铜箔技术规范for Suntak -三井
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Mitsui Copper Foil (M) Sdn. Bhd.
COPPER FOIL SPECIFICATION
Document Date: 1st September 2010
Foil Type: Electrodeposited Copper Foil
PROPOSAL Product Type: MW-G
Purchaser :SHENZHEN SUNTAK MULTILAYER PCB CO.,LTD.
深圳崇达多层线路板有线公司
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Name:
Title:
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Name:
Title:
Date:
Manufacturer : Mitsui Copper Foil (Malaysia) Sdn. Bhd.
No. 1C, Persiaran Kuala Langat,
Section 27, 40400 Shah Alam,
Selangor, Malaysia.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Name: Elaine Liew
Tel: +603-5191-2870Title: QA Deputy General Manager
Fax: +603-5191-2415
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Name: K.H. Yap
Title: Sales Executive
REVISIONS
1-Sep-10Original release of the specification
Remark: The Manufacturer shall inform Customer the implementation date of this Copper Foil Specification in writing.
Suntak PCB
Mitsui Copper Foil (M) Sdn. Bhd .
COPPER FOIL TYPE : MW-G
1. Physical Property And Dimension Specification (refer Table 1 for detail test method)
Item
Unit
18µ35µThickness by area weight g/m 2153 ± 10%305 ± 10%Resistivity Ωg/m 20.166 max
0.162 max
Copper purity
%
99.8 (min)
RT
≥ 21.0≥ 28.0HT ≥ 10.5≥ 14.0RT
≥ 2
≥ 3HT ≥ 2≥ 2P/S-A (as received)
≥ 1.1
≥ 1.6
P/S-S4 (after solder float, 288
o C)
≥ 1.1
≥ 1.6
sec Blister occuring time ( ≥ 20 )
Pinholes
no / ft
2
Refer to Page2 (2. Visual Appearance (i))Length
Width Quantity / box
sheets
As per agreed customer order.
Peel Strength *
: For other prepreg type, peel level subject to mutual agreement.
RT - Room Temperature
HT - Hot Temperature is at 180o C.
Tensile Strength
Elongation
Cut sheets
%
kgf/mm
2
Peel Strength * (on FR-4 prepreg)
Solder Blister (on FR-4 prepreg at 260 o C)kgf/cm
mm
As per agreed customer order (tolerance + 3 / - 0)
As per agreed customer order (tolerance + 3 / - 0)
Mitsui Copper Foil (M) Sdn. Bhd.
2.
VISUAL APPEARANCE
IPC-TM-650 Test method
(i)
Pinholes :
2.1.2
The longest dimension of any pin hole shall not exceed 0.05mm.Maximum pinholes allowable is :
18 µ: 5 points / ft 235 µ
: 3 points / ft 2
(ii)
Pits and dents :
2.1.5
No pits and dents of a permanently deformed nature.
(iii)Wrinkles :
2.1.5
There shall be no wrinkles of a permanently deformed nature.
(iv)Scratches :
2.1.5
(v)
Hole and tears :
2.1.5
Material shall be free from holes and tears.
(vi)Cleanliness :
2.1.5
Pinhole shall be confirmed by checking with red dye penetration method and observation under optical microscope.No scratches with depth > 20% of nominal thickness shall be present per square feet of sample.The metal foil shall be free from dirt, oil, corrosion, salts, smut, grease, finger prints, foreign matter, copper chips and other defects that may affect the life, serviceability, or appearance of the metal foil.
Suntak PCB Page 2
Mitsui Copper Foil (M) Sdn. Bhd.
3.TEST METHOD
Copper foil property be tested in accordance with (MMS) MITSUI's test method and IPC-TM-650.
as determined in Table 1.
4.TEST DATA
Test Data / Certificate Of Conformance (COC) shall be provided for each product lot which
includes the results of the following :
Item
Unit
Thickness(By area weight)g/m2
Tensile Strength(Room temperature)kgf/mm2
(Hot temperature)
Elongation(Room temperature)%
(Hot temperature)
Peel Strength(As received, P/S-A)kgf/cm
Peel Strength(After solder floated, P/S-S4)kgf/cm
Remark : product lot mentioned above shall be referred to as the Production Master Roll, which
is produced from a continuous surface treatment process and from the same electrodeposited
foil lot.
