MAX202EWE+中文资料

CM 202EValid as of E22ME0404 up toE22ME0601Electrical unit X CM 202EVoltage 3 AC 208V 60HzItem no. Part no Reference Description1 X1Control panel2 X2Electrical installation3 X3Clima Plus4 X4Steam generator, Bypass5 X5Hot air heating6 X6Motor and fan wheel7 X7Interior cabinet8 X8Door9 X9Water supply, quenching box10 X10Hand shower13 X13Exterior cabinet14 X14MiscellaneousCM 202EElectrical unit X Table of contentsVoltage: 3 AC 208V 60Hz1 Control panel (3)1.A Control panel (4)2 Electrical installation (5)2.A Contactor assembly (6)3 Clima Plus (8)4 Steam generator, Bypass (9)4.A Pump connection spout cpl (10)4.B Venting valve for steam generator (11)5 Hot air heating (12)6 Motor and fan wheel (13)7 Interior cabinet (14)7.A Interior cabinet welded (15)7.B Gasket frame w. glass a. gaskets (16)7.C Air baffle (17)7.C Air baffle (18)8 Door (19)8.A Door (21)8.C Door catch (22)9 Water supply, quenching box (23)10 Hand shower (24)13 Exterior cabinet (25)13.A Exterior cabinet (26)14 Miscellaneous (27)Electrical unit X 1 Control panel 11 Control panel Voltage 3 AC 208V 60HzItem no. Part no Reference DescriptionA X1.A Control panel1 87.00.001Control panel insert with overlayElectrical unit X 1.A Control panel 11 Control panel Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 42.00.004 Control pcb Index "ME"2 1104.0121Hex nut M4 self locking3 10.00.355Spacer black4 2020.0400Fixing device for cable harness5 16.00.282Dial6 40.02.087 Buzzer6 3006.0107 Buzzer7 5110.1028 Gasket poti hot air, core temperature8 40.00.464Potentiometer CT9 16.00.387Mounting device f.sealing + sealing lip10 1306.0218Washer A4,311 1103.0122Hex nut M3 self-locking12 5110.1029Gasket mode switch13 5110.1027Distance plate for front panelElectrical unit X 2 Electrical installation 22 Electrical installation Voltage3 AC 208V 60HzItem no. Part no Reference DescriptionA X2.A Contactor assembly1 4007.0620Membrane DGC 292 10.00.418 Bundle guide big3 40.00.453Solid state relais4 10.00.507Pan head screw Torx 5/16" T205 10.00.444Raised countersunk head screw Torx M4x86 1106.0224Hex nut M6 self locking7 10.00.065Countersunk screw Torx T20 M4x128 1104.0122Hex combination nut M4 galv9 42.00.007 External memory10 10.00.510Grommet 10/12/16-211 1104.0801Cage nut M412 10.00.243Spacer M4x813 1104.0120Hex nut M414 10.00.112Cable clip short15 10.00.111Cable clip long16 10.00.471Cable clip d10-12mm17 40.00.338Sicotronic-terminal *screw typ*19 40.01.356Fixing device f. cable guide20 1106.0160Hex nut M621 1206.0120Tooth lock washer A6,422 40.01.132Center fixation f. contactor assembly23 40.00.471Bus cable 0.8m23 40.00.472Bus cable 1.3m26 1104.0400Rivet nut M4Electrical unit X 2.A Contactor assembly 22 Electrical installation Voltage3 AC 208V 60HzItem no. Part no Reference Description1 40.01.329Dry up protector 160°2 3014.0302Hex nut M10 for dry-up protector3 40.01.482Safety temperature limiter 365°C4 3014.0327Hex nut M10x1,05 40.00.576 Contactor CK08CA311N-M6 40.00.474Cooling fan D.C.7 10.00.238Screw Torx 4x508 3101.1008Cooling fan9 40.00.333Halogen transformer10 40.01.613Varistor11 40.00.592Transformer f. cooling fan12 1105.0120 Hex nut M513 1305.0160Washer A5,3x10mm14 4001.1203End plate for mounting rail15 2620.370233Installation rail for Contactor 100mm15 2816.1307 Installation rail for Contactor 140mm16 10.00.061Pan head screw Torx T20 M4x1217 10.00.111Cable clip long18 40.01.588Fuse SC-8A 10x3819 40.01.487Fuse holder 2pol20 10.00.364Pan head screw Torx M3x1221 4001.0217Fuse SC 60A22 40.01.489Fuse holder 3pol23 40.01.488Fuse holder 2pol24 40.01.610Earth terminal 20 WKN 70SL/U25 40.01.609Terminal block grey WKN 150/U26 40.01.611Terminal block grey WKN 70/U27 10.00.244 - Unterlegscheibe A3.228 40.00.212Cable buzzerElectrical unit X 2.A Contactor assembly 22 Electrical installation Voltage3 AC 208V 60HzItem no. Part no Reference Description28 40.01.475Cable clock switch USA28 40.00.250Cable contactor-SSR28 40.01.271Cable control harness28 40.00.243Cable control SSR28 40.00.205Cable level electrode28 40.00.219Cable SC pump28 40.00.220Cable solenoid valveElectrical unit X 3 Clima Plus 33 Clima Plus Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 22.00.324Safety valve2 22.00.214 Hose d50x2023 2066.0531Hose clamp ø564 2001.0124Compression springElectrical unit X 4 Steam generator, Bypass 44 Steam generator, Bypass Voltage 3 AC 208V 60HzItem no. Part no Reference DescriptionA 8354.1320X4.A Pump connection spout cpl.B 8354.1304X4.B Venting valve for steam generator1 3002.0402Filling level electrode 90 mm2 44.00.175 Steam generator insolated3 1106.0803Hex combination nut M6 galv4 44.00.527 Heating element5 44.00.279Gasket f. heating element6 2066.0519Hose clamp 35,6mm7 2066.0526Hose clamp ø46mm8 44.00.207 Emptying pump9 1006.0762Hex screw M6x1010 1306.0222Washer A6,4x15x1,511 44.00.232Fixing device f. pump steam generator12 44.00.242Drain hose steam generator13 2066.0518Hose clamp 30mm14 40.00.291Thermocouple steam generator15 1104.0122Hex combination nut M4 galv16 44.00.362Steam hose 70x517 2066.0505Hose clamp 70-90mm18 2066.0506Hose clamp 20-32mm19 1105.0120 Hex nut M520 1205.0120 Tooth lock washer A5,321 2066.0300Hose clamp 50-70 mm22 2920.1300Level elektrode insert24 10.00.414Cable strap black 120°25 44.00.280Gasket f. heating element+Level elektrode insertElectrical unit X 4.A Pump connection spout cpl. 44 Steam generator, Bypass Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 2118.1000Pump connection spout2 2120.1259Stop plug 10mm3 2066.0527Hose clamp ø14mm4 2066.0530Hose clamp ø16.4mm5 2062.0331Junction pressure hose GS 106 4005.0101Tie rap 145 mmElectrical unit X 4.B Venting valve for steam generator 44 Steam generator, Bypass Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 2062.0332Receptacle for ventilation valve SG2 2069.0108Ventilation valve3 2112.1310Form hose for ventilation of steam generator4 2066.0506Hose clamp 20-32mmElectrical unit X 5 Hot air heating 55 Hot air heating Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 40.00.330Mating flange f. heating assembly2 40.00.258 Heating assembly3 10.00.109Hex screw M5x234 1106.0360Cap nut M6, high shape5 1306.0222Washer A6,4x15x1,56 40.00.331Gasket f. heating assemblyElectrical unit X 6 Motor and fan wheel 66 Motor and fan wheel Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 2120.1306Spacer SW19x172 22.00.123Flange f. motor shaft gasket3 22.00.120Mounting support f. gasket flange4 22.00.083 Motor shaft gasket4 5001.0207 Motor shaft gasket5 1315.0101Copper washer 6x106 1106.0220Hex nut M6 flat7 22.00.192Fan weel d340x1358 1008.0763Hex screw M8x208 10.00.565 Hex screw M8x2010 40.00.435Exhaust channel f. SSR11 40.00.274 Fan motor11 40.00.275 Fan motor12 10.00.071Hex nut M812 1108.0260Hex nut M812 10.00.710Hex nut M8 w. locking13 1208.0260Spring washer B814 1008.1005Square necked mushroom head bolt 8x40Electrical unit X 7 Interior cabinet 77 Interior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference DescriptionA X7.A Interior cabinet weldedB 40.00.091X7.B Gasket frame w. glass a. gasketsC 22.00.462 X7.C Air baffleC 22.00.298 X7.C Air baffle1 40.00.520 Screen interior cabinet sensor3 3024.0201Halogen bulb for interior cabinet 300°C4 40.00.229 Wiring interior light5 20.00.399 Door gasket6 40.01.943 Meat probe sensor6 40.02.103 Meat probe sensor6 40.00.298 Meat probe sensor7 1315.0104Copper washer 16x20x1,58 10.00.422 Hex nut M169 3014.0162Sealing cone for thermocouple10 3014.0163Gasket sleeve with nipple11 22.00.222Air baffle support12 40.00.594Thermocouple interior cabinet B113 2005.0308Outlet sieveElectrical unit X 7.A Interior cabinet welded 77 Interior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 40.00.098Reflector f. interior light2 4001.1248 Porcelain connector 2-pin interior light3 2120.1277Base for sensor connection4 1603.0167 Tubular rivet 3,2x0.25x105 10.00.041Rivet nut M5 hexagon closedElectrical unit X 7.B Gasket frame w. glass a. gaskets 77 Interior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 40.00.093Outer gasket f. interior light2 40.00.094Inner gasket f. interior light3 40.00.095Glass pane f. interior light4 40.00.096 Gasket frame f. interior light5 10.00.682 Phillips countersunk-head screw M5x16Electrical unit X 7.C Air baffle 77 Interior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 40.01.289Fixing clip core temp. cable2 1304.0160Washer A4,33 1604.0167Rivet 4x104 22.00.332Air sucking ring f. air baffle5 2760.1370Latch hook for air baffle6 10.00.515Rivet 3,2x5 A4Electrical unit X 7.C Air baffle 77 Interior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 1304.0160Washer A4,32 1604.0167Rivet 4x103 22.00.332Air sucking ring f. air baffle4 2760.1370Latch hook for air baffle5 40.01.289Fixing clip core temp. cable6 10.00.515Rivet 3,2x5 A46 1603.0166Rivet 3,2x7,9 CNS closed7 1603.0168Rivet 3,2x8 A48 22.00.440 Guard plate f. core sensorElectrical unit X 8 Door 88 Door Voltage 3 AC 208V 60HzItem no. Part no Reference DescriptionA 24.00.126X8.A DoorC 8514.1307X8.C Door catch1 2001.0042Loctite 243 10 ml2 2001.0046 Loctite 2723 24.00.136Door handle4 8474.1410Door lock5 1005.1901Straight pin ø5,6x166 1006.0761Hex screw M6x126 10.00.698Hex screw M6x12 w. precoat 857 1206.0261Spring washer B68 2940.1305Door bolt9 1008.1963Hex socket countersunk head screw M8x1610 2039.0309Cover cap for door11 1004.0665Allen screw M4x611 10.00.696Allen screw M4x6 w. Precoat 8512 24.00.133Door mounting support top13 1008.0768Ornamental screw M8x1614 1308.0160Washer A8,415 24.00.145Door bolt16 1008.0766Hex screw M8x3017 1308.0162Washer A8,418 24.00.048Door bolt19 1008.0769Ornamental screw M8x3020 2001.0109Compression spring21 1008.0761Hex screw M8x2522 1208.0260Spring washer B823 24.00.216Mounting braket f. door lock24 1008.0752Hex screw M5x1024 10.00.697Hex screw M5x10 w. precoat 85Electrical unit X 8 Door 88 Door Voltage 3 AC 208V 60HzItem no. Part no Reference Description25 1305.0160Washer A5,3x10mm26 10.00.099 Hex screw M8x1227 1005.1903Straight pin ø5,6x1228 1004.0906 Hex socket set screw M4x8Electrical unit X 8.A Door 88 Door Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 24.00.212Inner glass pane2 24.00.147Sleeve for door bolt top3 24.00.159Door setting bolt4 24.00.503Fixing device f. magnet with magnet5 24.00.194Gasket glass pane/trolly6 24.00.178Pre heat mechanism f. door cpl.7 24.00.507Fixing device middle f.inter. glass pane8 24.00.701Additional gasket f. trolly9 24.01.259Plastic buffer 8,1mmElectrical unit X 8.C Door catch 88 Door Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 5012.0711Silicone plate for door2 1006.1000 Stud bolt M6x753 1306.0550Washer A6,64 1004.0904Hex socket set screw M6x105 1106.0160Hex nut M66 2001.0119 Compression spring f. door catch7 1006.0625Allen screw M6x70Electrical unit X 9 Water supply, quenching box 99 Water supply, quenchingVoltage 3 AC 208V 60HzboxItem no. Part no Reference Description1 54.00.210Exhaust pipe2 2066.0516Hose clamp 60-80 mm3 40.00.398 Thermocouple quenching4 50.00.316Single solenoid valve5 50.00.139Single solenoid valve6 50.00.073Water distribution vert w/o roll guide con.7 50.00.072Water distribution vert roll guide con.8 50.00.277 Mounting device f. water distribution9 50.00.086Locking plate f. water distribution10 50.00.078Non return valve DW16/DN1211 1900.0202Water filter12 2067.0050Pressure hose d10mm13 2066.0205Hose clamp 8-16x9 mm SW 7mm14 8664.1301T-fitting water connection15 5110.1024Gasket for G3/4" threaded joint16 50.00.085Plug-in spring f. hand shower roll guide17 54.00.237 Inspection lid f. quenching chamber18 5012.0566Gasket quenching chamber 0-ring19 54.00.225Clamping bar20 2016.0943Quenching nozzle21 2112.1307Hose 70x5mmElectrical unit X 10 Hand shower 1010 Hand shower Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 50.00.176 Hand shower roll guide2 50.00.230Connect. pipe f. hand shower roll guide3 50.00.130Hand shower4 50.00.156Clamp f. hand shower roll guide5 1107.0100Star lock ø46 50.00.135 Tulip for handshower7 50.00.544 Mounting device f. hand sh. roll guide8 50.00.290Gasket f. tulip9 50.00.297Gasket f. tulip11 50.00.548Hose ø10x2x500 f. hand shower12 50.00.537Gasket f. connect.pipe hand shower roll guide13 50.00.538O-ring f. connect. pipe f. hand shower roll guideElectrical unit X 13 Exterior cabinet 1313 Exterior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference DescriptionA X13.A Exterior cabinet1 22.00.354Spacer ring1 8450.1310 Spacer ring2 22.00.353Vent cover2 8455.1209 Vent cover3 2022.0101Grommet 18 mm4 8700.0317Floor fixing for units6 5006.0213Glue for floor fixing brackets7 5013.0100Edge protection profile10 2039.0111Foot adjustable, metal, 40 x 40Electrical unit X 13.A Exterior cabinet 1313 Exterior cabinet Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 16.00.332Top cover2 1003.2265Countersunk self tapping screw 4,2x163 1104.0820Snap nut 4,2mm4 16.00.158Side panel right5 1603.0166Rivet 3,2x7,9 CNS closed6 16.00.139Side panel left7 10.00.102Hex self tapping screw B4,2x328 16.00.198Back panel9 16.00.296Front panel10 2002.0107Tension spring for front panel11 16.00.673 Air inlet filter12 2039.0331Cap for service door13 16.00.331Crossbar top14 5105.1028Gasket f. breather tube d=74mm15 16.00.360Cover f. RS232 interface16 10.00.103EJOT PT-screw KA 3.5x1017 16.00.338 Edge protection profile18 16.00.115Rosette19 16.00.358Crossbar front panel20 40.00.454Door switch 1.65m22 16.00.384Bracket for door contact switch23 40.00.476Exhaust channelElectrical unit X 14 Miscellaneous 1414 Miscellaneous Voltage 3 AC 208V 60HzItem no. Part no Reference Description1 60.22.086 Mobile oven rack for type 202,2 1008.0760Hex screw M8x163 10.00.357Rubber plug black4 10.00.448 Phillips countersunk-head screw M5x165 1008.0750Hex screw M5x166 1006.0760Hex screw M6x167 10.00.565 Hex screw M8x208 1208.0160Tooth lock washer A8,49 1104.0400Rivet nut M410 1306.0120Washer A6,412 60.60.100Castor with brake ø125mm13 60.60.101Castor without brake ø125mm14 1603.0162 Rivet 3,2x915 42.00.030 Memory-Stick16 4019.0008 Sticker Electric/Danger17 60.60.574Positioning support f. core sensor。

