SML-LX15SIC-RP-TR;中文规格书,Datasheet资料
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技术手册SHT1x (SHT10, SHT11, SHT15)数字温湿度传感器∙ 完全标定 ∙ 数字信号输出 ∙ 低功耗∙ 卓越的长期稳定性∙ SMD 封装 – 适于回流焊接外形尺寸图1 SHT1x 传感器尺寸(1mm=0.039inch),“11”表示该传感器型号为SHT11。
外部接口:1:GND, 2: DATA, 3: SCK, 4: VDD传感器芯片此说明书适用于SHT1x-V4。
SHT1x-V4 是第四代硅传感芯片,除了湿度、温度敏感元件以外,还包括一个放大器,A/D 转换器,OTP 内存和数字接口。
第四代传感器在其顶部印有产品批次号,以字母及数字表示,如“A5Z”,见图1。
材质传感器的核心为CMOS芯片,外围材料顶层采用环氧LCP ,底层为FR4。
传感器符合ROHS 和WEEE 标准,因此不含Pb, Cd, Hg, Cr(6+), PBB, PBDE。
实验包如要进行直接的传感器测量,传感器性能检验或者温湿度实验(数据记录),客户可选用EK-H4,其中包含SHT71(与SHT1x 的芯片相同)传感器,4路传感器通道和与电脑配套的软、硬件。
更多其他传感器实验包信息请登录/humidity产品概述SHT1x (包括 SHT10, SHT11 和 SHT15) 属于Sensirion 温湿度传感器家族中的贴片封装系列。
传感器将传感元件和信号处理电路集成在一块微型电路板上,输出完全标定的数字信号。
传感器采用专利的CMOSens® 技术,确保产品具有极高的可靠性与卓越的长期稳定性。
传感器包括一个 电容性聚合体测湿敏感元件、一个用能隙材料制成的测温元件,并在同一芯片上,与14 位的A/D 转换器以及串行接口电路实现无缝连接。
因此,该产品具有品质卓越、响应迅速、抗干扰能力强、性价比高等优点。
每个传感器芯片都在极为精确的湿度腔室中进行标定,校准系数以程序形式储存在OTP 内存中,用于内部的信号校准。
1345 TapeEmbossed Tin-Plated Copper Foil Data SheetProduct Description3M™ 1345 Tape consists of an embossed 1-ounce deadsoft tin-plated copper foil backing and an aggressive pressure-sensitive acrylic adhesive. The edges of the embossed pattern pressed into the foil cut through the adhesive layer to establish reliable metal-to-metal contact between the backing and the application substrate.• Embossed deadsoft 1-ounce tin-plated copper foil backing• Conductivity “through the adhesive”• Supplied on a removable liner for easy handling and diecuttingLike all 3M shielding tapes, 3M 1345 is available in standard and custom widths and lengths. Standard length is 18 yards.• Widths from 1/4” to 23”• Longer lengths up to several times normal length, dependent upon width. Check with Customer Service.Applications3M 1345 Tape is typically used for applications requiring excellent electrical conductivity from the application substrate through the adhesive to the foil backing. Common uses include grounding and EMI shielding in equipment, components, shielded rooms, etc. The tin plating on the copper foil backing facilitates soldering and improves resistance to oxidation and discoloration. Shielding EffectivenessMany factors determine the true shielding effectiveness of a shielding tape, including type and thickness of foil, adhesive type, intimacy of contact, smoothness of application surface, strength and frequency of the EMI signal, etc. However, using standard tests and fixtures, it is possible to determine a value for the attenuation.For 3M 1345 Tape, typical shielding effectiveness (far field) is in the range of 75dB to 95dB (30 MHz to 1 GHz).Properties Typical ValuesBacking thickness 1 1.4 mil (0,04mm)Total thickness (backing plus adhesive) 4.0 mil (.101mm)Breaking strength 125 lb./in (44 N/10mm)Adhesion to steel 145 oz/in (4.9 N/10mm)Electrical resistance through adhesive 2 0.001ohmFlame retardancy 3 Pass* Footnote: 1. Test method ASTM D 10002. MIL-STD-202 Method 307 maintained at 5 psi (3,4 N/cm2) measured over 1 in2surface area. The edges of the embossing pattern in thefoil backing penetrate through the nonconductive adhesive to make metal-to-metal contact with the application substrate.3. UL-recognized for flame retardancy per UL 510, Product Category 0ANZ2, File E17385./3M is a trademark of 3M. Important NoticeAll statements, technical information and recommendations related to the Seller’s products are based on information believed to be reliable, but the accuracy or completeness thereof is not guaranteed. Before utilizing the product, the user should determine the suitability of the product for its intended use. The user assumes all risks and liability whatsoever in connection with such use.Any statements or recommendations of the Seller which are not contained in the Seller’s current publications shall have no force or effect unless contained in an agreement signed by an authorized officer of the Seller.The statements contained herein are made in lieu of all warranties, expressed or implied, including but not limited to the implied warranties of merchantability and fitness for a particular purpose which warranties are hereby expressly disclaimed.SELLER SHALL NOT BE LIABLE TO THE USER OR ANY OTHER PERSON UNDER ANY LEGAL THEORY, INCLUDING BUT NOT LIMITED TO NEGLIGENCE OR STRICT LIABILITY, FOR ANY INJURY OR FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES SUSTAINED OR INCURRED BY REASON OF THE USE OF ANY OF THESELLER’S PRODUCTS THAT WERE DEFECTIVE.分销商库存信息:3M5-1345-1/2S5-1345-1/25-1345-3/4S5-1345-3/45-1345-1S5-1345-1/2-2R5-1345-15-1345-3/4-2R5-1345-1/2-3R5-1345-1-2R5-1345-1/2-4R5-1345-1.5S5-1345-3/4-3R5-1345-2S5-1345-1-4R5-1345-1.55-1345-1-3R5-1345-3/4-4R5-1345-21/2-6-13453M 1345 0.5"SQ-2503/4-6-13453M 1345 1/2" X 2"-1003M 1345 CIRCLE-0.5"-250 3M 1345 0.75"SQ-2503M 1345 3/4" X 2"-1003M 1345 1/2" X 3"-1001-6-13453M 1345 1" X 2"-1003M 1345 1/2" X 4"-1003M 1345 1.5"SQ-1003M 1345 3/4" X 3"-1003M 1345 CIRCLE-0.75"-2503M 1345 1"SQ-2503M 1345 CIRCLE-1.5"-1003M 1345 1" X 3"-1003M 1345 3/4" X 4"-1003M 1345 CIRCLE-1"-2502-6-13453M 1345 2"SQ-1003M 1345 1" X 4"-1003M 1345 CIRCLE-2"-100 3-6-134511.5X12-6-134523X36-1-13454-6-13456-6-134511.5-6-13451345 X 1"1345 X 6"。
TransistorsRev.A 1/32.5V Drive Nch+Nch MOSFETQS5K2z Structure z Dimensions (Unit : mm) Silicon N-channel MOSFETz Features1) Low On-resistance.3) Space saving, small surface mount package (TSMT5).zSwitchingz Packaging specifications z Inner circuitz Absolute maximum ratings (T a=25°C)∗1∗2∗1ParameterV V DSS Symbol V V GSS A I DA I DP A I SAI SP W / TOTAL P D °C Tch °CTstgLimits Unit Drain-source voltage Gate-source voltage Drain current Total power dissipation Channel temperatureRange of storage temperatureContinuous Pulsed Continuous Pulsed∗1 Pw ≤10µs, Duty cycle ≤1%∗2 Mounted on a ceramic boardSource current (Body diode)30150−55 to +15012±2.0±8.00.83.21.25W / ELEMENT0.9<It is the same ratings for the Tr1 and Tr2>z Thermal resistanceParameter°C/W Rth(ch-a)Symbol Limits Unit Channel to ambient100°C/W139∗ Mounted on a ceramic board∗TransistorsRev.A 2/3z Electrical characteristics (T a=25°C)z Body diode characteristics (Source-drain) (T a=25°C)V SD −−1.2VI S = 3.2A, V GS =0VForward voltage∗ PulsedParameter Symbol Min.Typ.Max.UnitConditions∗<It is the same characteristics for the Tr1 and Tr2>TransistorsRev.A 3/3DRAIN-SOURCE VOLTAGE : V DS (V)101001000C A P A C I T A N C E : C (p F )Fig.1 Typical Capacitancevs. Drain-Source VoltageGATE-SOURCE VOLTAGE : V GS (V)0.0010.010.1110D R A I N C U R RE N T : I D (A )Fig.4 Typical Transfer CharacteristicsSOURCE-DRAIN VOLTAGE : V SD(V)S O U R C E C U R R E N T : I S (A )Fig.6 Source Current vs. Source-Drain VoltageGATE-SOURCE VOLTAGE : V GS (V)100200300S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S TA N C E : R D S (m Ω)Fig.5 Static Drain-SourceOn-State Resistance vs.Gate source Voltagez Electrical characteristics curvesDRAIN CURRENT : I D (A)1101001000S W I T C H I N G T I M E : t (n s )Fig.2 Switching CharacteristicsTOTAL GATE CHARGE : Qg (nC)123456G A T E -S O U R C E V O L T A G E : V G S (V )Fig.3 Dynamic Input CharacteristicsDRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.7 Static Drain-Source On-State Resistance vs. Drain Current ( Ι )DRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.8 Static Drain-Source On-State Resistance vs. Drain Current ( ΙΙ )DRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.9 Static Drain-Source On-State Resistance vs. Drain Current ( ΙΙΙ )AppendixAbout Export Control Order in JapanProducts described herein are the objects of controlled goods in Annex 1 (Item 16) of Export T rade ControlOrder in Japan.In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.Appendix1-Rev1.1分销商库存信息: ROHMQS5K2TR。
