Simultaneous resistance to two or more broad spectrum anthelmintics by gastrointestinal nematode

Series MSX Pro Magnesense ® Differential Pressure TransmitterSpecifications - Installation and Operating InstructionsBulletin P-MSXP-AThe Series MSX Pro Magnesense ® Differential Pressure Transmitter is the professional differential pressure transmitter meeting stringent industry standards with innovative global product design. The device has exceptional stability for use in critical building performance applications with the popular versatility of our original Series MS2 Magnesense ® II transmitter. The MSX Pro simplifies the ordering process to deliver the desired configuration, which reduces product setup time. Pressure ranges of Pa, mm w.c., and in w.c. are available per device. All pressure ranges can be configured in unidirectional or bidirectional modes providing a total of 32 ranges. The MSX Pro transmitter can provide a linear pressure output or a linear velocity output with the square root extraction from the transmitter. Additional parameters have been included to expand the square root capability to calculate flow. Dual voltage and milliamp output signals can be used to provide control and equipment output signal verification.INSTALLATION Surface Mounting:Mount the transmitter on a vertical surface. The pressure sensor measurement is unaffected by orientation, but it is recommended the unit be mounted with the connections facing down to prevent moisture from entering either the pressure ports or the electrical cable entry. Attach the mounting flange to a flat surface using #8 x 1/2˝ pan head sheet metal screws. Do not over tighten.Duct Mounting (Universal model required):Mount the transmitter away from fans, corners, heating and cooling coils and other equipment that will affect the measurement of the pressure.1. To mount the transmitter, drill a .562˝ (12.70 mm) diameter hole into the duct. 2. Screw duct probe into back of housing. Insert transmitter probe into the duct.3. Mark location of mounting holes on duct using mounting flange as template. Drill holes.4. Attach mounting flange to duct with #8 x 1/2˝ pan head sheet metal screws. Do not over tighten screws.5. Place the included cap on the exterior positive pressure port.The Universal model can also be used as a standard wall mount transmitter. In this mode, do not use the duct probe and plug the port on the backside of the transmitterwith the included plug.1-29/32[48.43]1-29/32[48.43]ELECTRICALThe MSX Pro transmitter utilizes a 2-wire 4-20 mA Current Output , or a 3-wire 0-5 V / 0-10 V Voltage Output . It is also capable of Simultaneous Current and Voltage Output . The power and signals interconnect via a removable European-style four conductor terminal block, or optionally, via the included tooless terminal block. 2-Wire 4-20 mA Current OutputThe connections to the transmitter are made through terminals VDC and COM on the terminal block as shown in Figure 1. The terminal block is removable and each of the terminals are labeled next to the terminal block on the circuit board. Polarity is indicated by VDC and COM. See Figure 1.The maximum receiver load resistance (RL) for a given power supply voltage (Vps) is defined by the formula: Shielded 2-wire cable is recommended for control loop wiring. Ground the shield at the power supply end only.The receiver may be connected to either the negative or positive side of the loop, whichever is most convenient. Should polarity of the transmitter or receiver be inadvertently reversed, the loop will not function properly but no damage will be done to the transmitter.The maximum length of connecting wire between the transmitter and the receiver is a function of wire size and receiver resistance. That portion of the total current loop resistance represented by the resistance of the connecting wires themselves should not exceed 10% of the receiver resistance. For extremely long runs (over 1,000 feet), it is desirable to select receivers with lower resistances in order to keep the size and cost of the connecting leads as low as possible. In installations where the connecting run is no more than 100 feet, you can use a connecting lead wire as small as No. 22 ga.Selection of using a DC or AC power supply is made via the terminal block. See Figure 2 for DC Wiring. See Figure 3 for AC Wiring.The terminal block is removable and each of the terminals are labeled next to the terminal block on the circuit board. Positive polarity is indicatedby VOUT. AC/DC selection is made via the terminal block. If the polarity of the transmitter is inadvertently reversed, the unit will not function properly, but no damage will be done to the transmitter.The minimum receiver load is 1 kΩ. The resistance due to the wire should be low compared to the receiver load resistance. While the voltage at the terminal block remains unchanged with a 10 mA current flow, resistive losses in the wiring do cause errors in the voltage delivered to the receiver. For a 1% accurate gage, the resistance of the wires should be less than 0.1% of the value of the receiver load resistance. This will keep the error caused by the current flow below 0.1%.The output across VOUT and COM will be either 0-5 V, 0-10 V depending on the DIP switch setting. See DIP Switch Settings Section for more information.DC POWER SUPPLY 10-36 VDCV A CV D CC O MV O U TCURRENT RECEIVER+--+DC POWER SUPPLY 17-36 VDCVOLTAGE RECEIVER-++-V A CV D CC O MV O U T AC POWER SUPPLY 21.6-33 VACVOLTAGE RECEIVERV A CV D CC O MV O U T -+DO NOT EXCEED SPECIFIED SUPPLY VOLTAGE RATINGS. PERMANENT DAMAGE NOT COVERED BY WARRANTY WILLRESULT. SIMULTANEOUS OUTPUTS ARE NOT DESIGNED FOR AC VOLTAGE OPERATION.DO NOT EXCEED SPECIFIED SUPPLY VOLTAGE RATINGS. PERMANENT DAMAGE NOT COVERED BY WARRANTY WILLRESULT.Figure 1Figure 2: DC wiringFigure 3: AC wiringR L =V ps - 10.020 mA DC If equipped, the LCD must be removed before wiring. Pull the LCD directly away from the product to remove. Reinstall the LCD afterwiring is completed.Simultaneous Current and Voltage OutputThe terminal block is removable and each of the terminals is labeled underneath the terminal block on the circuit board. Positive polarity is indicated by VOUT. The VDC terminal and a DC power supply must be used for Simultaneous Current and Voltage Output. The voltage output and the power supply must have separate wire leads that are only joined at terminal 2 of the transmitter. Additional error may occur for the voltage output if a single wire is used or if the wires are joined at the power supply or receiver.For the current output, the maximum allowable loop resistance (wiring + receiver resistance) is dependent on the power supply. The maximum loop voltage drop must not reduce the transmitter voltage below 17 V. The maximum loop resistance (R MAX ) for a given power supply voltage (V PS ) can be calculated using the following equation:The equation uses 17.0 instead of 10.0 as seen in the equation earlier with Figure 1. This represents the minimum voltage supply which is higher on the simultaneous output configuration due to the requirements of the voltage outputs.Shielded 4-wire cable is recommended for control loop wiring. Ground the shield at the power supply end only. Should the polarity of the transmitter or receiver be inadvertently reversed, the unit will not function properly, but no damage will be done to the transmitter.For voltage outputs, the minimum receiver load is 1 kΩ. The resistance due to the wire should be low compared to the receiver load resistance. While the voltage at the terminal block remains unchanged with a 10 mA current flow, resistive losses in the wiring do cause errors in the voltage delivered to the receiver. For a 1% accurate gage, the resistance of the wires should be less than 0.1% of the value of the receiver load resistance. This will keep the error caused by the current flow below 0.1%.The output across VOUT and COM will be either 0-5 V or 0-10 V depending on the DIP switch setting. See DIP Switch Settings Section for more information.Power SupplyRefer to the following tables for the required supply rating.DIP SWITCH SETTINGSDIP switch settings are marked directly on the PCBA as shown in Figure 5. Switches are factory-set, based on the order configuration. You can also use a small screwdriver or pen to change the position of the switches.Key To DIP Switch SettingsSwitches are numbered 1 to 8 beginning on the left.DIP Switches 1 and 2 - Unit of Measure SelectionDIP Switches 1 and 2 work as a pair to select the unit of measure. V A CV D C C O M V O U T DC POWERSUPPLY 10-36 VDCVOLTAGE RECEIVERCURRENT RECEIVER+-+--+Figure 4: Simultaneous current and voltage output wiringDO NOT EXCEED SPECIFIED SUPPLY VOLTAGE RATINGS. PERMANENT DAMAGE NOT COVERED BY WARRANTY WILLRESULT. SIMULTANEOUSOUTPUTS ARE NOT DESIGNED FOR AC VOLTAGE OPERATION.Figure 5 is a depiction of a 5 in w.c. pressure board. Other pressure boards, while similar, will vary from the below.There are no hazardous voltages if supplied power is within thespecified range. However, it is a good idea to shut control systemsdown while changing DIP switches to prevent erratic control system behavior.Figure 5: 5 in w.c. pressure boardR MAX =(V PS – 17.0) 20 mA DCDIP Switch 3 - Pressure vs Velocity/Flow Mode of OperationDIP Switch 3 toggles between pressure output vs velocity or flow output.• When the switch is in the OFF or down position, the device is in Pressure Mode.• When the switch is in the ON or up position, the device is in Velocity/Flow Mode. DIP Switch 4 - Voltage Output RangeVoltage output range can be either 0-10 V or 0-5 V depending on the position of DIP Switch 4.• When the switch is in the OFF or down position, the output will be 0-10 V• When the switch is in the ON or up position, the output will be 0-5 V.DIP Switch 5 - Unidirectional vs Bidirectional OutputDIP Switch 5 can be set to measure pressure in one direction (unidirectional) or in both directions (bidirectional).• When the switch is in the OFF or down direction, the transmitter will be set for uni-directional and will be 0 based (i.e. 0 to 5 in w.c.).• When the switch is in the ON or up position, the transmitter will be set forbidirectional and will be ± the maximum of the selected range (i.e. ±5 in w.c.). DIP Switch 6 - Response Time SelectionDIP Switch 6 toggles to select the desired response time.• When the switch is in the OFF or down direction, the transmitter response time will be instantaneous.• When the switch is in the ON or up direction, the response time will be 3 seconds. DIP Switches 7 and 8 - Maximum Range Selection (Pressure)DIP switches 7 and 8 work as a pair to select the maximum range output of the transmitter. Use the tables below to navigate pressure range selection. Alternatively, if using the device for velocity and flow, proceed to the next section.DIP Switches 7 and 8 - Maximum Range Selection (Velocity/Flow)DIP switches 7 and 8 work as a pair to select the maximum range output of the transmitter. Use the tables below to navigate velocity and flow range selection. CALIBRATIONThe transmitter security feature must be unlocked before calibration is accessible. See Section Program Menu-Menu Access Security. There is a 3 second delay from the time the zero or span calibration buttons are released until the time that the change in calibration takes place. This delay is used to prevent stress related offsets on the lower ranges.Zero CalibrationThe zero calibration can be set by applying zero pressure to both of the pressure ports and pressing the zero button for 3 seconds. If the LCD display is present, the display will read ZERO and then sequence back to the home display.The span calibration function allows the pressure value to be adjusted so that the currently applied pressure is the maximum configured pressure. This will in turn set the maximum analog output at the set pressure. It is recommended that the ZERO function be applied before performing a span. Apply the maximum desired pressure to the device, press and hold span for 3 seconds. If the LCD display is present, SPAN is displayed. The span function will be processed 3 seconds after the span button is released.For a positive span, apply pressure to the positive “+” port.LCD DISPLAYThe LCD comes with a housing cover, which contains a window. The display plugs into the pins on top of the circuit board. The LCD is 180° rotatable so that it will read properly if the device must be mounted with the connections facing up.The following error messages will appear if an LCD is present and the device is an error state.PROGRAM MENUHome MenuDuring normal operation, the display will be in the Home Menu and will display the current measured pressure and the engineering units.Menu Access SecurityBy default, a PIN code is not required to enter the configuration menus. However, if access to the menus needs to be restricted, follow the steps below.1. While in the Home Menu, press and hold the Zero and Span buttons until “PIN” is displayed.2. Press and hold the Zero and Span buttons until the current PIN setting isdisplayed (default is 0000).3. Use the Zero button to increment the selected digit (denoted by the caron ) orpress the Span button to select the next digit to the right.4. Any value between 0001 and 9999 will result in the requirement to enter the PINeach time the menu is entered. The value 0000 will disable the PIN entryrequirement.5. Press and hold the Span button until the next menu is displayed. PIN security setup is now complete.MAINTENANCE/REPAIRUpon final installation of the Series MSX Pro, no routine maintenance is required. The Series MSX Pro is not field serviceable and should be returned if repair is needed. Field repair should not be attempted and may void warranty.WARRANTY/RETURNRefer to “Terms and Conditions of Sale” in our catalog and on our website. Contact customer service to receive a Return Materials Authorization (RMA) number before shipping the product back for repair. Be sure to include a brief description of theproblem plus any additional application notes.This symbol indicates waste electrical products should not be disposedof with household waste. Please recycle where facilities exist. Check withyour Local Authority or retailer for recycling advice.DISPLAY ALL SEGMENTSHOME SCREEN (MODE = PRESSURE)FIRMWARE VERSION(MAY VARY)PIN MENUK-FACTOR MENUPRESSURE MENU (OUTPUT LOW MENU)PRESSURE MENU (OUTPUT HIGH MENU)PRESSURE MENU (ALARM LOW)PRESSURE MENU (ALARM HIGH)RESET MENUVELOCITY MENU(OUTPUT LOW MENU)VELOCITY MENU(OUTPUT HIGH MENU)RESET MENUMSX PRO FLOW SETTINGS FLOWCHARTFLOW MENU(AREA)FLOW MENU(OUTPUT LOW MENU)FLOW MENU(OUTPUT HIGH MENU)RESET MENUPrinted in U.S.A. 8/20FR# 444576-10©Copyright 2020 Dwyer Instruments, Inc.NOTES__________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________。