General DescriptionThe MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communica-tions interfaces, particularly applications where ±12V is not available.These parts are especially useful in battery-powered sys-tems, since their low-power shutdown mode reduces power dissipation to less than 5µW. The MAX225,MAX233, MAX235, and MAX245/MAX246/MAX247 use no external components and are recommended for appli-cations where printed circuit board space is critical.________________________ApplicationsPortable Computers Low-Power Modems Interface TranslationBattery-Powered RS-232 Systems Multidrop RS-232 Networks____________________________Features Superior to Bipolaro Operate from Single +5V Power Supply (+5V and +12V—MAX231/MAX239)o Low-Power Receive Mode in Shutdown (MAX223/MAX242)o Meet All EIA/TIA-232E and V.28 Specifications o Multiple Drivers and Receiverso 3-State Driver and Receiver Outputs o Open-Line Detection (MAX243)Ordering InformationOrdering Information continued at end of data sheet.*Contact factory for dice specifications.MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers________________________________________________________________Maxim Integrated Products 1Selection Table19-4323; Rev 9; 4/00Power No. ofNominalSHDN RxPart Supply RS-232No. of Cap. Value & Three-Active in Data Rate Number (V)Drivers/Rx Ext. Caps (µF)State SHDN (kbps)FeaturesMAX220+52/24 4.7/10No —120Ultra-low-power, industry-standard pinout MAX222+52/2 4 0.1Yes —200Low-power shutdownMAX223 (MAX213)+54/54 1.0 (0.1)Yes ✔120MAX241 and receivers active in shutdown MAX225+55/50—Yes ✔120Available in SOMAX230 (MAX200)+55/04 1.0 (0.1)Yes —120 5 drivers with shutdownMAX231 (MAX201)+5 and2/2 2 1.0 (0.1)No —120Standard +5/+12V or battery supplies; +7.5 to +13.2same functions as MAX232MAX232 (MAX202)+52/24 1.0 (0.1)No —120 (64)Industry standardMAX232A+52/240.1No —200Higher slew rate, small caps MAX233 (MAX203)+52/20— No —120No external capsMAX233A+52/20—No —200No external caps, high slew rate MAX234 (MAX204)+54/04 1.0 (0.1)No —120Replaces 1488MAX235 (MAX205)+55/50—Yes —120No external capsMAX236 (MAX206)+54/34 1.0 (0.1)Yes —120Shutdown, three stateMAX237 (MAX207)+55/34 1.0 (0.1)No —120Complements IBM PC serial port MAX238 (MAX208)+54/44 1.0 (0.1)No —120Replaces 1488 and 1489MAX239 (MAX209)+5 and3/52 1.0 (0.1)No —120Standard +5/+12V or battery supplies;+7.5 to +13.2single-package solution for IBM PC serial port MAX240+55/54 1.0Yes —120DIP or flatpack package MAX241 (MAX211)+54/54 1.0 (0.1)Yes —120Complete IBM PC serial port MAX242+52/240.1Yes ✔200Separate shutdown and enableMAX243+52/240.1No —200Open-line detection simplifies cabling MAX244+58/104 1.0No —120High slew rateMAX245+58/100—Yes ✔120High slew rate, int. caps, two shutdown modes MAX246+58/100—Yes ✔120High slew rate, int. caps, three shutdown modes MAX247+58/90—Yes ✔120High slew rate, int. caps, nine operating modes MAX248+58/84 1.0Yes ✔120High slew rate, selective half-chip enables MAX249+56/1041.0Yes✔120Available in quad flatpack packageFor free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/ReceiversABSOLUTE MAXIMUM RATINGS—MAX220/222/232A/233A/242/243ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243(V CC = +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T A = T MIN to T MAX ‚ unless otherwise noted.)Note 1:Input voltage measured with T OUT in high-impedance state, SHDN or V CC = 0V.Note 2:For the MAX220, V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ..............................................................-0.3V to (V CC - 0.3V)R IN (Except MAX220)........................................................±30V R IN (MAX220).....................................................................±25V T OUT (Except MAX220) (Note 1).......................................±15V T OUT (MAX220)...............................................................±13.2V Output VoltagesT OUT ...................................................................................±15V R OUT .........................................................-0.3V to (V CC + 0.3V)Driver/Receiver Output Short Circuited to GND.........Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 18-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW20-Pin Plastic DIP (derate 8.00mW/°C above +70°C)..440mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C)...696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 20-Pin Wide SO (derate 10.00mW/°C above +70°C)....800mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C).....800mW 18-Pin CERDIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX2_ _AC_ _, MAX2_ _C_ _.............................0°C to +70°C MAX2_ _AE_ _, MAX2_ _E_ _..........................-40°C to +85°C MAX2_ _AM_ _, MAX2_ _M_ _.......................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________3Note 3:MAX243 R2OUT is guaranteed to be low when R2IN is ≥0V or is floating.ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243 (continued)(V= +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T = T to T ‚ unless otherwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 4_________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX220/MAX222/MAX232A/MAX233A/MAX242/MAX243108-1051525OUTPUT VOLTAGE vs. LOAD CURRENT-4-6-8-2642LOAD CURRENT (mA)O U T P U T V O L T A G E (V )1002011104104060AVAILABLE OUTPUT CURRENTvs. DATA RATE65798DATA RATE (kbits/sec)O U T P U T C U R R E N T (m A )203050+10V-10VMAX222/MAX242ON-TIME EXITING SHUTDOWN+5V +5V 0V0V 500µs/div V +, V - V O L T A G E (V )MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________5V CC ...........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................+0.3V to -14V Input VoltagesT IN ............................................................-0.3V to (V CC + 0.3V)R IN ......................................................................................±30V Output VoltagesT OUT ...................................................(V+ + 0.3V) to (V- - 0.3V)R OUT .........................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T OUT ......................................Continuous Continuous Power Dissipation (T A = +70°C)14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)....800mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C)..........1.07W24-Pin Plastic DIP (derate 9.09mW/°C above +70°C)......500mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).........762mW20-Pin Wide SO (derate 10 00mW/°C above +70°C).......800mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C).......941mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W 44-Pin Plastic FP (derate 11.11mW/°C above +70°C).....889mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C)..........727mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C)........800mW 20-Pin CERDIP (derate 11.11mW/°C above +70°C)........889mW 24-Pin Narrow CERDIP(derate 12.50mW/°C above +70°C)..............1W24-Pin Sidebraze (derate 20.0mW/°C above +70°C)..........1.6W 28-Pin SSOP (derate 9.52mW/°C above +70°C).............762mW Operating Temperature RangesMAX2 _ _ C _ _......................................................0°C to +70°C MAX2 _ _ E _ _...................................................-40°C to +85°C MAX2 _ _ M _ _ ...............................................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CABSOLUTE MAXIMUM RATINGS—MAX223/MAX230–MAX241ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241 (continued)(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________78.56.54.55.5TRANSMITTER OUTPUT VOLTAGE (V OH ) vs. V CC7.08.0V CC (V)V O H (V )5.07.57.46.02500TRANSMITTER OUTPUT VOLTAGE (V OH )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.46.27.27.0LOAD CAPACITANCE (pF)V O H (V )1500100050020006.86.612.04.02500TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE6.05.011.09.010.0LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )1500100050020008.07.0-6.0-9.04.55.5TRANSMITTER OUTPUT VOLTAGE (V OL ) vs. V CC-8.0-8.5-6.5-7.0V CC (V)V O L (V )5.0-7.5-6.0-7.62500TRANSMITTER OUTPUT VOLTAGE (V OL )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES-7.0-7.2-7.4-6.2-6.4LOAD CAPACITANCE (pF)V O L (V )150010005002000-6.6-6.810-105101520253035404550TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CURRENT-2-6-4-886CURRENT (mA)V +, V- (V )420__________________________________________Typical Operating CharacteristicsMAX223/MAX230–MAX241*SHUTDOWN POLARITY IS REVERSED FOR NON MAX241 PARTSV+, V- WHEN EXITING SHUTDOWN(1µF CAPACITORS)MAX220-13SHDN*V-O V+500ms/divM A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 8_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS—MAX225/MAX244–MAX249ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)Note 4:Input voltage measured with transmitter output in a high-impedance state, shutdown, or V CC = 0V.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ‚ ENA , ENB , ENR , ENT , ENRA ,ENRB , ENTA , ENTB ..................................-0.3V to (V CC + 0.3V)R IN .....................................................................................±25V T OUT (Note 3).....................................................................±15V R OUT ........................................................-0.3V to (V CC + 0.3V)Short Circuit (one output at a time)T OUT to GND............................................................Continuous R OUT to GND............................................................ContinuousContinuous Power Dissipation (T A = +70°C)28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 40-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...611mW 44-Pin PLCC (derate 13.33mW/°C above +70°C)...........1.07W Operating Temperature RangesMAX225C_ _, MAX24_C_ _ ..................................0°C to +70°C MAX225E_ _, MAX24_E_ _ ...............................-40°C to +85°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering,10sec)..............................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________9Note 5:The 300Ωminimum specification complies with EIA/TIA-232E, but the actual resistance when in shutdown mode or V CC =0V is 10M Ωas is implied by the leakage specification.ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249 (continued)(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 10________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX225/MAX244–MAX24918212345TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE86416LOAD CAPACITANCE (nF)T R A N S M I T T E R S L E W R A T E (V /µs )14121010-105101520253035OUTPUT VOLTAGEvs. LOAD CURRENT FOR V+ AND V--2-4-6-88LOAD CURRENT (mA)O U T P U T V O L T A G E (V )64209.05.012345TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.05.58.5LOAD CAPACITANCE (nF)V +, V (V )8.07.57.06.5MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/ReceiversFigure 1. Transmitter Propagation-Delay Timing Figure 2. Receiver Propagation-Delay TimingFigure 3. Receiver-Output Enable and Disable Timing Figure 4. Transmitter-Output Disable TimingM A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers ENT ENR OPERATION STATUS TRANSMITTERSRECEIVERS00Normal Operation All Active All Active 01Normal Operation All Active All 3-State10Shutdown All 3-State All Low-Power Receive Mode 11ShutdownAll 3-StateAll 3-StateTable 1a. MAX245 Control Pin ConfigurationsENT ENR OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All Active RA1–RA4 3-State,RA5 Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll 3-StateAll Low-Power Receive Mode All Low-Power Receive Mode 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RB5 Low-Power Receive ModeTable 1b. MAX245 Control Pin ConfigurationsTable 1c. MAX246 Control Pin ConfigurationsENA ENB OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All 3-State All Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll ActiveRA1–RA4 3-State,RA5 Active All Active 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RA5 Low-Power Receive ModeMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/ReceiversTable 1d. MAX247/MAX248/MAX249 Control Pin ConfigurationsM A X 220–M A X 249_______________Detailed DescriptionThe MAX220–MAX249 contain four sections: dual charge-pump DC-DC voltage converters, RS-232 dri-vers, RS-232 receivers, and receiver and transmitter enable control inputs.Dual Charge-Pump Voltage ConverterThe MAX220–MAX249 have two internal charge-pumps that convert +5V to ±10V (unloaded) for RS-232 driver operation. The first converter uses capacitor C1 to dou-ble the +5V input to +10V on C3 at the V+ output. The second converter uses capacitor C2 to invert +10V to -10V on C4 at the V- output.A small amount of power may be drawn from the +10V (V+) and -10V (V-) outputs to power external circuitry (see the Typical Operating Characteristics section),except on the MAX225 and MAX245–MAX247, where these pins are not available. V+ and V- are not regulated,so the output voltage drops with increasing load current.Do not load V+ and V- to a point that violates the mini-mum ±5V EIA/TIA-232E driver output voltage when sourcing current from V+ and V- to external circuitry. When using the shutdown feature in the MAX222,MAX225, MAX230, MAX235, MAX236, MAX240,MAX241, and MAX245–MAX249, avoid using V+ and V-to power external circuitry. When these parts are shut down, V- falls to 0V, and V+ falls to +5V. For applica-tions where a +10V external supply is applied to the V+pin (instead of using the internal charge pump to gen-erate +10V), the C1 capacitor must not be installed and the SHDN pin must be tied to V CC . This is because V+is internally connected to V CC in shutdown mode.RS-232 DriversThe typical driver output voltage swing is ±8V when loaded with a nominal 5k ΩRS-232 receiver and V CC =+5V. Output swing is guaranteed to meet the EIA/TIA-232E and V.28 specification, which calls for ±5V mini-mum driver output levels under worst-case conditions.These include a minimum 3k Ωload, V CC = +4.5V, and maximum operating temperature. Unloaded driver out-put voltage ranges from (V+ -1.3V) to (V- +0.5V). Input thresholds are both TTL and CMOS compatible.The inputs of unused drivers can be left unconnected since 400k Ωinput pull-up resistors to V CC are built in (except for the MAX220). The pull-up resistors force the outputs of unused drivers low because all drivers invert.The internal input pull-up resistors typically source 12µA,except in shutdown mode where the pull-ups are dis-abled. Driver outputs turn off and enter a high-imped-ance state—where leakage current is typically microamperes (maximum 25µA)—when in shutdownmode, in three-state mode, or when device power is removed. Outputs can be driven to ±15V. The power-supply current typically drops to 8µA in shutdown mode.The MAX220 does not have pull-up resistors to force the ouputs of the unused drivers low. Connect unused inputs to GND or V CC .The MAX239 has a receiver three-state control line, and the MAX223, MAX225, MAX235, MAX236, MAX240,and MAX241 have both a receiver three-state control line and a low-power shutdown control. Table 2 shows the effects of the shutdown control and receiver three-state control on the receiver outputs.The receiver TTL/CMOS outputs are in a high-imped-ance, three-state mode whenever the three-state enable line is high (for the MAX225/MAX235/MAX236/MAX239–MAX241), and are also high-impedance whenever the shutdown control line is high.When in low-power shutdown mode, the driver outputs are turned off and their leakage current is less than 1µA with the driver output pulled to ground. The driver output leakage remains less than 1µA, even if the transmitter output is backdriven between 0V and (V CC + 6V). Below -0.5V, the transmitter is diode clamped to ground with 1k Ωseries impedance. The transmitter is also zener clamped to approximately V CC + 6V, with a series impedance of 1k Ω.The driver output slew rate is limited to less than 30V/µs as required by the EIA/TIA-232E and V.28 specifica-tions. Typical slew rates are 24V/µs unloaded and 10V/µs loaded with 3Ωand 2500pF.RS-232 ReceiversEIA/TIA-232E and V.28 specifications define a voltage level greater than 3V as a logic 0, so all receivers invert.Input thresholds are set at 0.8V and 2.4V, so receivers respond to TTL level inputs as well as EIA/TIA-232E and V.28 levels.The receiver inputs withstand an input overvoltage up to ±25V and provide input terminating resistors with+5V-Powered, Multichannel RS-232Drivers/ReceiversTable 2. Three-State Control of ReceiversMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receiversnominal 5k Ωvalues. The receivers implement Type 1interpretation of the fault conditions of V.28 and EIA/TIA-232E.The receiver input hysteresis is typically 0.5V with a guaranteed minimum of 0.2V. This produces clear out-put transitions with slow-moving input signals, even with moderate amounts of noise and ringing. The receiver propagation delay is typically 600ns and is independent of input swing direction.Low-Power Receive ModeThe low-power receive-mode feature of the MAX223,MAX242, and MAX245–MAX249 puts the IC into shut-down mode but still allows it to receive information. This is important for applications where systems are periodi-cally awakened to look for activity. Using low-power receive mode, the system can still receive a signal that will activate it on command and prepare it for communi-cation at faster data rates. This operation conserves system power.Negative Threshold—MAX243The MAX243 is pin compatible with the MAX232A, differ-ing only in that RS-232 cable fault protection is removed on one of the two receiver inputs. This means that control lines such as CTS and RTS can either be driven or left floating without interrupting communication. Different cables are not needed to interface with different pieces of equipment.The input threshold of the receiver without cable fault protection is -0.8V rather than +1.4V. Its output goes positive only if the input is connected to a control line that is actively driven negative. If not driven, it defaults to the 0 or “OK to send” state. Normally‚ the MAX243’s other receiver (+1.4V threshold) is used for the data line (TD or RD)‚ while the negative threshold receiver is con-nected to the control line (DTR‚ DTS‚ CTS‚ RTS, etc.). Other members of the RS-232 family implement the optional cable fault protection as specified by EIA/TIA-232E specifications. This means a receiver output goes high whenever its input is driven negative‚ left floating‚or shorted to ground. The high output tells the serial communications IC to stop sending data. To avoid this‚the control lines must either be driven or connected with jumpers to an appropriate positive voltage level.Shutdown—MAX222–MAX242On the MAX222‚ MAX235‚ MAX236‚ MAX240‚ and MAX241‚ all receivers are disabled during shutdown.On the MAX223 and MAX242‚ two receivers continue to operate in a reduced power mode when the chip is in shutdown. Under these conditions‚ the propagation delay increases to about 2.5µs for a high-to-low input transition. When in shutdown, the receiver acts as a CMOS inverter with no hysteresis. The MAX223 and MAX242 also have a receiver output enable input (EN for the MAX242 and EN for the MAX223) that allows receiver output control independent of SHDN (SHDN for MAX241). With all other devices‚ SHDN (SH DN for MAX241) also disables the receiver outputs.The MAX225 provides five transmitters and five receivers‚ while the MAX245 provides ten receivers and eight transmitters. Both devices have separate receiver and transmitter-enable controls. The charge pumps turn off and the devices shut down when a logic high is applied to the ENT input. In this state, the supply cur-rent drops to less than 25µA and the receivers continue to operate in a low-power receive mode. Driver outputs enter a high-impedance state (three-state mode). On the MAX225‚ all five receivers are controlled by the ENR input. On the MAX245‚ eight of the receiver out-puts are controlled by the ENR input‚ while the remain-ing two receivers (RA5 and RB5) are always active.RA1–RA4 and RB1–RB4 are put in a three-state mode when ENR is a logic high.Receiver and Transmitter EnableControl InputsThe MAX225 and MAX245–MAX249 feature transmitter and receiver enable controls.The receivers have three modes of operation: full-speed receive (normal active)‚ three-state (disabled)‚ and low-power receive (enabled receivers continue to function at lower data rates). The receiver enable inputs control the full-speed receive and three-state modes. The transmitters have two modes of operation: full-speed transmit (normal active) and three-state (disabled). The transmitter enable inputs also control the shutdown mode. The device enters shutdown mode when all transmitters are disabled. Enabled receivers function inthe low-power receive mode when in shutdown.M A X 220–M A X 249Tables 1a–1d define the control states. The MAX244has no control pins and is not included in these tables. The MAX246 has ten receivers and eight drivers with two control pins, each controlling one side of the device. A logic high at the A-side control input (ENA )causes the four A-side receivers and drivers to go into a three-state mode. Similarly, the B-side control input (ENB ) causes the four B-side drivers and receivers to go into a three-state mode. As in the MAX245, one A-side and one B-side receiver (RA5 and RB5) remain active at all times. The entire device is put into shut-down mode when both the A and B sides are disabled (ENA = ENB = +5V).The MAX247 provides nine receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs each control four drivers. The ninth receiver (RB5) is always active.The device enters shutdown mode with a logic high on both ENTA and ENTB .The MAX248 provides eight receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs control four drivers each. This part does not have an always-active receiver. The device enters shutdown mode and trans-mitters go into a three-state mode with a logic high on both ENTA and ENTB .The MAX249 provides ten receivers and six drivers with four control pins. The ENRA and ENRB receiver enable inputs each control five receiver outputs. The ENTA and ENTB transmitter enable inputs control three dri-vers each. There is no always-active receiver. The device enters shutdown mode and transmitters go into a three-state mode with a logic high on both ENTA and ENTB . In shutdown mode, active receivers operate in a low-power receive mode at data rates up to 20kbits/sec.__________Applications InformationFigures 5 through 25 show pin configurations and typi-cal operating circuits. In applications that are sensitive to power-supply noise, V CC should be decoupled to ground with a capacitor of the same value as C1 and C2 connected as close as possible to the device.+5V-Powered, Multichannel RS-232Drivers/Receivers。