Technical Data Sheet0603 Package Chip LED (0.6 mm Height)19-213/GHC-YR1S2/3T Features․Package in 8mm tape on 7〞diameter reel.․Compatible with automatic placement equipment.․Compatible with infrared and vapor phase reflowsolder process.․Mono-color type.․Pb-free.Descriptions․The 19-213 SMD Taping is much smaller thanlead frame type components, thus enable smallerboard size, higher packing density, reducedstorage space and finally smaller equipment to beobtained.․Besides, lightweight makes them ideal forminiature applications. etc.Applications․Automotive: backlighting in dashboard and switch.․Telecommunication: indicator and backlighting intelephone and fax.․Flat backlight for LCD, switch and symbol.․General use.Device Selection GuideChipLens Color Part No.ColorMaterial Emitted19-213/GHC-YR1S2/3T InGaN Brilliant Green Water Clear19-213/GHC-YR1S2/3TNote: The tolerances unless mentioned is ±0.1mm ,Unit = mm19-213/GHC-YR1S2/3T Absolute Maximum Ratings (Ta=25℃)Parameter SymbolRatingUnitReverse Voltage V R 5 VForward Current I F 25 mAOperating Temperature Topr -40 ~ +85 ℃Storage Temperature Tstg -40 ~ +90 ℃Soldering Temperature Tsol260(for 5 second)℃Electrostatic Discharge ESD 150 VPower Dissipation Pd 110 mWPeak Forward Current(Duty 1/10 @1KHz)I FP 100 mAElectro-Optical Characteristics (Ta=25℃)Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 112 ---- 285 mcdViewing Angle2θ1/2 ----- 120 ----- degPeak Wavelengthλp ----- 518 ----- nmDominant Wavelengthλd520 ----- 535 nmSpectrum RadiationBandwidth△λ----- 35 ----- nm Forward Voltage V F----- 3.5 4.0 VI F=20mAReverse Current I R ----- ----- 50 μA V R=5V Notes:1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±1nm3.Tolerance of Forward Voltage ±0.1V19-213/GHC-YR1S2/3T Bin Rang Of Dom. WavelengthMin Max Unit Condition Group BinX 520 525Ynm I F=20mAY 525 530Z 530 535Bin Rang Of Luminous IntensityBin Min Max Unit ConditionR1 112 140R2 140 180mcd I F=20mAS1 180 225S2 225 285Notes:1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±1nm3.Tolerance of Forward Voltage ±0.1V19-213/GHC-YR1S2/3T19-213/GHC-YR1S2/3T Label explanationCAT:LuminousREF:Reel DimensionsNote:19-213/GHC-YR1S2/3T19-213/GHC-YR1S2/3TReliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below. Confidence level :90% LTPD :10%No. Items Test Condition Test Hours/Cycles SampleSizeAc/Re1 Reflow Soldering Temp. : 260℃±5℃Min. 5sec. 6 Min.22 PCS.0/1 2 Temperature Cycle H : +100℃ 15min∫ 5 minL : -40℃ 15min 300 Cycles 22 PCS.0/13 Thermal Shock H : +100℃ 5min∫ 10 secL : -10℃ 5min300 Cycles 22 PCS.0/1 4High TemperatureStorageTemp. : 100℃ 1000 Hrs. 22 PCS.0/1 5Low TemperatureStorage Temp. : -40℃ 1000 Hrs. 22 PCS.0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS.0/1 7High Temperature /High Humidity85℃/ 85%RH1000 Hrs.22 PCS.0/119-213/GHC-YR1S2/3TPrecautions For Use1. Over-current-proofCustomer must apply resistors for protection , otherwise slight voltage shift will cause bigcurrent change ( Burn out will happen ).2. Storage2.1 Do not open moisture proof bag before the products are ready to use.2.2 Before opening the package, the LEDs should be kept at 30℃or less and 90%RH or less.2.3 The LEDs should be used within a year.2.4 After opening the package, the LEDs should be kept at 30℃or less and 70%RH or less.2.5 The LEDs should be used within 168 hours (7 days) after opening the package.2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded thestorage time, baking treatment should be performed using the following conditions.Baking treatment : 60±5℃for 24 hours.3. Soldering Condition3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times.3.3 When soldering, do not put stress on the LEDs during heating.3.4 After soldering, do not warp the circuit board.19-213/GHC-YR1S2/3T4.Soldering IronEach terminal is to go to the tip of soldering iron temperature less than 280℃for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.5.RepairingRepair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether分销商库存信息: EVERLIGHT19-213/GHC-YR1S2/3T。
Technical Data Sheet5.0mm Round Type LED Lamps7344-15SUGC/S400-X6█ Features :●Choice of various viewing angles ●Available on tape and reel.●Reliable and robust ●Pb free█ Descriptions :●The series is specially designed forapplications requiring higher brightness●The led lamps are available with different colors, intensities.█ Applications :●TV set ●Monitor ●Telephone ●Computer7344-15SUGC/S400-X6InGaNSuper GreenWater ClearEVERLIGHT ELECTRONICS CO.,LTD. http : // Rev.:1Page: 1 of 6Device Number :CDLE-734-115Prepared date:2005/4/18Prepared by:Hong Fa ChenBG0503087,R0501651Lens ColorPART NO.MaterialEmitted ColorNote: *1:Soldering tine ≦5 secondsEVERLIGHT ELECTRONICS CO.,LTD.http : // Rev.:1Page: 2 of 6Device Number :CDLE-734-115Prepared date:Prepared by:Hong Fa Chen2005/4/18Technical Data Sheet5.0mm Round Type LED Lamps7344-15SUGC/S400-X6Electro-Optical Characteristics (Ta=25℃)Symbol Min.Typ.Max.Unit VF I F =20mA / 3.4 4.0V IR V R =5V //50μA Iv I F =20mA 8000011000/mcd 2θ1/2I F =20mA /20/deg λp I F =20mA /525/nm λd I F =20mA /530/nm △λI F =20mA/35/nmEVERLIGHT ELECTRONICS CO.,LTD.http : // Rev.:1Page: 3 of 6Device Number :CDLE-734-115Prepared date:Prepared by:Hong Fa ChenPeak Wavelength 2005/4/18Dominant Wavelength Spectrum RadiationBandwidthLuminous Intensity Viewing Angle Parameter Condition Forward Voltage Reverse CurrentTechnical Data Sheet5.0mm Round Type LED Lamps7344-15SUGC/S400-X6█ Reliability test items and conditions:The reliability of products shall be satisfied with items listed below. Confidence level:97% LTPD:3%NOItemTest ConditionsSample Size FailureJudgment Criteria1Solder Heat TEMP : 260℃ ± 5 ℃76 PCSH : +100℃ 15min2Temperature Cycle∫ 5 min 76 PCS L : -40℃ 15min H : +100℃ 5min3Thermal Shock ∫ 10 sec 76 PCSL : -10℃ 5min4High TemperatureStorage TEMP : 100℃76 PCS5Low TemperatureStorage TEMP : -40℃76 PCSTEMP : 25℃I F = 20mA 7High Temperature /High Humidity85℃ / 85% RH76 PCSNote :Ivt:To test Iv value of the chip before the reliablility testIv:The test value of the chip that has completed the reliablility test U:Upper Specification Limit L: Lower Specification LimitEVERLIGHT ELECTRONICS CO.,LTD. http : // Rev.: 1Page: 5 of 6Device Number :CDLE-734-115Prepared by:Hong Fa ChenPrepared date:2005/4/18Test Hours/Cycle 10 SEC0/176 PCS 300 CYCLES 300 CYCLES 1000 HRS 0/10/10/1Iv≦Ivt*0.5or Vf≧U or Vf≦L Ac/Re 0/10/10/11000 HRS1000 HRS 1000 HRS6DC Operating LifeTechnical Data Sheet5.0mm Round Type LED Lamps7344-15SUGC/S400-X6EVERLIGHT ELECTRONICS CO.,LTD. http : //'Re1Page: 6 of 6 Device Number :CDLE-734-115 Prepared date:2005/4/18Prepared by:Hong Fa Chen分销商库存信息: EVERLIGHT7344-15SUGC/S400-X6。