乙肝表面抗体阳性、核心抗体阳性（Hepatitis B surface antibody is positive, core antibody is positive）Hepatitis B surface antibody positive, hepatitis B core antibody positiveHepatitis B surface antibody is a protective antibody of human body, which can protect the body from HBV infection. Hepatitis B core antibody positive is infection or previous infection marker. These two simultaneous positive, indicating that the body was originally infected with hepatitis B, is in recovery or has recovered.Is hepatitis B antibody positive to be vaccinated?Whether to need to fight hepatitis B vaccine has the following two kinds of circumstances:1, if you are through hepatitis B vaccine to obtain hepatitis B antibody, it is recommended that every three years you strengthen the injection of a hepatitis B vaccine. Since the production of antibody by hepatitis B vaccine, the antibody level decreases with time. Most of our scholars suggest that it is better to strengthen the injection once three years after immunization. No matter how long apart, as long as the surface antibody titer in 10 international units more than /ml, indicating that the body has immunity to hepatitis B virus (variation hepatitis B invalid). Conversely, if the hepatitis B surface antibody titer is below this value, the injection should be enhanced.2, if the hepatitis B surface antibody is not obtained by injection of hepatitis B vaccine, but because of infection with hepatitis B virus obtained, at this time do not need to inject hepatitis B vaccine. The hepatitis B immune antibody obtained by hepatitis B infection has a relatively long duration.Hepatitis B surface antibody is positive, can be effective against hepatitis B virus invasion, thereby protecting the body from hepatitis B virus infection. The previous generation is generally believed that the injection of hepatitis B vaccine antibody 3-5 and sustainable, if often contact with hepatitis B patients if antibody offset faster, in recent years, clinical evidence of hepatitis B vaccine, hepatitis B surface antibody positive stimulation of antibody titer reached more than 10, most can play a protective role in 8-10, and often with hepatitis B patients contact person although antibody offset faster, but because the trace of hepatitis B virus stimulation, the body may also produce antibodies. If the hepatitis B surface antibody positive, generally do not have to worry about the daily life of infection, suggest that 3-5 check, in order to observe the existence and degree of antibodies, and antibody in weak timely to ensure the continuation of hepatitis B vaccine, antibody titer, and effective against hepatitis B virus, better maintenance of human health.Hepatitis B surface antibody appears weak positive, may have been infected with hepatitis B virus, has been restored to health. Or inoculation of hepatitis B vaccine may also lead to this phenomenon, indicating resistance already. The hepatitis B surface antibody is weak positive, generally is not contagious, but the hepatitis B antibody titer will graduallydecline along with the time, so generally strengthens injection once every 4-5 years. It's better to check two, half a titer below 10 micrograms, and every liter should be strengthened.The commonly used method of injecting hepatitis B vaccine is "0, 1 and June injection", that is, the second needle is injected 1 months after the first injection, and the third needle is injected 6 months after the first needle. According to the hepatitis B vaccine specific instructions, each subcutaneous injection of 5 - 10 micrograms. Seventh months, hepatitis B should be tested five items, the effect of vaccination. If the hepatitis B surface antibody is positive, that is effective, or else to play. Hepatitis B surface antibody is a protective antibody that can protect the body against hepatitis B virus, and its presence is the most important indicator of the effectiveness of hepatitis B vaccine injection.(1) if the hepatitis B surface antibody positive antibody titer is >10, showed that the protective antibody is enough, can to some extent in the prevention of hepatitis B virus attacks, without injection of hepatitis B vaccine to strengthen the needle, after check regularly.(2) if the surface antibody of hepatitis B is weak positive, that is, the titer of antibody is 4-10, then a hepatitis B vaccine should be inoculated to strengthen the needle.Hepatitis B surface antibody quantitative detection of normal value is less than 10 10mIU/m1, significantly negative, the body is not enough to resist the invasion of hepatitis B virus,hepatitis B is susceptible to the crowd, this time the need to fight hepatitis B vaccine booster, thereby enhancing the anti HBV effect; if more than 10mIU/m1, can effectively resist the infection of hepatitis B, and numerical better.Hepatitis B surface antibody (HBsAb) reached its peak in 6-12 months and gradually declined thereafter,Turn negative in 10 years (sometimes very fast).= = =Two half of hepatitis B is the most commonly used hepatitis B virus (HBV) infection detection serum marker in domestic hospitals. There are a total of 3 pairs of hepatitis B virus immunological markers, namely surface antigen (HBsAg) and surface antibody (anti HBs or HBsAb), e antigen (HBeAg) and e antibody (anti HBe or HBeAb), core antigen (HBcAg) and core antibody (anti HBc or HBcAb). Hepatitis B two half, also known as hepatitis B five, and its significance is: check whether the hepatitis B infection and the specific circumstances of infection, distinguish big Sanyang, small sanyang.Because core antigen is not easy to be measured in blood, at present the reagent box does not pass, so there are two half of antigen antibody, this is what people often say "hepatitis B two half and half" inspection, or called "hepatitis B five" inspection.Before the "two half and half", and later added a HBcAb-Igm (core antibody Igm), became the three, and now there is a Pre-S1(hepatitis B virus S1 antigen, S1 antigen), "two half and half" into the "three half and half".Hepatitis B two half of each index significance1 (HBsAg- hepatitis B surface antigen) as a sign of the virus has been infected, does not reflect whether the virus replication, replication, infectious intensity2 (HBsAb- hepatitis B surface antibody) is the hallmark of neutralizing antibodies, whether or not a major marker of recovery or resistance. Hepatitis B vaccination, if only the positive, should be regarded as a normal phenomenon after hepatitis B vaccination; hepatitis B virus infection on their own after the elimination of hepatitis B virus immunity will also have the body of hepatitis B surface antibody, this is a good phenomenon3 (HBeAg- hepatitis B virus e antigen) is a marker of viral replication. Continued positive for more than 3 months have affinity4 (HBeAb- hepatitis B virus e antibody) is a stop sign for viral replication. Viral replication decreases and infectivity is weaker than the HBV virus pattern, but not entirely without infection5 (HBcAb- core antibody) is a sign of a person who has been infected or is infected. The core antibody, IGM, is a marker of recent infection or viral replication. The core antibody IgG is produced after infection and has some relevance forassisting the two half of the test.Surface antigen: indicated that the hepatitis B virus (HBV) has been infected, because the surface antigen is the hepatitis B virus's shell, only this positive is not infectious. 70% - 90% surface antigen positive long-term, such as no symptoms, and liver function is normal, no symptoms of hepatitis B surface antigen carriers, without treatment, do not interfere with the work and study, the antigen positive in the population of China accounts for about 10%.Surface antibody: This is a protective antibody that neutralizes the hepatitis B virus. Clew: it is a kind of good phenomenon to obtain immunity after inoculation hepatitis B vaccine; second, hepatitis B recovery period or once suffered from hepatitis B already more, expressed already had immunity.E antigen: hepatitis B virus replication (reproduction) active, infectious stronger, and its close contact, the possibility of infection is greater. This antigen, such as persistent, suggests chronic hepatitis B virus carriers.E antibody: the condition that expresses hepatitis B patient is relieved, stability or incline to rehabilitation, prognosis is good, infectivity decreases, but do not assure the hepatitis B virus has disappeared completely.This is not the core antibody antibody neutralizing antibody, can not clear the virus, and once was in the body to exist for a long time, he recovered sustainable positive, the positive only recently infected with hepatitis B virus or viruscontinues to replicate (reproduction), or had hepatitis B virus infection, and can not distinguish between past or current infection is sick.9 common patterns1 - the past and present have not been infected with HBV.2 + - (1) previous infection failed to detect resistance to -HBs;(2) recovery stage HBsAg disappeared and anti -HBs did not appear; (3) asymptomatic HBsAg carriers.3 - - + + (1) had previously been infected with HBV; (2) acute HBV infection recovered; (3) a few specimens were still infectious. HBV infection has passed; the window period before the emergence of anti HBs. HBeAg appeared later in the latent period of hepatitis B, but disappeared later than the appearance of HBsAg,Closely related to HBV-DNA. Its clinical significance is as follows: (1) it can be used as an auxiliary diagnosis and prognostic indicator of acute hepatitis B. The recovery of acute hepatitis B usually disappears with the disappearance of HBsAg. If 3-4 months after the onset of acute hepatitis B, HBeAg is positive from Yang, anti -HBE appears, which means the prognosis is good. Onset of 3-6 months, still HBeAg (+), may be the earliest evidence of acute hepatitis becoming chronic.(2) it can help to determine the infectivity of hepatitis B patients or HBV carriers. HBeAg exists in the serum of HBsAg positive patients, indicating that there are Dane granules in the blood, most of which are HBV-DNA positive, and the threeare basically parallel. Therefore, HBeAg (+) is highly infectious. Anti -HBe (+) is generally less contagious. However, if serum HBV-DNA (+) may exist in the HBV variant, there is still a certain infectivity; (3) HBeAg positive suggests HBV replication in vivo. HBeAg appears to be resistant to -HBe before and after disappearance, and this phase is called seroconversion, from the HBV replication phase to the non replicative phase. Resistance to -HBe often indicates a decrease or termination of HBV proliferation. But if the nucleotide sequences of C before the change of HBV gene prevents the formation of HBeAg, HBV still exist in the blood circulation, liver disease may continue to develop, and gradually evolved into cirrhosis; (4) in primary hepatocellular carcinoma, the positive rate of HBeAg decreased, and the anti -HBe, a-FP in HBsAg (+ increased. The patients with liver cirrhosis), anti -HBe (+), a-FP increased, suggesting that early hepatocellular carcinoma; (5) maternal transmission in pregnant women during childbirth (HBeAg +) may spread between the rate of mother to child.4 - + - - (1) immunization with hepatitis B vaccine; (2) previous infection; false positive.5 + + + + acute HBV sensation rehabilitation.6 + + - (1) acute HBV infection; (2) chronic HBsAg carriers;(3) infectious weakness.7 - + - + infected with hepatitis B virus in the past, the virus has been basically cleared, the body in rehabilitation. However, there are still some patients with abnormal liver function andDNA positive. Whether or not there is a variation of the virus, it is still necessary to continue the treatment and still be immune. HBV infection, recovery stage.8 + - + + (1) acute HBV infection tended to recover; (2) chronic HBsAg carriers; (3) infectious weakness. Commonly known as "little Sanyang"".9 + + + - acute or chronic hepatitis B infection. Suggest HBV replication, infection is strong. Commonly known as "big Sanyang"".16 rare patterns10 + - - (1) acute HBV infection early, acute HBV infection incubation period; (2) chronic HBV carriers, infectious weak.11 + + - - (1) chronic HBsAg carriers tend to be negative; (2) acute HBV infection tends to recover.12 + + - - (1) acute HBV infection early, (2) chronic carriers, infectious strong.13 + - + + + (1) acute HBV infection tended to recover; (2) chronic carriers.14 + + - - (1) subclinical HBV infection early; (2) different subtypes of HBV two infection.15 + + - + (1) subclinical HBV infection early; (2) different subtypes of HBV two infection.16 + + + - subclinical or atypical infection.17 + + + + subclinical or atypical infection.18 + + + + - subclinical or atypical infection early. HBsAg immune complexes are newly infected with different subtypes.19 - - + - (1) atypical acute infection; (2) in the early stage of infection before the emergence of anti -HBc, HBsAg titer was low and negative, or false positive.20 + + + atypical acute infection.21 + + + acute HBV infection metaphase.22 - + - + - HBV infection has been restored.23 + + - atypical or subclinical HBV infection.24 + + + - atypical or subclinical HBV infection.25 - + - acute HBV infection tends to recover.7 rare patterns26 + + + + + + a subtype of HBsAg and profiled anti HBs (common); II. Serum converting from HBsAg to anti HBs (Shao Jian).27 - + + + -28 - + + + +29 - + + -30 + - + + -31 + + + -32 + + + + -3 normal modesThe following hepatitis B two half and half result index combination form, all indicated that now is the healthy person, has not infected the hepatitis B virus1. - + - +2. - + -3. - -1, hepatitis B symptoms are often manifested as loss of appetite, nausea, nausea and oil, abdominal discomfort, abdominal distension and so on.2, weak, tired, tired, listless, insomnia and dreaminess.3, jaundice is a more prominent symptom of hepatitis B symptoms, often manifested in urine color becomes dark, eyes, skin yellow.4, hepatitis B patients also often appear in right upper abdomen and right hypochondrium discomfort, pain and other symptoms.Hepatitis B two half of 135 positive, that is commonly known as the "hepatitis B big Sanyang", generally means that hepatitis B virus replication in vivo is more active, relatively strong infection. But the two semi hepatitis B 135 positive and can not explain the severity and the degree of liver damage in hepatitis B patients, to check liver function, liver B and hepatitis B virus load DNA related examination, comprehensive analysis and judgment can generally understand the severity of the replication of hepatitis B virus, and infectious size, and to determine the appropriate treatment according to the situation, to achieve the targeted drug, standardized treatment.Hepatitis B two pairs of semi positive 135, check if the liver function is normal, no other clinical symptoms, ultrasound examination showed no obvious damage to the liver, dynamic observations suggest that a HBV serological and biochemical indicators of liver function and ultrasound examination every 3-6 months.Hepatitis B two pairs of semi positive 135, check if the abnormal liver function, normal transaminase exceed more than 2 times, HBV-DNA positive, is suggestive of chronic active hepatitis, the immune has started, you should grasp the timing of treatment, the need for antiviral and protective therapy under the guidance of professional doctors.Hepatitis B two half of 145, positive refers to in the blood test, hepatitis B surface antigen, e antibody and core antibody is positive, we call it hepatitis B small sanyang.Where appear hepatitis B, two half of 145 positive (hepatitis B, small three yang), all indicate acute or chronic hepatitis B, in vivo viral replication, for hepatitis B virus replication.Hepatitis B two, half of 145 positive, should be further examination of liver function, blood routine, alpha fetoprotein and B ultrasound, so that they and doctors to understand the changes in the condition. Hepatitis B two half of 145 positive (hepatitis B small Sanyang) examination, HBV, DNA is still positive, indicating that hepatitis B virus still exists, is still infectious. Every transaminase is high, virus activity is small, 3 worlds need treatment. Otherwise, the liver will develop toward fibrosis - cirrhosis - liver cancer.In addition, hepatitis B two, half a 145 positive, HBV-DNA negative, normal liver function, many people believe that no treatment. However, liver biopsy showed that 90% of the patients had chronic liver inflammation and had a tendency to liver fibrosis. Some patients even had early cirrhosis and the most serious was cancer. This part of hepatitis B, small Sanyang patients should consider anti fibrosis treatment.Hepatitis B two pairs of semi positive 15 also known as hepatitis B 2 Yang, indicating that patients with infectious is relatively weak, if patients with acute or chronic hepatitis, the patients are contagious: if it is changed from hepatitisand viral replication, suggesting that tends to stop infectious. As long as the regular review of liver function and hepatitis B two half and half, as long as the function of the liver is normal, patients do not have to worry too much.Hepatitis B five, first HBsAg positive, indicating that the presence of hepatitis B virus in the body, is now being infected; hepatitis B five, fifth HBcAb positive, indicating that hepatitis B virus had been infected.To determine the severity of hepatitis B, we should make a more accurate judgement in addition to the five items of hepatitis B (two and a half), combined with liver function tests, hepatic fibrosis indexes and B ultrasonography, and CT findings. 15 hepatitis B positive, suggest further liver function and HBV-DNA examination. Take corresponding measures according to the inspection results.Hepatitis B two half to 245 positive refers to hepatitis B surface antibody, E antibody and core antibody is positive. Hepatitis B surface antibody is an antibody produced by hepatitis B surface antigen to stimulate the immune system,Can protect the body from hepatitis B virus attacks again.About hepatitis B two, half a 245 positive whether contagious, according to liver function, HBV-DNA, liver B ultrasound examination, to determine whether there is no virus replication. If two of 245 patients with positive hepatitis B, liver function is normal, DNA negative without virus replication, neither infectious hepatitis B virus; hepatitis B can exist in two veryfew 245 Yang, but positive for HBV-DNA virus replication, then there may be infected with hepatitis B virus.General hepatitis B two pairs of semi positive 245 January, when second after antibody after hepatitis B e antibody anti -HBe e antibody of hepatitis B will disappear; if the long time does not disappear, there may be a mutation of hepatitis B virus, need to do the relevant checks, timely treatment.Hepatitis B two half of the different combinations of its significance is not the same, the most common patterns are:1. hepatitis B five, 1 Yang, the remaining Yin: shows that the incubation period of acute viral infection is late; HBsAg virus carriers.2. hepatitis B five, 2 Yang, the remaining Yin: once vaccinated hepatitis B vaccine, and immune; second, have been infected with hepatitis B virus, but there have been immune antibodies; may appear false positive.3., hepatitis B five, 5 Yang, the remaining Yin: previously infected with hepatitis B virus, is now in convalescence.4. hepatitis B five, 15 Yang, the remaining Yin: commonly known as the "small two Yang" acute HBV infection; II. Chronic HBsAg carriers.5. hepatitis B five, 25 Yang, the remaining Yin: shows that previously infected with hepatitis B virus, has now recovered and has immunity.6. hepatitis B five, 45 Yang, the remaining Yin: (1) the past infection HBV; II acute HBV infection recovery period, the presence of hepatitis B surface antibody before the window period.7., hepatitis B five, 135 Yang, the remaining Yin: commonly known as the "big three yang" acute or chronic hepatitis B infection; II. Viruses in activity and replication period.8., hepatitis B five, 245 Yang, the remaining Yin: acute HBV feeling, rehabilitation period, has a certain immunity.9. hepatitis B five, 13 Yang, the remaining Yin: commonly known as "big second Yang" acute HBV infection; II chronic HBsAg carriers.10. hepatitis B five, 145 Yang, the remaining Yin: commonly known as "small Sanyang", suggesting acute or chronic hepatitis B, viral replication in vivo, hepatitis B virus replication statusHepatitis B two half and half liver function testDistinguish one: check different indicators(1) the target of the project is hepatitis B five, that is: surface antigen (HBsAg) and surface antibody (anti HBs or HBsAb), e antigen (HBeAg) and e antibody (anti HBe or HBeAb), core antibody (anti HBc or HBcAb).(2) liver function index: routine examination for alanine aminotransferase (ALT), alanine aminotransferase (AST), Gu Cao Gu Cao (AST/ALT), the valley of glutamyl transferase (GGP), alkaline phosphatase (ALP), total bilirubin (TBILI), direct bilirubin (DBILI), indirect bilirubin (IBILI), the total protein (TP), albumin (ALB) and globulin (GLB), than the white ball (ALB/GLB), glucose (GLU), urea nitrogen (BUN), creatinine (CRE), lactate dehydrogenase (LDH-L), creatine kinase (CK), total cholesterol (CHOL), triglyceride (TRIG), uric acid (UA).Difference two: the clinical significance is different(1) the second half of hepatitis B two check significance is: check whether the infection of hepatitis B and the specific circumstances of infection, distinguish big Sanyang, small sanyang.(2) liver function is to reflect the physiological function of the liver, liver function test is to detect whether the liver has disease, the extent of liver damage, as well as to identify the causes of liver disease, to judge the prognosis and to identify the cause of jaundice. Liver function tests are especially sensitive and important to the diagnosis of liver diseases such as hepatitis and cirrhosis.Many patients with hepatitis B will encounter such a situation, check the two semi hepatitis B, the doctor to check the hepatitis B virus DNA, HBVDNA is the hepatitis B virus can replicate the genetic material of the new virus, hepatitis B virus gene. Hepatitis B virus only antigen, and no HBVDNA, it will not infect others, because it does not replicate theability of the virus, the patient will be completely cured. The doctor is measuring the condition of the hepatitis B patient,Need measurement of the blood is contained in the HBVDNA (i.e. qualitative, positive or negative), to determine whether there are infectious; but also the check number with the virus (viral load), is to determine the level of infection, usually in the copy number per milliliter containing the number of virus (copy / ml) with the blood of patients with virus load.Two half of hepatitis B can only reflect the carrying pattern of antigen and antibody in the body and the immunity of the organism under certain conditions, so as to provide indirect evidence for the hepatitis B virus infection. The presence of HBVDNA is the direct evidence of hepatitis B virus infection, and is the gold standard for diagnosis.Hepatitis B two, half a check, and metabolism is not directly related, eating does not affect the HBV antigen antibody indicators, that does not affect the accuracy of the results of the examination. So you don't need an empty stomach.Hepatitis B two half and half examination, do not need fasting examination, but hepatitis B two half and half, often with liver function or hepatitis B ultrasound examination together, to determine the hepatitis B situation. The liver function and hepatitis B ultrasound examination must be fasting, while checking the day before eating light, check the first three days can not drink, in order to ensure the accuracy of inspection. So, if want to check hepatitis B at the same time two half, liver function (hepatitis B, b) must be empty stomach.1, for healthy people, through the injection of hepatitis B vaccine can produce sufficient hepatitis B antibody, 3-5 years to check once five hepatitis B can be, but there are chronic liver disease symptoms, but also need to check the hepatitis B five.2, for regular contact with hepatitis B patients, it is best to go every year to check the hepatitis B antibody titer, once the titer is less than 10, should be timely vaccination hepatitis B vaccine, strengthen the needle.3, for hepatitis B patients, hepatitis B five checks interval depends on their own circumstances, neither between the interval is too long, but too frequent inspection is meaningless. If patients are not treated with special antiviral therapy, there is no need to examine HBV markers and viral variants frequently, and each patient's condition must be selected for an examination to be performed. Under normal circumstances, it is recommended that every three months or six months of the patient's friends to check the hepatitis B five checks. There are five clinical hepatitis B is often carried out with the liver function, especially the hepatitis B patients who have manifested the symptoms of hepatitis B, if the feeling is a little unusual, go to the hospital for examination.Big 3 this world is infectivity, small, 3 this world infectivity is lower, healthy carrier is not infectivity.HBsAg carriers account for about 10% of China's totalpopulation.Hepatitis B is transmitted mainly through the bloodstream, occasionally through saliva and semen, and in daily life, general contact is unlikely to infect others."Small Sanyang," who, usually without hepatitis symptoms, liver function has been normal people, also known as hepatitis B virus carriers.It is estimated that there are about 215 million people living with hepatitis B virus in the world, about 120 million of them in china.。

Simultaneous Equation MethodIntroductionIn mathematics, simultaneous equations play a crucial role in solving real-world problems and modeling various phenomena. The simultaneous equation method is a powerful technique used to find solutions for a system of equations. This method involves solving multiple equations together to determine the values of unknown variables. In this article, we will explore the simultaneous equation method in detail and discuss its applications.Understanding Simultaneous EquationsDefinitionSimultaneous equations, also known as a system of equations, are a set of equations that share the same variables. The solutions of these equations simultaneously satisfy each equation in the system. The general form of simultaneous equations can be written as:a1x + b1y = c1a2x + b2y = c2Here, x and y are the variables, while a1, a2, b1, b2, c1, and c2 are constants.Types of Simultaneous EquationsSimultaneous equations can be classified into three types based on the number of solutions they have:1.Consistent Equations: These equations have a unique solution,meaning there is a specific set of values for the variables thatsatisfy all the equations in the system.2.Inconsistent Equations: This type of system has no solution. Theequations are contradictory and cannot be satisfied simultaneously.3.Dependent Equations: In this case, the system has infinitely manysolutions. The equations are dependent on each other and represent the same line or plane in geometric terms.To solve simultaneous equations, we employ various methods, with the simultaneous equation method being one of the most commonly used techniques.The Simultaneous Equation MethodThe simultaneous equation method involves manipulating and combining the given equations to eliminate one variable at a time. By eliminating one variable, we can reduce the system to a single equation with one variable, making it easier to find the solution.ProcedureThe general procedure for solving simultaneous equations using the simultaneous equation method is as follows:1.Identify the unknow n variables. Let’s assume we have n variables.2.Write down the given equations.3.Choose two equations and eliminate one variable by employingsuitable techniques such as substitution or elimination.4.Repeat step 3 until you have a single equation with one variable.5.Solve the single equation to determine the value of the variable.6.Substitute the found value back into the other equations to obtainthe values of the remaining variables.7.Verify the solution by substituting the found values into all theoriginal equations. The values should satisfy each equation.If the system is inconsistent or dependent, the simultaneous equation method will also lead to appropriate conclusions.Applications of Simultaneous Equation MethodThe simultaneous equation method finds applications in numerous fields, including:EngineeringSimultaneous equations are widely used in engineering to model and solve various problems. Engineers employ this method to determine unknown quantities in electrical circuits, structural analysis, fluid mechanics, and many other fields.EconomicsIn economics, simultaneous equations help analyze the relationship between different economic variables. These equations assist in studying market equilibrium, economic growth, and other economic phenomena.PhysicsSimultaneous equations are a fundamental tool in physics for solving complex problems involving multiple variables. They are used in areas such as classical mechanics, electromagnetism, and quantum mechanics.OptimizationThe simultaneous equation method is utilized in optimization techniques to find the optimal solution of a system subject to certain constraints. This is applicable in operations research, logistics, and resource allocation problems.ConclusionThe simultaneous equation method is an essential mathematical technique for solving systems of equations. By employing this method, we can find the values of unknown variables and understand the relationships between different equations. The applications of this method span across various fields, making it a valuable tool in problem-solving and modeling real-world situations. So, the simultaneous equation method continues to be akey topic in mathematics and its practical applications in diverse disciplines.。

《爱的⼼理学》期末复习题答案版《爱的⼼理学》期末复习题⽬录1. 简述⼼理学家RUBIN有关爱的理论的要点。

(2)2. 什么是PASSIONATE L OVE? 什么是COMPANIONATE L OVE? 两者有何区别？ (2)3. LEE的爱的六种类型是如何划分的？每种类型的主要特征是什么？ (3)4. STERNBERG的爱的三⾓形理论的主要观点是什么？你如何看待这个理论？ (3)5. HATFILED等⼈提出的LOVE S CHEMAS的含义是什么？它包括哪些类型？ (3)6. 根据⼼理学家们的观点，爱的起源是什么？为什么需要LEARNING T O L OVE? (4)7. 弗洛伊德关于⼉童早期经历的“⼆次动因学说”存在什么问题？请举出证据表明弗洛伊德的理论的缺陷。