________________________________________________________________Maxim Integrated Products 1General DescriptionThe MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV electrostatic discharge (ESD) shocks, without latchup.The various combinations of features are outlined in the Selector Guide.The drivers and receivers for all ten devices meet all EIA/TIA-232E and CCITT V.28specifications at data rates up to 120kbps, when loaded in accordance with the EIA/TIA-232E specification.The MAX211E/MAX213E/MAX241E are available in 28-pin SO packages, as well as a 28-pin SSOP that uses 60% less board space. The MAX202E/MAX232E come in 16-pin TSSOP, narrow SO, wide SO, and DIP packages. The MAX203E comes in a 20-pin DIP/SO package, and needs no external charge-pump capacitors. The MAX205E comes in a 24-pin wide DIP package, and also eliminates external charge-pump capacitors. The MAX206E/MAX207E/MAX208E come in 24-pin SO, SSOP, and narrow DIP packages. The MAX232E/MAX241E operate with four 1µF capacitors,while the MAX202E/MAX206E/MAX207E/MAX208E/MAX211E/MAX213E operate with four 0.1µF capacitors,further reducing cost and board space.________________________ApplicationsNotebook, Subnotebook, and Palmtop Computers Battery-Powered Equipment Hand-Held EquipmentNext-Generation Device Featureso For Low-Voltage ApplicationsMAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E: ±15kV ESD-Protected Down to10nA, +3.0V to +5.5V, Up to 1Mbps, True RS-232Transceivers (MAX3246E Available in a UCSP™Package)o For Low-Power ApplicationsMAX3221/MAX3223/MAX3243: 1µA SupplyCurrent, True +3V to +5.5V RS-232 Transceivers with Auto-Shutdown™o For Space-Constrained ApplicationsMAX3233E/MAX3235E: ±15kV ESD-Protected,1µA, 250kbps, +3.0V/+5.5V, Dual RS-232Transceivers with Internal Capacitorso For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA,2Tx/2Rx RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX202E–MAX213E, MAX232E/MAX241E±15kV ESD-Protected, +5V RS-232 TransceiversSelector Guide19-0175; Rev 6; 3/05Pin Configurations and Typical Operating Circuits appear at end of data sheet.YesPARTNO. OF RS-232DRIVERSNO. OF RS-232RECEIVERSRECEIVERS ACTIVE IN SHUTDOWNNO. OF EXTERNAL CAPACITORS(µF)LOW-POWER SHUTDOWNTTL TRI-STATE MAX202E 220 4 (0.1)No No MAX203E 220None No No MAX205E 550None Yes Yes MAX206E 430 4 (0.1)Yes Yes MAX207E 530 4 (0.1)No No MAX208E 440 4 (0.1)No No MAX211E 450 4 (0.1)Yes Yes MAX213E 452 4 (0.1)Yes Yes MAX232E 220 4 (1)No No MAX241E454 (1)YesFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc.Ordering InformationOrdering Information continued at end of data sheet.2_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EABSOLUTE MAXIMUM RATINGSV CC ..........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................-14V to +0.3V Input VoltagesT_IN............................................................-0.3V to (V+ + 0.3V)R_IN...................................................................................±30V Output VoltagesT_OUT.................................................(V- - 0.3V) to (V+ + 0.3V)R_OUT......................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT....................................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C).....696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C)...........755mW20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...889mW 20-Pin SO (derate 10.00mW/°C above +70°C).............800mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C) ...............................1.07W 24-Pin Wide Plastic DIP(derate 14.29mW/°C above +70°C)................................1.14W 24-Pin SO (derate 11.76mW/°C above +70°C).............941mW 24-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SO (derate 12.50mW/°C above +70°C)....................1W 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW Operating Temperature RangesMAX2_ _EC_ _.....................................................0°C to +70°C MAX2_ _EE_ _...................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +165°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICS(V CC = +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; V CC = +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF for MAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ELECTRICAL CHARACTERISTICS (continued)MAX202E–MAX213E, MAX232E/MAX241E (V CC= +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; V CC= +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF forMAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; T A= T MIN to T MAX; unless otherwise noted. Typical valuesare at T A= +25°C.)Note 1:MAX211EE_ _ tested with V CC= +5V ±5%._______________________________________________________________________________________34______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241E__________________________________________Typical Operating Characteristics(Typical Operating Circuits, V CC = +5V, T A = +25°C, unless otherwise noted.)5.00MAX211E/MAX213ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)V O H , -V O L (V )5.56.06.57.07.58.0100020003000400050000MAX211E/MAX213E/MAX241E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E ( V /µs )5101520253010002000300040005000_______________________________________________________________________________________5MAX202E–MAX213E, MAX232E/MAX241E____________________________Typical Operating Characteristics (continued)(Typical Operating Circuits, V CC = +5V, T A = +25°C, unless otherwise noted.)2MAX202E/MAX203E/MAX232E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E ( V /µs )468101214100020003000400050005.07.5-7.53000MAX205E–MAX208ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-5.02.5LOAD CAPACITANCE (pF)O U T P U T V O L T A G E (V )10002000400050000-2.54550203000MAX205E–MAX208E SUPPLY CURRENT vs. LOAD CAPACITANCE2540LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )100020004000500035302.55.0-10.0180MAX205E –MAX208EOUTPUT VOLTAGE vs. DATA RATE-7.50DATA RATE (kbps)O U T P U T V O L T A G E (V )601202401503090210-2.5-5.010.07.56_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EMAX203EMAX205E_____________________________________________________________Pin DescriptionsMAX202E/MAX232E_______________________________________________________________________________________7MAX202E–MAX213E, MAX232E/MAX241EMAX208E________________________________________________Pin Descriptions (continued)MAX206EMAX207E8_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EMAX211E/MAX213E/MAX241E)(MAX205E/MAX206E/MAX211E/MAX213E/MAX241E)________________________________________________Pin Descriptions (continued)MAX211E/MAX213E/MAX241EFigure 3. Transition Slew-Rate Circuit_______________Detailed Description The MAX202E–MAX213E, MAX232E/MAX241E consist of three sections: charge-pump voltage converters, drivers (transmitters), and receivers. These E versions provide extra protection against ESD. They survive ±15kV discharges to the RS-232 inputs and outputs, tested using the Human Body Model. When tested according to IEC1000-4-2, they survive ±8kV contact-discharges and ±15kV air-gap discharges. The rugged E versions are intended for use in harsh environments or applications where the RS-232 connection is frequently changed (such as notebook computers). The standard (non-“E”) MAX202, MAX203, MAX205–MAX208, MAX211, MAX213, MAX232, and MAX241 are recommended for applications where cost is critical.+5V to ±10V Dual Charge-PumpVoltage Converter The +5V to ±10V conversion is performed by dual charge-pump voltage converters (Figure 4). The first charge-pump converter uses capacitor C1 to double the +5V into +10V, storing the +10V on the output filter capacitor, C3. The second uses C2 to invert the +10V into -10V, storing the -10V on the V- output filter capacitor, C4.In shutdown mode, V+ is internally connected to V CC by a 1kΩpull-down resistor, and V- is internally connected to ground by a 1kΩpull up resistor.RS-232 Drivers With V CC= 5V, the typical driver output voltage swing is ±8V when loaded with a nominal 5kΩRS-232 receiver. The output swing is guaranteed to meet EIA/TIA-232E and V.28 specifications that call for ±5V minimum output levels under worst-case conditions. These include a 3kΩload, minimum V CC, and maximum operating temperature. The open-circuit output voltage swings from (V+ - 0.6V) to V-.Input thresholds are CMOS/TTL compatible. The unused drivers’ inputs on the MAX205E–MAX208E, MAX211E, MAX213E, and MAX241E can be left unconnected because 400kΩpull up resistors to V CC are included on-chip. Since all drivers invert, the pull up resistors force the unused drivers’ outputs low. The MAX202E, MAX203E, and MAX232E do not have pull up resistors on the transmitter inputs._______________________________________________________________________________________9MAX202E–MAX213E, MAX232E/MAX241E10______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241E±15kV ESD-Protected, +5V RS-232 Transceivers When in low-power shutdown mode, the MAX205E/MAX206E/MAX211E/MAX213E/MAX241E driver outputs are turned off and draw only leakage currents—even if they are back-driven with voltages between 0V and 12V. Below -0.5V in shutdown, the transmitter output is diode-clamped to ground with a 1k Ωseries impedance.RS-232 ReceiversThe receivers convert the RS-232 signals to CMOS-logic output levels. The guaranteed 0.8V and 2.4V receiver input thresholds are significantly tighter than the ±3V thresholds required by the EIA/TIA-232E specification.This allows the receiver inputs to respond to TTL/CMOS-logic levels, as well as RS-232 levels.The guaranteed 0.8V input low threshold ensures that receivers shorted to ground have a logic 1 output. The 5k Ωinput resistance to ground ensures that a receiver with its input left open will also have a logic 1 output. Receiver inputs have approximately 0.5V hysteresis.This provides clean output transitions, even with slow rise/fall-time signals with moderate amounts of noise and ringing.In shutdown, the MAX213E’s R4 and R5 receivers have no hysteresis.Shutdown and Enable Control (MAX205E/MAX206E/MAX211E/MAX213E/MAX241E)In shutdown mode, the charge pumps are turned off,V+ is pulled down to V CC , V- is pulled to ground, and the transmitter outputs are disabled. This reduces supply current typically to 1µA (15µA for the MAX213E).The time required to exit shutdown is under 1ms, as shown in Figure 5.ReceiversAll MAX213E receivers, except R4 and R5, are put into a high-impedance state in shutdown mode (see Tables 1a and 1b). The MAX213E’s R4 and R5 receivers still function in shutdown mode. These two awake-in-shutdown receivers can monitor external activity while maintaining minimal power consumption.The enable control is used to put the receiver outputs into a high-impedance state, to allow wire-OR connection of two EIA/TIA-232E ports (or ports of different types) at the UART. It has no effect on the RS-232 drivers or the charge pumps.N ote: The enabl e control pin is active l ow for the MAX211E/MAX241E (EN ), but is active high for the MAX213E (EN). The shutdown control pin is active high for the MAX205E/MAX206E/MAX211E/MAX241E (SHDN), but is active low for the MAX213E (SHDN ).Figure 4. Charge-Pump DiagramMAX202E–MAX213E, MAX232E/MAX241EV+V-200µs/div3V 0V 10V 5V 0V -5V -10VSHDNMAX211EFigure 5. MAX211E V+ and V- when Exiting Shutdown (0.1µF capacitors)X = Don't care.*Active = active with reduced performanceSHDN E N OPERATION STATUS Tx Rx 00Normal Operation All Active All Active 01Normal Operation All Active All High-Z 1XShutdownAll High-ZAll High-ZTable 1a. MAX205E/MAX206E/MAX211E/MAX241E Control Pin ConfigurationsTable 1b. MAX213E Control Pin ConfigurationsThe MAX213E’s receiver propagation delay is typically 0.5µs in normal operation. In shutdown mode,propagation delay increases to 4µs for both rising and falling transitions. The MAX213E’s receiver inputs have approximately 0.5V hysteresis, except in shutdown,when receivers R4 and R5 have no hysteresis.When entering shutdown with receivers active, R4 and R5 are not valid until 80µs after SHDN is driven low.When coming out of shutdown, all receiver outputs are invalid until the charge pumps reach nominal voltage levels (less than 2ms when using 0.1µF capacitors).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs have extra protection against static electricity. Maxim’s engineers developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the contact-discharge method specifiedin IEC1000-4-23)±15kV using IEC1000-4-2’s air-gap method.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test set-up, test methodology, and test results.Human Body ModelFigure 6a shows the Human Body Model, and Figure 6b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5k Ωresistor.S H D N ENOPERATION STATUS Tx 1–400Shutdown All High-Z 01Shutdown All High-Z 10Normal Operation 11Normal OperationAll ActiveAll Active Active1–34, 5High-Z ActiveHigh-Z High-Z High-Z Active*High-Z RxM A X 202E –M A X 213E , M A X 232E /M A X 241EIEC1000-4-2The IEC1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX202E/MAX203E–MAX213E, MAX232E/MAX241E help you design equipment that meets level 4 (the highest level) of IEC1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2, because series resistance is lower in the IEC1000-4-2 model. Hence, the ESD withstand voltage measured to IEC1000-4-2 is generally lower than that measured using the Human Body Model. Figure 7b shows the current waveform for the 8kV IEC1000-4-2 level-four ESD contact-discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protection during manufacturing, not just RS-232 inputs and outputs. Therefore,after PC board assembly,theMachine Model is less relevant to I/O ports.Figure 7a. IEC1000-4-2 ESD Test ModelFigure 7b. IEC1000-4-2 ESD Generator Current WaveformFigure 6a. Human Body ESD Test ModelFigure 6b. Human Body Model Current Waveform__________Applications InformationCapacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The MAX202E, MAX206–MAX208E, MAX211E, and MAX213E require 0.1µF capacitors, and the MAX232E and MAX241E require 1µF capacitors, although in all cases capacitors up to 10µF can be used without harm. Ceramic, aluminum-electrolytic, or tantalum capacitors are suggested for the 1µF capacitors, and ceramic dielectrics are suggested for the 0.1µF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2x) nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V-.Use larger capacitors (up to 10µF) to reduce the output impedance at V+ and V-. This can be useful when “stealing” power from V+ or from V-. The MAX203E and MAX205E have internal charge-pump capacitors. Bypass V CC to ground with at least 0.1µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple V CC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1–C4).V+ and V- as Power Supplies A small amount of power can be drawn from V+ and V-, although this will reduce both driver output swing and noise margins. Increasing the value of the charge-pump capacitors (up to 10µF) helps maintain performance when power is drawn from V+ or V-.Driving Multiple Receivers Each transmitter is designed to drive a single receiver. Transmitters can be paralleled to drive multiple receivers.Driver Outputs when Exiting Shutdown The driver outputs display no ringing or undesirable transients as they come out of shutdown.High Data Rates These transceivers maintain the RS-232 ±5.0V minimum driver output voltages at data rates of over 120kbps. For data rates above 120kbps, refer to the Transmitter Output Voltage vs. Load Capacitance graphs in the Typical Operating Characteristics. Communication at these high rates is easier if the capacitive loads on the transmitters are small; i.e., short cables are best.Table 2. Summary of EIA/TIA-232E, V.28 SpecificationsMAX202E–MAX213E, MAX232E/MAX241EM A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)Table 3. DB9 Cable ConnectionsCommonly Used for EIA/TIAE-232E and V.24 Asynchronous Interfaces____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241EM A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241E____________Pin Configurations and Typical Operating Circuits (continued)M A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241E____________Pin Configurations and Typical Operating Circuits (continued)M A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)______________________________________________________________________________________21MAX202E–MAX213E, MAX232E/MAX241E Ordering Information (continued)*Dice are specified at T A= +25°C.M A X 202E –M A X 213E , M A X 232E /M A X 241E22________________________________________________________________________________________________________________________________________________Chip Topographies___________________Chip InformationC1-V+C1+V CC R2INT2OUT R2OUT0.117"(2.972mm)0.080"(2.032mm)V-C2+ C2-T2IN T1OUT R1INR1OUT T1INGNDR5INV-C2-C2+C1-V+C1+V CC T4OUTR3IN T3OUTT1OUT 0.174"(4.420mm)0.188"(4.775mm)T4IN R5OUT R4OUT T3IN R4IN EN (EN) SHDN (SHDN)R3OUT T2OUT GNDR1IN R1OUT T2IN R2OUTR2IN T1IN ( ) ARE FOR MAX213E ONLYTRANSISTOR COUNT: 123SUBSTRATE CONNECTED TO GNDTRANSISTOR COUNT: 542SUBSTRATE CONNECTED TO GNDMAX202E/MAX232EMAX211E/MAX213E/MAX241EMAX205E/MAX206E/MAX207E/MAX208E TRANSISTOR COUNT: 328SUBSTRATE CONNECTED TO GNDMAX202E–MAX213E, MAX232E/MAX241E Package InformationM A X 202E –M A X 213E , M A X 232E /M A X 241EPackage Information (continued)MAX202E–MAX213E, MAX232E/MAX241E±15kV ESD-Protected, +5V RS-232 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________25©2005 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products, Inc.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