5.PACKING CONDITION
Copper foil roll or cut sheets shall be suitably wrapped in packaging sheet and vacuum packed to
prevent oxidation, and boxed in wooden box. It shall be marked in accordance to Mitsui Copper Foil
(M) Sdn. Bhd.'s standard packing labels.
6.QUALITY ASSURANCE TERM
The Quality Assurance Term shall be three (3) months from the arrival date with the condition
that the copper foil shall be tightly sealed and stored in the atmosphere with temperature of
25 O C and below and maximum relative humidity of 60 %.
7.ASSIGNMENT OF LOT NUMBER
One continuously treated roll at surface treatment process is defined as one lot.
Definition of Lot number
Example :0-01-0357-01
0: Production year, ie. 0 for 2010
01:Surface treatment machine number, ie. 01 for Treater #1
0357:Number of treated roll or master roll. This number started from
0001 on Jan 01st of every year and increase in sequence
01:Slit roll number from the master roll
8.IDENTIFICATION OF BOX NUMBER
It consists of an alpha-numeric character which is assigned based on the box code, the shipment year and running
numbers (in ascending order).
Definition of Box number
Example:ABC-0S-0001
ABC:Refers to abbreviation from End-user name.
0:Indicates last digit of the year, i.e. 0 for 2010
S:Indicates the foil size and thickness.
0001:Indicates box sequence number in ascending order.
9.MISCELLANEOUS
Any revision and amendment made of the above requirement shall be with mutual agreement
between both party or authorized party, and made through writing.
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Mitsui Copper Foil (M) Sdn. Bhd.
TABLE 1 : TEST METHOD
Thickness by area weight
Mitsui Method
IPC-TM-650(g/m 2)(No. 2.2.12)Resistivitity JIS-H-0505
IPC-TM-650(ohm-g/m 2) (No. 2.5.14)
Copper purity
JIS-H-1101
IPC-TM-650(No. 2.3.15)Tensile Strength
Mitsui Method
IPC-TM-650(kgf/mm 2
)(No. 2.4.18)and
Elongation JIS Z 2241
(%)
Peel Strength JIS C 6481IPC-TM-650
P/S-A (kgf/cm)
5.7
(No. 2.4.8 at ambient 5.7.3 (1) (normal condition)temperature)Peel Strength JIS C 6481IPC-TM-650
P/S-S4 (kgf/cm)
5.7
(No. 2.4.8 at elevated 5.7.3 (2) (after soldering)temperature)Solder Blister JIS-C-6481
IPC-TM-650(sec)(No. 2.4.12)Pinholes IPC-TM-650IPC-TM-650(no / ft 2
)
(No. 2.1.2)
(No. 2.1.2)
Etchability :IPC-TM-650
2.3.6, 2.3.7, 2.3.7.1Solderability :
IPC-TM-650There shall be no evidence of solder dewetting.
2.4.12
Discoloration :Mitsui Method Reference The metal foil surface treatment, including the foil, shall be capable of being removed by normal etching process, and be free from oxide transfer on base laminates after etching process. The treatment shall be functionally uniform within a foil.
There shall be no discoloration on shiny side of the foil after heating at 180°C for 1 hour.
Test Item
Test Method Used
Page 4
TITLE : PACKAGING SPECIFICATION
Product Copper Foil Without Adhesive Coating Shape Roll Type MW-G
Width As per agreed customer order Weight / Roll
As per agreed customer order Splice / Lot Joint per Roll
As per mutual agreement
1. Silica gel (50gm x 2) inside end of paper tube.
2. Insert plastic plugs at both ends of paper tube.
3. Copper roll put inside packing sheet.
Internal Packing
(Silica gel 50gm x 2)
Box Type Wooden box
Labels
Packing sheet - one on the box
PCQ Data Sheet - two on the copper roll
- one on the packing sheet
Lot number
- attached on both paper tube
Remarks The above packaging drawing is based on GCF actual packaging
Copper roll
Paper tube
Plastic plug
PE foam。