(4)8. 根据BOWLBY的理论，依恋的定义是什么？ (4)9. 根据BOWLBY的理论，依恋系统是⼀个什么样的系统？ (4)10. 根据BOWLBY的理论，依恋的⽣物学功能是什么？ (4)11. 根据BOWLBY的依恋理论，在什么条件下，依恋系统会被激活？ (4)12. 什么是SECURE B ASE 现象（SECURE B ASE P HENOMENON）？ (5)13. BOWLBY的依恋理论和弗洛伊德的理论有何异同点？ (5)14. 根据AINSWORTH最初的观察，婴⼉依恋的模式有⼏种？各有什么样的表现？ (6)15. 什么是AINSWORTH的“陌⽣情景法”（STRANGE S ITUATION P ROCEDURE）？请说明其包含那⼏个场景，以及标准的程序。

(7)16. 依恋测量的Q分类法的特点是什么？包括哪些内容？ (8)17. 根据BOWLBY和AINSWORTH的理论，婴⼉依恋的形成分成哪⼏个阶段？每个阶段各有什么样的特征？ (8)20. 为什么可以将成⼈的浪漫的爱看成是⼀种依恋过程？ (11)21. 成⼈依恋访谈（AAI）要回答的问题是什么？其分类的标准是什么？ (11)22. 成⼈依恋访谈（AAI）与陌⽣情景法（SSP）测量的婴⼉依恋模式之间有何对应关系？ 1324. BRENNAN等⼈提出的成⼈依恋测量的两个维度是什么？他们提出的量表（ECR）是如何编制的？ (16)1.简述⼼理学家Rubin有关爱的理论的要点。

XPIQQuad Intelligent Audio Transponderdn-6823:a • C-256823x p i q .j p gXPIQ (shown without cabinet cover)GeneralThe XPIQ Quad Intelligent Audio Transponder is for distrib-uted multichannel voice evacuation systems, playing up to four simultaneous messages. It is an integrated audio amplification and distribution subsystem controlled by an FACP (Fire Alarm Control Panel) via the SLC (Signaling Line Circuit). The XPIQ can direct up to four low-level audio signals from the risers to four audio amplifiers. The amplified audio signals are then directed to up to four integrated, continuously supervised speaker circuits. The XPIQ is compatible with all Onyx panels,with the exception of the NFS-320.NOTE: The XPIQ can also be used with Legacy panels. Please refer to the XPIQ manual for more information.XPIQ-MB Features•Four Class B speaker circuits (Class A with XPIQ-CA ).•Accepts four audio riser channels from XPIQ-AIB4 option board.•Four amplifier slots.•Continuously supervised amplifiers and speakers.•All-call local page capability with optional RM-1(SA) remote microphone and XPIQ-RMI .•Two independent user-configurable tone generators either for riser backup or as a main tone source.•Supports routing of all-call page from single remote micro-phone to other XPIQ-MB s in the same cabinet.•Background music input terminal block.•Ten-position background music volume-control switch.•Multiple variations of backup configurations:–1 to 1 backup.–2 to 1 backup.–3 to 1 backup.–2 to 2 backup.–1 to 1 external backup (backup amplifier in another XPIQ).–2 to 1 external backup (backup amplifier in another XPIQ).–3 to 1 external backup (backup amplifier in another XPIQ).–4 to 1 external backup (backup amplifier in another XPIQ).•Supports backup amplifier sharing between two or more XPIQs within the same cabinet.•Includes four Class B or two Class A notification appliance circuits or telephone circuits.•Ring tone on firefighter telephone circuits.•Supervised firefighter telephone riser input with in and out terminals.•XPIQ-PS(E) power supply control/supervision that includes AC, battery, and charger monitoring.•AC trouble delay option (none, 8-hour delay, 16-hour delay).•Ground fault detection.•Easy software upgrading and programming accomplished by downloading from PC via serial port.•Nonvolatile memory for storing configuration data.•Pluggable terminal blocks for field wiring.•Accessory trouble input.SpecificationsXPIQ-PS AND XPIQ-PSE POWER SUPPLIESAC power:•XPIQ-PS: 120 VAC, 50/60 Hz, 3.5 A.•XPIQ-PSE: 240 VAC, 50/60 Hz, 1.75 A.Batteries or battery-backed-up DC source (secondary source input TB2):•Input voltage range: 20.4 to 28 VDC.•Battery trouble voltage: less than or equal to 22 VDC.•amplifiers): 9.0 A.•Protection (overcurrent, reverse-polarity): 15.0 A automotive minifuse.•24-volt lead-acid battery charger (TB2):•Float charge (battery fully charged): 27.6 VDC.•Maximum charging current: 1.4 A.•Minimum capacity: 12 AH.•Maximum capacity: 25 AH (48-hour charging period), 12 AH (24-hour charging period).XPIQ-MB MOTHERBOARDSpeaker circuits TB1, TB2, TB3, TB4:•Output: Power-limited.•Operation: Class B (Style Y) circuits or Class A (Style Z) with XPIQ-CA converter module.•Field-wiring supervision: continuous (On and Off state).•Nominal ELR value for Style Y: 4.7 K ohms.•Minimum allowed leakage resistance of a speaker circuit (Style Y without ELR or Style Z with wiring disconnected from XPIQ-CA): 45 K ohms.FFT riser/NAC source input TB9:•Maximum allowed FFT/NAC riser voltage: 30 VDC.FFT/NAC circuits TB5, TB6, TB7, TB8:•Ouput: power-limited.•Operation: 4 Class B (Style Y) circuits or 2 Class A (Style Z).•Nominal ELR value for Style Y: 47 K ohms.•Maximum voltage drop @ 2 A on NAC output: 0.5 VDC.•NAC output current: 2.0 A.•Nominal FFT handset DC resistance: 1.2 K ohms.•Minimum allowed leakage resistance of an FFT/NAC zone (Style Y without ELR or Style Z with return wiring discon-nected): 150 K ohms.Background music input TB11:•Input voltage level: 1 Vp (peak voltage).•Input impedance: 75 K ohms.XPIQ-SLI SIGNALING LINE INTERFACE•All screw terminal blocks accept wire up to 12 AWG (3.31 mm²).•Compatible with CLIP and FlashScan® protocols.•Average SLC current: 1.0 mA.•SLC isolation: 500 VDC, limited by transient protection com-ponents to 40 VDC.•Contact rating, local Alarm relay TB11: 2.0 A @ 32 VDC (resistive).•Maximum length of local SLC loop wiring: 2,000 ft. (600 m).•Maximum number of detectors/modules on the local SLC loop output: 64.•Maximum resistance of the local SLC (from any device to the FACP): 50 ohms.XPIQ-AIB4/AIB1 AUDIO INPUT BOARD(4 CHANNEL/1 CHANNEL)•All screw terminal blocks accept wire up to 12 AWG (3.31 mm²).•Nominal input voltage: 3.5 Vp (peak voltage).XPIQ-AA25 AUDIO AMPLIFIER, 25 W•Built-in short-circuit and thermal-shutdown protection.•Nominal (sinusoidal) output voltage: 25 V RMS.•Nominal (sinusoidal) output power: 25 W.•Nominal (sinusoidal) output current: 1.0 A.XPIQ-AA2270 AUDIO AMPLIFIER, 22 W•Built-in short-circuit and thermal-shutdown protection.•Nominal (sinusoidal) output voltage: 70.7 V RMS.•Nominal (sinusoidal) output power: 22 W.•Nominal (sinusoidal) output current: 310 mA.XPIQ-RMI REMOTE MICROPHONE INTERFACE•All screw terminal blocks accept wire up to 12 AWG (3.31 mm²).•Supply output voltage for RM-1(SA) TB2-1 (+24V), TB2-2 (common): 19 – 28 VDC.•Nominal audio level: 2.5 V RMS. Four-Channel XPIQ Distributed Audio Block DiagramCOMBINED CHARACTERISTICS•AMG, XPIQ-AIB4(1), and XPIQ-AA25: frequency response 350 Hz to 6 kHz.•AMG, AA-30, ACT-2, XPIQ-AIB4(1), and XPIQ-AA25: fre-quency response 450 Hz to 3.8 kHz (UL); 400 Hz to 4 kHz (ULC).•RM-1(SA), XPIQ-AIB4(1), and XPIQ-AA25: frequency response 350 Hz to 7 kHz.•RM-1(SA), XPIQ-RMI, and XPIQ-AA25: frequency response 350 Hz to 10 kHz.•Background music input (TB10) and XPIQ-AA25: fre-quency response 250 Hz to 12 kHz.CABINET SPECIFICATIONSThe XPIQ mounts in any standard CAB-4 Series cabinet. Refer to CAB-4 (DN-6857) Series data sheet for specifications.LED IndicatorsLEDs located on XPIQ-MB motherboard:•System Trouble; yellow LED turns on for system-related trouble.•AC Fail; yellow LED turns on when AC is lost (all other non-essential LEDs will turn off to conserve batteries).•Battery Trouble; yellow LED turns on for low or no battery voltage.•Charger Trouble; yellow LED turns on for charger failure.•FFT/NAC Riser Trouble; yellow LED turns on for FFT riser loss.•Telephone Trouble (Circuits 1 – 4); yellow LED for each cir-cuit turns on for wiring trouble.•Speaker Trouble (Circuits 1 – 4); yellow LED for each circuit turns on for wiring trouble.•Speaker Zone On (Circuits 1 – 4); one green LED for each circuit turns on when active.•Earth Fault; yellow LED turns on for ground fault condition. LEDs located on XPIQ-PS power supply:•On Line; green LED turns on to indicate that AC power is applied.•Boost On; green LED turns on during battery tests and when amplifiers are used during AC failure.LEDs located on XPIQ-SLI signaling line interface board:•On Line; green LED turns on to indicate SLC communication presence.•Trouble/Test; yellow LED turns on steady for SLC communi-cation trouble.•7-Segment; displays the range of addresses programmed on the XPIQ-MB.LEDs located on XPIQ-AA25 audio amplifier:•Trouble; yellow LED indicates: Short (overcurrent) (on steady); Gain Test Failed (blinking).•Status; green LED indicates if amplifier is Primary (on steady) or Backup (blinking).LEDs located on XPIQ-AIB1/4 audio input board:•Channel 1 through 4 Trouble; one yellow LED for each channel turns on for channel signal loss trouble.•Channel 1 through 4 On; one green LED for each channel turns on to indicate channel condition: channel is Ready (on steady) or Active (blinking).Controls and SwitchesControls and switches located on XPIQ-MB mother-board:•SW1 Earth Fault Detection; enables or disables the detec-tion of a ground fault.•SW2 Phone Circuits 1 & 2 Wiring Selection; select 2W for two-wire Class B (Style Y) or 4W for four-wire Class A (Style Z) circuit wiring.•SW3 Phone Circuits 3 & 4 Wiring Selection; select 2W for two-wire Class B (Style Y) or 4W for four-wire Class A (Style Z) circuit wiring.•SW4 Music Source Volume Control.•Jumpers JP1 & JP2; used to enable or disable software upgrade for the XPIQ-MB.Controls and switches located on XPIQ-SLI signaling line inter-face board:•SW1 Rotary Switch; used to set ones digit of starting address on the SLC.•SW3 Rotary Switch; used to set tens/hundreds digit of start-ing address on the SLC.•SW2 Push-Button Switch; used to verify addresses on the XPIQ.•Jumpers JP1 & JP2; used to enable or disable downloading programming to the XPIQ-SLI.Architectural/Engineering Specifica-tionsSpecifications of these and all Notifier products are available from Notifier.Ordering InformationXPIQ-MB: Motherboard; required for each XPIQ installation. Mounts in a standard CAB-3/-4 Series cabinet. 5.3 lbs / 2.4 kg XPIQ-PS: Power supply; required for each XPIQ installation. 120 VAC. Mounts in same cabinet as the XPIQ-MB. 2.6 lbs / 1.18 kgXPIQ-PSE: Power supply; 240 VAC version of XPIQ-PS. 2.6 lbs / 1.18 kgXPIQ-SLI: Signaling line interface board; required for each XPIQ installation. data communication interface between the XPIQ-MB and the SLC of an FACP. The XPIQ-SLI uses the standard rotary, decimal addressing switch. The number of addresses utilized by the XPIQ-SLI depends on the number of channels, speaker zones, telephone zones, and other options selected during configuration by the installer. A seven-segment display is used to indicate the address range used. The XPIQ-SLI can be wired in Style 4, 6, or 7. Mounts onto the XPIQ-MB.0.3 lb / 0.14 kgXPIQ-AIB4: Audio interface board; optional four-channel audio input board that receives and processes up to four low-level audio signals for the XPIQ system. XPIQ-AIB4 or XPIQ-AIB1 required when there is an external low-level aud io riser signal input. It is not required for non-voice system operation, in which the XPIQ motherboard generates tones. Mounts onto the XPIQ-MB. 0.4 lb / 0.18 kgXPIQ-AIB1: Audio interface board; same as the XPIQ-AIB4 but receives and processes one low-level audio signal. 0.3 lb / 0.14 kgXPIQ-AA25: Audio amplifier; 25 watts of power at 25 V RMS. One fully supervised and power-limited speaker circuit on the mother-board for each audio amplifier. Up to four XPIQ-AA25s may be mounted on an XPIQ-MB. 1 lb / 0.45 kg Pictured at right. XPIQ-AA2270: Audio amplifier; 22 watts of power at 70.7 V RMS. One fully supervised and power-limited speaker circuit on the motherboard for each audio amplifier. Up to four XPIQ-AA2270s may be mounted on an XPIQ-MB. Compatible with Rev. H and higher of the XPIQ-MB and Rev. C and higher of the XPIQ-CA. 1.5 lbs / 0.68 kg.XPIQ-CA: Class A converter; converts all speaker circuits (up to 4 XPIQ-AA25) from Class B (Style Y) to Class A (Style Z). One XPIQ-CA per XPIQ-MB. 0.2 lb / 0.09 kgNotifier® and FlashScan® are registered trademarks of Honeywell International Inc. Microsoft® and Windows® are registered trademarks of Microsoft Corporation.©2009 by Honeywell International Inc. All rights reserved. Unauthorized use of this document is strictly prohibited.This document is not intended to be used for installation purposes. We try to keep our product information up-to-date and accurate. We cannot cover all specific applications or anticipate all requirements.All specifications are subject to change without notice.For more information, contact Notifier. Phone: (203) 484-7161, FAX: (203) 484-7118.XPIQ-RMI: Remote microphone interface; optional interface board with a connection for the RM-1 or RM-1SA. 0.1 lb / 0.05kgRM-1/RM-1SA: Remote microphone. See RM-1 d ata sheet DN-6728for specifications and ordering information.PK-XPIQ: Programming software for the XPIQ transponder.Includes Windows® 95/98/2000 compatible CD-ROM and pro-gramming cable.CHS-PS: Power supply mounting kit; optional kit used to mount the XPIQ-PS(E) in a location other than the bottom of the CAB-3/-4 Series cabinet (e.g., the second row).CHS-BH: Battery mounting kit; optional kit used to mount the XPIQ batteries in a location other than the bottom of the CAB-3/-4 Series cabinet (e.g., the second row).CAB-4 Series Cabinets: XPIQ can mount in any of the CAB-4Series cabinets. See CAB-4 (DN-6857) Series data sheets for ordering information and specifications.DP-1: Blank dress plate; covers unused cabinet tiers.VP-1: Vent plate, covers open space on top of CAB-4 Series cabinets.BAT Series: Batteries; XPIQ-PS battery charging circuit range is 12 to 26 AH. See BAT Series data sheet DN-6933 ordering information and specifications.Temperature and Humidity RangesThis system meets NFP A requirements for operation at 0 – 49°C/32 – 120°F and at a relative humidity 93% ± 2% RH (noncondensing) at 32°C ± 2°C (90°F ± 3°F). However, the useful life of the system's standby batteries and the electronic components may be adversely affected by extreme tempera-ture ranges and humidity. Therefore, it is recommended that this system and its peripherals be installed in an environment with a normal room temperature of 15 – 27°C/60 – 80°F .Agency Listings and ApprovalsThe listings and approvals below apply to the basic XPIQ. In some cases, certain modules may not be listed by certain approval agencies, or listing may be in process. Consult fac-tory for latest listing status.•UL listed: S635•ULC: S635•FM approved•CSFM: 6911-0028:211•MEA: 317-01-E; 345-02-2; 447-00-E。

科技英语翻译6.1 介词的一般译法第1节翻译练习1In general, man serves as the source of infection while animals act as such only occasionally.An industrial robot shares many attributes in common with a numerical control machine tool.一般来说，人可作为感染源，而动物只是偶然如此。

工业用机器人与数控机床有许多共同的特性。

第1节翻译练习2With non-changeover control both the boiler plant and the chiller plant operate to provide simultaneous heating and cooling throughout the year.The online service delivers substantially more value to our global audience of e-business professionals in the chemical, plastics and allied industries.This device can mimic photosynthesis to produce usable energy from sunlight.采用非转换控制，锅炉设备和制冷装置都在运行，全年可同时供暖和制冷。

该网络服务主要向全球从事化学、塑料及相关工业的专业电子商务用户提供更有价值的服务。

这种装置能够模拟光合作用，利用阳光产生可用的能源。

第1节翻译练习3The longitudinal axis of the turbine generator is perpendicular to the axis of the steam generator. In the right conditions, membranes are self-assembling.Winding of the spring induces residual stresses through bending.汽轮发电机的纵轴与锅炉轴线垂直。