■Operates from Single +5V Power Supply ■Meets All RS-232D and ITU V.28Specifications■Operates with 0.1µF to 10µF Capacitors ■High Data Rate – 120Kbps Under Load ■Low Power Shutdown ≤1µA (Typical)■3-State TTL/CMOS Receiver Outputs ■Low Power CMOS – 3mA Operation ■Improved ESD Specifications:±15kV Human Body Model±15kV IEC1000-4-2 Air Discharge ±8kV IEC1000-4-2 Contact DischargeDESCRIPTION…The SP202E/232E/233E/310E/312E devices are a family of line driver and receiver pairs that meet the specifications of RS-232 and V.28 serial protocols with enhanced ESD performance.The ESD tolerance has been improved on these devices to over ±15KV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compatible with Sipex's SP232A/233A/310A/312A devices as well as popular industry standards. As with the initial versions, the SP202E/232E/233E/310E/312E devices feature at least 120Kbps data rate under load, 0.1µF charge pump capacitors, and overall ruggedness for commercial applications.This family also features Sipex's BiCMOS design allowing low power operation without sacrificing performance. The series is available in plastic and ceramic DIP and SOIC packages operating over the commercial, industrial and military temperature ranges.Number of RS232No. of Receivers No. of ExternalModel Drivers Receivers Active in Shutdown 0.1µF CapacitorsShutdown WakeUp TTL Tri–StateSP202E 2204No No No SP232E 2204No No No SP233E 2200No No No SP310E 2204Yes No Yes SP312E2224Yes Yes YesABSOLUTE MAXIMUM RATINGS This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.Vcc .................................................................................................................................................................+6VV+....................................................................................................................(Vcc-0.3V) to +11.0V V-............................................................................................................................................................-11.0V Input VoltagesT IN .........................................................................................................................-0.3 to (Vcc +0.3V)RIN ............................................................................................................................................................±15VOutput VoltagesT OUT ....................................................................................................(V+, +0.3V) to (V-, -0.3V)ROUT ................................................................................................................-0.3V to (Vcc +0.3V)Short Circuit DurationT OUT .........................................................................................................................................ContinuousPower DissipationCERDIP..............................................................................675mW(derate 9.5mW/°C above +70°C)Plastic DIP..........................................................................375mW(derate 7mW/°C above +70°C)Small Outline......................................................................375mW(derate 7mW/°C above +70°C)SPECIFICATIONS元器件交易网元器件交易网PERFORMANCE CURVES+Figure 1. Typical Circuit using the SP202E or SP232E.FEATURES…The SP202E/232E/233E/310E/312E devices are a family of line driver and receiver pairs that meet the specifications of RS-232 and V.28serial protocols with enhanced ESD perfor-mance. The ESD tolerance has been improved on these devices to over ±15KV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compat-ible with Sipex's 232A/233A/310A/312A devices as well as popular industry standards.As with the initial versions, the SP202E/232E/233E/310E/312E devices feature10V/µs slew rate, 120Kbps data rate under load, 0.1µF charge pump capacitors, overall ruggedness for commercial applications, and increased drive current for longer and more flexible cable configurations. This family also features Sipex's BiCMOS design allowing low power operation without sacrificing performance.The SP202E/232E/233E/310E/312E devices have internal charge pump voltage converters which allow them to operate from a single +5V supply. The charge pumps will operate with polarized or non-polarized capacitors ranging from 0.1 to 10 µF and will generate the ±10V needed to generate the RS-232 output levels.Both meet all EIA RS-232 and ITU V.28specifications.The SP310E provides identical features as the SP232E with a single control line which simultaneously shuts down the internal DC/DC converter and puts all transmitter and receiver outputs into a high impedance state. The SP312E is identical to the SP310E with separate tri-state and shutdown control lines.THEORY OF OPERATIONThe SP232E , SP233E , SP310E and SP312Edevices are made up of three basic circuit blocks –1) a driver/transmitter, 2) a receiver and 3) a charge pump. Each block is described below.Driver/TransmitterThe drivers are inverting transmitters, which ac-cept TTL or CMOS inputs and output the RS-232signals with an inverted sense relative to the input logic levels. Typically the RS-232 output voltage swing is ±9V. Even under worst case loading conditions of 3kOhms and 2500pF, the output is guaranteed to be ±5V, which is consistent with the RS-232 standard specifications. The transmitter outputs are protected against infinite short-circuits to ground without degradation in reliability.元器件交易网The instantaneous slew rate of the transmitteroutput is internally limited to a maximum of 30V/µs in order to meet the standards [EIA RS-232-D 2.1.7, Paragraph (5)]. However, the transition re-gion slew rate of these enhanced products is typi-cally 10V/µs. The smooth transition of the loaded output from V OL to V OH clearly meets the mono-tonicity requirements of the standard [EIA RS-232-D 2.1.7, Paragraphs (1) & (2)].ReceiversThe receivers convert RS-232 input signals to inverted TTL signals. Since the input is usually from a transmission line, where long cable lengthsand system interference can degrade the signal, theinputs have a typical hysteresis margin of 500mV.This ensures that the receiver is virtually immune to noisy transmission lines.The input thresholds are 0.8V minimum and 2.4V maximum, again well within the ±3V RS-232requirements. The receiver inputs are also pro-tected against voltages up to ±15V. Should an input be left unconnected, a 5KOhm pulldown resistor to ground will commit the output of the receiver to a high state.Figure 2. Typical Circuits using the SP233ECP and SP233ECTFigure 3. Typical Circuits using the SP310E and SP312EFigure 4. Charge Pump — Phase 1Figure 5. Charge Pump — Phase 2In actual system applications, it is quite possible for signals to be applied to the receiver inputs before power is applied to the receiver circuitry.This occurs, for example, when a PC user attempts to print, only to realize the printer wasn’t turned on.In this case an RS-232 signal from the PC will appear on the receiver input at the printer. When the printer power is turned on, the receiver will operate normally. All of these enhanced devices are fully protected.Charge PumpThe charge pump is a Sipex –patented design (5,306,954) and uses a unique approach com-pared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 10V power supplies. There is a free–running oscillator that controls the four phases of the voltage shifting. A description of each phase follows.Phase 1— V SS charge storage —During this phase of the clock cycle, the positive side of capacitors C 1 and C 2 are initially charged to +5V. C l + is then switched to ground and the charge in C 1– is transferred to C 2–. Since C 2+ is connected to +5V, the voltage potential across capacitor C 2 is now 10V.Phase 2— V SS transfer — Phase two of the clock con-nects the negative terminal of C 2 to the V SS storage capacitor and the positive terminal of C 2to ground, and transfers the generated –l0V to C 3. Simultaneously, the positive side of capaci-tor C 1 is switched to +5V and the negative side is connected to ground.Phase 3— V DD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C 1 produces –5V in the negative terminal of C 1, which is applied to the negative side of capacitor C 2. Since C 2+ is at +5V, the voltage potential across C 2 is l0V.Phase 4— V DD transfer — The fourth phase of the clock connects the negative terminal of C 2 to ground,and transfers the generated l0V across C 2 to C 4,the V DD storage capacitor. Again, simultaneously with this, the positive side of capacitor C 1 is switched to +5V and the negative side is con-nected to ground, and the cycle begins again.Since both V + and V – are separately generated from V CC ; in a no–load condition V + and V – willFigure 6. Charge Pump Waveforms+10Va) C 2+GND GNDb) C 2––10VFigure 7. Charge Pump — Phase 3Figure 8. Charge Pump — Phase 4be symmetrical. Older charge pump approachesthat generate V – from V + will show a decrease in the magnitude of V – compared to V + due to the inherent inefficiencies in the design.The clock rate for the charge pump typically operates at 15kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating.Shutdown (SD) and Enable (EN) for the SP310E and SP312EBoth the SP310E and SP312E have a shutdown/standby mode to conserve power in battery-pow-ered systems. To activate the shutdown mode,which stops the operation of the charge pump, a logic “0” is applied to the appropriate control line.For the SP310E , this control line is ON/OFF (pin 18). Activating the shutdown mode also puts theSP310E transmitter and receiver outputs in a high impedance condition (tri-stated). The shutdown mode is controlled on the SP312E by a logic “0”on the SHUTDOWN control line (pin 18); this also puts the transmitter outputs in a tri–state mode. The receiver outputs can be tri–stated separately during normal operation or shutdown by a logic “1” on the ENABLE line (pin 1).Wake–Up Feature for the SP312EThe SP312E has a wake–up feature that keeps all the receivers in an enabled state when the device is in the shutdown mode. Table 1 defines the truth table for the wake–up function.With only the receivers activated, the SP312E typically draws less than 5µA supply current. In the case of a modem interfaced to a computer in power down mode, the Ring Indicator (RI) signal from the modem would be used to "wake up" the computer, allowing it to accept data transmission.After the ring indicator signal has propagated through the SP312E receiver, it can be used to trigger the power management circuitry of the computer to power up the microprocessor, and bring the SD pin of the SP312E to a logic high, taking it out of the shutdown mode. The receiver propagation delay is typically 1µs. The enable time for V+ and V– is typically 2ms. After V+ and V– have settled to their final values, a signal can be sent back to the modem on the data terminal ready (DTR) pin signifying that the computer is ready to accept and transmit data.Pin Strapping for the SP233ECTThe SP233E packaged in the 20–pin SOIC pack-age (SP233ECT) has a slightly different pinout than the SP233E in other package configurations. To operate properly, the following pairs of pins must be externally wired together:the two V– pins (pins 10 and 17)the two C2+ pins (pins 12 and 15)the two C2– pins (pins 11 and 16)All other connections, features, functions and performance are identical to the SP233E as specified elsewhere in this data sheet.ESD TOLERANCEThe SP202E/232E/233E/310E/312E devices incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD struc-ture is improved over our previous family for more rugged applications and environments sen-sitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15KV without damage nor latch-up. There are different methods of ESD testing applied:a) MIL-STD-883, Method 3015.7b) IEC1000-4-2 Air-Dischargec) IEC1000-4-2 Direct ContactThe Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 9. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise元器件交易网Table 1. Wake-up Function Truth Table.Figure 9. ESD Test Circuit for Human Body ModelFigure 10. ESD Test Circuit for IEC1000-4-2with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 10. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT)through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system.This energy, whether discharged directly or through air, is predominantly a function of theSP202E HUMAN BODY IEC1000-4-2FamilyMODEL Air Discharge Direct Contact LevelDriver Outputs ±15kV ±15kV ±8kV 4Receiver Inputs ±15kV±15kV±8kV4Figure 11. ESD Test Waveform for IEC1000-4-2t=0nst=30ns0A15A30At ➙i ➙Table 2. Transceiver ESD Tolerance Levelsdischarge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directlydischarged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.The circuit models in Figures 9 and 10 represent the typical ESD testing circuit used for all three methods. The C S is initially charged with the DC power supply when the first switch (SW1) is on.Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through R S , the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2switch is pulsed so that the device under test receives a duration of voltage.For the Human Body Model, the current limiting resistor (R S ) and the source capacitor (C S ) are 1.5k Ω an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (R S ) and the source capacitor (C S ) are 330Ω an 150pF, respectively.The higher C S value and lower R S value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.元器件交易网ORDERING INFORMATIONModel.......................................................................................Temperature Range................................................................................Package SP202ECN.....................................................................................0°C to +70°C...........................................................................16–pin N–SOIC SP202ECP.....................................................................................0°C to +70°C.......................................................................16–pin Plastic DIP SP202ECT.....................................................................................0°C to +70°C................................................................................16–pin SOIC SP202EEN...................................................................................–40°C to +85°C..........................................................................16–pin N-SOIC SP202EEP...................................................................................–40°C to +85°C.....................................................................16–pin Plastic DIP SP202EET...................................................................................–40°C to +85°C..............................................................................16–pin SOICSP232ECN.....................................................................................0°C to +70°C...........................................................................16–pin N–SOIC SP232ECP.....................................................................................0°C to +70°C.......................................................................16–pin Plastic DIP SP232ECT.....................................................................................0°C to +70°C................................................................................16–pin SOIC SP232EEN...................................................................................–40°C to +85°C..........................................................................16–pin N-SOIC SP232EEP...................................................................................–40°C to +85°C.....................................................................16–pin Plastic DIP SP232EET...................................................................................–40°C to +85°C..............................................................................16–pin SOIC SP233ECP.....................................................................................0°C to +70°C.......................................................................20–pin Plastic DIP SP233ECT.....................................................................................0°C to +70°C................................................................................20–pin SOIC SP233EEP...................................................................................–40°C to +85°C.....................................................................20–pin Plastic DIP SP233EET...................................................................................–40°C to +85°C..............................................................................20–pin SOICSP310ECP.....................................................................................0°C to +70°C.......................................................................18–pin Plastic DIP SP310ECT.....................................................................................0°C to +70°C................................................................................18–pin SOIC SP310ECA.....................................................................................0°C to +70°C...............................................................................20–pin SSOP SP310EEP...................................................................................–40°C to +85°C.....................................................................18–pin Plastic DIP SP310EET...................................................................................–40°C to +85°C..............................................................................18–pin SOIC SP310EEA...................................................................................–40°C to +85°C.............................................................................20–pin SSOP SP312ECP.....................................................................................0°C to +70°C.......................................................................18–pin Plastic DIP SP312ECT.....................................................................................0°C to +70°C................................................................................18–pin SOIC SP312ECA.....................................................................................0°C to +70°C...............................................................................20–pin SSOP SP312EEP...................................................................................–40°C to +85°C.....................................................................18–pin Plastic DIP SP312EET...................................................................................–40°C to +85°C..............................................................................18–pin SOIC SP312EEA...................................................................................–40°C to +85°C.............................................................................20–pin SSOPPlease consult the factory for pricing and availability on a Tape-On-Reel option.CorporationSIGNAL PROCESSING EXCELLENCESipex CorporationHeadquarters andSales Office22 Linnell CircleBillerica, MA 01821TEL: (978) 667-8700FAX: (978) 670-9001e-mail: sales@Sales Office233 South Hillview DriveMilpitas, CA 95035TEL: (408) 934-7500FAX: (408) 935-7600Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.。