Data Sheet No. PD60338IRMCK311 Dual Channel Sensorless Motor Control IC forAppliancesFeaturesMCE TM (Motion Control Engine) - Hardware based computation engine for high efficiency sinusoidal sensorless control of permanent magnet AC motor Integrated Power Factor Correction controlSupports both interior and surface permanent magnet motorsBuilt-in hardware peripheral for single shunt current feedback reconstructionNo external current or voltage sensing operational amplifier requiredDual channel three/two-phase Space Vector PWM Three-channel analog output (PWM)Embedded 8-bit high speed microcontroller (8051) for flexible I/O and man-machine controlJTAG programming port for emulation/debugger Two serial communication interface (UART)I2C/SPI serial interfaceWatchdog timer with independent analog clockThree general purpose timers/countersTwo special timers: periodic timer, capture timer Internal ‘One-Time Programmable’ (OTP) memory and internal RAM for final production usagePin compatible with IRMCF311 RAM version1.8V/3.3V CMOS Product SummaryMaximum crystal frequency 60 MHz Maximum internal clock (SYSCLK) frequency 128 MHz Maximum 8051 clock frequency 33 MHz Sensorless control computation time 11 μsec typ MCE TM computation data range 16 bit signed 8051 OTP Program memory 56K bytes MCE program and Data RAM 8K bytes GateKill latency (digital filtered) 2 μsec PWM carrier frequency counter 16 bits/ SYSCLK A/D input channels 6 A/D converter resolution 12 bits A/D converter conversion speed 2 μsec 8051 instruction execution speed 2 SYSCLK Analog output (PWM) resolution 8 bits UART baud rate (typ) 57.6K bps Number of I/O (max) 14 Package (lead-free) QFP64 Operating temperature -40°C ~ 85°CDescriptionIRMCK311 is a high performance OTP based motion control IC designed primarily for appliance applications. IRMCK311 is designed to achieve low cost and high performance control solutions for advanced inverterized appliance motor control. IRMCK311 contains two computation engines. One is Motion Control Engine (MCE TM) for sensorless control of permanent magnet motors; the other is an 8-bit high-speed microcontroller (8051). Both computation engines are integrated into one monolithic chip. The MCE TM contains a collection of control elements such as Proportional plus Integral, Vector rotator, Angle estimator, Multiply/Divide, Low loss SVPWM, Single Shunt IFB. The user can program a motion control algorithm by connecting these control elements using a graphic compiler. Key components of the sensorless control algorithms, such as the Angle Estimator, are provided as complete pre-defined control blocks implemented in hardware. A unique analog/digital circuit and algorithm to fully support single shunt current reconstruction is also provided. The 8051 microcontroller performs 2-cycle instruction execution (16MIPS at 33MHz). The MCE and 8051 microcontroller are connected via dual port RAM to process signal monitoring and command input. An advanced graphic compiler for the MCE TM is seamlessly integrated into the MATLAB/Simulink environment, while third party JTAG based emulator tools are supported for 8051 developments. IRMCK311 comes with a small QFP64 pin lead-free package.TABLE OF CONTENTS1 Overview (5)2 IRMCK311 Block Diagram and Main Functions (6)3 Pinout (8)4 Input/Output of IRMCK311 (9)4.1 8051 Peripheral Interface Group (10)4.2 Motion Peripheral Interface Group (10)4.3 Analog Interface Group (11)4.4 Power Interface Group (11)4.5 Test Interface (12)5 Application Connections (13)6 DC Characteristics (14)6.1 Absolute Maximum Ratings (14)6.2 System Clock Frequency and Power Consumption (14)6.3 Digital I/O DC Characteristics (15)6.4 PLL and Oscillator DC Characteristics (15)6.5 Analog I/O DC Characteristics (16)6.6 Under Voltage Lockout DC Characteristics (17)6.7 AREF Characteristics (17)7 AC Characteristics (18)7.1 PLL AC Characteristics (18)7.2 Analog to Digital Converter AC Characteristics (19)7.3 Op Amp AC Characteristics (19)7.4 SYNC to SVPWM and A/D Conversion AC Timing (20)7.5 GATEKILL to SVPWM AC Timing (21)7.6 Interrupt AC Timing (21)7.7 I2C AC Timing (22)7.8 SPI AC Timing (23)7.8.1 SPI Write AC timing (23)7.8.2 SPI Read AC Timing (24)7.9 UART AC Timing (25)7.10 CAPTURE Input AC Timing (26)7.11 JTAG AC Timing (27)7.12 OTP Programming Timing (28)8 I/O Structure (29)9 Pin List (32)Dimensions (35)10 Package11 Part Marking Information (36)Information (36)12 OrderingTABLE OF FIGURESFigure 1. Typical Application Block Diagram Using IRMCK311 (5)Figure 2. IRMCK311 Internal Block Diagram (6)Figure 3. IRMCK311 Pin Configuration (8)Figure 4. Input/Output of IRMCK311 (9)Figure 5. Application Connection of IRMCK311 (13)Figure 6. Clock Frequency vs. Power Consumption (14)Figure 7 Crystal oscillator circuit (18)Figure 8 Voltage droop of sample and hold (19)Figure 9 SYNC to SVPWM and A/D conversion AC Timing (20)Figure 10 GATEKILL to SVPWM AC Timing (21)Figure 11 Interrupt AC Timing (21)Figure 12 I2C AC Timing (22)Figure 13 SPI AC Timing (23)Figure 14 SPI Read AC Timing (24)Figure 15 UART AC Timing (25)Figure 16 CAPTURE Input AC Timing (26)Figure 17 JTAG AC Timing (27)Figure 18 OTP Programming Timing (28)Figure 19 All digital I/O except motor PWM output (29)Figure 20 RESET, GATEKILL I/O (29)Figure 21 Analog input (30)Figure 22 Analog operational amplifier output and AREF I/O structure (30)Figure 23 VPP programming pin I/O structure (30)Figure 24 VSS and AVSS pin structure (31)Figure 25 VDD1 and VDDCAP pin structure (31)Figure 26 XTAL0/XTAL1 pins structure (31)TABLE OF TABLESTable 1. Absolute Maximum Ratings (14)Table 2. System Clock Frequency (14)Table 3. Digital I/O DC Characteristics (15)Table 4. PLL DC Characteristics (15)Table 5. Analog I/O DC Characteristics (16)Table 6. UVcc DC Characteristics (17)Table 7. AREF DC Characteristics (17)Table 8. PLL AC Characteristics (18)Table 9. A/D Converter AC Characteristics (19)Table 10. Current Sensing OP Amp AC Characteristics (19)Table 11. SYNC AC Characteristics (20)Table 12. GATEKILL to SVPWM AC Timing (21)Table 13. Interrupt AC Timing (21)Table 14. I2C AC Timing (22)Table 15. SPI Write AC Timing (23)Table 16. SPI Read AC Timing (24)Table 17. UART AC Timing (25)Table 18. CAPTURE AC Timing (26)Table 19. JTAG AC Timing (27)Table 20. OTP Programming Timing (28)Table 21. Pin List (32)1 OverviewIRMCK311 is a new International Rectifier integrated circuit device primarily designed as a one-chip solution for complete inverter controlled appliance dual motor control applications. Unlike a traditional microcontroller or DSP, the IRMCK311 provides a built-in closed loop sensorless control algorithm using the unique Motion Control Engine (MCE TM) for permanent magnet motors. The MCE TM consists of a collection of control elements, motion peripherals, a dedicated motion control sequencer and dual port RAM to map internal signal nodes. IRMCK311 also employs a unique single shunt current reconstruction circuit to eliminate additional analog/digital circuitry and enables a direct shunt resistor interface to the IC. The sensorless control is the same for both motors with a single shunt current sensing capability. Motion control programming is achieved using a dedicated graphical compiler integrated into the MATLAB/Simulink TM development environment. Sequencing, user interface, host communication, and upper layer control tasks can be implemented in the 8051 high-speed 8-bit microcontroller. The 8051 microcontroller is equipped with a JTAG port to facilitate emulation and debugging tools. Figure 1 shows a typical application schematic using IRMCK311.IRMCK311 is intended for volume production purpose and contains 64K bytes of OTP (One Time Programming) ROM, which can be programmed through a JTAG port. For a development purpose use, IRMCF311 contains a 48k byte of RAM in place of program OTP to facilitate an application development work. Both IRMCF311 and IRMCK311 come in the same 64-pin QFP package with identical pin configuration to facilitate PC board layout and transition to mass productionFigure 1. Typical Application Block Diagram Using IRMCK3112 IRMCK311 Block Diagram and Main FunctionsM o t i o n C o n t r o l B u sFigure 2. IRMCK311 Internal Block DiagramIRMCK311 contains the following functions for sensorless AC motor control applications:• Motion Control