltage islimited by the creepage and clearance distances; according to EN50178-1, PD II, OVC III•Operating temperature is real ambient temperature around the driver core •Environmental conditions see Technical Explanation•Do not touch the transformersAbsolute Maximum Ratings SymbolConditionsValuesUnitV s Supply voltage primary side 15.6V V IH Input signal voltage (HIGH)Vs + 0.3V V IL Input signal voltage (LOW)GND - 0.3V I out(peak)Output peak current 1)24A I out(avg)Output average current 1)120mA f max Maximum switching frequency 2)100kHz V CE Collector emitter voltage 3)1700V V DC DC-Link voltage 4)1200V dv/dt Rate of rise and fall of voltage secondary to primary side 100kV/µs V isol Insulation test voltage 5)4000V Q out Output charge per pulse 6)20µC T op Operating temperature range -40...85°C T stgStorage temperature range-40 (85)°CCharacteristics SymbolConditionsmin.typ.max.UnitV sSupply voltage primary side 14.41515.6V V UVLO(prim)Primary side undervoltage-lockout shutdown threshold12.2VPrimary side undervoltage-lockout reset threshold13.9V V UVLO(secP)Secondary side undervoltage-lockout shutdown threshold, positive gate voltage9.4V Secondary side undervoltage-lockout reset threshold, positive gate voltage13.3V V UVLO(secN)Secondary side undervoltage-lockoutshutdown threshold, negative gatevoltage-4.1V Secondary side undervoltage-lockout reset threshold, negative gate voltage-5.8V I S(idle)Supply current primary side (no load)65mA I S(max)Supply current primary side (full load)700mA V I Input signal voltage on/off Vs/0V V IT+Input threshold voltage (HIGH)8.6V V IT-Input threshold voltage (LOW) 6.7V R IN(sw)Input resistance (switching signals)33k ΩC IN(sw)Input capacitance (switching signals)0.01nF V G(on)Turn-on output voltage 14.8V V G(off)Turn-off output voltage-8V t d(on,ana)Turn-on propagation delay time for analog filter selection 0.5µs t d(on,dig)Turn-on propagation delay time for digital filter selection 0.83µs t d(off,ana)Turn-off propagation delay time for analog filter selection 0.5µs t d(off,dig)Turn-off propagation delay time for digital filter selection 0.83µs R IN(err,prim)Input resistance(error input, primary side)150k ΩC IN(err,prim)Input capacitance(error input, primary side)10nF2Rev. 10.0–03.09.2021© by SEMIKRONR IN(err,sec)Input resistance(error inputs, secondary side)150k ΩCIN(err,sec)Input capacitance(error inputs, secondary side)0.01nF t d(err)Error propagation delay time 7)0.7µs t d(err,ext)External error propagation delay time 8)0.6µs t IDTInterlock dead time 9)2µs t jitter(ana)Signal transfer deviation for analog filter selection 10)± 3ns t jitter(dig)Signal transfer deviation for digital filter selection 10)± 12.5ns t SPS(ana)Short pulse suppression for analog filter selection 0.2µs t SPS(dig)Short pulse suppression for digital filter selection 0.39µs t POR Power-on reset time 0.15s t reset Error reset time 11)0.03ms V CE(ref)Reference voltage for V CE -monitoring 12)9V V ITH(clamp)Input threshold voltage clamping (HIGH)13)13V V ITL(clamp)Input threshold voltage clamping (LOW)13)2V R IN(clamp)Input resistance (clamping inputs)150k ΩC IN(clamp)Input capacitance (clamping inputs)0.01nF l clear(PS)Shortest distance in air, primary side to secondary side12.2mm l clear(SS)Shortest distance in air, secondary sides6.1mm l creep(PS)Shortest distance along the surface, primary side to secondary side (CTI > 175)12.2mml creep(SS)Shortest distance along the surface, secondary sides (CTI > 175)6.1mm V imp Impulse withstand voltage 14)8000V V PDPS Partial discharge extinction voltage, primary side to secondary side 15)2107V w Weight22g MTBFMean Time Between Failure16)7.5106hCharacteristics SymbolConditionsmin.typ.max.UnitSKYPER ®Two channel driver core Driver CoreOrder Number L5063101Datasheet valid for L5063101 Index 08SKYPER 42 LJ R Features*•Two output channels •Integrated power supply•Separated failure/signal transmission •Selectable dead time•Dynamic short-circuit detection•SoftOff in case of secondary side error •Active clamping•Selectable filter setting •Multi failure management •ROHS, UL recognizedTypical Applications•Driver for IGBT modules in bridge circuits in industrial applicationRemarks•The insulation test is not performed as 100% series test at SEMIKRON •The maximum DC-Link voltage islimited by the creepage and