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim's website at .General DescriptionThe MAX3202E/MAX3203E/MAX3204E/MAX3206E are low-capacitance ±15kV ESD-protection diode arrays designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to V CC or GND.The MAX3202E/MAX3203E/MAX3204E/MAX3206E pro-tect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. These devices have a 5pF capacitance per channel, making them ideal for use on high-speed data I/O interfaces.The MAX3202E is a two-channel device intended for USB and USB 2.0 applications. The MAX3203E is a triple-ESD structure intended for USB On-the-Go (OTG) and video applications. The MAX3204E is a quad-ESD structure designed for Ethernet and F ireWire ®applications, and the MAX3206E is a six-channel device designed for cell phone connectors and SVGA video connections.All devices are available in tiny 4-bump (1.05mm x 1.05mm) WLP, 6-bump (1.05mm x 1.57mm) WLP,9-bump (1.52mm x 1.52mm) WLP, 6-pin (3mm x 3mm)TDF N, and 12-pin (4mm x 4mm) TQF N packages and are specified for -40°C to +85°C operation.ApplicationsUSB Video USB 2.0Cell PhonesEthernet SVGA Video ConnectionsFireWireFeatures♦High-Speed Data Line ESD Protection±15kV—Human Body Model±8kV—IEC 61000-4-2, Contact Discharge ±15kV—IEC 61000-4-2, Air-Gap Discharge ♦Tiny WLP Package Available ♦Low 5pF Input Capacitance ♦Low 1nA (max) Leakage Current ♦Low 1nA Supply Current♦+0.9V to +5.5V Supply Voltage Range ♦2-, 3-, 4-, or 6-Channel Devices AvailableMAX3202E/MAX3203E/MAX3204E/MAX3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces________________________________________________________________Maxim Integrated Products1Ordering Information19-2739; Rev 5; 6/11*EP = Exposed pad.Note:All devices operate over -40°C to +85°C temperature range.+Denotes a lead(Pb)-free/RoHS-compliant package.FireWire is a registered trademark of Apple Computer, Inc.Typical Operating CircuitM A X 3202E /M A X 3203E /M A X 3204E /M A X 3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +5V ±5%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5V and T A = +25°C.) (Note 2)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 2:Limits over temperature are guaranteed by design, not production tested.Note 3:Idealized clamp voltages (L1 = L2 = L3 = 0) (Figure 1 ); see the Applications Information section for more information.Note 4:Guaranteed by design. Not production tested.V CC to GND...........................................................-0.3V to +7.0V I/O_ to GND................................................-0.3V to (V CC + 0.3V)Continuous Power Dissipation (T A = +70°C)2 ×2 WLP (derate 11.5mW/°C above +70°C)...............920mW3 ×2 WLP (derate 12.3mW/°C above +70°C)...............984mW 3 ×3 WLP (derate 14.1mW/°C above +70°C).............1128mW6-Pin TDFN (derate 24.4mW/°C above +70°C)..........1951mW 12-Pin TQFN (derate 16.9mW/°C above +70°C)........1349mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Junction Temperature .....................................................+150°C Lead Temperature (soldering, 10s).................................+300°C Soldering Temperature (reflow).......................................+260°CNote 1:Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to /thermal-tutorial .PACKAGE THERMAL CHARACTERISTICS (Note 1)4 WLPJunction-to-Ambient Thermal Resistance (θJA )...............87°C/W 6 WLPJunction-to-Ambient Thermal Resistance (θJA )...............84°C/W 9 WLPJunction-to-Ambient Thermal Resistance (θJA )...............71°C/W6 TDFNJunction-to-Ambient Thermal Resistance (θJA )....................42°C/W Junction-to-Case Thermal Resistance (θJC )...........................9°C/W 12 TQFNJunction-to-Ambient Thermal Resistance (θJA )....................41°C/W Junction-to-Case Thermal Resistance (θJC )...........................6°C/WMAX3202E/MAX3203E/MAX3204E/MAX3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces_______________________________________________________________________________________3Typical Operating Characteristics(V CC = +5V, T A = +25°C, unless otherwise noted.)Pin/Bump DescriptionPIN/BUMPMAX3202E MAX3203E MAX3204E MAX3206E WLPTDFN-EP WLP TDFN-EP WLP TDFN-EP WLP TQFN-EP NAMEFUNCTIONA1, B2 3, 6A1, A2, B31, 2, 4A1, A2, B2, B31, 2, 4, 5A1, A3, B1, B3, C1, C31, 2, 3, 7, 8, 9I/O_ E S D-Protected ChannelA2 4 B1 3 B1 3 A2 5 GND Ground B1 1 A3 6 A3 6 C2 11 V CC Power-Supply Input. Bypass V CC to GND with a 0.1µF ceramic capacitor. — 2, 5 — 5 — — —4, 6,10, 12N.C.No Connection. Not internally connected.— — — — — — — — EPExposed Pad. Connect to GND. Onlyfor TDFN and TQFN packages.0.300.700.501.100.901.301.50CLAMP VOLTAGE vs. DC CURRENTM A X 3202E t o c01DC CURRENT (mA)C L A M P V O L T A G E (V )30709050110130150110100100025354555657585LEAKAGE CURRENT vs. TEMPERATURETEMPERATURE (°C)L E A K A G E C U R R E N T (p A)2486101221345INPUT CAPACITANCE vs. INPUT VOLTAGEINPUT VOLTAGE (V)I N P U T C A P A C I T A N C E (p F )Detailed DescriptionThe MAX3202E/MAX3203E/MAX3204E/MAX3206E are diode arrays designed to protect sensitive electronics against damage resulting from ESD conditions or tran-sient voltages. The low input capacitance makes these devices ideal for high-speed data lines. The MAX3202E, MAX3203E, MAX3204E, and MAX3206E protect two, three, four, and six channels, respectively.The MAX3202E/MAX3203E/MAX3204E/MAX3206E are designed to work in conjunction with a device’s intrinsic ESD protection. The MAX3202E/MAX3203E/MAX3204E/MAX3206E limit the excursion of the ESD event to below ±25V peak voltage when subjected to the Human Body Model waveform. When subjected to the IEC 61000-4-2 waveform, the peak voltage is limited to ±60V when subjected to Contact Discharge and ±100V when subjected to Air-Gap Discharge. The device that is being protected by the MAX3202E/MAX3203E/MAX3204E/MAX3206E must be able to withstand these peak voltages plus any additional voltage generated by the parasitic board.Applications InformationDesign ConsiderationsMaximum protection against ESD damage results from proper board layout (see the Layout Recommendations section and Figure 2). A good layout reduces the para-sitic series inductance on the ground line, supply line,and protected signal lines.The MAX3202E/MAX3203E/MAX3204E/MAX3206E ESD diodes clamp the voltage on the protected lines during an ESD event and shunt the current to GND or V CC . In an ideal circuit, the clamping voltage, V C , is defined as the forward voltage drop, V F , of the protection diode plus any supply voltage present on the cathode.For positive ESD pulses:V C = V CC + V F For negative ESD pulses:V C = -V FIn reality, the effect of the parasitic series inductance on the lines must also be considered (Figure 1).For positive ESD pulses:For negative ESD pulses:where I ESD is the ESD current pulse.M A X 3202E /M A X 3203E /M A X 3204E /M A X 3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces 4_______________________________________________________________________________________Figure 1. Parasitic Series InductanceFigure 2. Layout ConsiderationsMAX3202E/MAX3203E/MAX3204E/MAX3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces_______________________________________________________________________________________5During an ESD event, the current pulse rises from zero to peak value in nanoseconds (Figure 3). For example,in a 15kV IEC-61000 Air-Gap Discharge ESD event,the pulse current rises to approximately 45A in 1ns (di/dt = 45 x 109). An inductance of only 10nH adds an additional 450V to the clamp voltage. An inductance of 10nH represents approximately 0.5in of board trace.Regardless of the device’s specified diode clamp volt-age, a poor layout with parasitic inductance significantly increases the effective clamp voltage at the protected signal line.A low-ESR 0.1µF capacitor must be used between V CC and GND. This bypass capacitor absorbs the charge transferred by an +8kV IEC-61000 Contact Discharge ESD event.Ideally, the supply rail (V CC ) would absorb the charge caused by a positive ESD strike without changing its regulated value. In reality, all power supplies have an effective output impedance on their positive rails. If a power supply’s effective output impedance is 1Ω, then by using V = I ×R, the clamping voltage of V C increas-es by the equation V C = I ESD x R OUT . An +8kV IEC 61000-4-2 ESD event generates a current spike of 24A,so the clamping voltage increases by V C = 24A ×1Ω,or V C = 24V. Again, a poor layout without proper bypassing increases the clamping voltage. A ceramic chip capacitor mounted as close to the MAX3202E/MAX3203E/MAX3204E/MAX3206E V CC pin is the best choice for this application. A bypass capacitor should also be placed as close to the protected device as possible.±15kV ESD ProtectionESD protection can be tested in various ways; the MAX3202E/MAX3203E/MAX3204E/MAX3206E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method speci-fied in IEC 61000-4-2•±15kV using the IEC 61000-4-2 Air-Gap Discharge methodESD Test ConditionsESD performance depends on a number of conditions.Contact Maxim for a reliability report that documents test setup, methodology, and results.Human Body ModelF igure 4 shows the Human Body Model, and F igure 5shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the device through a 1.5k Ωresistor.Figure 4. Human Body ESD Test ModelFigure 3. IEC 61000-4-2 ESD Generator Current WaveformM A X 3202E /M A X 3203E /M A X 3204E /M A X 3206EIEC 61000-4-2The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. The MAX3202E/MAX3203E/MAX3204E/MAX3206E help users design equipment that meets Level 4 of IEC 61000-4-2.The main difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2. Because series resistance is lower in the IEC 61000-4-2 ESD test model (F igure 6)the ESD-withstand voltage measured to this standard is generally lower than that measured using the Human Body Model. F igure 3 shows the current waveform for the ±8kV IEC 61000-4-2 Level 4 ESD Contact Discharge test.The Air-Gap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Layout RecommendationsProper circuit-board layout is critical to suppress ESD-induced line transients. The MAX3202E/MAX3203E/MAX3204E/MAX3206E clamp to 100V; however, with improper layout, the voltage spike at the device is much higher. A lead inductance of 10nH with a 45A current spike at a dv/dt of 1ns results in an ADDITION-AL 450V spike on the protected line. It is essential that the layout of the PC board follows these guidelines:1)Minimize trace length between the connector or input terminal, I/O_, and the protected signal line.2)Use separate planes for power and ground to reduce parasitic inductance and to reduce the impedance to the power rails for shunted ESD current.3)Ensure short ESD transient return paths to GND and V CC .4)Minimize conductive power and ground loops.5)Do not place critical signals near the edge of the PC board.6)Bypass V CC to GND with a low-ESR ceramic capac-itor as close to V CC as possible.7)Bypass the supply of the protected device to GND with a low-ESR ceramic capacitor as close to the supply pin as possible.Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces 6_______________________________________________________________________________________Figure 6. IEC 61000-4-2 ESD Test ModelMAX3202E/MAX3203E/MAX3204E/MAX3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces_______________________________________________________________________________________7Table 1. Reliability Test DataFunctional DiagramsChip InformationPROCESS: BiCMOSM A X 3202E /M A X 3203E /M A X 3204E /M A X 3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data Interfaces 8_______________________________________________________________________________________Pin ConfigurationsPackage InformationFor the latest package outline information and land patterns (footprints), go to /packages . Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing per-tains to the package regardless of RoHS status.MAX3202E/MAX3203E/MAX3204E/MAX3206ELow-Capacitance, 2/3/4/6-Channel, ±15kV ESD Protection Arrays for High-Speed Data InterfacesMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________9©2011 Maxim Integrated ProductsMaxim is a registered trademark of Maxim Integrated Products, Inc.。