4-IN -15-IN -1AC Hipot,DC Hipot,IR,Ground Bond/Continuity,Functional Run Test and Line Leakage Test6-IN -1OMNIA™SeriesFully-AutomatedMulti-Function Electrical SafetyCompliance AnalyzersU.S. Patent Nos. (6,054,865,6,011,398,5,936,419,5,828,222,5,548,501) Other patents pendingAC Hipot,DC Hipot,InsulationResistance,Ground Bond/Continuity and Functional Run Test AC Hipot,DC Hipot,IR and Ground Bond/Continuity With Optional HV and HC Scanner 800-404-ATEC (2832)E s t a b l i s h e d 1981• Graphic Liquid Crystal Display • Patented Multi-Function Tests • Dual Ground Bond/Ground Continuity TestOPERATOR-FRIENDLY FEATURESManual reset to re-activate after failure detectIndicator light to warn that high voltage is activeHigh current output terminalterminalterminal and data entry switchOption port for:- 8 port scanner board- Run test board - Line Leakage boardinterfaces also available (GPIB shown)connector switch scanning matrix High voltage FRONT PANELBACK PANEL• SmartGFI ™Circuit (Patent Pending )• Single DUT Connection• RS-232, GPIB & Printer Port • Internal (OMNIA 4 Only )& External Scanner MatrixesFEATURES & BENEFITSTHE FIRST PATENTED SAFETY TESTING INSTRUMENTWITH AN ENHANCED GRAPHIC LCD DISPLAYThis provides the operator with complete test setup and results in aneasy-to-use interface which eliminates the need to decipher crypticabbreviations. The graphic display makes testing safer,easier and morereliable than ever before.OMNIA,a complete all-in-one system,combines all of the most commonelectrical safety tests required by safety agencies (AC Hipot,DC Hipot,IR,Ground Bond/Continuity,Line Leakage and Functional Run tests) intoa single instrument which takes up less rack space and enables a singleDUT connection. OMNIA is also available in 4-in-1 and 5-in-1 versionsfor those who do not need to perform all of the above mentioned tests.FEATURE Built-in Cal-Alert™BENEFIT This feature automatically alerts the user when the instrument is due for re-calibration. This eliminates theneed for manual tracking of calibration dates.FEATURE Dual function Ground Bond and Ground Continuity BENEFIT The user can select whether to perform a high current Ground Bond test or a low current Ground Continuity test.The Ground Continuity test can be run independently or itcan be performed simultaneously with the Hipot test. Bothtests can be run through the optional built-in scanner.FEATURE Exclusive SmartGFI™functionBENEFIT The SmartGFI™function provides maximum protection to the user. The circuit monitors the ground configuration ofthe DUT and automatically sets up the GFI circuit for theuser. The circuit detects current between the high voltageoutput and earth ground. If excessive leakage is detected,the high voltage is immediately shut down.FEATURE Optional printer portBENEFIT This option allows direct connection of OMNIA to a printer. The user can select between several different printmodes and all printouts are time and date stamped.FEATURE Built-in Security settingsBENEFIT This allows the instrument to be setup for different levels of access to the setup programs. Users can setup passwordsfor restricted access to certain parts of the menu and theinstruments operation.FEATURE Storage of up to 50 setups with 30 steps per setup BENEFIT A real benefit for manufacturers that test different products. Each setup can store up to 30 steps,which can beconfigured to perform any of the safety tests. Each setupcan be stored and named any combination of alphanumericcharacters so it can be easily identified for recall.FEATURE Exclusive prompt and hold functionBENEFIT OMNIA allows users to setup prompts in the test cycle so that the test can be paused. During the pause a user-configured message is displayed instructing the testoperator on the action they need to perform beforecontinuing the test. This is a very convenient feature forapplications where test leads or probes need to be movedor when DUT switches need to be activated as part of thetest cycle.FEATURE Built-in Real Current measurementBENEFIT OMNIA allows for simultaneous monitoring of Real and Total current in AC Hipot mode. This allows the user tomonitor reactive and real current on a single screen.FEATURE Patented RAMP HI and CHARGE LO testing BENEFIT The RAMP HI feature allows the user to set a higher trip point during the ramp cycle and allows for quickercharging of the DUT without nuisance tripping. Thisincreases throughput which allows for more effective DCHipot testing. The CHARGE LO provides the user with thecapability to ensure that the device under test is connectedcorrectly by detecting a minimum level of current duringthe initial application of voltage to the DUT.FEATURE Built in Veri-Chek™menuBENEFIT Regular verification is required by some agencies to validate that the instrument is functioning correctly. TheVeri-Chek feature,by prompting the user through thecorrect steps,allows for quick and easy validation. This isa built-in feature that eliminates the need and additionalcost of having to use external boxes for verification.FEATURE Digitally controlled arc detection systemBENEFIT Most Hipot testers can detect catastrophic arc conditions because they usually exceed the current trip level. Arcdetection allows the operator to select whether low-levelarcs should be detected and provides the operator withthe ability to digitally select and program multiplesensitivity levels.FEATURE Four wire measurement and milliohm offset BENEFIT The four-wire measurement (Kelvin Method) technique eliminates test lead resistance when using the standard testleads. The milliohm-offset function allows the use oflonger test leads and test fixtures without compromisingtest results in the Ground Bond mode.FEATURE Ramp up and downBENEFIT This feature allows the user to setup the instrument for gradual increase and decrease of test voltage to avoiddamage to DUT’s that are sensitive to rapid changesin voltage.FEATURE True Line Leakage test (OMNIA 6)BENEFIT OMNIA 6 performs all 8 Line Leakage tests as called out in IE C specifications. All measurements can be madewithout using an external isolation transformer. TheOMNIA 6 can also be used to perform Applied Part andEnclosure Leakage tests.SPECIFICATIONSSPECIFICATIONS & OPTIONSOMNIA 5 & 6 FUNCTIONAL RUN TEST MODEThe Industry’s Most Complete Line of Instruments for Electrical SafetyCompliance Testing13860 West Laurel ke Forest,IL 60045-4546Tel:847-367-4077 • Fax:847-367-4080E-mail:*******************For more information visit our web site at:and ORDER ON-LINE!Or contact us toll-free at:1-800-858-TEST (8378)State-Of-The-Art Electrical Safety Compliance Testing Instruments24-HourTurn-Around On All Instrument CalibrationsInformativeIndustry Seminars,Professional Training And Educational Programs Knowledgeable Customer Support And ExpertTechnical Services At 1-800-858-TEST Guaranteed Product Satisfaction And A 5-Year Extended Product Warranty**With Annual Calibration from Associated ResearchLocal Sales Offices Throughout The World To Serve You More EfficientlyFor Over 65 Years,We’ve Provided…At Associated Research, Safety ComplianceTesting Is Our Only Focus!30 Amp Ground Bond tester that works as a stand-alone instrument or can be interconnected to the HypotPLUS ®II to form a semi-automated test system with a single DUT connection.The first Manual Dielectric Withstand Testers with an enhanced graphic LCD for production line safety agency compliance testing. Available in AC,AC/DC and AC/DC/IR versions.The first 30 Amp Ground Bond tester with anenhanced graphic LCD that works as a stand-alone or interconnected to the Hypot III to form a complete mid-range test system with a single DUT connection.The first semi-automated microprocessorcontrolled Dielectric Withstand testers available in AC or AC/DC versions. All models include enhanced PLC control,remote memory recall,advanced failure detection systems. Available optional 10 V analog signal and real current.The 905D functional run test system measures current,voltage,power factor and watts. It can be interconnected to our safety testers so all tests can be performed through a single DUT connection. Available with standard GPIB or RS-232 interface.4-in-1 Electrical Safety Compliance Analyzers include AC/DC Hipot,Insulation Resistance,Ground Bond tester and optional built-in scanner in a single instrument. Complete with IEEE-488(GPIB),RS-232 or printer interface. Available in 500 V A output versions.3-in-1 Dielectric Analyzers with AC,DC or AC/DC Hipot,Insulation Resistance,and built-in scanner available on some models. All models available with either IEEE-488 (GPIB),RS-232 or printer interface. Available in 500 V A output versions.Designed to automate line leakage testing in production line or lab environments. The 510L is a stand-alone system and the 520L can interconnect with other AR safety testers to form a complete automated testing system.The HS-8A is an 8 port scanner and the HS-16 is a 16 port scanner. Both models are high-voltage and high-current matrix scanners for multi-point or multi-product testing. (For use withQUADCHEK ®II,HypotULTRA ®II or OMNIA ™.)SWITCHING MATRIXSoftware designed to store,analyze and retrieve data on automated Associated Researchinstruments,while performing Line Leakage,Insulation Resistance,Dielectric Withstand,Ground Bond and Functional Run tests. Autoware also allows for bar coding inputs and provides basic statistical analysis graphs.Catalog # OMNIA 05/02。

外文原文Response of a reinforced concrete infilled-frame structure to removal of twoadjacent columnsMehrdad Sasani_Northeastern University, 400 Snell Engineering Center, Boston, MA 02115, UnitedStatesReceived 27 June 2007; received in revised form 26 December 2007; accepted 24January 2008Available online 19 March 2008AbstractThe response of Hotel San Diego, a six-story reinforced concrete infilled-frame structure, is evaluated following the simultaneous removal of two adjacent exterior columns. Analytical models of the structure using the Finite Element Method as well as the Applied Element Method are used to calculate global and local deformations. The analytical results show good agreement with experimental data. The structure resisted progressive collapse with a measured maximum vertical displacement of only one quarter of an inch mm). Deformation propagation over the height of the structure and the dynamic load redistribution following the column removal are experimentally and analytically evaluated and described. The difference between axial and flexural wave propagations is discussed. Three-dimensional Vierendeel (frame) action of the transverse and longitudinal frames with the participation of infill walls is identified as the major mechanism for redistribution of loads in the structure. The effects of two potential brittle modes of failure (fracture of beam sections without tensile reinforcement and reinforcing bar pull out) are described. The response of the structure due to additional gravity loads and in the absence of infill walls is analytically evaluated.c 2008 Elsevier Ltd. All rights reserved.Keywords: Progressive collapse; Load redistribution; Load resistance; Dynamic response; Nonlinear analysis; Brittle failure1.IntroductionThe principal scope of specifications is to provide general principles and computational methods in order to verify safet y of structures. The “safety factor ”, which according t o modern trends is independent of the nature and combination of the materials used, can usually be defined as the rati o between the conditions. This ratio is also proportional to the inverse of the probability ( risk ) of failure of th e structure.Failure has to be considered not only as overall collapse o f the structure but also as unserviceability or, according t o a more precise. Common definition. As the reaching of a “limit state ”which causes the construction not to acco mplish the task it was designed for. There are two categori es of limit state :(1)Ultimate limit sate, which corresponds to the highest value of the load-bearing capacity. Examples include local buckli ng or global instability of the structure; failure of some sections and subsequent transformation of the structure intoa mechanism; failure by fatigue; elastic or plastic deformati on or creep that cause a substantial change of the geometry of the structure; and sensitivity of the structure to alte rnating loads, to fire and to explosions.(2)Service limit states, which are functions of the use and durability of the structure. Examples include excessive defo rmations and displacements without instability; early or exces sive cracks; large vibrations; and corrosion.Computational methods used to verify structures with respect to the different safety conditions can be separated into: (1)Deterministic methods, in which the main parameters are co nsidered as nonrandom parameters.(2)Probabilistic methods, in which the main parameters are co nsidered as random parameters.Alternatively, with respect to the different use of factors of safety, computational methods can be separated into:(1)Allowable stress method, in which the stresses computed un der maximum loads are compared with the strength of the mat erial reduced by given safety factors.(2)Limit states method, in which the structure may be propor tioned on the basis of its maximum strength. This strength, as determined by rational analysis, shall not be less than that required to support a factored load equal to the sum of the factored live load and dead load ( ultimate state ).The stresses corresponding to working ( service ) conditions with unfactored live and dead loads are compared with pres cribed values ( service limit state ) . From the four poss ible combinations of the first two and second two methods, we can obtain some useful computational methods. Generally, t wo combinations prevail:(1)deterministic methods, which make use of allowable stresses . (2)Probabilistic methods, which make use of limit states. The main advantage of probabilistic approaches is that, at l east in theory, it is possible to scientifically take into account all random factors of safety, which are then combine d to define the safety factor. probabilistic approaches depend upon :(1) Random distribution of strength of materials with respect to the conditions of fabrication and erection ( scatter of the values of mechanical properties through out the structu re ); (2) Uncertainty of the geometry of the cross-section sand of the structure ( faults and imperfections due to fab rication and erection of the structure );(3) Uncertainty of the predicted live loads and dead loads acting on the structure; (4)Uncertainty related to the approx imation of the computational method used ( deviation of the actual stresses from computed stresses ). Furthermore, proba bilistic theories mean that the allowable risk can be based on several factors, such as :(1) Importance of the construction and gravity of the damage by its failure; (2)Number of human lives which can be thr eatened by this failure; (3)Possibility and/or likelihood of repairing the structure; (4) Predicted life of the structure. All these factors are related to economic and social consi derations such as：(1) Initial cost of the construction;(2) Amortization funds for the duration of the construction;(3) Cost of physical and material damage due to the failure of the construction;(4) Adverse impact on society;(5) Moral and psychological views.The definition of all these parameters, for a given saf ety factor, allows construction at the optimum cost. However, the difficulty of carrying out a complete probabilistic ana lysis has to be taken into account. For such an analysis t he laws of the distribution of the live load and its induc ed stresses, of the scatter of mechanical properties of mate rials, and of the geometry of the cross-sections and the st ructure have to be known. Furthermore, it is difficult to i nterpret the interaction between the law of distribution of strength and that of stresses because both depend upon the nature of the material, on the cross-sections and upon the load acting on the structure. These practical difficulties ca n be overcome in two ways. The first is to apply different safety factors to the material and to the loads, without necessarily adopting the probabilistic criterion. The second i s an approximate probabilistic method which introduces some s implifying assumptions ( semi-probabilistic methods ) . Aspart of mitigation programs to reduce the likelihood of mass casualties following local damage in structures, the General Services Administration [1] and the Department of Defense [2] developed regulations to evaluate progressive collapse resistance of structures. ASCE/SEI 7 [3] defines progressive collapse as the spread of an initial local failure fromelement to element eventually resulting in collapse of an entire structure or a disproportionately large part of it. Following the approaches proposed by Ellinwood and Leyendecker [4], ASCE/SEI 7 [3] defines two general methods for structural design of buildings to mitigate damage due to progressive collapse: indirect and direct design methods. General building codes and standards [3,5] use indirect design by increasing overall integrity of structures. Indirect design is also used in DOD [2]. Although the indirect design method can reduce the risk of progressive collapse [6,7] estimation of post-failure performance of structures designed based on such a method is not readily possible. One approach based on direct design methods to evaluate progressive collapse of structures is to study the effects of instantaneous removal of load-bearing elements, such as columns. GSA [1] and DOD [2] regulations require removal of one load bearing element. These regulations are meant to evaluate general integrity of structures and their capacity of redistributing the loads following severe damage to only one element. While such an approach provides insight as to the extent to which the structures are susceptible to progressive collapse, in reality, the initial damage can affect more than just one column. In this study, using analytical results that are verified against experimental data, the progressive collapse resistance of the Hotel San Diego is evaluated, following the simultaneous explosion (sudden removal) of two adjacent columns, one of which was a corner column. In order to explode the columns, explosives were inserted into predrilled holes in the columns. The columns were then well wrapped with a few layers of protective materials. Therefore, neither air blast nor flying fragments affected the structure.2. Building characteristicsHotel San Diego was constructed in 1914 with a south annex added in 1924. The annex included two separate buildings. Fig. 1 shows a south view of the hotel. Note that in the picture, the first and third stories of the hotel are covered with black fabric. The six story hotel had a non-ductile reinforced concrete (RC) frame structure with hollow clay tile exterior infill walls. The infills in the annex consisted of two withes (layers) of clay tiles with a total thickness of about 8 in (203 mm). The height of the first floor was about 190–800 m). The height of other floors and that of the top floor were 100–600 m) and 160–1000 m), respectively. Fig. 2 shows the second floor of one of the annex buildings. Fig. 3 shows a typical plan of this building, whose responsefollowing the simultaneous removal (explosion) of columns A2 and A3 in the first (ground) floor is evaluated in this paper. The floor system consisted of one-way joists running in the longitudinal direction (North–South), as shown in Fig. 3. Based on compression tests of two concrete samples, the average concrete compressive strength was estimated at about 4500 psi (31 MPa) for a standard concrete cylinder. The modulus of elasticity of concrete was estimated at 3820 ksi (26 300 MPa) [5]. Also, based on tension tests of two steel samples having 1/2 in mm) square sections, the yield and ultimate tensile strengths were found to be 62 ksi (427 MPa) and 87 ksi (600 MPa), respectively. The steel ultimate tensile strain was measured at . The modulus of elasticity of steel was set equal to 29 000 ksi (200 000 MPa). The building was scheduled to be demolished by implosion. As part of the demolition process, the infill walls were removed from the first and third floors. There was no live load in the building. All nonstructural elements including partitions, plumbing, and furniture were removed prior to implosion. Only beams, columns, joist floor and infill walls on the peripheral beams were present.3. SensorsConcrete and steel strain gages were used to measure changes in strains of beams and columns. Linear potentiometers were used to measure global and local deformations. The concrete strain gages were in (90 mm) long having a maximum strain limit of ±. The steel strain gages could measure up to a strain of ±. The strain gages could operate up to a several hundred kHz sampling rate. The sampling rate used in the experiment was 1000 Hz. Potentiometers were used to capture rotation (integral of curvature over a length) of the beam end regions and global displacementin the building, as described later. The potentiometers had a resolution of about in mm) and a maximum operational speed of about 40 in/s m/s), while the maximum recorded speed in the experiment was about 14 in/sm/s).4. Finite element modelUsing the finite element method (FEM), a model of the building was developed in the SAP2000 [8] computer program. The beams and columns are modeled with Bernoulli beam elements. Beams have T or L sections with effective flange width on each side of the web equal to four times the slab thickness [5]. Plastic hinges are assigned to all possible locations where steel bar yielding can occur, including the ends of elements as well as the reinforcing bar cut-off and bend locations. The characteristics of the plastic hinges are obtained using section analysesof the beams and columns and assuming a plastic hinge length equal to half of the section depth. The current version of SAP2000 [8] is not able to track formation of cracks in the elements. In order to find the proper flexural stiffness of sections, an iterative procedure is used as follows. First, the building is analyzed assuming all elements are uncracked. Then, moment demands in the elements are compared with their cracking bending moments, Mcr . The moment of inertia of beam and slab segments are reduced by a coefficient of [5], where the demand exceeds the Mcr. The exterior beam cracking bending moments under negative and positive moments, are 516 k in kN m) and 336 k in kN m), respectively. Note that no cracks were formed in the columns. Then the building is reanalyzed and moment diagrams are re-evaluated. This procedure is repeated until all of the cracked regions are properly identified and modeled.The beams in the building did not have top reinforcing bars except at the end regions (see Fig. 4). For instance, no top reinforcement was provided beyond the bend in beam A1–A2, 12 inches away from the face of column A1 (see Figs. 4 and 5). To model the potential loss of flexural strength in those sections, localized crack hinges were assigned at the critical locations where no top rebar was present. Flexural strengths of the hinges were set equal to Mcr. Such sections were assumed to lose their flexural strength when the imposed bending moments reached Mcr.The floor system consisted of joists in the longitudinal direction (North–South). Fig. 6 shows the cross section of a typical floor. In order to account for potential nonlinear response of slabs and joists, floors are molded by beam elements. Joists are modeled with T-sections, having effective flange width on each side of the web equal to four times the slab thickness [5]. Given the large joist spacing between axes 2 and 3, two rectangular beam elements with 20-inch wide sections are used between the joist and the longitudinal beams of axes 2 and 3 to model the slab in the longitudinal direction. To model the behavior of the slab in the transverse direction, equally spaced parallel beams with 20-inch wide rectangular sections are used. There is a difference between the shear flow in the slab and that in the beam elements with rectangular sections modeling the slab. Because of this, the torsional stiffness is setequal to one-half of that of the gross sections [9].The building had infill walls on 2nd, 4th, 5th and 6th floors on the spandrel beams with some openings . windows and doors). As mentioned before and as part of the demolition procedure, the infill walls in the 1st and 3rd floors were removed before the test. The infill walls were made of hollow clay tiles, which were in good condition. The net area of the clay tiles was about 1/2 of the gross area. The in-plane action of the infill walls contributes to the building stiffness and strength and affects the building response. Ignoring the effects of the infill walls and excluding them in the model would result in underestimating the building stiffness and strength.Using the SAP2000 computer program [8], two types of modeling for the infills are considered in this study: one uses two dimensional shell elements (Model A) and the other uses compressive struts (Model B) as suggested in FEMA356 [10] guidelines.. Model A (infills modeled by shell elements)Infill walls are modeled with shell elements. However, the current version of the SAP2000 computer program includes only linear shell elements and cannot account for cracking. The tensile strength of the infill walls is set equal to 26 psi, with a modulus of elasticity of 644 ksi [10]. Because the formation ofcracks has a significant effect on the stiffness of the infill walls, the following iterative procedure is used to account for crack formation:(1) Assuming the infill walls are linear and uncracked, a nonlinear time history analysis is run. Note that plastic hinges exist in the beam elements and the segments of the beam elements where moment demand exceeds the cracking moment have a reduced moment of inertia.(2) The cracking pattern in the infill wall is determined by comparingstresses in the shells developed during the analysis with the tensile strength of infills.(3) Nodes are separated at the locations where tensile stress exceeds tensile strength. These steps are continued until the crack regions are properly modeled.. Model B (infills modeled by struts)Infill walls are replaced with compressive struts as described in FEMA 356 [10] guidelines. Orientations of the struts are determined from the deformed shape of the structure after column removal and the location of openings.. Column removalRemoval of the columns is simulated with the following procedure. (1) The structure is analyzed under the permanent loads and the internal forces are determined at the ends of the columns, which will be removed.(2) The model is modified by removing columns A2 and A3 on the first floor. Again the structure is statically analyzed under permanent loads. In this case, the internal forces at the ends of removed columns found in the first step are applied externally to the structure along with permanent loads. Note that the results of this analysis are identical to those of step 1.(3) The equal and opposite column end forces that were applied in the second step are dynamically imposed on the ends of the removed column within one millisecond [11] to simulate the removal of the columns, and dynamic analysis is conducted.. Comparison of analytical and experimental resultsThe maximum calculated vertical displacement of the building occurs at joint A3 in the second floor. Fig. 7 shows the experimental andanalytical (Model A) vertical displacements of this joint (the AEM results will be discussed in the next section). Experimental data is obtained using the recordings of three potentiometers attached to joint A3 on one of their ends, and to the ground on the other ends. The peak displacements obtained experimentally and analytically (Model A) are in mm) and in mm), respectively, which differ only by about 4%. The experimental and analytical times corresponding to peak displacement are s and s, respectively. The analytical results show a permanent displacement of about in mm), which is about 14% smaller than the corresponding experimental value of in mm).Fig. 8 compares vertical displacement histories of joint A3 in the second floor estimated analytically based on Models A and B. As can be seen, modeling infills with struts (Model B) results in a maximum vertical displacement of joint A3 equal to about in mm), which is approximately 80% larger than the value obtained from Model A. Note that the results obtained from Model A are in close agreement with experimental results (see Fig. 7), while Model B significantly overestimates the deformation of the structure. If the maximum vertical displacement were larger, the infill walls were more severely cracked and the struts were more completely formed, the difference between the results of the two models (Models A and B) would be smaller.Fig. 9 compares the experimental and analytical (Model A) displacement of joint A2 in the second floor. Again, while the first peak vertical displacement obtained experimentally and analytically are in good agreement, the analytical permanent displacement under estimates the experimental value.Analytically estimated deformed shapes of the structure at the maximumvertical displacement based on Model A are shown in Fig. 10 with a magnification factor of 200. The experimentally measured deformed shape over the end regions of beams A1–A2 and A3–B3 in the second floorare represented in the figure by solid lines. A total of 14 potentiometers were located at the top and bottom of the end regions of the second floor beams A1–A2 and A3–B3, which were the most critical elements in load redistribution. The beam top and corresponding bottom potentiometerrecordings were used to calculate rotation between the sections where the potentiometer ends were connected. This was done by first finding the difference between the recorded deformations at the top and bottom of the beam, and then dividing the value by the distance (along the height of the beam section) between the two potentiometers. The expected deformed shapes between the measured end regions of the second floor beams are shown by dashed lines. As can be seen in the figures, analytically estimated deformed shapes of the beams are in good agreement with experimentally obtained deformed shapes.Analytical results of Model A show that only two plastic hinges are formed indicating rebar yielding. Also, four sections that did not have negative (top) reinforcement, reached cracking moment capacities and therefore cracked. Fig. 10 shows the locations of all the formed plastic hinges and cracks.。