clearance distances; according to EN50178-1, PD II, OVC III•Operating temperature is real ambient temperature around the driver core •Environmental conditions see Technical Explanation•Do not touch the transformersFootnotesFootnote Description1)The rated peak and average output current are valid over the full operating temperature range.2)The rated maximum switching frequency is valid over the full operating temperature range.3)Repetitive peak voltage across the semiconductor power rails.4)The maximum DC-Link voltage is limited by creepage and clearance distances(according to EN50178-1, PD II, OVC III).5)Test Conditions: ACrms, 2s, input to output.6)If using power semiconductor modules with gate charges >2.5µC, the buffer capacitance of the driver's secondarysides and primary side has to be adjusted according to the corresponding Technical Explanation.7)Time between the driver detects an error at the secondary side until the primary side reports an error at the interface.8)Time between the driver receives an external error signal at the primary side until the driver turns off its outputs at thesecondary side.9)The interlock dead time prevents the two outputs from being activated simultaneously. The dead time generationstarts with each turn-off command at the driver's primary side. The interlock dead time generation could bedeactivated via pin 'CFG_IDT'.10)The jitter is defined as the maximum deviation of the switching signal propagation delay time at constantenvironmental conditions. The signal transfer deviation t jittter(ana) is valid if analog filtering is selected via pin'CFG_FLT' and the interlock dead time, generated by the controller, is longer than the interlock dead time which isensured by the driver itself.11)Minimum time for which the driver is in error state.12)The driver detects a desaturation event, when one of its outputs is in on-state and the applied voltage at thecorresponding V CE-monitoring input (pin 'VCE_IN') exceeds the reference voltage for V CE-monitoring. As long as theblanking time has not been elapsed, the desaturation detection is deactivated. The blanking time is adjustable via the'CFG_VCE' pin.13)The driver's output switches to high-resistance state, when the output is in off-state and the applied voltage at thecorresponding 'CLMP_IN' pin exceeds the input threshold voltage V ITH(clamp). The output returns to off-state when theapplied voltage at pin 'CLMP_IN' falls below the input threshold voltage V ITL(clamp).14)Test condition: 8000V, pulse according to EN50178-1.15)The partial discharge extinction voltage in this data sheet is defined as peak voltage.16)Conditions: T op = 40°C; full load. Theoretical consideration according to SN 29500.17)All external circuits, except the V CE reference voltage adjustment, have to be supplied via pin 'PWR_VS_P_OUT' withrespect to pin 'PWR_VS_N_OUT'. The rated average output current is reduced by the supply current of theseexternal circuits.34Pin description - primary side Pin description - secondary side - TOP PIN Signal FunctionSpecificationsX10:01PWR_GND Ground potentialfor power supply and digital signals To be connected to ground X10:02CFG_IDTInterlock dead time configuration15V logic; 150k Ω (pull-up)LOW = 2µs interlock dead time HIGH = No interlock dead time X10:03nERR_OUT Error outputOpen collector output; max. 18V/15mA (external pull-up resistor needed)LOW = Error HIGH = No errorX10:04nERR_IN Error input15V logic inverted; 150k Ω/10nF (pull-up)LOW = External error HIGH = No external errorX10:05CFG_ERRError behavior configuration in case of secondary side error15V logic; 150k Ω (pull-down)LOW = Both outputs switch offHIGH = Outputs switch off with next turn-off signal at the corresponding input X10:06CFG_FLTFilter configuration for switching signals 15V logic; 150k Ω (pull-down)LOW = Analog filter (t SPS(ana))HIGH = Digital filter (t SPS(dig))X10:07TOP_INSwitching signal input (TOP)15V logic; 33k Ω/0.01nF (pull-down)LOW = TOP switch off HIGH = TOP switch onX10:08BOT_IN Switching signal input (BOT)15V logic; 33k Ω/0.01nF (pull-down)LOW = BOT switch off HIGH = BOT switch on X10:09PWR_VS Driver power supply Stabilized +15V ±4%X10:10PWR_VSDriver power supplyStabilized +15V ±4%PIN Signal FunctionSpecificationsX100:01CFG_VCE V CE -monitoring reference voltage External