●Saves Board Space •Integrated Charge Pump CircuitryEliminates the Need for a Bipolar ±12V SupplyEnables Single Supply Operation From Either +5Vor 9V to +12V•Integrated 0.1μF Capacitors (MAX203, MAX205)•24 pin SSOP Package Saves Up to 40% VersusSO Package●Saves Power for Longer Battery Operation•5μW Shutdown Mode (MAX200, MAX205,MAX206, MAX211)•75μW Ring Indicator Monitoring with Two ActiveReceivers (MAX213)Applications ●Battery-Powered Equipment ●Handheld Equipment ●Portable Diagnostics Equipment Selector Guide continued at end of data sheet.19-0065; Rev 8; 1/15PART POWER-SUPPLYVOLTAGE (V)NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN NUMBER OF EXTERNAL CAPACITORS (0.1μF)LOW-POWER SHUTDOWN/TTL THREE-STATE MAX200+55004Yes/No MAX201+5 and +9.0 to +13.22202No/No MAX202+52204No/No MAX203+5220None No/No 找MEMORY 、二三极管上美光存储MAX200-MAX209, MAX211, and MAX213 are a familyof RS-232 and V.28 transceivers with integrated chargepump circuitry for single +5V supply operation.The drivers maintain the ±5V EIA/TIA-232E outputsignal levels at data rates in excess of 120kbps whenloaded in accordance with the EIA/TIA-232Especification.The MAX211 and MAX213 are available in a 28-pin,wide small-outline (SO) package and a 28-pin shrinksmall-outline (SSOP) package, which occupies only 40%of the area of the SO. The MAX207 is available in a 24-pin SO package and a 24-pin SSOP . The MAX203 andMAX205 use no external components and arerecommended for applications with limited circuit boardspace.Bene its and FeaturesSelector GuideTypical Operating Circuit安装风格：S M O/S M T 。

5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments IncorporatedProduct FolderSample &BuyTechnical Documents Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016MAX2025-V Dual RS-232Line Driver and Receiver With ±15-kV ESD Protection1Features•Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28Standards•ESD Protection for RS-232Bus Pins:±15-kV Human-Body Model•Operates at 5-V V CC Supply •Operates Up to 120kbit/s•Two Drivers and Two Receivers•Latch-Up Performance Exceeds 100mA Per JESD 78,Class II2Applications•Battery-Powered Systems •Notebooks •Laptops•Palmtop PCs•Hand-Held Equipment3DescriptionThe MAX202device consists of two line drivers,two line receivers,and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins,including GND).The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector.The charge pump and four small external capacitors allow operation from a single 5-V supply.The device operates at data signaling rates up to 120kbit/s and a maximum of 30-V/µs driver output slew rate.Device Information (1)PART NUMBER PACKAGE BODY SIZE (NOM)MAX202CD MAX202ID SOIC (16)9.90mm ×3.91mm MAX202CDW MAX202IDW SOIC WIDE (16)10.30mm ×7.50mm MAX202CPW MAX202IPWTSSOP (16)5.00mm x 4.40mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Block Diagram2MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics .............................................67Parameter Measurement Information ..................78Detailed Description . (8)8.1Overview...................................................................88.2Functional Block Diagram.. (8)8.3Feature Description...................................................88.4Device Functional Modes (8)9Application and Implementation (10)9.1Application Information............................................109.2Typical Application.. (10)10Power Supply Recommendations .....................1311Layout . (13)11.1Layout Guidelines ................................................1311.2Layout Example. (13)12Device and Documentation Support (14)12.1Receiving Notification of Documentation Updates 1412.2Community Resources..........................................1412.3Trademarks...........................................................1412.4Electrostatic Discharge Caution............................1412.5Glossary................................................................1413Mechanical,Packaging,and OrderableInformation (14)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision E (April 2007)to Revision F Page•Added ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device and Documentation Support section,andMechanical,Packaging,and Orderable Information section..................................................................................................1•Removed the Ordering Information table;see POA at the end of the data sheet .................................................................1•Changed values in the Thermal Information table to align with JEDEC standards (4)C1+ V CC V+ GND C1± DOUT1C2+ RIN1C2± ROUT1V ± DIN1DOUT2 DIN2RIN2ROUT23MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DW,or PW Package 16-Pin SOIC or TSSOPTop ViewPin FunctionsPINI/O DESCRIPTION 1C1+—Positive lead of C1capacitor2V+O Positive charge pump output for storage capacitor only 3C1–—Negative lead of C1capacitor 4C2+—Positive lead of C2capacitor 5C2–—Negative lead of C2capacitor6V–O Negative charge pump output for storage capacitor only 7DOUT2O RS-232line data output (to remote RS-232system)8RIN2I RS-232line data input (from remote RS-232system)9ROUT2O Logic data output (to UART)10DIN2I Logic data input (from UART)11DIN1I Logic data input (from UART)12ROUT1O Logic data output (to UART)13RIN1I RS-232line data input (from remote RS-232system)14DOUT1O RS-232line data output (to remote RS-232system)15GND —Ground16V CC—Supply voltage,connect to external 5-V power supply4MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltages are with respect to network GND.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT Supply voltage,V CC (2)–0.36V Positive charge pump voltage,V+(2)V CC –0.314V Negative charge pump voltage,V–(2)–140.3V Input voltage,V I Drivers –0.3V++0.3V Receivers ±30Output voltage,V ODrivers V––0.3V++0.3VReceivers–0.3V CC +0.3Short-circuit duration,D OUTContinuousOperating junction temperature,T J 150°C Storage temperature,T stg –65150°C (1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNITV (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)Pins 7,8,13,and 14±15000V All other pins±2000Charged-device model (CDM),per JEDEC specification JESD22-C101(2)±1500(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted (1);see Figure 10)MINNOMMAX UNIT Supply voltage4.555.5V V IH Driver high-level input voltage (D IN )2V V IL Driver low-level input voltage (D IN )0.8V V I Driver input voltage (D IN )0 5.5V Receiver input voltage –3030T A Operating free-air temperatureMAX202C 070°CMAX202I–4085(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report.6.4Thermal InformationTHERMAL METRIC (1)MAX202UNITD (SOIC)DW (SOIC)PW (TSSOP)16PINS 16PINS 16PINS R θJA Junction-to-ambient thermal resistance 76.276.8101°C/W R θJC(top)Junction-to-case (top)thermal resistance 36.839.636.4°C/W R θJB Junction-to-board thermal resistance 33.941.545.9°C/W ψJT Junction-to-top characterization parameter 6.712.6 2.7°C/W ψJB Junction-to-board characterization parameter33.640.945.3°C/W5MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated (1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings,and not more than one output should be shorted at a time.6.5Electrical Characteristicsover recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAX UNIT I CC Supply currentNo load,V CC =5V815mADRIVER SECTIONV OH High-level output voltage D OUT at R L =3k Ωto GND,D IN =GND 59V V OL Low-level output voltage D OUT at R L =3k Ωto GND,D IN =V CC –5–9V I IH High-level input current V I =V CC 0200µA I IL Low-level input current V I at 0V0–200µA I OS (3)Short-circuit output current V CC =5.5V,V O =0V±10±60mA r O Output resistance V CC ,V+,and V–=0V,V O =±2V 300ΩRECEIVER SECTIONV OH High-level output voltage I OH =–1mA 3.5V CC –0.4V V OL Low-level output voltageI OL =1.6mA 0.4V V IT+Positive-going input threshold voltage V CC =5V,T A =25°C 1.7 2.4V V IT–Negative-going input threshold voltage V CC =5V,T A =25°C0.8 1.2V V hys Input hysteresis (V IT+–V IT–)0.20.51V r i Input resistanceV I =±3V to ±25V357k Ω(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Pulse skew is defined as |t PLH –t PHL |of each channel of the same device.6.6Switching Characteristicsover recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAXUNITDRIVER SECTIONMaximum data rateC L =50pF to 1000pF,R L =3k Ωto 7k ΩoneD OUT switching,see Figure 6120kbit/s t PLH(D)Propagation delay time,low-to high-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t PHL(D)Propagation delay time,high-to low-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t sk(p)Pulse skew (3)C L =150to 2500pF,R L =3k Ωto 7k Ω,see Figure 7300ns SR(tr)Slew rate,transition regionC L =50to 1000pF,R L =3k Ωto 7k Ω,V CC =5V,see Figure 63630V/µsRECEIVER SECTION (SEE Figure 8)t PLH(R)Propagation delay time,low-to high-level output C L =150pF 0.510µs t PHL(R)Propagation delay time,high-to low-level output C L =150pF 0.510µs t sk(p)Pulse skew (3)C L =150pF300ns6MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated6.7Typical Characteristicsat T A =25°C (unless otherwise noted)TEST CIRCUITVOLTAGE WAVEFORMS50%50%–3 V3 V1.5 V1.5 VOutputInputV OL V OHt PHL (R)t PLH (R)OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V 3 VOutputInputV OLV OHt PLH (D)t PHL (D)50%50%1.5 V1.5 VRS-232OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V3 VOutputInputV OLV OH t PLH (D)RS-232Outputt PHL (D)A)1.5 V1.5 V3 V –3 V3 V –3 VSR(tf) =6 Vt or t PHL(D PLH(D))7MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 6.Driver Slew RateA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 7.Driver Pulse SkewA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 8.Receiver Propagation Delay Times5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments Incorporated8MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated8Detailed Description8.1OverviewThe MAX202device is a dual driver and receiver that includes a capacitive voltage generator using four capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply.Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.These receivers have shorted and open fail safe.The receiver can accept up to ±30-V inputs and decode inputs as low as ±3V.Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels.Outputs are protected against shorts to ground.8.2Functional Block Diagram8.3Feature Description8.3.1PowerThe power block increases and inverts the 5-V supply for the RS-232driver using a charge pump that requires four 0.1-µF external capacitors.8.3.2RS-232DriverTwo drivers interface standard logic levels to RS-232levels.The driver inputs do not have internal pullup resistors.Do not float the driver inputs.8.3.3RS-232ReceiverTwo Schmitt trigger receivers interface RS-232levels to standard logic levels.Each receiver has an internal 5-k Ωload to ground.An open input results in a high output on ROUT.8.4Device Functional Modes8.4.1V CC Powered by 5-VThe device is in normal operation when powered by 5V.8.4.2V CC UnpoweredWhen MAX202is unpowered,it can be safely connected to an active remote RS-232device.DIN1DOUT1RIN1ROUT1DIN2DOUT2RIN2ROUT29MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated Device Functional Modes (continued)8.4.3Truth TablesTable 1and Table 2list the function for each driver and receiver (respectively).(1)H =high level,L =low levelTable 1.Function Table forEach Driver (1)INPUT DIN OUTPUT DOUTL H HL(1)H =high level,L =low level,Open =input disconnected or connected driver offTable 2.Function Table forEach Receiver (1)INPUT RIN OUTPUT ROUTL H H L OpenHFigure 9.Logic Diagram (Positive Logic)CBYPASS = 0.1F,m C10.1F,m 6.3 VCopyright © 2016,Texas Instruments Incorporated10MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationFor proper operation,add capacitors as shown in Figure 10.Pins 9through 12connect to UART or general purpose logic lines.RS-232lines on pins 7,8,13,and 14connect to a connector or cable.9.2Typical ApplicationA.C3can be connected to V CC or GND.B.Resistor values shown are nominal.C.Nonpolarized ceramic capacitors are acceptable.If polarized tantalum or electrolytic capacitors are used,they must be connected as shown.Figure 10.Typical Operating Circuit and Capacitor Values9.2.1Design Requirements •V CC minimum is 4.5V and maximum is 5.5V.•Maximum recommended bit rate is 120kbps.RVHBM MAX202 SLLS576F–JULY2003–REVISED SETPEMBER2016 Typical Application(continued)9.2.2Detailed Design Procedure9.2.2.1Capacitor SelectionThe capacitor type used for C1through C4is not critical for proper operation.The MAX202requires0.1-µF capacitors.Capacitors up to10µF can be used without harm.Ceramic dielectrics are suggested for the0.1-µF capacitors.When using the minimum recommended capacitor values,make sure the capacitance value does not degrade excessively as the operating temperature varies.If in doubt,use capacitors with a larger(for example, 2×)nominal value.The capacitors'effective series resistance(ESR),which usually rises at low temperatures, influences the amount of ripple on V+and V–.Use larger capacitors(up to10µF)to reduce the output impedance at V+and V–.Bypass V CC to ground with at least0.1µF.In applications sensitive to power-supply noise generated by the charge pumps,decouple V CC to ground with a capacitor the same size as(or larger than)the charge-pump capacitors(C1to C4).9.2.2.2ESD ProtectionMAX202devices have standard ESD protection structures incorporated on all pins to protect against electrostatic discharges encountered during assembly and handling.In addition,the RS-232bus pins(driver outputs and receiver inputs)of these devices have an extra level of ESD protection.Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of±15-kV when powered down.9.2.2.3ESD Test ConditionsStringent ESD testing is performed by TI based on various conditions and procedures.Please contact TI for a reliability report that documents test setup,methodology,and results.9.2.2.4Human-Body Model(HBM)The HBM of ESD testing is shown in Figure11.Figure12shows the current waveform that is generated during a discharge into a low impedance.The model consists of a100-pF capacitor,charged to the ESD voltage of concern,and subsequently discharged into the device under test(DUT)through a1.5-kΩresistor.Figure11.HBM ESD Test Circuit1001502005001.51.00.50.0I -AD U T MAX202SLLS576F –JULY 2003–REVISED SETPEMBER Typical Application (continued)Figure 12.Typical HBM Current Waveform9.2.3Application Curve120kbit/s,1-nF loadFigure 13.Driver and Receiver Loopback SignalMAX202 SLLS576F–JULY2003–REVISED SETPEMBER201610Power Supply RecommendationsThe V CC voltage must be connected to the same power source used for logic device connected to DIN and ROUT pins.V CC must be between4.5V and5.5V.11Layout11.1Layout GuidelinesKeep the external capacitor traces short.This is more important on C1and C2nodes that have the fastest rise and fall times.For best ESD performance,make the impedance from MAX202ground pin to the ground plane of the circuit board as low as e wide metal and multiple vias on both sides of ground pin.11.2Layout ExampleFigure14.MAX202Circuit Board LayoutMAX202SLLS576F–JULY2003–REVISED 12Device and Documentation Support12.1Receiving Notification of Documentation UpdatesTo receive notification of documentation updates,navigate to the device product folder on .In the upper right corner,click on Alert me to register and receive a weekly digest of any product information that has changed.For change details,review the revision history included in any revised document.12.2Community ResourcesThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 2(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant MAX202CDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202CDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202CPWR TSSOPPW 162000330.012.4 6.9 5.6 1.68.012.0Q1MAX202IDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202IDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202IPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) MAX202CDR SOIC D162500333.2345.928.6 MAX202CDWR SOIC DW162000367.0367.038.0 MAX202CPWR TSSOP PW162000367.0367.035.0 MAX202IDR SOIC D162500333.2345.928.6 MAX202IDWR SOIC DW162000367.0367.038.0MAX202IPWR TSSOP PW162000367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2016,Texas Instruments Incorporated。