DAT ASHEETNI 92374 AI, ±25 mV/V, 24 Bit, 50 kS/s/ch Simultaneous, Bridge Completion• 4 channels, 50 kS/s per channel simultaneous AI•±25 mV/V input range, 24-bit resolution•Programmable half- and full-bridge completionwith up to 10 V internal excitation•60 VDC, Category I bank isolation•RJ50 or D-SUB connectivity options•-40 °C to 70 °C operating range, 5 g vibration,50 g shockThe NI 9237 simultaneous bridge module for use with CompactDAQ and CompactRIO contains all the signal conditioning required to power and measure up to four bridge-based sensors simultaneously. The four RJ50 jacks provide direct connectivity to most torque or load cells and offer custom cable solutions with minimal tools. The high sampling rate and bandwidth of the NI 9237 offer a high-quality, high-speed strain or load measurement system with zero interchannel phase delay. With 60 VDC isolation and 1,000 Vrms transient isolation, the NI 9237 has high-common-mode noise rejection and increased safety for both the operator and test system.The NI 9237 can perform offset/null as well as shunt calibration and remote sense, making the module the best choice for strain and bridge measurements.The NI 9944 and NI 9945 are accessories for use with quarter-bridge sensors. These accessories have a female RJ50 connector on one end and screw terminals on the other end.C SERIES SIMULTANEOUS BRIDGE MODULE COMPARISONModel ChannelsSample Rate Resolution Connectivity Simultaneous Supported Bridges NI 9218NI 9219NI 9235NI 9236NI 923751.2 kS/s/ch 100 S/s/ch 10 kS/s/ch 10 kS/s/ch 50 kS/s/ch24 bits 24 bits 24 bits 24 bits 24 bitsQuarter, Half, Full Quarter, Half, Full 120 Ω Quarter Bridge 350 Ω Quarter Bridge Quarter, Half, FullLEMO,9-pin DSUB Spring Terminal Spring T erminal Spring T erminal RJ-50,DSUB24884NI C Series OverviewNI provides more than 100 C Series modules for measurement, control, and communication applications. C Series modules can connect to any sensor or bus and allow for high-accuracy measurements that meet the demands of advanced data acquisition and control applications.•Measurement-specific signal conditioning that connects to an array of sensors and signals •Isolation options such as bank-to-bank, channel-to-channel, and channel-to-earth ground •-40 °C to 70 °C temperature range to meet a variety of application and environmentalneeds •Hot-swappable The majority of C Series modules are supported in both CompactRIO and CompactDAQ platforms and you can move modules from one platform to the other with no modification.2 | | NI 9237 DatasheetCompactRIOCompactRIO combines an open-embedded architecturewith small size, extreme ruggedness, and C Seriesmodules in a platform powered by the NI LabVIEWreconfigurable I/O (RIO) architecture. Each systemcontains an FPGA for custom timing, triggering, andprocessing with a wide array of available modular I/O tomeet any embedded application requirement. CompactDAQCompactDAQ is a portable, rugged data acquisition platformthat integrates connectivity, data acquisition, and signalconditioning into modular I/O for directly interfacing to anysensor or signal. Using CompactDAQ with LabVIEW, youcan easily customize how you acquire, analyze, visualize,and manage your measurement data.SoftwareLabVIEW Professional Development System for Windows•Use advanced software tools for large project development•Generate code automatically using DAQ Assistant and InstrumentI/O Assistant•Use advanced measurement analysis and digital signal processing•Take advantage of open connectivity with DLLs, ActiveX,and .NET objects•Build DLLs, executables, and MSI installersNI LabVIEW FPGA Module•Design FPGA applications for NI RIO hardware•Program with the same graphical environment used for desktop andreal-time applications•Execute control algorithms with loop rates up to 300 MHz•Implement custom timing and triggering logic, digital protocols, andDSP algorithms•Incorporate existing HDL code and third-party IP including Xilinx IPgenerator functions•Purchase as part of the LabVIEW Embedded Control and MonitoringSuiteNI 9237 Datasheet| © National Instruments| 3NI LabVIEW Real-Time Module•Design deterministic real-time applications with LabVIEWgraphical programming•Download to dedicated NI or third-party hardware for reliableexecution and a wide selection of I/O•Take advantage of built-in PID control, signal processing, andanalysis functions•Automatically take advantage of multicore CPUs or setprocessor affinity manually•Take advantage of real-time OS, development and debuggingsupport, and board support•Purchase individually or as part of a LabVIEW suiteCircuitryEach channel on the NI 9237 has an independent 24-bit ADC and an input amplifier that enable you to sample signals from all four channels simultaneously.The NI 9237 is isolated from earth ground. However, the individual channels are not isolated from each other. The EX+, EX-, and T- signals are common among all channels. You can connect the NI 9237 to a device that is biased at any voltage within the NI 9237 rejection range of earth ground.Figure 1. Input Circuitry for One Channel of the NI 9237Connection Options to Correct for Resistance Errors Wiring resistance can create errors in bridge circuits. The NI 9237 provides two mechanisms to correct for these errors: remote sensing and shunt calibration.Remote SensingRemote sensing continuously and automatically corrects for errors in excitation leads, and generally is most appropriate for half- and full-bridge sensors.Long wire and small gauge wire have greater resistance, which can result in gain error. The resistance in the wires that connect the excitation voltage to the bridge causes a voltage drop, 4| | NI 9237 Datasheetwhich is a source of gain error. The NI 9237 includes remote sensing to compensate for this gain error. Connect remote sense wires to the points where the excitation voltage wires connect to the bridge circuit. Refer to the following figure for an illustration of how to connect remote sense wires to the NI 9237.Figure 2. Connecting Remote Sense Wires to the NI 9237RRThe actual bridge excitation voltage is smaller than the voltage at the EX+ and EX- leads. If you do not use remote sensing of the actual bridge voltage, the resulting gain error is:BB BBB for half‐bridge sensors and2⋅BBBBB for full‐bridge sensors.If you connect the remote sense signals directly to the bridge resistors, the NI 9237 senses the actual bridge voltage and eliminates the gain errors caused by the resistance of the EX+ and EX- leads.Shunt CalibrationShunt calibration can correct for errors from the resistance of both the excitation wiring and wiring in the individual resistors of the bridge. Remote sensing corrects for resistances from the EX pins on the NI 9237 to the sensor, and shunt calibration corrects for these errors and for errors caused by wire resistance within an arm of the bridge. Shunt calibration is most useful with quarter-bridge sensors because there may be significant resistance in the wiring to the active resistor in the bridge.The NI 9237 shunt calibration circuitry consists of a precision resistor and a software-controlled switch. Refer to the software help for information about enabling the shunt calibration switch for the NI 9237.Shunt calibration involves simulating the input of strain by changing the resistance of an arm in the bridge by some known amount. This is accomplished by shunting, or connecting, a large resistor of known value across one arm of the bridge, creating a known strain-induced change in resistance. You can then measure the output of the bridge and compare it to the expected voltage value. You can use the results to correct gain errors in the entire measurement path, or to simply verify general operation to gain confidence in the setup.NI 9237 Datasheet| © National Instruments| 5Use a stable signal, which is typically the unloaded state of the sensor, first with the shunt calibration switch off and then again with the switch on. The difference in these two measurements provides an indication of the gain errors from wiring resistances. You can design the software application to correct subsequent readings for this gain error.Excitation VoltagesYou can program the NI 9237 to supply 2.5 V , 3.3 V , 5 V , or 10 V of excitation voltage. Themaximum excitation power for internal excitation is 150 mW.Note Unless you supply external excitation voltage, NI recommends that you setthe excitation voltage to a value that keeps the total power below 150 mW. The NI 9237 automatically reduces internal excitation voltages as needed to stay below 150 mW total power.Use the following equation to calculate the power of a single bridge:=B 2where R is the total resistance of the bridge.For a quarter or half bridge, R is equal to two times the resistance of each element. For a full bridge, R is equal to the resistance of each element.The 150 mW limit allows you to power half and full bridges as follows:•Four 350 Ω half bridges at 5.0 V •Four 350 Ω full bridges at 3.3 V •Four 120 Ω half bridges at 2.5 VExternal ExcitationYou can connect an external excitation voltage source to the NI 9237 if you need an excitation voltage that causes more than 150 mW to dissipate across all the bridges.Figure 3. Connecting an External Excitation Voltage Source to the NI 9237External Excitation VoltageSourceExternal Excitation Voltage SourceNote For the NI 9237 with RJ-50, use the two EX+ and EX- terminals on the four-terminal external excitation voltage connector to connect one external excitation source.You can use the additional EX+ and EX- terminals on the connector to wire multiple NI 9237modules together in a daisy chain.6 | | NI 9237 DatasheetFilteringThe NI 9237 uses a combination of analog and digital filtering to provide an accurate representation of in-band signals and reject out-of-band signals. The filters discriminatebetween signals based on the frequency range, or bandwidth, of the signal. The three important bandwidths to consider are the passband, the stopband, and the anti-imaging bandwidth.The NI 9237 represents signals within the passband, as quantified primarily by passband ripple and phase nonlinearity. All signals that appear in the alias-free bandwidth are either unaliased signals or signals that have been filtered by at least the amount of the stopband rejection.PassbandThe signals within the passband have frequency-dependent gain or attenuation. The small amount of variation in gain with respect to frequency is called the passband flatness. Thedigital filters of the NI 9237 adjust the frequency range of the passband to match the data rate.Therefore, the amount of gain or attenuation at a given frequency depends on the data rate.Figure 4. Typical Passband Flatness for the NI 9237Frequency/Data Rate0.50.40.0250.000–0.025–0.0500.30.20.10G a i n (d B)StopbandThe filter significantly attenuates all signals above the stopband frequency. The primary goal of the filter is to prevent aliasing. Therefore, the stopband frequency scales precisely with the data rate. The stopband rejection is the minimum amount of attenuation applied by the filter to all signals with frequencies within the stopband.Alias-Free BandwidthAny signals that appear in the alias-free bandwidth are not aliased artifacts of signals at a higher frequency. The alias-free bandwidth is defined by the ability of the filter to reject frequencies above the stopband frequency. The alias-free bandwidth is equal to the data rate minus the stopband frequency.NI 9237 Datasheet | © National Instruments | 7Data RatesThe frequency of a master timebase (f M) controls the data rate (f s) of the NI 9237. The NI 9237 includes an internal master timebase with a frequency of 12.8 MHz, but the module also can accept an external master timebase or export its own master timebase. To synchronize the data rate of an NI 9237 with other modules that use master timebases to control sampling, all of the modules must share a single master timebase source.The following equation provides the available data rates of the NI 9237:=÷256where n is any integer from 1 to 31.However, the data rate must remain within the appropriate data rate range. When using the internal master timebase of 12.8 MHz, the result is data rates of 50 kS/s, 25 kS/s, 16.667 kS/s, and so on down to 1.613 kS/s depending on the value of n. When using an external timebase with a frequency other than 12.8 MHz, the NI 9237 has a different set of data rates.Note The NI 9151 R Series Expansion chassis does not support sharing timebasesbetween modules.NI 9237 SpecificationsThe following specifications are typical for the range -40 °C to 70 °C unless otherwise noted.Caution Do not operate the NI 9237 in a manner not specified in this document.Product misuse can result in a hazard. You can compromise the safety protectionbuilt into the product if the product is damaged in any way. If the product isdamaged, return it to NI for repair.Input CharacteristicsNumber of channels 4 analog input channelsBridge completionHalf and Full InternalQuarter ExternalADC resolution24 bitsType of ADC Delta-Sigma (with analog prefiltering) Sampling mode Simultaneous8| | NI 9237 DatasheetInternal master timebase (ƒM)Frequency12.8 MHzAccuracy±100 ppm maximumData rate range (ƒs) using internal master timebaseMinimum 1.613 kS/sMaximum50 kS/sData rate range (ƒs) using external master timebaseMinimum391 S/sMaximum51.36 kS/sData rates (ƒs)(ƒM ÷ 256) ÷ n, where n = 1, 2, …, 31 Typical input range±25 mV/VScaling coefficient 2.9802 nV/V per LSBOvervoltage protection between any two pins±30 VGain drift10 ppm/°C maximumOffset drift2.5 V excitation0.6 µV/V per °C3.3 V excitation0.5 µV/V per °C5 V excitation0.3 µV/V per °C10 V excitation0.2 µV/V per °C1Before offset null or shunt calibration.2Applies at a data rate of 50 kS/s. Lower data rates can have up to 0.20% of reading additional gain error.3Range equals 25 mV/V.4Uncalibrated accuracy refers to the accuracy achieved when acquiring data in raw or unscaledmodes and in which calibration constants that are stored in the module are not applied to the data.NI 9237 Datasheet| © National Instruments| 9Half-bridge completionTolerance±1200 µV/V maximumDrift 1.5 µV/V per °CTable 2. Channel-to-Channel Matching (Calibrated)Phase nonlinearityƒin = 0 to 1 kHz<0.001°ƒin = 0 to 20 kHz±0.1°Input delay(40 + 5/512)/ƒs + 4.5 µs PassbandFrequency0.45 · ƒsFlatness0.1 dB maximum StopbandFrequency0.55 · ƒsRejection100 dBAlias-free bandwidth0.45 · ƒsOversample rate64 · ƒsRejection at oversample rate5ƒs = 10 kS/s60 dB @ 640 kHzƒs = 50 kS/s*********** Common-mode voltage,all signals to earth ground±60 VDCCommon-mode voltage range, with respect to EX-±1 V from the midpoint of the excitation voltage5Rejection by analog prefilter of signal frequencies at oversample rate. 10| | NI 9237 DatasheetCMRRRelative to earth ground6 (ƒin = 0 to 60140 dBHz)Relative to EX– (ƒin = 0 to 1 kHz)85 dBSFDR (1 kHz, –60 dBFS)115 dBTotal Harmonic Distortion (THD)1 kHz, –20 dBFS–95 dB8 kHz, –20 dBFS–95 dBExcitation noise100 µVrmsCrosstalk (not including cable effects)ƒin = 1 kHz110 dBƒin = 10 kHz100 dBExcitationInternal voltage 2.5 V, 3.3 V, 5.0 V, 10.0 VInternal power150 mW maximumExternal voltage 2 V to 10 VShunt calibrationResistance100 kΩ6Measured with a balanced cable on the NI 9237 with RJ-50 and with no cable on theNI 9237 with DSUB. Shielded cables that are not twisted-pair may be significantly unbalanced, which can impact CMRR performance. To improve the balance of shielded cables, NI recommends twisting together the AI+/AI– pair, the RS+/RS– pair, and the EX+/EX– pair.NI 9237 Datasheet| © National Instruments| 11Resistor accuracy25 °C±110 Ω– 40 °C to 70 °C±200 ΩMTBFNI 9237 with RJ-50603,359 hours at 25 °C; Bellcore Issue 2,Method 1, Case 3, Limited Part Stress Method NI 9237 with DSUB704,148 hours at 25 °C; Bellcore Issue 2,Method 1, Case 3, Limited Part Stress Method Power RequirementsPower consumption from chassisActive mode740 mW maximumSleep mode25 µW maximumThermal dissipation (at 70 °C)Active mode740 mW maximumSleep mode25 µW maximumPhysical CharacteristicsTip For two-dimensional drawings and three-dimensional models of the C Seriesmodule and connectors, visit /dimensions and search by module number.Connect only voltages that are within the following limits.Between any two pins±30 V maximumIsolation, channel-to-channel NoneIsolation, channel-to-earth groundUp to 3,000 mContinuous60 VDC, Measurement Category IWithstand1,000 Vrms, verified by a 5 s dielectricwithstand testUp to 5,000 mContinuous60 VDC, Measurement Category IWithstand860 Vrms, verified by a 5 s dielectricwithstand test12| | NI 9237 DatasheetMeasurement Category I is for measurements performed on circuits not directly connected to the electrical distribution system referred to as MAINS voltage. MAINS is a hazardous live electrical supply system that powers equipment. This category is for measurements of voltages from specially protected secondary circuits. Such voltage measurements include signal levels, special equipment, limited-energy parts of equipment, circuits powered by regulated low-voltage sources, and electronics.Caution Do not connect the NI 9237 to signals or use for measurements withinMeasurement Categories II, III, or IV.Note Measurement Categories CAT I and CAT O are equivalent. These test andmeasurement circuits are not intended for direct connection to the MAINS buildinginstallations of Measurement Categories CAT II, CAT III, or CAT IV. Hazardous LocationsU.S. (UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, AEx nA IIC T4Canada (C-UL)Class I, Division 2, Groups A, B, C, D, T4;Class I, Zone 2, Ex nA IIC T4Europe (ATEX) and International (IECEx)Ex nA IIC T4 GcSafety and Hazardous Locations StandardsThis product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1, CSA 61010-1•EN 60079-0:2012, EN 60079-15:2010•IEC 60079-0: Ed 6, IEC 60079-15; Ed 4•UL 60079-0; Ed 5, UL 60079-15; Ed 3•CSA 60079-0:2011, CSA 60079-15:2012Note For UL and other safety certifications, refer to the product label or the OnlineProduct Certification section.Electromagnetic CompatibilityThis product meets the requirements of the following EMC standards for sensitive electrical equipment for measurement, control, and laboratory use:•EN 61326-2-1 (IEC 61326-2-1): Class A emissions; Industrial immunity•EN 55011 (CISPR 11): Group 1, Class A emissions•AS/NZS CISPR 11: Group 1, Class A emissionsNI 9237 Datasheet| © National Instruments| 13•FCC 47 CFR Part 15B: Class A emissions•ICES-001: Class A emissionsNote In the United States (per FCC 47 CFR), Class A equipment is intended foruse in commercial, light-industrial, and heavy-industrial locations. In Europe,Canada, Australia and New Zealand (per CISPR 11) Class A equipment is intendedfor use only in heavy-industrial locations.Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medicalequipment that does not intentionally generate radio frequency energy for thetreatment of material or inspection/analysis purposes.Note For EMC declarations and certifications, and additional information, refer tothe Online Product Certification section.CE ComplianceThis product meets the essential requirements of applicable European Directives, as follows:•2014/35/EU; Low-V oltage Directive (safety)•2014/30/EU; Electromagnetic Compatibility Directive (EMC)•94/9/EC; Potentially Explosive Atmospheres (ATEX)Online Product CertificationRefer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit / certification, search by model number or product line, and click the appropriate link in the Certification column.Shock and VibrationTo meet these specifications, you must panel mount the system.Operating vibrationRandom (IEC 60068-2-64) 5 g rms, 10 Hz to 500 HzSinusoidal (IEC 60068-2-6) 5 g, 10 Hz to 500 HzOperating shock (IEC 60068-2-27)30 g, 11 ms half sine; 50 g, 3 ms half sine;18 shocks at 6 orientations14| | NI 9237 DatasheetEnvironmentalRefer to the manual for the chassis you are using for more information about meeting these specifications.Operating temperature-40 °C to 70 °C(IEC 60068-2-1, IEC 60068-2-2)-40 °C to 85 °CStorage temperature(IEC 60068-2-1, IEC 60068-2-2)Ingress ProtectionNI 9237 with RJ-50IP30NI 9237 with DSUB IP40Operating humidity (IEC 60068-2-78)10% RH to 90% RH, noncondensing Storage humidity (IEC 60068-2-78)5% RH to 95% RH, noncondensing Pollution Degree2Maximum altitude5,000 mIndoor use only.Environmental ManagementNI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.For additional environmental information, refer to the Minimize Our Environmental Impact web page at /environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.Waste Electrical and Electronic Equipment (WEEE) EU Customers At the end of the product life cycle, all NI products must bedisposed of according to local laws and regulations. For more information abouthow to recycle NI products in your region, visit /environment/weee.电子信息产品污染控制管理办法（中国RoHS）中国客户National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。