voltage divider needed X100:02VCE_INV CE -monitoring inputExternal blocking diode neededX100:03PWR_VS_P_OUT Power supply output, positive voltage Equal to V G(on)17)(external buffer capacitors can be connected)X100:04nERR_INExternal error input15V logic inverted; 150k Ω/0.01nF (pull-up)LOW = External error HIGH = No external errorX100:05TOP_ON On signal path to TOP semiconductor External gate resistor needed(in consideration of I out(avg), I out(peak), V G(on))X100:06TOP_OFF Off signal path to TOP semiconductor External gate resistor needed(in consideration of -I out(avg), -I out(peak), V G(off))X100:07CLMP_INV CE -clamping input150k Ω/0.01nF (pull-down)In case of activated TOP_OFF:LOW = TOP_OFF equal to V G(off)HIGH = TOP_OFF floatingX100:08PWR_GND Ground potential forpower supply and digital signalsReference potential for gate voltages (emitter/source of power semiconductor)X100:09TOP_SOFTOFF SoftOff signal path to TOP semiconductor External gate resistor neededX100:10PWR_VS_N_OUTPower supply output, negative voltageEqual to V G(off)17)(external buffer capacitors can be connected)Pin description - secondary side - BOTPIN Signal Function SpecificationsX200:01CFG_VCE V CE-monitoring reference voltage External voltage divider neededX200:02VCE_IN V CE-monitoring input External blocking diode neededX200:03PWR_VS_P_OUT Power supply output, positive voltage Equal to V G(on)17)(external buffer capacitors can be connected) X200:04nERR_IN External error input15V logic inverted; 150kΩ/0.01nF (pull-up)LOW = External errorHIGH = No external errorX200:05BOT_ON On signal path to BOT semiconductor External gate resistor needed(in consideration of I out(avg), I out(peak), V G(on)) X200:06BOT_OFF Off signal path to BOT semiconductor External gate resistor needed(in consideration of -I out(avg), -I out(peak), V G(off)) X200:07CLMP_IN V CE-clamping input150kΩ/0.01nF (pull-down)In case of activated BOT_OFF:LOW = BOT_OFF equal to V G(off)HIGH = BOT_OFF floatingX200:08PWR_GND Ground potentialfor power supply and digital signals Reference potential for gate voltages (emitter/source of power semiconductor)X200:09BOT_SOFTOFF SoftOff signal path to BOT semiconductor External gate resistor neededX200:10PWR_VS_N_OUT Power supply output, negative voltage Equal to V G(off)17)(external buffer capacitors can be connected)5This is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to makechanges.6Rev. 10.0–03.09.2021© by SEMIKRON。

OnCell G3101/G3201SeriesCompact quad-band GSM/GPRS IP gatewaysFeatures and Benefits•Universal quad-band GSM/GPRS850/900/1800/1900MHz•Desktop or DIN-rail installation•Connect Ethernet and serial devices•Centralized private IP management software with OnCell Central Manager•Choice of configuration methods,including web console,serial console,andTelnetCertificationsIntroductionThe OnCell G3111/G3151/G3211/G3251are cellular IP gateways that can conveniently and transparently connect up to two devices to a cellular network,allowing you to connect serial devices to your existing Ethernet with only basic configuration.To ensure zero data loss and on-demand cellular communication,OnCell devices are integrated with the GuaranLink function.The G3111/G3151/G3211/G3251cellular IP gateways are compact,and can be placed on a desk or mounted on a DIN rail.The products come with a12to48VDC power input and have2kV EFT/surge protection to allow the use of different types of field power sources.The serial ports are also protected by15kV ESD line protection to keep your system safe from unexpected electrical discharges.SpecificationsCellular InterfaceCellular Standards GSM,GPRSBand Options Quad-band GSM/GPRS850MHz/900MHz/1800MHz/1900MHzGPRS Data Rates85.6kbps DL,43kbps ULGPRS Multi-Slot Class10GPRS Terminal Device Class Class BGPRS Coding Schemes CS1to CS4Cellular Antenna Connectors1SMA femaleNo.of SIMs1SIM Control Voltage3VEthernet Interface10/100BaseT(X)Ports(RJ45connector)1Total Port Count1Ethernet Software FeaturesManagement ARP,DDNS,DHCP/BOOTP,DNS Relay,HTTP,SMTP,SNMPv1/v2c/v3,TCP/IP,Telnet,UDP,Web Console,Wireless Search Utility,Serial Console,Telnet Console,RemoteSMS Control,OnCell Central Manager,GuaranLinkRouting NAT,Port forwarding,WAN IP FilteringSecurity HTTPS/SSL,SSHTime Management SNTPFirewallFilter ICMPSerial InterfaceSerial Standards OnCell