Figure 3. Transition Slew-Rate CircuitDetailed DescriptionThe MAX202E–MAX213E, MAX232E/MAX241E consist of three sections: charge-pump voltage converters, dri-vers (transmitters), and receivers. These E versions provide extra protection against ESD. They survive ±15kV discharges to the RS-232 inputs and outputs, tested using the Human Body Model. When tested according to IEC1000-4-2, they survive ±8kV contact-discharges and ±15kV air-gap discharges. The rugged E versions are intended for use in harsh environments or applications where the RS-232 connection is fre-quently changed (such as notebook computers). The standard (non-“E”) MAX202, MAX203, MAX205–MAX208, MAX211, MAX213, MAX232, and MAX241 are recommended for applications where cost is critical.+5V to ±10V Dual Charge-PumpVoltage ConverterThe +5V to ±10V conversion is performed by dual charge-pump voltage converters (F igure 4). The first charge-pump converter uses capacitor C1 to double the +5V into +10V, storing the +10V on the output filter capacitor, C3. The second uses C2 to invert the +10V into -10V, storing the -10V on the V- output filter capaci-tor, C4.In shutdown mode, V+ is internally connected to V CC by a 1kΩpull-down resistor, and V- is internally connected to ground by a 1kΩpull up resistor.RS-232 DriversWith V CC= 5V, the typical driver output voltage swing is ±8V when loaded with a nominal 5kΩRS-232 receiv-er. The output swing is guaranteed to meet EIA/TIA-232E and V.28 specifications that call for ±5V minimum output levels under worst-case conditions. These include a 3kΩload, minimum V CC, and maximum oper-ating temperature. The open-circuit output voltage swings from (V+ - 0.6V) to V-.Input thresholds are CMOS/TTL compatible. The unused drivers’ inputs on the MAX205E–MAX208E, MAX211E, MAX213E, and MAX241E can be left uncon-nected because 400kΩpull up resistors to V CC are included on-chip. Since all drivers invert, the pull up resistors force the unused drivers’ outputs low. The MAX202E, MAX203E, and MAX232E do not have pull up resistors on the transmitter inputs.找MEMORY、二三极管上美光存储Integrated | 9MAX202E–MAX213E, MAX232E/MAX241E±15kV ESD-Protected,5V RS-232 TransceiversShutdown and Enable Control(MAX205E/MAX206E/MAX211E/MAX213E/MAX241E)In shutdown mode, the charge pumps are turned off, V+ is pulled down to V CC, V- is pulled to ground, and the transmitter outputs are disabled. This reduces sup-ply current typically to 1µA (15µA for the MAX213E). The time required to exit shutdown is under 1ms, as shown in Figure 5.ReceiversAll MAX213E receivers, except R4 and R5, are put into a high-impedance state in shutdown mode (see Tables 1a and 1b). The MAX213E’s R4 and R5 receivers still function in shutdown mode. These two awake-in-shut-down receivers can monitor external activity while main-taining minimal power consumption.The enable control is used to put the receiver outputs into a high-impedance state, to allow wire-OR connection of two EIA/TIA-232E ports (or ports of different types) at the UART. It has no effect on the RS-232 drivers or the charge pumps.Note: The enable c ontrol pin is ac tive low for the MAX211E/MAX241E (EN), but is ac tive high for the MAX213E (EN). The shutdown control pin is active highFigure 4. Charge-Pump DiagramWhen in low-power shutdown mode, the MAX205E/MAX206E/MAX211E/MAX213E/MAX241E driver outputsare turned off and draw only leakage currents—even ifthey are back-driven with voltages between 0V and12V. Below -0.5V in shutdown, the transmitter output isdiode-clamped to ground with a 1kΩseries imped-ance.RS-232 ReceiversThe receivers convert the RS-232 signals to CMOS-logicoutput levels. The guaranteed 0.8V and 2.4V receiverinput thresholds are significantly tighter than the ±3Vthresholds required by the EIA/TIA-232E specification.This allows the receiver inputs to respond to TTL/CMOS-logic levels, as well as RS-232 levels.The guaranteed 0.8V input low threshold ensures thatreceivers shorted to ground have a logic 1 output. The5kΩinput resistance to ground ensures that a receiverwith its input left open will also have a logic 1 output.Receiver inputs have approximately 0.5V hysteresis.This provides clean output transitions, even with slowrise/fall-time signals with moderate amounts of noiseand ringing.In shutdown, the MAX213E’s R4 and R5 receivers haveno hysteresis.Integrated | 10。

General DescriptionThe MAX220–MAX249 family of line drivers/receivers is intended for all EIA/TIA-232E and V.28/V.24 communica-tions interfaces, particularly applications where ±12V is not available.These parts are especially useful in battery-powered sys-tems, since their low-power shutdown mode reduces power dissipation to less than 5µW. The MAX225,MAX233, MAX235, and MAX245/MAX246/MAX247 use no external components and are recommended for appli-cations where printed circuit board space is critical.________________________ApplicationsPortable Computers Low-Power Modems Interface TranslationBattery-Powered RS-232 Systems Multidrop RS-232 NetworksNext-Generation Device Features♦For Low-Voltage, Integrated ESD ApplicationsMAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E: +3.0V to +5.5V, Low-Power, Up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors (MAX3246E Available in a UCSP™Package)♦For Low-Cost ApplicationsMAX221E: ±15kV ESD-Protected, +5V, 1µA,Single RS-232 Transceiver with AutoShutdown™MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers________________________________________________________________Maxim Integrated Products 1Selection Table19-4323; Rev 15; 1/06Power No. of NominalSHDN RxPart Supply RS-232No. of Cap. Value & Three-Active in Data Rate Number (V)Drivers/Rx Ext. Caps (µF)State SHDN (kbps)FeaturesMAX220+52/240.047/0.33No —120Ultra-low-power, industry-standard pinout MAX222+52/2 4 0.1Yes —200Low-power shutdownMAX223 (MAX213)+54/54 1.0 (0.1)Yes ✔120MAX241 and receivers active in shutdown MAX225+55/50—Yes ✔120Available in SOMAX230 (MAX200)+55/04 1.0 (0.1)Yes —120 5 drivers with shutdownMAX231 (MAX201)+5 and2/2 2 1.0 (0.1)No —120Standard +5/+12V or battery supplies; +7.5 to +13.2same functions as MAX232MAX232 (MAX202)+52/24 1.0 (0.1)No —120 (64)Industry standardMAX232A+52/240.1No —200Higher slew rate, small caps MAX233 (MAX203)+52/20— No —120No external capsMAX233A+52/20—No —200No external caps, high slew rate MAX234 (MAX204)+54/04 1.0 (0.1)No —120Replaces 1488MAX235 (MAX205)+55/50—Yes —120No external capsMAX236 (MAX206)+54/34 1.0 (0.1)Yes —120Shutdown, three stateMAX237 (MAX207)+55/34 1.0 (0.1)No —120Complements IBM PC serial port MAX238 (MAX208)+54/44 1.0 (0.1)No —120Replaces 1488 and 1489MAX239 (MAX209)+5 and3/52 1.0 (0.1)No —120Standard +5/+12V or battery supplies;+7.5 to +13.2single-package solution for IBM PC serial port MAX240+55/54 1.0Yes —120DIP or flatpack package MAX241 (MAX211)+54/54 1.0 (0.1)Yes —120Complete IBM PC serial port MAX242+52/240.1Yes ✔200Separate shutdown and enableMAX243+52/240.1No —200Open-line detection simplifies cabling MAX244+58/104 1.0No —120High slew rateMAX245+58/100—Yes ✔120High slew rate, int. caps, two shutdown modes MAX246+58/100—Yes ✔120High slew rate, int. caps, three shutdown modes MAX247+58/90—Yes ✔120High slew rate, int. caps, nine operating modes MAX248+58/84 1.0Yes ✔120High slew rate, selective half-chip enables MAX249+56/1041.0Yes✔120Available in quad flatpack packageFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering InformationOrdering Information continued at end of data sheet.*Contact factory for dice specifications.AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS—MAX220/222/232A/233A/242/243ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243Note 1:For the MAX220, V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V.Note 2:Input voltage measured with T OUT in high-impedance state, SHDN or V CC = 0V.Note 3:Maximum reflow temperature for the MAX233A is +225°C.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V V+ (Note 1)..................................................(V CC - 0.3V) to +14V V- (Note 1).............................................................+0.3V to +14V Input VoltagesT IN ..............................................................-0.3V to (V CC - 0.3V)R IN (Except MAX220)........................................................±30V R IN (MAX220).....................................................................±25V T OUT (Except MAX220) (Note 2).......................................±15V T OUT (MAX220)...............................................................±13.2V Output VoltagesT OUT ...................................................................................±15V R OUT .........................................................-0.3V to (V CC + 0.3V)Driver/Receiver Output Short Circuited to GND.........Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)..842mW18-Pin Plastic DIP (derate 11.11mW/°C above +70°C)..889mW 20-Pin Plastic DIP (derate 8.00mW/°C above +70°C)..440mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C)...696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 20-Pin Wide SO (derate 10.00mW/°C above +70°C)....800mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C).....800mW 18-Pin CERDIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX2_ _AC_ _, MAX2_ _C_ _.............................0°C to +70°C MAX2_ _AE_ _, MAX2_ _E_ _..........................-40°C to +85°C MAX2_ _AM_ _, MAX2_ _M_ _.......................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10s) (Note 3)...................+300°CMAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________3Note 4:MAX243 R2OUT IN ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243 (continued)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 4_________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX220/MAX222/MAX232A/MAX233A/MAX242/MAX243108-1051525OUTPUT VOLTAGE vs. LOAD CURRENT-4-6-8-2642LOAD CURRENT (mA)O U T P U T V O L T A G E (V )1002011104104060AVAILABLE OUTPUT CURRENTvs. DATA RATE65798DATA RATE (kb/s)O U T P U T C U R R E N T (m A )203050+10V-10VMAX222/MAX242ON-TIME EXITING SHUTDOWN+5V +5V 0V0V 500μs/div V +, V - V O L T A G E (V )ELECTRICAL CHARACTERISTICS—MAX220/222/232A/233A/242/243 (continued)(V CC = +5V ±10%, C1–C4 = 0.1µF‚ MAX220, C1 = 0.047µF, C2–C4 = 0.33µF, T A = T MIN to T MAX ‚ unless otherwise noted.)MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________5V CC ...........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................+0.3V to -14V Input VoltagesT IN ............................................................-0.3V to (V CC + 0.3V)R IN ......................................................................................±30V Output VoltagesT OUT ...................................................(V+ + 0.3V) to (V- - 0.3V)R OUT .........................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T OUT ......................................Continuous Continuous Power Dissipation (T A = +70°C)14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)....800mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C)..........1.07W24-Pin Plastic DIP (derate 9.09mW/°C above +70°C)......500mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).........762mW20-Pin Wide SO (derate 10.00mW/°C above +70°C).......800mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C).......941mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W 44-Pin Plastic FP (derate 11.11mW/°C above +70°C).....889mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C)..........727mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C)........800mW 20-Pin CERDIP (derate 11.11mW/°C above +70°C)........889mW 24-Pin Narrow CERDIP(derate 12.50mW/°C above +70°C)..............1W24-Pin Sidebraze (derate 20.0mW/°C above +70°C)..........1.6W 28-Pin SSOP (derate 9.52mW/°C above +70°C).............762mW Operating Temperature RangesMAX2 _ _ C _ _......................................................0°C to +70°C MAX2 _ _ E _ _...................................................-40°C to +85°C MAX2 _ _ M _ _......................................................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10s) (Note 4)...................+300°CABSOLUTE MAXIMUM RATINGS—MAX223/MAX230–MAX241ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 4:Maximum reflow temperature for the MAX233/MAX235 is +225°C.M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 6_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—MAX223/MAX230–MAX241 (continued)(MAX223/230/232/234/236/237/238/240/241, V CC = +5V ±10; MAX233/MAX235, V CC = 5V ±5%‚ C1–C4 = 1.0µF; MAX231/MAX239,V CC = 5V ±10%; V+ = 7.5V to 13.2V; T A = T MIN to T MAX ; unless otherwise noted.)MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________78.56.54.55.5TRANSMITTER OUTPUT VOLTAGE (V OH ) vs. V CC7.08.0V CC (V)V O H (V )5.07.57.46.02500TRANSMITTER OUTPUT VOLTAGE (V OH )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.46.27.27.0LOAD CAPACITANCE (pF)V O H (V )1500100050020006.86.612.04.02500TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE6.05.011.09.010.0LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )1500100050020008.07.0-6.0-9.04.55.5TRANSMITTER OUTPUT VOLTAGE (V OL ) vs. V CC-8.0-8.5-6.5-7.0V CC (V)V O L (V )5.0-7.5-6.0-7.62500TRANSMITTER OUTPUT VOLTAGE (V OL )vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES-7.0-7.2-7.4-6.2-6.4LOAD CAPACITANCE (pF)V O L (V )150010005002000-6.6-6.810-105101520253035404550TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CURRENT-2-6-4-886CURRENT (mA)V +, V - (V )420__________________________________________Typical Operating CharacteristicsMAX223/MAX230–MAX241*SHUTDOWN POLARITY IS REVERSED FOR NON MAX241 PARTSV+, V- WHEN EXITING SHUTDOWN(1μF CAPACITORS)MAX220-13SHDN*V-O V+500ms/divM A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 8_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS—MAX225/MAX244–MAX249ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC )...............................................-0.3V to +6V Input VoltagesT IN ‚ ENA , ENB , ENR , ENT , ENRA ,ENRB , ENTA , ENTB ..................................-0.3V to (V CC + 0.3V)R IN .....................................................................................±25V T OUT (Note 5).....................................................................±15V R OUT ........................................................-0.3V to (V CC + 0.3V)Short Circuit (one output at a time)T OUT to GND............................................................Continuous R OUT to GND............................................................ContinuousContinuous Power Dissipation (T A = +70°C)28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 40-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...611mW 44-Pin PLCC (derate 13.33mW/°C above +70°C)...........1.07W Operating Temperature RangesMAX225C_ _, MAX24_C_ _ ..................................0°C to +70°C MAX225E_ _, MAX24_E_ _ ...............................-40°C to +85°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering,10s) (Note 6)....................+300°CNote 5:Input voltage measured with transmitter output in a high-impedance state, shutdown, or V CC = 0V.Note 6:Maximum reflow temperature for the MAX225/MAX245/MAX246/MAX247 is +225°C.MAX220–MAX249+5V-Powered, Multichannel RS-232Drivers/Receivers_______________________________________________________________________________________9Note 7:The 300Ωminimum specification complies with EIA/TIA-232E, but the actual resistance when in shutdown mode or V CC =0V is 10M Ωas is implied by the leakage specification.ELECTRICAL CHARACTERISTICS—MAX225/MAX244–MAX249 (continued)(MAX225, V CC = 5.0V ±5%; MAX244–MAX249, V CC = +5.0V ±10%, external capacitors C1–C4 = 1µF; T A = T MIN to T MAX ; unless oth-erwise noted.)M A X 220–M A X 249+5V-Powered, Multichannel RS-232Drivers/Receivers 10________________________________________________________________________________________________________________________________Typical Operating CharacteristicsMAX225/MAX244–MAX24918212345TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE86416LOAD CAPACITANCE (nF)T R A N S M I T T E R S L E W R A T E (V /μs )14121010-105101520253035OUTPUT VOLTAGEvs. LOAD CURRENT FOR V+ AND V--2-4-6-88LOAD CURRENT (mA)O U T P U T V O L T A G E (V )64209.05.012345TRANSMITTER OUTPUT VOLTAGE (V+, V-)vs. LOAD CAPACITANCE AT DIFFERENT DATA RATES6.05.58.5LOAD CAPACITANCE (nF)V +, V (V )8.07.57.06.5MAX220–MAX249Drivers/ReceiversFigure 1. Transmitter Propagation-Delay Timing Figure 2. Receiver Propagation-Delay TimingFigure 3. Receiver-Output Enable and Disable Timing Figure 4. Transmitter-Output Disable TimingM A X 220–M A X 249Drivers/Receivers ENT ENR OPERATION STATUS TRANSMITTERSRECEIVERS00Normal Operation All Active All Active 01Normal Operation All Active All 3-State10Shutdown All 3-State All Low-Power Receive Mode 11ShutdownAll 3-StateAll 3-StateTable 1a. MAX245 Control Pin ConfigurationsENT ENR OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All Active RA1–RA4 3-State,RA5 Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll 3-StateAll Low-Power Receive Mode All Low-Power Receive Mode 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RB5 Low-Power Receive ModeTable 1b. MAX245 Control Pin ConfigurationsTable 1c. MAX246 Control Pin ConfigurationsENA ENB OPERATION STATUS TRANSMITTERS RECEIVERSTA1–TA4TB1–TB4RA1–RA5RB1–RB500Normal Operation All Active All Active All Active All Active 01Normal Operation All Active All 3-State All Active RB1–RB4 3-State,RB5 Active 1ShutdownAll 3-StateAll ActiveRA1–RA4 3-State,RA5 Active All Active 11Shutdown All 3-State All 3-StateRA1–RA4 3-State,RA5 Low-Power Receive ModeRB1–RB4 3-State,RA5 Low-Power Receive ModeMAX220–MAX249Drivers/ReceiversM A X 220–M A X 249_______________Detailed DescriptionThe MAX220–MAX249 contain four sections: dual charge-pump DC-DC voltage converters, RS-232 dri-vers, RS-232 receivers, and receiver and transmitter enable control inputs.Dual Charge-Pump Voltage ConverterThe MAX220–MAX249 have two internal charge-pumps that convert +5V to ±10V (unloaded) for RS-232 driver operation. The first converter uses capacitor C1 to dou-ble the +5V input to +10V on C3 at the V+ output. The second converter uses capacitor C2 to invert +10V to -10V on C4 at the V- output.A small amount of power may be drawn from the +10V (V+) and -10V (V-) outputs to power external circuitry (see the Typical Operating Characteristics section),except on the MAX225 and MAX245–MAX247, where these pins are not available. V+ and V- are not regulated,so the output voltage drops with increasing load current.Do not load V+ and V- to a point that violates the mini-mum ±5V EIA/TIA-232E driver output voltage when sourcing current from V+ and V- to external circuitry. When using the shutdown feature in the MAX222,MAX225, MAX230, MAX235, MAX236, MAX240,MAX241, and MAX245–MAX249, avoid using V+ and V-to power external circuitry. When these parts are shut down, V- falls to 0V, and V+ falls to +5V. For applica-tions where a +10V external supply is applied to the V+pin (instead of using the internal charge pump to gen-erate +10V), the C1 capacitor must not be installed and the SHDN pin must be tied to V CC . This is because V+is internally connected to V CC in shutdown mode.RS-232 DriversThe typical driver output voltage swing is ±8V when loaded with a nominal 5k ΩRS-232 receiver and V CC =+5V. Output swing is guaranteed to meet the EIA/TIA-232E and V.28 specification, which calls for ±5V mini-mum driver output levels under worst-case conditions.These include a minimum 3k Ωload, V CC = +4.5V, and maximum operating temperature. Unloaded driver out-put voltage ranges from (V+ -1.3V) to (V- +0.5V).Input thresholds are both TTL and CMOS compatible.The inputs of unused drivers can be left unconnected since 400k Ωinput pullup resistors to V CC are built in (except for the MAX220). The pullup resistors force the outputs of unused drivers low because all drivers invert.The internal input pullup resistors typically source 12µA,except in shutdown mode where the pullups are dis-abled. Driver outputs turn off and enter a high-imped-ance state—where leakage current is typically microamperes (maximum 25µA)—when in shutdownmode, in three-state mode, or when device power is removed. Outputs can be driven to ±15V. The power-supply current typically drops to 8µA in shutdown mode.The MAX220 does not have pullup resistors to force the outputs of the unused drivers low. Connect unused inputs to GND or V CC .The MAX239 has a receiver three-state control line, and the MAX223, MAX225, MAX235, MAX236, MAX240,and MAX241 have both a receiver three-state control line and a low-power shutdown control. Table 2 shows the effects of the shutdown control and receiver three-state control on the receiver outputs.The receiver TTL/CMOS outputs are in a high-imped-ance, three-state mode whenever the three-state enable line is high (for the MAX225/MAX235/MAX236/MAX239–MAX241), and are also high-impedance whenever the shutdown control line is high.When in low-power shutdown mode, the driver outputs are turned off and their leakage current is less than 1µA with the driver output pulled to ground. The driver output leakage remains less than 1µA, even if the transmitter output is backdriven between 0V and (V CC + 6V). Below -0.5V, the transmitter is diode clamped to ground with 1k Ωseries impedance. The transmitter is also zener clamped to approximately V CC + 6V, with a series impedance of 1k Ω.The driver output slew rate is limited to less than 30V/µs as required by the EIA/TIA-232E and V.28 specifica-tions. Typical slew rates are 24V/µs unloaded and 10V/µs loaded with 3Ωand 2500pF.RS-232 ReceiversEIA/TIA-232E and V.28 specifications define a voltage level greater than 3V as a logic 0, so all receivers invert.Input thresholds are set at 0.8V and 2.4V, so receivers respond to TTL level inputs as well as EIA/TIA-232E and V.28 levels.The receiver inputs withstand an input overvoltage up to ±25V and provide input terminating resistors withDrivers/ReceiversTable 2. Three-State Control of ReceiversMAX220–MAX249Drivers/Receiversnominal 5k Ωvalues. The receivers implement Type 1interpretation of the fault conditions of V.28 and EIA/TIA-232E.The receiver input hysteresis is typically 0.5V with a guaranteed minimum of 0.2V. This produces clear out-put transitions with slow-moving input signals, even with moderate amounts of noise and ringing. The receiver propagation delay is typically 600ns and is independent of input swing direction.Low-Power Receive ModeThe low-power receive mode feature of the MAX223,MAX242, and MAX245–MAX249 puts the IC into shut-down mode but still allows it to receive information. This is important for applications where systems are periodi-cally awakened to look for activity. Using low-power receive mode, the system can still receive a signal that will activate it on command and prepare it for communi-cation at faster data rates. This operation conserves system power.Negative Threshold—MAX243The MAX243 is pin compatible with the MAX232A, differ-ing only in that RS-232 cable fault protection is removed on one of the two receiver inputs. This means that control lines such as CTS and RTS can either be driven or left floating without interrupting communication. Different cables are not needed to interface with different pieces of equipment.The input threshold of the receiver without cable fault protection is -0.8V rather than +1.4V. Its output goes positive only if the input is connected to a control line that is actively driven negative. If not driven, it defaults to the 0 or “OK to send” state. Normally‚ the MAX243’s other receiver (+1.4V threshold) is used for the data line (TD or RD)‚ while the negative threshold receiver is con-nected to the control line (DTR‚ DTS‚ CTS‚ RTS, etc.). Other members of the RS-232 family implement the optional cable fault protection as specified by EIA/TIA-232E specifications. This means a receiver output goes high whenever its input is driven negative‚ left floating‚or shorted to ground. The high output tells the serial communications IC to stop sending data. To avoid this‚the control lines must either be driven or connected with jumpers to an appropriate positive voltage level.Shutdown—MAX222–MAX242On the MAX222‚ MAX235‚ MAX236‚ MAX240‚ and MAX241‚ all receivers are disabled during shutdown.On the MAX223 and MAX242‚ two receivers continue to operate in a reduced power mode when the chip is in shutdown. Under these conditions‚ the propagation delay increases to about 2.5µs for a high-to-low input transition. When in shutdown, the receiver acts as a CMOS inverter with no hysteresis. The MAX223 and MAX242 also have a receiver output enable input (EN for the MAX242 and EN for the MAX223) that allows receiver output control independent of SHDN (SHDN for MAX241). With all other devices‚ SHDN (SH DN for MAX241) also disables the receiver outputs.The MAX225 provides five transmitters and five receivers‚ while the MAX245 provides ten receivers and eight transmitters. Both devices have separate receiver and transmitter-enable controls. The charge pumps turn off and the devices shut down when a logic high is applied to the ENT input. In this state, the supply cur-rent drops to less than 25µA and the receivers continue to operate in a low-power receive mode. Driver outputs enter a high-impedance state (three-state mode). On the MAX225‚ all five receivers are controlled by the ENR input. On the MAX245‚ eight of the receiver out-puts are controlled by the ENR input‚ while the remain-ing two receivers (RA5 and RB5) are always active.RA1–RA4 and RB1–RB4 are put in a three-state mode when ENR is a logic high.Receiver and Transmitter EnableControl InputsThe MAX225 and MAX245–MAX249 feature transmitter and receiver enable controls.The receivers have three modes of operation: full-speed receive (normal active)‚ three-state (disabled)‚ and low-power receive (enabled receivers continue to function at lower data rates). The receiver enable inputs control the full-speed receive and three-state modes. The transmitters have two modes of operation: full-speed transmit (normal active) and three-state (disabled). The transmitter enable inputs also control the shutdown mode. The device enters shutdown mode when all transmitters are disabled. Enabled receivers function in the low-power receive mode when in shutdown.M A X 220–M A X 249Tables 1a–1d define the control states. The MAX244has no control pins and is not included in these tables. The MAX246 has ten receivers and eight drivers with two control pins, each controlling one side of the device. A logic high at the A-side control input (ENA )causes the four A-side receivers and drivers to go into a three-state mode. Similarly, the B-side control input (ENB ) causes the four B-side drivers and receivers to go into a three-state mode. As in the MAX245, one A-side and one B-side receiver (RA5 and RB5) remain active at all times. The entire device is put into shut-down mode when both the A and B sides are disabled (ENA = ENB = +5V).The MAX247 provides nine receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs each control four drivers. The ninth receiver (RB5) is always active.The device enters shutdown mode with a logic high on both ENTA and ENTB .The MAX248 provides eight receivers and eight drivers with four control pins. The ENRA and ENRB receiver enable inputs each control four receiver outputs. The ENTA and ENTB transmitter enable inputs control four drivers each. This part does not have an always-active receiver. The device enters shutdown mode and trans-mitters go into a three-state mode with a logic high on both ENTA and ENTB .The MAX249 provides ten receivers and six drivers with four control pins. The ENRA and ENRB receiver enable inputs each control five receiver outputs. The ENTA and ENTB transmitter enable inputs control three dri-vers each. There is no always-active receiver. The device enters shutdown mode and transmitters go into a three-state mode with a logic high on both ENTA and ENTB . In shutdown mode, active receivers operate in a low-power receive mode at data rates up to 20kb/s.__________Applications InformationFigures 5 through 25 show pin configurations and typi-cal operating circuits. In applications that are sensitive to power-supply noise, V CC should be decoupled to ground with a capacitor of the same value as C1 and C2 connected as close as possible to the device.Drivers/Receivers。