Engine (MCE TM )o Proportional plus Integral block o Low pass filtero Differentiator and lag (high pass filter) o Ramp o Limito Angle estimate (sensorless control) o Inverse Clark transformation o Vector rotator o Bit latch o Peak detect o Transitiono Multiply-divide (signed and unsigned)o Divide (signed and unsigned)o Addero Subtractoro Comparatoro Countero Accumulatoro Switcho Shifto ATAN (arc tangent)o Function block (any curve fitting, nonlinear function)o16-bit wide Logic operations (AND, OR, XOR, NOT, NEGATE)o MCE TM program and data memory (6K byte). Note 1o MCE TM control sequencer• 8051 microcontrollero Three 16-bit timer/counterso16-bit periodic timero16-bit analog watchdog timero16-bit capture timero Up to 36 discrete I/Oso Eleven-channel 12-bit A/DFive buffered channels (0 – 1.2V input)One unbuffered channel (0 – 1.2V input)o JTAG port (4 pins)o Up to three channels of analog output (8-bit PWM)o Two UARTo I2C/SPI porto 64K byte Note 1program One-Time Programmable memoryo2K byte data RAM. Note 2Note 1: Total size of OTP memory is 64K byte, however MCE program occupiesmaximum 8K byte which will be loaded into internal RAM at a powerup/bootprocess. Therefore only 56K byte OTP memory area is usable for 8051microcontroller.Note 2: Total size of RAM is 8K byte including MCE program, MCE data, and 8051data. Different sizes can be allocated depending on applications.3 PinoutXTAL0XTAL1P1.1/RXD P1.2/TXDVDD1VSS VDD2P1.3/SYNC/SCKP1.4/CAPP 3.6/R X D 1P 3.7/T X D 1FPWMVL FPWMUL V S SV D D 2A V D DA V S SA I N 0A R E FP 2.7/A O P W M 1P 2.6/A O P W M 0CPWMUH CPWMVH CPWMWH CPWMUL CPWMVL CPWMWL CGATEKILL VDD1VSS I F B C OI F B C +I F B C -P L L V S SP L L V D DR E S E TN CT C KP 5.3/T D IP 5.2/T D OP 5.1/T M SS D A /C S 0S C L /S O -S I /V P PP 5.0/P F C G K I L LP F C P W M V S SFGATEKILL FPWMWL VAC-VAC+VACO IPFCO IPFC+IPFC-I F B F OI F B F +I F B F -P3.0/INT2/CS1C M E X TFPWMVH FPWMUHFPWMWH A I N 1P 3.2/I N T 0Figure 3. IRMCK311 Pin Configuration4 Input/Output of IRMCK311All I/O signals of IRMCK311 are shown in Figure 4. All I/O pins are 3.3V logic interface except A/D interface pins.Figure 4. Input/Output of IRMCK3114.1 8051 Peripheral Interface GroupUART InterfaceP1.1/RXD Input, Receive data to IRMCK311, can be configured as P1.1P1.2/TXD Output, Transmit data from IRMCK311, can be configured as P1.22nd channel Receive data to IRMCK311, can be configured as P3.6 P3.6/RXD1 Input,P3.7/TXD1 Output,2nd channel Transmit data from IRMCK311, can be configured as P3.7Discrete I/O InterfaceP1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock P1.4/CAP Input/output port 1.4, can be configured as Capture Timer inputP3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P3.2/INT0 Input/output port 3.2, can be configured as external interrupt 0Analog Output InterfaceP2.6/AOPWM0 Input/output, can be configured as 8-bit PWM output 0 withprogrammable carrier frequencyP2.7/AOPWM1 Input/output, can be configured as 8-bit PWM output 1 withprogrammable carrier frequencyCrystal InterfaceXTAL0 Input, connected to crystalXTAL1 Output, connected to crystalReset InterfaceRESET Inout, system reset, needs to be pulled up to VDD1 but doesn’t requireexternal RC time constantI2C/SPI InterfaceSCL/SO-SI/VPP Output, I2C clock output, SPI SO-SII2C Data line, Chip Select 0 of SPISDA/CS0 Input/output,P3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock 4.2 Motion Peripheral Interface GroupPWMCPWMUH Output, motor 1 PWM phase U high side gate signalCPWMUL Output, motor 1 PWM phase U low side gate signalCPWMVH Output, motor 1 PWM phase V high side gate signalCPWMVL Output, motor 1 PWM phase V low side gate signalCPWMWH Output, motor 1 PWM phase W high side gate signalCPWMWL Output, motor 1 PWM phase W low side gate signalFPWMUH Output, motor 2 PWM phase U high side gate signalFPWMUL Output, motor 2 PWM phase U low side gate signal分销商库存信息: IRIRMCK311TR。
July 2011Doc ID 4926 Rev 61/8STPS40L15CLow drop OR-ing power Schottky diodeFeatures■Very low forward voltage drop for less power dissipation and reduced heatsink size ■Reverse voltage suited to OR-ing of 3 V , 5 V and 12 V rails■Avalanche capability specifiedDescriptionDual center tap schottky rectifier packaged in TO-220AB and TO-247, this device is especially intended for use as OR-ing diode in fault tolerant power supply equipments.Table 1.Device summarySymbolValue I F(AV) 2x20 A V RRM 15 VT j (max) 125 °CV F (max)0.33 VCharacteristics STPS40L15C2/8Doc ID 4926 Rev 61 CharacteristicsTo evaluate the conduction losses use the following equation :P = 0.18 x I F(AV) + 0.008 I F 2(RMS)Table 2.Absolute ratings (limiting values, per diode)Symbol Parameter Value Unit V RRMRepetitive peak reverse voltage15 V I F(RMS) Forward current rms 30AI F(AV) Average forward current T case = 140 °C δ = 1 Total 40APer diode 20 I FSM Surge non repetitive forwardcurrentt p = 10 m, Sinusoidal 310 A I RRM Peak repetitive reverse currentt p = 2 µs, F= 1 kHz 2 A I RSM Non repetitive peak reverse current t p = 100 µs 3 A P ARM Repetitive peak avalanche power t p = 1µs, T j = 25 °C13140 W T stg Storage temperature range-65 to + 150°C T j Maximum operating junction temperature (1)1. condition to avoid thermal runaway for a diode on its own heatsink 125 °C dV/dtCritical rate of rise of reverse voltage10000V/µsTable 3.Thermal resistancesSymbol Parameter Value Unit R th(j-c) Junction to case Per diode1.6°C/WTotal 0.85R th (c)Coupling 0.1 °C/WTable 4.Static electrical characteristics (Per diode)Symbol Parameter Tests conditions Min. Typ. Max. UnitI R (1)1.Pulse test : t p = 380 µs, δ < 2%Reverse leakage currentT j = 25 °C V R = V RRM 6mAT j = 100 °C 200500 V F (1) Forwardvoltage drop T j = 25 °CI F = 19 A 0.41 V T j = 25 °CI F = 40 A 0.52 T j = 125 °CI F = 19 A 0.280.33T j = 125 °CI F = 40 A0.42 0.50dPtotdTj ---------------1Rth j a –()-------------------------<STPS40L15CCharacteristicsDoc ID 4926 Rev 63/8Figure 1.Average forward power dissipation versus average forward currentFigure 2.Average forward current versus ambient temperatureFigure 3.Normalized avalanche power derating versus pulse durationFigure 4.Normalized avalanche power derating versus junctionFigure 5.Non repetitive surge peak forward current versus overload duration Figure 6.Relative variation of thermalimpedance junction to case versusCharacteristicsSTPS40L15C4/8Doc ID 4926 Rev 6Figure 7.Reverse leakage current versus reverse voltage applied (typicalFigure 8.Junction capacitance versus reverse voltage applied (typical Figure 9.Forward voltage drop versus forward current (typical values perFigure 10.Forward voltage drop versus forward current (typical maximumSTPS40L15C Package informationDoc ID 4926 Rev 65/82 Package information●Epoxy meets UL94,V0●Cooling method: by conduction (C)●Recommended torque values for: TO-220AB 0.4 to 0.6 N·m ●Recommended torque values for: TO-247 0.9 to 1.2 N·mIn order to meet environmental requirements, ST offers these devices in different grades ofECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: . ECOPACK ® is an ST trademark.Package information STPS40L15C6/8Doc ID 4926 Rev 6STPS40L15C Ordering informationDoc ID 4926 Rev 67/83 Ordering information4 Revision historyTable 7.Ordering informationOrder codeMarkingPackage Weight Base qtyDelivery modeSTPS40L15CW STPS40L15CWTO-2474.4 g 30 Tube STPS40L15CT STPS40L15CT TO-220AB2.2 g50TubeTable 8.Document revision historyDate Revision ChangesJuly-20035A Previous edition.18-Jul-20116Added cathode indicator K to illustration for TO-220AB.STPS40L15CPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2011 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America8/8Doc ID 4926 Rev 6分销商库存信息:STMSTPS40L15CW STPS40L15CT。