G3211/G3111:RS-232OnCell G3151/G3251:RS-232/422/485Data Bits5,6,7,8Stop Bits1,1.5,2Parity None,Even,Odd,Space,MarkFlow Control RTS/CTS,XON/XOFFBaudrate50bps to921.6kbpsSerial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDOperation ModesStandards Ethernet Modem modeReal COM modeRFC2217modeTCP Client modeTCP Server modeUDP modeSMS TunnelReverse Real COMPower ParametersInput Voltage12to48VDCPower Connector Power jackInput Current0.9A@12VDC,0.23A@48VDCPhysical CharacteristicsHousing AluminumIP Rating IP30Dimensions77x111x26mm(3.03x4.37x1.02in)Weight OnCell G3151/G3111:170g(0.38lb)OnCell G3211/G3251:190g(0.42lb)Environmental LimitsOperating Temperature-30to55°C(-22to131°F)Storage Temperature(package included)-40to75°C(-40to167°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsSafety UL60950-1EMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:8kV;Air:15kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:4kV;Signal:2kVIEC61000-4-5Surge:Power:1kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFRadio Frequency FCC Part22H,FCC Part24E,EN301489-1,EN301489-7,EN301511,PTCRB(OnCellG3151only)MTBFTime1,483,420hrsStandards Telcordia SR332WarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x OnCell G3101/G3201Series IP gateway1Installation Kit1x DIN-rail kit1x rubber standAntenna1x GSM/GPRSPower Supply DC power supply(screw-on type)Documentation1x quick installation guide1x warranty card1.An activated SIM card(not included)must be provided by a third party Cellular Service Provider.DimensionsOrdering InformationModel Name Cellular Standard GPRS Band Operating Temp.No.of Serial Ports Serial StandardsOnCell G3111GSM/GPRS 850/900/1800/1900MHz-30to55°C1RS-232OnCell G3151GSM/GPRS 850/900/1800/1900MHz-30to55°C1RS-232/422/485OnCell G3211GSM/GPRS 850/900/1800/1900MHz-30to55°C2RS-232OnCell G3251GSM/GPRS 850/900/1800/1900MHz-30to55°C2RS-232/422/485Accessories(sold separately)Wireless Antenna CablesA-CRF-SMSF-R3-100Cellular magnetic-base SMA connector with1-meter RF cable©Moxa Inc.All rights reserved.Updated Aug29,2019.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

ST1.3 Series Installation GuideST612712DEG, ST612712DE, ST610712DEG, ST610712DE,ST680712DEG, ST680712DE, ST660712DEG and ST660712DE Zero Insertion Force (ZIF) Disc DrivesPublication Number: 100409346, Rev. B, September 2006The easiest way to install your ST1.3 Series driveMany of today’s consumer products, like cameras, notebook computers, MP3 players, printers and more have been designed to make it possible for the end user to use hard disc drives. Your Seagate® ST1.3 Series drive is designed for such use. Refer to your product’s user manual for the location of the media compartment and the specific instructions regarding insertion and removal of removable media devices like the ST1.3 Series disc drive. Your product manufacturer’s support Web site will have the most up-to-date information. Read and follow all instructions regarding the proper steps to be taken when using your Seagate ST1.3 Series disc drive.The Seagate ST1.3 Series ZIF interface disc drives, ST612712DEG, ST612712DE, ST610712DEG, ST610712DE, ST680712DEG, ST680712DE, ST660712DEG and ST660712DE are designed for embedded installation or as a fixed storage solution. Follow the installation instructions provided on this instruction sheet. Your product manufacturer’s support Web site will have the most up-to-date information on installing and removing storage devices. Read and follow all instructions regarding the proper steps to be taken when using your Seagate ST1.3 Series disc drive. It is important to follow the handling precautions and electrostatic discharge protection information below when handling any electronic device. It is always a good idea to back up all your data before installing any new hardware in your computer.Handling precautions/electrostatic discharge protection•ST1.3 Series disc drives are fragile. Do not drop or jar the drive. Handle the drive only by the edges or by the finger grip area shown in Figure 1.Keep the device in the packaging until you are ready to install it and between uses to minimize handling damage.•It may be necessary to turn off the power to the host product during installation. Refer to your product’s user manual for details regarding installation and removal of media devices.