max202ecpe原理
MAX202ECPE 是一种常见的RS-232 接口集成电路，它在电子设备中广泛用于串行数据的传输和通信。

下面将详细介绍MAX202ECPE 的原理。

MAX202ECPE 主要由电荷泵、发送器和接收器三部分组成。

电荷泵部分由两只用来实现电压升及极性转换的电荷泵组成。

当脉冲为正，VCC 给cl 充电；当脉冲为负，cl 两端电压由于电容的作用而保持不变。

发送器部分由一个驱动电路和一个输出晶体管组成。

输入的数据信号通过驱动电路转换为适合传输的电平，并通过输出晶体管发送到RS-232 总线上。

接收器部分由一个输入放大器和一个比较器组成。

从RS-232 总线上接收到的信号经过输入放大器放大后，与参考电压进行比较，产生相应的数字信号输出。

MAX202ECPE 的技术指标包括：VCC 端对地为0.3V 到+6V，v+端对地为VCC-0.3V 到+14V，v-端对地为-14V 到+0.3V；输入电压T.为-0.3V 到v+ +0.3v，R.IN 为±30V；输出电压T.OUT 为v- -0.3V 到
v+ +0.3v，R—OUT 为-0.3V 到VCC+0.3v；波特率为120Kbps；最大瞬时镜像率为30V/μs。

总之，MAX202ECPE 是一种高性能的RS-232 接口集成电路，它通过电荷泵、发送器和接收器等部分实现了数据的传输和通信。

它具有广泛的应用领域，如计算机、通信设备、工业控制等。

在使用
MAX202ECPE 时，需要注意其技术指标和工作原理，以确保其正常工作和稳定性能。

General DescriptionThe MAX200–MAX211/MAX213 transceivers are designed for RS-232 and V.28 communication inter-faces where ±12V supplies are not available. On-board charge pumps convert the +5V input to the ±10V need-ed for RS-232 output levels. The MAX201 and MAX209operate from +5V and +12V, and contain a +12V to -12V charge-pump voltage converter.The MAX200–MAX211/MAX213 drivers and receivers meet all EIA/TIA-232E and CCITT V.28 specifications at a data rate of 20kbps. The drivers maintain the ±5V EIA/TIA-232E output signal levels at data rates in excess of 120kbps when loaded in accordance with the EIA/TIA-232E specification.The 5µW shutdown mode of the MAX200, MAX205,MAX206, and MAX211 conserves energy in battery-powered systems. The MAX213 has an active-low shut-down and an active-high receiver enable control. Two receivers of the MAX213 are active, allowing ring indica-tor (RI) to be monitored easily using only 75µW power.The MAX211 and MAX213 are available in a 28-pin wide small-outline (SO) package and a 28-pin shrink small-outline (SSOP) package, which occupies only 40% of the area of the SO. The MAX207 is now avail-able in a 24-pin SO package and a 24-pin SSOP. The MAX203 and MAX205 use no external components,and are recommended for applications with limited circuit board space.ApplicationsComputersLaptops, Palmtops, Notebooks Battery-Powered Equipment Hand-Held Equipment Next-Generation Device Features ♦For Low-Cost Applications:MAX221E: ±15kV ESD-Protected, +5V, 1µA, Single RS-232 Transceiver with AutoShutdown™♦For Low-Voltage and Space-Constrained Applications:MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E: ±15kV ESD-Protected, Down to 10nA,+3.0V to +5.5V, Up to 1Mbps, True RS-232Transceivers (MAX3246E Available in UCSP™Package)♦For Space-Constrained Applications:MAX3228E/MAX3229E: ±15kV ESD-Protected,+2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable Applications:MAX3380E/MAX3381E: +2.35V TO +5.5V, 1µA,2Tx/2Rx RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic Pins ♦For Low-Power Applications:MAX3224E–MAX3227E/MAX3244E/MAX3245E:±15kV ESD-Protected, 1µA, 1Mbps, +3.0V to+5.5V, RS-232 Transceivers with AutoShutdown Plus™MAX200–MAX211/MAX213+5V , RS-232 Transceivers with 0.1µF External Capacitors ________________________________________________________________Maxim Integrated Products 119-0065; Rev 6; 10/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering Information appears at end of data sheetAutoShutdown, AutoShutdown Plus, and UCSP are trademarks of Maxim Integrated Products, Inc.MAX200–MAX211/MAX213+5V , RS-232 Transceiverswith 0.1µF External Capacitors______________________________________________________________________________________19Ordering Information*Contact factory for dice specifications.M A X 200–M A X 211/M A X 213+5V , RS-232 Transceiverswith 0.1µF External Capacitors Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.20____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。