Schmitt TriggerH11Lx SeriesFeatures:• High data rate, 1MHz typical (NRZ)• Free from latch up and oscilliation throughout voltage and temperature ranges.• Microprocessor compatible drive• Logic compatible output sinks 16mA at 0.4V maximum • Guaranteed on/off threshold hysteresis• Wide supply voltage capability, compatible with all popular logic systems• High isolation voltage between input and output (Viso=5000 V rms ) • Compact dual-in-line package • Pb free and RoHS compliant. • UL approved (No. E214129) • VDE approval (No.132249 ) • SEMKO approved • NEMKO approved • DEMKO approved• FIMKO approved• CSA approved (No. 2007798)SchematicDescriptionThe H11LX series of devices each consist of a GaAs infrared emitting diode optically coupled a high speed integrated circuit detector. The output detector incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse shaping. The devices are in a 6-pin DIP package and available in wide-lead spacing and SMD option.Applications1. Anode2. Cathode3. No Connection4. V O5. GND6. V CCz Logic to logic isolatorz Programmable current level sensorz Line receiver - eliminate noise and transient problems z AC to TTL conversion - square wave shaping z Digital programming of power supplies z Interfaces computers with peripheralsTruth TableInput Output H L L HSchmitt Trigger H11Lx SeriesAbsolute Maximum Ratings (T a =25°C)Parameter Symbol Rating Unit Forward currentI F 60 mA Reverse voltage V R 6 V InputPower dissipation P D 120 mW V 45 Allowed RangeV o 0 to 16 V V 65 Allowed Range V CC3 to 16VOutput Current I 0 50 mA Outputpower dissipationP D 150 mW Total power dissipation P tot 250 mW Isolation voltage *1 V iso 5000 V rms Operating temperature T opr -55~+100 °C Storage temperature T stg -55~+150 °C Soldering temperature *2 T sol260 °CNotes*1 AC for 1 minute, R.H.= 40 ~ 60% R.H. In this test, pins 1, 2 & 3 are shorted together, and pins 4, 5 & 6 are shorted together. *2 For 10 seconds.Schmitt Trigger H11Lx SeriesElectrical Characteristics (T a =25°C unless specified otherwise)InputParameter Symbol Min. Typ.* Max. Unit ConditionForward voltageV F - 1.15 1.5 V I F = 10mA Reverse Leakage current I R - - 10 µA V R = 5VCapacitanceC J- - 100 pF V=0, f=1MHzOutputParameter Symbol Min. Typ.* Max. Unit ConditionOperation Voltage Range V CC 3 - 15 V Supply Current I CC(off) - 1.6 5 mA I F =0mA, Vcc=5V Output Current, High I OH- - 100 µA I F =0mA, Vcc=Vo=15VIsolation ResistanceR ISO 1011- -Ω V I-O =500VDCTransfer CharacteristicsParameter Symbol Min. Typ.* Max. Unit ConditionSupply Current I CC(on) - 1.6 5 mA I F =10mA, Vcc=5V Output Voltage .lowV OL- - 0.4 VVcc=5V, I F =I Fon (max.), R L =270ΩH11L1 - -1.6 H11L2 - - 10Turn on ThresholdCurrent 1H11L3I Fon- - 5 mA Vcc=5V, R L =270Ω Turn off Threshold Current I Foff - 1 - mA Vcc=5V, R L =270Ω Hysteresis Ratio I Fon /I Foff 0.5 - 0.9 Vcc=5V, R L =270ΩTurn on Time t on - - 4 μS Fall Time t r - 0.1 - μS Turn off Time t off - - 4 μS Rise Time t r - 0.1 - μS Vcc=5V, I F =I Fon , R L =270ΩData Rate- 1 - MHz* Typical values at T a = 25°C 1. Max. I F(ON) is the maximum current required to trigger the output. For examples, a 1.6mA maximum trigger current would require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA.Schmitt TriggerH11Lx SeriesTypical Performance CurvesSchmitt TriggerH11Lx SeriesOrder InformationPart NumberH11LXY(Z)-VNoteX = Part No. for 1, 2 or 3Y = Lead form option (S, S1, M or none)Z = Tape and reel option (TA, TB or none).V = VDE (optional)quantity Option Description PackingNone Standard DIP-6 65 units per tubeM Wide lead bend (0.4 inch spacing) 65 units per tubeS + TA Surface mount lead form + TA tape & reel option 1000 units per reelS + TB Surface mount lead form + TB tape & reel option 1000 units per reelS1 + TA Surface mount lead form (low profile) + TA tape & reel option 1000 units per reelS1 + TB Surface mount lead form (low profile) + TB tape & reel option 1000 units per reelSchmitt Trigger H11Lx SeriesPackage Drawings(Dimensions in mm)Standard DIP TypeOption M TypeSchmitt Trigger H11Lx Seriesption S1 TypeOSchmitt Trigger H11Lx Series Recommended pad layout for surface mount leadformevice Markingotesdenotes EverlightberDELH11L3YW WVNLEH11L3 denotes Device NumY denotes 1 digit Year codeWW denotes 2 digit Week codeV denotes VDE (optional)Schmitt Trigger H11Lx SeriesTape & Reel Packing Specificationsape dimensionsE FTDimension No. A B Do D1 Dimension (mm)10.4±0.1 7.52±0.1 1.5±0.1 1.5+0.1/-0 1.75±0.1 7.5±0.1Dimension No. Po P1 P2 tW KDimension (mm)4.0±0.15 1.6±0.1 2.0±0.1 0.35±0.03 16.0±0.2 4.5±0.1Schmitt Trigger H11Lx Series Solder Reflow Temperature ProfileTIME (S)6 PIN DIP PHOTO COUPLERSchmitt Trigger Everlight Electronics Co., Ltd. 11 Document No :DPC-0000022 Rev. 1 January 7, 2009H11Lx Series DISCLAIMERThe specifications in this datasheet may be changed without notice. EVERLIGHT reserves the authority . When using this product, please observe the absolute maximum ratings and the instructions for use as the 3. hese specification sheets include materials protected under copyright of EVERLIGHT. Reproduction in1.on material change for above specification.2outlined in this datasheet. EVERLIGHT assumes no responsibility for any damage resulting from use of product which does not comply with the absolute maximum ratings and the instructions included in this datasheet.T any form is prohibited without the specific consent of EVERLIGHT.芯天下--/。
60 Watt 2” x 2”Single Output●60 Watts Regulated Output Power ●2:1 Wide Input Voltage Range●1.6kVDC Isolation (Basic Insulation)●Overload and Over T emperature Protection ●Six-Sided Shield ●No Derating to 40°C●Standard 2” x2” Package and Pinning ●Efficiency to 90%●Available as Power Module (RPM60-G)FeaturesRegulated ConvertersSelection Guide 24V and 48V Wide Input TypesDerating Graph (Ambient Temperature)Part NumberInput Output Output Input (5,4)Efficiency (5)Capacitive (6)Range Voltage Current Current Load max.VDC VDC mA mA %RP60-243.3SG 18-36 3.314000100/22648936000µF RP60-2405SG 18-36512000130/29419020400µF RP60-2412SG 18-36125000150/2907903550µF RP60-2415SG 18-36154000150/2907902300µF RP60-483.3SG 36-75 3.31400080/11328936000µF RP60-4805SG 36-7551200090/14539020400µF RP60-4812SG 36-75125000100/1453903550µF RP60-4815SG36-75154000100/1453902300µF125755025100Ambient Temperature Range (°C)-40-1004060708090100O u t p u t P o w e r (%)Natural Convection -251101=75Vin, 2=36Vin3012RP60-4805SG* no suffix for CTRL function with Positive Logic (1=ON, 0=OFF), this is standard * add /N for CTRL function with Negative Logic (0=ON, 1=OFF)* add suffix -HC for premounted heatsink and clipsOrdering ExamplesRP60-2405SG = 24V Input, 5V Output, Positive Logic CTRL pin.RP20-4812SG/N-HC = 48V Input, 12V Output, Negative Logic CTRL pin, Heatsink fittedDescriptionThe RP60-G series DC/DC converters deliver 60W of power in an industry standartd 2” x 2” package, which also meets military standards for thermal shock and vibration tolerance.Sense pins allow the ouput voltage at the point of load to be tightly regulated and automatically compensate for any voltage drops that may occur across any connections.Derating graphs are valid only for the shown part numbers.If you need detailed derating information about a part number not shown here please contact our technical customer service at info@recom-development.atPlease Read Application NotesUL-60950-1 Certified E196683REV:1/2010P-97 