•Do not disassemble the drive. Doing so voids the warranty.See the warranty information on page 2.•Do not expose the drive to extreme temperatures or humidity conditions.•Do not apply pressure, write on, or attach labels to the top or bottom of the drive.•Do not cover or otherwise obstruct the breather hole on the top of the drive. (See Figure 3)•Keep the drive away from strong magnetic fields to avoid data loss. Figure 1ST1.3 Series—Improper handling and Finger grip areasFigure 2ST1.3 Series—Breather hole location Drive characteristicsST612712DEG ST610712DEGST612712DE ST610712DE Formatted capacity 12.0 Gbytes10.0 GbytesTotal number of sectors* 23,438,01619,533,024Cache size 2 Mbytes 2 MbytesST680712DEG ST660712DEGST680712DE ST660712DE Formatted capacity 8.0 Gbytes 6.0 GbytesTotal number of sectors* 15,625,00811,719,008Cache size 2 Mbytes 2 Mbytes*One sector equals 512 bytes.Note.The Seagate ST1.3 Series ZIF interface disc drive is compatible with the ATA version 7.Note.This drive is designed for a product that supplies interface signals and +3.3V power through the ZIF connector. See Figure 3 for drive dimensions.Figure 3ST1.3 Series, DE/DEG dimensions—end and bottom views Installing your ST1.3 Series ZIF interface model disc drive Follow installation instructions for media devices provided in your product’s user manual to determine if your Seagate ST1.3 Series disc drive is compatible. See Figure 3 for drive dimensions. Follow all handling precautions/electrostatic discharge protection suggestions when installing any drive.Follow the precaution when installing and removing your ST1.3 Series Flex interface disc drive:•Drive electronics are extremely sensitive to static electricity. Caution should be exercised when handling any electronic device. Wear an Electrostatic Discharge (ESD) ground strap when integrating the flex cable into host systems. Improper handling may cause ESD damage to the ST1.3 Series disc drive’s electronics.•Do not bend the cable sharply as this may cause the electrical traces to be broken. See Figure 4.•When the drive is powered on, do not physically remove the flex cable from the host connector. Power down the system first before removing the drive.Figure 4Examples of mounting ZIF interfacemotorZIF connectorPin 1TroubleshootingIf your drive is not working properly, these troubleshooting tips may helpsolve the problem.1.Does the drive spin up? A spinning drive produces a faint whine andclicking noise. If your drive does not spin, check that the drive issecurely inserted.2.Does the computer recognize the drive? Verify that the drive isenabled in the system CMOS or setup program. If not, select the autodetect option and enable it. If your drive has a problem, it may not berecognized by the system. If the operating system does not recognizethe drive, you need to load your host adapter drivers.3.Does ScanDisk find the drive defect-free? ScanDisk is a utilitylocated on your Windows startup diskette that scans the drive fordefects. If defects are detected, this may be an indication of a problem.4.Why does my computer hang on startup? Verify that your system isATA compatible. You need either an ATA-compatible motherboardconnector or ATA host adapter to use this drive.Note.If these tips do not answer your question or solve the problem,contact your dealer or visit to downloadSeaTools™ disc diagnostics software and more troubleshootingadvice.Seagate support servicesFor online information about Seagate products, visit or************************************************.If you need help installing your drive, consult your dealer first. If you needadditional help, call a Seagate technical support specialist. Before calling,note your system configuration and drive model number.Africa+1-405-324-4714Netherlands00 800-47324283Australia1800-14-7201New Zealand0800-443988Belgium00 800-47324283Norway00 800-47324283China*800-810-9668Poland00 800-311 12 38Denmark00 800-47324283Spain00 800-47324283France00 800-47324283Sweden00 800-47324283Germany00 800-47324283Switzerland00 800-47324283Hong Kong800-90-0474Singapore800-1101-150Hong Kong†001-800-0830-1730Taiwan*00-800-0830-1730India1-800-180-1104Thailand001-800-11-0032165Indonesia001-803-1-003-2165Turkey00 800-31 92 91 40Ireland00 800-47324283United Kingdom00 800-47324283Italy00 800-47324283USA/Canada/1-800 