reactive flash sintering method Reactive Flash Sintering Method: Revolutionizing Material ProcessingIntroduction:In recent decades, there has been significant progress in materials science and engineering that has allowed us to develop new and improved materials for various applications. One such innovation is the reactive flash sintering method, which has emerged as a promising technique for fabricating advanced materials with enhanced properties. This article aims to provide a comprehensive understanding of the reactive flash sintering method by discussing its principle, process, advantages, and potential applications.I. Principle of Reactive Flash Sintering:Reactive flash sintering is a novel technique that combines the principles of conventional flash sintering and reactive sintering. In flash sintering, a high electric field is applied to a material powder, causing rapid and uniform heating due to Joule heating. On the other hand, reactive sintering involves the reaction between two or more materials during the sintering process, resulting in the formation of a new phase and improved properties. In the reactiveflash sintering method, these two processes are integrated, allowing for simultaneous densification and in-situ reaction to occur.II. Process of Reactive Flash Sintering:The reactive flash sintering process consists of several steps, which are as follows:1. Material Preparation:The starting materials, typically in powder form, are carefully selected and mixed to achieve the desired composition and properties. The mixture may contain reactive components that will undergo a chemical reaction during sintering.2. Loading:The prepared powder mixture is loaded into a specially designed graphite die, which acts as both the heating element and the electrical contact.3. Application of Pressure and Electric Field:Pressure is applied to ensure proper contact between the powder particles and enhance densification. Simultaneously, a high electricfield is applied to the die, generating a strong electric current through the powder bed.4. Electrothermal Heating:The electric current passing through the graphite die generates Joule heating within the powder bed, rapidly raising its temperature. The resistance of the graphite die provides uniform heating throughout the sample.5. Reaction and Densification:As the temperature of the powder mixture increases, chemical reactions between the reactive components take place. These reactions can result in the formation of new phases, crystal growth, and enhanced properties. Additionally, the high temperature and applied pressure promote particle rearrangement and densification.6. Cooling and Post-processing:Once the desired reaction and densification are achieved, the electric field and pressure are removed, and the sample is cooled. Further post-processing steps, such as shaping, polishing, or heat treatment, can be performed as needed.III. Advantages of Reactive Flash Sintering:The reactive flash sintering method offers several advantages over conventional sintering techniques:1. Rapid Processing:Reactive flash sintering allows for significantly shorter processing times compared to traditional methods. The application of a high electric field results in rapid heating, enabling faster reaction kinetics and densification.2. Enhanced Homogeneity:The uniform heating provided by the electric current passing through the graphite die ensures enhanced homogeneity within the sintered material. This leads to improved mechanical, electrical, and thermal properties.3. Energy Efficiency:The high heating rates achieved through the Joule heating effect reduce the overall energy consumption during the sintering process. This energy efficiency makes reactive flash sintering an environmentally friendly option.4. Unique Material Combinations:The ability to perform in-situ reactions during sintering opens up new possibilities for fabricating materials that were previously difficult or impossible to produce. Complex material combinations, such as metal-ceramic composites or multi-phase alloys, can be realized using this method.IV. Potential Applications:Reactive flash sintering has the potential to revolutionize material processing and find applications in various industries. Some potential applications include:1. Advanced Ceramics:Reactive flash sintering can be used to fabricate high-performance ceramic materials with improved mechanical strength, thermal stability, and electrical conductivity. These materials can find applications in the aerospace, electronics, and energy industries.2. Metal-Ceramic Composites:The ability to reactively sinter metal and ceramic powders enables the production of metal-ceramic composites with tailoredproperties. Such composites can be utilized in the automotive, aerospace, and defense sectors due to their unique combination of characteristics.3. Sustainable Materials:The energy efficiency and reduced processing times offered by reactive flash sintering make it an ideal technique for the fabrication of sustainable, environmentally friendly materials. This includes materials for renewable energy applications, such as solid oxide fuel cells or photovoltaic devices.Conclusion:The reactive flash sintering method presents a promising avenue for the fabrication of advanced materials with enhanced properties. Its unique combination of rapid heating, in-situ reaction, and uniform densification offers numerous advantages over conventional techniques. With its potential applications spanning across various sectors, reactive flash sintering could lead to significant advancements in material science and engineering, driving innovation and improving the performance of materials indiverse industries.。

极限强度英语The ultimate strength of a material refers to the maximum stress it can withstand before it fails. It is an important factor in determining the safety and reliabilityof engineering structures and components. The ultimate strength is usually determined through tensile testing, where a specimen of the material is subjected to increasing amounts of tensile force until it fractures. The stress at which this fracture occurs is the ultimate tensile strength.There are several factors that can affect the ultimate strength of a material. These include the material's composition, microstructure, and processing history. For example, the presence of impurities or defects within the material can act as stress concentrators, reducing its ultimate strength. Similarly, the way in which the material is processed, such as through cold working or heat treatment, can also have a significant impact on itsultimate strength.In engineering design, it is important to consider the ultimate strength of materials to ensure that they cansafely withstand the expected loads and forces. Thisinvolves selecting materials with appropriate ultimate strength values and designing structures and components with adequate safety factors. Failure to account for the ultimate strength of materials can lead to catastrophic failures and compromise the safety of the designed system.In addition to ultimate strength, it is also importantto consider other mechanical properties of materials, such as yield strength, ductility, and toughness. These properties collectively influence the behavior of materials under different loading conditions and are essential for ensuring the overall performance and reliability of engineered systems.Ultimately, understanding the ultimate strength of materials is crucial for ensuring the safety andreliability of engineering structures and components. By considering this important mechanical property, engineers can make informed decisions in material selection and design, ultimately leading to safer and more efficient systems.材料的极限强度是指在材料破裂之前能够承受的最大应力。

Common M ode F ilter D esign G uideIntroductionThe selection of component values for common mode filters need not be a difficult and confusing process. The use of standard filter alignments can be utilized to achieve a relatively simple and straightforward design process, though such alignments may readily be modified to utilize pre-defined component values.GeneralLine filters prevent excessive noise from being conducted between electronic equipment and the AC line; generally, the emphasis is on protecting the AC line. Figure 1 shows the use of a common mode filter between the AC line (via impedance matching circuitry) and a (noisy) power con-verter. The direction of common mode noise (noise on both lines occurring simultaneously referred to earth ground) is from the load and into the filter, where the noise common to both lines becomes sufficiently attenuated. The result-ing common mode output of the filter onto the AC line (via impedance matching circuitry) is then negligible.Figure 1.Generalized line filteringThe design of a common mode filter is essentially the design of two identical differential filters, one for each of the two polarity lines with the inductors of each side coupled by a single core:L2Figure 2.The common mode inductorFor a differential input current ( (A) to (B) through L1 and (B) to (A) through L2), the net magnetic flux which is coupled between the two inductors is zero.Any inductance encountered by the differential signal is then the result of imperfect coupling of the two chokes; they perform as independent components with their leak-age inductances responding to the differential signal: the leakage inductances attenuate the differential signal. When the inductors, L1 and L2, encounter an identical signal of the same polarity referred to ground (common mode signal), they each contribute a net, non-zero flux in the shared core; the inductors thus perform as indepen-dent components with their mutual inductance respond-ing to the common signal: the mutual inductance then attenuates this common signal.The First Order FilterThe simplest and least expensive filter to design is a first order filter; this type of filter uses a single reactive component to store certain bands of a spectral energy without passing this energy to the load. In the case of a low pass common mode filter, a common mode choke is the reactive element employed.The value of inductance required of the choke is simply the load in Ohms divided by the radian frequency at and above which the signal is to be attenuated. For example, attenu-ation at and above 4000 Hz into a 50⏲ load would require a 1.99 mH (50/(2π x 4000)) inductor. The resulting common mode filter configuration would be as follows:50Ω1.99 mHFigure 3.A first order (single pole) common mode filter The attenuation at 4000 Hz would be 3 dB, increasing at 6 dB per octave. Because of the predominant inductor dependence of a first order filter, the variations of actual choke inductance must be considered. For example, a ±20% variation of rated inductance means that the nominal 3 dB frequency of 4000 Hz could actually be anywhere in the range from 3332 Hz to 4999 Hz. It is typical for the inductance value of a common mode choketo be specified as a minimum requirement, thus insuring that the crossover frequency not be shifted too high.However, some care should be observed in choosing a choke for a first order low pass filter because a much higher than typical or minimum value of inductance may limit the choke’s useful band of attenuation.Second Order FiltersA second order filter uses two reactive components and has two advantages over the first order filter: 1) ideally, a second order filter provides 12 dB per octave attenuation (four times that of a first order filter) after the cutoff point,and 2) it provides greater attenuation at frequencies above inductor self-resonance (See Figure 4).One of the critical factors involved in the operation of higher order filters is the attenuating character at the corner frequency. Assuming tight coupling of the filter components and reasonable coupling of the choke itself (conditions we would expect to achieve), the gain near the cutoff point may be very large (several dB); moreover, the time response would be slow and oscillatory. On the other hand, the gain at the crossover point may also be less than the presumed -3 dB (3 dB attenuation), providing a good transient response, but frequency response near and below the corner frequency could be less than optimally flat.In the design of a second order filter, the damping factor (usually signified by the Greek letter zeta (ζ )) describes both the gain at the corner frequency and the time response of the filter. Figure (5) shows normalized plots of the gain versus frequency for various values of zeta.Figure 4.Analysis of a second order (two pole) common modelow pass filterThe design of a second order filter requires more care and analysis than a first order filter to obtain a suitable response near the cutoff point, but there is less concern needed at higher frequencies as previously mentioned.A ≡ ζ = 0.1;B ≡ ζ = 0.5;C ≡ ζ = 0.707;D ≡ ζ = 1.0;E ≡ ζ = 4.0Figure 5.Second order frequency response for variousdamping f actors (ζ)As the damping factor becomes smaller, the gain at the corner frequency becomes larger; the ideal limit for zero damping would be infinite gain. The inherent parasitics of real components reduce the gain expected from ideal components, but tailoring the frequency response within the few octaves of critical cutoff point is still effectively a function of ideal filter parameters (i.e., frequency, capaci-tance, inductance, resistance).L0.1W n1W n 10W nRadian Frequency,WG a i n (d B )V s V s LR s LCs LC j L R j LC LR LCCMout CMin L L n n n L ()()=++=−+⎛⎝⎜⎞⎠⎟=+−⎛⎝⎜⎞⎠⎟≡≡≡≡111111212222ωωζωωωωωωζradian frequencyR the noise load resistance LFor some types of filters, the design and damping char-acteristics may need to be maintained to meet specific performance requirements. For many actual line filters,however, a damping factor of approximately 1 or greater and a cutoff frequency within about an octave of the calculated ideal should provide suitable filtering.The following is an example of a second order low pass filter design:1)Identify the required cutoff frequency:For this example, suppose we have a switching power supply (for use in equipment covered by UL478) that is actually 24 dB noisier at 60 KH z than permissible for the intended application. For a second order filter (12dB/octave roll off) the desired corner frequency would be 15 KHz.2)Identify the load resistance at the cutoff frequency:Assume R L = 50 Ω3)Choose the desired damping factor:Choose a minimum of 0.707 which will provide 3 dB attenuation at the corner frequency while providing favorable control over filter ringing.4)Calculate required component values:Note:Damping factors much greater than 1 may causeunacceptably high attenuation of lower frequen-cies whereas a damping factor much less than 0.707 may cause undesired ringing and the filter may itself produce noise.Third Order FiltersA third order filter ideally yields an attenuation of 18 dB per octave above the cutoff point (or cutoff points if the three corner frequencies are not simultaneous); this is the prominently positive aspect of this higher order filter. The primary disadvantage is cost since three reactive compo-nents are now required. H igher than third order filters are generally cost-prohibitive.Figure 6.Analysis of a third order (three pole) low pass filter where ω1, ω2 and ω4 occur at the same -3dB frequency of ω05)Choose available components:C = 0.05 µF (Largest standard capacitor value that will meet leakage current requirements for UL478/CSA C22.2 No. 1: a 300% decrease from design)L = 2.1 mH (Approx. 300% larger than design to compensate for reduction or capacitance: Coilcraft standard part #E3493-A)6)Calculate actual frequency, damping factor, and at-tenuation for components chosen:ζ = 2.05 (a damping factor of about 1 or more is acceptible)Attenuation = (12 dB/octave) x 2 octaves = 24 dB 7)The resulting filter is that of figure (4) with:L = 2.1 mH; C = 0.05 µF; R L = 50 ΩL 1L 2VCMout s VCMin s R R L s R L s sC R L s sC R L s L L s L s sC L L R s L Cs L L C R s L L L L L L L()()()()=+⎛⎝⎜⎞⎠⎟+++++⎛⎝⎜⎜⎜⎜⎞⎠⎟⎟⎟⎟=++++222121*********11Butterworth →+++112212233s s s n n n ωωω()()L L R R L L L n n L 12111222+==+ωω;()L L C n 1n2C =2;ωω2211414=.L L L L n n n 12L n3n2L2n2L2C R =1;R R ωωωωωω33224422===ωπωζωμn n n Lf C L L R L =====294248070727502rad /sec =1Hn .1215532πLC=Hz (very nearly 15KHz)The design of a generic filter is readily accomplished by using standard alignments such as the Butterworth (“maxi-mally flat”) alignments. Figure (6) shows the general analysis and component relationships to the Butterworth alignments for a third order low pass filter. Butterworth alignments provide an inherent ζ of 0.707 and a -3 dB point at the crossover frequency. The Butterworth alignments for the first three orders of low pass filters are shown in Figure (7).The design of a line filter need not obey the Butterworth alignments precisely (although such alignments do pro-vide a good basis for design); moreover, because of leakage current limits placed upon electronic equipment (thus limiting the amount of filter capacitance to ground),adjustments to the alignments are usually required, but they can be executed very simply as follows:1)First design a second order low pass with ζ ≥ 0.52)Add a third pole (which has the desired corner fre-quency) by cascading a second inductor between the second order filter and the noise load:L = R/ (2 π f c )Where f c is the desired corner frequency.Design ProcedureThe following example determines the required compo-nent values for a third order filter (for the same require-ments as the previous second order design example).1)List the desired crossover frequency, load resistance:Choose f c = 15000 Hz Choose R L = 50 Ω2)Design a second order filter with ζ = 0.5 (see second order example above):3)Design the third pole:R L /(2πf c ) = L 250/(2π15000) = 0.531 mH4)Choose available components and check the resulting cutoff frequency and attenuation:L2 = 0.508 mH (Coilcraft #E3506-A)f n= R/(2πL 1 )= 15665 HzAttenuation at 60 KHZ: 24 dB (second order filter) +2.9 octave × 6 = 41.4 dB5)The resulting filter configuration is that of figure (6)with:L 1 = 2.1 mH L 2 = 0.508 mH R L = 50 ΩConclusionsSpecific filter alignments may be calculated by manipu-lating the transfer function coefficients (component val-ues) of a filter to achieve a specific damping factor.A step-by-step design procedure may utilize standard filter alignments, eliminating the need to calculate the damping factor directly for critical filtering. Line filters,with their unique requirements, yet non-critical character-istics, are easily designed using a minimum allowable damping factor.Standard filter alignments assume ideal filter compo-nents; this does not necessarily hold true, especially at higher frequencies. For a discussion of the non-ideal character of common mode filter inductors refer to the application note “Common Mode Filter Inductor Analysis,”available from Coilcraft.Figure 7.The first three order low pass filters and their Butterworth alignmentse i +–e O +–R LL 2Ce i +–e O +–R LL 1Ce i +–e O +–R LL 1L 2Filter SchematicFilter Transfer FunctionButterworthAlignmentFirst OrderSecond OrderThird Ordere e Ls R o iL =+11e e LCs Ls R oi L=++112e e L L R s L Cs L L s R o iLL =++++111231212()e e s o in=+11ωe e LCs Ls R oiL =++112e e s s so i n n n =+++122133221ωωω。

材料科技英语试题及答案一、选择题（每题2分，共20分）1. What is the most common type of material used in the construction of bridges?A. SteelB. ConcreteC. WoodD. Plastic2. The process of hardening metal by heating and cooling is known as:A. AnnealingB. TemperingC. QuenchingD. Forging3. Which of the following is not a property of materials?A. DensityB. ElasticityC. ColorD. Thermal conductivity4. The term "nanomaterials" refers to materials with at least one dimension in the size range of:A. 1-100 nanometersB. 1-100 micrometersC. 1-100 millimetersD. 1-100 centimeters5. What is the primary function of a catalyst in a chemical reaction?A. To increase the temperatureB. To provide energyC. To speed up the reaction without being consumedD. To slow down the reaction6. The strength of a material is often measured by its:A. DuctilityB. Tensile strengthC. MalleabilityD. Hardness7. Which of the following is a type of composite material?A. GlassB. CeramicC. AlloyD. Fiberglass8. The SI unit for measuring thermal expansion is:A. CelsiusB. KelvinC. JouleD. Degree Celsius per meter Kelvin9. What is the main difference between amorphous and crystalline materials?A. ColorB. ShapeC. Atomic arrangementD. Density10. The term "strain" in materials science refers to:A. The amount of deformation per unit lengthB. The force applied to a materialC. The change in shape of a materialD. The resistance to deformation二、填空题（每题2分，共20分）11. The process of changing the physical or chemical properties of a material is known as ________.12. The ________ of a material is its ability to resist deformation.13. The ________ is a material that can withstand high temperatures without significant loss of strength.14. The ________ of a material is the measure of its ability to conduct heat.15. A ________ is a material that can be easily deformed without breaking.16. The ________ of a material is its resistance to wear or abrasion.17. The ________ is the process of joining two pieces of metal by heating them to a molten state.18. The ________ is the process of removing excess material to create a desired shape.19. The ________ of a material is its ability to return to its original shape after deformation.20. The ________ is the study of the behavior of materials under various conditions.三、简答题（每题10分，共30分）21. Explain the difference between ductile and brittle materials.22. Describe the process of annealing and its effects on materials.23. Discuss the importance of material selection in the design of aeronautical components.四、论述题（每题15分，共30分）24. Discuss the role of materials science in the development of new technologies.25. Analyze the environmental impact of material production and disposal, and suggest ways to minimize these effects.答案：一、1-5: B C C A C6-10: B D D A C A二、11. Alteration12. Rigidity13. Refractory14. Thermal conductivity15. Ductile material16. Hardness17. Fusion18. Machining19. Elasticity20. Material science三、21. 略22. 略23. 略四、24. 略25. 略。