RP60-GPOWERLINEDC/DC-Converterwith 3 year WarrantyRoHS2002/95/EC6/6/Derating Graph (Ambient Temperature)125755025100Ambient Temperature Range (°C)-40-1005060708090100O u t p u t P o w e r (%)Natural Convection-251101=Natural Convection, 2=200LFM, 3=300LFM,4=400LFM, 5=500LFM4012345RP60-4805SGPOWERLINEDC/DC-ConverterRP60-SG SeriesSpecifications (typical at nominal input and 25°C unless otherwise noted)Input Voltage Range 24V nominal input 18-36VDC 48V nominal input 36-75VDCUndervoltage Protection 24V Input DC-DC ON = 17VDC, DC-DC OFF = 15VDC 48V InputDC-DC ON = 34VDC, DC-DC OFF = 32VDCInput FilterPi Type Input Voltage Variation dv/dt (Complies with ETS300 132 part 4.4)5V/ms maxInput Surge Voltage (100 ms max.)24V Input 50VDC 48V Input 100VDC Input Reflected Ripple (nominal Vin and full load)(see Note 3)20mAp-p Start Up Time (nominal Vin and constant resistor load)20ms max.Remote ON/OFF (see Note 7)Positive logic - Standard DC-DC ON Open or 3V < Vr < 12V DC-DC OFF Short or 0V < Vr < 1.2V Negative logic - /N OptionDC-DC ON Short or 0V < Vr < 1.2V DC-DC OFF Open or 3V < Vr < 12VRemote Pin Drive Current Nominal Vin -0.5 -1.0mARemote OFF input current Nominal Vin4mAOutput Power60W max.Output Voltage Accuracy (full Load and nominal Vin)±1%continued on next pageR P 60-GREV: 1/P-98/Specifications, cont. (typical at nominal input and 25°C unless otherwise noted)POWERLINEDC/DC-ConverterRP60-SG SeriesVoltage Adjustability (see Note 1)±10%Line RegulationLL to HL at Full Load ±0.2%Load Regulation (see Note 3)0% to 100% Load ±0.5%Temperature Coefficient±0.02%/°C max.Ripple and Noise (20MHz bandwith) 3.3,5V 75mVp-p 12,15V100mVp-pTransient Response (25% load step change)250µs Over Voltage Protection3.3 Vout 3.7-5.4V Zener diode clamp (only single)5 Vout 5.6-7.0V 12 Vout 13.7-17.5V15 Vout16.8-20.5V Over Load Protection (% of full load at nominal Vin)150% max.Undervoltage Lockout See Application Notes Short Circuit Protection Hiccup, automatic recovery Efficiencysee …Selection Guide“ tableIsolation Voltage (rated for one minute)1600VDC Isolation Resistance 1 G Ωmin.Isolation Capacitance 1500pF max.Operating Frequency300kHz typ.Designed to meet Safety Standards IEC60950-1, UL60950-1, EN60950-1Operating Temperature Range -40°C to +40°C(without derating)+40°C to +100°C(with derating)Maximum Case Temperature 110°CStorage Temperature Range -55°C to +125°COver Temperature Protection 120°C typ.Thermal Impedance (see Note 11)Without Heat-Sink 10.5°C/Watt With Heat-Sink8.4°C/Watt Thermal Shock MIL-STD-810DVibration 10-55Hz, 10G, 30 Min. along X, Y and ZRelative Humidity 5% to 95% RH Case Material Nickel plated copperBase Material Non-conductive black plastic FR4Potting MaterialEpoxy (UL94-V0)Conducted Emissions (see Notes 9, 10)EN55022Class A Radiated Emissions EN55022Class A ESDEN61000-4-2Perf. Criteria B Radiated Immunity EN61000-4-3Perf. Criteria A Fast Transient EN61000-4-4Perf. Criteria B SurgeEN61000-4-5Perf. Criteria B Conducted Immunity EN61000-4-6Perf. Criteria AWeight 60gPacking Quantity Refer to App Notes for tube dimensions 4 pcs per Tube Dimensions 50.8 x 50.8 x 10.2mmMTBF (see Note 2)Bellcore TR-NWT-003321093 x 103hours MIL-STD-217F1096 x 103hoursREV:1/2010P-99 RP60-G/Notes :POWERLINEDC/DC-ConverterRP60-SG Series1.Maximum output deviation is 10% inclusive of remote sense and trim. If remote sense is not being used, the +sense should be connected to its corresponding +OUTPUT and likewise the -sense should be connected to its corresponding –OUTPUT.2.BELLCORE TR-NWT-000332. Case l: 50% Stress, Temperature at 40°C (Ground fixed and controlled environment).3.No minimum loading on the output is required to maintain specified regulation. Operation under no-load condition will not damage these devices4. Maximum value at nominal input voltage and no load.5. Typical value at nominal input voltage and full load.6.Test by minimum Vin and constant resistive load.7.The ON/OFF control pin voltage is referenced to the negative input (-Vin).To order negative logic ON/OFF control add the suffix-N (Example: RP60-4805SG-N).8.Heat sink is optional and P/N: 7G-0026-C. Powerline DC/DC Converters can be ordered with pre-mounted heatsinks including antivibration fixing clips (add suffix -HC). See Application Notes for heatsink details.9.The RP60-SG series meets EN55022 Class A with an external capacitor across the input pins (24Vin:6.8µF/50V MLCC, 48Vin:2x2,2µF/100V MLCC)1o.See application notes for Class B common mode filter suggestion.11.Vertical orientation and natural convection.Package Style and Pinning (mm)3rd angle projectionPin Pitch Tolerance ±0.35 mmPin Connections Pin #Single 1+Vin 2-Vin 3CTRL 4-SENSE (Note 1)5+SENSE(Note 1)6+Vout 7-Vout 8TRIMTrim UpR UTrim DownR D7886Output can be externally trimmed by using the method shown below.See Application Notes for more details.R P 60-GREV: 1/P-100/分销商库存信息:RECOM-POWERRP60-2405SG RP60-2412SG RP60-2415SGRP60-243.3SG RP60-4805SG RP60-4812SGRP60-4815SG RP60-483.3SG RP60-2405SG/N RP60-2412SG/N RP60-2415SG/N RP60-243.3SG/N RP60-4805SG/N RP60-4812SG/N RP60-4815SG/N RP60-483.3SG/N RP60-2405SG-HC RP60-2412SG-HC RP60-2415SG-HC RP60-243.3SG-HC RP60-4805SG-HC RP60-4812SG-HC RP60-4815SG-HC RP60-483.3SG-HC RP60-2405SG/N-HC RP60-2412SG/N-HC RP60-2415SG/N-HC RP60-243.3SG/N-HC RP60-4805SG/N-HC RP60-4812SG/N-HC RP60-4815SG/N-HC RP60-483.3SG/N-HC。
Technical Data Sheet Silicon PIN PhotodiodePD15-22C/TR8Features․Fast response time ․High photo sensitivity ․Small junction capacitance ․Pb free ․The product itself will remain within RoHS compliant version.Descriptions․PD15-22C/TR8 is a high speed and high sensitive PIN photodiode in miniature flat top view lens SMD package and it is molded in a water clear plastic. The device is Spectrally matched to visible and infrared emitting diode.Applications․High speed photo detector ․Copier ․Game machineDevice Selection Guide LED Part No.PD15-22C/TR8Chip MaterialSiliconLens ColorWater clearEverlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 1 of 10/PD15-22C/TR8Package Dimensions2.1 0.9 2.3 0.45 2.0 3.3 2.3 1.1 0.92.8 1.41.02.11.24-R0.25Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mmAbsolute Maximum Ratings (Ta=25℃)Parameter Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature*1 Power Dissipation at(or below) 25℃Free Air Temperature Symbol VR Topr Tstg Tsol Pc Rating 32 -25 ~ +85 -40 ~ +100 260 150 Units V ℃ ℃ ℃ mWNotes: *1:Soldering time≦5 seconds.Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 11.4Prepared by Jaine Tsai:Page: 2 of 10/PD15-22C/TR8Electro-Optical Characteristics (Ta=25℃)Parameter Rang Of Spectral Bandwidth Wavelength Of Peak Sensitivity Open-Circuit Voltage Symbol λ λP VOC ISC Condition 10% of λP --Ee=5mW /cm2 λP=940nm Ee=1mW /cm2 λP=875nm Ee=1mW /cm2 λP=875nm VR=5V Ee=0mW /cm2 VR=10V Ee=0mW /cm2 IR=100μA Ee=0mW /cm2 f=1MHz VR=5V VR=5V RL=1000Ω Min 400 ----Typ --940 0.41 Max 1100 ----Unit nm nm V μAShort-Circuit Current4.06.5---Reverse Light CurrentIL ID BVR4.26.5---μADark Reverse Current Reverse Breakdown Voltage--32--17010 ---nA VTotal Capacitance Rise Time Fall TimeCt tr tf-------6 10 10-----pFnS ---Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 3 of 10/PD15-22C/TR8Typical Electro-Optical Characteristics CurvesFig.1 Power Dissipation vs. Ambient Temperature Fig.2 Spectral Sensitivity2001.0Ta=25 CO1501000.550 0 -25 0 25 50 75 85 1000400 500 600 700 800 900 1000 1100 1200Fig.3 Dark Current vs. Ambient Temperature 1000Fig.4 Reverse Light Current vs. Ee20 1510010105VR=10V 1 20 40 60 80 1000 0.5 1.0VR=5V1.523.0Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 4 of 10/PD15-22C/TR8Typical Electro-Optical Characteristics CurvesFig.5 Terminal Capacitance vs. Reverse Voltage Fig.6 Response Time vs. Load Resistance10 8f=1MHZ VR=5V1021VR=10VTa=25°C100t610-1410 10-2-32 0.1 1 10 100101102103104105Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 5 of 10/PD15-22C/TR8Precautions For Use1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 6 of 10/PD15-22C/TR84.