SEAGATE orJapan0034 800 400 554Latin America+1-405-324-4700Korea007 98 8521 7635Other EuropeanMalaysia1-800-80-2335countries+1-405-324-4714Middle East+1-405-324-4714*Mandarin†CantoneseWarranty.To determine the warranty status of your Seagate disc drive, contact yourplace of purchase or visit our web site at for more information.Return Merchandise Authorization (RMA). Run SeaTools to diagnose your drivebefore requesting a return authorization. In addition, please verify that your drive isdefective by following the troubleshooting checklist in this guide. Seagate offerscomprehensive customer support for all Seagate drives worldwide. Seagate customerservice centers are the only facilities authorized to service Seagate drives. Drivereturn procedures vary depending on geographical location and are subject to currentinternational trade regulations.Shipping the driveCaution.Back up the data before shipping. Seagate assumes no responsibility fordata lost during shipping or service.Shipping drive in an unapproved container voids the warranty. Pack the drive withoriginal box and packing materials. Use no other materials. This prevents electricaland physical damage in transit.Electromagnetic compliance for the European Union. This model complies withthe European Union requirements of the Electromagnetic Compatibility Directive 89/336/EEC of 03 May 1989 as amended by Directive 92/31/EEC of 28 April 1992 andDirective 93/68/EEC of 22 July 1993. Compliance of this drive, as a systemcomponent, was confirmed with a test system. We cannot guarantee that your systemwill comply. The drive is not meant for external use (without properly designedenclosure, shielded I/O cable, etc.).Sicherheitsanleitung 1. Das Gerrät ist ein Einbaugerät, das für eine maximaleUmgebungstempeatur von 70°C vorgesehen ist. 2. Als Versorgungsspannugenwerden benötigt: +5V +/- 10% 0.330mA; +3.3V +/- 5% 0.330mA 3. DieVersorgungsspannung muss SELV entsprechen. 4. Alle Arbeiten auf dem Festplatttedürfen nur von Ausgebiletem Serciepersonal durchgeführt werden. Bitte entfernen Sienicht die Aufschriftenschilder des Laufwerkes. 5. Der Einbau des Laufwerkes mussden Anforderungen gemäss DIN IEC 950 VDE 0805/05.90 entspreche.© 2006 Seagate Technology LLC. All rights reservedPublication number: 100409346, Rev. B, September 2006, Printed in USASeagate, Seagate Technology and the Wave logo are registered trademarks of Seagate TechnologyLLC. SeaTools is a registered trademark or trademark of Seagate Technology LLC. Other productnames are registered trademarks or trademarks of their owners. Seagate reserves the right tochange, without notice, product offerings or specifications.。

BRITISH STANDARDBS EN60512-3-1:2002Connectors forelectronic equipment — Tests andmeasurements —Part 3-1: Insulation tests — Test 3a: Insulation resistanceThe European Standard EN 60512-3-1:2002 has the status of a British StandardICS 31.220.10L i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S IBS EN 60512-3-1:2002This British Standard, having been prepared under the direction of theElectrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 16May 2002© BSI 16May 2002ISBN 0 580 39634 7National forewordThis British Standard is the official English language version of EN 60512-3-1:2002. It is identical with IEC 60512-3-1:2002.The UK participation in its preparation was entrusted by Technical Committee EPL/48, Electromechanical components and mechanical structures forelectronic equipment, to Subcommittee EPL/48/2, Connectors for electronic equipment, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary.From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems.Cross-referencesThe British Standards which implement international or Europeanpublications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue.A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application.Compliance with a British Standard does not of itself confer immunity from legal obligations.