机械工程英语试题及答案一、选择题（每题2分，共20分）1. What is the function of a bearing in a mechanical system?A. To support the shaftB. To reduce frictionC. Both A and BD. None of the above2. The term "machinability" refers to:A. The ease with which a material can be machinedB. The hardness of the materialC. The cost of machining a materialD. The strength of the material3. Which of the following is NOT a type of gear?A. Spur gearB. Bevel gearC. Worm gearD. Cam gear4. The process of converting electrical energy into mechanical energy is known as:A. ElectromagnetismB. Electromechanical conversionC. Electromagnetic inductionD. Electrostatics5. What is the primary purpose of a flywheel in an engine?A. To store energyB. To increase fuel efficiencyC. To reduce vibrationsD. To increase horsepower6. The SI unit for pressure is:A. NewtonB. PascalC. JouleD. Watt7. In a hydraulic system, what does the term "pump" refer to?A. A device that generates hydraulic pressureB. A device that reduces hydraulic pressureC. A device that converts hydraulic pressure to mechanical forceD. A device that regulates hydraulic flow8. What is the main advantage of using a belt drive in a mechanical system?A. High efficiencyB. Low maintenanceC. High precisionD. Compact size9. The term "thermal expansion" refers to the:A. Increase in volume of a material when heatedB. Decrease in volume of a material when cooledC. Change in shape of a material due to heatD. Change in color of a material due to heat10. Which of the following is a measure of the hardness of a material?A. Tensile strengthB. Yield strengthC. Modulus of elasticityD. Brinell hardness二、填空题（每题1分，共10分）11. The _______ is the process of removing material from a workpiece to achieve the desired shape and size.(答案：Machining)12. In a four-stroke internal combustion engine, the _______ stroke converts the chemical energy of the fuel into mechanical energy.(答案：Power)13. The _______ is the study of the behavior of materials under load.(答案：Mechanics of materials)14. A _______ is a mechanical device that converts the linear motion of a piston into the rotational motion of a crankshaft. (答案：Crank)15. The _______ is the ratio of the output power to the input power of a machine.(答案：Efficiency)16. _______ is the process of joining two or more metal parts by heating them to their melting point and fusing themtogether.(答案：Welding)17. The _______ is a type of gear that has teeth cut diagonally rather than parallel to the axis of the gear.(答案：Hypoid gear)18. _______ is the process of cutting a workpiece by feeding it against a rotating abrasive disk.(答案：Grinding)19. The _______ is the study of the deformation and flow of materials under various forces.(答案：Rheology)20. _______ is the process of shaping a workpiece by pressing it between a punch and a die.(答案：Forging)三、简答题（每题5分，共30分）21. Explain the difference between static and dynamic friction.(答案：Static friction is the frictional force that must be overcome to start moving an object, while dynamic friction is the frictional force that opposes the motion of an object that is already in motion.)22. Describe the function of a clutch in a vehicle.(答案：A clutch is a device that engages and disengages power transmission from the engine to the transmission, allowing the driver to change gears smoothly.)23. What is the purpose of a heat exchanger in a mechanical system?(答案：A heat exchanger is used to transfer heat from one medium to another, typically to cool a system or to preheat a fluid before it enters the system.)24. Explain the concept of stress and strain in materials.(答案：Stress is the internal resistance of a material to deformation when subjected to an external force, while strain is the measure of the deformation of the material under stress.)四、计算题（。

电路原理英语Circuit TheoryIntroduction:Circuit theory is a fundamental branch of electrical engineering that focuses on the study of electronic circuits and their behavior. It provides a framework for understanding the principles and concepts underlying the functioning of various electronic devices. Basic Concepts:1. Voltage: Voltage is the electrical potential difference between two points in a circuit. It is measured in volts (V) and represents the "push" or "force" that drives the flow of electric current.2. Current: Electric current is the flow of electric charge through a conductor. It is measured in amperes (A) and represents the rate of flow of charge.3. Resistance: Resistance measures the opposition to the flow of electric current in a circuit. It is measured in ohms (Ω) and depends on factors such as the material, length, and cross-sectional area of the conductor.4. Ohm's Law: Ohm's law states that the current flowing through a conductor is directly proportional to the voltage across it and inversely proportional to its resistance. It can be mathematically expressed as I = V/R, where I is the current, V is the voltage, and R is the resistance.Circuit Elements:1. Resistors: Resistor is a passive electronic component that limits the flow of current in a circuit. It is commonly used to control the voltage levels in a circuit.2. Capacitors: Capacitor is a passive electronic component that stores electrical energy in an electric field. It consists of two parallel conducting plates separated by an insulating material called a dielectric.3. Inductors: Inductor is a passive electronic component that stores electrical energy in a magnetic field. It consists of a coil of wire wound around a magnetic core.4. Diodes: Diode is a semiconductor device that allows current to flow in only one direction. It is widely used in rectifier circuits and serves as a switch in digital logic circuits.Circuit Analysis Techniques:1. Kirchhoff's Laws: Kirchhoff's laws are a set of fundamental principles used for analyzing electrical circuits. The first law, called Kirchhoff's current law (KCL), states that the sum of currents entering a node in a circuit is equal to the sum of currents leaving the node. The second law, called Kirchhoff's voltage law (KVL), states that the sum of voltages around any closed loop in a circuit is zero.2. Node Voltage Method: The node voltage method is a circuit analysis technique that involves assigning reference node voltages and solving for the unknown node voltages using Kirchhoff's laws.3. Mesh Current Method: The mesh current method is a circuit analysis technique that involves assigning mesh currents and solving a set of simultaneous equations based on Kirchhoff's voltage law.Conclusion:Understanding the principles of circuit theory is essential for analyzing and designing electronic circuits. By applying the basic concepts and analysis techniques discussed, engineers can predict the behavior of circuits and ensure their proper functioning.。

Instruction Manual 4 Port Solenoid ValveSeries VQD1000The intended use of this valve is to control the movement of an actuator.1 Safety InstructionsThese safety instructions are intended to prevent hazardous situations and/or equipment damage. These instructions indicate the level of potential hazard with the labels of “Caution,” “Warning” or “Danger.” They are all important notes for safety and must be followed in addition to International Standards (ISO/IEC) *1), and other safety regulations. *1)ISO 4414: Pneumatic fluid power - General rules relating to systems. ISO 4413: Hydraulic fluid power - General rules relating to systems.IEC 60204-1: Safety of machinery - Electrical equipment of machines. (Part 1: General requirements)ISO 10218-1: Robots and robotic devices - Safety requirements for industrial robots - Part 1: Robots.• Refer to product catalogue, Operation Manual and Handling Precautions for SMC Products for additional information. • Keep this manual in a safe place for future reference.CautionCaution indicates a hazard with a low level of risk which, if not avoided, could result in minor or moderate injury.WarningWarning indicates a hazard with a medium level of riskwhich, if not avoided, could result in death or serious injury.DangerDanger indicates a hazard with a high level of risk which, ifnot avoided, will result in death or serious injury.Warning• Always ensure compliance with relevant safety laws and standards.• All work must be carried out in a safe manner by a qualified person in compliance with applicable national regulations.• If this equipment is used in a manner not specified by the manufacturer, the protection provided by the equipment may be impaired.Caution• The product is provided for use in manufacturing industries only. Do not use in residential premises.2 Specifications2.1 Valve specifications TypeStandard single Large-flow single Large- flow latchingFluid Air Operating pressure range [MPa] 0 (Vacuum: -101.2 kPa) to 0.7 Ambient and fluid temperature [°C] -10 to 50 (no freezing) Flow characteristics Refer to catalogue Response time [ms] Refer to catalogue Duty cycle Contact SMC Min. operating frequency 1 cycle / 30 days Max. operating frequency [Hz] Contact SMC Manual override Non-locking push type Locking Lubrication Not required Impact / Vibration resistance [m/s 2]Note 1)150/30 Enclosure (based on IEC60529) IP402 Specifications - continuedMounting orientation Unrestricted WeightRefer to catalogueTable 1.Note 1) Impact resistance: No malfunction occurred when it was tested with a droptester in the axial direction and at right angles to the main valve and armature; in both energized and de-energised states and for every time in each condition. (Values at the initial period).Vibration resistance: No malfunction occurred in a one-sweep test between 45 and 2000 Hz. Tests are performed at both energized and de-energized states in the axial direction and at right angles to the main valve and armature. (Values at the initial period).2.2 Solenoid specifications Type Standard single Large-flow single Large-flowlatchingCoil rated voltage [VDC] 12, 24 24 Electrical entry L/M plug connector Coil insulation class Class B or equivalentAllowable voltage fluctuation-10% to +10% of rated voltage Power consumption [W] Note 1) 2 3.2 (Inrush) 1 (Holding)2Surge voltage suppressor Varistor Diode Varistor Indicator light LEDTable 2.Note 1) Refer to catalogue for energy saving type power waveform.2.3 Pneumatic symbolSingle type Latching typeFigure 1. Pneumatic symbol2.4 Special productsWarningSpecial products (-X) might have specifications different from those shown in this section. Contact SMC for specific drawings.3 Installation3.1 InstallationWarning• Do not install the product unless the safety instructions have been read and understood. 3.2 EnvironmentWarning• Do not use in an environment where corrosive gases, chemicals, salt water or steam are present.• Do not use in an explosive atmosphere.• Do not expose to direct sunlight. Use a suitable protective cover.• Do not install in a location subject to vibration or impact in excess of the product’s specifications .• Do not mount in a location exposed to radiant heat that would result in temperatures in excess of the product’s specifications. 3.3 PipingCaution• Before connecting piping make sure to clean up chips, cutting oil, dust etc.• When installing piping or fittings, ensure sealant material does not enter inside the port. When using seal tape, leave 1 thread exposed on the end of the pipe/fitting.• Tighten fittings to the specified tightening torque. Port Thread Tightening torque [N·m]1(P), 3(R) M5 1 to 1.5 2(B), 4(A)P(1), R(3) (Manifold)1/83 to 5Table 4.3 Installation - continued3.4 LubricationCaution• SMC products have been lubricated for life at manufacture, and do not require lubrication in service.• If a lubricant is used in the system, refer to catalogue for details. 3.5 Air supplyWarning• Use clean air. If the compressed air supply includes chemicals, synthetic materials (including organic solvents), salinity, corrosive gas etc., it can lead to damage or malfunction.Caution• Install an air filter upstream of the valve. Select an air filter with afiltration size of 5 μm or smaller. 3.6 Manual overrideWarning• Regardless of an electric signal for the valve, the manual override is used for switching the main valve. Since connected equipment will operate when the manual override is activated, confirm that conditions are safe prior to activation.• Locked manual overrides might prevent the valve responding to being electrically de-energised or cause unexpected movement in the equipment.• Refer to the catalogue for details of manual override operation. 3.7 MountingCaution• Ensure gaskets are in good condition, not deformed and are dust and debris free.• When mounting valves ensure gaskets are present, aligned and securely in place and tighten the mounting screws to a torque of 0.18 to 0.25 N∙m.• When piping and mounting valves, clamp the body part in place to avoid applying force to the coil. If you apply force over 120 N to coil, connection pins deform, which may cause malfunction. (Latching: 50N or more).Figure 2.3.8 Electrical circuitsCautionFigure 3. Single type (Standard: 2W)Figure 4. Single type (Large flow: 3.2 W)Effective energizing time for the energy saving type is between 15 to 25 ms at 24 VDC. Refer to catalogue for electrical power waveform.3 Installation - continuedFigure 5. Latching solenoid typeFigure 6. Positive commonFigure 7. Negative common3.9 Electrical connectorsCautionFigure 8. How to use plug connectorPull lead wire with gently, otherwise it may cause contact failure ordisconnection.Refer to catalogue for guidance on how to use plug connector. 3.10 Residual voltageCaution• If a varistor voltage suppressor is used, the suppressor arrests the back EMF voltage from the coil to a level in proportion to the rated voltage.• Ensure the transient voltage is within the specification of the host controller.• Contact SMC for the varistor residual voltage.• In the case of a diode, the residual voltage is approximately 1 V.• Valve response time is dependent on surge suppression method selected.ORIGINAL INSTRUCTIONSFittingCoilPin BodyLEDSOL.Red (+/-)Black (-/+)V a r i s t o rRed (+)Black (-)E n e r g y s a v i n g I CDiode SOL.SOL.LEDA (-) SetC (+) COMV a r i s t o rS i m u l t a n e o u s e n e r g i s a t i o n p r o t e c t i o n c i r c u i tB (-) ResetS i m u l t a n e o u s e n e r g i s a t i o n p r o t e c t i o n c i r c u i tS i m u l t a n e o u s e n e r g i s a t i o n p r o t e c t i o n c i r c u i tBlack (-) A-ONRed (+) COMWhite (-) B-ONRed (+) A-ONBlack (-) COMWhite (+) B-ONSOL.SOL.CoverGroove PinConnectorLeverLeverConnectorL plug connector M plug connector Base mounted Body ported Base mounted Body ported AC3 Installation - continued3.11 Countermeasure for surge voltageCaution•At times of sudden interruption of the power supply, the energy stored in a large inductive device may cause non-polar type valves in a de-energised state to switch.•When installing a breaker circuit to isolate the power, consider a valve with polarity (with polarity protection diode), or install a surge absorption diode across the output of the breaker.3.12 Extended period of continuous energizationWarning•If a valve will be continuously energized for an extended period of time, or is mounted in a control panel, the temperature of the valve will increase due to the heat generated by the coil assembly. This will likely adversely affect the performance of the valve and any nearby peripheral equipment. Therefore, if the valve is to be energized for periods of longer than 30 minutes at a time or if during the hours of operation the energized period per day is longer than the de-energized period, we advise using a direct operated continuous duty type valve such as the VK series or the VT series, or consider use of the latching type for which continuous energization is not required.•Coil temperature may get high due to ambient temperature or energizing duration. Do not touch the valve by hand directly. When there is such a dangerous case to be touched by hands directly, install a protective cover.•The latching type should not be energized over 30 seconds. Ensure the de-energised period is longer than the energised time (both A andB should be turned off.) before the next operation.3.13 Effect of back pressure when using a manifoldWarningUse caution when valves are used on a manifold, because an actuator may malfunction due to back-pressure.3.14 Latching typeCaution•Use in a circuit that does not have simultaneous energization of A-ON and B-ON signals.•The minimum energization time required for self-holding is 50 ms. •Although there is no problem for normal operations and environments. please consult SMC when operating in an environment with vibration (10G or more) or strong magnetic fields.•When there is the magnetic body at the valve side, it may cause malfunction. Allow a space over 10 mm between the valve and magnetic body.•Even though this valve is held on to B-ON position (passage: P → B), it may switch to the set position during transportation or due to impact when mounting valves, etc. Therefore, check the initial position by means of power supply or manual override prior to use.Energisation Passage Light colourA-ON (Set) A(-) C(+)Black RedP→A(B→R)RedB-ON (Reset) B(-) C(+)White RedP→B(A→R)GreenTable 5.Note) For positive common.4 How to OrderRefer to catalogue for ‘How to Order’.5 Outline DimensionsRefer to catalogue for outline dimensions.6 Maintenance6.1 General maintenanceCaution•Not following proper maintenance procedures could cause the product to malfunction and lead to equipment damage.•If handled improperly, compressed air can be dangerous. •Maintenance of pneumatic systems should be performed only by qualified personnel. 6 Maintenance - continued•Before performing maintenance, turn off the power supply and be sureto cut off the supply pressure. Confirm that the air is released toatmosphere.•After installation and maintenance, apply operating pressure andpower to the equipment and perform appropriate functional andleakage tests to make sure the equipment is installed correctly.•If any electrical connections are disturbed during maintenance, ensurethey are reconnected correctly and safety checks are carried out asrequired to ensure continued compliance with applicable nationalregulations.•Do not make any modification to the product.•Do not disassemble the product, unless required by installation ormaintenance instructions.6.2 MountingCautionRefer to 3.7 Mounting for guidance on how to mount valve to base.6.3 Maintainable partsCautionRefer to catalogue for how to order manifold accessories, sub-plates orelectrical connector assemblies.7 Limitations of Use7.1 Limited warranty and disclaimer/compliance requirementsCautionRefer to Handling Precautions for SMC Products.7.2 Effect of energy loss on valve switchingWarningSingle type Latching type Note)Air supply present,electrical supply cutValve spoolreturns to OFFposition by springforce.Valve spool holds position untilreset signal is sent (B-ON), spoolthen returns to OFF position byspring force.Electrical supplypresent, air supply cutValve operation is not dependent on presence of airsupply. Spool position/movement is unaffected byloss of air supply.Note) Refer to 3.14 and catalogue for Latching type operation guidance.7.3 Holding of pressureWarningSince valves are subject to air leakage, they cannot be used forapplications such as holding pressure (including vacuum) in a system.7.4 Cannot be used as an emergency shut-off valveWarningThis product is not designed for safety applications such as anemergency shut-off valve. If the valves are used in this type of system,other reliable safety assurance measures should be adopted.7.5 Leakage voltageCautionEnsure that any leakage voltage caused by the leakage current when theswitching element is OFF causes ≤ 2% of the rated voltage across thevalve.7.6 Low temperature operationCautionUnless otherwise indicated in the specifications for each valve, operationis possible to -10˚C, but appropriate measures should be taken to avoidsolidification or freezing of drainage and moisture, etc.7 Limitations of Use - continued7.7 Vacuum applications and use as a 3 port valve.Caution•Use a VQD(1/2)(2/3/5)1(V/W) valve for vacuum applications.•Connect the vacuum source to the 3(R) port.•Refer to catalogue for diagram.•Air pressure cannot be applied to the 3(R) port.•When used as a 3 port valve, conversion from N.O. to N.C. and viceversa is possible by plugging either port 4(A) or 2(B).•The valve cannot be used as a 2 port valve.8 Product DisposalThis product shall not be disposed of as municipal waste. Check yourlocal regulations and guidelines to dispose this product correctly, in orderto reduce the impact on human health and the environment.9 ContactsRefer to or www.smc.eu for your localdistributor/importer.URL : https:// (Global) https:// www.smc.eu (Europe)SMC Corporation, 4-14-1, Sotokanda, Chiyoda-ku, Tokyo 101-0021, JapanSpecifications are subject to change without prior notice from the manufacturer.© 2022SMC Corporation All Rights Reserved.Template DKP50047-F-085M。