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 7 of 10/PD15-22C/TR8Reliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% NO. Item Test Conditions Test Hours/ Sample Failure Cycles Sizes Judgement Criteria 1 REFLOW Soldering TEMP.:260℃±5℃ 10secs 2 Temperature Cycle H : +100℃ L : -40℃ 3 Thermal Shock H :+100℃ L :-10℃ 4 High Temperature Storage 5 Low Temperature Storage TEMP.:-40℃ 1000hrs 1000hrs 1000hrs 22pcs 22pcs 22pcs 0/1 0/1 0/1 6Mins 22pcs IL≦L×0.8 15mins 50Cycles 5mins 15mins 5mins 50Cycles 10secs 5mins 1000hrs 22pcs L:Lower 22pcs Specification Limit 0/1 0/1 0/1 Ac/ReTEMP.:+100℃22pcs0/16 DC Operating Life VR=5V 7 High Temperature/ 85℃ / 85% R.H High HumidityEverlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 8 of 10/.PD15-22C/TR8 Package Dimensions1. Reel DimensionsNote: The tolerances unless mentioned is ±0.1mm ,Unit = mm2. Carrier Tape Dimensions:(Quantity: 2000pcs/reel)2.0±0.05 1.754.01.55±0.050.2323.5±0.058.014.02.951 Anode 2 Cathode 1.65Note: The tolerances unless mentioned is ±0.1mm ,Unit = mmEverlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:/3.35Page: 9 of 10PD15-22C/TR8Packing ProcedureLabelAluminum moistue-proof bagDesiccantLabelLabel Form SpecificationCPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production PlaceRoHSPD15-22C/TR8Notes1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 Everlight Electronics Co., Ltd. Device No:DTD-152-001 Prepared date:09-21-2007Rev 1Prepared by Jaine Tsai:Page: 10 of 10/分销商库存信息: EVERLIGHTPD15-22C/TR8。
AT89C5131A Starter Kit .............................................................................................. Hardware User GuideTable of ContentsSection 1Introduction...........................................................................................1-11.1Features....................................................................................................1-1Section 2Hardware Description...........................................................................2-32.1Block Diagram...........................................................................................2-32.2Power Supply............................................................................................2-42.3C51 Standard Settings..............................................................................2-52.4Feature Description...................................................................................2-62.5External Connectors.................................................................................2-8Section 3Device Programming............................................................................3-93.1In-System Programming...........................................................................3-93.2Using a Programmer.................................................................................3-9Section 4Appendix.............................................................................................4-114.1Electrical Schematics..............................................................................4-124.2Component Placement...........................................................................4-164.3Mechanical Outlines................................................................................4-174.4Bill of Materials........................................................................................4-17Section 1IntroductionThis document describes the AT89C5131A Starter Kit Evaluation Board dedicated tothe AT89C5131A USB microcontroller. This board is designed to allow an easy evalua-tion of the product using demonstration software (refer to Software Guide).1.1Features The AT89C5131A evaluation board provides the following features:Possibility to choose between two packages for the AT89C5131A–PLCC 52-pin package–VQFP 64-pin packageOn-board power supply circuitry–from an external power connector–from an external battery–from the USB line via the USB on-board connectorOn-board reset, INT0, LEDs, EA, ISP and programming interfacePower, ALE, RS232 Rx and Tx LEDsExternal system clock connectorPCA clock connectorUSB, TWI, SPI and RS232 hardware connectorsTwo Connectors available for extended boardIntroductionFigure 1-1. AT89C5131A Evaluation BoardHardware DescriptionSection 2Hardware Description2.1Block DiagramFigure 2-1. AT89C5131A Evaluation Board ComponentsAT89C5131APowerSupplyUSB TWISPIRS232LEDC51 Generic Board InterfaceResetISPEAINT0DeviceDeviceHost,Device...HumanC51 Generic BoardProgrammingSpecific DeviceInterfaceHardware Description2.2Power SupplyThe on-board power supply circuitry allows various power supply configurations.The power source can be:–V BUS from USB (5V)–V BUS from USB (5V) through the current limiter –External power supply (from 6 to 12V) or 9V batteryThe voltage output can be the direct power source, regulated at 5V or 3.3V.The power supply selection is performed using the JP2, JP3, JP4 and JP5 jumpers.The power supply can be turned on/off using the “power” switch (SW6). Once the power is established, the power LED (D9) is lit.Figure 2-2. Different Power ConfigurationsLIMREG V B U S5V 3.3V I C CPWR.S.PWRVCC LIMREG V B U S5V 3.3V I C CPWR.S.PWRVCC LIMREG V B U S5V 3.3V I C CPWR.S.PWR VCC LIM REGV B U S5V3.3V I C CPWR.S.PWRVCC LIMREGV B U S5V 3.3V I C CPWR.S.PWRVCC LIMREG V B U S5V 3.3V I C CPWR.S.PWRVCC LIM REGV B U S5V3.3V I C CPWR.S.PWRVCC LIMREGV B U S5V 3.3V I C CPWR.S.PWRVCC LIMREG V B U S5V 3.3V I C CPWR.S.PWRVCC VBUSVBUS and Current LimiterExternalDirect Input5V Regulate3.3V RegulatePower SourceRegulationHardware Description 2.3C51 StandardSettings2.3.1Reset The external Reset push-button (SW3) is provided to easily generate a warm reset. Thisbutton is used for ISP process. The Reset applied is active low.2.3.2Clock A crystal can be easily installed on the Y1 socket. The clock can also be provided usingthe J8 connector instead of the crystal.Note:Remove the clock generators before the using the programmer.2.3.3EA Place a jumper on the EA connector (J10) to force the EA pin to ground and executeexternal code. Otherwise internal code will be executed.Figure 2-3. EA Circuitry2.3.4INT0In order to use the on-board INT0 circuitry, connect the J7 Jumper to the AT89C5131A.When you press the INT0 button (SW5), the P3.2 pin will go low which induces an inter-rupt event.Note:Remove the J7 jumper before using the programmer. Otherwise the program-mer will not function.Figure 2-4. INT0 CircuitryHardware Description2.4FeatureDescription2.4.1RS232The AT89C5131A evaluation board includes all the required hardware to manage theRS232 communication.Figure 2-5. RS232 On-board Circuitry2.4.2USB Peripheral The AT89C5131A evaluation board provides all the required hardware to develop aUSB firmware for the AT89C5131A, this includes:–a USB connector–2 test points on D+ and D-–1 test point on V BUS–a USB UNLOAD button which allows to disconnect the pull-up on D+ and thento simulate an Attach/Detach of the USB cableThe USB peripheral can also be used to perform an In-System Programming.Hardware Description2.4.3TWI PeripheralThe CT3 and CT5 