——UK interests informed;—monitor related international and European developments and promulgate them in the UK.Summary of pagesThis document comprises a front cover, an inside front cover, the EN title page, pages 2 to 4, an inside back cover and a back cover.The BSI copyright date displayed in this document indicates when the document was last issued.Amendments issued since publication Amd. No.Date CommentsL i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S IEUROPEAN STANDARD EN 60512-3-1NORME EUROPÉENNEEUROPÄISCHE NORMApril 2002CENELEC© 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.Ref. No. EN 60512-3-1:2002 EICS 31.220.10English versionConnectors for electronic equipment –Tests and measurements Part 3-1: Insulation tests –Test 3a: Insulation resistance(IEC 60512-3-1:2002)Connecteurs pour équipements électroniques –Essais et mesuresPartie 3-1: Essais d'isolement –Essai 3a: Résistance d'isolement (CEI 60512-3-1:2002)Steckverbinder für elektronische EinrichtungenMess- und Prüfverfahren –Teil 3-1: Prüfungen der Isolation –Prüfung 3a: Isolationswiderstand (IEC 60512-3-1:2002)This European Standard was approved by CENELEC on 2002-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.L i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S INE 065-21-3:12002- 2 -ForewordThe text of document 48B/1133/FDIS, future edition 1 of IEC 60512-3-1, prepared by SC 48B,Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60512-3-1 on 2002-04-01.The following dates were fixed:–national standard or by endorsement (dop)2003-01-01–latest date by which the national standards conflicting with the EN have to be withdrawn(dow)2005-04-01__________Endorsement noticeThe text of the International Standard IEC 60512-3-1:2002 was approved by CENELEC as a European Standard without any modification.__________Page 2EN 60512−3−1:2002© BSI 16 May 2002L i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S I065-21-31 Ó EI:C0022– 3 –CONNECTORS FOR ELECTRONIC EQUIPMENT –TESTS AND MEASUREMENTS –Part 3-1: Insulation tests –Test 3a: Insulation resistance1 Scope and objectThis part of IEC 60512, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar devices when specified in a detail specification.The object of this test is to define a standard test method to assess the insulation resistance of electromechanical components.2 Mounting of specimenThe specimen shall be mounted in accordance with the detail specification.3 General requirementsThe insulation resistance shall be measured with a closed-circuit d.c. voltage of 10 V ± 1 V,100 V + 15 V or 500 V + 50 V, using method A, B or C specified in the detail specification.The insulation resistance shall be measured only when a stable reading is obtained.If a stable condition is not reached, the insulation resistance reading shall be recorded within 60 s + 5 s after the application of voltage.The insulation resistance shall be not less than that specified in the detail specification.4 Measuring methodsMethod AThe insulation resistance shall be measured on specimens using the specified test voltage applied in turn between each termination being tested and all others connected together and to the housing and/or the mounting plate.Method BAlternate terminations shall be connected together to form two groups.Page 3EN 60512−3−1:2002© BSI 16 May 2002L i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S I065-21-31 Ó EI:C0022– 4 –The insulation resistance shall be measured on specimens using the specified test voltage applied between:1)the first group of terminations and the second group connected to the housing and/or themounting plate, and 2)the second group of terminations and the first group connected to the housing and/or themounting plate.NOTE Method CThe insulation resistance shall be measured between two adjacent terminations having a minimum spacing using the specified test voltage.5 Detail to be specifiedWhen this test is required by the detail specification, the following details shall be specified:a)measuring method to be used;b)value of the test voltage;c)minimum value of the insulation resistance;d)contacts to be tested;e)any deviation from the standard test method.___________Page 4EN 60512−3−1:2002© BSI 16 May 2002L i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S IL i c e n s e d C o p y : s h e f f i e l d u n s h e f f i e l d u n , n a , S a t N o v 11 07:18:08 G M T +00:00 2006, U n c o n t r o l l e d C o p y , (c ) B S IBS EN60512-3-1:2002BSI389 Chiswick High Road London W4 4ALBSI —British Standards InstitutionBSI is the independent national body responsible for preparingBritish Standards. 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