Keys:第一章科技英语阅读第一节科技英语主要特点I.1.The first three sentences in Passage One are all constructed with passive voice while thefirst three sentences in Passage Two are constructed with active voice. Therefore, the language in Passage One sounds more formal and objective than that of Passage Two.2.The words spoken by Sheila in Passage Two are informal. Examples: "There's Ravi atthe home of that American doctor." (Contracted form); "A wonderful guy." (Incomplete sentence); "Ravi looks sweet, doesn 't he?" (Question tag).3.In the second paragraph of Passage One, "it" refers to "to use insecticide regularly, on avery large scale."4.In the second paragraph of Passage Two, "through" means "finish" or "complete."5.Passage One is written for academic purpose and Passage Two mainly for entertainment. II.Passage OneA blast of hot air is sent into the bottom of the furnace to make the coke burn fiercely. It is blown into the furnace through pipes. These pipes are installed around the circumference of the blast furnace eight feet above the bottom.While the coke is burning and iron is melting, gas is formed at the top of the chamber. This is led off from the top of the furnace to be used. It contains carbon monoxide, which is combustible. Part of this gas is used for making the air blast hot. It is led off into stoves.Passage TwoAll elements are composed of discrete units called atoms, which are the smallest particles that exhibit the characteristics of the element. Atoms are tiny units of matter composed of positively charged protons, negatively charged electrons, and electrically neutral neutrons. Protons and neutrons, which have approximately the same mass, are clustered in the nucleus in the center of the atom. Electrons, which are tiny in comparison to the other units, orbit the nucleus at high speed. Atoms that have an equal number of electrons and protons are electrically neutral. Those that have gained or lost electrons, and therefore are positively or negatively charged, are called ions.第二节科技、半科技英语专业术语I.1. D (自动驾驶仪)2. F (生物钟)3. I (热核的)4. G (地热的)5. B (微波)6. J (放射疗法)7. E (光周期)8. A (超导体)9. H (远距离操纵器) 10. C (超显微/滤过性病毒)II.1. 一位从事航空医学研究的医生2. 防止计算机犯罪的措施3. 一种新型除霜器4. 一个用光电池驱动的玩具5. 一辆装有自动报警器的汽车6. 隔音材料7. 一种广泛使用的杀虫剂（农药）8. 用放射性碳做的试验9. 电信业的发展10. 一台通用机床III.1. in-(Inorganic)2. radio- (radioactive)3. hydro- (Hydrotherapy)4. -free (caffeine-free)5. infra- (infrared) / ultra- (ultrared)6. mono- (monorail)7. aero- (Aerodynamics) 8. -fold (33-fold)9. geo- (geocentric) 10. -proof (weatherproof)11. bio- (biotechnology) 12. anti- (antibiotic)IV. 发电站 2. 矿物燃料 3. 太阳黑子 4. 航天探测器 5. 滚珠轴承6. 涡轮7. 航天飞机8. 树木的年轮9. 离心调速器10. 心肌功能V.1. flow2. laws3. law4. conserved5. transferred6. transformed7. bond8. thermodynamics9. work 10. law 11. degraded 12. work13. law 14. state 15. disorder 16. energy17. law 18. biological 19. metabolically 20. cellVI.1.很明显，许多家用电器的加热和照明作用都依靠电阻。

Chapter 1 Thermodynamics and Heat Transfer 主要内容1.Concepts:heat (thermal energy)、heat transfer、thermodynamics、total amount of heat transfer、heat transfer rate、heat flux、conduction、convection、radiation2.Equations:1) The first law of thermodynamics (conservation of energy principle)2) Heat balance equation: a) closed system; b) open system (steady-flow)3) Fourier’s law of heat conduction4) Newton’s law of cooling5) Stefan-Boltzmann law主要专业词汇heat transfer 传热、热传递、传热学thermodynamics热力学caloric 热素specific heat 比热mass flow rate 质量流率latent heat 潜热sensible heat 显热heat flux热流密度heat transfer rate热流量total amount of heat transfer总热量conduction导热convection对流radiation辐射thermal conductivity 热导率thermal diffusivity 热扩散率convection/combined heat transfer coefficient 对流/综合换热系数emissivity 发射率absorptivity 吸收率simultaneous heat transfer 复合换热Chapter 2 Heat Conduction Equation主要内容1.Concepts:temperature field、temperature gradient、heat generation、initial condition、boundary condition、steady\transient heat transfer、uniform\nonuniform temperature distribution2.Equations:1) Fourier’s law of heat conduction (§2-1)2) Heat conduction equation (inrectangular\cylindrical\spherical coordinates) (§2-2、§2-3)3) Boundary conditions: (§2-4)a)Specified temperature B. C.b) Specified heat flux B. C. [special case(dt/dx=0):insulation、thermal symmetry];c) Convection B.C.d) Radiation B.C.e) Interface B.C.4) Average thermal conductivity k ave(§2-7)5) Solution of one-dimensional, steady heat conduction inplane walls、cylinders and spheres (k =const)：a) no heat generation, specified B.C.: T(x) or T(r) (§2-5)Q(x) or Q(r), Q=constb) with heat generation, Specified B.C. or Convection B.C. : (§2-6)∆T max=T o-T s= gs2/2nk ; q(x)=gx/n; T s=T + gs/nh characteristic length S, shape factor n:plane walls —s = L (half thickness), n = 1cylinders ——s =r o, n = 2spheres ——s =r o, n =33.Methods: Solve a heat transfer problem1) Mathematical formulation (differential equation & B.C.)2) General solution of equation3) Application of B.C.s4) Unique solution of the problem主要专业词汇temperature field\distribution温度场\分布temperature gradient温度梯度heat generation热生成(热源)initial\boundary condition初始\边界条件transient heat transfer瞬态(非稳态)传热isothermal surface 等温面Heat conduction differential equation 导热微分方程trial and error method试算法iterate迭代convergence 收敛Chapter 3 Steady Heat Conduction主要内容1.Concepts:multilayer\composite wall overall heat transfer coefficient Uthermal resistance R t thermal contact resistance R c critical radius of insulation R crfin efficiency fin effectiveness2.Equations:✓Multiplayer plane wall、cylinders and spheres:✓Fin: fin equation——refer to the attachment.1) Uniform cross-section: refer to the attachment.2) Varying cross-section: refer to the attachment.主要专业词汇thermal resistance热阻parallel 并联in series串联thermal contact resistance 接触热阻composite wall 复合壁面thermal grease 热脂cross-section 横截面temperature execess 过余温度hyperbolic 双曲线的exponent 指数fin 肋(翅)片fin base 肋基fin tip 肋端fin efficiency 肋效率fin effectiveness 肋片有效度Chapter 4 Transient Heat Conduction主要内容1.Concepts:lumped system analysis characteristic length (L c=V/A)Biot number (Bi=hL c /k) Fourier number ( τ = at/L)2.Equations:●Bi≤0, lumped system analysis (§4-1)●Bi>0, Heisler/Grober charts OR analytical expressions1-D：a) infinite large plane walls, long cylinders and spheres (§4-2)b) semi-infinite solids (§4-3)multidimensional: product solution (§4-4)主要专业词汇lumped system analysis 集总参数法characteristic length 特征长度（尺寸）dimension 量纲nondimensionalize 无量纲化dimensionless quantity 无量纲量semi-infinite solid 半无限大固体complementary error function 误差余函数series 级数production solution 乘积解Chapter 5 Numerical Methods in Heat Conduction主要内容1.Concepts:control volume (energy balance) method、finite difference method、discretization、node、space step、time step、mesh Biot number、mesh Fourier number、mirror image concept、explicit/implicit method、stability criterion (primary coefficients ≥0)Numerical error: 1) discretization/truncation error; 2) round-off error2.Methods:Numerical solution:1) Discretization in space and time (∆x, ∆t);2) Build all nodes’finite difference formulations (including interior and boundary nodes);i.Finite difference methodii.Energy balance method (i.e.Control Volume method)3) Solution of nodal difference eqs. of heat conduction;i.Direct method: Gaussian Eliminationii.Iterative method: Gauss-Seidel iteration主要专业词汇control volume 控制容积finite difference有限差分Taylor series expression泰勒级数展开式mirror image concept 镜像法Elimination method 消元法direct/iterative method 直接/迭代方法explicit/implicit method 显式/隐式格式stability criterion 稳定性条件primary coefficients 主系数unconditionally 无条件地algebraic eq. 代数方程discretization/truncation error 离散/截断误差round-off error 舍入误差Chapter 6、7 Forced Convection and NaturalConvection主要内容1.Concepts:Nu、Re、Gr、PrForce/natural convection、external/internal flow、velocity/thermal boundary layerflow regimes、laminar/turbulent flowhydrodynamic/thermal entry region、fully developed regionCritical Reynolds Number (Re c)、hydraulic diameter (D h)、film temperature (T f)、bulk mean fluid temperature (T b)logarithmic mean temperature difference ( T ln)volume expansion coefficient (β= 1/T)effective thermal conductivity (K eff = K Nu)2.Equations:Drag force ：F D = C f AρV2/2Heat transfer rate：Q = hA(T s-T )3．Typical Convection Phenomena:1) Forced convection：external flow——flow over flat plates (§6-4)——flow across cylinders and spheres (§6-5)internal flow——flow in tubes (§6-6)2) Natural convection：flow over surfaces (§7-2)flow inside enclosures (§7-3)主要专业词汇Force/natural convection 自然/强制对流laminar/turbulent flow 层/湍流boundary layer 边界层laminar sublayer 层流底层buffer layer 缓冲层transition region 过渡区flow regimes 流态inertia/viscous force 惯性/粘性力shear stress 剪切应力friction/drag coefficient 摩擦/阻力系数friction factor 摩擦因子dynamic/kinematic viscous 动力/运动粘度wake 尾流stagnation point 滞止点flow separation 流体分离vortex 漩涡rotational motion 环流velocity fluctuation 速度脉动hydrodynamic 水动力学的hydraulic diameter 水力直径fully developed region 充分发展段volume flow rate 体积流量arithmetic/logarithmic mean temperature difference 算术/对数平均温差volume expansion coefficient 体积膨胀系数interferometer 干涉仪asymptotic渐近线的effective thermal conductivity 有效热导率analogical method 类比法integral approach 积分近似法order of magnitude analysis 数量级分析法similarity principle 相似原理Chapter 9 Radiation Heat Transfer主要内容1.Concepts:black body、gray body、diffuse surface、emissive power (E)emissivity (ε)、absorptivity (α)、reflectivity (ρ)、transmissivity (τ) irradiation(G)、radiosity(J)、reradiating(adiabatic) surfaceview factor (F ij)、radiation network、space resistance、surface resistance radiation shieldgas radiation、transparent medium to radiation、absorbing and transmitting mediumws:Blackbody：(1) Plank’s law(2) Stefan-Boltzmann’s law(3) Wien’s displacement lawGraybody：(4) Kirchhoff’s lawActual body：E (T) = εE b(T) = εσT4W/m2Gas：(5) Beer’s law3．Calculation:1) View factor：reciprocity/summation/superposition/symmetry Rulecrossed-strings method2) Radiation heat transfer：Radiation networkOpen system：between two surface (e.g. two large parallel plates) Enclosure：2-surface enclosure；3-surface enclosureRadiation shield主要专业词汇thermal radiation热辐射、quantum theory量子理论、index of refraction 折射系数electromagnetic wave/spectrum 电磁波/波谱、ultraviolet (UV) rays紫外线、infrared (IR) rays 红外线absorptivity 吸收率、reflectivity 反射率、transmissivity 透射率、emissivity (ε) 发射率(黑度)、specular/diffuse reflection 镜反射/漫反射irradiation (incident radiation) 投入辐射、radiosity 有效辐射spectral/directional/total emissive power单色/定向/总辐射力fraction of radiation energy 辐射能量份额(辐射比)、blackbody radiation function 黑体辐射函数view factor 辐射角系数、crossed-strings method交叉线法、reciprocity/summation/superposition/symmetry Rule相互/完整/和分/对称性net radiation heat transfer 净辐射热流量radiation network 辐射网络图、space/surface radiation resistance 空间/表面辐射热阻、reradiating surface重辐射面、adiabatic 绝热的radiation shield遮热板transparent medium to radiation辐射透热体、absorbing and transmitting medium吸收-透过性介质Chapter 10 Heat Exchangers主要内容1.Concepts:heat exchanger type---- double-pipe、compact、shell-and-tube、plate-and-frame、regenerative heat exchangerparallel/counter/cross/multipass flowoverall heat transfer coefficient (U) fouling factor (R f)heat capacity rate capacity rationlog mean temperature difference (ΔT lm)heat transfer effectiveness (ε)number of transfer units (NTU)2.Equations:1) heat balance eq.: Q = C h (T h,in - T h,out)=C c(T c,out - T c,in)2) heat transfer eq.: Q = UAΔT lm( LMTD method)or Q = εQ max = εC min (T h,in ？C T c,in) ( ε-NTU method) 3．Methods:1) LMTD Method：select a heat exchangerKnown: C h、C c、3‘T’Predict: 1‘T’、Q、A2) ε-NTU Method：evaluate the performance of a specified heat exchangerKnown: C h、C c、UA、T h,in、T c,inPredict: Q、T h,out、T c,out主要专业词汇double-pipe/compact/shell-and-tube/plate-and-frame/regenerative heat exchanger套管式/紧凑式/壳管式/板式/蓄热（再生）式换热器parallel/counter/cross/multipass flow 顺流/逆流/叉流/多程流area density 面积密度tube/shell pass 管程/壳程static/dynamic type 静/动态型baffle 挡板header 封头nozzle管嘴guide bar 导向杆porthole 孔口gasket 垫圈lateral 侧面的/横向的fouling factor 污垢因子heat capacity rate 水当量heat transfer effectiveness (ε) 传热有效度number of transfer units (NTU) 传热单元数。

Simultaneous Equations Models (1)The Nature of Simultaneous Equations Models● In the previous study, we considered single equation models – one Y and one or more X ’s.● The cause-and-effect relationship is from X ’s to Y .● There may be a two-way, or simultaneous, relationship between Y and X ’s.● It is difficult to distinguish dependent and explanatory variables.● Set up simultaneous equations model where variables are jointly dependent or endogenous.● Can not estimate the parameters of a single equation without taking into account of theinformation provided by other equations.● OLS estimator for single equation in simultaneous model is biased and inconsistent.● i i i i ii i i u X Y Y u X Y Y 21211222021111212101+++=+++=γββγββY 1i and u 2i are correlated, Y 2i and u 1i are correlated, so OLS leads to inconsistent estimates.Examples of Simultaneous Equations Models● Example1: Demand –and-supply modelDemand function: 0 1110<++=αααt t d t u P Q Supply function:0 1210>++=βββt t s t u P QEquilibrium condition: s t d t Q Q = Wheretime t supplied, Q demanded,quantity s t ===quantityQ d t● Price P and quantity Q are determined by the intersection of the demand and supply curves.Demand and supply curves are linear.● P and Q are jointly dependent.● the demand curve will shift upward if u 1t is positive and downward if u 1t is negative. ● A shift in the demand curve changes both P and Q● A change in u 2t will shift supply curve then change both P and Q● So u 1t and P, u 2t and P are correlated – violate the important assumption of CLRM. ● Example 2: Keynesian model of income determination● Consumption function: 10 1 10<<++=βββt t t u Y CIncome identity:)(t t t t S I C Y =+=Where C = consumption expenditure, Y = income, I = investment (assumed exogenous), S = savings, t = time, u = stochastic disturbance term● β1 is marginal propensity to consume(MPC) lying between 0 and 1.● C and Y are interdependent and Y is not expected to be independent of the disturbance term. ● Because U i shifts, then the consumption function also shifts, which, in turn, affects Y.The simultaneous equation bias: Inconsistency of OLS estimator● Use simple Keynesian model of income determination to show OLS estimator is inconsistentin simultaneous model● We want to estimate consumption function10t t t u Y C ++=ββ● First show that Y t and u t are correlated.Substituting consumption function into income identity:t t t u I Y 111011111ββββ-+-+-=t t I Y E 11011)(ββββ-+-=so12t 1]E[u)]()][([),cov(β-=--=t t t t t t u E u Y E Y E u Y● Second show that the OLS estimator 1ˆβis an inconsistent estimator of 1β, because of the correlation of Y t and u t∑∑∑∑∑∑∑∑+=++==---=21210221)( )())((ˆtttt ttt t t t t t tyy u y y u Y yy C Y Y Y Y C C ββββSo)(11 )/lim()/lim()ˆlim(2211211Yt t t N y p N u y p p σσββββ-+=+=∑∑● Plim(1ˆβ) will be always be greater than 1βThe Identification Problem● Recall the demand and supply model, if we have time-series data on P and Q only and noadditional information, can we estimate the demand function?● Need to solve the identification problem.Notations and Definitions● Take income determination model as example:Consumption function : 10 1 10<<++=βββt t t u Y CIncome identity : )(t t t t S I C Y =+=● - Endogenous variables: determined within the model- Predetermined variables: determined outside the model.- Predetermined variables include current and lagged exogenous variables and lagged endogenous variables.- Lagged endogenous variable is nonstochastic, hence a predetermined variable. - Be careful to defend the classification.●β’s are known as the structural parameters or coefficients.● Solve for endogenous variables to derive the reduced-form equations.● Reduced-form equation is the one which expresses an endogenous variable solely in terms ofthe predetermined variables and the stochastic disturbances.● Substitute consumption function into income identity:t t t w I Y +∏+∏=10Where 1t 111001 w ,11,1ββββ-=-=∏-=∏t uSubstitute income identity into consumption functiont t t w I C +∏+∏=32Where 1t 1131021 w ,1 ,1βββββ-=-=∏-=∏t u● 31 and ∏∏ are impact multipliers● Reduced form equations give the equilibrium values of the relevant endogenous variables.● The OLS method can be applied to estimate the coefficients of the reduced –form equations● Structural coefficients can be “retrieved ” from the reduced form coefficients.The identification problem● The identification problem is whether numerical estimates of the parameters of a structuralequation can be obtained from the estimated reduced form coefficients.● Identified, underidentified, exactly identified and overidentified.Underidentified● Consider the demand and supply model, together with market clearing condition.(Insert equations)● There are four structural coefficients corresponding two reduced form coefficients. – modelcan not be solved.● What does “underidentified ” mean? See figures● An alternative way to looking at the identification problem. – “mongrel ” equations. Ifmongrel equation is observational indistinguishable with demand function, then demand function is underidentified.Just , or exact, identification● Demand function: 0 ,0211210><+++=αααααt t t t u I P Q Supply function: 0 1210>++=βββt t t u P Q● There is an additional variable in the demand equation● Derive reduced form equations● Five structural coefficients corresponding with four reduced form coefficients – remainunderidentified.● Demand curve is underidentified, but supply curve is identified.● “mongrel ” equation is distinguishable from supply function but not from demand function.● The presence of an additional variable in the demand function enables us to identify thesupply function.● ConsiderDemand function : 0,0 211210><+++=αααααt t t t u I P QSupply function:0 ,0 21 21210>>+++=-βββββt t t t u P P QExactly identified!Overidentified● Demand function : 13210t t t t t u R I P Q ++++=ααααSupply function: 21210t t t t u P P Q +++=-βββ● Solvefor the structural equations and get reduced form:t t t t t v P R I P +∏++∏+∏+∏=-13210t t t t t w P R I Q +∏+∏+∏+∏=-17654● 7 coefficients corresponding 8 equations. Will have multiple solutions. For example:151201 ∏∏=∏∏=ββ● The reason for the multiple solution is that we have “too much ” information to identify thesupply curve.● “too much ” reflects by the exclusion of two variables in the supply function. One should beenough.Rules for identification● Solve structural equations, then get reduced form, check how many structural coefficientsand how many reduced form coefficients – no need for this time-consuming process● Order conditions of identificationM – number of endogenous variables in the modelm – number of endogenous variables in a given equation K – number of predetermined variables in the modelk – number of predetermined variables in a given equationA equivalent explanation is, in a model of M simultaneous equations, in order for an equationto be identified, the number of predetermined variables excluded from the equation must not be less than the number of endogenous variables included in that equation less 1. that is: K-k>= m-1● Check the previous examples.。