contacts have to be soldered in order to use the SDA and SCL alter-nate P4.1 and P4.0 port configuration on the SPI connector (J4).In order to use these signals on the J5 extension connector (SDA and SCL), the CT4and CT6 contacts have to also be soldered.2.4.4SPI Peripheral2.4.5LED Controller The AT89C5131A controller includes an LED controller on:–P3.3 (LED 0)–P3.5 (LED 1)–P3.6 (LED 2)–P3.7 (LED 3)The on board LEDs can be controlled with the AT89C5131A if the corresponding con-tacts CT9, CT10, CT11 and CT12 are bypassed.Figure 2-6. On-board LEDs for LED Controller1LED32CT9CT10CT11CT12LED 0LED 1LED 2LED 3Hardware Description2.5ExternalConnectorsThese two external connectors to build a customer extended board easily.Figure 2-7. Top View of J5 and J6 ConnectorsP1.0P1.1P1.2P1.3P1.4P1.5P1.6P1.7P3.0P3.1P3.2P3.3P3.4P3.5 P3.6 - WRNCNCNCNCNCNCNCNCVCCVSSSDASCLNCRESETEABP1A16NCVSSXTAL2VSSNCNCNCNCNCNCNCNCBUZZERVSSVSS4745434139373533312927252321191715131197531484644424038363432302826242220181614121086424.35 12V4.35 12VVSSNCNCNCNCNCNCNCNCPSENVSSALEP1.0 - KBD 0P1.1 - KBD 1P1.2 - KBD 2P1.3 - KBD 3P1.4 - KBD 4P1.5 - KBD 5P1.6 - KBD 6P1.7 - KBD 7VSSVSSP0.0P0.1P0.2P0.3P0.4P0.5P0.6P0.7P2.0P2.1P2.2P2.3P2.4P2.5P2.6P2.7P4.0P4.1NCNCNCNCNCNC474543413937353331292725232119171513119753148464442403836343230282624222018161412108642 J5J6分销商库存信息: ATMELAT89STK-05。
UNISONIC TECHNOLOGIES CO., LTDLXXLD15Preliminary CMOS IC0.8V REFERENCE ULTRALOW DROPOUT LINEARREGULATOR⏹DESCRIPTIONThe UTC LXXLD15 is a typical LDO with the feature of verylow dropout voltage as low as 0.2V at output current 1.5A.For normal operation, two supply voltages are necessary.One called control voltage from other equipment can shutdownthe output voltage and it should pull and hold the voltage of ENpin less than 0.3V. Another one is the main supply voltagewhose purpose is for main power conversion to keep the powerdissipation low and to make the dropout voltage lower.Internally, in the UTC LXXLD15, there’re many functionswhich can be seen in the block figure to prevent the IC frombeing damaged. Internal Power-On-Reset (POR) circuit cancontrol the two supply voltages to prevent fault operations of thecircuit. And the thermal shutdown circuit is able to protect thedevice from over thermal operation and a current limit functionwill keep the device work safely under current over-load.The UTC LXXLD15 can be used as an ideal to provide wellsupply voltage in the applications, such as front-side-bustermination on motherboard, NB applications, front side bus V TT(1.2V/1.5A) and note book PC applications.⏹FEATURES*Low Dropout V D=0.2V (typ.) @ I OUT=1.5A*Low ESR Output Capacitor*V REF=0.8V*±1.5% over Line, Load and Temperature Output Accuracy *Fast Transient Response*Output Voltage Adjustable through External Resistors*POR (Power-On-Reset) controlling V CNTL and V IN *With internal Soft-Start*Internal Current Limit Protection*Internal Under Voltage Protection*Hysteretic Thermal Shutdown*With Power-OK Output (with a Delay Time) *For Standby or Suspend Mode: Shutdown⏹ORDERING INFORMATIONOrdering NumberPackage Packing Lead Free Halogen FreeLXXLD15L-SH2-R LXXLD15G-SH2-R HSOP-8TapeReel⏹MARKING INFORMATION⏹PIN CONFIGURATIONV INGND FB V OUT V OUTV INV CNTL P OK EN ⏹PIN DESCRIPTIONDESCRIPTION There’s an external resistor divider connected to this pin which is necessary to give the feedback voltage to the regulator. The external circuit is combined as the and FB is R1(connected with a bypass capacitor which can improve the load transient response),and between FB and ground is R2.The valueof R2 and R1 are recommended between 100Ω~10k .So the output voltage is The output voltage pin of the regulator. There should be set an output capacitor to compensate for closed-loop and also to improve transient responses. It’s necessary to connect Pin 3 and Pin 4 together by wide tracks. It’s necessary to connect the Exposed Pad and V voltage. Monitoring this pin’s voltage can reset Power-On.Power input pin of the control circuitry. Connecting this pin to a +5V(recommended) supply voltage provides the bias for the control circuitry. Thevoltage at this pin is monitored for Power-On Reset purpose.BLOCK DIAGRAM⏹ABSOLUTE MAXIMUM RATINGPARAMETER SYMBOL RATINGS UNIT Supply Voltage (V CNTL to GND) V CNTL-0.3 ~ +7V Supply Voltage (V IN to GND) V IN-0.3 ~ +3.9VEN and FB to GND V I/O-0.3 ~ V CNTL+0.3VPOK to GND V POK-0.3 ~ +7V Power Dissipation P D 2.8WLead Soldering Temperature, 10 Seconds T SDR260°СJunction Temperature T J+150°СStorage Temperature T STG-65 ~ +150°СNote: Absolute maximum ratings are those values beyond which the device could be permanently damaged.Absolute maximum ratings are stress ratings only and functional device operation is not implied.⏹RECOMMENDED OPERATING CONDITIONSPARAMETER SYMBOL RATINGS UNIT Supply Voltage Control V CNTL 3.1 ~ 6 V Supply Voltage Input V IN 1.1 ~ 3.5 VOutput Voltage V CNTL=3.3±5%V OUT0.8 ~ 1.2 V V CNTL=5.0±5% 0.8 ~ V IN-0.2VOutput Current I OUT0 ~ 1.5 A Junction Temperature T J-40 ~ +125°С⏹THERMAL CHARACTERISTICSPARAMETER SYMBOL RATINGS UNIT Junction to Ambient in Free Air (Note 1) θJA44°C/W Junction to Case (Note 2) θJC19°C/W Notes: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.The exposed pad of HSOP-8 is soldered directly on the PCB.2.The Thermal Pad Temperature is measured on the PCB copper area connected to the thermal pad ofpackage.ELECTRICAL CHARACTERISTICS(Refer to the typical application circuit. These specifications apply over, V CNTL = 5V, V IN = 1.5V, V OUT = 1.2V andAPPLICATION INFORMATION1.Power SequencingWhen there’s no main voltage applied at V IN, it is suggested not to apply a voltage to V OUT for a long time. Because the internal parasitic diode (between V OUT to V IN) will conduct and dissipate power, there’s no protection.2.Output CapacitorA proper output capacitor to maintain stability and improve transient response over temperature and current is necessary. Proper ESR (equivalent series resistance) and capacitance of the output capacitor should be selected properly for stability of the normal operation and good load transient response.Many kinds of capacitors can be used as an output capacitor, such as ultra-low-ESR capacitors (like ceramic chip capacitors), low-ESR bulk capacitors (like solid Tantalum, POSCap, and Aluminum electrolytic capacitors). And also the value of the output capacitors’ can be increased without limit.In the applications with large stepping load current, the low-ESR bulk capacitors are normally recommended. Decoupling ceramic capacitors are recommended to be placed at the load and ground pins very closely and also the impedance of the layout must be minimized.3.Input CapacitorIn order to prevent the input rail from dropping, the proper input capacitor to supply current surge during stepping load transients is required. Because the limited slew rate of the surge currents, more parasitic inductance needs more input capacitance.Ultra-low-ESR capacitors (>100mF, ESR<300mW) is recommended for the input capacitor.4.Feedback NetworkThe following figure shows the feedback network between V OUT GND and FB pins. Working with the internal error amplifier, the feedback network can provide proper frequency response for the UTC LXXLD15.V OUTTYPICAL APPLICATION CIRCUITS ing an Output Capacitor with ESR≥18mΩing an MLCC as the Output CapacitorUTCLXXLD15POKENEnablePOKENGNDFBOUTOUTVV CNTLR3=1kΩR2=78kR1=39kΩOUT=22µFV OUT+1.2V/1.5AV IN+1.5VCNTL=1µFC IN=22µF=56pFV CNTL+5V5678V OUT (V) R1 (kΩ)R2(kΩ)C1(pF)1.0543137.6471.52730.86821.81512150。